Automotive Power
Data Sheet
Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Low Side Switch with Parallel Control and SPI Interface
coreFLEX TLE8110EE
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Data Sheet 2 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Table of Content
Table of Content
1 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1 Pin Assignment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.2 Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.3 Terms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 General Product Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.1 Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4.2 Functional Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
4.3 Thermal Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
5 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.1 Description Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
5.2 Electrical Characteristics Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
6 Reset and Enable Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.1 Description Reset and Enable Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
6.2 Electrical Characteristics Reset Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
7 Power Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.1 Description Power Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
7.2 Description of the Clamping Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
7.3 Electrical Characteristics Power Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
7.4 Parallel Connection of the Power Stages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
8 Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.1 Diagnosis Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
8.1.1 Open Load diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.1.2 Overcurrent / Overtemperature diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
8.2 Electrical Characteristics Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
9 Parallel Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.1 Description Parallel Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
9.2 Electrical Characteristics Parallel Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
10 Protection Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35
10.1 Electrical Characteristics Overload Protection Function . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
11 16 bit SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11.1 Description 16 bit SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11.2 Timing Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
11.3 Electrical Characteristics 16 bit SPI Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
12 Control of the device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.1 Internal Clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.2 SPI Interface. Signals and Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.2.1 Description 16 bit SPI Interface Signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
12.2.2 Daisy Chain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12.2.3 SPI Protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12.2.3.1 16-bit protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
12.2.3.2 2x8-bit protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
12.2.3.3 16- and 2x8-bit protocol mixed. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 48
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TLE 8110 EE
Smart Multichannel Switch
Table of Content
Data Sheet 3 Rev. 1.3.1, 2011-05-26
12.2.3.4 Daisy-Chain and 2x8-bit protocol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
12.2.4 safeCOMMUNICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12.2.4.1 Encoding of the commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12.2.4.2 Modulo-8 Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12.3 Register and Command - Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
12.3.1 CMD - Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
12.3.1.1 CMD_RSD - Command: Return Short Diagnosis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 56
12.3.1.2 CMD_RSDS - Command: Return Short Diagnosis and Device Status . . . . . . . . . . . . . . . . . . . . 57
12.3.1.3 CMD_RPC - Command: Return Pattern Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
12.3.1.4 CMD_RINx - Command: Return Input Pin (INx) -Status . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
12.3.2 DCC - Diagnosis Registers and compactCONTROL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62
12.3.2.1 DRx - Diagnosis Registers Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
12.3.2.2 DRx - Return on DRx Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
12.3.2.3 DMSx/OPSx - Diagnosis Mode Set / Output Pin Set Commands . . . . . . . . . . . . . . . . . . . . . . . . 66
12.3.3 OUTx - Output Control Register CHx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
12.3.4 ISx - INPUT or Serial Mode Control Register, Bank A and Bank B . . . . . . . . . . . . . . . . . . . . . . . . . 69
12.3.5 PMx - Parallel Mode Register CHx . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
12.3.6 DEVS - Device Settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
13 Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72
14 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
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PG-DSO-36-41
Type Package Marking
TLE8110EE PG-DSO-36-41 TLE8110EE
Data Sheet 4 Rev. 1.3.1, 2011-05-26
Smart Multichannel Low Side Switch with Parallel
Control and SPI Interface
coreFLEX
TLE8110EE
1Overview
Features
• Overvoltage, Overtemperature, ESD -Protection
• Direct Parallel PWM Control of all Channels
•safeCOMMUNICATION (SPI and Parallel)
• Efficient Communication Mode: compactCONTROL
• Compatible with 3.3V- and 5V- Micro Controllers I/O ports
•clampSAFE for highly efficient parallel use of the channels
• Green Product (RoHS compliant)
• AEC Qualified
Application
• Power Switch Automotive and Industrial Systems switching Solenoids, Relays and Resistive Loads
Description
10-channel Low-Side Switch in Smart Power Technology [SPT] with Serial Peripheral Interface [SPI] and 10 open
drain DMOS output stages. The TLE8110EE is protected by embedded protection functions and designed for
automotive and industrial applications. The output stages are controlled via Parallel Input Pins for PWM use or SPI
Interface. The TLE8110EE is particularly suitable for Engine Management and Powertrain Systems.
