– 388 –
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
E
1
Product Code
Micro Chip Fuse
Structure
Rectangular type
Product shape
3216 size
(3.2 mm҂1.6 mm)
Packaging Type
Code
Punched Carrier Taping
4mmpitch, 5,000 pcs.
R
2
B
3
R
4
D
5
1
6 7
R
8
0
9
0
10
X
V
R
G
1608 size
(1.6 mm҂0.8 mm)
E
Rated Current (A)
0R25
0R31
0R37
0R50
0R75
1R00
1R25
0.25 A
0.315 A
0.375 A
0.50 A
0.75 A
1.0 A
1.25 A
1R50
2R00
2R50
3R00
4R00
5R00
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
1005 size
(1.0 mm҂0.5 mm)
DPressed Carrier Taping
2mmpitch, 10,000 pcs. ERBRD
ERBRE
ERBRG
X
Almina Substrate
Fusing Element Electrode
(Outer)
Protective Coating Electrode (Base)
a
b
t
W
L
Micro Chip Fuse
Type: ERBRD
ERBRE
ERBRG
■Explanation of Part Numbers
■Features
● Small size
● Fast-acting and withstanding in-rush current characteristics
■Construction ■Dimensions in mm (not to scale)
Type
(inch size)
Dimensions (mm)
Mass (Weight)
(g/1000 pcs.)
LWa b t
ERBRD
(0402) 1.00±0.10 0.50+0.10 0.15±0.10 0.25±0.10 0.39
±0.10 0.7
ERBRE
(0603) 1.60±0.15 0.80+0.15 0.24±0.15 0.30±0.15 0.54
±0.10 2.2
ERBRG
(1206) 3.20±0.20 1.60±0.15 0.30±0.20 0.55±0.20 0.65±0.10 10
-0.05
-0.05
■Approved Safety Standards
UL248-14 : File No.E194052
c-UL C22.2 No.248-14 : File No.E194052
Sep. 201000
●RoHScompliant
– 389 –
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
■Ratings
● 1608 (0603 inch) size (Type ERBRE)
Part No. ERBRE첸R첸첸V
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00 5R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0 5.0
Marking Code F G H J K N O P S T
Internal R (m액) at 25 °C max.
330 190 125 94 72 51 40 33 22 19
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 32 VDC
Interrupting Rating
(at Rated Voltage) 50 A
Category Temp. Range −40 °C to ＋125 °C
● 1005 (0402 inch) size (Type ERBRD)
Part No. ERBRD첸R첸첸X
0R25 0R31 0R37 0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00
Rated Current (A) 0.25 0.315 0.375 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0
Marking Code V X Y F G H J K N O P
Internal R (m액) at 25 °C max.
700 520 440 310 190 125 82 70 53 42 37
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 32 VDC
Interrupting Rating
(at Rated Voltage) 35 A
Category Temp. Range −40 °C to ＋125 °C
Part No. ERBRG첸R첸첸V
0R50 0R75 1R00 1R25 1R50 2R00 2R50 3R00 4R00
Rated Current (A) 0.5 0.75 1.0 1.25 1.5 2.0 2.5 3.0 4.0
Marking Code F G H J K N O P S
Internal R (m액) at 25 °C max.
560 340 210 175 115 85 65 45 35
Fusing Current/Fusing Time
(at 25 °C)
Rated Current ҂100 %/4 hours min.
Rated Current ҂200 %/5 seconds max.
Rated Current ҂300 %/0.2 seconds max.
Rated Voltage
(Open Circuit Voltage) 63 VDC 32 VDC
Interrupting Rating
(at Rated Voltage) 50 A
Category Temp. Range −40 °C to ＋125 °C
● 3216 (1206 inch) size (Type ERBRG) Mass production : April 2011
✽
The thin type is available about 1005 (0402 inch) size. Please contact us for details.
✽
Please contact us when another rated current is needed.
Dec. 201001
– 390 –
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
TT
A
P0
P2
P1
P1
φD0
B
F
W
E
(2mmpitch)
Pressed
Carrier
Punched
Carrier
φN
W2
W1
φA
φC
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10 100
Fusing Time (s)
0.0001
0.001
0.01
0.1
10
1
0.1 1 10
Fusing Current (A) Fusing Current (A)
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
5.0 A
● 1608 (0603 inch) size
(Type ERBRE)
● 1005 (0402 inch) size
(Type ERBRD)
0.5 A
0.25 A
0.315 A
0.375 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
100
Fusing Time (s)
0.0001
0.001
0.01
0.1
1
10
0.1 1 10
Fusing Current (A)
● 3216 (1206 inch) size
(Type ERBRG)
0.5 A
0.75 A
1.0 A
1.25 A
1.5 A
2.0 A
2.5 A
3.0 A
4.0 A
✽ Reference Only
✽ Reference Only
✽ Reference Only
–0
■Fusing Characteristics (25 °C typical)
● Carrier Taping ● Taping Reel
■Packaging Methods
● Standard Quantity
Type A B W F E
ERBRD 0.68±0.10 1.20±0.10
8.00±0.20 3.50±0.05 1.75±0.10
ERBRE 1.05±0.10 1.85±0.10
ERBRG 2.00±0.15 3.60±0.20
Type Kind of Taping Pitch (P1) Quantity
ERBRD Pressed Carrier Taping 2 mm 10000 pcs./ reel
ERBRE Punched Carrier Taping 4 mm 5000 pcs./ reel
ERBRG
(Unit : mm)
Type P1P2P0φD0T
ERBRD 2.00±0.10
2.00±0.05 4.00±0.10 1.50+0.10
0.67±0.07
ERBRE 4.00±0.10 0.78±0.07
ERBRG 0.84±0.07
(Unit : mm)
Type φAφNφCW
1W2
ERBRD
ERBRE
ERBRG
180.0–1.5 60–0 13.0±0.2 9.0–0 11.4±1.0
+0 +1.0 +1.0
Sep. 201000
– 391 –
Micro Chip Fuse
Design and specifi cations are each subject to change without notice. Ask factory for the current technical specifi cations before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
C
A
B
Preheating
Peak
Heating
Temperature
Time
The following are precautions for individual products. Please also refer to the common precautions shown on page 4
of this catalog.
