1. General description
The PCA9410 and PCA9410A are highly efficien t 3.0 MHz, 500 mA, step-up DC-to-DC
converters. They convert input voltages from 2.5 V to 5.25 V to a fixed output voltage of
5.0 V.
These devices are optim ized for battery-powe red applications. High efficiency of up to
94 % enables an extended battery life in all portable designs. Step-up operation at a
switching frequency of 3 MHz allows using 1 H inductor or smaller.
2. Features and benefits
Efficiency up to 94 %
3 % output voltage accuracy at nominal and static conditions
3 % output voltage accuracy over full current, voltage and temperature range
VINVO, (Pass-Through Mode Operation)
Load disconnect
Current-mode controller
Soft start function for limiting inrush current with true load disconnect
Overcurren t an d over-temp er at ur e pr otection
The PCA9410 totally disconnects input to output when disabled
The PCA9410A connects input to output when disabled
Wafer-Level Chip-Size Package (WLCSP) with 0.4 mm pitch; allows for the use of a
smaller antenna, or for greater signal strength
3. Applications
Smartphones
NFC terminals
4. Ordering information
PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Rev. 1 — 5 August 2016 Product data sheet
WLCSP9
Table 1. Ordering information
Type number Topside
mark Package
Name Description Version
PCA9410UK P10 WLCSP9 wafer-level chip-size package; 9 bumps; body 1.24 1.24
0.525 mm -
PCA9410AUK 10A WLCSP9 wafer-level chip-size package; 9 bumps; body 1.24 1.24
0.525 mm -
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 2 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
4.1 Ordering options
5. Block diagram
Table 2. Ordering options
Type number Orderable part
number Package Packing method Minimum
order quantity Temperature
PCA9410UK PCA9410UKZ WLCSP9 REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
3000 Tamb = 40 C to +85 C
PCA9410AUK PCA9410AUKZ WLCSP9 REEL 7" Q1/T1
*SPECIAL MARK
CHIPS DP
3000 Tamb = 40 C to +85 C
Fig 1. Block diagram
BANDGAP
REFERENCE
BIAS
SUPPLY
UNDERVOLTAGE
LOCKOUT
TEMPERATURE
WATCHDOG
CONTROL
LOGIC
PULSE
GENERATOR GATE
DRIVER
SOFTSTART
OVERCURRENT
PROTECTION
aaa-013240
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 3 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
6. Pinning information
6.1 Pinning
6.2 Pin description
Fig 2. Pin configu ration WLCSP9 package Fig 3. Ball mapping for WLCSP9
321
A
B
C
ball A1
index area
Transparent top view
aaa-013280
PCA9410/9410A
VOUT VIN
PGND AGND
PGND
EN
21 3
A
B
C
Transparent top view
aaa-013281
PCA9410/9410A
VOUT
SW SW
Table 3. Pin description
Symbol Pin Description
VOUT A1, A2 Output voltage. This pin is the output voltage terminal; connect
directly to COUT.
VIN A3 Input voltage. Connect to Li-Ion battery input power source.
SW B1, B2 Switching node. Connect to inductor.
EN B3 Enable. Used to enable/disable the device; HIGH = enabled.
Non-A version: EN low = total disconnect
A version: EN low = forced pass through
PGND C1, C2 Power ground. This is the power return for the IC. COUT capacitor
should be returned with the shortest path possible to these pins.
AGND C3 Analog ground. This is the signal ground reference fo r the IC. All
voltage levels are measured with respect to this pin; connect to
PGND at a single point. The AGND pin should be flooded over by
the ground plane that is connecti ng the PGND pins to both the
input caps and the output caps.
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 4 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
7. Functional description
The step-up converter (Figure 4) generates a regulated constant output voltage.
7.1 Enable (EN) pin
EN pin enables the boost conver ter when HIGH. However the effect of the EN when LOW
has two methods of operation, depending on which device is used.
