Preliminary Edition
2015 Microchip Technology Inc.
page 1
BM23 Bluetooth®
Evaluation Board User’s Guide
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
page 2
Index
Preface ........................................................................................................................................ 4
1 OVERVIEW .............................................................................................................................. 6
1.1 INTRODUCTION................................................................................................................................................ 6
1.2 BM23 EVALUATION BOARD FEATURES ........................................................................................................ 7
1.3 BM23 EVALUATION BOARD CONTENTS ........................................................................................................ 8
1.4 BM23 EVB KIT CONTENTS ............................................................................................................................ 10
2. Getting Started ..................................................................................................................... 11
2.1 INTRODUCTION.............................................................................................................................................. 11
2.2 HARDWARE REQUIREMENTS ...................................................................................................................... 11
2.2.1 Hardware Setup ................................................................................................................. 11
2.2.2 Using Evaluation Board .................................................................................................... 11
2.3 APPLICATION DEMONSTRATION ................................................................................................................. 11
2.3.1 AUDIO DEMONSTRATION (A2DP) ............................................................................. 11
2.3.2 HSP/HFP DEMONSTRATION ........................................................................................ 13
2.4 SOFTWARE CUSTOMIZATION .................................................................................................................... 14
2.4.1 UI Tool .............................................................................................................................. 14
2.4.2 DSP TOOL ........................................................................................................................ 19
2.4.4 EEPROM Parameters Update ........................................................................................... 27
2.5 MODULE CONFIGURATION ........................................................................................................................... 29
APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS ....................................... 30
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
page 3
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Web site at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
•
Microchip’s Worldwide Web site; http://www.microchip.com
•
Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer Notification System
Register on our web site at www.microchip.com to receive the most current information on all of our products.
Abbreviations List:
AVRCP: Audio Video Remote Control Profile
A2DP: Advanced Audio Distribution Profile
HFP: Hands-free Profile
HSP: Headset Profile
NFC: Near Field Communication
SPP: Serial Port Profile
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
page 4
Preface
NOTICE TO CUSTOMERS
All documentation becomes dated, and this manual is no exception. Microchip tools
and documentation are constantly evolving to meet customer needs, so some actual
dialogs and/or tool descriptions may differ from those in this document. Please refer to
our web site
(www.microchip.com) to obtain the latest documentation available.
INTRODUCTION
This chapter contains general information that will be useful to know before using the
BM23. Items discussed in this chapter include:
Document Layout
Recommended Reading
The Microchip Web Site
Customer Support
Document Revision History
DOCUMENT LAYOUT
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. The document is organized as
follows:
Chapter 1. “Overview” – This chapter introduces the BM23 Bluetooth Evaluation Board and provides an
overview of various features.
Chapter 2. “Getting Started” – This chapter describes
The hardware components and setup of the BM23 Bluetooth Evaluation Board.
The application demonstrations of the BM23 Bluetooth Evaluation Board.
Software/Utility Requirements of the BM23 Bluetooth Evaluation Board.
Appendix A. “BM23 Audio Evaluation Board Schematics” – This appendix includes a schematic of the
BM23 Bluetooth Evaluation Board.
RECOMMENDED READING
This user’s guide describes how to use the BM23 Bluetooth Evaluation Board. Other useful documents are
listed below. The following Microchip documents are available and recommended as supplemental reference
resources:
STEREO Module Data Sheet (BM20/23 Data Sheet)
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
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MICROCHIP WEBSITE
Microchip provides online support via our web site at http://www.microchip.com. This website is used as a
means to make files and information easily available to the customers. Accessible by using your favorite
Internet browser, the website contains the following information:
Product Support – Data sheets and errata, application notes and sample programs, design resources,
user’s guides and hardware support documents, latest software releases and archived software
General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online
discussion groups, Microchip consultant programmer listing
Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of
seminars and events, listings of Microchip sales offices, distributors and factory representatives
CUSTOMER SUPPORT
Users of Microchip products can receive assistance through several channels:
Distributor or Representative
Local Sales Office
Field Application Engineer (FAE)
Technical Support
Customers should contact their distributor, representative or Field Application Engineer (FAE) for support.
