Dual Low Power, 8-/10-/12-/14-Bit
TxDAC Digital-to-Analog Converters
Data Sheet
AD9114/AD9115/AD9116/AD9117
Rev. D Document Feedback
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FEATURES
Power dissipation @ 3.3 V, 20 mA output
191 mW @ 10 MSPS
232 mW @ 125 MSPS
Sleep mode: <3 mW @ 3.3 V
Supply voltage: 1.8 V to 3.3 V
SFDR to Nyquist
86 dBc @ 1 MHz output
85 dBc @ 10 MHz output
AD9117 NSD @ 1 MHz output, 125 MSPS, 20 mA: −162 dBc/Hz
Differential current outputs: 2 mA to 20 mA
2 on-chip auxiliary DACs
CMOS inputs with single-port operation
Output common mode: adjustable 0 V to 1.2 V
Small footprint 40-lead LFCSP RoHS-compliant package
APPLICATIONS
Wireless infrastructures
Picocell, femtocell base stations
Medical instrumentation
Ultrasound transducer excitation
Portable instrumentation
Signal generators, arbitrary waveform generators
GENERAL DESCRIPTION
The AD9114/AD9115/AD9116/AD9117 are pin-compatible
dual, 8-/10-/12-/14-bit, low power digital-to-analog converters
(DACs) that provide a sample rate of 125 MSPS. These TxDAC®
converters are optimized for the transmit signal path of commu-
nication systems. All the devices share the same interface, package,
and pinout, providing an upward or downward component
selection path based on performance, resolution, and cost.
The AD9114/AD9115/AD9116/AD9117 offer exceptional ac and
dc performance and support update rates up to 125 MSPS.
The flexible power supply operating range of 1.8 V to 3.3 V and
low power dissipation of the AD9114/AD9115/AD9116/AD9117
make them well suited for portable and low power applications.
PRODUCT HIGHLIGHTS
1. Low Power. DACs operate on a single 1.8 V to 3.3 V supply;
total power consumption reduces to 225 mW at 100 MSPS.
Sleep and power-down modes are provided for low power
idle periods.
2. CMOS Clock Input. High speed, single-ended CMOS clock
input supports a 125 MSPS conversion rate.
3. Easy Interfacing to Other Components. Adjustable output
common mode from 0 V to 1.2 V allows for easy interfacing
to other components that accept common-mode levels
greater than 0 V.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 2 of 52
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications ....................................................................................... 1
General Description ......................................................................... 1
Product Highlights ........................................................................... 1
Revision History ............................................................................... 3
Functional Block Diagram .............................................................. 4
Specifications ..................................................................................... 5
DC Specifications ......................................................................... 5
Digital Specifications ................................................................... 7
AC Specifications .......................................................................... 8
Absolute Maximum Ratings ............................................................ 9
Thermal Resistance ...................................................................... 9
ESD Caution .................................................................................. 9
Pin Configurations and Function Descriptions ......................... 10
Typical Performance Characteristics ........................................... 18
Terminology .................................................................................... 31
Theory of Operation ...................................................................... 32
Serial Peripheral Interface (SPI) ................................................... 33
General Operation of the Serial Interface ............................... 33
Instruction Byte .......................................................................... 33
Serial Interface Port Pin Descriptions ..................................... 33
MSB/LSB Transfers..................................................................... 34
Serial Port Operation ................................................................. 34
Pin Mode ..................................................................................... 34
SPI Register Map ............................................................................. 35
SPI Register Descriptions .............................................................. 36
Digital Interface Operation ........................................................... 40
Digital Data Latching and Retimer Section ............................ 41
Estimating the Overall DAC Pipeline Delay........................... 42
Reference Operation .................................................................. 43
Reference Control Amplifier .................................................... 43
DAC Transfer Function ............................................................. 43
Analog Output ............................................................................ 44
Self-Calibration ........................................................................... 44
Coarse Gain Adjustment ........................................................... 45
Using the Internal Termination Resistors ............................... 46
Applications Information .............................................................. 47
Output Configurations .............................................................. 47
Differential Coupling Using a Transformer ............................... 47
Single-Ended Buffered Output Using an Op Amp ................ 47
Differential Buffered Output Using an Op Amp .................. 48
Auxiliary DACs........................................................................... 48
DAC-to-Modulator Interfacing ................................................ 49
Correcting for Nonideal Performance of Quadrature
Modulators on the IF-to-RF Conversion ................................ 49
I/Q Channel Gain Matching ..................................................... 49
LO Feedthrough Compensation .............................................. 50
Results of Gain and Offset Correction .................................... 50
Outline Dimensions ....................................................................... 51
Ordering Guide .......................................................................... 52
