Si5341/40 Rev D Data Sheet
Low-Jitter, 10 or 4-Output, Any-Frequency, Any-Output Clock
Generator
The any-frequency, any-output Si5341/40 clock generators combine a wide-band PLL
with proprietary MultiSynth™ fractional synthesizer technology to offer a versatile and
high performance clock generator platform. This highly flexible architecture is capable
of synthesizing a wide range of integer and non-integer related frequencies up to 1
GHz on 10 differential clock outputs while delivering sub-100 fs rms phase jitter per-
formance with 0 ppm error. Each of the clock outputs can be assigned its own format
and output voltage enabling the Si5341/40 to replace multiple clock ICs and oscillators
with a single device making it a true "clock tree on a chip."
The Si5341/40 can be quickly and easily configured using ClockBuilderPro software.
Custom part numbers are automatically assigned using a ClockBuilder Pro™ for fast,
free, and easy factory pre-programming or the Si5341/40 can be programmed via I2C
and SPI serial interfaces.
Applications:
• Clock tree generation replacing XOs, buffers, signal format translators
• Any-frequency clock translation
• Clocking for FPGAs, processors, memory
• Ethernet switches/routers
• OTN framers/mappers/processors
• Test equipment and instrumentation
• Broadcast video
KEY FEATURES
• Generates any combination of output
frequencies from any input frequency
• Ultra-low jitter of 90 fs rms
• Input frequency range:
• External crystal: 25 to 54 MHz
• Differential clock: 10 to 750 MHz
• LVCMOS clock: 10 to 250 MHz
• Output frequency range:
• Differential: 100 Hz to 1028 MHz
• LVCMOS: 100 Hz to 250 MHz
• Highly configurable outputs compatible with
LVDS, LVPECL, LVCMOS, CML, and HCSL
with programmable signal amplitude
• Si5341: 4 input, 10 output, 64-QFN 9x9 mm
• Si5340: 4 input, 4 output, 44-QFN 7x7 mm
Up to 10
Output Clocks
OUT7
OUT6
OUT5
OUT1
OUT4
OUT3
OUT2
OUT0
Si5340
Si5341
I2C / SPI Control NVM
Status Flags Status Monitor
4 Input
Clocks
XBXA
25-54 MHz XTAL
OSC MultiSynth ÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
÷INT
MultiSynth
MultiSynth
MultiSynth
MultiSynth
÷INT
÷INT
÷INT
PLL
÷INT
OUT9
OUT8
÷INT
÷INT
IN0
IN1
IN2
FB_IN
Zero Delay
silabs.com | Building a more connected world. Rev. 1.1
1. Features List
The Si5341/40 Rev D features are listed below:
• Generates any combination of output frequencies from any in-
put frequency
• Ultra-low jitter of 90 fs rms
• Input frequency range:
• External crystal: 25 to 54 MHz
• Differential clock: 10 to 750 MHz
• LVCMOS clock: 10 to 250 MHz
• Output frequency range:
• Differential: 100 Hz to 1028 MHz
• LVCMOS: 100 Hz to 250 MHz
• Highly configurable outputs compatible with LVDS, LVPECL,
LVCMOS, CML, and HCSL with programmable signal ampli-
tude
• Locks to gapped clock inputs
• Optional zero delay mode
• Glitchless on the fly output frequency changes
• DCO mode: as low as 0.001 ppb steps
• Core voltage
• VDD: 1.8 V ±5%
• VDDA: 3.3 V ±5%
• Independent output clock supply pins
• 3.3 V, 2.5 V, or 1.8 V
•Serial interface: I2C or SPI
• In-circuit programmable with non-volatile OTP memory
• ClockBuilder Pro software simplifies device configuration
• Si5341: 4 input, 10 output, 64-QFN 9x9 mm
• Si5340: 4 input, 4 output, 44-QFN 7x7 mm
• Temperature range: –40 to +85 °C
• Pb-free, RoHS-6 compliant
Si5341/40 Rev D Data Sheet
Features List
silabs.com | Building a more connected world. Rev. 1.1 | 2
2. Ordering Guide
Table 2.1. Si5341/40 Ordering Guide
Ordering Part Number
(OPN)
Number of In-
put/Output
Clocks
Output Clock Frequency
Range (MHz)
Frequency Syn-
thesis Mode Package Temperature
Range
Si5341
Si5341A-D-GM1, 2
4/10
0.0001 to 1028 MHz Integer and
Fractional 64-QFN
9x9 mm
–40 to 85 °C
Si5341B-D-GM1, 2 0.0001 to 350 MHz
Si5341C-D-GM1, 2 0.0001 to 1028 MHz
Integer Only
Si5341D-D-GM1, 2 0.0001 to 350 MHz
Si5340
Si5340A-D-GM1, 2
4/4
0.0001 to 1028 MHz Integer and
Fractional 44-QFN
7x7 mm
–40 to 85 °C
Si5340B-D-GM1, 2 0.0001 to 350 MHz
Si5340C-D-GM1, 2 0.0001 to 1028 MHz
Integer Only
Si5340D-D-GM1, 2 0.0001 to 350 MHz
Si5341/40-D-EVB
Si5341-D-EVB
— — — Evaluation
Board —
Si5340-D-EVB
Note:
1. Add an R at the end of the OPN to denote tape and reel ordering options.
2. Custom, factory pre-programmed devices are available. Ordering part numbers are assigned by Silicon Labs and the ClockBuild-
er Pro software utility. Custom part number format is: e.g., Si5341A-Dxxxxx-GM, where "xxxxx" is a unique numerical sequence
representing the preprogrammed configuration.
3. See 3.9 Custom Factory Preprogrammed Devicesand 3.10 Enabling Features and/or Configuration Settings Not Available in
ClockBuilder Pro for Factory Pre-Programmed Devices for important notes about specifying a preprogrammed device to use fea-
tures or device register settings not yet available in CBPro.
Si5341/40 Rev D Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.1 | 3
Si534fg-Rxxxxx-GM
Timing product family
f = Multi-PLL clock family member (7, 6)
g = Device grade (A, B, C, D)
Product Revision*
Custom ordering part number (OPN) sequence ID**
Package, ambient temperature range (QFN, -40 °C to +85°C)
*See Ordering Guide table for current product revision
** 5 digits; assigned by ClockBuilder Pro
Figure 2.1. Ordering Part Number Fields
Si5341/40 Rev D Data Sheet
Ordering Guide
silabs.com | Building a more connected world. Rev. 1.1 | 4
Table of Contents
1. Features List ...............................2
2. Ordering Guide ..............................3
3. Functional Description............................7
3.1 Power-up and Initialization ..........................7
3.2 Frequency Configuration ..........................7
3.3 Inputs .................................7
3.3.1 XA/XB Clock and Crystal Input .......................8
3.3.2 Input Clocks (IN0, IN1, IN2) ........................8
3.3.3 Input Selection (IN0, IN1, IN2, XA/XB) ....................9
3.4 Fault Monitoring .............................9
3.4.1 Status Indicators ............................9
3.4.2 Interrupt Pin (INTRb) ..........................9
3.5 Outputs ................................10
3.5.1 Output Signal Format ..........................10
3.5.2 Differential Output Terminations.......................10
3.5.3 Programmable Common Mode Voltage for Differential Outputs ............11
3.5.4 LVCMOS Output Terminations .......................11
3.5.5 LVCMOS Output Impedance and Drive Strength Selection..............11
3.5.6 LVCMOS Output Signal Swing .......................11
3.5.7 LVCMOS Output Polarity .........................11
3.5.8 Output Enable/Disable ..........................11
3.5.9 Output Driver State When Disabled .....................12
3.5.10 Synchronous/Asynchronous Output Disable Feature ...............12
3.5.11 Zero Delay Mode ...........................12
3.5.12 Output Crosspoint ...........................12
3.5.13 Digitally Controlled Oscillator (DCO) Modes ..................13
3.6 Power Management ............................13
3.7 In-Circuit Programming ...........................13
3.8 Serial Interface ..............................13
3.9 Custom Factory Preprogrammed Devices .....................13
3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory
Pre-Programmed Devices ..........................14
4. Register Map ..............................16
5. Electrical Specifications ..........................17
6. Typical Application Schematic ........................32
7. Detailed Block Diagrams ..........................33
8. Typical Operating Characteristics ......................35
9. Pin Descriptions .............................37
silabs.com | Building a more connected world. Rev. 1.1 | 5
10. Package Outlines ............................42
10.1 Si5341 9x9 mm 64-QFN Package Diagram ....................42
10.2 Si5340 7x7 mm 44-QFN Package Diagram ....................43
11. PCB Land Pattern ............................44
12. Top Marking ..............................46
13. Device Errata ..............................47
14. Revision History............................. 48
silabs.com | Building a more connected world. Rev. 1.1 | 6
3. Functional Description
The Si5340/41-D combines a wide band PLL with next generation MultiSynth technology to offer the industry's most versatile and high
performance clock generator. The PLL locks to either an external crystal between XA/XB or to an external clock connected to XA/XB
or IN0, 1, 2. A fractional or integer multiplier takes the selected input clock or cystal frequency up to a very high frequency that is then
divided by the MultiSynth output stage to any frequency in the range of 100 Hz to 1 GHz on each output. The MultiSynth stage can
divide by both integer and fractional values. The high-resolution fractional MultiSynth dividers enable true any-frequency input to any-
frequency on any of the outputs. The output drivers offer flexible output formats which are independently configurable on each of the
outputs. This clock generator is fully configurable via its serial interface (I2C/SPI) and includes in-circuit programmable non-volatile
memory.