Local sales offices are also available to help customers. A listing of sales offices and locations is included in
the back of this document. Technical support is available through the website at:
http://support.microchip.com
DOCUMENT REVISION HISTORY
Revision A (Aug 2015)
This is the initial released version of this document.
Revision 1.0 : Added details of V4 EVB
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1 OVERVIEW
1.1 INTRODUCTION
This user’s guide describes the hardware and software setup for the BM23 Bluetooth® Evaluation Board.
This board contains the hardware needed to evaluate the BM23 Bluetooth module. The BM23 module is
mounted to an evaluation board that demonstrates the module’s key features. The evaluation board contains:
PIC18 MCU and YAMAHA YDA174 DSP on board
12 push buttons to control audio playback
Status LEDs
The BM23 supports the following Bluetooth profiles: A2DP, AVRCP, and HFP/HSP
A2DP stereo audio (Sink mode support for Sub-Band Coding (SBC)),
AVRCP media player remote control
HFP/HSP for accepting a phone call support.
For data sheet and other details related to BM23 module, refer to the Microchip website at
http://www.microchip.com/bm23.
This chapter discusses the following topics:
BM23 Evaluation Board Features
BM23 Evaluation Board Contents and Part Details
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1.2 BM23 EVALUATION BOARD FEATURES
The BM23 Evaluation Board has the following features:
It includes a Bluetooth module (BM23), MCU (PIC18) and DSP (YDA174) on the board for easy
function and feature demonstration.
BM23 module is a fully qualified Bluetooth version 4.1, fully compatible with Bluetooth version 3.0, 2.0,
1.2.
Embedded BM23 module with postage-stamp size form factor of 15 x 29 x 2.5 mm (include shielding
case)
Embedded Bluetooth stack profiles: A2DP, AVRCP, and HFP/HSP, Bluetooth SIG certified.
System gets power from 15V / 3A DC adapter for speaker application.
Environmentally friendly, RoHS compliant
Keypad matrix on board and controlled by MCU, easy for playback control (play/pause, Vol Up/Down,
forward/rewind, Next/previous track etc.).
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EVALUTATION BOARD USER’S GUIDE
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1.3 BM23 EVALUATION BOARD CONTENTS
BM23 Evaluation Board contains the following components as shown in Figure 1-1 which describes the
evaluation board’s interfaces and connectors. Table 1-1 describes the various components of the evaluation
board.
FIGURE 1-1: BM23 EVALUATION BOARD
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MIC (JP23) ICSP (J5)
Pin
Description
Pin
Description
1
MIC_P1
1
Reset
2
AGND
2
ICD3 power
3
MIC_N1
3
GND
4
PGD
5
PGC
6
NC
TABLE 1-1:BM23 EVALUATION BOARD HARDWARE
Hardware Component
Description
BM23
Bluetooth® 4.1 Module
YDA174
DSP with internal digital amplifier
PIC18F85J10
16 bit MCU with 32k byte flash and 2048 bytes SRAM.
MCP2200
UART-USB converter chip
Micro USB Connector
USB to UART for EEPROM R/W for BM23.
15V Adapter Jack
Connect to 15V adapter (P2) for main power source of whole system.
