1A
GND
2A
1Y
VCC
2Y
1A
GND
2A
1Y
VCC
2Y
DRY PACKAGE
(TOP VIEW)
DSF PACKAGE
(TOP VIEW)
1
2
34
5
61
2
34
5
6
1
2
34
5
6
1A
GND
2A
1Y
VCC
2Y
YZP PACKAGE
(BOTTOM VIEW)
1A
GND
2A
1Y
VCC
2Y
DCK PACKAGE
(TOP VIEW)
1
2
34
5
6
1A
2A
1Y
VCC
2Y
DBV PACKAGE
(TOP VIEW)
1
2
34
5
6
SN74LVC2G07
www.ti.com
SCES308J AUGUST 2001REVISED AUGUST 2012
DUAL BUFFER/DRIVER WITH OPEN DRAIN OUTPUTS
Check for Samples: SN74LVC2G07
1FEATURES
2 Available in the Texas Instruments NanoFree™ Typical VOHV (Output VOH Undershoot)
Package >2 V at VCC = 3.3 V, TA= 25°C
Supports 5-V VCC Operation Ioff Supports Partial-Power-Down Mode
Operation
Inputs and Open-Drain Outputs Accept
Voltages up to 5.5 V Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
Max tpd of 3.7 ns at 3.3 V ESD Protection Exceeds JESD 22
Low Power Consumption, 10-μA Max ICC 2000-V Human-Body Model (A114-A)
±24-mA Output Drive at 3.3 V 200-V Machine Model (A115-A)
Typical VOLP (Output Ground Bounce)
<0.8 V at VCC = 3.3 V, TA= 25°C 1000-V Charged-Device Model (C101)
DESCRIPTION/ORDERING INFORMATION
This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open
drain and can be connected to other open-drain outputs to implement active-low wired-OR or active-high wired-
AND functions. The maximum sink current is 32 mA.
NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the die as the
package.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs,
preventing damaging current backflow through the device when it is powered down.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2NanoFree is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date. Copyright © 2001–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
1A 1Y
1 6
2A 2Y
3 4
SN74LVC2G07
SCES308J AUGUST 2001REVISED AUGUST 2012
www.ti.com
ORDERING INFORMATION
TAPACKAGE(1) (2) ORDERABLE PART NUMBER TOP-SIDE MARKING(3)
NanoFree™ WCSP (DSBGA) Reel of 3000 SN74LVC2G07YZPR _ _ _CV_
0.23-mm Large Bump YZP (Pb-free)
SOT (SOT-23) DBV Reel of 3000 SN74LVC2G07DBVR C07_
QFN - DRY (4) Reel of 5000 SN74LVC2G07DRYR CV
–40°C to 85°C
μQFN - DSF(4) Reel of 5000 SN74LVC2G07DSFR CV
Reel of 3000 SN74LVC2G07DCKR
SOT (SC-70) DCK CV_
Reel of 250 SN74LVC2G07DCKT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb, = Pb-free).
(4) ESD protection exceeds 150-V machine model.
FUNCTION TABLE
(EACH BUFFER/DRIVER)
INPUT OUTPUT
A Y
L L
H Z
LOGIC DIAGRAM (POSITIVE LOGIC)
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Product Folder Links: SN74LVC2G07
SN74LVC2G07
www.ti.com
SCES308J AUGUST 2001REVISED AUGUST 2012
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Supply voltage range –0.5 6.5 V
VIInput voltage range(2) –0.5 6.5 V
VOVoltage range applied to any output in the high-impedance or power-off state(2) –0.5 6.5 V
VOVoltage range applied to any output in the high or low state(2) (3) –0.5 6.5 V
IIK Input clamp current VI< 0 –50 mA
IOK Output clamp current VO< 0 –50 mA
IOContinuous output current ±50 mA
Continuous current through VCC or GND ±100 mA
DBV package 165
DCK package 259
θJA Package thermal impedance(4) YZP package 123 °C/W
DRY package 234
DSF package 300
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The input negative-voltage and output voltage ratings may be exceeded if the input and output current ratings are observed.