3.1 Power-up and Initialization
Once power is applied, the device begins an initialization period where it downloads default register values and configuration data from
NVM and performs other initialization tasks. Communicating with the device through the serial interface is possible once this initializa-
tion period is complete. No clocks will be generated until the initialization is done. There are two types of resets available. A hard reset
is functionally similar to a device power-up. All registers will be restored to the values stored in NVM, and all circuits will be restored to
their initial state including the serial interface. A hard reset is initiated using the RSTb pin or by asserting the hard reset bit. A soft reset
bypasses the NVM download. It is simply used to initiate register configuration changes.
Power-Up
Serial interface
ready
RSTb
pin asserted
Hard Reset
bit asserted
Initialization
NVM download
Soft Reset
bit asserted
Figure 3.1. Si5341 Power-Up and Initialization
3.2 Frequency Configuration
The phase-locked loop is fully contained and does not require external loop filter components to operate. Its function is to phase lock to
the selected input and provide a common reference to the MultiSynth high-performance fractional dividers.
A crosspoint mux connects any of the MultiSynth divided frequencies to any of the outputs drivers. Additional output integer dividers
provide further frequency division by an even integer from 2 to (225)-2. The frequency configuration of the device is programmed by
setting the input dividers (P), the PLL feedback fractional divider (Mn/Md), the MultiSynth fractional dividers (Nn/Nd), and the output
integer dividers (R). Silicon Labs's ClockBuilder Pro configuration utility determines the optimum divider values for any desired input
and output frequency plan.
3.3 Inputs
The Si5340/41-D requires either an external crystal at its XA/XB pins or an external clock at XA/XB or IN0, 1, 2.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 7
3.3.1 XA/XB Clock and Crystal Input
An internal crystal oscillator exists between pin XA and XB. When this oscillator is enabled, an external crystal connected across these
pins will oscillate and provide a clock input to the PLL. A crystal frequency of 25 MHz can be used although crystals in the frequency
range of 48 MHz to 54 MHz are recommended for best jitter performance. Frequency offsets due to CL mismatch can be adjusted using
the frequency adjustment feature which allows frequency adjustments of ± 1000 ppm. The Si5340/41 Family Reference Manual pro-
vides additional information on PCB layout recommendations for the crystal to ensure optimum jitter performance. Refer to Table
5.12 Crystal Specifications on page 30 for crystal specifications.
To achieve optimal jitter performance and minimize BOM cost, a crystal is recommended on the XA/XB reference input. A clock (e.g.,
XO) may be used in lieu of the crystal, but it will result in higher output jitter. See the Si5340/41 Reference Manual for more information.
Selection between the external XTAL or input clock is controlled by register configuration. The internal crystal load capacitors (CL) are
disabled in the input clock mode. Refer to Table 5.3 Input Clock Specifications on page 19 for the input clock requirements at XAXB.
Both a single-ended or a differential input clock can be connected to the XA/XB pins as shown in the figure below. A PXAXB divider is
available to accommodate external clock frequencies higher than 54 MHz.
50
Differential Connection
2xCL
2xCL
XB
XA
2xCL
2xCL
XB
XA
Single-ended XO Connection
Crystal Connection
OSC
XB
XA
XTA
L
2xCL
2xCL
Si5341/40
Si5341/40 Si5341/40
Note: 2.0 Vpp_se max
XO with Clipped Sine
Wave Output
2xCL
2xCL
XB
XA
OSC
Si5341/40
Note: 2.0 Vpp_se max
CMOS/XO Output
R2
R1
XO VDD R1 R2
3.3 V 523 Ohms
2.5 V
1.8 V
50
0.1 µf
0.1 µf
0.1 µf
0.1 µf
0.1 µf
0.1 µf
0.1 µf
Single-ended Connection
Note: 2.5 Vpp diff max
X1
X2
nc
nc
X1
X2
nc
nc
X1
X2
nc
nc
X2
X1
OSC
OSC
475 Ohms
158 Ohms
422 Ohms
649 Ohms
866 Ohms
Figure 3.2. XAXB External Crystal and Clock Connections
Note: See Table 5.3 Input Clock Specifications on page 19 for more information.
3.3.2 Input Clocks (IN0, IN1, IN2)
A differential or single-ended clock can be applied at IN2, IN1, or IN0.
The recommended input termination schemes are can be found in Si5341/40 Rev D Family Reference Manual.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 8
3.3.3 Input Selection (IN0, IN1, IN2, XA/XB)
The active clock input is selected using the IN_SEL[1:0] pins or by register control. A register bit determines input selection as pin or
register selectable. There are internal pull ups on the IN_SEL pins.
Table 3.1. Manual Input Selection Using IN_SEL[1:0] Pins
IN_SEL[1:0] Selected Input
0 0 IN0
0 1 IN1
1 0 IN2
1 1 XA/XB
3.4 Fault Monitoring
The Si5340/41-D provides fault indicators which monitor loss of signal (LOS) of the inputs (IN0, IN1, IN2, XA/XB, FB_IN) and loss of
lock (LOL) for the PLL as shown in the figure below.
PLL
LPFPD
Mn
IN0
IN0b LOS0
÷P
0
IN1
IN1b ÷P
1
FB_IN
FB _INb
IN2
IN2b
÷P
2
LOL
Si5341/40
XB
XA OSC
÷Pfb
Md
÷
LOSXAB
LOS1
LOS2
LOLb
LOSXAB
INTRb
LOSFB
(Si5340)
Figure 3.3. LOS and LOL Fault Monitors
3.4.1 Status Indicators
The state of the status monitors are accessible by reading registers through the serial interface or with dedicated pin (LOLb). Each of
the status indicator register bits has a corresponding sticky bit in a separate register location. Once a status bit is asserted its corre-
sponding sticky bit (_FLG) will remain asserted until cleared. Writing a logic zero to a sticky register bit clears its state.
3.4.2 Interrupt Pin (INTRb)
An interrupt pin (INTRb) indicates a change in state with any of the status registers. All status registers are maskable to prevent asser-
tion of the interrupt pin. The state of the INTRb pin is reset by clearing the status registers.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 9
3.5 Outputs
The Si5341 supports 10 differential output drivers which can be independently configured as differential or LVCMOS. The Si5340 sup-
ports 4 output drivers independently configurable as differential or LVCMOS.
3.5.1 Output Signal Format
The differential output amplitude and common mode voltage are both fully programmable and compatible with a wide variety of signal
formats including LVDS and LVPECL. In addition to supporting differential signals, any of the outputs can be configured as LVCMOS
(3.3 V, 2.5 V, or 1.8 V) drivers providing up to 20 single-ended outputs, or any combination of differential and single-ended outputs.
3.5.2 Differential Output Terminations
The differential output drivers support both ac-coupled and dc-coupled terminations as shown in the figure below.
DC Coupled LVDS/LVPECL
50
50
100
OUTx
OUTxb
Si5341/40
LVDS: VDDO = 3.3V, 2.5V, 1.8V
LVPECL: VDDO = 2.5V, 1.8V
AC Coupled LVDS/LVPECL
100
50
50
Internally
self-biased
OUTx
OUTxb
VDDO = 3.3V, 2.5V, 1.8V
Si5341/40
AC Coupled LVPECL/CML
50
50
VDD – 1.3V
5050
OUTx
OUTxb
VDDO = 3.3V, 2.5V
Si5341/40
AC Coupled HCSL
VDDRX
Standard
HCSL
Receiver
R1
OUTx
OUTxb
R1
R2 R2
VDDO = 3.3V, 2.5V, 1.8V
50
50
Si5341/40
Figure 3.4. Supported Differential Output Terminations
Note: See the Si5341/40 Rev D Family Reference Manual for resistor values.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 10
3.5.3 Programmable Common Mode Voltage for Differential Outputs
The common mode voltage (VCM) for the differential modes are programmable so that LVDS specifications can be met and for the best
signal integrity with different supply voltages. When dc coupling the output driver it is essential that the receiver should have a relatively
high common mode impedance so that the common mode current from the output driver is very small.
3.5.4 LVCMOS Output Terminations
LVCMOS outputs are typically dc-coupled, as shown in the figure below.
3.3V , 2.5V , 1.8 V
LVCMOS
VDDO = 3.3V , 2.5V , 1.8V
50
Rs
50
Rs
DC Coupled LVCMOS
OUTx
OUTxb
Figure 3.5. LVCMOS Output Terminations
3.5.5 LVCMOS Output Impedance and Drive Strength Selection
Each LVCMOS driver has a configurable output impedance. It is highly recommended that the minimum output impedance (strongest
drive setting) is selected and a suitable series resistor (Rs) is chosen to match the trace impedance.
Table 3.2. Nominal Output Impedance vs. OUTx_CMOS_DRV (register)
VDDO CMOS_DRIVE_Selection
OUTx_CMOS_DRV=1 OUTx_CMOS_DRV=2 OUTx_CMOS_DRV=3
3.3 V 38 Ω 30 Ω 22 Ω
2.5 V 43 Ω 35 Ω 24 Ω
1.8 V — 46 Ω 31 Ω
Note: Refer to the Si5340/41 Family Reference Manual for more information on register settings.
