V+
1
2
3
4 5
6
7
8
N/C
VIN-
VIN+
V-
N/C
VOUT
N/C
-
+
LMP2011, LMP2012
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SNOSA71K OCTOBER 2004REVISED MARCH 2013
LMP2011 Single/LMP2012 Dual High Precision, Rail-to-Rail Output Operational Amplifier
Check for Samples: LMP2011,LMP2012
1FEATURES DESCRIPTION
The LMP201X series are the first members of TI's
2(For VS= 5V, Typical Unless Otherwise Noted) new LMPTM precision amplifier family. The LMP201X
Low Ensured VOS Over Temperature 60 µV series offers unprecedented accuracy and stability in
Low Noise with No 1/f 35nV/Hz space-saving miniature packaging while also being
offered at an affordable price. This device utilizes
High CMRR 130 dB patented techniques to measure and continually
High PSRR 120 dB correct the input offset error voltage. The result is an
High AVOL 130 dB amplifier which is ultra stable over time and
temperature. It has excellent CMRR and PSRR
Wide Gain-Bandwidth Product 3MHz ratings, and does not exhibit the familiar 1/f voltage
High Slew Rate 4V/µs and current noise increase that plagues traditional
Low Supply Current 930µA amplifiers. The combination of the LMP201X
characteristics makes it a good choice for transducer
Rail-to-Rail Output 30mV amplifiers, high gain configurations, ADC buffer
No External Capacitors Required amplifiers, DAC I-V conversion, and any other 2.7V-
5V application requiring precision and long term
APPLICATIONS stability.
Precision Instrumentation Amplifiers Other useful benefits of the LMP201X are rail-to-rail
Thermocouple Amplifiers output, a low supply current of 930 µA, and wide
gain-bandwidth product of 3 MHz. These extremely
Strain Gauge Bridge Amplifier versatile features found in the LMP201X provide high
performance and ease of use.
Connection Diagram
Figure 1. 5-Pin SOT-23 Single Figure 2. 8-Pin Single SOIC Figure 3. 8-Pin Dual
(LMP2011) (LMP2011) SOIC/VSSOP (LMP2012)
Top View Top View Top View
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
www.ti.com
Absolute Maximum Ratings (1)(2)
ESD Tolerance Human Body Model 2000V
Machine Model 200V
Supply Voltage 5.8V
Common-Mode Input Voltage 0.3 VCM VCC +0.3V
Lead Temperature (soldering 10 sec.) +300°C
Differential Input Voltage ±Supply Voltage
Current at Input Pin 30 mA
Current at Output Pin 30 mA
Current at Power Supply Pin 50 mA
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not ensured. For ensured specifications and test conditions, see the Electrical
Characteristics.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
Operating Ratings (1)
Supply Voltage 2.7V to 5.25V
Storage Temperature Range 65°C to 150°C
Operating Temperature Range 40°C to 125°C
(1) Absolute Maximum Ratings indicate limits beyond which damage may occur. Operating Ratings indicate conditions for which the device
is intended to be functional, but specific performance is not ensured. For ensured specifications and test conditions, see the Electrical
Characteristics.
2.7V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 2.7V, V= 0V, V CM = 1.35V, VO= 1.35V and RL> 1 MΩ.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
VOS Input Offset Voltage 0.8 25
(LMP2011 only) 60 μV
Input Offset Voltage 0.8 36
(LMP2012 only) 60
Offset Calibration Time 0.5 10 ms
12
TCVOS Input Offset Voltage 0.015 μV/°C
Long-Term Offset Drift 0.006 μV/month
Lifetime VOS Drift 2.5 μV
IIN Input Current -3 pA
IOS Input Offset Current 6 pA
RIND Input Differential Resistance 9 M
CMRR Common Mode Rejection Ratio 0.3 VCM 0.9V 95 130 dB
0VCM 0.9V 90
PSRR Power Supply Rejection Ratio 95 120 dB
90
AVOL Open Loop Voltage Gain RL= 10 k95 130
90 dB
RL= 2 k90 124
85
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using
statistical quality control (SQC) method.
(2) Typical values represent the most likely parametric norm.
