Type
PRODUCT SPECIFICATION
NUMBER
GS-12-233
TITLE PAGE REV.
PCI EXPRESSTM CONNECTOR 1 of 11 H
AUTHORIZED BY DATE
Richard Chiu 07/04/08
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev E
GS-01-001
TABLE OF CONTENTS
SECTION 1 INTRODUCTION
SECTION 2 GENERAL REQUIREMENTS
SECTION 3 MECHANICAL
3.1 EXAMINATION OF PRODUCT
3.2 INSERTION/WITHDRAWAL FORCES – ADD IN CARD
3.3 CONTACT RETENTION
3.4 BOARD INSERTION/RETENTION FORCE
3.5 SOLDERABILITY
SECTION 4 ELECTRICAL
4.1 LOW LEVEL CONTACT RESISTANCE
4.2 INSULATION RESISTANCE
4.3 DIELECTRIC WITHSTANDING
4.4 CONTACT CURRENT RATING
4.5 INSERTION LOSS
4.6 RETURN LOSS
4.7 CROSSTALK
SECTION 5 ENVIRONMENTAL
5.1 THERMAL SHOCK
5.2 CYCLIC TEMPERATURE AND HUMIDITY
5.3 TEMPERATURE LIFE (PRE-CONDITIONING)
5.4 TEMPERATURE LIFE
5.5 VIBRATION
5.6 DURABILITY (PRE-CONDITIONING)
5.7 DURABILITY
5.8 MIXED FLOWING GAS
5.9 RESEATING
5.10 RESISTANCE TO SOLDER HEAT
SECTION 6 TEST MATRIX
PDM: Rev:H Released .STATUS: Printed: Nov 27, 2010
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-233
TITLE PAGE REV.
PCI EXPRESSTM CONNECTOR 2 of 11 H
AUTHORIZED BY DATE
Richard Chiu 07/04/08
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev E
GS-01-001
1.0 INTRODUCTION
1.1 SCOPE
This document describes the functional and test requirements
for the PCI ExpressTM card-edge connector. The connector is
designed to meet the requirements of the PCI Express Card
Electromechanical Specification and certain customer
specifications not covered by the PCI-SIG document .
1.2 APPLICABLE DOCUMENTS
1.2.1 Solderability : BUS-19-002/A
1.2.2 PCI Express Card Electromechanical Specification
1.2.3 EIA –90, EIA-364-
09,17,20,21,28,31,32,65,70,101,108,638
1.2.4 PCI Express Connector High Speed Electrical Test
Procedure.
1.2.5 FCI drawing, PCI Express connector, inspection &
customer copy.
1.2.6 FCI drawing, solder washer, 78523 : inspection copy.
1.3 DRAWING PRECEDENCE
In the event of conflict between this document and product
prints, the product prints shall take precedence.
2.0 GENERAL REQUIREMENTS
2.1 The connector has the following characteristics:
1.00m(0.040”) pitch, X1, X4, X8, X16 sizes, through hole
or straddle mount configuration, rectangular outline,
plastic peg or two forklock holdowns requiring TH holes
on PCB.
2.2 Visual examination, unless otherwise specified, shall be
made at 7X.
2.3 Silicone compounds (mold releases, lubricants, etc.) May
not be used in the manufacturing processes.
2.4 Flammability to be rated UL 94V-0.
2.5 Unless otherwise specified, tests that require the use of
a pc edge card shall use the following
2.5.1 Card material: FR-4 glass epoxy.
2.5.2 Thickness: 1.57 +/- 0.13 (0.062 +/- 0.005 inch)
2.5.3 Trace material: 0.035 (0.0014 inches), copper.
2.5.4 Trace plating: 0.76 micrometers (30 microinches)
minimum gold over 1.27 micrometers (50 microinches)
minimum unbrushed nickel
PDM: Rev:H Released .STATUS: Printed: Nov 27, 2010
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-233
TITLE PAGE REV.
PCI EXPRESSTM CONNECTOR 3 of 11 H
AUTHORIZED BY DATE
Richard Chiu 07/04/08
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev E
GS-01-001
2.5.5 Pad and trace design: pad and trace design shall follow
PCI Express standard as depicted in customer drawing.
