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QID1215005
Split Dual Si/SiC Hybrid IGBT Module
150 Amperes/1200 Volts
Powerex, Inc., 173 Pavilion Lane, Youngwood, Pennsylvania 15697 (724) 925-7272 www.pwrx.com
11/18/14 Rev. 1
Preliminary
Information presented is based upon manufacturers testing and projected capabilities. This information is subject to change without notice.
The manufacturer makes no claim as to the suitability of use, reliability, capability, or future availability of this product.
Absolute Maximum Ratings, Tj = 25°C unless otherwise specied
Ratings Symbol QID1215003 Units
Junction Temperature Tj –40 to 150 °C
Storage Temperature Tstg –40 to 150 °C
Collector-Emitter Voltage (G-E Short) VCES 1200 Volts
Gate-Emitter Voltage (C-E Short) VGES ±20 Volts
Collector Current (TC = 25°C) IC 150* Amperes
Peak Collector Current ICM 300* Amperes
Emitter Current** (TC = 25°C) IE 150* Amperes
Repetitive Peak Emitter Current (TC = 25°C)** IEM 300* Amperes
Maximum Collector Dissipation (TC = 25°C, Tj ≤ 150°C) PC 960 Watts
Mounting Torque, M6 Mounting — 40 in-lb
Weight — 270 Grams
Isolation Voltage (Main Terminal to Baseplate, AC 1 min.) VISO 2500 Volts
IGBT Electrical Characteristics, Tj = 25°C unless otherwise specied
Characteristics Symbol Test Conditions Min. Typ. Max. Units
Collector-Cutoff Current ICES VCE = VCES, VGE = 0V — — 1.0 mA
Gate Leakage Current IGES VGE = VGES, VCE = 0V — — 0.5 µA
Gate-Emitter Threshold Voltage VGE(th) IC = 15mA, VCE = 10V 4.5 6.0 7.5 Volts
Collector-Emitter Saturation Voltage VCE(sat) IC = 150A, VGE = 15V, Tj = 25°C — 5.0 6.5 Volts
IC = 150A, VGE = 15V, Tj = 125°C — 5.0 — Volts
Total Gate Charge QG VCC = 600V, IC = 150A, VGE = 15V — 680 — nC
Input Capacitance Cies — — 24 nf
Output Capacitance Coes VCE = 10V, VGE = 0V — — 2.0 nf
Reverse Transfer Capacitance Cres — — 0.45 nf
Inductive Turn-on Delay Time td(on) VCC = 600V, IC = 150A, — — TBD ns
Load Rise Time tr VGE1 = VGE2 = 15V, — — TBD ns
Switch Turn-off Delay Time td(off) RG = 2.1Ω, — — TBD ns
Time TimeFall Time tf Inductive Load Switching Operation — — TBD ns
* Pulse width and repetition rate should be such that device junction temperature (Tj) does not exceed Tj(max) rating.
**Represents characteristics of the anti-parallel, emitter-to-collector silicon carbide Schottky diode (FWDi).