PACKAGE SCHEMATIC
6/9/04
Page 1 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
DESCRIPTION
The MOC811X series consists of a Gallium Arsenide IRED coupled with an NPN phototransistor. The base of the transistor is not
bonded to an external pin for improved noise immunity
FEATURES
High isolation voltage
5300 VAC RMS—1 minute
High BV
CEO
minimum 70 Volts
Current transfer ratio in selected groups:
MOC8111: 20% min.
MOC8112: 50% min.
MOC8113: 100% min.
Maximum switching time in saturation specified
Underwriters Laboratory (UL) recognized (File #E90700)
VDE recognized (File #94766)
APPLICATIONS
•Power Supply Regulators
Digital Logic Inputs
Microprocessor Inputs
Appliance Sensor Systems
Industrial Controls
EMITTER
COLLECTOR
1
2
3
ANODE
CATHODE
4
5
6N/C
N/C
6
1
6
1
6
1
6/9/04
Page 2 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
ABSOLUTE MAXIMUM RATINGS
(T
A
=25°C Unless otherwise specified)
Parameter Symbol Value Unit
INPUT LED
Forward Current – Continuous I
F
90 mA
Forward Current – Peak (PW = 1µs, 300pps) I
F
(pk) 3 A
Reverse Voltage V
R
6Volts
LED Power Dissipation @ T
A
= 25°C P
D
135 mW
Derate above 25°C 1.8 mW/°C
OUTPUT TRANSISTOR
Detector Power Dissipation @ T
A
= 25°C P
D
200 mW
Derate above 25°C 2.67 mW/°C
TOTAL DEVICE
Total Device Power Dissipation @ T
A
= 25°C P
D
260 mW
Derate above 25°C 3.5 mW/°C
Ambient Operating Temperature Range T
OPR
-55 to +100 °C
Storage Temperature Range T
STG
-55 to +150 °C
Lead Soldering Temperature T
SOL
260 °C
(1/16” from case, 10 sec. duration)
6/9/04
Page 3 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
ELECTRICAL CHARACTERISTICS
(T
A
= 25°C Unless otherwise specified)
INDIVIDUAL COMPONENT CHARACTERISTICS
Parameter Test Conditions Symbol Device Min Typ Max Unit
EMITTER
Input Forward Voltage I
F
= 60 mA V
F
All 1.35 1.65 V
I
F
= 10 mA 1.15 1.50
Reverse Voltage I
R
= 10 µA V
R
All 6.0 15 V
Capacitance V
F
= 0 V, f = 1.0 MHz C
J
All 50 pF
V
F
= 1 V, f = 1.0 MHz 65
Reverse Leakage Current V
R
= 3.0 V I
R
All .35 10 µA
DETECTOR
Breakdow Voltage
Collector to Emitter I
C
= 1.0 mA, I
F
= 0 BV
CEO
All 70 V
Breakdow Voltage
Emitter to Collector I
E
= 100 µA, I
F
= 0 BV
ECO
All 7 V
Leakage Current
Collector to Emitter V
CE
= 10 V, I
F
= 0 I
CEO
All 5 50 V
Capacitance
Collector to Emitter V
CE
= 0 V, f = 1 MHz C
CE
All 8 pF
ISOLATION CHARACTERISTICS
Characteristic Test Conditions Symbol Min Typ Max Units
Input-Output Isolation Voltage f = 60 Hz, t = 1 min. V
ISO
5300 V
RMS
Isolation Resistance V
I-O
= 500 VDC R
ISO
10
11
Isolation Capacitance V
I-O
= 0, f = 1 MHz C
ISO
0.5 pF
6/9/04
Page 4 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
TRANSFER CHARACTERISTICS
(T
A
= 25°C Unless otherwise specified)
