1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
C1+
VS+
C1−
C2+
C2−
VS−
DOUT2
RIN2
VCC
GND
DOUT1
RIN1
ROUT1
DIN1
DIN2
ROUT2
D, DW, N, NS, OR PW PACKAGE
(TOP VIEW)
MAX232E
www.ti.com
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
DUAL RS-232 DRIVER/RECEIVER WITH IEC61000-4-2 PROTECTION
Check for Samples: MAX232E
1FEATURES
• Meets or Exceeds TIA/RS-232-F and ITU
Recommendation V.28
• Operates From a Single 5-V Power Supply
With 1.0-μF Charge-Pump Capacitors
• Operates up to 250 kbit/s
• Two Drivers and Two Receivers
• ±30-V Input Levels
• Low Supply Current . . . 8 mA Typical
• ESD Protection for RS-232 Bus Pins
– ±15-kV Human-Body Model (HBM)
– ±8-kV IEC61000-4-2, Contact Discharge
– ±15-kV IEC61000-4-2, Air-Gap Discharge
APPLICATIONS
• TIA/RS-232-F
• Battery-Powered Systems
• Terminals
• Modems
• Computers
DESCRIPTION/ORDERING INFORMATION
The MAX232E is a dual driver/receiver that includes a capacitive voltage generator to supply TIA/RS-232-F
voltage levels from a single 5-V supply. Each receiver converts TIA/RS-232-F inputs to 5-V TTL/CMOS levels.
This receiver has a typical threshold of 1.3 V, a typical hysteresis of 0.5 V, and can accept ±30-V inputs. Each
driver converts TTL/CMOS input levels into TIA/RS-232-F levels. The driver, receiver, and voltage-generator
functions are available as cells in the Texas Instruments LinASIC™ library.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date. Copyright © 2006–2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DIN1 DOUT1
RIN1ROUT1
DIN2 DOUT2
RIN2ROUT2
11
10
12
9
14
7
13
8
MAX232E
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
www.ti.com
Table 1. ORDERING INFORMATION(1)
TAPACKAGE(2) ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Tube of 25 MAX232ECN MAX232ECN
Tube of 40 MAX232ECD
SOIC – D MAX232EC
Reel of 2500 MAX232ECDR
0°C to 70°C Tube of 40 MAX232ECDW
SOIC – DW MAX232EC
Reel of 2000 MAX232ECDWR
Tube of 25 MAX232ECPW
TSSOP – PW MA232EC
Reel of 2000 MAX232ECPWR
PDIP – N Tube of 25 MAX232EIN MAX232EIN
Tube of 40 MAX232EID
SOIC – D MAX232EI
Reel of 2500 MAX232EIDR
–40°C to 85°C Tube of 40 MAX232EIDW
SOIC – DW MAX232EI
Reel of 2000 MAX232EIDWR
Tube of 25 MAX232EIPW
TSSOP – PW MB232EI
Reel of 2000 MAX232EIPWR
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
Table 2. FUNCTION TABLES
ABC
Each Driver(1)
INPUT OUTPUT
DIN DOUT
L H
H L
(1) H = high level, L = low level
Table 3. Each Receiver(1)
INPUT OUTPUT
RIN ROUT
L H
H L
(1) H = high level, L = low level
LOGIC DIAGRAM (POSITIVE LOGIC)
2Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX232E
MAX232E
www.ti.com
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
VCC Input supply voltage range(2) –0.3 6 V
VS+ Positive output supply voltage range VCC – 0.3 15 V
VS– Negative output supply voltage range –0.3 –15 V
Driver –0.3 VCC + 0.3
VIInput voltage range V
Receiver ±30
DOUT VS– – 0.3 VS+ + 0.3
VOOutput voltage range V
ROUT –0.3 VCC + 0.3
Short-circuit duration DOUT Unlimited
D package 73
DW package 57
θJA Package thermal impedance(3) (4) °C/W
N package 67
PW package 108
TJOperating virtual junction temperature 150 °C
Tstg Storage temperature range –65 150 °C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/θJA. Operating at the absolute maximum TJof 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions MIN NOM MAX UNIT
VCC Supply voltage 4.5 5 5.5 V
VIH High-level input voltage (DIN1, DIN2) 2 V
VIL Low-level input voltage (DIN1, DIN2) 0.8 V
Receiver input voltage (RIN1, RIN2) ±30 V
MAX232EC 0 70
TAOperating free-air temperature °C
MAX232EI –40 85
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
ICC Supply current VCC = 5.5 V, All outputs open, TA= 25°C 8 10 mA
(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V and TA= 25°C.
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Link(s): MAX232E
MAX232E
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
www.ti.com
DRIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage DOUT RL= 3 kΩto GND 5 7 V
VOL Low-level output voltage(3) DOUT RL= 3 kΩto GND –7 –5 V
roOutput resistance DOUT VS+ = VS– = 0, VO= ±2 V 300 Ω
IOS Short-circuit output current DOUT VCC = 5.5 V, VO= 0 ±10 mA
(4)
IIS Short-circuit input current DIN VI= 0 200 μA
(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V and TA= 25°C.
(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic
voltage levels only.
(4) Not more than one output should be shorted at a time.
