PROTECTION PRODUCTS
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PRELIMINARY
PROTECTION PRODUCTS - EMIClampTM
EClamp2455P
ESD/EMI Protection
for SIM Card
Description Features
Package Configuration
8 Pin SLP package (Bottom Side View)
Nominal Dimensions in mm
The EClampTM2455P is combination EMI filter and line
termination device with integrated TVS diodes for use on
SIM Card interfaces on cellular phones and other por-
table electronics. This state-of-the-art device utilizes
solid-state silicon-avalanche technology for superior
clamping performance and DC electrical characteristics.
The device consists of three circuits that include series
impedance matching resistors for proper termination of
the SIM card interface. Termination resistor value of
100 Ohms is included on the RST and Data lines and 47
Ohms on the CLK line. TVS diodes are also included on
each line for ESD protection in excess of ±15kV (air
discharge) and ±8kV (contact discharge) per IEC 61000-
4-2, level 4. An additional TVS diode connection is
included for protection of the voltage (Vcc) bus.
The EClamp2455P is in a 8-pin, RoHS/WEEE compliant,
SLP2116P8 package. It measures 2.1 x 1.6 x
0.58mm. The leads are spaced at a pitch of 0.5mm
and are finished with lead-free NiPdAu. The small
package makes it ideal for use in portable electronics
such as cell phones and digital still cameras.
Mechanical Characteristics
Pin Configuration
Applications
SIM Card
Cell Phone
PDAs and Smartphones
SLP2116P8 8-pin package
RoHS/WEEE Compliant
Nominal Dimensions: 2.1 x 1.6 x 0.58 mm
Lead Pitch: 0.5mm
Lead finish: NiPdAu
Marking: Marking Code
Packaging: Tape and Reel
Bidirectional EMI/RFI filter with integrated TVS
for ESD protection
ESD protection to IEC 61000-4-2 (ESD) Level 4,
±15kV (air), ±8kV (contact)
TVS working voltage: 5V
Termination Resistors: 100 Ohms & 47 Ohms
Capacitance: 20pF (Typical at VR = 0V)
Protection and filtering for four lines
Solid-state technology
Revision 10/26/2007
RST Out
CLK Out
Data Out
RST In
CLK In
Data In
Vcc
1
45
8
Gnd
NC
Pin Identification and Configuration
(Top Side View)
2.10
1.60
12
0.50 BSC
0.58
22007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Schematics & Component Values
Pin Configuration (Top View)
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8,1TSR htiwtuptuo/tupniteseR
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7,2KLC htiwtuptuo/tupnikcolC
rotsisernoitanimret
6,3ataD htiwtuptuo/tupniataD
rotsisernoitanimret
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bat DNGnoitcennocdnuorG
Pin Identification and Configuration
14
5
8
Gnd
32
76
GND
Data IN Data OUT
100
Ω
47
Ω
100
Ω
CLK IN
RST IN
Vcc
CLK OUT
RST OUT
32007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Maximum Ratings
Electrical Characteristics (T=25oC)
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DSE
81-/+
21-/+ Vk
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J
521
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C
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po
58+ot04-
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C
erutarepmeTegarotST
GTS
051+ot55-
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C
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MWR
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RB
I
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R
V
MWR
V0.5=1.05.0Aµ
srotsiseRseireSteseRR
TSR
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srotsiseRseireSklCR
KLC
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ATAD
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R
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610242Fp
42007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Typical Characteristics
Typical Insertion Loss S21 (Pin 2 to 7)
Note: Data is taken with a 10x attenuator Note: Data is taken with a 10x attenuator
Normalized Capacitance vs. Reverse Voltage Analog Crosstalk (Each Line)
Typical Insertion Loss S21 (Pin 1 to 8 and Pin 3 to 6)
START . 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 20 dB / REF 0 dB
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
1.1
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Reverse Voltage - VR (V)
CJ(VR) / CJ(VR=0)
f = 1 MHz
START . 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -8.9909 dB
294.402 MHz
2: -19.003 dB
900 MHz
3: -28.966dB
1.8 GHz
4: -30.765 dB
2.5 GHz
5: -30.974 dB
2.7 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
1
2
3
4
5
-42 dB
-48 dB
START . 030 MHz 3
STOP 000
.
000 000 MHz
CH1 S21 LOG 6 dB / REF 0 dB
1: -6.4316 dB
307.466 MHz
2: -14.641 dB
900 MHz
3: -23.808dB
1.8 GHz
4: -28.845 dB
2.5 GHz
5: -30.455 dB
2.7 GHz
0 dB
-6 dB
-12 dB
-18 dB
-24 dB
-30 dB
-36 dB
1
GHz
100
MHz
3
GHz
10
MHz
1
MHz
1
2
3
4
5
-42 dB
-48 dB
ESD Clamping
(+8kV Contact per IEC 61000-4-2)
ESD Clamping
(-8kV Contact per IEC 61000-4-2)
52007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Device Connection
The EClamp2455P designed with ease of layout in
mind. The package has flow through design which
allows the designer to route the signals straight in and
out between the SIM port connector and the SIM
controller. The device is in a 8-pin SLP package.