Amplifier Audio Out
Audio connector (JP6 / 7) from YDA174
Audio In
Audio 3.5 mm jack for Mono microphone input(P6) and AUX input(P8)
Status LEDs
Red and Blue LEDs show the pairing/connection status
MFB Button
Switch to turn on/off BM23 module (SW24)
Play/Pause Button
Button to play or pause the audio playback (SW31)
Previous Track Button
Button to skip track backwards (SW23)
Next Track Button
Button to skip track forwards(SW45)
Volume Up Button
Button to increase volume (SW27)
Volume Down Button
Button to decrease volume (SW28)
Pairing Button
Button to make BM23 into pairing mode (SW34)
Sound Effect Button
Button to change sound effect (SW35)
Reset Button
Reset BM23 (SW10); Reset MCU (SW1)
1 2 3
1
2
3
4
5
6
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1.4 BM23 EVB KIT CONTENTS
BM23 EVB kit include: BM23 EVB board, 15V adapter, micro USB cable and 2 speaker cables as shown in
Figure 1-2.
FIGURE 1-2: BM23 EVB KIT
1) 15V adapter: main power source of the whole system.
2) USB cable: micro USB cable can connect to P3 of BM23 EVB board to do firmware update on
BM23.
3) Speaker cable: connect speaker to BM23 EVB J6 and J7.
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2. Getting Started
2.1 INTRODUCTION
This chapter describes how the BM23 Evaluation Board works. Certain hardware and utilities are essential to
support the evaluation/development of demo applications. This chapter discusses the following topics:
Hardware Requirements
Software/Utility Requirements
Module Configuration
2.2 HARDWARE REQUIREMENTS
2.2.1 Hardware Setup
To setup the evaluation hardware, perform the following steps:
1. Make sure pin 1 / 2 / 3 of “SW9” in “Off / Off / On” to make system in application mode.
2. Connect the speaker line to the amplifier output connector (J6 / 7).
2.2.2 Using Evaluation Board
1. Connect 15V adapter P2.
2. Connect speaker to J6 and J7.
3. Long press MFB button (SW24) to turn-on and enter pairing mode. The status LEDs will blink.
4. Press and hold Pairing button (SW34). Blue and Red LED will flash alternately. Release the Pairing
button. Now the BM23 Evaluation board is discoverable.
5. Turn on Bluetooth device manager on a host device (PC or smartphone), the host device will
display a list of discoverable Bluetooth devices. Select the BM23-002 EVB and connect with it.
6. If the pairing with the device is successful, BM23 evaluation board is connect to the host device.
Once connected, BM23 evaluation board enables Advanced Audio Distribution Profile (A2DP) for
audio playback and Audio Video Remote Control Profile (AVRCP) for player control.
7. Play music and the host device and listen the music on the speaker. This will demonstrate A2DP.
8. If host device is cell phone, call you cell phone from another phone. Accept the incoming phone call
on your paired and connected cell phone. This will demonstrate HFP.
2.3 APPLICATION DEMONSTRATION
2.3.1 AUDIO DEMONSTRATION (A2DP)
In this demonstration, user can play an audio stream on both BM23 evaluation boards using a computer or
smartphone. The following are the steps to perform the demonstration.
1. Connect BM23 evaluation board to a host device (PC or smartphone) that has an audio source.
2. Connect speakers to BM23 evaluation board J6 / 7.
3. Open the audio source on the host device. Microchip recommends using media player (e.g. Microsoft
BM23 BLUETOOTH
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Media Player, iTunes, and Android).
4. Start the audio stream on the media player.
When BM23 evaluation board is connected to an audio source compatible with Bluetooth AVRCP, the
following audio control buttons can be used:
Control the volume of audio output (Vol+ (SW27), Vol- (SW28)).
Go to the previous track(SW23)
Go to the next track(SW45)
Start / stop playing the current track (SW31).
FIGURE 1-2: BM23 EVALUATION BOARD AUDIO CONTROL BUTTONS
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2.3.2 HSP/HFP DEMONSTRATION
In this demonstration, user can explore the hands-free profile setting to receive an incoming voice call from a
paired smartphone. This demonstration requires a microphone. It would be good to use a PC
headset/microphone (with two-plugs). The following are the steps to perform the demonstration.
1. Connect the speakers / microphone to BM23 evaluation board’s audio out connector (J6/7) and MIC
input (P6) respectively.
