October 2006 Rev 2 1/9
STTH3R02
Ultrafast recovery diode
Main product characteristics
Features and benefits
■Very low conduction losses
■Negligible switching losses
■Low forward and reverse recovery times
■High junction temperature
Description
The STTH3R02 uses ST's new 200 V planar Pt
doping technology, and it is specially suited for
switching mode base drive and transistor circuits.
Packaged in DO-201AD, DO-15, and SMC, this
device is intended for use in low voltage, high
frequency inverters, free wheeling and polarity
protection.
Order codes
IF(AV) 3 A
VRRM 200 V
Tj (max) 175° C
VF (typ) 0.7 V
trr (typ) 16 ns
Part Number Marking
STTH3R02 STTH3R02
STTH3R02RL STTH3R02
STTH3R02Q STTH3R02
STTH3R02QRL STTH3R02
STTH3R02S 3R2S
KA
K
A
K
A
K
K
A
A
K
A
DO-15
STTH3R02Q
SMC
STTH3R02S
DO-201AD
STTH3R02
www.st.com
Characteristics STTH3R02
2/9
1 Characteristics
To evaluate the conduction losses use the following equation:
P = 0.68 x IF(AV) + 0.04 IF2(RMS)
Table 1. Absolute ratings (limiting values at Tj = 25° C, unless otherwise specified)
Symbol Parameter Value Unit
VRRM Repetitive peak reverse voltage 200 V
IFRM Repetitive peak forward current(1) tp = 5 µs, F = 5 kHz 110 A
IF(RMS) RMS forward current DO-201AD / DO-15 70 A
SMC 70
IF(AV) Average forward current, δ = 0.5
DO-15 Tlead = 50° C
3ADO-201AD Tlead = 90° C
SMC Tc = 110° C
IFSM Surge non repetitive forward current tp = 10 ms Sinusoidal 75 A
Tstg Storage temperature range -65 to + 175 ° C
TjMaximum operating junction temperature(1) 175 ° C
TLMaximum lead temperature for soldering during 10 s at 4 mm from case 230 ° C
1. On infinite heatsink with 10 mm lead length
Table 2. Thermal parameters
Symbol Parameter Value Unit
Rth(j-l) Junction to lead Lead Length = 10 mm on infinite heatsink DO-15 45
° C/WDO-201AD 30
Rth(j-c) Junction to case SMC 20
Table 3. Static electrical characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
IR(1) Reverse leakage current Tj = 25° C VR = VRRM
3µA
Tj = 125° C 3 30
VF(2) Forward voltage drop
Tj = 25° C IF = 9 A 1.20
V
Tj = 25° C
IF = 3 A
0.89 1.0
Tj = 100° C 0.76 0.85
Tj = 150° C 0.70 0.80
1. Pulse test: tp = 5 ms, δ < 2 %
2. Pulse test: tp = 380 µs, δ < 2 %
STTH3R02 Characteristics
3/9
Table 4. Dynamic characteristics
Symbol Parameter Test conditions Min. Typ Max. Unit
trr Reverse recovery time
IF = 1 A, dIF/dt = -50 A/µs,
VR = 30 V, Tj = 25° C 24 30
ns
IF = 1 A, dIF/dt = -100 A/µs,
VR = 30 V, Tj = 25° C 16 20
IRM Reverse recovery current IF = 3 A, dIF/dt = -200 A/µs,
VR = 160 V, Tj = 125° C 3.5 4.5 A
tfr Forward recovery time IF = 3 A, dIF/dt = 100 A/µs
VFR = 1.1 x VFmax, Tj = 25° C 40 ns
VFP Forward recovery voltage IF = 3 A, dIF/dt = 100 A/µs,
Tj = 25° C 1.9 V
Figure 1. peak current versus duty cycle Figure 2. Forward voltage drop versus
forward current (typical values)
0
20
40
60
80
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
I
M
(A)
T
d=tp/T tp
IM
T
δ=tp/T tp
IM
P = 5 WP = 5 W
P = 3 WP = 3 W
P = 10 WP = 10 W
δ0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0
I
FM
(A)
Tj=25°C
Tj=150°C
VFM(V)
Figure 3. Forward voltage drop versus
forward current (maximum values)
Figure 4. Relative variation of thermal
impedance junction to ambient
versus pulse duration - DO-201AD
(Epoxy printed circuit board FR4,
eCU =35µm)
0
10
20
30
40
50
0.0 0.5 1.0 1.5 2.0
I
FM
(A)
Tj=25°C
Tj=150°C
VFM(V)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
DO-201AD
Lleads=10mm
tP(s)
Characteristics STTH3R02
4/9
Figure 5. Relative variation of thermal
impedance junction to ambient
versus pulse duration - DO-15
(Epoxy printed circuit board FR4,
eCU =35µm)
Figure 6. Relative variation of thermal
impedance junction to ambient
versus pulse duration - SMC
(Epoxy printed circuit board FR4,