1. Set the rated current so that the current passing through the Micro Chip Fuses (hereafter called the fuses)
under normal conditions is within 70% of the rated current.
2. Do not continuously pass a current exceeding the rated current through the fuses.
3. If a pulse exceeding the rated current is applied, such as a rush current or surge current at power-on, take
care not to cause unwanted fusing. Calculate the I2t value of the pulse and check the tolerance to the number
of pulses according to the I2t-t characteristic curve before deciding to use the fuses. Before checking the
tolerance, consult our sales staff in advance.
4. The fuses are designed to be blown out by a current that is double or greater than the rated current. Ensure
that the abnormal current generated when a circuit abnormality occurs in your product is at least double or
greater than the rated current of the fuses. In addition, ensure that the abnormal cur rent of your product does not
exceed the maximum interrupting current of the fuses.
5. The fuses are designed to be used on the secondary side of a power supply. Do not use them on the primary
side.
6. Ensure that the voltage applied to the fuses are within their rated voltage.
7. The fusing characteristics of the fuses are affected by the ambient temperature. Before use, mount the fuses
on your products and carefully check and evaluate their category temperature range.
Safety Precautions
■Recommended Land Pattern
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Type
(inch size)
Dimensions (mm)
ABC
ERBRD(0402) 0.5 to 0.6 1.4 to 1.6 0.4 to 0.6
ERBRE(0603) 0.7 to 0.9 2.0 to 2.2 0.8 to 1.0
ERBRG(1206) 2.0 to 2.4 4.4 to 5.0 1.2 to 1.8
Temperature Time
Preheating 140 °C to 160 °C 60 s to 120 s
Main heating Above 200 °C 30 s to 40 s
Peak 235 ± 5 °C max. 10 s
Temperature Time
Preheating 150 °C to 180 °C 60 s to 120 s
Main heating Above 230 °C 30 s to 40 s
Peak max. 260 °C max. 10 s
For soldering For lead-free soldering
Temperature TimeTemperatureTime
Preheating 140 °C to 180 °C 60 s to 120 s 150 °C to 180 °C 60 s to 120 s
Soldering 245 ± 5 °C 20 s to 30 s max. 260 °C max. 10 s
■Recommended Soldering Conditions
Recommendations and precautions are described below.
●Recommended soldering conditions for refl ow
For soldering (Example : Sn/Pb)
For lead-free soldering (Example : Sn/Ag/Cu)
●Recommended soldering conditions for fl ow
· Refl ow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specifi ed.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability be fore ac tu al use.
Sep. 201000
– 4 –
Safety Precautions
(Common precautions for Fixed Resistors, Noise Suppression Device, ESD Suppressor, fuses, and MR Sensors)
•When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifi cations with us in advance. The design and specifi cations in this catalog are subject
to change without prior notice.
•Do not use the products beyond the specifi cations described in this catalog.
•This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
•Install the following systems for a failsafe design to ensure safety if these products are to be used in equip ment
where a defect in these products may cause the loss of human life or other signifi cant dam age, such as damage to
vehicles (automobile, train, vessel), traffi c lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽Systems equipped with a protection circuit and a protection device
✽Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a sin gle fault
(1) Precautions for use
•These products are designed and manufactured for general and standard use in general elec tron ic equipment
(e.g. AV equipment, home electric appliances, offi ce equipment, information and communication equipment)
•These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
•These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components (except Thermal Cutoffs).
•Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or infl ammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
•Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble fl ux may deteriorate the
performance or reliability of the products.
•Carefully select a fl ux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of ar riv al
at your company, provided that they remain packed as they were when delivered and stored at a tem per a ture
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %.
The performance of EMI Filters is guaranteed for 6 months or a year after our delivery, provided that they are stored
at a temperature of -5 °C to +40 °C and a relative humidity of 40 % to 60 %. Check the guarantee period in the
specifi cations. The performance of Thermal Cut offs is guaranteed for a year after our delivery, provided that they are
stored at a temperature of -10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Sep. 201000