3.5.6 LVCMOS Output Signal Swing
The signal swing (VOL/VOH) of the LVCMOS output drivers is set by the voltage on the VDDO pins. Each output driver has its own
VDDO pin allowing a unique output voltage swing for each of the LVCMOS drivers.
3.5.7 LVCMOS Output Polarity
When a driver is configured as an LVCMOS output it generates a clock signal on both pins (OUTx and OUTxb). By default the clock on
the OUTxb pin is generated with complementary polarity with the clock on the OUTx pin. The LVCMOS OUTx and OUTxb outputs can
also be generated in phase.
3.5.8 Output Enable/Disable
The OEb pin provides a convenient method of disabling or enabling the output drivers. When the OEb pin is held high all outputs will be
disabled. When held low, the outputs will be enabled. Outputs in the enabled state can be individually disabled through register control.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 11
3.5.9 Output Driver State When Disabled
The disabled state of an output driver is configurable as: disable low or disable high.
3.5.10 Synchronous/Asynchronous Output Disable Feature
Outputs can be configured to disable synchronously or asynchronously. The default state is synchronous output disable. In synchro-
nous disable mode the output will wait until a clock period has completed before the driver is disabled. This prevents unwanted runt
pulses from occurring when disabling an output. In asynchronous disable mode the output clock will disable immediately without waiting
for the period to complete.
3.5.11 Zero Delay Mode
A zero delay mode is available for applications that require fixed and consistent minimum delay between the selected input and outputs.
The zero delay mode is configured by opening the internal feedback loop through software configuration and closing the loop externally
as shown in the figure below. This helps to cancel out the internal delay introduced by the dividers, the crosspoint, the input, and the
output drivers. Any one of the outputs can be fed back to the FB_IN pins, although using the output driver that achieves the shortest
trace length will help to minimize the input-to-output delay. It is recommended to connect OUT9 (Si5341) or OUT3 (Si5340) to FB_IN for
external feedback. The FB_IN input pins must be terminated and ac-coupled when zero delay mode is used. A differential external
feedback path connection is necessary for best performance.
Zero Delay
Mode
Si5341
IN_SEL[1:0]
IN0
IN0b
IN1
IN1b
IN2
IN2b
÷P0
÷P1
÷P2
OUT0b
VDDO0
OUT0
OUT2b
VDDO2
OUT2
OUT3b
VDDO3
OUT3
OUT7b
VDDO7
OUT7
OUT8b
VDDO8
OUT8
OUT9b
VDDO9
OUT9
OUT1b
VDDO1
OUT1
MultiSynth
& Dividers
FB_IN
FB_INb
100
External Feedback Path
PD
LPF
÷Mn
Md
÷N9n
N9d ÷R9
fFB = fIN
fIN
÷Pfb
PLL
Figure 3.6. Si5341 Zero Delay Mode Setup
3.5.12 Output Crosspoint
The output crosspoint allows any of the N dividers to connect to any of the clock outputs.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 12
3.5.13 Digitally Controlled Oscillator (DCO) Modes
Each MultiSynth can be digitally controlled so that all outputs connected to the MultiSynth change frequency in real time without any
transition glitches. There are two ways to control the MultiSynth to accomplish this task:
• Use the Frequency Increment/Decrement Pins or register bits.
• Write directly to the numerator of the MultiSynth divider.
An output that is controlled as a DCO is useful for simple tasks such as frequency margining or CPU speed control. The output can also
be used for more sophisticated tasks such as FIFO management by adjusting the frequency of the read or write clock to the FIFO or
using the output as a variable Local Oscillator in a radio application.
3.5.13.1 DCO with Frequency Increment/Decrement Pins/Bits
Each of the MultiSynth fractional dividers can be independently stepped up or down in predefined steps with a resolution as low as
0.001 ppb. Setting of the step size and control of the frequency increment or decrement is accomplished by setting the step size with
the 44 bit Frequency Step Word (FSTEPW). When the FINC or FDEC pin or register bit is asserted the output frequency will increment
or decrement respectively by the amount specified in the FSTEPW.
3.5.13.2 DCO with Direct Register Writes
When a MultiSynth numerator and its corresponding update bit is written, the new numerator value will take effect and the output fre-
quency will change without any glitches. The MultiSynth numerator and denominator terms can be left and right shifted so that the least
significant bit of the numerator word represents the exact step resolution that is needed for your application.
3.6 Power Management
Several unused functions can be powered down to minimize power consumption. Consult the Si5340/41 Family Reference Manual and
ClockBuilder Pro configuration utility for details.
3.7 In-Circuit Programming
The Si5341/40 is fully configurable using the serial interface (I2C or SPI). At power-up the device downloads its default register values
from internal non-volatile memory (NVM). Application specific default configurations can be written into NVM allowing the device to gen-
erate specific clock frequencies at power-up. Writing default values to NVM is in-circuit programmable with normal operating power sup-
ply voltages applied to its VDD and VDDA pins. The NVM is two time writable. Once a new configuration has been written to NVM, the
old configuration is no longer accessible. Refer to the Si5340/41 Family Reference Manual for a detailed procedure for writing registers
to NVM.
3.8 Serial Interface
Configuration and operation of the Si5341/40 is controlled by reading and writing registers using the I2C or SPI interface. The I2C_SEL
pin selects I2C or SPI operation. Communication with both 3.3 V and 1.8 V host is supported. The SPI mode operates in either 4-wire or
3-wire. See the Si5340/41 Family Reference Manual for details.
3.9 Custom Factory Preprogrammed Devices
For applications where a serial interface is not available for programming the device, custom pre-programmed parts can be ordered
with a specific configuration written into NVM. A factory pre-programmed device will generate clocks at power-up. Custom, factory-pre-
programmed devices are available. Use the ClockBuilder Pro custom part number wizard (www.silabs.com/clockbuilderpro) to quickly
and easily request and generate a custom part number for your configuration. In less than three minutes, you will be able to generate a
custom part number with a detailed data sheet addendum matching your design’s configuration. Once you receive the confirmation
email with the data sheet addendum, simply place an order with your local Silicon Labs sales representative. Samples of your pre-pro-
grammed device will ship to you typically within two weeks.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 13
3.10 Enabling Features and/or Configuration Settings Not Available in ClockBuilder Pro for Factory Pre-Programmed Devices
As with essentially all software utilities, ClockBuilder Pro is continuously updated and enhanced. By registering at http://www.silabs.com
and opting in for updates to software, you will be notified whenever changes are made and what the impact of those changes are. This
update process will ultimately enable ClockBuilder Pro users to access all features and register setting values documented in this data
sheet and the Si5341/40 Family Reference Manual. However, if you must enable or access a feature or register setting value so that
the device starts up with this feature or a register setting, but the feature or register setting is NOT yet available in CBPro, you must
contact a Silicon Labs applications engineer for assistance. An example of this type of feature or custom setting is the customizable
amplitudes for the clock outputs. After careful review of your project file and custom requirements, a Silicon Labs applications engineer
will email back your CBPro project file with your specific features and register settings enabled, using what is referred to as the manual
"settings override" feature of CBPro. "Override" settings to match your request(s) will be listed in your design report file. Examples of
setting "overrides" in a CBPro design report are shown below:
Table 3.3. Setting Overrides
Location Name Type Target Dec Value Hex Value
0128[6:4] OUT6_AMPL User OPN & EVB 5 5
Once you receive the updated design file, simply open it in CBPro. After you create a custom OPN, the device will begin operation after
startup with the values in the NVM file, including the Silicon Labs-supplied override settings.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 14
Do I need a
pre-programmed device with
a feature or setting which is
unavailable in ClockBuilder
Pro?
No
Yes
Contact Silicon Labs
Technical Support
to submit & review
your
non-standard
configuration
request & CBPro
project file
Configure device
using CBPro
Load project file
into CBPro and test
Receive
updated CBPro
project file
from
Silicon Labs
with “Settings
Override”
Generate
Custom OPN
in CBPro
Does the updated
CBPro Project file
match your
requirements?
Yes
End: Place
sample order
Start
Figure 3.7. Flowchart to Order Custom Parts with Features not Available in CBPro
Note: Contact Silicon Labs Technical Support at www.silabs.com/support/Pages/default.aspx.
Si5341/40 Rev D Data Sheet
Functional Description
silabs.com | Building a more connected world. Rev. 1.1 | 15
5. Electrical Specifications
Table 5.1. Recommended Operating Conditions1
(VDD=1.8 V ± 5%, VDDA=3.3 V ± 5%, TA= –40 to 85°C)
Parameter Symbol Min Typ Max Units
Ambient Temperature TA–40 25 85 °C
Junction Temperature TJMAX — — 125 °C
Core Supply Voltage VDD 1.71 1.80 1.89 V
VDDA 3.14 3.30 3.47 V
Output Driver Supply Voltage VDDO 3.14 3.30 3.47 V
2.37 2.50 2.62 V
1.71 1.80 1.89 V
Note:
1. All minimum and maximum specifications are guaranteed and apply across the recommended operating conditions. Typical val-
ues apply at nominal supply voltages and an operating temperature of 25 °C unless otherwise noted.
