UBA2024P/N1 - NXP - Datasheet.Directory

1. General description

The UBA2024 is a family of high-voltage monolithic Integrated Compact Fluorescent

Lamp (CFL) drivers for a large range of lamp powers. Specific versions are optimized for

230 V and 110 V mains supplies. The product family integrates full CFL controller

functionality with high voltage half-bridge transistors. All products in the UBA2024 family

are pin-to-pin compatible enabling a single application design covering a wide range of

power ratings .

The IC features a soft start function, an adjustable internal oscillator and an internal drive

function with a high-volt age level shifter for driving the half-bridge.

To guarantee an accurate 50 % duty cycle, the oscillator signal is passed through a divider

before being fed to the output drivers.

2. Features and benefits

The common feature set includes:

high power efficiency

a high integration level with low component counts enablin g sm all for m fact or

electronic ballast

integrated bootstrap diode

soft start function

minimum glow time control

integrated low-voltage supply

adjustable operating frequency as a result of the embedded oscillator

an accurate 50 % duty cycle provided by an embedded oscillator signal

integrated half-bridge power transistors

an internal drive function with a high -volta ge level shif ter up to 550 V (300 V for the

UBA2024BP and UBA2024BT)

3. Applications

Driver for any kind of half-bridge configured load up to 23 W, provided that the

maximum junction temperature is not exceeded

Designed for electronically self-ballasted CFL lamps

UBA2024

Half-bridge power IC for CFL lamps

Rev. 6.2 — 1 November 2010 Product data sheet

Product data sheet Rev. 6.2 — 1 November 2010 2 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

4. Ordering information

[1] For this type number, RDS(on) = 9 Ω and ISAT = 900 mA.

[2] For this type number, RDS(on) = 6 Ω and ISAT = 1350 mA.

[3] For this type number, RDS(on) = 6.4 Ω and ISAT = 1200 mA.

[4] For this type number, RDS(on) = 2 Ω and ISAT = 2500 mA.

5. Block diagram

Tabl e 1. Ordering information

Type number Package

Name Description Version

UBA2024P[1] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

UBA2024T[1] SO14 plastic small outl ine package; 14 leads; body width 3.9 mm SOT108-1

UBA2024AP[2] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

UBA2024AT[3] SO14 plas tic small outline package; 14 leads; body width 3.9 mm SOT108-1

UBA2024BP[4] DIP8 plastic dual in-line package; 8 leads (300 mil) SOT97-1

UBA2024BT[4] SO14 plastic small outline package; 14 leads; body width 3.9 mm SOT108-1

Fig 1. Block diagram

mdb029

SWEEP AND

GLOW TIME CONTROL

HIGH VOLTAGE

LEVEL SHIFTER

VDD CONTROL

HIGH SIDE

DRIVER

LOW SIDE

DRIVER

OSCILLATOR DIVIDE-BY-2 DEAD TIME

1,2,3,5,9,10,13 (2)

7 (8)

VDD

VDD(stop)

SGND

8 (1)

6* (7)**

(6) 4 HV

OUT

PGND

(3) 11

(5) 14

(4) 12

Product data sheet Rev. 6.2 — 1 November 2010 3 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

6. Pinning information

6.1 Pinning

6.2 Pin description

Fig 2. Pinni ng diagram SOT97-1 Fig 3. Pinning diagram SOT108-1

UBA2024P

UBA2024AP

UBA2024BP

SW RC

SGND V

FS HV

PGND OUT

014aaa657

UBA2024T

UBA2024AT

UBA2024BT

SGND OUT

SGND SGND

SGND PGND

HV FS

SGND SGND

VDD SGND

RC SW

014aaa804

7 8

Table 2. Pin description

Symbol Pin SOT97-1 Pin SOT108-1 Description

SW 1 8 sweep timing input

SGND 2 1, 2, 3, 5, 9,

10, 13 signal ground

FS 3 11 high-side floating supply output

PGND 4 12 power ground

OUT 5 14 half-bridge ou tput

HV 6 4 high-voltage supply

VDD 7 6 internal low-voltage supply output

RC 8 7 internal oscillator input

Product data sheet Rev. 6.2 — 1 November 2010 4 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

7. Functional description

7.1 Supply voltage

The UBA2024 does not require an external low-voltage supply as the ma ins supply

voltage appli ed to pin HV powers it. The IC derives it s own low supply voltage fr om this for

its internal circuitry.

