1
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
Lead-Free/Green SP725
General Purpose ESD Protection - SP725 Series
Description
Features
• ESDInterfaceperHBMStandards
-IEC61000-4-2,DirectDischarge .......... 8kV(Level4)
-IEC61000-4-2,AirDischarge ............... 15kV(Level4)
-MIL-STD-3015.7 ................................................. 25kV
• PeakCurrentCapability
-IEC61000-4-58/20µsPeakPulseCurrent ..... ±14A
-SingleTransientPulse,100µsPulseWidth ...... ±8A
• DesignedtoProvideOver-VoltageProtection
-Single-EndedVoltageRangeto ........................ +30V
-DifferentialVoltageRangeto ............................ ±15V
• FastSwitching .............................................. 2nsRisetime
• LowInputLeakages ..........................5nAat25ºCTypical
• LowInputCapacitance .................................... 5pFTypical
• AnArrayof4SCR/DiodePairs
• OperatingTemperatureRange..................-40ºCto105ºC
Applications
TheSP725isanarrayofSCR/Diodebipolarstructuresfor
ESDandovervoltageprotectionofsensitiveinputcircuits.
TheSP725has2protectionSCR/Diodedevicestructures
perinput.Thereareatotalof4availableinputsthatcanbe
usedtoprotectupto4externalsignalorbuslines.Over-
voltageprotectionisfromtheIN(Pins1-4)toV+orV-.
TheSCRstructuresaredesignedforfasttriggeringata
thresholdofone+VBEdiodethresholdaboveV+(Pin5,6)
orone–VBEdiodethresholdbelowV-(Pin7,8).Froman
INinput,aclamptoV+isactivatedifatransientpulse
causestheinputtobeincreasedtoavoltagelevelgreater
thanoneVBEaboveV+.AsimilarclamptoV-isactivatedif
anegativepulse,oneVBElessthanV-,isappliedtoanIN
input.
RefertoFig1andTable1forfurtherdetails.Referto
ApplicationNoteAN9304andAN9612forfurtherdetail.
• Microprocessor/Logic
InputProtection
• DataBusProtection
• AnalogDeviceInput
Protection
• VoltageClamp
Pinout
Functional Block Diagram
V+
V-
IN IN IN
1
5, 6
2
7, 8
3, 4
SP725
(SOIC)
1
2
3
4
8
7
6
5
In
In
In
V+
V+
V-
In
V-
LifeSupportNote:
Not Intended for Use in Life Support or Life Saving Applications
Theproductsshownhereinarenotdesignedforuseinlifesustainingorlifesaving
applicationsunlessotherwiseexpresslyindicated.
RoHS
Pb
GREEN
SP725 Series 5pF 8kV Diode Array
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
2
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
General Purpose ESD Protection - SP725 Series
Absolute Maximum Ratings
Parameter Rating Units
ContinuousSupplyVoltage,(V+)-(V-) +35 V
ForwardPeakCurrent,IINtoVCC,IINtoGND
(RefertoFigure5) ±8,100µs A
PeakPulseCurrent,8/20µs ±14 A
ESDRatingsandCapability(Figure1,Table1)
LoadDumpandReverseBattery(Note2)
Electrical Characteristics TA = -40oC to 105oC, VIN = 0.5VCC , Unless Otherwise Specified
Thermal Information
Parameter Rating Units
ThermalResistance(Typical,Note1) θJA
oC/W
SOICPackage 170 oC/W
StorageTemperatureRange -65to150 oC
MaximumJunctionTemperature 150 oC
MaximumLeadTemperature
(Soldering20-40s)(SOIC-LeadTipsOnly) 260 oC
Parameter Symbol Test Conditions Min Typ Max Units
OperatingVoltageRange,
VSUPPLY=[(V+)-(V-)] VSUPPLY -2to30 - V
ForwardVoltageDrop
IIN=2A(PeakPulse)
INtoV- VFWDL -2- V
INtoV+ VFWDH -2- V
InputLeakageCurrent IIN -20 5 +20 nA
QuiescentSupplyCurrent IQUIESCENT -50 200 nA
EquivalentSCRONThreshold (Note3) -1. 1 - V
EquivalentSCRONResistance VFWD/IFWD;(Note3) -0.5 - Ω
InputCapacitance CIN 5-pF
InputSwitchingSpeed tON -2-ns
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause
permanent damage to the device. This is a stress only rating and operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied.