PCA9410 device: the EN pin when LOW causes the part to go into a total disconnect
mode from input to output.
PCA9410A device: EN pin when LOW forces the part into Pass Through mode where th e
output voltage is the same as the input voltage. This device emulates a conventional
boost converter (without the voltage drop of the internal diode).
When the EN pin is pulled HIGH it should be held HIGH for at least 500 s for the device
to properly initialize. This is for getting the forced Pass Through mode set up properly.
Shorter pulses may cause unpredictable behavior.
7.1.1 Pass-Through (PT) mode
With both devices, the device automatically transitions from Boost Mod e to Pass-T hrough
Mode if VIN goes above the VOUT target. In Pass-Through Mode, the de vice provides a
very low impedance path from VIN to VOUT. Ent ry to the Pass-Through Mode is triggered
Fig 4. Typical DC-to-DC application
SW SW
VIN VIN
ENEnable
AGND
VOUT
aaa-013259
PGND PGND
C
1
L
i(ext)
C
2
VOUTVOUT
Table 4. Operating modes
Mode Description Invoked when
LIN linear start-up VIN > VOUT
SS boost soft-start VIN < VOUT < VOUT(TARGET)
BST boost operating mode VOUT = VOUT(TARGET)
PT pass-through mode VIN > VOUT(TARGET) or in the advanced
part when EN is pulled LOW
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 5 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
by condition where VIN > VOUT target. Pass-Through Mode exit is trigge red when VOUT
going down reach es the target VOUT voltage. During Automatic Pass-Through Mode, the
PMOS overcurrent protection remains enabled.
In the PCA9410A, user can force the device in Forced Pass-Through Mode through the
EN pin. If the EN pin is pulled HIGH, the device starts operating in Boost Mode. Once the
EN pin is pulled LOW, the device is forced into Pass-Through Mode. To disable the
device, the input supply voltage must be removed. The device cannot start-up in Forced
Pass-Through Mode. During st art-up, keep the EN pulle d HIGH for 500 s, before pulling
it LOW and putting the device into Forced Pass-Through Mode. The EN pin has an
internal pull-down resistor (see Figure 5 for the sequence).
7.2 Inrush current limiter (soft start)
The PCA9410 and PCA9410A have an integrated pre-charge circuit that prevents large
inrush current s when input voltage is applied. This inrush is accompanied with a current
limit that shuts down the device, and runs a delay timer then attempts a restart.
Once the output volt age reach es the input vo lt age the so ft sta rt function is enabled to limit
the maximum current in boost time and to reduce an input voltage dip. Therefore the
system has a turn-on pr oced ur e which starts up step-by-step and limits the inrush current
via a duty cycle control up to the maximum current capability.
7.3 Thermal protection
The PCA9410 and PCA9410A have an integrated thermal protection. The protection
circuit senses the internal temperature of the chip and switches off the integrated PMOS
power switch transistor when temperature reaches 150 C. After th e temperature returns
to a safe value 20 C below the shutdown temperature, th e system restarts in the
pre-charg e ph ase.
Table 5. Enable
EN logic level Description Non-A Description A
LOW Power-down isolated output Forced pass-through
HIGH Boost mode Boost mode
Fig 5. Forced pass-through
V
IN
Enable
V
OUT
Boost
Forced Pass through
Boost
Disconnect
aaa-019181
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 6 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
7.4 Overcurrent protection
Overcurrent protection circuit senses the current through the integrated PMOS. If the
diagnostic circuit detect s an overcurre nt, the system switches of f the PMOS and NMOS to
break the current flow, and a 20 ms timeout is started. Once the 20 ms timeout expires,
the part restarts in the pre-charge phase .
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 7 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
8. Limiting values
[1] Internally limited
9. Recommended operating conditions
[1] This is the capacitance at 5 V bias. Check application section for more details.
