Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2010. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called TAIYO YUDEN s official sales channel ). It is only applicable to the products purchased from any of TAIYO YUDEN s official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to Foreign Exchange and Foreign Trade Control Law of Japan, U.S. Export Administration Regulations , and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 11 notice_e-01 MULTILAYER FERRITE CHIP BEADS (BK SERIES P TYPE) WAVE REFLOW Except for BKP0603, BKP1005 FEATURES APPLICATIONS Low Rdc value can lower the power consumption and extend the life of batteries. That stands on the high advanced green sheet and printing technologies. High frequency noise debug on the DC power supply line in personal computers and other information system products. Noise suppression in USB and IEEE1394 interface. No need for grounding provides greater flexibility in circuit design. HS With low R-XL cross point frequency characteristics and large resistance part working as damping function, suppresses unnecessary resonance and keeps signal integrity. HMResistance part rising exceeding from 20MHz. For general usage. TS : Low DC resistance HS version. For power supply lines. TM Low DC resistance HM version. Prevents interference between circuits in mobile systems (PDC, PHS, PDA) OPERATING TEMP. 5585 ORDERING CODE B K P 1 6 0 BKP 8 H Type Multilayer Ferrite Chip Beads (For Power Supply Lines) S 1 8 External Dimensions LxW mm 0603 0201 0.6x0.3 1005 0402 1.0x0.5 1608 0603 1.6x0.8 2125 0805 2.0x1.25 Material HS Refer to impedance Curves for material HM differrences 1 Impedance example 330 101 391 T Characteristics Standard Products 33 100 390 T Packaging Tape & Reel Internal code Standard Products Blank Space EXTERNAL DIMENSIONS/STANDARD QUANTITY Type L W T e BKP0603 0201 0.60.03 0.0240.001 0.30.03 0.0120.001 0.30.03 0.0120.001 0.0060.002 BKP1005 0402 1.000.05 0.0390.002 0.500.05 0.0200.002 0.500.05 0.0200.002 BKP1608 0603 1.60.15 0.0630.006 0.80.15 0.0310.006 BKP2125 0805 0.0790.012 0.004 1.250.2 0.0490.008 0.3 2.00.1 Standard Quantitypcs Embossed Tape Paper Tape 0.150.05 15000 0.250.10 0.0100.004 10000 0.80.15 0.0310.006 0.30.2 0.0120.008 4000 0.850.2 0.0330.008 0.50.3 0.0200.012 4000 Unitmm inch AVAILABLE MATERIALS BKP0603 BKP1005 100 80 HS type HS type 1 2 3 4 5 400 300 60 40 500 HS221 HS121 HS680 HS330 HS100 200 250 200 2 3 4 2 500 400 1 121 2 680 3 330 5 I max=0.82.0A I max=0.91.1A 200 100 700 1 2 3 4 5 6 7 8 500 400 300 1 2 3 I max=1.31.7A HS471 HS391 HS271 HS181 HS121 HS101 HS600 HS330 HS type 500 1 2 3 4 5 1 2 HS331 HS221 HS101 HS600 HS330 1 250 3 2 4 200 3 5 100 0 I max=1.3A BKP2125 HS type 600 300 1 2 100 BKP1608 TS type 1 TM121 1 300 I max=1.0A 500 1 HM221 2 HM121 400 100 20 TM type HM type 500 1 HS330 2 HS220 1 10 100 I max=13A 6 7 7 8 4 5 1000 I max=1.54A This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 96 11 mlci08_e-01 PART NUMBERS BKP0603 Ordering code BKP0603 HS 220 BKP0603 HS 330 EHS Environmental Hazardous Substances RoHS RoHS Impedance Measuring frequency MHz DC resistance m max. Rated current A max. Thickness mm inch 2225 3325 100 65 70 1.0 1.0 0.300.03 0.0120.001 Impedance Measuring frequency MHz DC resistance m max. Rated current A max. Thickness mm inch 105 3325 6825 12025 22025 12025 22025 3325 6825 12025 12025 100 30 50 75 140 200 120 180 3930% 5530% 7030% 100 2.0 1.7 1.5 1.0 0.8 1.1 0.9 1.7 1.5 1.3 1.3 0.500.05 0.020.002 Impedance Measuring frequency MHz DC resistance m max. Rated current A max. Thickness mm inch 3325 6025 10025 12025 18025 27025 39025 47025 100 25 40 50 35 75 110 140 180 3.0 2.5 1.7 2.7 1.5 1.2 1.0 1.0 0.800.15 0.0310.006 Impedance Measuring frequency MHz DC resistance m max. Rated current A max. Thickness mm inch 4.0 3.0 2.5 2.0 1.5 0.850.2 0.0330.008 BKP1005 Ordering code HS 100 HS 330 HS 680 HS 121 HS 221 HM 121 HM 221 TS 330 TS 680 TS 121 TM 121 BKP1608 Ordering code BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 BKP1608 HS HS HS HS HS HS HS HS 330 600 101 121 181 271 391 471 EHS Environmental Hazardous Substances RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS FERRITE PRODUCTS BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 BKP1005 EHS Environmental Hazardous Substances RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS RoHS BKP2125 Ordering code BKP2125 BKP2125 BKP2125 BKP2125 BKP2125 HS HS HS HS HS 330 600 101 221 331 EHS Environmental Hazardous Substances RoHS RoHS RoHS RoHS RoHS 3325 6025 10025 22025 33025 100 20 25 40 50 75 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci08_e-01 11 97 ELECTRICAL CHARACTERISTICS BKP0603 BKP1005 BKP0603 HS220 BKP0603 HS330 BKP1005 