2. Connect BM23 evaluation board to a smartphone that supports the A2DP and HFP/HSP Bluetooth
profiles.
3. From another one phone, initiate a call to the smartphone that is paired with BM23 evaluation board. The
A2DP stream pauses and the ringtone plays on the speakers.
4. Click button “MFB” on BM23 evaluation board to accept the incoming call.
5. Once phone call is terminated, A2DP stream resumes.
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2.4 SOFTWARE CUSTOMIZATION
User can customized UI and DSP settings according to their requirements. These settings can then be
merged along with patch code to create IISC patch file (*.ipf). This patch file then programmed into EEPROM.
Process of patch file creation is given below.
Tools needed for customization
UI Tool: user can use this tool to create customize Bluetooth behavior like button functionality, Bluetooth
name etc.
DSP Tool: user can use this tool to modify audio parameter.
MPET Tool: user can use this tool to merge UI, DSP and patch code. Details about Patch code will be
provided latter section.
EEPROM Tool: user can use this tool to upgrade the merged parameter into EEPROM of BM23.
All these tools can be obtained from www.microchip.com/bm23 or through FAE.
2.4.1 UI Tool
Step1. Open UI tool
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Step2. Load appropriate default UI setting (included in UI tool package) or previous saved file.
Step3. Click “Edit” to modify the settings.
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Step4. In the main settings, profile can be enabled/disabled by checking/unchecking the box as shown below.
Click “Next” for other setting.
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Step5. You can do system and functional setting in these pages.
Click “Help” you can get more detail information.
Step6. After finish parameter selection, click “Finish” button and a message will remind you check EEPROM
size on your system.
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Step7. Click “Save” button to save these UI parameters as a “.txt” file
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2.4.2 DSP TOOL
Step1. Open DSP tool
Step2. Select IC version ““IS2020_XXX_SHS” (XXX is the version of chip, e.g. IS2023S-002)
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Step3. You can setup all voice and audio function in these pages.
Step4. Click “Save” button to save these DSP parameters as a “.txt” file after finish all DSP
setting.
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
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2015 Microchip Technology Inc.
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2.4.3 MERGE TOOL
Step1. Open MPET tool, click “Next” to set up.
Step2. Select “UI Patch Only” to use full EEPROM table to merge UI and DSP parameter.
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Step3. Select the bin file (full EEPROM table) and click “Next”
Step4. If the bin file includes UI/DSP/patch code, you can see them as shown in the above figure. If you
want to keep any one of them in your customization, you can select that and use “pull down” button (2) to
add them to merge list. For adding customized parameters, you can use add button (+) (3) to add new
parameters (e.g. UI/DSP parameters), into tool to merge with EEPROM table.
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Step5. Select output path and choose a file name for the merged EEPROM table.
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Step6. Click “Next” and choose Merge Default Bin to Patch (Patch File, *.ipf) as shown in the following
picture and then Click “Next”. “Generate” button to generate the new EEPROM table.
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Step7. Click Generate button
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Step8. Select all as shown below and then click Next.
Step9. Now you have a merged patch file (*.ipf file).
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2.4.4 EEPROM Parameters Update
Step1. Make sure SW9 in “ROM TEST” mode. Mode switch (1/2/3 – on/off/on)
Step2. Connect EVB “P1” port and PC by USB cable. LED1 & LED2 on EVB will keep lighting.
Step3. Run the E2PROM_tool.exe program and a window will be come up as below
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Step4. Specify the COM Port (1). Click IC/Module (2) Identify to know IC version of BM23. This is useful to
prevent IC version mismatch.
Step5. Press ”Browse” (3) to choose the *.ipf file (created in section 2.4.3) and click Write(4)
Step6. After data update is completed, remove USB cable and make SW9 to “ROM APP”(mode Switch 1/2/3
off/off/on) mode and power cycle.
EVB will be using new setting from EEPROM. Follow section 2.0 to see the effect of parameter
customization.