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2.7V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 2.7V, V= 0V, V CM = 1.35V, VO= 1.35V and RL> 1 MΩ.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
VOOutput Swing RL= 10 kto 1.35V 2.665 2.68
(LMP2011 only) VIN(diff) = ±0.5V 2.655 V
0.033 0.060
0.075
RL= 2 kto 1.35V 2.630 2.65
VIN(diff) = ±0.5V 2.615 V
0.061 0.085
0.105
Output Swing RL= 10 kto 1.35V 2.64 2.68
(LMP2012 only) VIN(diff) = ±0.5V 2.63 V
0.033 0.060
0.075
RL= 2 kto 1.35V 2.615 2.65
VIN(diff) = ±0.5V 2.6 V
0.061 0.085
0.105
IOOutput Current Sourcing, VO= 0V 5 12
VIN(diff) = ±0.5V 3mA
Sinking, VO= 5V 5 18
VIN(diff) = ±0.5V 3
ISSupply Current per Channel 0.919 1.20 mA
1.50
2.7V AC Electrical Characteristics
TJ= 25°C, V+= 2.7V, V= 0V, VCM = 1.35V, VO= 1.35V, and RL> 1 MΩ.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
GBW Gain-Bandwidth Product 3 MHz
SR Slew Rate 4 V/μs
θmPhase Margin 60 Deg
GmGain Margin 14 dB
enInput-Referred Voltage Noise 35 nV/Hz
inInput-Referred Current Noise pA/Hz
enp-p Input-Referred Voltage Noise RS= 100, DC to 10 Hz 850 nVpp
trec Input Overload Recovery Time 50 ms
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using
statistical quality control (SQC) method.
(2) Typical values represent the most likely parametric norm.
5V DC Electrical Characteristics
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 5V, V= 0V, V CM = 2.5V, VO= 2.5V and RL> 1MΩ.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
VOS Input Offset Voltage 0.12 25
(LMP2011 only) 60 μV
Input Offset Voltage 0.12 36
(LMP2012 only) 60
Offset Calibration Time 0.5 10 ms
12
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using
statistical quality control (SQC) method.
(2) Typical values represent the most likely parametric norm.
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5V DC Electrical Characteristics (continued)
Unless otherwise specified, all limits ensured for TJ= 25°C, V+= 5V, V= 0V, V CM = 2.5V, VO= 2.5V and RL> 1MΩ.
Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
TCVOS Input Offset Voltage 0.015 μV/°C
Long-Term Offset Drift 0.006 μV/month
Lifetime VOS Drift 2.5 μV
IIN Input Current -3 pA
IOS Input Offset Current 6 pA
RIND Input Differential Resistance 9 M
CMRR Common Mode Rejection Ratio 0.3 VCM 3.2 100 130 dB
0VCM 3.2 90
PSRR Power Supply Rejection Ratio 95 120 dB
90
AVOL Open Loop Voltage Gain RL= 10 k105 130
100 dB
RL= 2 k95 132
90
VOOutput Swing RL= 10 kto 2.5V 4.96 4.978
(LMP2011 only) VIN(diff) = ±0.5V 4.95 V
0.040 0.070
0.085
RL= 2 kto 2.5V 4.895 4.919
VIN(diff) = ±0.5V 4.875 V
0.091 0.115
0.140
Output Swing RL= 10 kto 2.5V 4.92 4.978
(LMP2012 only) VIN(diff) = ±0.5V 4.91 V
0.040 0.080
0.095
RL= 2 kto 2.5V 4.875 4.919
VIN(diff) = ±0.5V 4.855 V
0.0.91 0.125
0.150
IOOutput Current Sourcing, VO= 0V 8 15
VIN(diff) = ±0.5V 6mA
Sinking, VO= 5V 8 17
VIN(diff) = ±0.5V 6
ISSupply Current per Channel 0.930 1.20 mA
1.50
5V AC Electrical Characteristics
TJ= 25°C, V+= 5V, V= 0V, VCM = 2.5V, VO= 2.5V, and RL> 1MΩ.Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min (1) Typ (2) Max (1) Units
GBW Gain-Bandwidth Product 3 MHz
SR Slew Rate 4 V/μs
θmPhase Margin 60 deg
GmGain Margin 15 dB
enInput-Referred Voltage Noise 35 nV/Hz
inInput-Referred Current Noise pA/Hz
enp-p Input-Referred Voltage Noise RS= 100, DC to 10 Hz 850 nVpp
trec Input Overload Recovery Time 50 ms
(1) Limits are 100% production tested at 25°C. Limits over the operating temperature range are ensured through correlations using
statistical quality control (SQC) method.