HS100 BKP1005 HS330 100 100 100 100 80 80 80 80 60 60 60 60 40 40 40 40 20 20 20 20 0 0 0 1 10 100 1000 1 10 100 1000 10000 0 1 10 1000 1 250 500 250 200 200 400 200 150 150 300 150 100 100 200 100 50 50 100 50 0 0 0 10 100 1000 1 10000 10 BKP1005 HM221 100 1000 1 10000 10 BKP1005 TS330 100 1000 10000 1 250 400 80 200 200 300 60 150 150 200 40 100 100 100 20 50 50 0 0 0 1000 10000 1 10 100 1000 10000 10000 100 1000 10000 1000 10000 BKP1005 TS121 250 100 10 BKP1005 TS680 100 10 1000 0 500 1 100 BKP1005 HM121 250 1 10 BKP1005 HS221 BKP1005 HS121 BKP1005 HS680 100 0 1 10 100 1000 10000 1 10 100 BKP1608 BKP1005 TM121 BKP1608 HS330 BKP1608 HS600 BKP1608 HS101 500 100 100 250 400 80 80 200 300 60 60 150 200 40 40 100 100 20 20 50 0 0 0 1 10 100 1000 10000 1 10 BKP1608 HS121 100 1000 10000 1 10 BKP1608 HS181 100 1000 10000 0 1 BKP1608 HS271 250 500 500 200 400 400 150 300 300 100 200 200 50 100 100 10 100 1000 10000 BKP1608 HS391 500 250 0 1 10 100 1000 10000 0 0 0 1 10 100 1000 1 10 100 1 1000 10 100 1000 BKP2125 BKP2125 HS330 BKP1608 HS471 700 BKP2125 HS600 BKP2125 HS101 100 100 500 50 50 250 600 500 400 300 200 100 0 0 1 10 100 1000 0 1 10 100 1000 0 1 10 100 1000 1 10 100 1000 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 98 11 mlci08_e-01 ELECTRICAL CHARACTERISTICS BKP2125 HS221 BKP2125 HS331 500 500 250 250 0 0 1 10 100 1000 1 10 100 1000 FERRITE PRODUCTS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci08_e-01 11 99 PACKAGING Taping material Minimum Quantity Tape & Reel Packaging Type CK1608 0603 CK2125 0805 CKS2125 0805 CKP2012 0805 CKP2016 0806 CKP2520 1008 NM2012 0805 NM2520 1008 LK1005 0402 LK1608 0603 LK2125 0805 HK0603 0201 HK1005 0402 HK1608 0603 HK2125 0805 HKQ0603S 0201 AQ105 0402 BK0402 01005 BK0603 0201 BK1005 0402 BK1608 0603 BK2125 0805 BK2010 0804 BK3216 1206 BKP0603 0201 BKP1005 0402 BKP1608 0603 BKP2125 0805 Thickness mm inch 0.8 0.031 0.85 0.033 1.25 0.049 0.85 0.033 1.25 0.049 0.9 0.035 0.9 0.035 0.7 0.028 0.9 0.035 1.1 0.043 0.9 0.035 1.1 0.043 0.5 0.020 0.8 0.031 0.85 0.033 1.25 0.049 0.3 0.012 0.5 0.020 0.8 0.031 0.85 0.033 1.0 0.039 0.3 0.012 0.5 0.020 0.2 0.008 0.3 0.012 0.5 0.020 0.8 0.031 0.85 0.033 1.25 0.049 0.45 0.018 0.8 0.031 0.3 0.012 0.5 0.020 0.8 0.031 0.85 0.033 Standard Quantitypcs Paper Tape Embossed Tape 4000 4000 2000 4000 2000 3000 3000 3000 3000 2000 3000 2000 10000 4000 4000 2000 15000 10000 4000 4000 3000 15000 10000 20000 15000 4000 4000 2000 4000 4000 15000 10000 4000 4000 16 0 8 212 5 212 5 10 0 5 16 0 8 212 5 0603 10 0 5 16 0 8 0603 10 5 0402 0603 10 0 5 16 0 8 212 5 2 010 0603 10 0 5 16 0 8 212 5 CK CKS CKP CKP CKP NM NM L K HK BK BK 212 5 212 5 2 012 2 016 2520 2 012 2520 212 5 212 5 212 5 3 216 Taping Dimensions Paper tape (0.315 inches wide) Unit : mminch Insertion Pitch A B F 1.00.2 1.80.2 4.00.1 0.8 CK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 CK2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.85 1.50.2 2.30.2 4.00.1 CKS2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.650.1 1.150.1 2.00.05 0.5 LK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 LK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 LK2125 0805 0.0330.0590.0080.0910.0080.1570.004 0.400.06 0.700.06 2.00.05 0.3 HK0603 0201 0.0120.0160.0020.0280.0020.0790.002 0.650.1 1.150.1 2.00.05 0.5 HK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 HK1608 0603 0.0310.0390.0080.0710.0080.1570.004 0.3 0.400.06 0.700.06 2.00.05 HKQ0603S0201 0.0120.0160.0020.0280.0020.0790.002 0.750.1 1.150.1 2.00.05 0.5 AQ105 0402 0.0200.0300.0040.0450.0040.0790.002 0.250.04 0.450.04 2.00.05 0.2 BK0402 01005 0.0080.0100.0020.0180.0020.0790.002 0.400.06 0.700.06 2.00.05 0.3 BK0603 0201 0.0120.0160.0020.0280.0020.0790.002 Type 10000 CK CK CKS L K L K L K HK HK HK HKQ AQ BK BK BK BK BK BK BKP BKP BKP BKP Thickness mm inch Chip cavity Tape Thickness T 1.1 0.043max 1.1 0.043max 1.1 0.043max 0.8 0.031max 1.1 0.043max 1.1 0.043max 0.45 0.018max 0.8 0.031max 1.1 0.043max 0.45 0.018max 0.8 0.031max 0.36 0.014max 0.45 0.018max To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP1 11 mlci0109_reli_e-01 PACKAGING Insertion Pitch A B F 0.650.1 1.150.1 2.00.05 0.5 BK1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 BK1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 BK2125 0805 0.0330.0590.0080.0910.0080.1570.004 1.20.1 2.170.1 4.00.1 0.45 BK2010 0804 0.0180.0470.0040.0850.0040.1570.004 0.400.06 0.700.06 2.00.05 0.3 BKP0603 0201 0.0120.0160.0020.0280.0020.0790.002 0.650.1 1.150.1 2.00.05 0.5 BKP1005 0402 0.0200.0260.0040.0450.0040.0790.002 1.00.2 1.80.2 4.00.1 0.8 BKP1608 0603 0.0310.0390.0080.0710.0080.1570.004 1.50.2 2.30.2 4.00.1 0.85 BKP2125 0805 0.0330.0590.0080.0910.0080.1570.004 Thickness mm