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TLE 8110 EE
Smart Multichannel Switch
Overview
Data Sheet 5 Rev. 1.3.1, 2011-05-26
Figure 1 Block Diagram TLE8110EE
Table 1 Product Summary
Parameter Symbol Value Unit
Analogue Supply voltage VDD 4.50 … 5.50 V
Digital Supply Voltage VCC 3.00 … 5.50 V
Clamping Voltage (CH 1-10) VDS(CL)typ 55 V
On Resistance
typical at Tj=25°C and IDnom
RON1-4 0.30 Ω
RON5-6 0.25 Ω
RON7-10 0.60 Ω
On Resistance
maximum at Tj=150°C and IDnom
RON1-4 0.60 Ω
RON5-6 0.50 Ω
RON7-10 1.20 Ω
Nominal Output current (CH 1-4) IDnom 1.50 A
Nominal Output current (CH 5-6) IDnom 1.70 A
Nominal Output current (CH 7-10) IDnom 0.75 A
Output Current Shut-down Threshold (CH 1-4) min. IDSD(low) 2.60 A
Output Current Shut-down Threshold (CH 5-6) min. IDSD(low) 3.70 A
Output Current Shut-down Threshold (CH 7-10) min. IDSD(low) 1.70 A
Micro
Controller
TLE8110 EE
I/O
I/O
IN1
IN10
SPI _ SI SPI _SI
SPI_SO
SPI _ SO
SPI _ CLK SPI _ CLK
SPI_CSSPI _ CS
V
DD
= typ. 5V
V
CC
= typ . 3. 3….5 V
RST
Supply IC
V
Ba tt
4 to 6
Injectors
or Solenoids
General pur pose
Channels i n
parallel connecti on
General pur pose
Channels for Relays
OUT1
OUT10
Appl _ D iag_ 10 c h_TLE 8110 .vsd
ENI/O
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Data Sheet 6 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Block Diagram
2 Block Diagram
Figure 2 Block Diagram
2.1 Description
Communication
The TLE8110EE is a 10-channel low-side switch in PG-DSO-36-41 package providing embedded protection
functions. The 16-bit serial peripheral interface (SPI) can be utilized for control and diagnosis of the device and
the loads. The SPI interface provides daisy-chain capability in order to assemble multiple devices in one SPI chain
by using the same number of micro-controller pins 1).
The analogue and the digital part of the device is supplied by 5V. Logic Input and Output Signals are then
compatible to 5V logic level [TTL - level]. Optionally, the logic part can be supplied with lower voltages to achieve
signal compatibility with e.g. 3.3V logic level [CMOS - level].
The TLE8110EE is equipped with 10 parallel input pins that are routed to each output channel. This allows control
of the channels for loads driven by Pulse Width Modulation (PWM). The output channels can also be controlled
by SPI.
Reset
The device is equipped with one Reset Pin and one Enable. Reset [RST] serves the whole device, Enable [EN]
serves only the Output Control Unit and the Power Stages.
1) Daisy Chain
Block_diag_10ch_TLE8110.vsd
S_CS
S_SI
S_CLK
S_SO
SPI
(TTL or
CMOS)
open load
detection
temperature
sensor
diagnosis
register
OUT4
OUT3
OUT2
OUT1
gate
control
short circuit
detection
input
register
VCC
Input Control
(TTL or CMOS)
IN3
VDD
RST
OUT8
OUT7
OUT6
OUT5
OUT10
OUT9
short to GND
detection
IN4
IN5
IN6
IN7
IN8
IN9
IN10
IN1
IN2
control
register
Logic
control
unit
analogue
control,
diagnostic
and protective
functions
EN
GND
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TLE 8110 EE
Smart Multichannel Switch
Block Diagram
Data Sheet 7 Rev. 1.3.1, 2011-05-26
Diagnosis
The device provides diagnosis of the load, including open load, short to GND as well as short circuit to VBatt
detection and over-load / over-temperature indication. The SPI diagnosis flags indicates if latched fault conditions
may have occurred.