Electrical connection is made to the 8 pins located at
the bottom of the device. A center tab serves as the
ground connection. Pin connections are noted in
Figure 1. All path lengths should be kept as short as
possible to minimize the effects of parasitic inductance
in the board traces.
Figure 1 - Pin Identification and Configuration
(Top Side View)
Figure 2 - SIM Protection
RST Out
CLK Out
Data Out
RST In
CLK In
Data In
Vcc
1
45
8
Gnd
NC
DATA OUT
RST In
CLK IN
DATA IN
Vcc
EClamp2455P
SIM Card
Connector
SIM Controller
CLK OUT
RST OUT Reset
Clock
Data I/O
5V/3.3V/1.8V
1
45
8
Gnd
DATA OUT
RST In
CLK IN
DATA IN
Vcc
EClamp2455P
SIM Card
Connector
SIM ControllerSIM Controller
CLK OUT
RST OUT Reset
Clock
Data I/O
5V/3.3V/1.8V
1
45
8
Gnd
62007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Applications Information - Spice Model
EClamp2455P Spice Model
EClamp2455P Spice Model & Parameters
GND
Data IN Data OUT
100
Ω
47
Ω
100
Ω
CLK IN
RST IN
Vcc
CLK OUT
RST OUT
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VBIpmA3-E1
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TTces9-E145.2
M--642.0
N--1.1
GEVe11.1
Note: All TVS shown in the circuit use D1 Parameters
72007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Land Pattern - SLP2116P8
Outline Drawing - SLP2116P8
INCHES
.020 BSC
b.008
bbb
aaa
N
D1
L
e
D
.011
.061
DIM
A1
A2
A
MIN
-
.020
0.300.20.012 0.25.010
0.38
1.80
0.28
1.55
.004
.003
8
.013
.083
.067
.015
.071
0.08
0.10
8
0.33
1.70
0.50 BSC
MILLIMETERS
MAX
0.05
0.65
DIMENSIONS
MIN
0.00
NOM
(.005)
.023
.001
MAX
.002
.026
NOM
0.50
.003
(0.13)
0.58
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE TERMINALS.
NOTES:
2.
1.
E1 .010 .016 .020 0.25 0.40 0.50
2.10
1.60.063E
AB
A1
SEATING
C
PLANE
aaa C
bxN
D
E
bbb C A B
e
12
N
PIN 1
INDICATOR
(LASER MARK)
D/2
E/2
LxN
A2
A
2.202.00
.087.079
1.701.50.067.059
D1
E1
THIS LAND PATTERN IS FOR REFERENCE PURPOSES ONLY.
CONSULT YOUR MANUFACTURING GROUP TO ENSURE YOUR
NOTES:
2.
DIM
X
Y
P
G
H
MILLIMETERSINCHES
0.45
.012
.025
.035
.020
.018
0.30
0.63
0.50
0.89
DIMENSIONS
COMPANY'S MANUFACTURING GUIDELINES ARE MET.
2.15.085Z
X
Z
P
Y
G(C)
C(.060) (1.52)
H
K
K .071 1.80
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (ANGLES IN DEGREES).
1.
3. THERMAL VIAS IN THE LAND PATTERN OF THE EXPOSED PAD
SHALL BE CONNECTED TO A SYSTEM GROUND PLANE.
FAILURE TO DO SO MAY COMPROMISE THE THERMAL AND/OR
FUNCTIONAL PERFORMANCE OF THE DEVICE.
82007 Semtech Corp. www.semtech.com
PRELIMINARY
PROTECTION PRODUCTS
EClamp2455P
Contact Information
Semtech Corporation
Protection Products Division
200 Flynn Rd., Camarillo, CA 93012
Phone: (805)498-2111 FAX (805)498-3804
Marking Ordering Information
Tape and Reel Specification
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TCT.P5542pmalCE0003hcnI7
PIN 1
INDICATOR
2455P
YYWW
Device Orientation in Tape
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htdiW )xaM(,BD1DE F
K
)XAM( P0P2P)XAM(TW
mm8 mm2.4
)561.(
mm1.0+5.1
mm0.0-
500.+95.0(
)000.-
mm8.0
50.0±
)130.(
01.±057.1
mm
)400.±960.(
50.0±5.3
mm
)200.±831.(
mm4.2
)490.(
1.0±0.4
mm
-00.±751.(
)4
1.0±0.4
mm
-00.±751.(
)4
-m50.0±0.2
m
)200.±970.(
mm4.0
)610.(
mm0.8
mm3.0+
mm1.0-
)210.±213.(
Pin 1 Location
User Direction of feed
This is a lead-free RoHS/WEEE Compliant Device
EMIClamp and EClamp are marks of Semtech Corporation
YYWW = Date Code
0A0B0K
mm01.0-/+69.1mm01.0-/+13.2mm01.0-/+47.0