inch Type Chip cavity Tape Thickness T 0.8 0.031max 1.1 0.043max 1.1 0.043max 0.8 0.031max 0.45 0.018max 0.8 0.031max 1.1 0.043max 1.1 0.043max Reel Size 2.00.5 0.0790.031 13.00.2 0.5120.020 Unit : mminch Top tape strength Embossed Tape (0.315 inches wide) The top tape requires a peel-off force of 0.10.7N in the direction of the arrow as illustrated below. Unit : mminch Thickness mm inch Type CK21250805 CKS21250805 CKP20120805 CKP20160806 CKP25201008 NM20120805 NM25201008 LK21250805 HK21250805 BK21250805 BK32161206 1.25 0.049 1.25 0.049 0.9 0.035 0.9 0.035 0.7 0.028 0.9 0.035 1.1 0.043 0.9 0.035 1.1 0.043 1.25 0.049 0.85 0.033 1.0 0.039 1.25 0.049 0.8 0.031 Tape Insertion Thickness Pitch A B F K T 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.550.2 2.30.2 4.00.1 1.3 0.3 0.0610.008 0.0910.008 0.1570.004 0.051 0.012 1.80.1 2.20.1 4.00.1 1.3 0.25 0.0710.004 0.0870.004 0.1570.004 0.051 0.01 1.4 0.055 1.4 0.3 2.30.1 2.80.1 4.00.1 0.0910.004 0.1100.004 0.1570.004 0.055 0.012 1.7 0.067 1.550.2 2.30.2 4.00.1 1.3 0.3 0.0610.008 0.0910.008 0.1570.004 0.051 0.012 2.30.1 2.80.1 4.00.1 1.7 0.3 0.0910.004 0.1100.004 0.1570.004 0.067 0.012 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.5 0.059 0.3 1.50.2 2.30.2 4.00.1 0.0590.008 0.0910.008 0.1570.004 2.0 0.012 0.079 1.50.2 2.30.2 4.00.1 2.0 0.3 0.0590.008 0.0910.008 0.1570.004 0.079 0.012 1.90.1 3.50.1 4.00.1 1.4 0.3 0.0750.004 0.1380.004 0.1570.004 0.055 0.012 Chip cavity LEADER AND BLANK PORTION 160mm or more 6.3inches or more 100mm or more 3.94inches or more Direction of tape feed 400mm ore more 15.7inches or more This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP2 RELIABILITY DATA Multilayer chip inductors and beads 1. Operating Temperature Range BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 2. Storage Temperature Range BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 55125 5585 4085 55125 4085 55125 55125 5585 4085 55125 4085 55125 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP3 11 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 3. Rated Current BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 240540mA DC 100500mA 1201000mA 1501500mA 2001200mA 100mA 100200mA 1.0A 8002000mA DC 1.03.0A 1.54.0A 5060mA DC 60500mA DC 110280mA DC 0.71.2A DC 0.91.6A DC 1.11.8A DC 0.81.5A DC 0.91.1A DC 2025mA DC 1150mA DC 5300mA DC 60470mA DC 110300mA DC 150300mA DC 300mA DC 130600mA DC 280710mA DC Definition of rated current In the CK, CKS and BK Series, the rated current is the value of current at which the temperature of the element is increased within 20. In the BK Series P type and CK Series P type, NM Series the rated current is the value of current at which the temperature of the element is increased within 40. In the LK,HK,HKQ,and AQ Series, the rated current is either the DC value at which the internal L value is decreased within 5% with the application of DC bias, or the value of current at which the temperature of the element is increased within 20. 4. Impedance BK0402 10120 25% BK0603 10600 25% 101800 25% BK1005 222500 25% BK1608 152500 25% BK2125 BK2010 51000 25% ARRAY 681000 25% BK3216 2233 25% BKP0603 10220 25% BKP1005 33470 25% BKP1608 33330 25% BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 Test Methods and Remarks BK0402 Series Measuring frequency1001MHz Measuring equipmentHP4991A or its equivalent Measuring jig16196D or its equivalent BK0603 Series, BKP0603 Series Measuring frequency1001MHz Measuring equipmentHP4291A or its equivalent Measuring jig16193A or its equivalent BK1005 Series, BKP1005 Series Measuring frequency1001MHz Measuring equipmentHP4291A or its equivalent Measuring jig16192A or its equivalent, 16193A or its equivalent BK16082125 Series, BKP16082125 Series Measuring frequency1001MHz Measuring equipmentHP4291A or its equivalent, HP4195A or its equivalent Measuring jig16092A or its equivalentor 16192A or its equivalent/HW BK20103216 Series Measuring frequency1001MHz Measuring equipmentHP4291A or its equivalent, HP4195A or its equivalent Measuring jig16192A or its equivalent ---- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP4 RELIABILITY DATA Multilayer chip inductors and beads 5. Inductance BK0402 BK0603 BK1005 BK1608 BK2125 ---- BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 4.710.0H20% CK2125 0.110.0H20% CKS2125 1.010.0H20% CKP2012 0.474.7H20% CKP2016 0.474.7H20% CKP2520 0.474.7H20% NM2012 0.821.0H20% NM2520 1.02.2H20% LK1005 0.122.2H10% Q 0.122.2H30% LK1608 0.04733.0H20% 0.1012.0H10% Q 0.122.2H30% LK2125 0.04733.0H20% 0.1012.0H10% Q 0.122.2H30% HK0603 1.06.2nH0.3nH 6.8100nH5% HK1005 1.06.2nH0.3nH 6.8270nH5% HK1608 1.05.6nH0.3nH 6.8470nH5% HK2125 1.55.6nH0.3nH 6.8470nH5% HKQ0603S 0.66.2nH0.3nH 