(3) The value of VCC is provided in the recommended operating conditions table.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
RECOMMENDED OPERATING CONDITIONS(1)
MIN MAX UNIT
Operating 1.65 5.5
VCC Supply voltage V
Data retention only 1.5
VCC = 1.65 V to 1.95 V 0.65 × VCC
VCC = 2.3 V to 2.7 V 1.7
VIH High-level input voltage V
VCC = 3 V to 3.6 V 2
VCC = 4.5 V to 5.5 V 0.7 × VCC
VCC = 1.65 V to 1.95 V 0.35 × VCC
VCC = 2.3 V to 2.7 V 0.7
VIL Low-level input voltage V
VCC = 3 V to 3.6 V 0.8
VCC = 4.5 V to 5.5 V 0.3 × VCC
VIInput voltage 0 5.5 V
VOOutput voltage 0 5.5 V
VCC = 1.65 V 4
VCC = 2.3 V 8
IOL Low-level output current 16 mA
VCC = 3 V 24
VCC = 4.5 V 32
VCC = 1.8 V ± 0.15 V, 2.5 V ± 0.2 V 20
Δt/Δv Input transition rise or fall rate VCC = 3.3 V ± 0.3 V 10 ns/V
VCC = 5 V ± 0.5 V 5
TAOperating free-air temperature –40 85 °C
(1) All unused inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
Copyright © 2001–2012, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: SN74LVC2G07
SN74LVC2G07
SCES308J AUGUST 2001REVISED AUGUST 2012
www.ti.com
ELECTRICAL CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER TEST CONDITIONS VCC MIN TYP(1) MAX UNIT
IOL = 100 μA 1.65 V to 5.5 V 0.1
IOL = 4 mA 1.65 V 0.45
IOL = 8 mA 2.3 V 0.3
VOL V
IOL = 16 mA 0.4
3 V
IOL = 24 mA 0.55
IOL = 32 mA 4.5 V 0.55
IIA inputs VI= 5.5 V or GND 0 to 5.5 V ±5 μA
Ioff VIor VO= 5.5 V 0 ±10 μA
ICC VI= 5.5 V or GND, IO= 0 1.65 V to 5.5 V 10 μA
ΔICC One input at VCC 0.6 V, Other inputs at VCC or GND 3 V to 5.5 V 500 μA
CIVI= VCC or GND 3.3 V 3.5 pF
(1) All typical values are at VCC = 3.3 V, TA= 25°C.
SWITCHING CHARACTERISTICS
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 1)
VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
FROM TO ± 0.15 V ± 0.2 V ± 0.3 V ± 0.5 V
PARAMETER UNIT
(INPUT) (OUTPUT) MIN MAX MIN MAX MIN MAX MIN MAX
tpd A Y 1.5 8.6 1 4.4 1 3.7 1 2.9 ns
OPERATING CHARACTERISTICS
TA= 25°C VCC = 1.8 V VCC = 2.5 V VCC = 3.3 V VCC = 5 V
PARAMETER TEST CONDITIONS UNIT
TYP TYP TYP TYP
Cpd Power dissipation capacitance f = 10 MHz 3 3 4 4 pF
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Product Folder Links: SN74LVC2G07
th
tsu
From Output
UnderTestC
(see Note A)
L
LOAD CIRCUIT
S1 VLOAD
Open
GND
RL
Data Input
Timing Input 0V
0V
0V
tW
Input
0V
Input
Output
Waveform 1
S1 atV
(see Note B)
LOAD
Output
Waveform 2
S1 at GND
(see Note B)
VOL
VOH
0V
0V
Output
Output
TEST S1
Output
Control
VM
VMVM
VM
VM
1.8V 0.15 V±
2.5V 0.2 V±
3.3V 0.3 V±
5V 0.5 V±
1 k
500
500
500
VCC RL
2 ×VCC
2 ×VCC
6V
2 ×VCC
VLOAD CL
30 pF
30 pF
50 pF
50 pF
0.15V
0.15V
0.3V
0.3V
V
3V
VI
VCC/2
VCC/2
1.5V
VCC/2
VM
2 ns
2 ns
2.5 ns
2.5 ns
INPUTS
RL
t/t
r f
VCC
VCC
VCC
t (see Notes E and F)
PZL VLOAD
VOLTAGE WAVEFORMS
ENABLE AND DISABLETIMES
LOW- AND HIGH-LEVEL ENABLING
VOLTAGE WAVEFORMS
PROPAGATION DELAYTIMES
INVERTING AND NONINVERTING OUTPUTS
NOTES: A. C includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators have the following characteristics: PRR 10 MHz, Z = 50 .