Protection
Each output stage is protected against short circuit. In case of over load, the affected channel is switched off. The
switching off reaction time is dependent on two switching thresholds. Restart of the channel is done by clearing
the Diagnosis Register 1). This feature protects the device against uncontrolled repetitive short circuits. The
reaction to a short-circuit and over-temperature can be alternatively changed to further modes, such as semi- or
auto - restart of the affected channel.
There is a temperature sensor available for each channel to protect the device in case of over temperature. In case
of over temperature the affected channel is switched off and the Over-Temperature Flag is set. Restart of the
channel is done by deleting the Flag. This feature protects the device against uncontrolled temperature toggling.
Parallel Connection of Channels
The device is featured with a central clamping structure, so-called CLAMPsafe. This feature ensures a balanced
clamping between the channels and allows in case of parallel connection of channels a high efficient usage of the
channel capabilities. This parallel mode is additionally featured by best possible parameter- and thermal matching
of the channels and by controlling the channels accordingly.
1) Restart after Clear
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Data Sheet 8 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Pin Configuration
3 Pin Configuration
3.1 Pin Assignment
Figure 3 Pin Configuration
3.2 Pin Definitions and Functions
Pin Symbol Function
1 GND Ground
2 P_IN1 Parallel Input Pin 1. Default assignment to Output Channel 1.
3 P_IN2 Parallel Input Pin 2. Default assignment to Output Channel 2.
4 EN Enable Input Pin. If not needed, connect with Pull-up resistor to VCC.
5RST Reset Input Pin. (low active). If not needed, connect with Pull-up resistor to VCC.