7.2 Start-up state

With an increase of the supply voltage on pin HV, the IC enters the start-up state. In the

start-up state the high-side power tra n sisto r is not conducting and the low-side power

transistor is switched on. The internal circuit is reset and the capacitors on the boot strap

pin FS and low-voltage supply pin VDD are charged. Pins RC and SW are switched to

ground. The start-up state is defined until VDD = VDD(startup).

7.3 Sweep mode

The IC enters the sweep mode when the volt age on pin VDD > VDD(startup). The capacitor

on pin SW is charged b y ISW and the half-bridge circuit start s oscillating. The circuit enters

the start-up state again whe n th e vo ltage on pin V DD < VDD(stop).

The sweep time (tsweep) is determined by the charge current (Ich(sw)) and the external

capacitor (CSW). Typical the total sweep time set by CSW is:

(1)

During the sweep time the current flowing through the lamp electrodes performs some

preheating of the fila ments. See Figure 5.

7.4 Reset

A DC reset circuit is incorporated in the high-side driver. The high-side transistor is

switched off whe n the voltage on pin FS is be low the hig h-side lo ckou t vo ltage Vfloat(UVLO).

7.5 Oscillation

The oscillation is based upon the 555-timer function. A self oscillating circuit is made with

the external re sist or ROSC and the capacitor COSC (see Figure 4).

To realize an accurate 50 % duty cycle, an internal di vider is used. This reduces the bridge

frequency to half the oscillator frequency.

The output voltage of the bridge will change at the falling edge of the signal on pin RC.

The design equation for the half-bridge frequency is:

(2)

An overview of the oscillator signal, internal LS and HS drive signals and the output is

given in Figure 4.

tsweep CSW nF()10.3 ms×=

fosc 1

OSC

×COSC

-----------------------------------------

Product data sheet Rev. 6.2 — 1 November 2010 5 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

When entering the swe ep mode (VSW = 0 V), the bridge oscillator starts at 2.5 times the

nominal bridge frequency and sweeps down to the nominal freq uency (bridge), set by

ROSC and COSC. During the sweep mode th e amplitude of the RC oscillator on pin RC, will

swing between Vtrip(osc)low and VSW +0.4V

trip(osc)high. The amplitude of the RC oscillator

will continue to increase until VSW +0.4V

trip(osc)high =V

trip(osc)high, this determines the end

of the sweep time. The voltage on pin SW however will continue to rise until it reaches

supply voltage level.

During this continuous decrease in frequency, the circuit approache s the resonance

frequency of the load, and this causes a high voltage across the load, which ignites the

lamp. The sweep to resonance time should be much larger than the settling time of the

supply voltage on pin HV, to guarantee that the full high-voltage is present at the moment

of ignition. See Figure 5.

Fig 4. Oscillator, drivers and output signals

time

VRC

VOUT

drive

half

bridge

time

014aaa65

Product data sheet Rev. 6.2 — 1 November 2010 6 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

7.6 Non-overlap time

The non-overlap time is defined as the time when both MOSFETs are not conducting. The

non-overlap time is fixed internally.

Fig 5. Start-up frequency behavior

014aaa65

time

tsweep

VHV

VDD

VDD(startup)

VSW

VDD

0.6Vtrip(osc)high

fosc

2.5nom

Vlamp

Vign

VgloA

Vnom

nom

Product data sheet Rev. 6.2 — 1 November 2010 7 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

8. Limiting values

[1] The maximum junction temperature must not be exceeded.