6.822nH5% AQ105 1.06.2nH0.3nH 6.815nH5% Test Methods and Remarks CK Series Measuring frequency2 to 4MHzCK1608 Measuring frequency2 to 25MHzCK2125 Measuring frequency2 to 10MHzCKS2125 LK Series Measuring frequency10 to 25MHzLK1005 Measuring frequency1 to 50MHzLK1608 Measuring frequency0.4 to 50MHzLK2125 CKP Series, NM Series Measuring frequency1MHz CKP2012, CKP2016, CKP2520, NM2012NM2520 Measuring equipment, jigHP4194A16085B16092A or its equivalent HP4195A4195116092A or its equivalent HP4294A16192A or its equivalent HP4291A16193A or its equivalent/LK1005 HP4285A42841A42842C4285161100 CKP2012CKP2016CKP2520NM2012NM2520 Measuring current1mA rms 0.047 to 4.7H 0.1mA rms 5.6 to 33H HKHKQAQ Series Measuring frequency100MHz HK0603HK1005AQ105 Measuring frequency50/100MHz HK1608HK2125 Measuring frequency500MHz HKQ0603S Measuring equipment, jigHP4291A16197A or its equivalent/HK0603AQ105 HP4291A16193A or its equivalent/HK1005 E4991A16197A or its equivalent/HKQ0603S HP4291A16092in-house made jig or its equivalent/HK1608HK2125 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP5 11 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 6. Q BK0402 BK0603 BK1005 BK1608 BK2125 ARRAY ---- BK2010 BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 20 min. 1520 min. CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 1020 min. LK1608 1035 min. 1550 min. LK2125 45 min. HK0603 8 min. HK1005 HK1608 812 min. HK2125 1018 min. 1013 min. HKQ0603S 8 min. AQ105 Test Methods and Remarks CK Series Measuring frequency2 to 4MHz CK1608 Measuring frequency2 to 25MHz CK2125 LK Series Measuring frequency10 to 25MHz LK1005 Measuring frequency1 to 50MHz LK1608 Measuring frequency0.4 to 50MHz LK2125 Measuring equipment, jigHP4194A16085B16092A or its equivalent HP4195A4195116092A or its equivalent HP4294A16192A or its equivalent HP4291A16193A or its equivalent/LK1005 Measuring current1mA rms 0.047 to 4.7H 0.1mA rms 5.6 to 33H HKHKQAQ Series Measuring frequency100MHz HK0603HK1005AQ105 Measuring frequency50/100MHz HK1608HK2125 Measuring frequency500MHz HKQ0603S Measuring equipment, jigHP4291A16197A or its equivalent/HK0603AQ105 HP4291A16193A or its equivalent/HK1005 E4991A16197A or its equivalent/HKQ0603S HP4291A16092A in-house made jig or its equivalent/HK1608HK2125 7. DC Resistance BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 ---- 0.100.53 max. 0.0651.50 max. 0.030.80 max. 0.051.10 max. 0.050.75 max. 0.100.90 max. 0.150.80 max. 0.0650.070 max. 0.0300.20 max. 0.0250.18 max. 0.0200.075 max. 0.450.8530% 0.160.65 max. 0.090.40 typ. 0.120.52 max. 0.100.28 max. 0.080.20 max. 0.050.16 max. 0.100.19 max. 0.130.22 max. 0.411.16 max. 0.22.2 max. 0.11.1 max. 0.113.74 max. 0.084.8 max. 0.052.6 max. 0.101.5 max. 0.061.29 max. 0.070.45 max. CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 Test Methods and Remarks Measuring equipmentVOAC-7412 made by Iwasaki Tsushinki VOAC-7512 made by Iwasaki Tsushinki This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP6 RELIABILITY DATA Multilayer chip inductors and beads 8. Self Resonance Frequency SRF BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 1725MHz min. 24235MHz min. CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 40180MHz min. LK1608 9260MHz min. 13320MHz min. LK2125 90010000MHz min. HK0603 40010000MHz min. HK1005 30010000MHz min. HK1608 2004000MHz min. HK2125 190010000MH min. HKQ0603S 230010000MHz min. AQ105 Test Methods and Remarks LK Series Measuring equipmentHP4195A or its equivalent Measuring jig4195116092A or its equivalent HKHKQAQ Series Measuring equipmentHP8719C or its equivalent HP8753D or its equivalent/HK2125 ---- ---- 9. Temperature Characteristic BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 Inductance changeWithin 10 HK2125 HKQ0603S AQ105 Test Methods and Remarks HKHKQAQ SeriesTemperature range30 to 85 Reference temperature20 ---- This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP7 11 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 10. Resistance to Flexure of Substrate BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 No mechanical damage. CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 Test Methods and Remarks Warp2mmBK Series without 0402size, BKP, CK, CKS, CKP, NM, LK, HK, HKQ, AQ Series 1mmBK0402 Series Testing boardglass epoxy-resin substrate Thickness0.8mm 11. Solderability BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 LK2125 HK0603 HK1005 HK1608 HK2125 HKQ0603S AQ105 Test Methods and Remarks Solder temperature2305 Duration41 sec. At least 75 of terminal electrode is covered by new solder. At least 75 of terminal electrode is covered by new solder. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP8 RELIABILITY DATA Multilayer chip inductors and beads 12. Resistance to Soldering BK0402 BK0603 BK1005 BK1608 BK2125 AppearanceNo significant abnormality. BK2010 Impedance changeWithin 30 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. CK2125 Remaining terminal electrode70 min. CKS2125 CKP2012 Inductance change R104R7 Within 10 CKP2016 6R8100 Within 15 CKP2520 CKS2125 Within 20 NM2012 CKP2012CKP2016CKP2520NM2012NM2520Within 30 NM2520 LK1005 No mechanical damage. Remaining terminal electrode70 min. Inductance changeWithin 15 LK1608 No mechanical damage. Remaining terminal electrode70 min. Inductance change 47N4R7Within 10 5R6330Within 15 LK2125 HK0603 HK1005 HK1608 No mechanical damage. Remaining terminal electrode70 min. Inductance changeWithin 5 HK2125 HKQ0603S AQ105 Test Methods and Remarks Solder temperature2605 Duration100.5 sec. Preheating temperature150 to 180 Preheating time3 min. FluxImmersion into methanol solution with colophony for 3 to 5 sec. Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 13. Thermal Shock BK0402 BK0603 BK1005 BK1608 BK2125 AppearanceNo significant abnormality. BK2010 Impedance changeWithin 30 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 CK2125 Inductance changeWithin 20CKS2125 CKS2125 CKP2012 CKP2016 CKP2520 No mechanical damage. Inductance changeWithin 30 NM2012 NM2520 LK1005 No mechanical damage. LK1608 Inductance changeWithin 10 Q changeWithin 30 LK2125 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S AQ105 Test Methods and Remarks Conditions for 1 cycle Step 1Minimum operating temperature 0 3 303 min. Step 2Room temperature 2 to 3 min. 3 Step 3Maximum operating temperature 0 303 min. Step 4Room temperature 2 to 3 min. Number of cycles5 Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 (Note 1) When there are questions concerning mesurement resultmeasurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP9 11 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 14. Damp HeatSteady state BK0402 BK0603 BK1005 BK1608 BK2125 AppearanceNo significant abnormality. BK2010 Impedance changeWithin 30 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 CK2125 CKS2125 Inductance changeWithin 20 CKP2012 CKP2016 CKP2520 No mechanical damage. Inductance changeWithin 30 NM2012 NM2520 LK1005 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 LK1608 LK2125 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S AQ105 Test Methods and Remarks BK Series Temperature402 Humidity90 to 95RH Duration50024 0 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 LKCKCKSCKPNMHKHKQAQ Series Temperature402LKCKCKSCKPNM Series 602HKHKQAQ Series Humidity90 to 95RH Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP10 RELIABILITY DATA Multilayer chip inductors and beads 15. Loading under Damp Heat BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 AppearanceNo significant abnormality. Impedance changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 No mechanical damage. Inductance changeWithin 30 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 No mechanical damage. Inductance change0.047 to 12.0HWithin 10 15.0 to 33.0HWithin 15 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 LK2125 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S AQ105 Test Methods and Remarks BK Series Temperature402 Humidity90 to 95RH Applied currentRated current Duration50024 0 hrs See Note 1 Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. LKCKCKSCKPNMHKHKQAQ Series Temperature402LKCKCKSCKPNM Series 602HKHKQAQ Series Humidity90 to 95RH Applied currentRated current Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP11 11 mlci0109_reli_e-01 RELIABILITY DATA Multilayer chip inductors and beads 16. Loading at High Temperature BK0402 BK0603 BK1005 BK1608 BK2125 BK2010 ARRAY BK3216 BKP0603 BKP1005 BKP1608 BKP2125 CK1608 CK2125 CKS2125 CKP2012 CKP2016 CKP2520 NM2012 NM2520 LK1005 LK1608 AppearanceNo significant abnormality Impedance changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 No mechanical damage. Inductance changeWithin 30 No mechanical damage. Inductance changeWithin 10 Q changeWithin 30 No mechanical damage. Inductance change0.047 to 12.0HWithin 10 15.0 to 33.0HWithin 15 Q changeWithin 30 No mechanical damage. Inductance changeWithin 20 Q changeWithin 30 LK2125 HK0603 HK1005 HK1608 No mechanical damage. Inductance changeWithin 10 Q changeWithin 20 HK2125 HKQ0603S AQ105 Test Methods and Remarks BK Series Temperature1253 Applied currentRated current Duration50024 0 hrs Recovery2 to 3 hrs of recovery under the standard condition after the removal from test chamber. See Note 1 LKCKCKSCKPNMHKHKQAQBKP Series Temperature852LKCKCKSCKPNMBKP Series 852HK16082125 852HK1005, AQ105 operating temperature