6 P_IN3 Parallel Input Pin 3. Default assignment to Output Channel 3.
7 P_IN4 Parallel Input Pin 4. Default assignment to Output Channel 4.
8 VDD Analogue Supply Voltage
9 P_IN5 Parallel Input Pin 5. Default assignment to Output Channel 5.
10 VCC Digital Supply Voltage
11 S_SO Serial Peripheral Interface [SPI], Serial Output
12 S_CLK Serial Peripheral Interface [SPI], Clock Input
13 S_CS Serial Peripheral Interface [SPI], Chip Select (active Low)
14 S_SI Serial Peripheral Interface [SPI], Serial Input
15 P_IN6 Parallel Input Pin 6. Default assignment to Output Channel 6.
16 P_IN7 Parallel Input Pin 7. Default assignment to Output Channel 7.
17 P_IN8 Parallel Input Pin 8. Default assignment to Output Channel 8.
18 GND Ground
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
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TLE 8110 EE
Smart Multichannel Switch
Pin Configuration
Data Sheet 9 Rev. 1.3.1, 2011-05-26
19 GND Ground
20 OUT9 Drain of Power Transistor Channel 9
21 OUT10 Drain of Power Transistor Channel 10
22 N.C. internally not connected, connect to Ground
23 GND Ground
24 OUT6 Drain of Power Transistor Channel 6
25 OUT4 Drain of Power Transistor Channel 4
26 OUT3 Drain of Power Transistor Channel 3
27 P_IN9 Parallel Input Pin 9. Default assignment to Output Channel 9.
28 P_IN10 Parallel Input Pin 10. Default assignment to Output Channel 10.
29 OUT2 Drain of Power Transistor Channel 2
30 OUT1 Drain of Power Transistor Channel 1
31 OUT5 Drain of Power Transistor Channel 5
32 GND Ground
33 N.C. internally not connected, connect to Ground
34 OUT8 Drain of Power Transistor Channel 8
35 OUT7 Drain of Power Transistor Channel 7
36 GND Ground
Cooling
Tab
GND Cooling Tab; internally connected to GND
Pin Symbol Function
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Data Sheet 10 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Pin Configuration
3.3 Terms
Figure 4 Terms
Terms_TLE8110.vsd
V
P_IN2
V
RST
V
P_IN3
V
P_IN4
V
VDD
V
P_IN5
V
VCC
V
S_SO
V
S_CLK
V
S_CS
V
S_SI
V
P_IN7
V
OUT7
V
P_IN9
V
OUT3
V
Batt
I
OUT1
I
OUT4
I
OUT2
I
P_IN10
I
P_IN9
I
OUT3
I
P_IN2
I
RST
I
S_SI
I
P_IN7
I
P_IN3
I
P_IN4
I
VDD
I
P_IN5
I
VCC
I
S_SO
I
S_CLK
I
S_CS
1
2
3
4
5
6
7
8
9
10
12
13
14
15
16
17
18
36
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
11
35
PG-DSO-36
GND
P_IN1
P_IN2
EN
RST
P_IN3
P_IN4
VDD
P_IN5
VCC
S_SO
S_CLK
S_CS
S_SI
P_IN6
P_IN7
P_IN8
GND
GND
OUT7
OUT8
N.C.
GND
OUT5
OUT1
OUT2
P_IN10
P_IN9
OUT3
OUT4
OUT6
GND
N.C.
OUT10
OUT9
GND
I
P_IN1
I
EN
I
P_IN6
I
P_IN8
V
P_IN1
V
EN
V
P_IN6
V
P_IN8
I
OUT7
I
OUT8
I
OUT5
I
OUT6
I
OUT10
I
OUT9
V
OUT8
V
OUT5
V
OUT1
V
OUT2
V
P_IN10
V
OUT4
V
OUT6
V
OUT10
V
OUT9
Top View
Heat- Slug /
Exposed Pad
(back-side)
GND
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TLE 8110 EE
Smart Multichannel Switch
General Product Characteristics
Data Sheet 11 Rev. 1.3.1, 2011-05-26
4 General Product Characteristics
4.1 Absolute Maximum Ratings
Absolute Maximum Ratings1)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Max.
Supply Voltages
4.1.1 Digital Supply voltage VCC -0.3 5.5 V permanent
4.1.2 Digital Supply voltage VCC -0.3 6.2 V t < 10s
4.1.3 Analogue Supply voltage VDD -0.3 5.5 V permanent
4.1.4 Analogue Supply voltage VDD -0.3 6.2 V t < 10s
Power Stages
4.1.5 Load Current (CH 1 to 10 ) IDn -I
DSD(low) A–
4.1.6 Reverse Current Output (CH 1-10) IDn -IDSD(low) -A–
4.1.7 Total Ground Current IGND -20 20 A –
4.1.8 Continuous Drain Source Voltage
(Channel 1 to 10)
VDSn -0.3 45 V –
4.1.9 maximum Voltage for short circuit
protection on Output
VDSn - 24 V one event on one
single channel.
Clamping Energy - Single Pulse2)3)
4.1.10 Single Clamping Energy
Channel Group 1-4
EAS -29mJID = 2.6A
1 single pulse
4.1.11 Single Clamping Energy
Channel Group 5-6
EAS -31mJID = 3.7A
1 single pulse
4.1.12 Single Clamping Energy
Channel Group 7-10
EAS -11mJID = 1.7A
1 single pulse
Logic Pins (SPI, INn, EN, RST)
4.1.13 Input Voltage at all Logic Pin Vx-0.3 5.5 V permanent
4.1.14 Input Voltage at all Logic Pin Vx-0.3 6.2 V t < 10s
4.1.15 Input Voltage at Pin 27, 28 (IN9, 10, ) Vx-0.3 45 V permanent
Temperatures
4.1.16 Junction Temperature Tj-40 150 °C–
4.1.17 Junction Temperature Tj-40 175 °C max. 100hrs
cumulative
4.1.18 Storage Temperature Tstg -55 150 °C–
ESD Robustness
4.1.19 Electro Static Discharge Voltage
“Human Body Model - HBM”
VESD -4 4 kV All Pins
HBM4)
1.5KOhm, 100pF
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Data Sheet 12 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
General Product Characteristics
Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the
data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are
not designed for continuous repetitive operation.