9. Thermal characteristics

[1] In accordance with IEC 60747-1

Table 3. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VHV voltage on pin HV normal operation

UBA2024P - 373 V

UBA2024AP - 373 V

UBA2024T - 373 V

UBA2024AT - 373 V

UBA2024BP - 187 V

UBA2024BT - 187 V

mains transients during 0.5 s

UBA2024P - 550 V

UBA2024AP - 550 V

UBA2024T - 550 V

UBA2024AT - 550 V

UBA2024BP - 300 V

UBA2024BT - 300 V

VFS voltage on pin FS VHV VHV +14 V

VDD supply voltage low voltage; DC supply 0 14 V

IDD supply current low voltage; peak value is internally

limited; Tamb =25°C05mA

VPGND voltage on pin PGND referenced to SGND −1+1V

VRC voltage on pin RC IRC <1mA 0 V

DD V

VSW voltage on pin SW ISW <1mA 0 V

DD V

SR slew rate pin OUT; repetitive −4+4V/ns

Tjjunction temperature [1] −40 +150 °C

Tamb ambient temperature −40 +150 °C

Tstg storage temperature −55 +150 °C

Table 4. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resistance from junction to ambient in free air [1]

SO14 package 95 K/W

DIP8 package 95 K/W

Rth(j-c) thermal resistance from junction to case in free air [1]

SO14 package 8 K/W

DIP8 package 16 K/W

Product data sheet Rev. 6.2 — 1 November 2010 8 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

10. Characteristics

Table 5. Characteristics

Tj = 25

C; all voltages are measured with respect to SGND; positive currents flow into the IC.

Symbol Parameter Conditions Min Typ Max Unit

High-voltage supply

VHV voltage on pin HV mains transients during 0.5 s; IHV < 30 μA

UBA2024P 0 - 550 V

UBA2024AP 0 - 550 V

UBA2024T 0 - 550 V

UBA2024AT 0 - 550 V

UBA2024BP 0 - 250 V

UBA2024BT 0 - 250 V

VFS voltage on pin FS mains transients during 0.5 s; IHV < 30 μA

UBA2024P 0 - 564 V

UBA2024AP 0 - 564 V

UBA2024T 0 - 564 V

UBA2024AT 0 - 564 V

UBA2024BP 0 - 264 V

UBA2024BT 0 - 264 V

Low-voltage supply

VDD supply voltage VHV =100V; R

osc =∞; VSW =V

DD;

VRC =0V 11.4 12.5 13.3 V

Start-up state

IHV current on pin HV VHV =100V; R

osc =∞; VSW =V

DD;

VRC =0V - - 0.39 mA

VDD(startup) start-up supply voltage 10 11 12 V

VDD(stop) stop supply voltage 8 8.5 9 V

VDD(hys) hysteresis of supply voltage 2 2.5 3 V

Product data sheet Rev. 6.2 — 1 November 2010 9 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

Output stage

Ron on-state resistance HS transistor; VHV =310V; I

D= 100 mA

UBA2024P - 9.7 11 Ω

UBA2024T - 9.7 11 Ω

UBA2024AP - 6.5 7.4 Ω

UBA2024AT - 7.0 8.0 Ω

HS transistor; VHV =160V; I

D= 100 mA

UBA2024BP - 2.0 2.35 Ω

UBA2024BT - 2.0 2.35 Ω

LS transistor; ID= 100 mA

UBA2024P - 8.5 9.4 Ω

UBA2024T - 8.5 9.4 Ω

UBA2024AP - 5.7 6.3 Ω

UBA2024AT - 6.2 6.9 Ω

UBA2024BP - 2.3 2.55 Ω

UBA2024BT - 2.3 2.55 Ω

VFforward voltage HS; IF= 200 mA - - 2.0 V

LS; IF= 200 mA - - 2.0 V

bootstrap diode; IF= 1 mA 0.7 1.0 1.3 V

IDsat drain saturation current HS; VDS =30V; T

j≤ 125 °C; VHV = 310 V

UBA2024P 900 - - mA

UBA2024AP 1350 - - mA

UBA2024T 900 - - mA

UBA2024AT 1200 - - mA

HS; VDS =30V; T

j≤ 125 °C; VHV = 160 V

UBA2024BP 2500 - - mA

UBA2024BT 2500 - - mA

LS; VDS =30V; T

j≤125 °C

UBA2024P 900 - - mA

UBA2024AP 1350 - - mA

UBA2024T 900 - - mA

UBA2024AT 1200 - - mA

UBA2024BP 2500 - - mA

UBA2024BT 2500 - - mA

tno non-overlap time 1 1.35 1.7 μs

Vfloat(UVLO) undervoltage lockout

floating voltage 3.6 4.2 4.8 V

Table 5. Characteristics …continued

Tj = 25

C; all voltages are measured with respect to SGND; positive currents flow into the IC.

