54AC16245, 74AC16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCAS235A – MARCH 1990 – REVISED APRIL 1996
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
D
Members of the Texas Instruments
Widebus
t
Family
D
3-State Outputs Drive Bus Lines or Buffer
Memory Address Registers
D
Flow-Through Architecture Optimizes PCB
Layout
D
Distributed VCC and GND Configuration
Minimizes High-Speed Switching Noise
D
EPIC
t
(Enhanced-Performance Implanted
CMOS) 1-
m
m Process
D
500-mA T ypical Latch-Up Immunity at 125°C
D
Package Options Include Plastic Thin
Shrink Small-Outline (DGG) Package,
300-mil Shrink Small-Outline (DL) Package
Using 25-mil Center-to-Center Pin Spacings
and 380-mil Fine-Pitch Ceramic Flat (WD)
Package Using 25-mil Center-to-Center Pin
Spacings
description
The ’AC16245 are 16-bit bus transceivers
organized as dual-octal noninverting 3-state
transceivers designed for asynchronous two-way
communication between data buses. The control
function implementation minimizes external tim-
ing requirements
These devices allow data transmission from the A
bus to the B bus or from the B bus to the A bus,
depending upon the logic level at the direction
control (DIR) input. The output-enable input (OE)
can be used to disable the devices so that the
buses are effectively isolated.
The 74AC16245 is packaged in TI’s shrink small-outline package, which provides twice the I/O pin count and
functionality of standard small-outline packages in the same printed-circuit-board area.
The 54AC16245 is characterized for operation over the full military temperature range of –55°C to 125°C. The
74AC16245 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
CONTROL
INPUTS OPERATION
OE DIR
L L B data to A bus
LH A data to bus
H X Isolation
Copyright 1996, Texas Instruments Incorporated
UNLESS OTHERWISE NOTED this document contains PRODUCTION
DATA information current as of publication date. Products conform to
specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all
parameters.
EPIC and Widebus are trademarks of Texas Instruments Incorporated.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
1DIR
1B1
1B2
GND
1B3
1B4
VCC
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
VCC
2B5
2B6
GND
2B7
2B8
2DIR
1OE
1A1
1A2
GND
1A3
1A4
VCC
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
VCC
2A5
2A6
GND
2A7
2A8
2OE
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
54AC16245 . . . WD PACKAGE
74AC16245 . . . DGG OR DL PACKAGE
(TOP VIEW)
54AC16245, 74AC16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCAS235A – MARCH 1990 – REVISED APRIL 1996
2POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
logic symbol†
5
4
1
1
2
1
2OE
1OE
†This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
G3
48
3 EN1 [BA]
1
1DIR
G6
25
6 EN4 [BA]
24
2DIR
47
1A1
46
1A2 44
1A3 43
1A4 41
1A5 40
1A6 38
1A7 37
1A8 36
2A1
35
2A2 33
2A3 32
2A4 30
2A5 29
2A6
1B1
2
1B2
3
1B3
5
1B4
6
1B5
8
1B6
9
1B7
11
1B8
12
2B1
13
2B2
14
2B3
16
2B4
17
2B5
19
2B6
20
3 EN2 [AB]
6 EN5 [AB]
27
2A7 26
2A8
2B7
22
2B8
23
1
1
logic diagram (positive logic)
To Seven Other Transceivers
1B1
2
1A1
1DIR
47
1
48
1OE
2B1
13
2A1
2DIR
36
24
25
To Seven Other Transceivers
2OE
54AC16245, 74AC16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCAS235A – MARCH 1990 – REVISED APRIL 1996
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage range, VCC –0.5 V to 7 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage range, VI (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output voltage range, VO (see Note 1) –0.5 V to VCC + 0.5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input clamp current, IIK (VI < 0 or VI > VCC) ±20 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Output clamp current, IOK (VO < 0 or VO > VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous output current, IO (VO = 0 to VCC) ±50 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Continuous current through VCC or GND ±400 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum power dissipation at TA = 55°C (in still air) (see Note 2): DGG package 0.85 W. . . . . . . . . . . . . . . .
DL package 1.2 W. . . . . . . . . . . . . . . . . . .
Storage temperature range, Tstg –65°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
†Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only , and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may af fect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150
_
C and a board trace length of 750 mils.
recommended operating conditions (see Note 3)
54AC16245 74AC16245
UNIT
MIN NOM MAX MIN NOM MAX
UNIT
VCC Supply voltage (see Note 4) 3 5 5.5 3 5 5.5 V
VCC = 3 V 2.1 2.1
VIH High-level input voltage VCC = 4.5 V 3.15 3.15 V
VCC = 5.5 V 3.85 3.85
VCC = 3 V 0.9 0.9
VIL Low-level input voltage VCC = 4.5 V 1.35 1.35 V
VCC = 5.5 V 1.65 1.65
VIInput voltage 0 VCC 0 VCC V
VOOutput voltage 0 VCC 0 VCC V
VCC = 3 V –4 –4
IOH High-level output current VCC = 4.5 V –24 –24 mA
VCC = 5.5 V –24 –24
VCC = 3 V 12 12
IOL Low-level output current VCC = 4.5 V 24 24 mA
VCC = 5.5 V 24 24
∆t/∆vInput transition rise or fall rate 0 10 0 10 ns/V
TAOperating free-air temperature –55 125 –40 85 °C
NOTES: 3. All unused pins (input and I/O) must be held high or low to prevent them from floating.