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2.5 MODULE CONFIGURATION
2.5.1 Mode Settings
Setting in Mode Switch:
Mode
SW9 Setting
Switch 9 PIN Definition
ROM Test Mode
1: ON (P2_0: LOW)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
Application Mode
1: OFF (P2_0: HIGH)
2: OFF (P2_4: HIGH)
3: ON (EAN: HIGH)
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APPENDIX A. BM23 AUDIO EVALUATION BOARD SCHEMATICS
EVB block diagram
Key Button Matrix:
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MIC_P1
MIC1
C20
2.2u/6.3V
R11
1K
1 2
R13
1K
1 2
C22
2.2u/6.3V
MIC_BIAS
JP23
JP 1x3
1
2
3C27
220p/50V
R14
2K
1 2 C29
0.1u/10V
C28
0.1u/10V
P6
PJ-2001-5K
1
2
3
4
5
P2_0
EAN
P2_4
RST_N
P1_5
P3_0
BAT_IN
P0_0
C5
10u/16V
GD
S
Q1
STS2301
13
2
5V
R6
1K/1%
12
BAT_IN
R119
20K
12
Break +3.3V to BAT_IN trace
When 5V insert.
AIL
MIC_N1
MIC_P1
C59
10u/16V
CODEC_VO
C2
0.1u/10V
C52
1u/16V
R29
1K
12
5V
SYS_PWR RST_N
AIR
P1_5
C54
4.7u/10V
MIC_BIAS
3V3
VDD_IO
SYS_PWR
MFB
RFS0
SCLK0
DR0
DT0
PCB1
FP-BM23
P0_0
1
RFS0
2
TFS0
3
SLK0
4
DR0
5
DT0
6
P0_4
7
EAN
8
MIC1_P
9
MIC1_N
10
MIC_BIAS
11
VDDA
12
AIR
13
AIL
14
GND
15
SYS_PWR
25 AMB_DET
24 BAT_IN
23 ADAP_IN
22 P0_1
21 P1_5
20 VDD_IO
19 NC
18 NC
17 RST
16
GND 40
P2_0 39
P3_0 38
P2_0 37
P2_7 36
P0_5 35
HCI_RXD 34
HCI_TXD 33
P0_3 32
P0_2 31
P2_4 30
LED2 29
LED1 28
MFB 27
BK_OUT 26
TFS0
JP11
JP 1x2
1
2
DGND
HCI_TXD
HCI_RXD
P3_0
LED2
LED1
F2
Footing
1
F4
Footing
1
F3
Footing
1
F1
Footing
1
Board Name
Size Title Rev
Dat e: Sheet of
P/N
MAIN CIRCUIT 4.0
BM23 EVB
B
4 8Thursday, October 01, 2015
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
U7
G691L293
GND 1
RST 2
VCC
3
R64
1K
1 2
RESET
RST_N
SW10
TS08M-PF
21
VDD_IO
LED2
LED1
LED2 C7
0.1u/10V
LED2 LED-HR
12
LED1 LED-B
12
LED3
SYS_PWR
LED1
LED3 LED-G
12
P2_4
C50
1u/16V
C38
1u/16V
R36
NP-0402R38
0
1 2
R37
NP-0402
R32
0
1 2
C51
NP-0402
AIR
C47
NP-0402
P3_0 AILLINE_L
LINE_R
LINE INPUT
C26
0.1u/10V
P8
TSH-3865D
4
3
2
10
1
MIC_N1
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VDD_IO
ON
SW9
SW-3BIT
1
2
3
4
5
6
R9
4K7
12
R8
4K7
12
R7