Notes:
1. θ JAismeasuredwiththecomponentmountedonanevaluationPCboardinfreeair
2.Inautomotiveandbatteryoperatedsystems,thepowersupplylinesshouldbeexternallyprotectedforloaddumpandreversebatteryV+andV-pinsareconnectedtothesamesupply
voltagesourceasthedeviceorcontrollineunderprotection,acurrentlimitingresistorshouldbeconnectedinseriesbetweentheexternalsupplyandtheSP725supplypinstolimit
reversebatterycurrenttowithintheratedmaximumlimits.Bypasscapacitorsoftypically0.01µForlargerfromtheV+andV-pinstogroundarerecommended.
3.RefertotheFigure3graphfordenitionsofequivalent“SCRONThreshold”and“SCRONResistance.”Thesecharacteristicsaregivenhereforthumb-ruleinformationtodeterminepeak
currentanddissipationunderEOSconditions.
+VCC
INPUT
DRIVERS
SP725 INPUT PROTECTION CIRCUIT (1 OF 4 SHOWN)
OR
SIGNAL
SOURCES
IN 1 - 4
SP725
V-
TO +VCC
LINEAR OR
DIGITAL IC
INTERFACE
V+
+VCC
(ApplicationasanInputClampforOvervoltage,Greaterthan1VBE
AboveV+orlessthan-1VBEbelowV-)
Typical Application of the SP725
3
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
Lead-Free/Green SP725
General Purpose ESD Protection - SP725 Series
ESD Capability
Table 1: ESD Test Conditions
Figure 3: High Current SCR Forward Voltage Drop Curve
ESDcapabilityisdependentontheapplicationanddened
teststandard.Theevaluationresultsforvarioustest
standardsandmethodsbasedonFigure1areshownin
Table1.
TheSP725hasaLevel4HBMcapabilitywhentestedasa
devicetotheIEC61000-4-2standard.Level4speciesa
requiredcapabilitygreaterthan8kVfordirectdischargeand
greaterthan15kVforairdischarge.
Forthe“Modied”MIL-STD-3015.7conditionthatis
denedasan“incircuit”methodofESDtesting,theV+
andV-pinshaveareturnpathtogroundandtheSP725
ESDcapabilityistypicallygreaterthan25kVfrom100pF
through1.5kΩ.BystrictdenitionofMIL-STD-3015.7using
“pinto-pin”devicetesting,theESDvoltagecapabilityis
greaterthan10kV.
FortheSP725EIAJIC121MachineModel(MM)standard,
theESDcapabilityistypicallygreaterthan2kVfrom200pF
withnoseriesresistance.
Standard Type/Mode RDCD±VD
IEC61000-4-2
(Level4)
HBM,AirDischarge 330Ω 150pF 15kV
HBM,DirectDischarge 330Ω 150pF 8kV
MIL-STD-3015.7 ModiedHBM 1.5kΩ 100pF 25kV
StandardHBM 1.5kΩ 100pF 10kV
EIAJIC121 MachineModel 0kΩ 200pF 2kV
H.V.
SUPPLY
±VD
IN
DUT
CD
R
1
IEC 61000-4-2: R 150 to 100MΩ
R
D
CHARGE
SWITCH
DISCHARGE
SWITCH
MIL-STD-3015.7: R 11 to 10MΩ
Figure 2: Low Current SCR Forward Voltage Drop Curve
Figure 1: Electrostatic Discharge Test
600 800 1000 1200
FORWARD SCR VO LTAGE DROP (mV)
200
160
120
80
40
0
TA = 25ºC
SINGLE PULSE
FORWARD SCR CURRENT (mA)
5
4
3
2
1
0
VFWD
IFWD
FORWARD SCR VO LTAGE DROP (V)
FORWARD SCR CURRENT (A)
01
23
EQUIV. SAT. ON
THRESHOLD ~ 1.1V
TA = 25°C
SINGLE PULSE
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
4
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
General Purpose ESD Protection - SP725 Series
Peak Transient Current Capability for Long Duration Surges
Thepeaktransientcurrentcapabilityrisessharplyasthe
widthofthecurrentpulsenarrows.Destructivetesting
wasdonetofullyevaluatetheSP725’sabilitytowithstand
awiderangeofpeakcurrentpulsesvstime.Thecircuit
usedtogeneratecurrentpulsesisshowninFigure4.