4.2 Functional Range
Note: Within the functional range the IC operates as described in the circuit description. The electrical
characteristics are specified within the conditions given in the related electrical characteristics table.
4.1.20 Electro Static Discharge Voltage
“Charged Device Model - CDM”
VESD -500 500 V All Pins
CDM5)
4.1.21 Electro Static Discharge Voltage
“Charged Device Model - CDM”
VESD -750 750 V Pin 1, 18, 19, 36
(corner pins)
CDM5)
1) Not subject to production test, specified by design.
2) One single channel per time.
3) Triangular Pulse Shape (inductance discharge): ID(t) = ID(0)·(1 - t / tpulse); 0 < t < tpulse.
4) ESD susceptibility, HBM according to EIA/JESD 22-A114-B
5) ESD susceptibility, Charged Device Model “CDM” EIA/JESD22-C101-C
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Max.
Supply Voltages
4.2.1 Analogue Supply Voltage VDD 4.5 5.5 V –
4.2.2 Digital Supply Voltage VCC 3VDD V–
4.2.3 Digital Supply Voltage VCC VDD 5.5 V leakage Currents
(ICC) might increase
if VCC > VDD.
Power Stages
4.2.4 Ground Current IGND_typ 9 A resistive loads1)
1) Not subject to production test, specified by design.
Temperatures
4.2.5 Junction Temperature Tj-40 150 °C-
4.2.6 Junction Temperature Tj-40 175 °C1) for 100hrs
Absolute Maximum Ratings1) (cont’d)
Tj = -40°C to +150°C; all voltages with respect to ground, positive current flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Max.
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TLE 8110 EE
Smart Multichannel Switch
General Product Characteristics
Data Sheet 13 Rev. 1.3.1, 2011-05-26
4.3 Thermal Resistance
Figure 5 PG-DSO-36-41 PCB set-up
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
4.3.1 Junction to Soldering Point RthJSP - 1.75 3.60 K/W Pvtot = 3W1)2)3)
1) Not subject to production test, specified by design.
2) Homogenous power distribution over all channels (All Power stages equally heated), dependent on cooling set-up.
3) Refer to Figure 5
4.3.2 Junction to Ambient RthJA - 25.00 - K/W Pvtot = 3W1)2)3)
Metallization:
Dimensions:
Thermal Vias:
Rth PCB setup.vsd
1.5mm
35µm, 90% metallization
70µm modeled (traces)
35µm, 90% metallization
70µm, 5% metallization
76.2 x 114.3 x 1.5 mm³ , FR4
JEDEC 2s2p (JESD 51-7) + (JESD 51-5)
Φ=0.3 mm; plating 25 µm; 24 pcs. for PG-DSO-36-41
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Data Sheet 14 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Power Supply
5 Power Supply
5.1 Description Power Supply
The TLE8110EE is supplied by analogue power supply line VDD which is used for the analogue functions of the
device, such as the gate control of the power stages. The digital power supply line VCC is used to supply the digital
part and offers the possibility to adapt the logic level of the serial output pins to lower logic levels.
Figure 6 Block Diagram Supply and Reset
Description Supply
The Supply Voltage Pins are monitored during the power-on phase and under normal operating conditions for
under voltage.
If during Power-on the increasing supply voltage exceeds the Supply Power-on Switching Threshold, the internal
Reset is released after an internal delay has expired.
In case of under voltage, a device internal reset is performed. The Switching Threshold for this case is the Power-
on Switching threshold minus the Switching Hysteresis.