(2) Typical values represent the most likely parametric norm.
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0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
-500
-400
-300
-200
-100
0
100
200
300
400
500
BIAS CURRENT (pA)
VCM (V)
VS = 5V
0.1 100 100k
10
100
1000
10000
1k
10 1M
FREQUENCY (Hz)
10k
1
VOLTAGE NOISE (nV/ Hz)
VS = 5V
LMP2011, LMP2012
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SNOSA71K OCTOBER 2004REVISED MARCH 2013
Typical Performance Characteristics
TA=25C, VS= 5V unless otherwise specified.
Supply Current vs. Supply Voltage Offset Voltage vs. Supply Voltage
Figure 4. Figure 5.
Offset Voltage vs. Common Mode Offset Voltage vs. Common Mode
Figure 6. Figure 7.
Voltage Noise vs. Frequency Input Bias Current vs. Common Mode
Figure 8. Figure 9.
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10 1k 100k 10M
FREQUENCY (Hz)
0
40
80
120
PSRR
(dB)
1M
10k
100
100
60
20
VS = 2.7V
VCM = 1V
POSITIVE
NEGATIVE
10 1k 100k 10M
FREQUENCY (Hz)
0
40
80
120
PSRR
(dB)
1M
10k
100
100
60
20
VS = 5V
VCM = 2.5V
POSITIVE
NEGATIVE
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
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Typical Performance Characteristics (continued)
TA=25C, VS= 5V unless otherwise specified.
PSRR vs. Frequency PSRR vs. Frequency
Figure 10. Figure 11.
Output Sourcing @ 2.7V Output Sourcing @ 5V
Figure 12. Figure 13.
Output Sinking @ 2.7V Output Sinking @ 5V
Figure 14. Figure 15.
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10 100 1k 100k 100k
FREQUENCY (Hz)
0
20
40
60
80
100
120
140
CMRR (dB)
VS = 5V
100 10k 10M
FREQUENCY (Hz)
-20
20
100
GAIN (dB)
1M
100k
1k
80
40
0
60
-30.0
30.0
150.0
120.0
60.0
0.0
90.0
PHASE (°)
RL = 1M
CL = < 20pF
VS = 2.7V OR 5V
VS = 5V
VS = 5V
VS = 2.7V
PHASE
GAIN
LMP2011, LMP2012
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SNOSA71K OCTOBER 2004REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA=25C, VS= 5V unless otherwise specified.
Max Output Swing vs. Supply Voltage Max Output Swing vs. Supply Voltage
Figure 16. Figure 17.
Min Output Swing vs. Supply Voltage Min Output Swing vs. Supply Voltage
Figure 18. Figure 19.
CMRR vs. Frequency Open Loop Gain and Phase vs. Supply Voltage
Figure 20. Figure 21.