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 17
Table 5.2. DC Characteristics
(VDD=1.8V ± 5%, VDDA=3.3V ± 5%, VDDO=1.8V ± 5%, 2.5V ± 5%, or 3.3V ± 5%, TA= -40 to 85°C)
Parameter Symbol Test Condition Min Typ Max Units
Core Supply Current1, 2 IDD Si5340/41 — 115 230 mA
IDDA Si5340/41 — 120 130 mA
Output Buffer Supply Current IDDOx LVPECL Output3
@ 156.25 MHz
— 22 26 mA
LVDS Output3
@ 156.25 MHz
— 15 18 mA
3.3 V LVCMOS4 output
@ 156.25 MHz
— 22 30 mA
2.5 V LVCMOS4 output
@ 156.25 MHz
— 18 23 mA
1.8 V LVCMOS4 output
@ 156.25 MHz
— 12 16 mA
Total Power Dissipation1, 5 PdSi5341 — 880 1150 mW
Si5340 — 680 875 mW
Note:
1. Si5341 test configuration: 7 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors.
2. Si5340 test configuration: 4 x 2.5 V LVDS outputs enabled @ 156.25 MHz. Excludes power in termination resistors.
3. Differential outputs terminated into an ac-coupled 100 Ω load.
4. LVCMOS outputs measured into a 6-inch 50 W PCB trace with 5 pF load. The LVCMOS outputs were set to
OUTx_CMOS_DRV=3, which is the strongest driver setting. Refer to the Si5341/40 Family Reference Manual for more details on
register settings.
Differential Output Test Configuration LVCMOS Output Test Configuration
50
50
100
OUT
OUTb
IDDO 0. 1 uF
0. 1 uF
50
OUT
OUTb
IDDO
Trace length 5 inches
50
4.7 pF
4.7 pF
56
499
499
56
50 probe, scope
50 probe, scope
DC Block
DC Block
5. Detailed power consumption for any configuration can be estimated using ClockBuilderPro when an evaluation board (EVB) is not
available. All EVBs support detailed current measurements for any configuration.
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 18
Table 5.3. Input Clock Specifications
(VDD =1.8 V ± 5%, VDDA = 3.3 V ± 5%, TA= –40 to 85 °C)
Parameter Symbol Test Condition Min Typ Max Units
Standard Input Buffer with Differential or Single-Ended - AC-Coupled (IN0/IN0b, IN1/IN1b, IN2/IN2b, FB_IN/FB_INb)
Input Frequency Range fIN Differential 10 — 750 MHz
All Single-ended Signals
(including LVCMOS)
10 — 250 MHz
Input Voltage Swing1VIN Differential AC-coupled
fIN < 250 MHz
100 — 1800 mVpp_se
Differential AC-coupled
250 MHz < fIN < 750 MHz
225 — 1800 mVpp_se
Single-ended AC-coupled
fIN < 250 MHz
100 — 3600 mVpp_se
Slew Rate2, 3 SR 400 — — V/μs
Input Capacitance CIN — 2.4 — pF
Input Resistance Differential RIN_DIFF — 16 — kΩ
Input Resistance Single-Ended RIN_SE — 8 — kΩ
Pulsed CMOS Input Buffer - DC Coupled (IN0, IN1, IN2)
Input Frequency fIN 10 — 250 MHz
Input Voltage VIL –0.2 — 0.4 V
VIH 0.8 — — V
Slew Rate2, 3 SR 400 — — V/μs
Minimum Pulse Width PW Pulse Input 1.6 — — ns
Input Resistance RIN — 8 — kΩ
REFCLK (Applied to XA/XB)
Input Frequency Range fIN Full operating range. Jitter
performance may be re-
duced.
10 — 200 MHz
Range for best jitter. 48 — 54 MHz
Input Single-ended Voltage
Swing
VIN_SE 365 — 2000 mVpp_se
Input Differential Voltage Swing VIN_DIFF 365 — 2500 mVpp_diff
Slew Rate2, 3 SR Imposed for best jitter per-
formance
400 — — V/μs
Input Duty Cycle DC 40 — 60 %
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 19
Parameter Symbol Test Condition Min Typ Max Units
Note:
1. Voltage swing is specified as single-ended mVpp.
Vpp_se
Vpp_se
Vpp_diff = 2*Vpp_se
Vcm
Vcm
2. Recommended for specified jitter performance. Jitter performance can degrade if the minimum slew rate specification is not met
(see the Family Reference Manual).
3. Pulsed CMOS mode is intended primarily for single-ended LVCMOS input clocks < 1 MHz, which must be dc-coupled because
they have a duty cycle significantly less than 50%. A typical application example is a low frequency video frame sync pulse. Since
the input thresholds (VIL, VIH) of this buffer are non-standard (0.4 and 0.8 V, respectively), refer to the input attenuator circuit for
DC-coupled Pulsed LVCMOS in the Family Reference Manual. Otherwise, for standard LVCMOS input clocks, use the Standard
AC-Coupled, Single-ended input mode.
Table 5.4. Control Input Pin Specifications
(VDD =1.8 V ± 5%, VDDA = 3.3 V ± 5%, VDDIO= 3.3 V ± 5%, 1.8 V ± 5%, TA = –40 to 85 °C)
Parameter Symbol Test Condition Min Typ Max Units
Si5341 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, SYNCb, A1, SCLK, A0/CSb, FINC, FDEC, SDA/SDIO)
Input Voltage VIL — — 0.3xVDDIO1V
VIH 0.7xVDDIO1— — V
Input Capacitance CIN — 2 — pF
Input Resistance RIN — 20 — kΩ
Minimum Pulse Width TPW RSTb, SYNCb, FINC, and
FDEC
100 — — ns
Frequency Update Rate FUR FINC and FDEC — — 1 MHz
Si5340 Control Input Pins (I2C_SEL, IN_SEL[1:0], RSTb, OEb, A1, SCLK, A0/CSb, SDA/SDIO)
Input Voltage VIL — — 0.3xVDDIO1V
VIH 0.7xVDDIO1— — V
Input Capacitance CIN — 2 — pF
Input Resistance RIN — 20 — kΩ
Minimum Pulse Width TPW RSTb only 100 — — ns
Note:
1. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more
details on register settings.
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 20
Table 5.5. Differential Clock Output Specifications
(VDD=1.8 V ± 5%, VDDA= 3.3 V ± 5%, VDDO= 1.8 V ± 5%, 2.5 V ± 5%, or 3.3 V ± 5%, TA= –40 to 85 °C)
Parameter Symbol Test Condition Min Typ Max Units
Output Frequency fOUT MultiSynth not used 0.0001 — 720 MHz
733.33 — 800.00
825 — 1028
MultiSynth used 0.0001 — 720 MHz
Duty Cycle DC fOUT < 400 MHz 48 — 52 %
400 MHz < fOUT < 1028 MHz 45 — 55 %
Output-Output Skew
Using Same MultiSynth
TSKS Outputs on same MultiSynth
(Measured at 712.5 MHz)
— 0 75 ps
OUT-OUTb Skew TSK_OUT Measured from the positive
to negative output pins
— 0 50 ps
Output Voltage Swing1VOUT LVDS 350 430 510 mVpp_se
LVPECL 640 750 900
Common Mode Voltage1, 2 VCM VDDO = 3.3 V LVDS 1.1 1.2 1.3 V
LVPECL 1.9 2.0 2.1
VDDO = 2.5 V LVPECL
LVDS
1.1 1.2 1.3
VDDO = 1.8 V Sub-LVDS 0.8 0.9 1.0
Rise and Fall Times
(20% to 80%)
tR/tF— 100 150 ps
Differential Output Impedance ZO— 100 — Ω
Power Supply Noise Rejection2PSRR 10 kHz sinusoidal noise — –101 — dBc
100 kHz sinusoidal noise — –96 —
500 kHz sinusoidal noise — –99 —
1 MHz sinusoidal noise — –97 —
Output-Output Crosstalk3XTALK Si5341 — –72 — dBc
Si5340 — –88 — dBc
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 21
Parameter Symbol Test Condition Min Typ Max Units
Notes:
1. Output amplitude and common-mode settings are programmable through register settings and can be stored in NVM. Each out-
put driver can be programmed independently. The maximum LVDS single-ended amplitude can be up to 110 mV higher than the
TIA/EIA-644 maximum. Refer to the Family Reference Manual for more suggested output settings. Not all combinations of volt-
age amplitude and common mode voltages settings are possible.
OUTxb
OUTx
Vpp_se
Vpp_se
Vpp_ diff = 2*Vpp_se
Vcm
Vcm
2. Measured for 156.25 MHz carrier frequency. 100 mVpp sinewave noise added to VDDO = 3.3 V and noise spur amplitude meas-
ured.
3. Measured across two adjacent outputs, both in LVDS mode, with the victim running at 155.52 MHz and the aggressor at 156.25
MHz. Refer to application note, AN862: Optimizing Si534x Jitter Performance in Next Generation Internet Infrastructure Systems,
guidance on crosstalk minimization.
