GaAs-IR-Lumineszenzdiode GaAs Infrared Emitter Lead (Pb) Free Product - RoHS Compliant SFH 400 SFH 401 SFH 400 SFH 401 Wesentliche Merkmale Features * Kathode galvanisch mit dem Gehauseboden verbunden * Hohe Zuverlassigkeit * Gute spektrale Anpassung an Si-Fotoempfanger * Hermetisch dichtes Metallgehause * SFH 401: Gehausegleich mit BPX 43, BPY 62 * * * * * Anwendungen Applications * Lichtschranken fur Gleich- und Wechsellichtbetrieb * IR-Geratefernsteuerungen * Sensorik * Lichtgitter * * * * Cathode is electrically connected to the case High reliability Matches all Si-Photodetectors Hermetically sealed package SFH 401: Same package as BPX 43, BPY 62 Photointerrupters IR remote control Sensor technology Light curtains Typ Type Bestellnummer Ordering Code Gehause Package SFH 400 Q62702P0096 SFH 401 Q62702P0097 18 A3 DIN 41876 (TO-18), Glaslinse, hermetisch dichtes Gehause, Anschlusse im 2.54-mm-Raster (1/10'') 18 A3 DIN 41876 (TO-18) glass lens, hermetically sealed package, solder tabs lead spacing 2.54 mm (1/10'') 2007-12-07 1 SFH 400, SFH 401 Grenzwerte (TC = 25 C) Maximum Ratings Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Betriebs- und Lagertemperatur Operating and storage temperature range SFH 400 Top; Tstg - 40 ... + 125 C Betriebs- und Lagertemperatur Operating and storage temperature range SFH 401 Top; Tstg - 40 ... + 100 C Sperrspannung Reverse voltage VR 5 V Durchlassstrom Forward current IF 300 mA Stostrom, tp = 10 s, D = 0 Surge current IFSM 3 A Verlustleistung Power dissipation Ptot 470 mW Warmewiderstand Thermal resistance RthJA RthJC 450 160 K/W K/W Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Wellenlange der Strahlung Wavelength at peak emission IF = 100 mA, tp= 20ms peak 950 nm Spektrale Bandbreite bei 50% von Imax Spectral bandwidth at 50% of Imax IF = 100 mA, tp= 20ms 55 nm 6 15 Grad deg. Aktive Chipflache Active chip area A 0.25 mm2 Abmessungen der aktiven Chipflache Dimension of the active chip area LxB LxW 0.5 x 0.5 mm2 Kennwerte (TA = 25 C) Characteristics Abstrahlwinkel Half angle SFH 400 SFH 401 2007-12-07 2 SFH 400, SFH 401 Kennwerte (TA = 25 C) Characteristics (cont'd) Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit Abstand Chipoberflache bis Linsenscheitel Distance chip front to lens top SFH 400 SFH 401 H H 4.0 ... 4.8 2.8 ... 3.7 mm mm Schaltzeiten, Ie von 10% auf 90% und von 90% auf 10%, bei IF = 100 mA, RL = 50 Switching times, e from 10% to 90% and from 90% to 10%, IF = 100 mA, RL = 50 tr , tf 1 s Kapazitat Capacitance VR = 0 V, f = 1 MHz Co 40 pF VF VF 1.30 ( 1.5) 1.90 ( 2.5) V V Sperrstrom Reverse current VR = 5 V IR 0.01 ( 1) A Gesamtstrahlungsfluss Total radiant flux IF = 100 mA, tp = 20 ms e 8 mW Temperaturkoeffizient von Ie bzw. e, IF = 100 mA Temperature coefficient of Ie or e, IF = 100 mA TCI - 0.55 %/K Temperaturkoeffizient von VF, IF = 100 mA Temperature coefficient of VF, IF = 100 mA TCV - 1.5 mV/K Temperaturkoeffizient von , IF = 100 mA Temperature coefficient of , IF = 100 mA TC + 0.3 nm/K Durchlassspannung Forward voltage IF = 100 mA, tp = 20 ms IF = 1 A, tp = 100 s 2007-12-07 3 SFH 400, SFH 401 Gruppierung der Strahlstarke Ie in Achsrichtung gemessen bei einem Raumwinkel = 0.01 sr Grouping of Radiant Intensity Ie in Axial Direction at a solid angle of = 0.01 sr Bezeichnung Parameter Symbol Symbol Wert Value Einheit Unit SFH 400-2 SFH 400-3 SFH 401-2 SFH 401-3 Strahlstarke Radiant intensity IF = 100 mA, tp = 20 ms Strahlstarke Radiant intensity IF = 1 A, tp = 100 s 2007-12-07 