In case of under voltage on the analogue supply line VDD the outputs are turned off but the content of the registers
and the functionality of the logic part is kept alive. In case of under voltage on the digital supply VCC line, a complete
reset including the registers is performed.
After returning back to normal supply voltage and an internal delay, the related functional blocks are turned on
again. For more details, refer to the chapter “Reset”.
The device internal under-voltage set will set the related bits in SDS (Short Diagnosis and Device Status) to allow
the micro controller to detect this reset. For more information, refer to the chapter “Control of the Device”.
Block_diag_Supply_Reset.vsd
Input
and
Serial
Inter-
face
Fault
Detection
Gate Control
diagnosis
register
input
register
VDD
VCC
RST
OUTx
control
register
Logic
control
unit
EN
GND
VCC
Under
Voltage
Monitor
VDD
Under
Voltage
Monitor
oror
analogue
control,
diagnostic
and protective
functions
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TLE 8110 EE
Smart Multichannel Switch
Power Supply
Data Sheet 15 Rev. 1.3.1, 2011-05-26
5.2 Electrical Characteristics Power Supply
Electrical Characteristics: Power Supply
3.0V < VCC < 5.5V; 4.5V < VDD < 5.5V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current
flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
Digital Supply and Power-on Reset
5.2.1 Digital Supply Voltage VCC 3- 5.5V
5.2.2
a)
b)
Digital Supply Current during Reset
(VCC < VCCpo )
ICCstb -1520µAf
SCLK = 0Hz,
S_CS = VCC,
Tj=85°C 1)
VCC = 2.0V
VDD > VCC
-2040µAf
SCLK = 0Hz,
S_CS = VCC,
Tj=150°C
VCC = 2.0V
VDD > VCC
5.2.3
a)
b)
Digital Supply Current during Reset
( VRST < VRSTl)
ICCstb - 25µAf
SCLK = 0Hz,
S_CS = VCC,
Tj=85°C1)
VDD > VCC
-515µAf
SCLK = 0Hz,
S_CS = VCC,
Tj=150°C
VDD > VCC
5.2.4
a)
b)
Digital Supply Operating Current
VCC = 3.3V
ICC -0.152mAf
SCLK = 0Hz,
Tj=150°C.
all Channels ON
1)
-0.55mAf
SCLK = 5MHz,
Tj=150°C.
all Channels ON
1)2)
5.2.5
a)
b)
Digital Supply Operating Current
VCC = 5.5V
ICC -0.252mAf
SCLK = 0Hz,
Tj=150°C.
all Channels ON
-0.810mAf
SCLK = 5MHz,
Tj=150°C.
all Channels ON
1)2)
5.2.6 Digital Supply Power-on Switching
Threshold
VCCpo 1.9 2.8 3 V VCC increasing
5.2.7 Digital Supply Switching Hysteresis VCChy 100 300 500 mV 1)
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Data Sheet 16 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Power Supply
Analogue Supply and Power-on Reset
5.2.8 Analogue Supply Voltage VDD 4.5- 5.5V -
5.2.9
a)
b)
Analogue Supply Current during
Reset
(VDD< VDDpo )
IDDstb -1020µAf
SCLK = 0Hz,
Tj=85°C 1)
VDD = 2V
-1540µAf
SCLK = 0Hz,
Tj=150°C
VDD = 2V
5.2.10
a)
b)
Analogue Supply Current during
Reset
( VEN< VENl)
IDDstb - 15µAf
SCLK = 0Hz,
Tj=85°C 1)
-215µAf
SCLK = 0Hz,
Tj=150°C
5.2.11 Analogue Supply Operating Current IDD -825mAf
SCLK = 0...5MHz1)
Tj=150°C
all Channels ON
5.2.12 Analogue Supply Power-on
Switching Threshold
VDDpo 34.24.5VVDD increasing
5.2.13 Analogue Supply Switching
Hysteresis
VDDhy 100 200 400 mV 1)
5.2.14 Analogue Supply Power-on Delay
Time
tVDDpo - 100 200 µs VDD increasing 1)
1) Parameter not subject to production test. Specified by design.