Table 6. L imiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
VIN voltage on pin IN 0.5 +6.0 V
Viinput voltage on pin EN 0.3 VIN + 0.3 V, up to
+6.0 V V
VOoutput voltage on pins SW, OUT 0.5 +6.0 V
Ptot total power dissipation [1]
Tstg storage temperature 65 +150 C
Tjjunction temperature 40 +125 C
Tamb ambient temperature 40 +85 C
VESD electrostatic discharge voltage human body model
(JESD22-001)
2+2 kV
Table 7. Ope rating conditions
Symbol Parameter Conditions Min Typ Max Unit
VIN voltage on pin IN 2.5 -5.25 V
Viinput voltage on pin EN 0.3 - VIN V
C1external input capacitance VIN = 4.8 V [1] 2.0 4.2 -F
C2external output capacitance VO = 5 V [1] 3.0 4.2 10 F
Li(ext) external input inductance [1] 0.47 12.2 H
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 8 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
10. Static characteristics
Table 8. Static characteristics
At recommended input voltages and Tamb =
40
C to +85
C; voltages are referenced to GND (ground = 0 V); unless
otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Input voltage and input current
VIN input voltage 2.5 3.6 5.25 V
IQsupply current EN = 0 V -3.0 10.0 A
EN = 1.8 V, VIN = 2.5 V -36 -mA
EN = 1.8 V, VIN = 4.8 V -11 -mA
EN = 1.8 V, VIN = 5.25 V -3.57 -mA
Output voltage and output current
VOUT output voltage IO 15 mA 4.85 (3 %) 5.0 5.15 (+3 %) V
IOUT(lim) output current limit EN = HIGH 0.5 - - A
fo(boost) boost output frequency 2.91 33.09 MHz
Vth(r)(UVLO) rising threshold voltage
on VIN UVLO 1.9 2.1 2.3 V
Vth(f)(UVLOhyst) falling UVLO hysteresis 70 -120 mV
Vo(noise_p-p_coh) Vo coherent
peak-to-peak noise 100 kHz to 1.5 MHz, VIN < 4.8 V 2 mV
12 MHz to 15 MHz, VIN < 4.8 V 2 mV
Vo(noise_rms) Vo rms noise (incoherent
noise) 100 kHz to 1.5 MHz, VIN < 4.8 V 660 µV rms
12 MHz to 15 MHz, VIN < 4.8 V 660 µV rms
Control input and timing
VIH HIGH-level input voltage pins EN 1.16 - - V
VIL LOW-level input voltage pins EN - - 0.4 V
tstartup start-up time -500 600 S
Over-temperature protection
Tsd shut d o w n temperature -150 -C
Tsd(hys) hysteresis of shutdown
temperature -20 -C
Switches
RDSon drain-source on-state
resistance N-channel FET -70 - m
P-channel FET -80 - m
ILleakage current VIN = 3.6 V; EN = LOW 00.051 10 A
Rpd(en_low) enable pull down EN = LOW 450 640 800 k
I(ena-pulldown) enable pull down current EN = HIGH, VIN 2.5 V -100 -nA
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 9 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 6. Output regula ti on v s Ilo a d an d V IN
Fig 7. Output ripple vs Iload and VIN
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PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 10 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 8. Output regulation v s Ilo a d an d temp (VIN = 3.6 V)
Fig 9. Frequen cy vs load current and VIN
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PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 11 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 10. Efficiency vs Iload and VIN
Fig 11. Efficiency vs Iload and temp (VIN = 3.6 V)
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PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 12 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 12. Line step response
Fig 13. Pass through
aaa-017046
aaa-017047
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 13 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 14. L oa d step
Fig 15. Typical load current capability vs VIN and temp
aaa-017049
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PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 14 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
11. Application information
11.1 Overcurrent protection
Conventiona l Boo st co nve rtor s ha ve no ou tp ut current limit protection. Additionally they
have a phantom power path made up of the inductor and output diode connecting the
input directly to the output; this causes an inrush of current when power is applied. The
PCA9410 has extra provisions to prevent the inrush current and output current limit
problems.