10 12 EAN
P2_4
P2_0
C12
1u/16V C18
10u/16V
VBUS
D-
D+
ID
GND
P3
UCB02SB3021-99R
1
2
3
4
5
6
89
7
1011
R69
1K
12
5V
D-
D+
D1
LED-HR
12
D18
CDSU400B
1 2
Board Name
Size Title Rev
Date: Sheet of
P/N
HCI INTERFACE 4.0
BM23 EVB
A
5 8Wednesday, July 22, 2015
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
D-
D+ EXT_3V3
TX
RX
C19
12p/50V
C21
12p/50V
C24
0.1u/16V
U10
MCP2200
VDD
1
OSC1
2
OSC2
3
RST
4
GP7/TxLED
5
GP6/RxLED
6
GP5
7
GP4
8
GP3
9
TX
10 RTS 11
RX 12
CTS 13
GP2 14
GP1/USBCFG 15
GP0/SSPND 16
VUSB 17
D- 18
D+ 19
VSS 20
C62
0.1u/16V
X1
X4P-12MHZ
4
13
2
R91
3K
1 2
R92
3K
1 2
HCI_TXD
HCI_RXD
EXT_3V3
5V
C23
0.1u/16V
R20
10K
12
RST_N
R21
470
1 2
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TP1
1TP2
1TP3
1TP4
1TP5
1
TP6 1
TP7 1
TP8 1
TP9 1
TP10
1
TP11
1
TP12
1
J6 HDR 1x2
1
2
U18
MCP1824T
VIN
1
SHDN
3ADJ 4
VOUT 5
GND
2
J7 HDR 1x2
1
2
R124
3K/1%
12
R125
10K
12
(0.41V)
(RT9179
pin compatible)
DSP/MCU INTERFACE
U17
APL1117-33VC
ADJ/GND
1
OUT
2
IN
3
3V3
C15
10u/16V
C16
10u/16V
C14
10u/16V
C17
10u/16V
1V8
G
G
X2
XTL571300-L118-045
4
13
2
SLK0_DSP
DT0_DSP
1V8
C10
1u/50V
DSP_IC_N
OUTML
R93
100K
12
C96
0.1u/16V
R4
47K
12
C97
1u/50V
1V8
1V8 OUTPL
3V3 DSP_SLEEP
C98
0.1u/16V
C6
1u/16V
R94
1M
12
R95 220
1 2
DSP_PROT_N
R15
4K7
12
R97
4K7
12
3V3
DSP_P1_2
3V3
C100
10u/16V
DC_AMP
DSP_P1_3
3V3
C11
0.1u/16V
DSP_IRQ_N
OUTPR
C101
10p/50V
C102
10p/50V
3V3
R99
47K
12
3V3
C1
0.1u/16V
R100
47K
12
DSP_MUTE
C103
0.1u/16V
OUTMR
P2 DC-JACK
1
2
3
DGND
3V3
YDA174A30
U2
YDA174A30
DVDD18
1
GPIO6
2
GPIO5
3
GPIO4
4
GPIO3
5
DVSS
6
GPIO2
7
GPIO1
8
GPIO0
9
PLLVDD
10
IC_N
11
PLLVSS
12
XIN
13
XOUT
14
IOVDD
15
SCL
16
SDA
17
DVDD18
18
IRQ_N
19
OPEN
20
PROT_N
21
SLEEP_N
22
MUTE_N
23
TESTr
24
OPEN 36
PVDDPL 35
OUTPL 34
PVSSL 33
OUTML 32
PVDDML 31
PVDDMR 30
OUTMR 29
PVSSR 28
OUTPR 27
PVDDPR 26
OPEN 25
EP 49
GPIO7 48
IOVDD 47
GPIO8 46
GPIO9 45
GPIO10 44
GPIO11 43
TESTb 42
DVSS 41
OPEN 40
DVSS 39
REFA 38
AVSS 37
R12
100K
12
DC_AMP
RFS0_DSP
+C32
1000u/50V
12
DC_AMP
(15V)
OUTML
OUTPL
SPKOUT
C25
0.1u/50V
C106
0.1u/50V
C107
0.22u/16V
C134
1u/50V
DC_AMP
C8
1u/50V