2) C = 50pF connected to S_SO
Electrical Characteristics: Power Supply
3.0V < VCC < 5.5V; 4.5V < VDD < 5.5V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current
flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
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TLE 8110 EE
Smart Multichannel Switch
Reset and Enable Inputs
Data Sheet 17 Rev. 1.3.1, 2011-05-26
6 Reset and Enable Inputs
6.1 Description Reset and Enable Inputs
The TLE8110EE contains one Reset- and one Enable Input Pin as can be seen in Figure 6.
Description:
Reset Pin [RST] is the main reset and acts as the internal under voltage reset monitoring of the digital supply
voltage VCC: As soon as RST is pulled low, the whole device including the control registers is reset.
The Enable Pin [EN] resets only the Output channels and the control circuits. The content of the all registers is
kept. This functions offers the possibility of a “soft” reset turning off only the Output lines but keeping alive the SPI
communication and the contents of the control registers. This allows the read out of the diagnosis and setting up
the device during or directly after Reset.
6.2 Electrical Characteristics Reset Inputs
Electrical Characteristics: Reset Inputs
3.0V < VCC < 5.5V; 4.5V < VDD < 5.5V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current
flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
Reset Input Pin [RST]
6.2.1 Low Level of RST VRSTl -0.3 - VCC *0.2 V -
6.2.2 High Level of RST VRSTh VCC *0.4 - VCC V-
6.2.3 RST Switching Hysteresis VRSThy 20 100 300 mV 1)
1) Parameter not subject of production test. Specified by design.
6.2.4 Reset Pin pull-down Current IRSTresh 20 40 85 µA VRST=5V
IRSTresl 2.4 - - µA VRST=0.6V1)
6.2.5 Minimum Reset Duration time RST tRSTmin 1-- µs
1)
Enable Input Pin [EN]
6.2.6 Low Level of EN VENl -0.3 - VCC *0.2 V -
6.2.7 High Level of EN VENh VCC *0.4 - VCC V-
6.2.8 EN Switching Hysteresis VENhy 20 60 300 mV 1)
6.2.9 Enable Pin pull-down Current IENresh 53585µAV
EN=5V
IENresl 2.4 - - µA VEN=0.6V1)
6.2.10 Enable Reaction Time
(reaction of OUTx)
tENrr -4- µs
1)
6.2.11 Minimum Enable Duration time EN tENmin 1.2 - - µs 1)
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Data Sheet 18 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Reset and Enable Inputs
Figure 7 Timing
V
DD
OUTx
t
EN r r
t
t
Enable of
Output
Device
operating t
Enable
valid
t
VDDpo
V
EN
T<
t
EN min
V
EN h
V
EN l
V
EN h y
Exter nal _ r eset. vsd
OUTx OFF
Device ON
Device OFF
Enable
not valid
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TLE 8110 EE
Smart Multichannel Switch
Power Outputs
Data Sheet 19 Rev. 1.3.1, 2011-05-26
7 Power Outputs
7.1 Description Power Outputs
The TLE8110EE is a 10 channel low-side powertrain switch. The power stages are built by N-channel power
MOSFET transistors. The device is a universal multichannel switch but mostly suited for the use in Engine
Management Systems [EMS]. Within an EMS, the best fit of the channels to the typical loads is:
• Channel 1 to 4 for Injector valves or mid-sized solenoids with a nominal current requirement of 1.5A.
• Channel 5 to 6 for mid-sized solenoids or Injector valves with a nominal current requirement of 1.7A
• Channel 7 to 10 for small solenoids or relays with a nominal current requirement of 0.75A
Channel 1 to 10 provide enhanced clamping capabilities of typically 55V best suited for inductive loads such as
injectors and valves. It is recommended in case of an inductive load, to connect an external free wheeling- or
clamping diode, where-ever possible to reduce power dissipation.