Symbol Parameter Conditions Min Typ Max Unit

Product data sheet Rev. 6.2 — 1 November 2010 10 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

11. Electrostatic discharge

IFS current on pin FS VHV =310V; V

FS =12.2V

UBA2024P, UBA2024T 10 14 18 μA

UBA2024AP, UBA2024AT 10 14 18 μA

VHV =160V; V

FS =12.2V

UBA2024BP, UBA2024BT 10 14 18 μA

Internal oscillator

fosc oscillator frequency VSW = 0 V - 150 - kHz

VSW =V

DD - - 60 kHz

operating; nominal; ROSC =100kΩ;

COSC = 220 pF; VSW =V

40.05 41.32 42.68 kHz

Δfosc/fosc relative oscillator frequency

variation ROSC = 100 kΩ; COSC = 220 pF;

−20 °C≤Tj≤+150 °C-2-%

kHhigh-level trip point factor 0.382 0.395 0.408

Vtrip(osc)high high oscillator trip voltage Vtrip(osc)high =k

H×VDD 4.58 4.94 5.29 V

kLlow-level trip point factor 0.030 0.033 0.038

Vtrip(osc)low low oscillator trip voltage Vtrip(osc)low =k

L×VDD 0.367 0.413 0.483 V

Kosc oscillator constant ROSC = 100 kΩ; COSC = 220 pF 1.065 1.1 1.35 V

Sweep function

Ich(sweep) sweep charge current VSW = 0 V 215 280 345 nA

tsweep sweep time CSW =33nF; V

DD = 12.2 V 0.28 0.35 0.45 s

Table 5. Characteristics …continued

Tj = 25

C; all voltages are measured with respect to SGND; positive currents flow into the IC.

Symbol Parameter Conditions Min Typ Max Unit

Table 6. ElectroStatic Discharge (ESD) overview

Model Class JEDEC classification criteria

ESDH (human body model) 1C pass at ESD pulse 1000 V

fail at ESD pulse 2000 V

ESDC (charged device model) C2 pass at ESD pulse 200 V

fail at ESD pulse 500 V

ESDM (machine model) B pass at 200 V ≥ ESD pulse < 400 V

Product data sheet Rev. 6.2 — 1 November 2010 11 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

12. Application information

Fig 6. Schematic of 230 V standard compact fluorescent lamp application using UBA2024

001aan022

CBUF

4.7 μF

LFILT

1.8 mH

RFUS

33 Ω

CHB2

47 nF

11 W/150 mA

max. 550 V

3.1 mH

LLA

CHB1

47 nF

ROSC

110 kΩ

COSC

180 pF

CFS

10 nF

CDV

100 pF

CVDD

10 nF

CLA

UBA2024

VDD

SGND

OUT

PGND

CSW

33 nF

AC mains

supply

(230 V) CFL

1.5 nF

Fig 7. Schematic of 120 V standard compact fluorescent lamp application using UBA2024B

001aam620

ROSC

26.1 kΩ

CSW

470 nF

RSW

4.7 MΩ

COSC

1.2 nF

CFS

10 nF

CDVDT

820 pF

CHB1

150 nF

CBUS

33 μF

RFUS

4.7 Ω

CHB2

150 nF

0.66 mH

LFILT maximum 300 V

1.5 mH

CVDD

10 nF

CRS

24 W/300 mA

10 nF

UBA2024B

PGND

OUT

HV VDD

SGND

AC mains

supply

(120 V) CFL

Product data sheet Rev. 6.2 — 1 November 2010 12 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

13. Package outline

Fig 8. Package outline SOT97-1 (DIP8)

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

SOT97-1 99-12-27

03-02-13

UNIT A

max. 12 b1(1) (1) (1)

b2cD E e M Z

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

min. A

max. bmax.