D. The outputs are measured one at a time, with one transition per measurement.
L
O
E. Because this device has open-drain outputs, t and t are the same as t .
F. t is measured at V .
G. t is measured atV + V .
H. All parameters and waveforms are not applicable to all devices.
PLZ PZL PD
PZL M
PLZ OL
VOLTAGE WAVEFORMS
PULSE DURATION VOLTAGE WAVEFORMS
SETUP AND HOLDTIMES
VI
VI
VI
VM
VM
V /2
LOAD
tPZL tPLZ
tPHZ
tPZH
V V
OH
V +V
OL
VM
VMVM
VM
VOL
VOH
VI
VI
VOH
VOL
VM
VM
VM
VM
tPLH tPHL
tPLH
tPHL
t (see Notes E and G)
PLZ VLOAD
t /t
PHZ PZH VLOAD
SN74LVC2G07
www.ti.com
SCES308J AUGUST 2001REVISED AUGUST 2012
PARAMETER MEASUREMENT INFORMATION
(OPEN DRAIN)
Figure 1. Load Circuit and Voltage Waveforms
Copyright © 2001–2012, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: SN74LVC2G07
SN74LVC2G07
SCES308J AUGUST 2001REVISED AUGUST 2012
www.ti.com
REVISION HISTORY
Changes from Revision H (June 2008) to Revision I Page
Added new orderable parts, DRY and DSF. ......................................................................................................................... 2
Changes from Revision I (July 2012) to Revision J Page
Updated pin out packages. ................................................................................................................................................... 1
6Submit Documentation Feedback Copyright © 2001–2012, Texas Instruments Incorporated
Product Folder Links: SN74LVC2G07
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74LVC2G07DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRE4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DBVRG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKR ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRE4 ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKRG4 ACTIVE SC70 DCK 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKT ACTIVE SC70 DCK 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKTE4 ACTIVE SC70 DCK 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DCKTG4 ACTIVE SC70 DCK 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DRYR ACTIVE SON DRY 6 5000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07DSFR ACTIVE SON DSF 6 5000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74LVC2G07YEPR OBSOLETE WCSP YEP 6 TBD Call TI Call TI
SN74LVC2G07YZPR ACTIVE DSBGA YZP 6 3000 Green (RoHS
& no Sb/Br) SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
PACKAGE OPTION ADDENDUM
www.ti.com 16-Aug-2012
Addendum-Page 2
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN74LVC2G07 :
Enhanced Product: SN74LVC2G07-EP
NOTE: Qualified Version Definitions:
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74LVC2G07DBVR SOT-23 DBV 6 3000 178.0 9.2 3.3 3.2 1.55 4.0 8.0 Q3
SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 9.2 3.17 3.23 1.37 4.0 8.0 Q3
SN74LVC2G07DBVR SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
SN74LVC2G07DCKR SC70 DCK 6 3000 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC2G07DCKR SC70 DCK 6 3000 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G07DCKT SC70 DCK 6 250 178.0 9.0 2.4 2.5 1.2 4.0 8.0 Q3
SN74LVC2G07DCKT SC70 DCK 6 250 178.0 9.2 2.4 2.4 1.22 4.0 8.0 Q3
SN74LVC2G07DCKT SC70 DCK 6 250 180.0 9.2 2.3 2.55 1.2 4.0 8.0 Q3
SN74LVC2G07DRYR SON DRY 6 5000 180.0 9.5 1.15 1.6 0.75 4.0 8.0 Q1
SN74LVC2G07DSFR SON DSF 6 5000 180.0 9.5 1.16 1.16 0.5 4.0 8.0 Q2
SN74LVC2G07YZPR DSBGA YZP 6 3000 178.0 9.2 1.02 1.52 0.63 4.0 8.0 Q1
SN74LVC2G07YZPR DSBGA YZP 6 3000 180.0 8.4 1.02 1.52 0.63 4.0 8.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G07DBVR SOT-23 DBV 6 3000 205.0 200.0 33.0
SN74LVC2G07DBVR SOT-23 DBV 6 3000 180.0 180.0 18.0
SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G07DCKR SC70 DCK 6 3000 205.0 200.0 33.0
SN74LVC2G07DCKR SC70 DCK 6 3000 180.0 180.0 18.0
SN74LVC2G07DCKT SC70 DCK 6 250 180.0 180.0 18.0
SN74LVC2G07DCKT SC70 DCK 6 250 180.0 180.0 18.0
SN74LVC2G07DCKT SC70 DCK 6 250 205.0 200.0 33.0
SN74LVC2G07DRYR SON DRY 6 5000 180.0 180.0 30.0
SN74LVC2G07DSFR SON DSF 6 5000 180.0 180.0 30.0
SN74LVC2G07YZPR DSBGA YZP 6 3000 220.0 220.0 35.0
SN74LVC2G07YZPR DSBGA YZP 6 3000 220.0 220.0 34.0
PACKAGE MATERIALS INFORMATION
www.ti.com 16-Aug-2012
Pack Materials-Page 2