DC_AMP
I2S INTERFACE
DT0_DSP
RFS0_DSP
SLK0_DSP
DR0_DSP
R17 33
1 2
R118 33
1 2 TFS0_DSP
R22 33
1 2
R18 33
1 2
R19 33
1 2
Board Name
Size Title Rev
Date: Sheet of
P/N
DSP_YDA174 4.0
BM23 EVB
B
6 8Wednesday, July 22, 2015
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
RFS0
SCLK0
TFS0
DR0
DT0
D15
CDSL4148
2 1
D14
CDSL4148
2 1
DC_AMP
D17
CDSL4148
2 1
D16
CDSL4148
2 1
L4 L22uH
1 2
L3 L22uH
1 2
DSP_PROT_N
DSP_MUTE
DSP_SLEEP
DSP_IRQ_N
DSP_IC_N
DSP_MUTE
DSP_SLEEP
DSP_IC_N
DSP_P1_3
DSP_P1_2 DSP_P1_2
DSP_P1_3
DSP_PROT_N
DSP_IRQ_N
C104
0.1u/50V
C105
0.1u/50V
C30
0.22u/16V
OUTMR
OUTPR L6 L22uH
1 2
L5 L22uH
1 2
+C133
1000u/50V
12
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
page 34
MCU_P70
MCU_P71
R122 3K
1 2
R123 3K
1 2
HCI_RXD
HCI_TXD
G
D
S
Q2
STS2306
3
1
2
R126
2K
12
R127
1K
12
5V
RST_N
RST_PIC18
G
D
S
Q3
STS2306
3
1
2
ICD3_PWR
RST_N
R128
1K
12
(Reset PIC18 when connect to USB)
(Reset BT when connect to ICD3)
JP33
JP 1x2
1
2
PGD
RESET
3V3
PGC
J5
JP 1x6
1
2
3
4
5
6
ICSP
Board Name
Size Title Rev
Date: Sheet of
P/N
MCU_PIC18 4.0
BM23 EVB
B
7 8Wednesday, July 22, 2015
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
ICD3_PWR
C4
10p/50V
(MFB/RX_IND)
(TX_IND)
(UART_TXD)
(UART_RXD)
C125
0.1u/25V C126
0.1u/25V
X4
XTAL-32.768KHZ
1 2
3
DP1
DP-4
2 1 C114
15p/50V
C120
15p/50V
T1OSO
T1OSI
DP2
DP-4
2 1
C3
10p/50V
PIC18F85J10
U13
PIC18F85J10
RH2/A18
1
RH3/A19
2
RE1/AD9/WR/P2C
3
RE0/AD8/RD/P2D
4
RG0/ECCP3/P3A
5
RG1/TX2/CK2
6
RG2/RX2/DT2
7
RG3/CCP4/P3D
8
MCLR
9
RG4/CCP5/P1D
10
VSS
11
VDDCORE/VCAP
12
RF7/SS1
13
RF6/AN11
14
RF5/AN10/CVREF
15
RF4/AN9
16
RF3/AN8
17
RF2/AN7/C1OUT
18
RH7/AN15/P1B
19
RH6/AN14/P1C
20
RH5/AN13/P3B
21
RH4/AN12/P3C
22
RF1/AN6/C2OUT
23
ENVREG
24
AVDD
25
AVSS
26
RA3/AN3/VREF+
27
RA2/AN2/VREF-
28
RA1/AN1
29
RA0/AN0
30
VSS
31
VDD
32
RA5/AN4
33
RA4/T0CKI
34
RC1/T1OSI/ECCP2/P2A
35
RC0/T1OSO/T13CKI
36
RC6/TX1/CK1
37
RC7/RX1/DT1
38
RJ4/BA0
39
RJ5/CE
40
RJ2/WRL 60
RJ3/WRH 59
RB0/INT0/FLT0 58
RB1/INT1 57
RB2/INT2 56
RB3/INT3/ECCP2/P2A 55
RB4/KBI0 54
RB5/KBI1 53
RB6/KBI2/PGC 52
VSS 51
OSC2/CLKO 50
OSC1/CLKI 49