Switching Characteristics(1)
VCC = 5 V, TA= 25°C (see Note 4)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
SR Driver slew rate RL= 3 kΩto 7 kΩ, See Figure 2 30 V/μs
SR(t) Driver transition region slew rate See Figure 3 3 V/μs
Data rate One DOUT switching 250 kbit/s
(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
ESD protection
PARAMETER TEST CONDITIONS TYP UNIT
HBM ±15 kV
DOUT, RIN IEC61000-4-2, Air-Gap Discharge ±15 kV
IEC61000-4-2, Contact Discharge ±8 kV
4Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX232E
MAX232E
www.ti.com
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
RECEIVER SECTION
abc
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature range
PARAMETER TEST CONDITIONS MIN TYP(2) MAX UNIT
VOH High-level output voltage ROUT IOH = –1 mA 3.5 V
VOL Low-level output voltage(3) ROUT IOL = 3.2 mA 0.4 V
VIT+ Receiver positive-going input threshold voltage RIN VCC = 5 V, TA= 25°C 1.7 2.4 V
VIT– Receiver negative-going input threshold voltage RIN VCC = 5 V, TA= 25°C 0.8 1.2 V
Vhys Input hysteresis voltage RIN VCC = 5 V 0.2 0.5 1 V
riReceiver input resistance RIN VCC = 5 V, TA= 25°C 3 5 7 kΩ
(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V and TA= 25°C.
(3) The algebraic convention, in which the least-positive (most negative) value is designated minimum, is used in this data sheet for logic
voltage levels only.
Switching Characteristics(1)
VCC = 5 V, TA= 25°C (see Figure 1)PARAMETER TYP UNIT
tPLH(R) Receiver propagation delay time, low- to high-level output 500 ns
tPHL(R) Receiver propagation delay time, high- to low-level output 500 ns
(1) Test conditions are C1–C4 = 1 μF at VCC = 5 V ± 0.5 V.
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Link(s): MAX232E
≤10 ns
VCC
RIN ROUT
RL = 1.3 kΩ
See Note C
CL = 50 pF
(see Note B)
TEST CIRCUIT
≤10 ns
Input
Output
tPHL tPLH
1.5 V VOL
VOH
0 V
3 V
10% 90%
50%
500 ns
WAVEFORMS
1.5 V
90%
50% 10%
Pulse
Generator
(see Note A)
MAX232E
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
www.ti.com
PARAMETER MEASUREMENT INFORMATION
A. The pulse generator has the following characteristics: ZO= 50 Ω, duty cycle ≤50%.
B. CLincludes probe and jig capacitance.
C. All diodes are 1N3064 or equivalent.
Figure 1. Receiver Test Circuit and Waveforms for tPHL and tPLH Measurements
6Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX232E
DIN DOUT
CL = 10 pF
(see Note B)
TEST CIRCUIT
≤10 ns≤10 ns
Input
Output
tPHL tPLH
VOL
VOH
0 V
3 V
10%
90%
50%
5 µs
WAVEFORMS
90%
50% 10%
RL
90%
10%
90%
10%
tTLH
tTHL
SR +
0.8 (VOH – VOL)
tTLH or 0.8 (VOL – VOH)
tTHL
Pulse
Generator
(see Note A) RS-232 Output
RS-232 Output
−3 V 3 V
−3 V
3 V
3 kΩ
10%
1.5 V
90%
WAVEFORMS
20 µs
1.5 V
90%
10%
VOH
VOL
tTLH
tTHL
≤10 ns ≤10 ns
TEST CIRCUIT
CL = 2.5 nF
Pulse
Generator
(see Note A)
Input
Output
SR +6 V
tTHL or tTLH
DIN DOUT
MAX232E
www.ti.com
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
PARAMETER MEASUREMENT INFORMATION (continued)
A. The pulse generator has the following characteristics: ZO= 50 Ω, duty cycle ≤50%.
B. CLincludes probe and jig capacitance.
Figure 2. Driver Test Circuit and Waveforms for tPHL and tPLH Measurements (5-μs Input)
A. The pulse generator has the following characteristics: ZO= 50 Ω, duty cycle ≤50%.
Figure 3. Test Circuit and Waveforms for tTHL and tTLH Measurements (20-μs Input)
Copyright © 2006–2009, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Link(s): MAX232E
1 µF
1 µFVS+
VS−
2
6
14
7
13
8
C1+
C1−
C2+
C2−
1
3
4
5
11
10
12
9
GND
15
0 V
VCC
16
5 V
RS-232 Output
RS-232 Output
RS-232 Input
RS-232 Input
1 µF
8.5 V
−8.5 V
1 µF
From CMOS or TTL
To CMOS or TTL
CBYPASS = 1 µF
C1
C2
C3†
C4
†C3 can be connected to VCC or GND.
+
+
−
MAX232E
SLLS723B –APRIL 2006–REVISED NOVEMBER 2009
www.ti.com
APPLICATION INFORMATION
A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown. In addition to the 1-μF capacitors shown, the MAX202E can operate with 0.1-μF capacitors.
Figure 4. Typical Operating Circuit
8Submit Documentation Feedback Copyright © 2006–2009, Texas Instruments Incorporated
Product Folder Link(s): MAX232E
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MAX232ECD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MAX232ECNE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MAX232ECPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232ECPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EID ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
MAX232EIDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIN ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MAX232EINE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
MAX232EIPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
MAX232EIPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 23-Jan-2012
Addendum-Page 3
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
MAX232ECDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
MAX232ECDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232ECDWRG4 SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232ECPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
MAX232EIDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
MAX232EIDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
MAX232EIPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
MAX232ECDR SOIC D 16 2500 367.0 367.0 38.0
MAX232ECDWR SOIC DW 16 2000 366.0 364.0 50.0
MAX232ECDWRG4 SOIC DW 16 2000 367.0 367.0 38.0
MAX232ECPWR TSSOP PW 16 2000 367.0 367.0 35.0
MAX232EIDR SOIC D 16 2500 367.0 367.0 38.0
MAX232EIDWR SOIC DW 16 2000 367.0 367.0 38.0
MAX232EIPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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