ThetestcircuitofFigure4isshownwithapositivepulse
input.Foranegativepulseinput,the(-)currentpulseinput
goestoanSP725‘IN’inputpinandthe(+)currentpulse
inputgoestotheSP725V-pin.TheV+toV-supplyofthe
SP725mustbeallowedtooat.(i.e.,Itisnottiedtothe
groundreferenceofthecurrentpulsegenerator.)Figure
5showsthepointofoverstressasdenedbyincreased
leakageinexcessofthedatasheetpublishedlimits.
Themaximumpeakinputcurrentcapabilityisdependent
ontheambienttemperature,improvingasthetemperature
isreduced.Peakcurrentcurvesareshownforambient
temperaturesof25ºCand105ºCanda15Vpowersupply
condition.Thesafeoperatingrangeofthetransientpeak
currentshouldbelimitedtonomorethan75%ofthe
measuredoverstresslevelforanygivenpulsewidthas
showninthecurvesofFigure5.
NotethatadjacentinputpinsoftheSP725maybe
paralleledtoimprovecurrent(andESD)capability.The
sustainedpeakcurrentcapabilityisincreasedtonearly
twicethatofasinglepin.
+
-
CURRENT
SENSE
VO LTAGE
PROBE
6
7
8
5
1
2
3
4
IN
IN
IN
V-
V+
V+
V- +
-
R1~ 10Ω TYPICAL
SP725
VX
VXADJ. 10V/ATYPICAL
R1
(-)
(+)
C1 ~ 100μF
VARIABLE TIME DURATION
CURRENT PULSE GENERATOR
IN
C1
Figure 5: SP725 Typical Nonrepetitive Peak Current
Pulse Capability
14
12
10
8
6
4
2
0
CAUTION: SAFE OPERATING CONDITIONS LIMIT
THE MAXIMUM PEAK CURRENT FOR A GIVEN
PULSE WIDTH TO BE NO GREATER THAN 75%
OF THE VALUES SHOWN ON EACH CURVE
V+ TO V-SUPPLY = 15V
0.0001 0.01 0.1 110100 1000
PULSE WIDTH TIME (ms)
TA = 25ºC
TA = 105ºC
PEAK CURRENT (A)
ShowingtheMeasuredPointofOverstressinAmperesvs
pulsewidthtimeinmilliseconds
Figure 4: Typical SP725 Peak Current Test Circuit
with a Variable Pulse Width Input
5
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
Lead-Free/Green SP725
General Purpose ESD Protection - SP725 Series
Package Dimensions — Small Outline Plastic Packages (SOIC)
Time
Temperature
TP
TL
TS(max)
TS(min)
25
tP
tL
tS
time to peak temperature
Preheat
P
rehea
t
Ramp-up
R
amp-up
Ramp-down
R
amp-d
o
Critical Zone
TL to TP
C
ritical Zon
e
T
to
T
P
Reflow Condition Pb–Freeassembly
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)60–180secs
Average ramp up rate (Liquidus) Temp
(TL) to peak 5°C/secondmax
TS(max) to TL - Ramp-up Rate 5°C/secondmax
Reflow - Temperature (TL) (Liquidus) 217°C
- Temperature (tL)60–150seconds
Peak Temperature (TP)260+0/-5°C
Time within 5°C of actual peak
Temperature (tp)20–40seconds
Ramp-down Rate 5°C/secondmax
Time 25°C to peak Temperature (TP)8minutesMax.