To implement these protections this device has a start-up state machine. This machine
includes a two-stage pre-char ge of the output circuitry:
Stage 1, Inrush control: a 1 A current source is turned on providing a path from input
to output while a voltage comp arator and a timer1 are active. If the output voltage
doesn't reach VIN - 200 mV within 1 ms, the device goes into the fault state. If the
output voltage reaches 200 mV below the input voltage first the state machine
advances to the boost mode soft start state .
Stage 2, Boost Soft-Start: Starting from VOUT = VIN, the output will ramp up to VOUT
target. The PMOS current limit will be enabled during this stage.
The curren t levels are impleme nted through th e synchronous rectifier transistor pr operties
and drive states.
11.2 Thermal shutdown
A thermal shutdown state shuts out all other states out until the device has cooled to the
(HiTemp Thysteresis) turn back on temperature, and then it enters the fault state.
11.3 Fault recovery
When a fault occurs, the device has a faul t state that disables the output for 20 ms. After
the 20 ms timeout, the device will attempt a restart starting from the inrush state.
11.4 Enable delay
Once the device has been running and gets disabled, it cannot be re-enabled until the
output volta ge discharges down to the input voltage. Th e device has an internal pull-down
to accomplish this, however in the absence of any external load this will take 3 ms. Any
external load will shorten the time it takes to get re-enabled.
11.5 Connection diagram
The DC-to-DC converter requires an external inductor and two decoup ling capacitors.
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 15 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
11.6 Recommended inductors
In order to ensure proper operation of the step-up DC-to-DC converter an inductor with a
suff icient inductance a n d su f f i c i e n t s a t u r a t i o n c u r r e n t v a l u e needs to be used. Re co mm en de d
inductance is 1 H. Using this recommended 0603 i nductor puts a 300 mA current limit on the
circuit; this inductor has a 800 mA saturation current. For more output cur rent a larger, hi gher
saturation current inductor will be required according to Figure 17. The saturation current of the
inductor has to be properly chosen for the input voltage and load current range. The lower the
input voltage th e higher the input current for a given load current . Once the saturation cur rent of
the inductor is reached, the ferromagnetic core of the inductor will show a rapid nonlinear
behavior and the output current capability of the circuit will drop significantly.
Fig 16. Simple DC-to-DC application diag ram
SW SW
VIN VIN
ENEnable
AGND
VOUT
aaa-013259
PGND PGND
C
1
L
i(ext)
C
2
VOUTVOUT
Table 9. Recommended inductors
Inductor Manufacturer Product Parameter Package size
LAbracon ASMPH-0603-1R0M-T 1 H0603
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 16 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
11.7 Input capacitor
To eliminate unwanted voltage transient s at the input, place an input decoupling cap acitor
of at least 2.2 F as close as possible to the input pin. Due to the voltage dependence of
the capacitor, care should be taken that the effective capacitance of 2 F is available at
input voltages up to 5.25 V. To ensure best performance, it is recommended to use a
capacitor with a low Equivalent Series Resistance (ESR). When using a capacitor with
X5R or X7R dielectric keep in mind that the capacitance drops significantly with voltage,
thus a 22 F cap will actually only have 4.2 F at 5 V as show n in Table 10.
Fig 17. Inductor peak current vs Iload an d VIN
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Table 10. Recommended input capacitors
Manufacturer Product Parameter Package size
Samsung CL05A106MQ5NUNC 10 f 6.3 V,
2.5 F at 5 V 0402
TDK C1608X5R0J226M080AC 22 f at 6.3 V,
4.2 F at 5 V 0603
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 17 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
11.8 Output capacitor
Because of the narrow voltage-dependent capacitance spread, high temperature stability
and low ESR at high frequencies, it is recommended to use the dielectric X7R or X5R.