range 55 to 85 1252HK0603, HK1005, HKQ0603S, AQ105 operating temperature range 55 to 125 Applied currentRated current Duration50012 hrs Recovery2 to 3 hrs of recovery under the standard condition after the test. See Note 1 Note on standard condition: "standard condition" referred to herein is defined as follows: 5 to 35 of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure. When there are questions concerning measurement results: In order to provide correlation data, the test shall be conducted under condition of 202 of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air pressure. Unless otherwise specified, all the tests are conducted under the "standard condition." (Note 1) Measurement shall be made after 482 hrs of recovery under the standard condition. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP12 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads 1. Circuit Design Verification of operating environment, electrical rating and performance 1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social ramifications. As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly differentiated from components used in general purpose applications. Precautions Operating CurrentVerification of Rated current 1. The operating current for inductors must always be lower than their rated values. 2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect. 2. PCB Design Pattern configurations Design of Land-patterns 1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used size of filletcan directly affect inductor performance. Therefore, the following items must be carefully considered in the design of solder land patterns: 1The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder pads which in turn determines the amount of solder necessary to form the fillets. 2When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's soldering point is separated Precautions by solder-resist. 3The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to design land patterns smaller than terminal electrode of chips. Pattern configurations Inductor layout on panelizedbreakawayPC boards 1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered boards etc.For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to minimize stress. Pattern configurations Design of Land-patterns 1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts larger fillets which extend above the component end terminations. Examples of improper pattern designs are also shown. 1Recommended land dimensions for a typical chip inductor land patterns for PCBs Recommended land dimensions for wave-soldering 1608 2125 3216 1.6 2.0 3.2 0.8 1.25 1.6 0.81.0 1.01.4 1.82.5 0.50.8 0.81.5 0.81.7 0.60.8 0.91.2 1.21.6 Recommended land dimensions for reflow-soldering Type L W A B C Size Size Type L W A B C 0402 0603 1005 105 1608 2012 2125 2016 3216 2520 0.4 0.6 1.0 1.0 1.6 2.0 2.0 2.0 3.2 2.5 0.2 0.3 0.5 0.6 0.8 1.25 1.25 1.6 1.6 2.0 0.150.25 0.200.30 0.450.55 0.500.55 0.81.0 0.81.2 0.81.2 0.81.2 1.82.5 1.01.4 0.100.20 0.200.30 0.400.50 0.300.40 0.60.8 0.81.2 0.81.2 0.81.2 0.61.5 0.61.0 0.150.30 0.250.40 0.450.55 0.600.70 0.60.8 0.91.6 0.91.6 1.22.0 1.22.0 1.82.2 Unitmm Unitmm Excess solder can affect the ability of chips to withstand mechanical stresses. Therefore, please take proper precautions when designing land-patterns. Recommended land dimension for Reflow-soldering Size Technical considerations Type L W a b c d 3216 3.2 1.6 0.70.9 0.81.0 0.40.5 0.8 2010 2.0 1.0 0.50.6 0.50.6 0.20.3 0.5 Unitmm 2Examples of good and bad solder application Item Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP13 11 mlci0109_reli_e-01 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads 2. PCB Design Pattern configurations Inductor layout on panelizedbreakawayPC boards 1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical stresses from board warp or deflection. Item Not recommended Recommended Deflection of the board Technical considerations 1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary depending on inductor layout. An example below should be counted for better design. 1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure. 3. Considerations for automatic placement Adjustment of mounting machine 1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards. 2. The maintenance and inspection of the mounter should be conducted periodically. Precautions Selection of Adhesives 1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and amounts of adhesive to use. Adjustment of mounting machine 1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the following points should be considered before lowering the pick-up nozzle: 1The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the board. 