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1k 10k 100k 1M 10M
FREQUENCY (Hz)
-20
0
20
40
60
80
100
GAIN (dB)
VS = 2.7V
VOUT = 200 mVPP
RL = >1M
CL = < 20 pF
PHASE
GAIN
-40°C
85°C
25°C
85°C
-40°C
-23
0
23
45
68
90
113
PHASE (°)
1k 10k 100k 1M 10M
FREQUENCY (Hz)
-20
0
20
40
60
80
100
GAIN (dB)
VS = 5V
VOUT = 200 mVPP
RL = >1M
CL = < 20pF
PHASE
GAIN
85°C
25°C
85°C
-23
0
23
45
68
90
113
PHASE (°)
-40°C
-40°C
100 10k 10M
FREQUENCY (Hz)
-20
20
100
GAIN (dB)
1M
100k
1k
80
40
0
60
-30.0
30.0
150.0
120.0
60.0
0.0
90.0
PHASE (°)
10pF
500pF 10pF
500pF
VS = 2.7V, RL = >1M
CL = 10,50,200 & 500pF
PHASE
GAIN
100 10k 10M
FREQUENCY (Hz)
-20
20
100
GAIN (dB)
1M
100k
1k
80
40
0
60
10pF
10pF
500pF
500pF
VS = 5V, RL = >1M
CL = 10,50,200 & 500pF -30.0
30.0
150.0
120.0
60.0
0.0
90.0
PHASE (°)
GAIN
PHASE
100 10k 10M
FREQUENCY (Hz)
-20
20
100
GAIN (dB)
1M
100k
1k
80
40
0
60
-30.0
30.0
150.0
120.0
60.0
0.0
90.0
PHASE (°)
VS = 2.7V
CL = < 20 pF
RL = >1M & 2k
RL = >1M
RL = 2k
RL = >1M
RL = 2k
PHASE
GAIN
100 10k 10M
FREQUENCY (Hz)
-20
20
100
GAIN (dB)
1M
100k
1k
80
40
0
60
-30.0
30.0
150.0
120.0
60.0
0.0
90.0
PHASE (°)
VS = 5V
CL = < 20 pF
RL = >1M & 2k
RL = >1M
RL = 2k
RL = >1M
PHASE
GAIN
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
www.ti.com
Typical Performance Characteristics (continued)
TA=25C, VS= 5V unless otherwise specified.
Open Loop Gain and Phase vs. RL@ 2.7V Open Loop Gain and Phase vs. RL@ 5V
Figure 22. Figure 23.
Open Loop Gain and Phase vs. CL@ 2.7V Open Loop Gain and Phase vs. CL@ 5V
Figure 24. Figure 25.
Open Loop Gain and Phase vs. Temperature @ 2.7V Open Loop Gain and Phase vs. Temperature @ 5V
Figure 26. Figure 27.
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NOISE (200 nV/DIV)
1 sec/DIV
10 100 1k 10k 100k
FREQUENCY (Hz)
0.01
0.1
1
10
THD+N (%)
VS = 2.7V
VS = 2.7V
VS = 5V
VS = 5V
VOUT = 2 VPP
MEAS BW = 500 kHz
RL = 10k
AV = +10
LMP2011, LMP2012
www.ti.com
SNOSA71K OCTOBER 2004REVISED MARCH 2013
Typical Performance Characteristics (continued)
TA=25C, VS= 5V unless otherwise specified.
THD+N vs. AMPL THD+N vs. Frequency
Figure 28. Figure 29.
0.1 Hz 10 Hz Noise vs. Time
Figure 30.
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APPLICATION INFORMATION
THE BENEFITS OF LMP201X
NO 1/f NOISE
Using patented methods, the LMP201X eliminates the 1/f noise present in other amplifiers. That noise, which
increases as frequency decreases, is a major source of measurement error in all DC-coupled measurements.
Low-frequency noise appears as a constantly-changing signal in series with any measurement being made. As a
result, even when the measurement is made rapidly, this constantly-changing noise signal will corrupt the result.
The value of this noise signal can be surprisingly large. For example: If a conventional amplifier has a flat-band
noise level of 10nV/Hz and a noise corner of 10 Hz, the RMS noise at 0.001 Hz is 1µV/Hz. This is equivalent
to a 0.50 µV peak-to-peak error, in the frequency range 0.001 Hz to 1.0 Hz. In a circuit with a gain of 1000, this
produces a 0.50 mV peak-to-peak output error. This number of 0.001 Hz might appear unreasonably low, but
when a data acquisition system is operating for 17 minutes, it has been on long enough to include this error. In
this same time, the LMP201X will only have a 0.21 mV output error. This is smaller by 2.4 x. Keep in mind that
this 1/f error gets even larger at lower frequencies. At the extreme, many people try to reduce this error by
integrating or taking several samples of the same signal. This is also doomed to failure because the 1/f nature of
this noise means that taking longer samples just moves the measurement into lower frequencies where the noise
level is even higher.