Table 5.6. LVCMOS Clock Output Specifications
(VDD =1.8 V ± 5%, VDDA= 3.3 V ± 5%, VDDO= 1.8 V ± 5%, 2.5 V ± 5%, or 3.3 V ± 5%, TA = –40 to 85 °C)
Parameter Symbol Test Condition Min Typ Max Units
Output Frequency 0.0001 — 250 MHz
Duty Cycle DC fOUT < 100 MHz 48 — 52 %
100 MHz < fOUT < 250 MHz 45 — 55
Output Voltage High1, 2, 3 VOH VDDO = 3.3 V
OUTx_CMOS_DRV=1 IOH = -10 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV=2 IOH = -12 mA — —
OUTx_CMOS_DRV=3 IOH = -17 mA — —
VDDO = 2.5 V
OUTx_CMOS_DRV=1 IOH = -6 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV=2 IOH = -8 mA — —
OUTx_CMOS_DRV=3 IOH = -11 mA — —
VDDO = 1.8 V
OUTx_CMOS_DRV=2 IOH = -4 mA VDDO x 0.85 — — V
OUTx_CMOS_DRV=3 IOH = -5 mA — —
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 22
Parameter Symbol Test Condition Min Typ Max Units
Output Voltage Low1, 2, 3 VOL VDDO = 3.3 V
OUTx_CMOS_DRV=1 IOL = 10 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV=2 IOL = 12 mA — —
OUTx_CMOS_DRV=3 IOL = 17 mA — —
VDDO = 2.5 V
OUTx_CMOS_DRV=1 IOL = 6 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV=2 IOL = 8 mA — —
OUTx_CMOS_DRV=3 IOL = 11 mA — —
VDDO = 1.8 V
OUTx_CMOS_DRV=2 IOL = 4 mA — — VDDO x 0.15 V
OUTx_CMOS_DRV=3 IOL = 5 mA — —
LVCMOS Rise and Fall
Times3
(20% to 80%)
tr/tf VDDO = 3.3V — 400 600 ps
VDDO = 2.5 V — 450 600 ps
VDDO = 1.8 V — 550 750 ps
Notes:
1. Driver strength is a register programmable setting and stored in NVM. Options are OUTx_CMOS_DRV = 1, 2, 3. Refer to the
Family Reference Manual for more details on register settings.
2. IOL/IOH is measured at VOL/VOH as shown in the dc test configuration.
3. A series termination resistor (Rs) is recommended to help match the source impedance to a 50 W PCB trace. A 5 pF capacitive
load is assumed. The LVCMOS outputs were set to OUTx_CMOS_DRV = 3.
Zs
IOL/IOH
VOL/VOH
50
OUT
OUTb
IDDO
Trace length 5 inches
50
4.7 pF
4.7 pF
56
499
499
56
AC Test Configuration
50 probe, scope
50 probe, scope
DC Block
DC Block
DC Test Configuration
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 23
Table 5.7. Output Status Pin Specifications
(VDD =1.8 V ± 5%, VDDA= 3.3 V ± 5%, VDDIO/VDDS = 3.3 V +/- 5%, 1.8 V ± 5%, TA = –40 to 85°C)
Parameter Symbol Test Condition Min Typ Max Units
Si5341/40 Status Output Pins (INTRb, SDA/SDIO)1
Output Voltage VOH IOH = -2 mA VDDIO2 x
0.85
— — V
VOL IOL = 2 mA — — VDDIO2x
0.15
V
Si5341 Status Output Pins (LOLb)
Output Voltage VOH IOH = -2 mA VDDIO2 x
0.85
— — V
VOL IOL = 2 mA — — VDDIO2 x
0.15
V
Si5340 Status Output Pins (LOLb, LOS_XAXBb)
Output Voltage VOH IOH = -2 mA VDDS x 0.85 — — V
VOL IOL = 2 mA — — VDDSx 0.15 V
Notes:
1. The VOH specification does not apply to the open-drain SDA/SDIO output when the serial interface is in I2C mode or is unused
with I2C_SEL pulled high. VOL remains valid in all cases.
2. VDDIO is determined by the IO_VDD_SEL bit. It is selectable as VDDA or VDD. Refer to the Family Reference Manual for more
details on register settings.
Table 5.8. Performance Characteristics
(VDD= 1.8 V ± 5%, VDDA= 3.3 V ± 5%, TA= –40 to 85 °C)
Parameter Symbol Test Condition Min Typ Max Units
PLL Loop Bandwidth fBW — 1.0 — MHz
Initial Start-Up Time tSTART Time from power-up to
when the device gener-
ates clocks (Input Fre-
quency >48 MHz)
— 30 45 ms
PLL Lock Time1tACQ fIN = 19.44 MHz 15 — 150 ms
POR2 to Serial Interface Ready tRDY — — 15 ms
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 24
Parameter Symbol Test Condition Min Typ Max Units
Jitter Generation Locked to Ex-
ternal Clock3
JGEN Integer Mode4
12 kHz to 20 MHz
— 140 180 fs rms
Fractional/DCO Mode5
12 kHz to 20 MHz
— 160 210 fs rms
JPER Derived from integrated
phase noise
— 110 — fs rms
JCC — 180 — fs rms
JPER N = 10,000 cycles Integer
or Fractional Mode4, 5 .
Measured in the time do-
main. Performance is limi-
ted by the noise floor of
the equipment.
— 4710 — fs pk-pk
JCC — 4000 — fs pk
Jitter Generation Locked to Ex-
ternal XTAL
XTAL Frequency = 48 MHz
JGEN Integer Mode4
12 kHz to 20 MHz
— 90 140 fs rms
Fractional/DCO Mode5
12 kHz to 20 MHz
— 115 170 fs rms
JPER Derived from integrated
phase noise
— 110 — fs rms
JCC — 180 — fs rms
JPER N = 10, 000 cycles Integer
or Fractional Mode.4, 5
Measured in the time do-
main. Performance is limi-
ted by the noise floor of
the equipment.
— 5080 — fs pk-pk
JCC — 4340 — fs pk
XTAL Frequency = 25 MHz
JGEN Integer Mode4
12 kHz to 20 MHz
115 140 fs rms
Fractional Mode5
12 kHz to 20 MHz
140 190 fs rms
Notes:
1. PLL lock time is measured by first letting the PLL lock, then turning off the input clock, and then turning on the input clock. The
time from the first edge of the input clock being re-applied until LOL de-asserts is the PLL lock time.
2. Measured as time from valid VDD and VDD33 rails (90% of their value) to when the serial interface is ready to respond to com-
mands. Measured in SPI 4-wire mode, with SCLK @ 10 MHz.
3. Jitter generation test conditions fIN = 100 MHz, fOUT = 156.25 MHz LVPECL.
4. Integer mode assumes that the output dividers (Nn/Nd) are configured with an integer value.
5. Fractional and DCO modes assume that the output dividers (Nn/Nd) are configured with a fractional value and the feedback divid-
er is integer.
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 25
Table 5.9. I2C Timing Specifications (SCL,SDA)
Parameter Symbol Test Condition Standard Mode
100 kbps
Fast Mode
400 kbps
Units
Min Max Min Max
SCL Clock Frequency fSCL — 100 — 400 kHz
Hold Time (Repeated)
START Condition
tHD:STA 4.0 — 0.6 — μs
Low Period of the SCL Clock tLOW 4.7 — 1.3 — μs
HIGH Period of the SCL
Clock
tHIGH 4.0 — 0.6 — μs
Set-up Time for a Repeated
START Condition
tSU:STA 4.7 — 0.6 — μs
Data Hold Time tHD:DAT 100 — 100 — ns
Data Set-up Time tSU:DAT 250 — 100 — ns
Rise Time of Both SDA and
SCL Signals
tr— 1000 20 300 ns
Fall Time of Both SDA and
SCL Signals
tf— 300 — 300 ns
Set-up Time for STOP Con-
dition
tSU:STO 4.0 — 0.6 — μs
Bus Free Time between a
STOP and START Condition
tBUF 4.7 — 1.3 — μs
Data Valid Time tVD:DAT — 3.45 — 0.9 μs
Data Valid Acknowledge
Time
tVD:ACK — 3.45 — 0.9 μs
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 26
Figure 5.1. I2C Serial Port Timing Standard and Fast Modes
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 27
Table 5.10. SPI Timing Specifications (4-Wire)
(VDD=1.8 V ± 5%, VDDA=3.3 V ± 5%, TA= –40 to 85 °C)
Parameter Symbol Min Typ Max Units
SCLK Frequency fSPI — — 20 MHz
SCLK Duty Cycle TDC 40 — 60 %
SCLK Period TC50 — — ns
Delay Time, SCLK Fall to SDO Active TD1 — 12.5 18 ns
Delay Time, SCLK Fall to SDO TD2 — 10 15 ns
Delay Time, CSb Rise to SDO Tri-State TD3 — 10 15 ns
Setup Time, CSb to SCLK TSU1 5 — — ns
Hold Time, SCLK Fall to CSb TH1 5 — — ns
Setup Time, SDI to SCLK Rise TSU2 5 — — ns
Hold Time, SDI to SCLK Rise TH2 5 — — ns
Delay Time Between Chip Selects (CSb)1TCS 2 — — TC
Note:
1. The minimum time is based on 20 MHz SPI clock (50 ns). So the minimum wait time between two frames should be 2*50 ns =
100 ns.