2.6 SOLDERTAIL TERMINATION
Tests requiring termination of the soldertails to a PC
board shall be prepared as follows:
2.6.1A 2.4mm +/- 0.13 (0.094 +/- 0.005) thick FR-4 glass
epoxy board having no internal ground planes with
plated thru holes in the pattern specified in AFCI
customer drawing, shall be used.
2.6.2 Solder washers, AFCI part number 78523-001, shall be
applied to the tails, and the connector vapor phase
reflowed at 215°C (419°F) for a time not to exceed 2
minutes.
3.0 MECHANICAL REQUIREMENTS
3.1 EXAMINATION OF PRODUCT
Samples must comply to applicable FCI product prints.
3.2 INSERTION / WITHDRAWAL FORCE- ADD IN CARD
PER EIA-364-13
Mating cycle is with maximum/minimum thickness gage at a rate
of 25.4 mm/minute.
3.2.1 Maximum insertion force is 1.15 N max. per contact pair
when measured with a 1.70 +0.00/-0.01(0.067 +0.000/
-0.004 inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05 min.,
R0.10 max.(sharpedge)and the surface roughness in
connector area to be 0.10 micrometers (4 microinches)
maximum.
3.2.2 Withdrawal force is 0.15N minimum per contact pair when
measured with a 1.44 +0.01/-0.00 (0.067 +0.004/-0 .000
inches) thick hardened steel card made to the
dimensions shown for the PCI Express expansion board
in the FCI customer drawing. The card has a R0.05
min., R0.10 max (sharp edge) and the surface
roughness in the connector area to be 0.10 micrometers
(4 microinches) maximum.
3.3 CONTACT RETENTION
PDM: Rev:H Released .STATUS: Printed: Nov 27, 2010
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-233
TITLE PAGE REV.
PCI EXPRESSTM CONNECTOR 4 of 11 H
AUTHORIZED BY DATE
Richard Chiu 07/04/08
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev E
GS-01-001
Minimum retention force of terminals in the connector
housing to be 5N each. Pull rate to be 1.27 mm/min.
3.4 BOARD RETENTION / INSERTION FORCES
3.4.1 Board retention / insertion forces should be checked on
an 1.57 +/- 0.13 (0.062 +/- 0.005 inch) thick segment
of FR-4 glass / epoxy circuit board segment with a
hole of diameter as described below drilled through.
Connectors should have all contacts present. Forces
apply to connectors with plastic pegs and metal board
locks.
3.4.2 Maximum insertion force(including all types post or
straddle mount solder tails) to seat connector in
PCB(including straddle mount or through PCB)are:
36 pos 2.14 kg max.
64 pos 3.91 kg max.
98 pos 7.45 kg max.
164 pos 7.45 kg max.
3.5 SOLDERABILITY
Per J-STD-002
a. steam age for 1 hour
b. contact areas evaluated shall meet 95% minimum cov erage.
4.0 ELECTRICAL REQUIREMENTS
Unless otherwise specified, all measurements should be
performed in the following ambients:
relative humidity: 50% or less
temperature: 25°C +/- 5°c
barometric pressure: 711 to 812 mm mercury (at sea level)
4.1 LOW LEVEL CONTACT RESISTANCE
EIA-364-23
PDM: Rev:H Released .STATUS: Printed: Nov 27, 2010
Type
PRODUCT SPECIFICATION
NUMBER
GS-12-233
TITLE PAGE REV.
PCI EXPRESSTM CONNECTOR 5 of 11 H
AUTHORIZED BY DATE
Richard Chiu 07/04/08
This document is the property of and embodies CONFIDENTIAL and PROPRIETARY information of FCI. No part of the information shown on the document may be used in any way or
disclosed to others without the written consent of FCI. Copyright FCI.
Form E-3005
Rev E
GS-01-001
4.1.1 Solder connector to pc board per section 2.6 and insert card
per section 2.5
4.1.2 Resistance measurements should be made from the underside of
the pc board to the PTH in the add-in card above the contact
pad. The test current shall be 100 milliampere d.c. max.
with a maximum open circuit voltage of 20 millivolts D.C.
See figure 1.0 for attachment of current and voltage leads.
4.1.3 Requirement is 30 milliohms maximum initial, with change of 10
milliohms maximum after exposure testing.
CONTACT RESISTANCE TEST SET UP
THROUGH HOLE
FIGURE 1
PDM: Rev:H Released .STATUS: Printed: Nov 27, 2010