Ie min Ie max 20 40 > 32 - 10 20 >16 - mW/sr mW/sr Ie typ. 300 320 120 190 mW/sr 4 SFH 400, SFH 401 Radiation Characteristics, SFH 400, Irel = f () 40 30 20 10 0 OHR01883 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 0.8 0.6 0.4 0 20 40 60 80 100 120 Radiation Characteristics, SFH 401, Irel = f () 40 30 20 10 0 OHR01884 1.0 50 0.8 60 0.6 70 0.4 0.2 80 0 90 100 1.0 2007-12-07 0.8 0.6 0.4 0 20 40 60 80 5 100 120 SFH 400, SFH 401 Relative Spectral Emission Irel = f () Radiant Intensity Single pulse, tp = 20 s OHRD1938 100 OHR01037 10 2 e Max. Permissible Forward Current SFH 401, IF = f (TA) OHR00486 350 F mA 300 e (100 mA) % rel Ie = f (IF) Ie 100 mA 80 250 10 1 60 R thJC = 160 K/W 200 150 40 10 R thJA = 450 K/W 0 100 20 50 0 880 920 960 1000 nm 10 -1 10 -2 1060 Forward Current IF = f (VF) F 10 -1 OHR01040 F OHR01937 10 4 mA tP D= 5 typ. tP T max. 10 3 F 0.2 0 0 40 60 80 C 100 TA , TC Max. Permissible Forward Current SFH 400, IF = f (TA) OHR00395 350 F mA 300 250 R thJC = 160 K/W 200 150 R thJA = 450 K/W 5 -1 20 T D= 0.005 0.01 0.02 0.05 0.1 0.5 10 10 1 A F Permissible Pulse Handling Capability IF = f (), TC = 25 C, RthJC = 160 K/W,duty cycle D = parameter 10 1 A 10 0 10 0 100 DC 50 10 -2 1 1.5 2007-12-07 2 2.5 3 3.5 4 V 4.5 VF 10 2 10 -5 10 -4 10 -3 6 10 -2 s 10 0 0 0 20 40 60 80 100 C 130 TA , TC SFH 400, SFH 401 Mazeichnung Package Outlines ) 43 ) .0 (0 035 . (0 9 0. welded 6.6 (0.260) 0. 9 1. 1 (0 o4.8 (0.189) o4.6 (0.181) .0 43 ) Chip position o0.45 (0.018) 1 ) 43 .0 (0 ) 35 5.0 (0.197) .0 (0 9 0. welded 5.3 (0.209) Anode = SFH 481 Cathode = SFH 401 (package) 1. 2.54 (0.100) spacing GEOY6314 ) 12.5 (0.492) 35 7.4 (0.291) .0 14.5 (0.571) (0 5.0 (0.197) (2.7 (0.106)) o5.6 (0.220) o5.3 (0.209) glass lens 5.3 (0.209) o5.6 (0.220) o5.3 (0.209) glass lens 14.5 (0.571) 6.4 (0.252) 12.5 (0.492) 5.6 (0.220) GETY6091 Mae in mm (inch) / Dimensions in mm (inch). 2007-12-07 Anode = SFH 480 Cathode = SFH 216, SFH 400 (package) 1 1. 2.54 (0.100) spacing o0.45 (0.018) SFH 401 1. 0. 1 (0 9 (0 .043 .0 35 ) ) Chip position o4.8 (0.189) o4.6 (0.181) (2.7 (0.106)) SFH 400 7 SFH 400, SFH 401 Lotbedingungen Soldering Conditions Wellenloten (TTW) TTW Soldering (nach CECC 00802) (acc. to CECC 00802) OHLY0598 300 C T 10 s 250 Normalkurve standard curve 235 C ... 260 C Grenzkurven limit curves 2. Welle 2. wave 200 1. Welle 1. wave 150 ca 200 K/s 2 K/s 5 K/s 100 C ... 130 C 100 2 K/s 50 Zwangskuhlung forced cooling 0 0 50 100 150 200 s 250 t Published by OSRAM Opto Semiconductors GmbH Wernerwerkstrasse 2, D-93049 Regensburg www.osram-os.com (c) All Rights Reserved. The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. Packing Please use the recycling operators known to you. We can also help you - get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Components used in life-support devices or systems must be expressly authorized for such purpose! Critical components 1 , may only be used in life-support devices or systems 2 with the express written approval of OSRAM OS. 1 A critical component is a component usedin a life-support device or system whose failure can reasonably be expected to cause the failure of that life-support device or system, or to affect its safety or effectiveness of that device or system. 2 Life support devices or systems are intended (a) to be implanted in the human body, or (b) to support and/or maintain and sustain human life. If they fail, it is reasonable to assume that the health of the user may be endangered. 2007-12-07 8