SCLK
CSb
SDI
SDO
TSU1 TD1
TSU2
TD2
TC
TCS
TD3
TH2
TH1
Figure 5.2. 4-Wire SPI Serial Interface Timing
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 28
Table 5.11. SPI Timing Specifications (3-Wire)
(VDD=1.8 V ± 5%, VDDA= 3.3 V ± 5%, TA= –40 to 85 °C)
Parameter Symbol Min Typ Max Units
SCLK Frequency fSPI — — 20 MHz
SCLK Duty Cycle TDC 40 — 60 %
SCLK Period TC50 — — ns
Delay Time, SCLK Fall to SDO Turn-on TD1 — 12.5 20 ns
Delay Time, SCLK Fall to SDO Next-bit TD2 — 10 15 ns
Delay Time, CSb Rise to SDO Tri-State TD3 — 10 15 ns
Setup Time, CSb to SCLK TSU1 5 — — ns
Hold Time, SCLK Fall to CSb TH1 5 — — ns
Setup Time, SDI to SCLK Rise TSU2 5 — — ns
Hold Time, SDI to SCLK Rise TH2 5 — — ns
Delay Time Between Chip Selects (CSb)1TCS 2 — — TC
Note:
1. The minimum time is based on 20 MHz SPI clock (50 ns). So the minimum wait time between two frames should be 2*50 ns =
100 ns.
SCLK
SDIO
TSU1
TD1
TSU2
TD2
TC
TCS
TD3
TH2
TH1
CSb
Figure 5.3. 3-Wire SPI Serial Interface Timing
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 29
Table 5.12. Crystal Specifications
Parameter Symbol Test Condition Min Typ Max Units
Crystal Frequency Range fXTAL Full operating range. Jitter per-
formance may be reduced.
24.97 — 54.06 MHz
Range for best jitter. 48 — 54 MHz
Load Capacitance CL— 8 — pF
Crystal Drive Level dL— — 200 μW
Equivalent Series Resistance
Shunt Capacitance
rESR
CO
Refer to the Si5341/40 Family Reference Manual to determine ESR and shunt ca-
pacitance.
Note:
1. Refer to the Si534x/8x Recommended Crystal, TCXO and OCXOs Reference Manual for recommended 48 to 54 MHz crystals.
The Si5341/40 are designed to work with crystals that meet these specifications.
Table 5.13. Thermal Characteristics
Parameter Symbol Test Condition1Value Units
Si5341 - 64QFN
Thermal Resistance
Junction to Ambient
ϴJA Still Air 22 °C/W
Air Flow 1 m/s 19.4
Air Flow 2 m/s 18.3
Thermal Resistance
Junction to Case
ϴJC 9.5
Thermal Resistance
Junction to Board
ϴJB 9.4
ΨJB 9.3
Thermal Resistance
Junction to Top Center
ΨJT 0.2
Si5340 - 44QFN
Thermal Resistance
Junction to Ambient
ϴJA Still Air 22.3 °C/W
Air Flow 1 m/s 19.4
Air Flow 2 m/s 18.4
Thermal Resistance
Junction to Case
ϴJC 10.9
Thermal Resistance
Junction to Board
ϴJB 9.3
ΨJB 9.2
Thermal Resistance
Junction to Top Center
ΨJT 0.23
Note:
1. Based on PCB Dimension: 3" x 4.5", PCB Land/Via under GND pad: 36, Number of Cu Layers: 4
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 30
Table 5.14. Absolute Maximum Ratings1, 2, 3, 4, 5
Parameter Symbol Test Condition Value Units
Storage Temperature Range TSTG -55 to +150 °C
DC Supply Voltage VDD -0.5 to 3.8 V
VDDA -0.5 to 3.8 V
VDDO -0.5 to 3.8 V
Input Voltage Range VI1 IN0-IN2, FB_IN -1.0 to 3.8 V
VI2 IN_SEL[1:0], RSTb, OEb,
SYNCb, I2C_SEL, SDI, SCLK,
A0/CSb, A1, SDA/SDIO, FINC/
FDEC
-0.5 to 3.8 V
VI3 XA/XB -0.5 to 2.7 V
Latch-up Tolerance LU JESD78 Compliant
ESD Tolerance HBM 100 pF, 1.5 kΩ 2.0 kV
Maximum Junction Temperature in Operation TJCT 125 °C
Soldering Temperature (Pb-free profile)5TPEAK 260 °C
Soldering Temperature Time at TPEAK
(Pb-free profile)5
TP20 to 40 sec
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be restricted to
the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum rating conditions for ex-
tended periods may affect device reliability.
2. 64-QFN and 44-QFN packages are RoHS-6 compliant.
3. Moisture sensitivity level is MSL2. For more packaging information, go to the Silicon Labs RoHS information page.
4. The minimum voltage at these pins can be as low as –1.0 V when an AC input signal of 10 MHz or greater is applied. See Table
5.3 Input Clock Specifications on page 19 spec for single-ended AC-coupled fIN < 250 MHz.
5. The device is compliant with JEDEC J-STD-020.
Si5341/40 Rev D Data Sheet
Electrical Specifications
silabs.com | Building a more connected world. Rev. 1.1 | 31
6. Typical Application Schematic
XA
XB
25 MHz
“Traditional Discrete” Clock Tree
Level
Translator
Clock
Generator
161.1328125
MHz
Buffer
133.33 MHz
Buffer
One Si5341 replaces:
3x crystal oscillators (XO)
2x buffers
1x Clock Generator
2x level translators
“Clock Tree
On-a-Chip”
XA
XB
25 MHz 200 MHz
2.5V LVCMOS
2x 161.1328125 MHz
LVDS
2x 133.33 MHz
1.8V LVCMOS
Buffer
125 MHz
Level
Translator
Buffer
4x 125 MHz
3.3V LVCMOS
3x 125 MHz
LVPECL
Si5341
1x 161.1328125 MHz
LVDS
1x 161.1328125 MHz
LVDS
2x 133.33 MHz
1.8V LVCMOS
2x 125 MHz
3.3V LVCMOS
2x 125 MHz
3.3V LVCMOS
2x 200 MHz
2.5V LVCMOS
2x 200 MHz
2.5V LVCMOS
1x 125 MHz
LVPECL
1x 125 MHz
LVPECL
1x 125 MHz
LVPECL
Figure 6.1. Using the Si5341 to Replace a Traditional Clock Tree
Si5341/40 Rev D Data Sheet
Typical Application Schematic
silabs.com | Building a more connected world. Rev. 1.1 | 32
7. Detailed Block Diagrams
VDD
VDDA
3
SDA/ SDIO
A1/ SDO
SCLK
A0/ CSb
I2C_ SEL
SPI /
I2CNVM
RSTb
Zero Delay
Mode
FB_IN
FB_ INb
OEb
Si5341
Generator
Clock
÷R0
÷R2
÷R3
÷R4
÷R5
÷R6
÷R7
÷R8
÷R9
÷R1
OUT0b
VDDO0
OUT0
OUT2b
VDDO2
OUT2
OUT3b
VDDO3
OUT3
OUT4b
VDDO4
OUT4
OUT5b
VDDO5
OUT5
OUT6b
VDDO6
OUT6
OUT7b
VDDO7
OUT7
OUT8b
VDDO8
OUT8
OUT9b
VDDO9
OUT9
OUT1b
VDDO1
OUT1
÷Pfb
LPF
PD
÷Mn
M
d
PLL
IN_SEL[1:0]
XA
XB
÷P2
÷P1
÷P0
IN0
IN0b
IN1
IN1b
IN2
IN2b
FDEC
FINC
Frequency
Control
÷N0n
N0d
÷N2n
N2d
÷N3n
N3d
÷N4n
N4d
÷N1n
N1d
MultiSynth
SYNCb
Dividers/
Drivers
Status
Monitors
LO Lb
INTRb
OSC
÷PXAXB
25-54 MHz
XTAL
Figure 7.1. Si5341 Block Diagram
Si5341/40 Rev D Data Sheet
Detailed Block Diagrams
silabs.com | Building a more connected world. Rev. 1.1 | 33
RSTb
OEb
÷Nn0
Nd0
÷N2n
N2d
÷N3n
N3d
÷Nn1
Nd1
LPF
PD
PLL
Mn
Md
LO Lb
I NT Rb
LOSXAB
SDA/SDIO
A1/SDO
SCLK
A0/CSb
I2C_SEL
SPI/
I2CNVM
Status
Monitors
MultiSynth
÷R0
÷R2
÷R3
÷R1
OUT0b
VDDO0
OUT0
OUT2b
VDDO2
OUT2
OUT3b
VDDO3
OUT3
OUT1b
VDDO1
OUT1
Dividers/
Drivers
Zero Delay
Mode
FB_IN
FB_INB ÷P
fb
IN_SEL[1:0]
÷P
2
÷P
1
÷P
0
IN0
IN0b
IN1
IN1b
IN2
IN2b
XA
XB
25-54 MHz
XTAL OSC
÷P
Si5340
Generator
Clock
VDD
VDDA
42
÷
XAXB
VDDS
1
Figure 7.2. Si5340 Detailed Block Diagram
Si5341/40 Rev D Data Sheet
Detailed Block Diagrams
silabs.com | Building a more connected world. Rev. 1.1 | 34
8. Typical Operating Characteristics
Figure 8.1. Integer Mode--48 MHz Crystal, 625 MHz Output (2.5 V LVDS)
Si5341/40 Rev D Data Sheet
Typical Operating Characteristics
silabs.com | Building a more connected world. Rev. 1.1 | 35
Figure 8.2. Integer Mode--48 MHz Crystal, 156.25 MHz Output (2.5 V LVDS)
Figure 8.3. Fractional Mode--48 MHz Crystal, 155.52 MHz Output (2.5 V LVDS)
Si5341/40 Rev D Data Sheet
Typical Operating Characteristics
silabs.com | Building a more connected world. Rev. 1.1 | 36
9. Pin Descriptions
GND
Pad
IN1
IN1b
IN_SEL0
IN_SEL1
SYNCb
RSTb
X1
XA
XB
X2
OEb
INTRb
VDDA
IN2
IN2b
SCLK
A0/CSb
SDA/SDIO
A1/SDO
VDD
RSVD
RSVD
VDDO0
OUT0b
OUT0
FDEC
OUT1b
OUT1
VDDO2
OUT2b
OUT2
FINC
LOLb
VDD
OUT 6
OUT6b
VDDO6
OUT5
OUT5b
VDDO 5
I2C_SEL
OUT4
OUT4b
VDDO4
OUT3
OUT3b
VDDO 3
VDDO7
OUT7b
OUT7
VDDO8
OUT8b
OUT8
OUT9b
O
U
T9
VDDO9
VDD
FB_IN
FB_INb
IN0
IN0b
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
VDDO1
Si 5341 64QFN
Top View
RSVD
RSVD
GND
Pad
IN1
IN1b
IN_SEL0
INTRb
X1
XA
XB
X2
OEb
RSTb
VDDA
VDDA
IN2
A0/CSb
SDA/SDIO
A1/SDO
OUT0b
OUT0
VDDO0
SCLK
I2C_SEL
OUT1
OUT1b
VDDO1
VDDO3
OUT3b
OUT3
FB_IN
FB_INb
IN0
IN0b
Si 5340 44QFN
Top View
1
2
3
4
5
6
7
8
9
10
33
32
31
30
29
28
27
26
25
24
12
13
14
15
16
17
18
19
20
21
44
43
42
41
40
39
38
37
36
35
VDD
OUT2
OUT2b
VDDO2
VDDS
LOLb
LOS_XAXBb
VDD
IN_SEL1
IN2b 11 23
NC 22
VDD
VDD
34
Si5341/40 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 37
Table 9.1. Pin Descriptions
Pin Name Pin Number Pin Type1Function
Si5341 Si5340
Inputs
XA 8 5 I Crystal and External Clock Input. These pins are used to con-
nect an external crystal or an external clock. See 3.3.1 XA/XB
Clock and Crystal Input and Figure 3.2 XAXB External Crystal and
Clock Connections on page 8 for connection information. If
IN_SEL[1:0] = 11b, then the XAXB input is selected. If the XAXB
input is not used and powered down, then both inputs can be left
unconnected. ClockBuilder Pro will power down an input that is
set as "Unused".