Do not exceed 260°C
Soldering Parameters
INDEX
AREA
E
D
N
123
-B-
0.25(0.010) CA
MBS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010)B
MM
Notes:
1. Symbolsaredenedinthe“MOSeriesSymbolList”inSection2.2ofPublication
Number95.
2. DimensioningandtolerancingperANSIY14.5M-1982.
3. Dimension“D”doesnotincludemoldash,protrusionsorgateburrs.Moldash,
protrusionandgateburrsshallnotexceed0.15mm(0.006inch)perside.
4. Dimension“E”doesnotincludeinterleadashorprotrusions.Interleadashand
protrusionsshallnotexceed0.25mm(0.010inch)perside.
5. Thechamferonthebodyisoptional.Ifitisnotpresent,avisualindexfeaturemustbe
locatedwithinthecrosshatchedarea.
6. “L”isthelengthofterminalforsolderingtoasubstrate.
7. “N”isthenumberofterminalpositions.
8. Terminalnumbersareshownforreferenceonly.
9. Theleadwidth“B”,asmeasured0.36mm(0.014inch)orgreaterabovetheseating
plane,shallnotexceedamaximumvalueof0.61mm(0.024inch).
10.Controllingdimension:MILLIMETER.Convertedinchdimensionsarenotnecessarily
exact.
Package SOIC
Pins 8
JEDEC MS-012
Millimeters Inches Notes
Min Max Min Max
A 1.35 1.75 0.0532 0.0688 -
A1 0.10 0.25 0.0040 0.0098 -
B 0.33 0.51 0.013 0.020 9
C 0.19 0.25 0.0075 0.0098 -
D 4.80 5.00 0.1890 0.1968 3
E 3.80 4.00 0.1497 0.1574 4
e 1.27BSC 0.050BSC -
H 5.80 6.20 0.2284 0.2440 -
h 0.25 0.50 0.0099 0.0196 5
L 0.40 1.27 0.016 0.050 6
N 8 8 7
µ0o 8o 0o 8o -
©2012 Littelfuse, Inc.
Specifications are subject to change without notice.
Please refer to www.littelfuse.com/SPA for current information.
6
TVS Diode Arrays (SPA
™ Family of Products)
Revision: April 20, 2012
SP725 Lead-Free/Green Series
General Purpose ESD Protection - SP725 Series
Part Numbering System Product Characteristics
Ordering Information
Embossed Carrier Tape & Reel Specification - SOIC Package
Part Number Temp. Range (ºC) Package Marking Min. Order Qty.
SP725ABG -40to105 8LdSOIC SP725AB(T)G11960
SP725ABTG -40to105 8LdSOICTapeandReel SP725AB(T)G12500
SP 725 AB
Series
Package Type
AB: 8 Leaded SOIC
TG=Tape and Reel
G=Green
Silicon Protection
Array (SPATM)
Family of
TVS Diode Arrays
*Lead Plating MatteTin
Lead Material CopperAlloy
Lead Coplanarity 0.004inches(0.102mm)
Substitute Material Silicon
Body Material MoldedEpoxy
Flammability UL94V-0
Notes:
1.Alldimensionsareinmillimeters.
2.Dimensionsincludesolderplating.
3.Dimensionsareexclusiveofmoldash&metalburr.
4.Bloisfacingupformoldandfacingdownfortrim/form,i.e.reversetrim/form.
5.PackagesurfacemattenishVDI11-13.
User Feeding Direction
Pin 1 Location
Symbol Millimetres Inches
Min Max Min Max
E1.65 1.85 0.065 0.073
F5.4 5.6 0.213 0.22
P2 1.95 2.05 0.077 0.081
D1. 5 1. 6 0.059 0.063
D1 1.50Min 0.059Min
P0 3.9 4.1 0.154 0.161
10P0 40.0+/-0.20 1.574+/-0.008
W11. 9 12.1 0.468 0.476
P7. 9 8.1 0.311 0.319
A0 6.3 6.5 0.248 0.256
B0 5.1 5.3 0.2 0.209
K0 2 2.2 0.079 0.087
t0.30+/-0.05 0.012+/-0.002
Notes:
1.SP725AB(T)GmeansdevicemarkingeitherSP725ABGorSP725ABTG.