The rated capacitance of the output capacitor will be much greater than the actual
capacit ance at the 5 V output voltage. The device requires at least 3 F of output
capacit ance at it s rated output volt age for su ppression of ringing, overshoot, as well as for
loop stability. We recommend a 22 F 6.3 V capacitor that is actually a 4.2 F capacitor
when biased at 5 V.
When the space on th e application board allows, it is recommended to use two capacitors
instead of a single large va lue. The reason is that the equivalent series inductance
reduces to half when using two capacitors with the same value and this helps the
capacitors to work more efficiently against high frequency noise where it can be re duced
by a factor of 2. The minimum capacitance needed can either be obtained with a single
22 F capacitor or two 10 F capacitors when the space allows and low er nois e is
targe ted; keep in m ind that the bu lk cap a cit ance a t the ou tput volt ag e needs to b e gre ater
than 3.0 F for control loop stability, and two large capacitors will have superior
performance when compared with two smaller capacitors. The boost factor, output
current, switching fr equency an d the desir ed peak to peak ripple limit define the minimu m
capacitance needed.
The duty cycle (D) needed with 90 % efficiency at a worst case of 2.5 V VIN.
(1)
For the minimum input voltage 2.5 V and 5 V output voltage D = 0.55
Using the simplified correlation between the current (IOUT(max)), ripple (Vripple), duty cycle
(D) and switching frequency (fsw) the minimum Cout capacitance can be calculated as
follows:
(2)
With a sample set of values: Iout = 300 mA, D = 0.55, fsw = 3 MHz, Vripple = 20 mV
COUT(min) = 2.75 F (This is not the nominal value at 0 V bias, it is the derated value at 5 V
bias).
This value presumes that the ESR and ESL of the capacitor is negligible and the path
output-capacitor-ground is as short as possible. Compensating for the listed factors, the
minimum outp ut capacitance is specified at 3.0 f at 5 V. How much the capacitance
degrades at high bias voltage is supplier dependent and especially when 0402 size
capacitors are chosen the voltage dependence should be taken into consideration.
Table 11. Recommended output capacitors
Cap Manufacturer Product Parameter Package size
C2TDK C1608X5R0J226M080AC 22 F 6.3 V,
4.2 F at 5 V 0603
D1
Eff VIN
VOUT
----------------------
=
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 18 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
11.9 Layout of the PCB
The most critical layout constraint of this circuit is that the output Cap C2 be placed as
close to the IC as possible. Use short wide traces to connect this capacitor to the IC. See
below for an example of the layout detailing the IC and the output capacitor. The
connection from switch pin to the inductor should have minimum capacitance to GND.
Fig 18. Layout of PCB
aaa-016344
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 19 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
12. Package outline
Fig 19. Package outline WLCSP9
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PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 20 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Fig 20. WLCSP9 Under Ball Metal (UBM) structure
aaa-019496
UBM: 240 µm ± 4 µm
PI opening: 160 µm
Passivation opening: 190 µm
Al pad: 220 µm
PI: 10 µm
1K Ti: 1K ± 0.2K
2 K Cu: 2K ± 0.2K
8.3 µm Cu:
All: 8.6 µm ± 1.7 µm
UBM:
Solder ball: SAC105N
BD: 260 µm ± 30 µm
BH: 200 µm ± 30 µm
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 21 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
13. Soldering of WLCSP packages
13.1 Introduction to soldering WLCSP packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note
AN10439 “W afer Level Chip Scale Package” and in application note AN10365 “Surface
mount reflow soldering description”.
Wave soldering is not suitable for this package.
All NXP WLCSP packages are lead-free.
13.2 Board mounting
Board mounting of a WLCSP requires several steps:
1. Solder paste printing on the PCB
2. Component placement with a pick and place machine
3. The reflow soldering itself
13.3 Reflow soldering
Key characteristics in reflow soldering are :
Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to
higher minimum peak temperatures (see Figure 21) than a SnPb process, thus
reducing the process window
Solder paste printing issues, such as smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature), and cooling down. It is imperative that the peak
temperature is high enoug h for the solder to make reliable solder joint s (a solder paste
characterist ic) while be ing low en oug h th at th e packages an d/or boards are no t
damaged. The pea k temperature of the package depends on package thickness and
volume and is classified in accordance with Table 12.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures dur ing reflow
soldering, see Figure 21.
