TputtyTM 502 Series Innovative Technology for a Connected World Creates compression of interface material TputtyTM 502 is the best material for applications where large tolerance differences create the need for compression of the interface material beyond 50% of its original thickness. TputtyTM 502 will flow and ensure low pressures on the components being cooled. In conjunction with outstanding compression characteristics, TputtyTM 502 has a high thermal conductivity, resulting in very low thermal resistance. TputtyTM 502 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. global solutions: local support Americas: +1.800.843.4556 Europe: +49.8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal TM FEATURES AND BENEFITS APPLICATIONS * Soft and ultra high compressibility for low stress applications * Cooling components to the chassis or frame * 3 W/mK thermal conductivity * Entire large panel PCB cooling * Available in sheets 0.020" - 0.200" (0.5mm - (5.0mm) thick and in bulk * Semiconductor automated test equipment (ATE) * Naturally tacky needing no further adhesive coating * Any high compression low stress application TputtyTM 502 Series Innovative Technology for a Connected World TputtyTM 0.020 Construction & Composition TputtyTM 0.040 TputtyTM 0.060 TputtyTM 0.080 TputtyTM 0.100 TEST METHOD Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride Reinforced boron nitride filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer filled silicone elastomer Color White Thickness White White White White Visual 0.020" (0.51mm) 0.040" (1.02mm) 0.060" (1.52mm) 0.080" (2.03mm) 0.100" (2.54mm) 0.002" ( 0.05mm) 0.003" ( 0.08mm) 0.004" ( 0.10mm) 0.004" ( 0.10mm) 0.005" ( 0.13mm) 1.39 g/cc 1.38 g/cc 1.37 g/cc 1.37 g/cc 1.36 g/cc Helium Pycnometer 05 Shore OO 05 Shore OO 05 Shore OO 05 Shore OO 05 Shore OO ASTM D2240 Outgassing TML (Post Cured) 0.11% 0.11% 0.11% 0.11% 0.11% ASTM E595 Outgassing CVCM (Post Cured) 0.06% 0.06% 0.06% 0.06% 0.06% ASTM E595 Temperature Range -45C to 200C -45C to 200C -45C to 200C -45C to 200C -45C to 200C 3 W/mK 3 W/mK 3 W/mK 3 W/mK 3 W/mK ASTM D5470 (modified) Thermal Impedance @ 10 psi @ 69KPa 0.44 C-in2/W 2.84 C-cm2/W 0.49 C-in2/W 3.16 C-cm2/W 0.53 C-in2/W 3.42 C-cm2/W 0.58 C-in2/W 3.74 C-cm2/W 0.62 C-in2/W 4.00 C-cm2/W ASTM D5470 (modified) Thermal Expansion 92 ppm/C 92 ppm/C 92 ppm/C 92 ppm/C 92 ppm/C IPC-TM-650 2.4.24 Breakdown Voltage 2000 Volts AC 4000 Volts AC >5000 Volts AC >5000 Volts AC >5000 Volts AC ASTM D149 Volume Resistivity 5 x 10 ohm-cm 5 x 10 ohm-cm 5 x 10 ohm-cm 5 x 10 ohm-cm 13 5 x 10 ohm-cm ASTM D257 Dielectric Constant @ 1MHz 3.20 3.20 3.20 3.20 3.20 ASTM D150 Thickness Tolerance Specific Gravity Hardness *without fiberglass Thermal Conductivity 13 13 Standard Thicknesses 0.020" (0.51mm) 0.060" (1.52mm) 0.100" (2.54mm) 0.140" (3.56mm) 0.180" (4.57mm) 0.030" (0.76mm) 0.070" (1.78mm) 0.110" (2.79mm) 0.150" (3.81mm) 0.190" (4.83mm) 13 13 Standard Sheet Sizes 0.040" (1.02mm) 0.080" (2.03mm) 0.120" (3.05mm) 0.160" (4.06mm) 0.200" (5.08mm) 0.050" (1.27mm) 0.090" (2.29mm) 0.130" (3.30mm) 0.170" (4.32mm) 9" x 9" (229mm x 229mm) and 18" x 18" (457mm x 457mm). 9" x 9" only over 0.100" thickness TputtyTM 502 is available in individual die cut shapes. Pressure sensitive adhesive is not applicable for TputtyTM products. Reinforcement Consult the factory for alternate thicknesses. TputtyTM 502 sheets are reinforced on both sides with fiberglass. Bulk Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application. TputtyTM 502 is available in bulk form in the following sizes: 100 cc Jar 500 cc Jar 1000 cc Jar Consult the factory for alternate bulk sizes. THR-SPEC-Tputty-502 0710 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies' Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. (c) Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. 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