2The pick-up pressure should be adjusted between 1 and 3N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement: Item Improper method Proper method Single-sided mounting Double-sided mounting 2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance, inspection and replacement of the pin should be conducted periodically. Technical considerations Selection of Adhesives 1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect component placement, so the following precautions should be noted in the application of adhesives. 1Required adhesive characteristics a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive should have sufficient strength at high temperatures. c. The adhesive should have good coating and thickness consistency. d. The adhesive should be used during its prescribed shelf life. e. The adhesive should harden rapidly. f. The adhesive must not be contaminated. g. The adhesive should have excellent insulation characteristics. h. The adhesive should not be toxic and have no emission of toxic gasses. 2When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad. Recommended conditions Figure a b c 0805 case sizes as examples 0.3mm min 100120m Area with no adhesive This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP14 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads 4. Soldering Selection of Flux 1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use; 1Flux used should be with less than or equal to 0.1 wt%Chlorine conversion methodof halogenated content. Flux having a strong acidity content should not be applied. 2When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level. Precautions 3When using water-soluble flux, special care should be taken to properly clean the boards. Soldering 1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us about peak temperature when you use lead-free paste. Selection of Flux 1-1. When too much halogenated substance Chlorine, etc.content is used to activate the flux, or highly acidic flux is used, an excessive amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the surface of the Inductor. 1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux. Soldering 1-1. Preheating when soldering Heating: Chip inductor components should be preheated to within 100 to 130 of the soldering. Cooling: The temperature difference between the components and cleaning process should not be greater than 100. Chip inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock. Recommended conditions for soldering Reflow soldering Temperature profile Temperature 300 Pb free soldering Peak 260 max 10 sec max 200 Gradually cooling Preheating 100 0 150 60 sec min Heating above 230 40 sec max Ceramic chip components should be preheated to within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Caution Temperature Pb free soldering 1. The ideal condition is to have solder mass filletcontrolled to 1/2 to 1/3 of the thickness of the inductor, as shown below: Pb free soldering Temperature 300 300 Peak 260 max Peak 260 max 10 sec max 10 sec max 200 200 Gradually Gradually cooling cooling Preheating 150 Preheating 100 100 150 Heating above 230 Temperature sec min Pb free 12060 sec min 40 soldering sec max 0 Technical considerations 3000 2. Because excessive dwell times can detrimentally affect solderability, soldering shouldtobe kept as close to recommended times as possible. maxduration CeramicPeak chip 260 components should be preheated Wave soldering Temperature profile Ceramic chip components should be preheated to max within 10010 to sec 130 of the soldering. within 100 to 130 of the soldering. Assured to be reflow soldering for 2 times. Assured to be wave soldering for 1 time. Except for reflow soldering type. Gradually cooling Preheating 200 100 Temperature Pb Temperature Pb free free soldering soldering 150 Heating above 230 300 400 Peak max 60260 sec min 40 sec maxmax 350 0 10 sec max 3 sec max 300 Ceramic chip components should be preheated to 200 within 100 to 130 Gradually of the soldering. Gradually Preheating Assured to be reflow soldering for 2 times. cooling cooling 150 200 100 100 120 sec60min sec min Pb free soldering Temperature 30000 max should be preheated to CeramicPeak chip260 components T190 3216Type max , 1303225 max within 10010 to sec 130 of the soldering. Type ming Assured to be wave soldering for 1 time. It is recommended to use 20W soldering iron and 200 Except for reflow soldering type. Gradually the tipPreheating is 1 or less. cooling The soldering the 150iron should not directly touch Caution 100 components. Assured iron for 1 time. Temperature to be solderingPb free soldering 1. Make sure the inductors are preheated sufficiently. 