Table 12. Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350 350 to 2 000 > 2 000
< 1.6 260 260 260
1.6 to 2.5 260 250 245
> 2.5 250 245 245
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 22 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
For further information on temperature profiles, re fer to application note AN10365
“Surface mount reflow soldering description”.
13.3.1 Stand off
The stand off between the substrate and the chip is determined by:
The amount of printed solder on the substrate
The size of the solder land on the substrate
The bump height on the chip
The higher the stand off, the better the stresses are released due to TEC (Thermal
Expansion Coefficient) differences between substrate and chip.
13.3.2 Quality of solder joint
A flip-chip joint is considered to be a good joint when the entire solder land has been
wetted by the solder from the bump. The surface of the joint should be smooth and the
shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps
after reflow can occur during the reflow process in bumps with high ratio of bump diameter
to bump height, i.e. low bumps with large diameter. No failures have been found to be
related to these voids. Solder joint inspection after reflow can be done with X-ray to
monitor defects such as bridging, open circuits and voids.
13.3.3 Rework
In general, rework is not recommended. By rework we mean the process of removing the
chip from the substrate and replacing it with a new chip. If a chip is removed from the
substrate, most solder balls of the chip will be damaged. In that case it is recommended
not to re-use the chip again.
MSL: Moisture Sensitivity Level
Fig 21. Temperature profiles for large and small components
001aac844
temperature
time
minimum peak temperature
= minimum soldering temperature
maximum peak temperature
= MSL limit, damage level
peak
temperature
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 23 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Device removal can be done when the substrate is heated until it is certain that all solder
joints are molten. The chip can then be carefully removed fro m the substrate without
damaging the tracks and solder lands on the substrate. Removing the device must be
done using plastic tweezers, because metal tweezers can damage the silicon. The
surface of the substrate should be carefully cleaned and all solder and flux residues
and/or underfill removed. When a new chip is placed on the substrate, use the flux
process instead of solder on the sold er lands. Apply flux on the bumps at th e chip side a s
well as on the solder pads on the substrate. Place and align the new chip while viewing
with a microscope. To reflow the solder, use the solder profile shown in application note
AN10365 “Surface mount reflow soldering description”.
13.3.4 Cleaning
Cleaning can be done after reflow soldering.
14. References
[1] IEC60134 — Rating systems for electronic tubes and valves and analogous
semiconductor devices
[2] IEC61340-3-1 — Method for simulation of electrostatic ef fects - Human body model
(HBM) electrostatic discharge test waveforms
[3] JESD22-A115C — Electrostatic Discharge (ESD) Sensitivity Testing Machine Model
(MM)
[4] NX2-00001 — NXP Semiconductors Quality and Reliability Specification
[5] AN10365 — NXP Semiconductors application note “Surface mount reflow soldering
description”
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 24 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
15. Revision history
Table 13. Revision history
Document ID Release date Data sheet status Change notice Supersedes
PCA9410 v.1.1 20160805 Product data sheet -PCA9410 v.1
Modifications: Deleted Figure 12 Sta r tup
PCA9410 v.1 20151008 Product data sheet - -
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 25 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
16. Legal information
16.1 Data sheet status
[1] Please consult the most recently issued document before initiating or completing a design.
[2] The term ‘short data sheet’ is explained in section “Definitions”.
[3] The product status of device (s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liab ility for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and tit le. A short data sh eet is intended
for quick reference only and shou ld not b e relied u pon to cont ain det ailed and
full information. For detailed and full informatio n see the relevant full data
sheet, which is available on request via the local NXP Semicond uctors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall pre va il.
