TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1312 SP1054 SP1312 11pF 24kV Bidirectional Discrete TVS RoHS Pb GREEN Description The SP1312 bidirectional TVS is fabricated in a proprietary silicon avalanche technology. These diodes provide a high ESD (electrostatic discharge) protection level for electronic equipment. The SP1312 TVS can safely absorb repetitive ESD strikes of 24 kV (contact and air discharge as defined in IEC 61000-4-2) without any performance degradation. Additionally, each TVS can safely dissipate a 3A 8/20 surge event as defined in IEC 61000-4-5 2nd Edition. Pinout Features 0201 Flipchip 1 2 Note: Drawing not to scale * ESD, IEC 61000-4-2, 24kV contact, 30kV air * Low leakage current of 0.02A(TYP) at 12V * EFT, IEC 61000-4-4, 40A (5/50ns) * Industries smallest ESD footprint available (01005) * Lightning, 3A (8/20 as defined in IEC 61000-4-5 2nd edition) * Halogen free, lead free and RoHS compliant * Low capacitance of 11pF (@ VR=0V) Functional Block Diagram 1 Applications 2 Life Support Note: Not Intended for Use in Life Support or Life Saving Applications The products shown herein are not designed for use in life sustaining or life saving applications unless otherwise expressly indicated. (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/06/18 * Mobile Phones * Wearable Technology * Smart Phones * Camcorders * Portable Navigation Components * Portable Medical * Tablets * Digital Cameras * Point of Sale Terminals TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1312 SP1054 Absolute Maximum Ratings Symbol Parameter Value Units IPP Peak Current (tp=8/20s) TOP Operating Temperature -40 to 125 C TSTOR Storage Temperature -55 to 150 C 3 A 1 Notes: 1. CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the component. This is a stress only rating and operation of the component at these or any other conditions above those indicated in the operational sections of this specification is not implied. Electrical Characteristics (TOP=25C) Parameter Symbol Test Conditions Reverse Standoff Voltage VRWM IR1A Breakdown Voltage VBR IR=1mA Reverse Leakage Current ILEAK VR=12V Clamp Voltage1 VC Dynamic Resistance RDYN 2 ESD Withstand Voltage1 Diode Capacitance VESD Typ Max Units 12 V 0.02 0.5 A IPP=1A, tp=8/20s, Fwd 18.5 22 V IPP=3A, tp=8/20s, Fwd 22.5 27 V TLP, tP=100ns, I/O to I/O 0.48 13 15 V IEC 61000-4-2 (Contact Discharge) 24 kV IEC 61000-4-2 (Air Discharge) 30 kV CD 1 Min Reverse Bias=0V 11 14 pF Note: 1 Parameter is guaranteed by design and/or component characterization. 2 Transmission Line Pulse (TLP) with 100ns width, 2ns rise time, and average window t1=70ns to t2= 90ns Clamp voltage vs. IPP for 8/20s Waveshape Capacitance vs. Reverse Bias 12.0 25.0 Capacitance (pF) Clamp Voltage-Vc (V) 20.0 15.0 10.0 5.0 0.0 9.0 6.0 3.0 1 1.5 2 Peak Pulse Current-IPP (A) (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/06/18 2.5 3 0.0 0 1 2 3 4 5 6 7 Reverse Bias Voltage (V) 8 9 10 11 12 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1312 SP1054 Negative Transmission Line Pulsing (TLP) Plot 40 0 35 -5 30 -10 TLP Current (A) TLP Current (A) Positive Transmission Line Pulsing (TLP) Plot 25 20 15 -15 -20 -25 10 -30 5 -35 0 -40 0 10 20 30 40 TLP Voltage (V) 50 60 25.0 30.0 -60 -50 -40 -30 -20 TLP Voltage (V) -10 0 8/20s Pulse Waveform 110% 100% 90% Percent of IPP 80% 70% 60% 50% 40% 30% 20% 10% 0% 0.0 5.0 10.0 15.0 20.0 Time (s) Soldering Parameters Pre Heat Pb - Free assembly 150C - Temperature Max (Ts(max)) 200C - Time (min to max) (ts) 60 - 180 secs Average ramp up rate (Liquidus) Temp (TL) to peak 3C/second max TS(max) to TL - Ramp-up Rate 3C/second max Reflow - Temperature (TL) (Liquidus) 217C - Temperature (tL) 60 - 150 seconds Peak Temperature (TP) 260 Time within 5C of actual peak Temperature (tp) 20 - 40 seconds Ramp-down Rate 6C/second max Time 25C to peak Temperature (TP) 8 minutes Max. Do not exceed 260C (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/06/18 +0/-5 tP TP - Temperature Min (Ts(min)) C Temperature Reflow Condition Critical Zone TL to TP Ramp-up TL TS(max) tL Ramp-do Ramp-down Preheat TS(min) 25 tS time to peak temperature Time TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1312 SP1054 Part Marking System Product Characteristics Ordering Information Lead Plating Tin plating Lead Material Copper bump Substrate material Silicon Flammability UL Recognized compound meeting flammability rating V-0 Part Numbering System Part Number Package Min. Order Qty. SP1312-01WTG 01005 Flipchip 15000 SP 1312 - 01 W T G TVS Diode Arrays (SPA(R) Diodes) G= Green T= Tape & Reel Series Number of Channels Package W:01005 Flipchip Package Dimensions -- 01005 Flipchip D e 01005 Flipchip Pin 1 P Top View L1 Bottom View Millimeters Typ Max Min Typ Max A 0.168 0.181 0.194 0.0066 0.0071 0.0076 A1 0.008 0.011 0.014 0.0003 0.0004 0.0006 A2 0.160 0.170 0.180 0.0063 0.0067 0.0071 0.280 BSC A1 A A2 e Side View 0.15mm 0.15mm 0.23mm 0.23mm 0.15mm 0.30mm Recommended soldering pad layout 0.30mm Stencil apertures Stencil thickness : 80um Drawing# : W01-A (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/06/18 Inches Min L2 E Symbol 0.0110 BSC E 0.200 0.230 0.260 0.0079 0.0091 0.0102 D 0.400 0.430 0.460 0.0157 0.0169 0.0181 F 0.110 0.130 0.150 0.0043 0.0051 0.0059 G 0.180 0.200 0.220 0.0071 0.0079 0.0087 P 0.150 0.170 0.190 0.0059 0.0067 0.0075 TVS Diode Arrays (SPA(R) Diodes) General Purpose ESD Protection - SP1312 SP1054 Embossed Carrier Tape & Reel Specification -- 01005 Flipchip ,Ref. ,Ref. ,Ref. Disclaimer Notice - Information furnished is believed to be accurate and reliable. However, users should independently evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications. Read complete Disclaimer Notice at http://www.littelfuse.com/disclaimer-electronics. (c)2018 Littelfuse, Inc. Specifications are subject to change without notice. Revision: 06/06/18