XB 9 6 I
X1 7 4 I XTAL Shield. Connect these pins directly to the XTAL ground
pins. X1, X2, and the XTAL ground pins must not be connected to
the PCB ground plane. DO NOT GROUND THE CRYSTAL
GROUND PINS. Refer to the Si5341/40 Family Reference Manual
for layout guidelines. These pins should be left disconnected
when connecting XA/XB pins to an external reference clock.
X2 10 7 I
IN0 63 43 I Clock Inputs. These pins accept both differential and single-
ended clock signals. Refer 3.3.2 Input Clocks (IN0, IN1, IN2) for
input termination options. These pins are high-impedance and
must be terminated externally. If both the INx and INx (with over-
strike) inputs are un-used and powered down, then both inputs
can be left floating. ClockBuilder Pro will power down an input that
is set as "Unused".
IN0b 64 44 I
IN1 1 1 I
IN1b 2 2 I
IN2 14 10 I
IN2b 15 11 I
FB_IN 61 41 I External Feedback Input. These pins are used as the external
feedback input (FB_IN/FB_INb) for the optional zero delay mode.
See 3.5.11 Zero Delay Mode for details on the optional zero delay
mode. If FB_IN and FB_IN (with overstrike) are un-used and pow-
ered down, then both inputs can be left floating. ClockBuilder Pro
will power down an input that is set as "Unused".
FB_INb 62 42 I
Si5341/40 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 38
Pin Name Pin Number Pin Type1Function
Si5341 Si5340
Outputs
OUT0 24 20 O Output Clocks. These output clocks support a programmable
signal amplitude when configured as a differential output. Desired
output signal format is configurable using register control. Termi-
nation recommendations are provided in 3.5.2 Differential Output
Terminations and 3.5.4 LVCMOS Output Terminations. Unused
outputs should be left unconnected.
OUT0b 23 19 O
OUT1 28 25 O
OUT1b 27 24 O
OUT2 31 31 O
OUT2b 30 30 O
OUT3 35 36 O
OUT3b 34 35 O
OUT4 38 — O
OUT4b 37 — O
OUT5 42 — O
OUT5b 41 — O
OUT6 45 — O
OUT6b 44 — O
OUT7 51 — O
OUT7b 50 — O
OUT8 54 — O
OUT8b 53 — O
OUT9 59 — O
OUT9b 58 — O
Serial Interface
I2C_SEL 39 38 I I2C Select.2 This pin selects the serial interface mode as I2C
(I2C_SEL = 1) or SPI (I2C_SEL = 0). This pin is internally pulled
up by a ~ 20 kΩ resistor to the voltage selected by the
IO_VDD_SEL register bit.
SDA/SDIO 18 13 I/O Serial Data Interface.2 This is the bidirectional data pin (SDA) for
the I2C mode, or the bidirectional data pin (SDIO) in the 3-wire
SPI mode, or the input data pin (SDI) in 4-wire SPI mode. When
in I2C mode, this pin must be pulled-up using an external resistor
of at least 1 kΩ. No pull-up resistor is needed when in SPI mode.
A1/SDO 17 15 I/O Address Select 1/Serial Data Output.2 In I2C mode, this pin
functions as the A1 address input pin and does not have an inter-
nal pull up or pull down resistor. In 4-wire SPI mode this is the se-
rial data output (SDO) pin (SDO) pin and drives high to the volt-
age selected by the IO_VDD_SEL pin.
SCLK 16 14 I Serial Clock Input.2 This pin functions as the serial clock input
for both I2C and SPI modes.This pin is internally pulled up by a
~20 kΩ resistor to the voltage selected by the IO_VDD_SEL regis-
ter bit. In I2C mode this pin should have an external pull up of at
least 1 kΩ. No pull-up resistor is needed when in SPI mode.
Si5341/40 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 39
Pin Name Pin Number Pin Type1Function
Si5341 Si5340
A0/CSb 19 16 I Address Select 0/Chip Select.2 This pin functions as the hard-
ware controlled address A0 in I2C mode. In SPI mode, this pin
functions as the chip select input (active low). This pin is internally
pulled up by a ~20 kΩ resistor to the voltage selected by the
IO_VDD_SEL register bit.
Control/Status
INTRb 12 33 O Interrupt. 2 This pin is asserted low when a change in device sta-
tus has occurred. This interrupt has a push pull output and should
be left unconnected when not in use.
RSTb 6 17 I Device Reset. 2 Active low input that performs power-on reset
(POR) of the device. Resets all internal logic to a known state and
forces the device registers to their default values. Clock outputs
are disabled during reset. This pin is internally pulled up with a
~20 kΩ resistor to the voltage selected by the IO_VDD_SEL bit.
OEb 11 12 I Output Enable.2 This pin disables all outputs when held high.
This pin is internally pulled low and can be left unconnected when
not in use.
LOLb 47 — O Loss Of Lock.2 This output pin indicates when the DSPLL™ is
locked (high) or out-of-lock (low). An external pull up or pull down
is not needed.
— 27 O Loss Of Lock.3 This output pin indicates when the DSPLL is
locked (high) or out-of-lock (low). An external pull up or pull down
is not needed.
LOS_XAXBb — 28 O Loss Of Signal.3 This output pin indicates a loss of signal at the
XA/XB pins.
SYNCb 5 — I Output Clock Synchronization.2 An active low signal on this pin
resets the output dividers for the purpose of re-aligning the output
clocks. For a tighter alignment of the clocks, a soft reset should be
applied. This pin is internally pulled up with a ~20 kΩ resistor to
the voltage selected by the IO_VDD_SEL bit and can be left un-
connected when not in use.
FDEC 25 — I Frequency Decrement Pin.2 This pin is used to step-down the
output frequency of a selected output. The affected output driver
and its frequency change step size is register configurable. This
pin is internally pulled low with a ~20 kΩ resistor and can be left
unconnected when not in use.
FINC 48 — I Frequency Increment Pin.2 This pin is used to step-up the out-
put frequency of a selected output. The affected output and its fre-
quency change step size is register configurable. This pin is inter-
nally pulled low with a ~20 kΩ resistor and can be left unconnec-
ted when not in use.
IN_SEL0 3 3 I Input Reference Select.2 The IN_SEL[1:0] pins are used in the
manual pin controlled mode to select the active clock input. These
pins are internally pulled up with a ~20 kΩ resistor to the voltage
selected by the IO_VDD_SEL bit and can be left unconnected
when not in use.
IN_SEL1 4 37 I
Si5341/40 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 40
Pin Name Pin Number Pin Type1Function
Si5341 Si5340
RSVD 20 — — Reserved. These pins are connected to the die. Leave discon-
nected.