4. All VCC and GND pins must be connected to the proper voltage power supply.
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
54AC16245, 74AC16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCAS235A – MARCH 1990 – REVISED APRIL 1996
4POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
PARAMETER
TEST CONDITIONS
VCC
TA = 25°C 54AC16245 74AC16245
UNIT
PARAMETER
TEST
CONDITIONS
V
CC MIN TYP MAX MIN MAX MIN MAX
UNIT
3 V 2.9 2.9 2.9
IOH = –50 µA4.5 V 4.4 4.4 4.4
5.5 V 5.4 5.4 5.4
VOH IOH = –4 mA 3 V 2.58 2.48 2.48 V
IOH =24mA
4.5 V 3.94 3.8 3.8
I
OH = –
24
mA
5.5 V 4.94 4.8 4.8
IOH = –75 mA†5.5 V 3.85 3.85
3 V 0.1 0.1 0.1
IOL = 50 µA4.5 V 0.1 0.1 0.1
5.5 V 0.1 0.1 0.1
VOL IOL = 12 mA 3 V 0.36 0.44 0.44 V
IOL =24mA
4.5 V 0.36 0.44 0.44
I
OL =
24
mA
5.5 V 0.36 0.44 0.44
IOL = 75 mA†5.5 V 1.65 1.65
IIVI = VCC or GND 5.5 V ±0.1 ±1±1µA
IOZ VI = VCC or GND 5.5 V ±0.5 ±5±5µA
ICC VI = VCC or GND, IO = 0 5.5 V 8 80 80 µA
CiVI = VCC or GND 5 V 4.5 p
F
CoVI = VCC or GND 5 V 16
pF
†Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
‡For I/O ports, the parameter IOZ includes the input leakage current.
switching characteristics over recommended operating free-air temperature range,
VCC = 3.3 V ± 0.3 V (see Figure 1)
PARAMETER
FROM TO TA = 25°C 54AC16245 74AC16245
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
AorB
BorA
2.5 7.6 10.4 2.5 11.9 2.5 11.9
ns
tPHL
A
or
B
B
or
A
3.1 9 12.3 3.1 13.5 3.1 13.5
ns
tPZH
OE
AorB
2.8 8.6 11.8 2.8 13.2 2.8 13.2
ns
tPZL
OE
A
or
B
3.9 12 16.2 3.9 18 3.9 18
ns
tPHZ
OE
AorB
5.3 8.4 10.4 5.3 11.2 5.3 11.2
ns
tPLZ
OE
A
or
B
4.4 7.7 9.7 4.4 10.3 4.4 10.3
ns
switching characteristics over recommended operating free-air temperature range,
VCC = 5 V ± 0.5 V (see Figure 1)
PARAMETER
FROM TO TA = 25°C 54AC16245 74AC16245
UNIT
PARAMETER
(INPUT) (OUTPUT) MIN TYP MAX MIN MAX MIN MAX
UNIT
tPLH
AorB
BorA
2 4.6 6.9 2 7.9 2 7.9
ns
tPHL
A
or
B
B
or
A
2.5 5.2 7.9 2.5 8.9 2.5 8.9
ns
tPZH
OE
AorB
2.3 4.9 7.5 2.3 8.6 2.3 8.6
ns
tPZL
OE
A
or
B
3 6.2 9.5 3 10.7 3 10.7
ns
tPHZ
OE
AorB
5 7.2 9.1 5 9.8 5 9.8
ns
tPLZ
OE
A
or
B
4.2 6.2 8.1 4.2 8.7 4.2 8.7
ns
PRODUCT PREVIEW information concerns products in the formative or
design phase of development. Characteristic data and other
specifications are design goals. Texas Instruments reserves the right to
change or discontinue these products without notice.
54AC16245, 74AC16245
16-BIT BUS TRANSCEIVERS
WITH 3-STATE OUTPUTS
SCAS235A – MARCH 1990 – REVISED APRIL 1996
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
operating characteristics, VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Cd
Power dissi
p
ation ca
p
acitance
p
er latch
Outputs enabled
p
43 p
F
C
pd
Po
w
er
dissipation
capacitance
per
latch
Outputs disabled
L =
,
=
z8
pF
PARAMETER MEASUREMENT INFORMATION
From Output
Under Test
CL = 50 pF
(see Note A)
LOAD CIRCUIT
S1
2 × VCC
500 Ω
500 Ω
tPLH tPHL
Output
Control
(low-level
enabling)
Output
Waveform 1
S1 at 2 × VCC
(see Note B)
Output
W aveform 2
S1 at GND
(see Note B)
VOL
VOH
tPZL
tPZH
tPLZ
tPHZ
50%
50%
50% 50%
[
VCC
VCC
0 V
50% VCC 50% VCC
VOH
VOL
0 V
50% VCC 20% VCC
50% VCC 80% VCC
[
0 V
VCC
GND
Open
Input
Output
VOLTAGE WAVEFORMS VOLTAGE WAVEFORMS
tPLH/tPHL
tPLZ/tPZL
tPHZ/tPZH
Open
2 × VCC
GND
TEST S1
NOTES: A. CL includes probe and jig capacitance.
B. W aveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
W aveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, ZO = 50 Ω, tr = 3 ns, tf = 3 ns.
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
74AC16245DL ACTIVE SSOP DL 48 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AC16245DLG4 ACTIVE SSOP DL 48 25 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AC16245DLR ACTIVE SSOP DL 48 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
74AC16245DLRG4 ACTIVE SSOP DL 48 1000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 24-Feb-2006
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
74AC16245DLR SSOP DL 48 1000 330.0 32.4 11.35 16.2 3.1 16.0 32.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
74AC16245DLR SSOP DL 48 1000 346.0 346.0 49.0
PACKAGE MATERIALS INFORMATION
www.ti.com 11-Mar-2008
Pack Materials-Page 2
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