Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Multilayer Ceramic Capacitors
– EC51 –
Supporting pin
The supporting pin does not necessarily
have to be positioned beneath the Capacitor.
Supporting pin
Crack
Separation of Solder
Crack
260
240
0
Temperature(˚C)
Time
3to5s
Soldering
oT
Gradual cooling
(at ordinary temperature)
60 to 120 s
5.2 Refl ow Soldering
The refl ow soldering temperature conditions are each
temperature curves of Preheating, Temp. rise, Heating,
Peak and Gradual cooling. Large temperature difference
caused by rapid heat application to the Capacitors may
lead to excessive thermal stresses, contributing to the
thermal cracks. The Preheating temperature requires
controlling with great care so that tombstone phenomenon
may be prevented.
(5) Insuffi cient curing may cause the Capacitor to fall
off after or during soldering. In addition, insulation
resistance between terminal electrodes may deteriorate
due to moisture absorption. In order to prevent these
problems, please observe proper curing conditions.
3.Chip Mounting Consideration
(1) When mounting the Capacitors/components on a
PC board, the Capacitor bodies shall be free from
excessive impact loads such as mechanical impact
or stress due to the positioning, pushing force and
displacement of vacuum nozzles during mounting.
(2) Maintenance and inspection of the Chip Mounter
must be performed regularly.
(3) If the bottom dead center of the vacuum nozzle
is too low, the Capacitor will crack from excessive
force during mounting.
The following precautions and recommendations are
for your reference.
(a) Set and adjust the bottom dead center of the
vacuum nozzles to the upper surface of the PC
board after correcting the warp of the PC board.
(b) Set the pushing force of the vacuum nozzle
during mounting to 1 to 3 N in static load.
(c) For double surface mounting, apply a supporting
pin on the rear surface of the PC board to suppress
the bending of the PC board in order to minimize
the impact of the vacuum nozzles. Typical examples
are shown in the table below.
Item Prohibited mounting Recommended
mounting
Single surface
mouting
Double surface
mounting
(d) Adjust the vacuum nozzles so that their bottom
dead center during mounting is not too low.
(4) The closing dimensions of the positioning chucks
shall be controlled. Maintenance and replacement
of positioning chucks shall be performed regularly
to prevent chipping or cracking of the Capacitors
caused by mechanical impact during positioning
due to worn positioning chucks.
(5) Maximum stroke of the nozzle shall be adjusted
so that the maximum bending of PC board does
not exceed 0.5 mm at 90 mm span. The PC board
shall be supported by an adequate number of
supporting pins.
4. Selection of Soldering Flux
Soldering fl ux may seriously affect the performance of the
Capacitors. The following shall be confi rmed before use.
(1) The soldering fl ux should have a halogen based
content of 0.1 wt. % (converted to chlorine) or below.
Do not use soldering fl ux with strong acid.
(2) When applying water-soluble soldering fl ux, wash
the Capacitors suffi ciently because the soldering fl ux
residue on the surface of PC boards may deteriorate
the insulation resistance on the Capacitors surface.
5. Soldering
5.1 Flow Soldering
For fl ow soldering, abnormal and large thermal and
mechanical stress, caused by the “Temperature Gradient”
between the mounted Capacitors and melted solder in a
soldering bath may be applied directly to the Capacitors,
resulting in failure and damage of the Capacitors.
Therefore it is essential that soldering process follow
these recommended conditions.
(1) Application of Soldering fl ux:
The soldering fl ux shall be applied to the mounted
Capacitors thinly and uniformly by foaming method.
(2) Preheating:
The mounted Capacitors/Components shall be
pre-heated suffi ciently so that the “Temperature
Gradient” between the Capacitors/Components
and the melted solder shall be 150 °C max. (100
to 130 °C)
(3) Immersion into Soldering Bath:
The Capacitors shall be immersed into a soldering
bath of 240 to 260 °C for 3 to 5 seconds.
(4) Gradual Cooling:
The Capacitors shall be cooled gradually to room
ambient temperature at cooling temperature rates of
8 °C/s max. from 250 °C to 170 °C and 4 °C/s max.
from 170 °C to 130 °C.
(5) Flux Cleaning:
When the Capacitors are immersed into a cleaning
solvent, be sure that the surface temperatures of
the devices do not exceed 100 °C.
(6) Performing fl ow soldering once under the conditions
shown in the fi gure below [Recommended profi le of
Flow soldering (Ex)] will not cause any problems.
However, pay attention to the possible warp and
bending of the PC board.
Recommended profi le for Flow soldering [Ex.]
Size Temp. Tol
0603 to 1206, 0508, 0612 o
T < 150 °C
<Allowable temperature difference o
T>
Item Temperature Period or Speed
1
Preheating
140 to 180 °C 60 to 120 sec
2
Temp. rise
Preheating temp to
Peak temp. 2 to 5 °C/sec
3
Heating
220 °C min. 60 sec max.
4
Peak
260 °C max. 10 sec max.
5
Gradual cooling Peak temp. to 140 °C
1 to 4 °C/sec
For products specifi ed in individual specifi cations, avoid
fl ow soldering.
00 Sep. 2008