Product specificatio n The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to off er functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warr a nty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warrant ies, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Se miconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect , incidental,
punitive, special or consequ ential damages (including - wit hout limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ ag gregate and cumulati ve liability toward s
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all informa tion supplied prior
to the publication hereof .
Suitability for use NXP Semiconductors product s are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in perso nal injury, death or severe property or environment al
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconducto rs products in such equipment or
applications and ther efore such inclu sion and/or use is at the cu stomer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and ope ration of their applications
and products using NXP Semicondu ctors products , and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whet her the NXP
Semiconductors product is suit able and fit for t he customer’s applications and
products planned, as well as fo r the planned application and use of
customer’s third party customer(s). Custo mers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party custo mer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individua l agreement. In case an individual
agreement is concluded only the ter m s and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing i n this document may be interpreted or
construed as an of fer t o sell product s that is open for accept ance or t he grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or inte llectual property rights.
Document status[1][2] Product status[3] Definition
Objective [short] data sheet Development This document contains data from the objective specification for product develop ment.
Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specif ication.
Product [short] dat a sheet Production This document cont ains the product specification.
PCA9410 All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2016. All rights reserved.
Product data sheet Rev. 1 — 5 August 2016 26 of 27
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It i s neit her qua lif ied nor test ed
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automot ive specifications and standards, custome r
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y
liability, damages or failed product claims resulting from customer design an d
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced b rands, produc t names, service names and trademarks
are the property of their respective ow ners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
NXP Semiconductors PCA9410/9410A
3.0 MHz, 500 mA, DC-to-DC boost converter
© NXP Semiconductors N.V. 2016. All right s reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 5 August 2016
Document identifier: PCA9410
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
18. Contents
1 General description. . . . . . . . . . . . . . . . . . . . . . 1
2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1
3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4 Ordering information. . . . . . . . . . . . . . . . . . . . . 1
4.1 Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2
5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3
6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7 Functional description . . . . . . . . . . . . . . . . . . . 4
7.1 Enable (EN) pin . . . . . . . . . . . . . . . . . . . . . . . . 4
7.1.1 Pass-Through (PT) mode. . . . . . . . . . . . . . . . . 4
7.2 Inrush current limiter (soft start) . . . . . . . . . . . . 5
7.3 Thermal protection . . . . . . . . . . . . . . . . . . . . . . 5
7.4 Overcurrent protection . . . . . . . . . . . . . . . . . . . 6
8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 7
9 Recommended operating conditions. . . . . . . . 7
10 Static characteristics. . . . . . . . . . . . . . . . . . . . . 8
11 Application information. . . . . . . . . . . . . . . . . . 14
11.1 Overcurrent protection . . . . . . . . . . . . . . . . . . 14
11.2 Thermal shutdown . . . . . . . . . . . . . . . . . . . . . 14
11.3 Fault recovery. . . . . . . . . . . . . . . . . . . . . . . . . 14
11.4 Enable delay. . . . . . . . . . . . . . . . . . . . . . . . . . 14
11.5 Connection diagram . . . . . . . . . . . . . . . . . . . . 14
11.6 Recommended inductors . . . . . . . . . . . . . . . . 15
11.7 Input capacitor . . . . . . . . . . . . . . . . . . . . . . . . 16
11.8 Output capacitor . . . . . . . . . . . . . . . . . . . . . . . 17
11.9 Layout of the PCB . . . . . . . . . . . . . . . . . . . . . 18
12 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 19
13 Soldering of WLCSP packages. . . . . . . . . . . . 21
13.1 Introduction to soldering WLCSP packages. . 21
13.2 Board mounting . . . . . . . . . . . . . . . . . . . . . . . 21
13.3 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 21
13.3.1 Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
13.3.2 Quality of solder joint . . . . . . . . . . . . . . . . . . . 22
13.3.3 Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
13.3.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
14 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
15 Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24
16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 25
16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25
16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 25
16.4 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
17 Contact information. . . . . . . . . . . . . . . . . . . . . 26
18 Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27