DC CHARACTERISTICS Test Conditions Symbol Device Min Typ Max Units
Output/Input Current Transfer
Ratio I
F
= 10 mA, V
CE
= 5V CTR
MOC8111 20
%MOC8112 50
MOC8113 100
Collector-Emitter Saturation
Voltage I
F
= 10 mA, I
C
= 2.5 mA V
CE(SAT)
All 0.27 0.4 V
AC CHARACTERISTICSØ Test Conditions Symbol Device Min Typ Max Units
Non-Saturated Switching Times
Tu r n-On Time R
L
= 100
, I
C
= 2 mA,
V
CC
= 10 V
See Figure 7
t
on
All 6.0 10 µS
Tu r n-Off Time t
off
All 5.5 10 µS
Saturated Switching Times
Tu r n-On Time I
F
= 20 mA, V
CE
= 0.4 V t
on
MOC8111 3.0 5.5 µS
I
F
= 10 mA, V
CE
= 0.4 V MOC812, MOC8113 4.2 8.0
Rise-Time I
F
= 20 mA, V
CE
= 0.4 V t
r
MOC8111 2.0 4.0 µS
I
F
= 10 mA, V
CE
= 0.4 V MOC812, MOC8113 3.0 6.0
Tu r n-Off Time I
F
= 20 mA, V
CE
= 0.4 V t
off
MOC8111 18 34 µS
I
F
= 10 mA, V
CE
= 0.4 V MOC812, MOC8113 23 39
Fall-Time I
F
= 20 mA, V
CE
= 0.4 V t
f
MOC8111 11 20 µS
I
F
= 10 mA, V
CE
= 0.4 V MOC812, MOC8113 14 24
6/9/04
Page 5 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
TYPICAL PERFORMANCE CURVES
NORMALIZED CTR
Fig. 3 Normalized CTR vs. Ambient Temperature
TA - AMBIENT TEMPERATURE (°C)
-75 -50 -25 0 25 50 75 100 125
NORMALIZED CTR
0.4
0.6
0.8
1.0
1.2
1.4
1.6
IF = 20 mA
IF = 10 mA
IF = 5 mA
Normalized to
IF = 10 mA
TA = 25°C
IF - LED FORWARD CURRENT (mA)
110100
V
F
- FORWARD VOLTAGE (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
TA = -55°C
TA = 100°C
TA = 25°C
Fig. 2 Normalized CTR vs. Forward CurrentFig. 1 LED Forward Voltage vs. Forward Current
IF - FORWARD CURRENT (mA)
05101520
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
Normalized to
IF = 10 mA
TA = 25°C
VCE = 5.0 V
Fig. 4 Collector Emitter Saturation Voltage
vs Collector Current
0.01 0.1 1 10
0.001
0.01
0.1
1
10
100
IF = 5 mA
IF = 2.5 mA
IF = 10 mA
IF = 20 mA
TA = 25°C
VCE (sat) - COLLECTOR-EMITTER SATURATION VOLTAGE (V)
IC - COLLECTOR CURRENT (mA)
6/9/04
Page 6 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
TYPICAL PERFORMANCE CURVES
(continued)
Fig. 6 Dark current vs. Ambient Temperature.
0255075100 125
ICEO - COLLECTOR-EMITTER DARK CURRENT (µA)
1e-6
1e-5
1e-4
1e-3
1e-2
1e-1
1e+0
1e+1
VCE = 10V
TA - AMBIENT TEMPERATURE (°C)
Fig. 5 Switching Speed vs. Load Resistor
R-LOAD RESISTOR (kΩ)
0.1 1 10 100
SWITCHING SPEED - (µs)
0.1
1
10
100
1000
Toff
Tf
IF = 10 mA
VCC = 10 V
TA = 25°C
Tr
Ton
6/9/04
Page 7 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
NOTE
All dimensions are in inches (millimeters)
Package Dimensions (Through Hole) Package Dimensions (Surface Mount)
Package Dimensions (0.4” Lead Spacing) Recommended Pad Layout for
Surface Mount Leadform
0.100 (2.54)
TYP
0.020 (0.51)
MIN
0.350 (8.89)
0.330 (8.38)
0.270 (6.86)
0.240 (6.10)
PIN 1
ID.