VDD 48
RB7/KBI3/PGD 47
RC5/SDO1 46
RC4/SDI1/SDA1 45
RC3/SCK1/SCL1 44
RC2/ECCP1/P1A 43
RJ7/UB 42
RJ6/LB 41
RH1/A17 80
RH0/A16 79
RE2/AD10/CS/P2B 78
RE3/AD11/P3C 77
RE4/AD12/P3B 76
RE5/AD13/P1C 75
RE6/AD14/P1B 74
RE7/AD15/ECCP2/P2A 73
RD0/AD0/PSP0 72
VDD 71
VSS 70
RD1/AD1/PSP1 69
RD2/AD2/PSP2 68
RD3/AD3/PSP3 67
RD4/AD4/PSP4/SDO2 66
RD5/AD5/PSP5/SDI2/SDA2 65
RD6/AD6/PSP6/SCK2/SCL2 64
RD7/AD7/PSP7/SS2 63
RJ0/ALE 62
RJ1/OE 61
C127
0.1u/25V
RESET DSP_PROT_N
DSP_IRQ_N
DSP_P1_3
MCU_P44
MCU_P45
MCU_P46
DSP_MUTE
DSP_P1_2
SW1
SW-TACT
12
34 RESET
3V3
C128
0.1u/25V
R112
100/1%
1 2
DSP_SLEEP
MCU_P72
P77
DSP_IC_N
MFB
P0_0
(Audio AMP Enable)
(RESET_n)
P3_0
P1_5
(LINE_IN_DET)
3V3
3V3
3V3
X3
X4P-16MHZ
4
13
2
C129
0.1u/25V
3V3
PGD
PGC
P20
C130
0.1u/25V
P17
C131
10u/16V
R113
10K/1%
1 2 RST_PIC18
T1OSO
T1OSI
BM23 BLUETOOTH
EVALUTATION BOARD USER’S GUIDE
Preliminary Edition
2015 Microchip Technology Inc.
page 35
P77
SOUND
EFFECT
PAIRING
P77 R3
P77
MCU_P71
MCU_P71
MFB VOL-
PLAY/PAUSE
VOL+
C1
BUTTON
MCU_P45
MCU_P70
MCU_P72
R1
R0
R2
MCU_P71
MCU_P72
MCU_P70
R11410K/1%
1 2
C61
1u/16V
MCU_P70
<< PRV
C0
MCU_P72
MCU_P44
C132
1u/16V
R116
10K/1%
1 2 SW22
TS08M-PF
21
SW23
TS08M-PF
21
SW24
TS08M-PF
21
SW34
TS08M-PF
21
SW27
TS08M-PF
21
SW31
TS08M-PF
21
SW28
TS08M-PF
21
SW35
TS08M-PF
21
SW39
TS08M-PF
21
SW45
TS08M-PF
21
SW40
TS08M-PF
21
SW38
TS08M-PF
21
SW PT
P77
C2
MCU_P70
R11510K/1%
1 2
MCU_P71
C63
1u/16V FWD >>
MCU_P72
MCU_P46
3V33V3 3V3
Board Name
Size Title Rev
Date: Sheet of
P/N
MCU_BUTTON 4.0
BM23 EVB
A
8 8Monday, July 27, 2015
0360
5F, No.5, Industry E. Rd. VII, Hsinchu Science Park,
Hsinchu City 30078, Taiwan
TEL. 886-3-5778385
Worldwide Sales and Service
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los Angeles
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
ASIA/PACIFIC
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7830
Taiwan - Taipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Pforzheim
Tel: 49-7231-424750
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
2015 Microchip Technology Inc. Advance Information page 32