The LMP201X eliminates this source of error. The noise level is constant with frequency so that reducing the
bandwidth reduces the errors caused by noise.
Another source of error that is rarely mentioned is the error voltage caused by the inadvertent thermocouples
created when the common "Kovar type" IC package lead materials are soldered to a copper printed circuit board.
These steel-based leadframe materials can produce over 35 μV/°C when soldered onto a copper trace. This can
result in thermocouple noise that is equal to the LMP201X noise when there is a temperature difference of only
0.0014°C between the lead and the board!
For this reason, the lead-frame of the LMP201X is made of copper. This results in equal and opposite junctions
which cancel this effect. The extremely small size of the SOT-23 package results in the leads being very close
together. This further reduces the probability of temperature differences and hence decreases thermal noise.
OVERLOAD RECOVERY
The LMP201X recovers from input overload much faster than most chopper-stabilized op amps. Recovery from
driving the amplifier to 2X the full scale output, only requires about 40 ms. Many chopper-stabilized amplifiers will
take from 250 ms to several seconds to recover from this same overload. This is because large capacitors are
used to store the unadjusted offset voltage.
Figure 31. Overload Recovery Test
The wide bandwidth of the LMP201X enhances performance when it is used as an amplifier to drive loads that
inject transients back into the output. ADCs (Analog-to-Digital Converters) and multiplexers are examples of this
type of load. To simulate this type of load, a pulse generator producing a 1V peak square wave was connected
to the output through a 10 pF capacitor. (Figure 31) The typical time for the output to recover to 1% of the
applied pulse is 80 ns. To recover to 0.1% requires 860ns. This rapid recovery is due to the wide bandwidth of
the output stage and large total GBW.
NO EXTERNAL CAPACITORS REQUIRED
The LMP201X does not need external capacitors. This eliminates the problems caused by capacitor leakage and
dielectric absorption, which can cause delays of several seconds from turn-on until the amplifier's error has
settled.
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0.1 100 100k
10
100
1000
10000
1k
10 1M
FREQUENCY (Hz)
10k
1
VOLTAGE NOISE (nV/ Hz)
VS = 5V
LMP2011, LMP2012
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SNOSA71K OCTOBER 2004REVISED MARCH 2013
MORE BENEFITS
The LMP201X offers the benefits mentioned above and more. It has a rail-to-rail output and consumes only 950
µA of supply current while providing excellent DC and AC electrical performance. In DC performance, the
LMP201X achieves 130 dB of CMRR, 120 dB of PSRR and 130 dB of open loop gain. In AC performance, the
LMP201X provides 3 MHz of gain-bandwidth product and 4 V/µs of slew rate.
HOW THE LMP201X WORKS
The LMP201X uses new, patented techniques to achieve the high DC accuracy traditionally associated with
chopper-stabilized amplifiers without the major drawbacks produced by chopping. The LMP201X continuously
monitors the input offset and corrects this error. The conventional chopping process produces many mixing
products, both sums and differences, between the chopping frequency and the incoming signal frequency. This
mixing causes large amounts of distortion, particularly when the signal frequency approaches the chopping
frequency. Even without an incoming signal, the chopper harmonics mix with each other to produce even more
trash. If this sounds unlikely or difficult to understand, look at the plot (Figure 32), of the output of a typical
(MAX432) chopper-stabilized op amp. This is the output when there is no incoming signal, just the amplifier in a
gain of -10 with the input grounded. The chopper is operating at about 150 Hz; the rest is mixing products. Add
an input signal and the noise gets much worse. Compare this plot with Figure 33 of the LMP201X. This data was
taken under the exact same conditions. The auto-zero action is visible at about 30 kHz but note the absence of
mixing products at other frequencies. As a result, the LMP201X has very low distortion of 0.02% and very low
mixing products.