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.135 (3.43)
0.300 (7.62)
TYP
0° to 15°
0.154 (3.90)
0.100 (2.54)
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
Lead Coplanarity : 0.004 (0.10) MAX
0.270 (6.86)
0.240 (6.10)
0.350 (8.89)
0.330 (8.38)
0.300 (7.62)
TYP
0.405 (10.30)
MAX
0.315 (8.00)
MIN
0.016 (0.40) MIN
2
5
PIN 1
ID.
0.016 (0.41)
0.008 (0.20)
0.100 (2.54)
TYP
0.022 (0.56)
0.016 (0.41)
0.070 (1.78)
0.045 (1.14)
0.200 (5.08)
0.165 (4.18)
4
3
0.020 (0.51)
MIN
1
6
SEATING PLANE
0.016 (0.40)
0.008 (0.20)
0.070 (1.78)
0.045 (1.14)
0.350 (8.89)
0.330 (8.38)
0.154 (3.90)
0.100 (2.54)
0.200 (5.08)
0.135 (3.43)
0.004 (0.10)
MIN
0.270 (6.86)
0.240 (6.10)
0.400 (10.16)
TYP
0° to 15°
0.022 (0.56)
0.016 (0.41)
0.100 (2.54) TYP
0.070
(
1.78
)
0.060
(
1.52
)
0.030
(
0.76
)
0.100
(
2.54
)
0.295
(
7.49
)
0.415
(
10.54
)
6/9/04
Page 8 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
ORDERING INFORMATION1
MARKING INFORMATION
Option Example Part Number Description
No Suffix MOC8111 Through Hole
S MOC8111S Surface Mount Lead Bend
SD MOC8111SD Surface Mount; Tape and Reel
W MOC8111W 0.4" Lead Spacing
300 MOC8111300 VDE 0884
300W MOC8111300W VDE 0884, 0.4" Lead Spacing
3S MOC81113S VDE 0884, Surface Mount
3SD MOC81113SD VDE 0884, Surface Mount, Tape and Reel
MOC8111
V XX YY K
1
2
6
43 5
Definitions
1Fairchild logo
2Device number
3VDE mark (Note: Only appears on parts ordered with VDE
option – See order entry table)
4Two digit year code, e.g., ‘03’
5Two digit work week ranging from ‘01’ to ‘53’
6 Assembly package code
6/9/04
Page 9 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113
NOTE
All dimensions are in inches (millimeters)
Reflow Profile (Black Package, No Suffix)
Carrier Tape Specifications
4.0 ± 0.1
Ø1.55 ± 0.05
User Direction of Feed
4.0 ± 0.1
1.75 ± 0.10
7.5 ± 0.1
16.0 ± 0.3
12.0 ± 0.1
0.30 ± 0.05
13.2 ± 0.2
4.85 ± 0.20
0.1 MAX 10.30 ± 0.20
9.55 ± 0.20
Ø1.6 ± 0.1
• Peak reflow temperature: 225° C (package surface temperature)
• Time of temperature higher than 183° C for 60–150 seconds
• One time soldering reflow is recommended
215°C, 10–30 s
225 C peak
Time (Minute)
0
300
250
200
150
100
50
0
0.5 1 1.5 2 2.5 3 3.5 4 4.5
Temperature (°C)
Time above 183° C, 60–150 sec
Ramp up = 3 C/sec
LIFE SUPPORT POLICY
FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES
OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR
CORPORATION. As used herein:
1. Life support devices or systems are devices or systems
which, (a) are intended for surgical implant into the body, or
(b) support or sustain life, and (c) whose failure to perform
when properly used in accordance with instructions for use
provided in the labeling, can be reasonably expected to
result in a significant injury of the user.
2. A critical component in any component of a life support
device or system whose failure to perform can be
reasonably expected to cause the failure of the life support
device or system, or to affect its safety or effectiveness.
DISCLAIMER
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO
ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME
ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;
NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
6/9/04
Page 10 of 10
© 2004 Fairchild Semiconductor Corporation
6-PIN DIP OPTOCOUPLERS FOR
POWER SUPPLY APPLICATIONS
(NO BASE CONNECTION)
MOC8111 MOC8112 MOC8113