All channels can be connected in parallel. Channels 1 to 4, 5 to 6 and 7 to 10 are prepared by matching for parallel
connection with the possibility to use a high portion of the capability of each single channel also in parallel mode
(refer to Chapter 7.4).
Channel 5 and 6 have a higher current shut down threshold to allow to connect in parallel mode a load with a high
inrush-current, such as a lambda sensor heater.
Figure 8 Block Diagram of Control and Power Outputs
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Data Sheet 20 Rev. 1.3.1, 2011-05-26
TLE 8110 EE
Smart Multichannel Switch
Power Outputs
7.2 Description of the Clamping Structure
When switching off inductive loads, the potential at pin OUT rises to VDS(CL) potential, because the inductance
intends to continue driving the current. The clamping voltage is necessary to prevent destruction of the device,
see Figure 9 for the clamping circuit principle. Nevertheless, the maximum allowed load inductance is limited.
Figure 9 Internal Clamping Principle
Clamping Energy
During demagnetization of inductive loads, energy has to be dissipated in the device. This energy can be
calculated with following equation:
(1)
The maximum energy, which is converted into heat, is limited by the thermal design of the component.
Attention: It is strongly recommended to measure the load Energy and Current under operating
conditions, example of measurement setup is shown in Figure 10. Load small-signal
parameters might not reflect the real load behavior under operating conditions, see Figure 11.
For more details please refer to the Application Note “Switching Inductive Loads”.
Figure 10 ECL measurement setup
V
bat
I
D
V
DScl
OUT
V
DS
GND
L,
R
L
OutputClam p.vsd
EV
DS CL()
LL
RL
------IL
VDS CL()VBAT
–
RL
------------------------------------- 1
RLI⋅L
VDS CL()VBAT
–
-------------------------------------
+
⎝⎠
⎛⎞
ln⋅–⋅⋅=
Low-Side Switch
VBAT
Ctrl
Load Measurement Setup
DMOS
Active Clamping
VCL
GND
vD(t)
iL(t)
Inductive Load
RL
LL
OUT
Temperature Chamber
T=TL
Oscilloscope
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TLE 8110 EE
Smart Multichannel Switch
Power Outputs
Data Sheet 21 Rev. 1.3.1, 2011-05-26
Figure 11 Deviation of calculation from measurement
7.3 Electrical Characteristics Power Outputs
Electrical Characteristics: Power Outputs
3.0V < VCC < 5.5V; 4.5V < VDD < 5.5V, Tj = -40°C to +150°C, all voltages with respect to ground, positive current
flowing into pin
(unless otherwise specified)
Pos. Parameter Symbol Limit Values Unit Conditions
Min. Typ. Max.
Output Channel Resistance
7.3.1 On State Resistance
Channel Group 1-4
RDSon -0.3-OhmIDnom=1,5A;
Tj=25°C1)
- 0.45 0.6 Ohm IDnom=1,5A;
Tj=150°C
7.3.2 On State Resistance
Channel Group 5-6
RDSon - 0.25 - Ohm IDnom=1.7A;
Tj=25°C1)
- 0.35 0.5 Ohm IDnom=1.7A;
Tj=150°C
7.3.3 On State Resistance
Channel Group 7-10
RDSon -0.6-OhmIDnom=0.75A;
Tj=25°C1)
- 0.85 1.2 Ohm IDnom=0.75A;
Tj=150°C
Deviation from measured values
ON OFFCtrl
vD, iL
t
t
vD· iL
ECLm
ECL
measured
calculated
L-Saturation
Effect
R-Temp.
Effect
tF
VCL
VBAT
VON
IL
ILm
tFm
0
ON OFFCtrl
vD, iL
t
t
vD· iL
ECLm
ECL
measured
calculated
µ-increase
Effect
R-Temp.
Effect
tF
VCL
VBAT
VON
IL
ILm
tFm
0
Increasing Inductance with IL
(Relays and some Valve types)
Decreasing Inductance with IL
(Injectors, Valves)
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