1.73

1.14

0.53

0.38

0.36

0.23

9.8

9.2

6.48

6.20

3.60

3.05 0.2542.54 7.62 8.25

7.80

10.0

8.3 1.154.2 0.51 3.2

inches 0.068

0.045

0.021

0.015

0.014

0.009

1.07

0.89

0.042

0.035

0.39

0.36

0.26

0.24

0.14

0.12 0.010.1 0.3 0.32

0.31

0.39

0.33 0.0450.17 0.02 0.13

050G01 MO-001 SC-504-8

(e )

seating plane

0 5 10 mm

scale

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

pin 1 index

IP8: plastic dual in-line package; 8 leads (300 mil) SOT97

-1

Product data sheet Rev. 6.2 — 1 November 2010 13 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

Fig 9. Package outline SOT108-1 (SO14)

UNIT A

max. A1A2A3bpcD

(1) E(1) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

8.75

8.55

4.0

3.8 1.27 6.2

5.8

0.7

0.6

0.7

0.3 8

0.25 0.1

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Note

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

1.0

0.4

SOT108-1

detail X

vMA

(A )

076E06 MS-012

pin 1 index

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.35

0.34

0.16

0.15 0.05

1.05

0.041

0.244

0.228

0.028

0.024

0.028

0.012

0.01

0.25

0.01 0.004

0.039

0.016

99-12-27

03-02-19

0 2.5 5 mm

scale

O14: plastic small outline package; 14 leads; body width 3.9 mm SOT108

-1

Product data sheet Rev. 6.2 — 1 November 2010 14 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

14. Revision history

Table 7. Revision history

Document ID Release date Data sheet status Change notice Supersedes

UBA2024 v.6.2 20101101 Product data sheet - UBA2024 v.5

Modifications: •Figure 5 on page 6 has been changed.

•The glow time section has been removed.

•ESD values have been removed from Table 3 “Limiting values” on p age 7, added in to Table

6 “ElectroStatic Discharge (ESD) overvi ew” on page 10 and one error corrected.

•Table 3 “Limiting values” on page 7: table notes 2 and 3 have been removed.

•Table 5 “Characteristics” on page 8:

–VDD supply voltage minimum value has been changed.

–VF forward voltage HS maximum value has been changed.

–KL low-level trip point factor maximum value has been chang ed.

–Vtrip(osc)low low oscillator trip voltage maximum value has been changed.

•Figure 6 on page 11 have been changed.

UBA2024 v.5 20100916 Product data sheet - UBA2024 v.4

UBA2024 v.4 20090917 Product data sheet - UBA2024 v.3

UBA2024 v.3 081016 Product data sheet - UBA2024 v.2

UBA2024 v.2 040203 Product data sheet - UBA2024 v.1

UBA2024 v.1 030813 Product data sheet - -

Product data sheet Rev. 6.2 — 1 November 2010 15 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

15. Legal information

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[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

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the Absolute Maximum Ratings System of IEC 60134) will cause permanent

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Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contains data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specification.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 6.2 — 1 November 2010 16 of 17

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product i s automotive qualified,

the product is not suitable for automo tive use. It i s neit her qua lif ied nor test ed

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such au tomotive applicat ions, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from custome r design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

15.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

16. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors UBA2024

Half-bridge power IC for CFL lamps

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 1 November 2010

Document identifier: UBA2024

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

17. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Functional description . . . . . . . . . . . . . . . . . . . 4

7.1 Supply voltage . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.2 Start-up state . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.3 Sweep mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.4 Reset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.5 Oscillation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

7.6 Non-overlap time . . . . . . . . . . . . . . . . . . . . . . . 6

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7

9 Thermal characteristics . . . . . . . . . . . . . . . . . . 7

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 8

11 Electrostatic discharge . . . . . . . . . . . . . . . . . . 10

12 Application information. . . . . . . . . . . . . . . . . . 11

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12

14 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

15 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

15.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

15.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

15.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

16 Contact information. . . . . . . . . . . . . . . . . . . . . 16

17 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17