eCU =35µm)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
DO-15
L
leads
=10mm
tP(s)
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 1.E+02 1.E+03
Z
th(j-a)
/R
th(j-a)
Single pulse
SMC
Scu=1cm²
tP(s)
Figure 7. Junction capacitance versus
reverse applied voltage (typical
values)
Figure 8. Reverse recovery charges versus
dIF/dt (typical values)
1
10
100
1 10 100 1000
C(pF)
F=1MHz
V
osc
=30mV
RMS
T
j
=25°C
V
R
(V)
0
10
20
30
40
50
60
70
80
10 100 1000
Q
RR
(n
C
)
I
F
=3A
V
R
=160V
T
j
=125°C
T
j
=25°C
dI
F
/dt(A/µs)
Figure 9. Reverse recovery time versus dIF/dt
(typical values)
Figure 10. Peak reverse recovery current
versus dIF/dt (typical values)
0
10
20
30
40
50
60
10 100 1000
t
RR
(ns)
I
F
=3A
V
R
=160V
T
j
=125°C
T
j
=25°C
dI
F
/dt(A/µs)
0
1
2
3
4
5
6
7
8
10 100 1000
I
RM
(A)
I
F
=3A
V
R
=160V
T
j
=125°C
T
j
=25°C
dIF/dt(A/µs)
STTH3R02 Ordering information scheme
5/9
2 Ordering information scheme
Figure 11. Dynamic parameters versus
junction temperature
Figure 12. Thermal resistance junction to
ambient versus copper surface
under each lead for DO-15 and
DO-201AD (Epoxy printed circuit
board FR4, eCU = 35µm)
0.0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
25 50 75 100 125 150
Q
RR
;I
RM
[T
j
]
/Q
RR
;I
RM
[T
j
=125°
C
]
I
RM
Q
RR
I
F
=3A
V
R
=160V
Tj(°C)
R
th(j-a)
(°C/W)
0
10
20
30
40
50
60
70
80
90
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
DO-201AD
DO-15
SCu(cm²)
Figure 13. Thermal resistance versus copper
surface under each lead for SMC
(Epoxy printed circuit board FR4,
eCU = 35µm)
Figure 14. Thermal resistance versus lead
length for DO-201AD package
0
20
40
60
80
100
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
R
th(j-a)
(°C/W)
SMC
SCU(cm²)
0
10
20
30
40
50
60
70
80
90
100
5 10152025
R
th
(°C/W)
DO-201AD
Rth(j-a)
Rth(j-l)
Lleads(mm)
STTH 3 R 02 XXX
Ultrafast switching diode
Average forward current
3 = 3 A
02 = 200 V
Blank = DO-201 in Ammopack
RL = DO-201 in Tape and reel
Q = DO-15 in Ammopack
QRL = DO-15 in Tape and reel
S= SMC in Tape and reel
Model R
Package
Repetitive peak reverse voltage
Package information STTH3R02
6/9
3 Package information
●Epoxy meets UL94, V0
●Cooling method: by conduction (C)
Table 5. DO-201AD Dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 9.50 0.374
B 25.40 1.000
C 5.30 0.209
D 1.30 0.051
E 1.25 0.049
Notes 1 - The lead diameter ø D is not
controlled over zone E
2 - The minimum length which must stay
straight between the right angles after
bending is 0.59"(15mm)
Table 6. DO-15 dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A 6.05 6.75 0.238 0.266
B 2.95 3.53 0.116 0.139
C 26 31 1.024 1.220
D 0.71 0.88 0.028 0.035
ØC
ØD
A
EE
Note 2
Note 1 Note 1
BB
D
B
A
CC
STTH3R02 Package information
7/9
Figure 15. SMC footprint (dimensions in mm)
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com.
Table 7. SMC dimensions
Ref.
Dimensions
Millimeters Inches
Min. Max. Min. Max.
A1 1.90 2.45 0.075 0.096
A2 0.05 0.20 0.002 0.008
b 2.90 3.2 0.114 0.126
c 0.15 0.41 0.006 0.016
E 7.75 8.15 0.305 0.321
E1 6.60 7.15 0.260 0.281
E2 4.40 4.70 0.173 0.185
D 5.55 6.25 0.218 0.246
L 0.75 1.60 0.030 0.063
E
CLE2
E1
D
A1
A2
b
4.25
8.65
2.20
3.30
2.20
Ordering information STTH3R02
8/9
4 Ordering information
5 Revision history
Part Number Marking Package Weight Base qty Delivery mode
STTH3R02 STTH3R02 DO-201AD 1.16 g 600 Ammopack
STTH3R02RL STTH3R02 DO-201AD 1.16 g 1900 Tape and reel
STTH3R02Q STTH3R02 DO-15 0.4 g 1000 Ammopack
STTH3R02QRL STTH3R02 DO-15 0.4 g 6000 Tape and reel
STTH3R02S 3R2S SMC 0.243 g 2500 Tape and reel
Date Revision Description of Changes
03-May-2006 1 First issue
10-Oct-2006 2 Added SMC package
STTH3R02
9/9
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