21 — —
55 — —
56 — —
NC — 22 — No Connect. These pins are not connected to the die. Leave dis-
connected.
Power
VDD 32 21 P Core Supply Voltage. The device core operates from a 1.8 V
supply. A 1.0 µf bypass capacitor is recommended.
46 32
60 39
— 40
VDDA 13 8 P Core Supply Voltage 3.3 V. This core supply pin requires a 3.3 V
power source. A 1.0 µf bypass capacitor is recommended.
— 9 P
VDDS — 26 P Status Output Voltage. The voltage on this pin determines the
VOL/VOH on LOLb and LOS_XAXBb status output pins. A 0.1 µf to
1.0 µf bypass capacitor is recommended.
VDDO0 22 18 P Output Clock Supply Voltage 0–9. Supply voltage (3.3 V, 2.5 V,
1.8 V) for OUTx, OUTx outputs. See the Si5341/40 Family Refer-
ence Manual for power supply filtering recommendations. Leave
VDDO pins of unused output drivers unconnected. An alternate
option is to connect the VDDO pin to a power supply and disable
the output driver to minimize current consumption.
VDDO1 26 23 P
VDDO2 29 29 P
VDDO3 33 34 P
VDDO4 36 — P
VDDO5 40 — P
VDDO6 43 — P
VDDO7 49 — P
VDDO8 52 — P
VDDO9 57 — P
GND PAD P Ground Pad This pad provides electrical and thermal connection
to ground and must be connected for proper operation. Use as
many vias as practical and keep the via length to an internal
ground plan as short as possible.
Note:
1. I = Input, O = Output, P = Power.
2. The IO_VDD_SEL control bit (0x0943 bit 0) selects 3.3 V or 1.8 V operation.
3. The voltage on the VDDS pin(s) determines 3.3 V or 1.8 V operation.
4. Refer to the Family Reference Manual for more information on register setting names.
5. All status pins except I2C and SPI are push-pull.
Si5341/40 Rev D Data Sheet
Pin Descriptions
silabs.com | Building a more connected world. Rev. 1.1 | 41
10. Package Outlines
10.1 Si5341 9x9 mm 64-QFN Package Diagram
The figure below illustrates the package details for the Si5341. The table below lists the values for the dimensions shown in the illustra-
tion.
Figure 10.1. 64-Pin Quad Flat No-Lead (QFN)
Table 10.1. Package Dimensions
Dimension Min Nom Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 9.00 BSC
D2 5.10 5.20 5.30
e 0.50 BSC
E 9.00 BSC
E2 5.10 5.20 5.30
L 0.30 0.40 0.50
aaa — — 0.10
bbb — — 0.10
ccc — — 0.08
ddd — — 0.10
eee — — 0.05
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5341/40 Rev D Data Sheet
Package Outlines
silabs.com | Building a more connected world. Rev. 1.1 | 42
10.2 Si5340 7x7 mm 44-QFN Package Diagram
The figure below illustrates the package details for the Si5340. The table below lists the values for the dimensions shown in the illustra-
tion.
Figure 10.2. 44-Pin Quad Flat No-Lead (QFN)
Table 10.2. Package Dimensions
Dimension Min Nom Max
A 0.80 0.85 0.90
A1 0.00 0.02 0.05
b 0.18 0.25 0.30
D 7.00 BSC
D2 5.10 5.20 5.30
e 0.50 BSC
E 7.00 BSC
E2 5.10 5.20 5.30
L 0.30 0.40 0.50
aaa — — 0.10
bbb — — 0.10
ccc — — 0.08
ddd — — 0.10
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-220.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5341/40 Rev D Data Sheet
Package Outlines
silabs.com | Building a more connected world. Rev. 1.1 | 43
11. PCB Land Pattern
The figure below illlustrates the PCB land pattern details for the devices. The table below lists the values for the dimensions shown in
the illustration.
Si5341 Si5340
Figure 11.1. PCB Land Pattern
Si5341/40 Rev D Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.1 | 44
Table 11.1. PCB Land Pattern Dimensions
Dimension Si5341 (Max) Si5340 (Max)
C1 8.90 6.90
C2 8.90 6.90
E 0.50 0.50
X1 0.30 0.30
Y1 0.85 0.85
X2 5.30 5.30
Y2 5.30 5.30
Notes:
General
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. This Land Pattern Design is based on the IPC-7351 guidelines.
3. All dimensions shown are at Maximum Material Condition (MMC). Least Material Condition is calculated based on a fabrication
Allowance of 0.05 mm.
Solder Mask Design
1. All metal pads are to be non-solder mask defined (NSMD). Clearance between the solder mask and the metal pad is to be 60 µm
minimum, all the way around the pad.
Stencil Design
1. A stainless steel, laser-cut and electro-polished stencil with trapezoidal walls should be used to assure good solder paste release.
2. The stencil thickness should be 0.125 mm (5 mils).
3. The ratio of stencil aperture to land pad size should be 1:1 for all perimeter pads.
4. A 3×3 array of 1.25 mm square openings on 1.80 mm pitch should be used for the center ground pad.
Card Assembly
1. A No-Clean, Type-3 solder paste is recommended.
2. The recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body Components.
Si5341/40 Rev D Data Sheet
PCB Land Pattern
silabs.com | Building a more connected world. Rev. 1.1 | 45
12. Top Marking
Figure 12.1. Si5341-40 Top Markings
Table 12.1. Si5341-40 Top Marking Explanation
Line Characters Description
1 Si5341g-
Si5340g-
Base part number and Device Grade for Low Jitter, Any-Frequency, 10-output Clock
Generator.
Si5341: 10-output, 64-QFN
Si5340: 4-output, 44-QFN
g = Device Grade (A, B, C, D). See 2. Ordering Guide for more information.
– = Dash character.
2 Rxxxxx-GM R = Product revision. (See ordering guide for current revision).
xxxxx = Customer specific NVM sequence number. Optional NVM code assigned for
custom, factory pre-programmed devices.
Characters are not included for standard, factory default configured devices. See Or-
dering Guide for more information.
–GM = Package (QFN) and temperature range (–40 to +85 °C)
3 YYWWTTTTTT YYWW = Characters correspond to the year (YY) and work week (WW) of package
assembly.
TTTTTT = Manufacturing trace code.
4 Circle w/ 1.6 mm (64-QFN) or
1.4 mm (44-QFN) diameter
Pin 1 indicator; left-justified
e4
TW
Pb-free symbol; Center-Justified
TW = Taiwan; Country of Origin (ISO Abbreviation)
Si5341/40 Rev D Data Sheet
Top Marking
silabs.com | Building a more connected world. Rev. 1.1 | 46
14. Revision History
Revision 1.1
July, 2020
• Updated Figure 3.2 XAXB External Crystal and Clock Connections on page 8.
• Updated Figure 3.4 Supported Differential Output Terminations on page 10.
• Removed "Output Delay Control (t0–t4)" section.
• Added Zero Delay Mode.
• Removed section on Sync Pin (Synchronizing R Dividers).
• Updated 4. Register Map.
• Removed Addressing Scheme section.
• Removed High-Level Register Map section.
• Updated Table 5.3 Input Clock Specifications on page 19.
• Updated Input Capacitance specification typical value.
• Updated the Notes section.
• Min input frequency updated to 10 MHz.
• Updated Table 5.5 Differential Clock Output Specifications on page 21.
• Updated Output-Output Skew Using Same Multisynth specification typical and max values.
• Updated Table 5.6 LVCMOS Clock Output Specifications on page 22.
• Removed Output-to-Output Skew specification.
• Updated Table 5.8 Performance Characteristics on page 24.
• Removed Output Delay Adjustment specification.
• Min VCO Frequency Range (FVCO) updated to 13.2 GHz.
• Updated Table 5.10 on page 28 SPI Timing Specifications (4-Wire).
• Updated TH1 description for Hold Time to SCLK Fall to CSb.
• Added Note for Delay Time Between Chip Selects (CSb).
• Updated Figure 5.2 4-Wire SPI Serial Interface Timing on page 28.
• Updated Table 5.11 on page 29 SPI Timing Specifications (3-Wire).
• Updated TH1 description for Hold Time to SCLK Fall to CSb.
• Added Note for Delay Time Between Chip Selects (CSb).
• Updated Figure 5.3 3-Wire SPI Serial Interface Timing on page 29.
• Updated Table 5.13 Thermal Characteristics on page 30.
• Updated PCB size from mm to inches.
• Updated Figure 6.1 Using the Si5341 to Replace a Traditional Clock Tree on page 32.
• Removed output delay adjustment features.
• Updated 7. Detailed Block Diagrams.
• Removed Δt blocks from block diagrams.
• Updated Table 10.1 Package Dimensions on page 42 for 64-Pin QFN.
• Max dimension "aaa" updated to 0.10 mm.
• Updated Table 10.2 Package Dimensions on page 43 for 44-Pin QFN.
• Max dimension "aaa" updated to 0.10 mm.
Revision 1.0
July, 2016
• Initial release. (See "AN1006: Differences between Si534x/8x Revision B and Revision D Silicon" for a list of changes from Rev B to
Rev D.)
Si5341/40 Rev D Data Sheet
Revision History
silabs.com | Building a more connected world. Rev. 1.1 | 48
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Disclaimer
Silicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or
intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical"
parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without
further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior
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