Figure 32. The Output of a Chopper Stabilized Op Amp (MAX432)
Figure 33. The Output of the LMP2011/LMP2012
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+
-
+
-VOUT
5V
R1 R2 R2 R1
10k, 0.1% 2k, 1% 2k, 1% 10k, 0.1%
R3
20:
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
www.ti.com
INPUT CURRENTS
The LMP201X's input currents are different than standard bipolar or CMOS input currents in that it appears as a
current flowing in one input and out the other. Under most operating conditions, these currents are in the
picoamp level and will have little or no effect in most circuits. These currents tend to increase slightly when the
common-mode voltage is near the minus supply. (See the typical curves.) At high temperatures such as 85°C,
the input currents become larger, 0.5 nA typical, and are both positive except when the VCM is near V. If
operation is expected at low common-mode voltages and high temperature, do not add resistance in series with
the inputs to balance the impedances. Doing this can cause an increase in offset voltage. A small resistance
such as 1 kcan provide some protection against very large transients or overloads, and will not increase the
offset significantly.
PRECISION STRAIN-GAUGE AMPLIFIER
This Strain-Gauge amplifier (Figure 34) provides high gain (1006 or ~60 dB) with very low offset and drift. Using
the resistors' tolerances as shown, the worst case CMRR will be greater than 108 dB. The CMRR is directly
related to the resistor mismatch. The rejection of common-mode error, at the output, is independent of the
differential gain, which is set by R3. The CMRR is further improved, if the resistor ratio matching is improved, by
specifying tighter-tolerance resistors, or by trimming.
Figure 34. Precision Strain Gauge Amplifier
Extending Supply Voltages and Output Swing by Using a Composite Amplifier Configuration:
In cases where substantially higher output swing is required with higher supply voltages, arrangements like the
ones shown in Figure 35 and Figure 36 could be used. These configurations utilize the excellent DC performance
of the LMP201X while at the same time allow the superior voltage and frequency capabilities of the LM6171 to
set the dynamic performance of the overall amplifier. For example, it is possible to achieve ±12V output swing
with 300 MHz of overall GBW (AV= 100) while keeping the worst case output shift due to VOS less than 4 mV.
The LMP201X output voltage is kept at about mid-point of its overall supply voltage, and its input common mode
voltage range allows the V- terminal to be grounded in one case (Figure 35, inverting operation) and tied to a
small non-critical negative bias in another (Figure 36, non-inverting operation). Higher closed-loop gains are also
possible with a corresponding reduction in realizable bandwidth. Table 1 shows some other closed loop gain
possibilities along with the measured performance in each case.
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C4
0.01
PF
1N4731A
(4.3V)
D1
7
2
6
4
3
Input -15V
R6
10k
(-0.7V)
-
+
R1
R7, 3.9k
R2
C2
3
2
6
7
4
LMP201X
U1 LM6171
U2
+
-
R5, 1M
(+2.5V)
Output
C5
0.01 PF
+15V
R4
3.9k
R3
20k
D2
1N4148 C3
0.01 PF
+15V
LMP2011, LMP2012
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SNOSA71K OCTOBER 2004REVISED MARCH 2013
Figure 35. Composite Amplifier Configuration
Table 1. Composite Amplifier Measured Performance
AVR1 R2 C2 BW SR en p-p
() () (pF) (MHz) (V/μs) (mVPP)
50 200 10k 8 3.3 178 37
100 100 10k 10 2.5 174 70
100 1k 100k 0.67 3.1 170 70
500 200 100k 1.75 1.4 96 250
1000 100 100k 2.2 0.98 64 400
In terms of the measured output peak-to-peak noise, the following relationship holds between output noise
voltage, enp-p, for different closed-loop gain, AV, settings, where 3 dB Bandwidth is BW:
(1)
Figure 36. Composite Amplifier Configuration
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: LMP2011 LMP2012
-
+
LMP201X +Input
-Input
(0V to 5V Range) 430:
LM9140-2.5
+2.5V
+5V
ADC1203X
+VREF
GND
-VREF
VIN
+5V
1M
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
www.ti.com
It should be kept in mind that in order to minimize the output noise voltage for a given closed-loop gain setting,
one could minimize the overall bandwidth. As can be seen from Equation 1 above, the output noise has a
square-root relationship to the Bandwidth.
In the case of the inverting configuration, it is also possible to increase the input impedance of the overall
amplifier, by raising the value of R1, without having to increase the feed-back resistor, R2, to impractical values,
by utilizing a "Tee" network as feedback. See the LMC6442 data sheet (Application Notes section) for more
details on this.