400 120 sec min 350 max 100 to 130. Note: Theshould above profiles thegreater maximum allowable 2. The temperature difference between the inductor and melted0solder notarebe than 3 sec max are soldering condition, therefore these profiles 3. Cooling after soldering should be as gradual as possible. 300 Ceramic chip components should be preheated to not always recommended. Gradually within 100 to 130 the soldering. ofsoldering 4. Wave soldering must not be applied to the inductors designated as for reflow only. cooling Assured to be wave soldering for 1 time. 200 Hand soldering Temperature profile Except for reflow soldering type. 100 Temperature 4000 60 sec min Pb free soldering 350 max T1903216Type max , 1303225 3 sec max 300 Type ming It is recommended iron and Gradually to use 20W soldering the tip is 1 or less. cooling 200 The soldering iron should not directly touch the components. 100 Assured to be soldering iron for 1 time. 60 sec min Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are T190 3216Type max , 1303225 not always recommended. Type ming It is recommended to use 20W soldering iron and the tip is 1 or less. The soldering iron should not directly touch the components. Assured to be soldering iron for 1 time. 0 Note: The above profiles are the maximum allowable soldering condition, therefore these profiles are not always recommended. Caution 1. Use a 20W soldering iron with a maximum tip diameter of 1.0 mm. 2. The soldering iron should not directly touch the inductor. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli-PRP15 11 mlci0109_reli_e-01 PRECAUTIONS Precautions on the use of Multilayer chip Inductors, Multilayer chip inductors for high frequency, Multilayer ferrite chip beads 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux used and purpose of the cleaning e.g. to remove soldering flux or other materials from the production process. 2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's characteristics. Cleaning conditions 1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation of the inductor's electrical properties especially insulation resistance. 2. Inappropriate cleaning conditions insufficient or excessive cleaningmay detrimentally affect the performance of the inductors. 1Excessive cleaning a. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Thus the following conditions should be carefully checked; Ultrasonic output Below 20W/ Ultrasonic frequency Below 40kHz Ultrasonic washing period 5 min. or less 6. Post cleaning processes Application of resin coatings, moldings, etc. to the PCB and components. 1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the inductor's performance. 2. When a resin's hardening temperature is higher than the inductor's operating temperature, the stresses generated by the excess heat may lead to inductor Precautions damage or destruction. 3. Stress caused by a resin's temperature generated expansion and contraction may damage inductors. The use of such resins, molding materials etc. is not recommended. 7. Handling splitting along perforations Breakaway PC boards 1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection or twisting to the board. 2. Board separation should not be done manually, but by using the appropriate devices. General handling precautions 1. Always wear static control bands to protect against ESD. 2. Keep the inductors away from all magnets and magnetic objects. 3. Use non-magnetic tweezers when handling inductors. Precautions 4. Any devices used with the inductorssoldering irons, measuring instrumentsshould be properly grounded. 5. Keep bare hands and metal products i.e., metal deskaway from chip electrodes or conductive areas that lead to chip electrodes. 6. Keep inductors away from items that generate magnetic fields such as speakers or coils. Mechanical considerations 1. Be careful not to subject the inductors to excessive mechanical shocks. 1If inductors are dropped on the floor or a hard surface they should not be used. 2When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature Below 40 Humidity Below 70% RH Precautions The ambient temperature must be kept below 30. Even under ideal storage conditions inductor electrode solderability decreases as time passes, so inductors should be used within 6 months from the time of delivery. Technical considerations *The packaging material should be kept where no chlorine or sulfur exists in the air. Storage 1. If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6 months from the time of delivery. If exceeding the above period, please check solderability before using the inductors. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlci0109_reli_e-01 11 mlci0109_reli-PRP16