Figure 37. AC Coupled ADC Driver
LMP201X AS ADC INPUT AMPLIFIER
The LMP201X is a great choice for an amplifier stage immediately before the input of an ADC (Analog-to-Digital
Converter), whether AC or DC coupled. See Figure 37 and Figure 38. This is because of the following important
characteristics:
A) Very low offset voltage and offset voltage drift over time and temperature allow a high closed-loop gain
setting without introducing any short-term or long-term errors. For example, when set to a closed-loop gain
of 100 as the analog input amplifier for a 12-bit A/D converter, the overall conversion error over full
operation temperature and 30 years life of the part (operating at 50°C) would be less than 5 LSBs.
B) Fast large-signal settling time to 0.01% of final value (1.4 μs) allows 12 bit accuracy at 100 KHZor more
sampling rate
C) No flicker (1/f) noise means unsurpassed data accuracy over any measurement period of time, no matter
how long. Consider the following op amp performance, based on a typical low-noise, high-performance
commercially-available device, for comparison:
Op amp flatband noise = 8nV/Hz
1/f corner frequency = 100 Hz
AV= 2000
Measurement time = 100 sec
Bandwidth = 2 Hz
This example will result in about 2.2 mVPP (1.9 LSB) of output noise contribution due to the op amp alone,
compared to about 594 μVPP (less than 0.5 LSB) when that op amp is replaced with the LMP201X which
has no 1/f contribution. If the measurement time is increased from 100 seconds to 1 hour, the
improvement realized by using the LMP201X would be a factor of about 4.8 times (2.86 mVPP compared
to 596 μV when LMP201X is used) mainly because the LMP201X accuracy is not compromised by
increasing the observation time.
D) Copper leadframe construction minimizes any thermocouple effects which would degrade low level/high
gain data conversion application accuracy (see discussion under The Benefits of the LMP201X section
above).
E) Rail-to-Rail output swing maximizes the ADC dynamic range in 5-Volt single-supply converter applications.
Below are some typical block diagrams showing the LMP201X used as an ADC amplifier (Figure 37 and
Figure 38).
14 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMP2011 LMP2012
LMP2011, LMP2012
www.ti.com
SNOSA71K OCTOBER 2004REVISED MARCH 2013
Figure 38. DC Coupled ADC Driver
Copyright © 2004–2013, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: LMP2011 LMP2012
LMP2011, LMP2012
SNOSA71K OCTOBER 2004REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision J (March 2013) to Revision K Page
Changed layout of National Data Sheet to TI format .......................................................................................................... 15
16 Submit Documentation Feedback Copyright © 2004–2013, Texas Instruments Incorporated
Product Folder Links: LMP2011 LMP2012
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LMP2011MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMP20
11MA
LMP2011MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMP20
11MA
LMP2011MF NRND SOT-23 DBV 5 1000 TBD Call TI Call TI -40 to 125 AN1A
LMP2011MF/NOPB ACTIVE SOT-23 DBV 5 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AN1A
LMP2011MFX/NOPB ACTIVE SOT-23 DBV 5 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AN1A
LMP2012MA/NOPB ACTIVE SOIC D 8 95 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMP20
12MA
LMP2012MAX/NOPB ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LMP20
12MA
LMP2012MM/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AP1A
LMP2012MMX/NOPB ACTIVE VSSOP DGK 8 3500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 AP1A
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LMP2011MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMP2011MF SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2011MF/NOPB SOT-23 DBV 5 1000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2011MFX/NOPB SOT-23 DBV 5 3000 178.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
LMP2012MAX/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1
LMP2012MM/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LMP2012MMX/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LMP2011MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2011MF SOT-23 DBV 5 1000 210.0 185.0 35.0
LMP2011MF/NOPB SOT-23 DBV 5 1000 210.0 185.0 35.0
LMP2011MFX/NOPB SOT-23 DBV 5 3000 210.0 185.0 35.0
LMP2012MAX/NOPB SOIC D 8 2500 367.0 367.0 35.0
LMP2012MM/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0
LMP2012MMX/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 23-Sep-2013
Pack Materials-Page 2
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