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 3 of 52
REVISION HISTORY
12/2017—Rev. C to Rev. D
Changes to Figure 94 ...................................................................... 41
Changes to Estimating the Overall DAC Pipeline Delay Section .. 42
Updated Outline Dimensions ........................................................ 51
Changes to Ordering Guide ........................................................... 52
3/2013—Rev. B to Rev. C
Change to Features Section .............................................................. 1
Change to Endnote 1, Table 1 .......................................................... 6
Changes to Figure 86 and Figure 88 ............................................. 34
Change to Table 13 .......................................................................... 35
Change to Version Register Description, Table 14 ..................... 39
Changes to Table 17 and Reference Control Amplifier
Section .............................................................................................. 43
Changes to Using the Internal Termination Resistors
Section .............................................................................................. 46
Changes to Single-Ended Buffered Output Using an Op Amp
Section .............................................................................................. 47
Changes to Differential Buffered Output Using an Op Amp
Section .............................................................................................. 48
Updated Outline Dimensions ........................................................ 51
5/2012—Rev. A to Rev. B
Changes to Table 1 ............................................................................ 5
Changes to Table 2 ............................................................................ 7
Changes to Table 3 and Table 4 ....................................................... 8
Changes to Theory of Operation Section .................................... 32
Changes to SCLK—Serial Clock Section ..................................... 33
Changes to Pin Mode Section ........................................................ 34
Changes to Table 14 ........................................................................ 37
Changes to Self-Calibration Section ............................................. 44
Deleted Modifying the Evaluation Board to Use the ADL5370
On-Board Quadrature Modulator Section .......................................... 51
Deleted Evaluation Board Schematics and Artwork Section and
Figure 111 to Figure 133, Renumbered Sequentially.................. 52
Updated Outline Dimensions ........................................................ 51
Changes to Ordering Guide ........................................................... 52
Deleted Bill of Materials Section and Table 18 ............................ 75
3/2009—Rev. 0 to Rev. A
Changes to Product Title and General Description Section ....... 1
Changes to Figure 1 .......................................................................... 4
Changed IOUTFS = 2 mA to IxOUTFS = 20 mA .................................... 5
Changes to Table 1 ............................................................................ 6
Changed IOUTFS = 2 mA to IxOUTFS = 20 mA .................................... 7
Changes to Table 2 ............................................................................ 7
Changed DVDDIO = 1.8 V to DVDDIO = 3.3 V, Table 3 and
CVDD = 3.3 V to CVDD = 1.8 V, Table 4 ..................................... 8
Changes to Table 5 and Table 6 ....................................................... 9
Changes to Table 7 .......................................................................... 10
Changes to Table 8 .......................................................................... 12
Changes to Table 9 .......................................................................... 14
Changes to Table 10 ........................................................................ 16
Changes to Typical Performance Characteristics Section ......... 18
Changes to Theory of Operation Section and Figure 84 ........... 32
Added Figure 85 to Figure 88; Renumbered Sequentially ......... 34
Changes to Table 13 ........................................................................ 35
Changes to Table 14 ........................................................................ 36
Changes to Digital Interface Operation Section and Figure 89,
Figure 90, Figure 91, Figure 92, and Figure 93 ............................ 40
Changes to Figure 94, Digital Data Latching Section, and
Retimer Section ............................................................................... 41
Added Reference Operation Section, Reference Control
Amplifier Section, DAC Transfer Function Section, Figure 96,
and Table 17 ..................................................................................... 43
Added Analog Output Section ...................................................... 44
Changes to Auxiliary DACs Section ............................................. 48
Changes to DAC to Modulator Interfacing Section, Figure 107,
and Figure 108 ................................................................................. 49
Added Figure 111 to Figure 133 .................................................... 52
Added Table 18 ................................................................................ 75
8/2008—Revision 0: Initial Version
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 4 of 52
FUNCTIONAL BLOCK DIAGRAM
I DAC
Q DAC
AUX1DAC
AUX2DAC
BAND
GAP
CLOCK
DIST
10kΩ
QR
SET
2kΩ
IR
SET
2kΩ
I
REF
100µA
IR
CM
60Ω TO
260Ω
QR
CM
60Ω TO
260Ω
62.5Ω
62.5Ω
62.5Ω
62.5Ω
SPI
INTERFACE
1 INTO 2
INTERLEAVED
DATA
INTERFACE
I DATA
Q DATA
1.8V
LDO
1V
AD9117
RLIN
IOUTN
IOUTP
RLIP
AVDD
AVSS
RLQP
QOUTP
QOUTN
RLQN
DB11
DB10
DB9
DB8
DVDDIO
DVSS
DVDD
DB7
DB6
DB5
DB12
DB13 (MSB)
CS/PWRDN
SDIO/FORMAT
SCLK/CLKMD
RESET/PINMD
REFIO
FSADJQ/AUXQ
FSADJI/AUXI
CMLI
DB4
DB3
DB2
DB1
(LSB) DB0
DCLKIO
CVDD
CLKIN
CVSS
CMLQ
07466-001
Figure 1.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 5 of 52
SPECIFICATIONS
DC SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 20 mA, maximum sample rate, unless otherwise noted.
Table 1.
Parameter
AD9114 AD9115 AD9116 AD9117
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
RESOLUTION 8 10 12 14 Bits
ACCURACY, AVDD = DVDDIO =
CVDD = 3.3 V
Differential Nonlinearity (DNL)
Precalibration ±0.02 ±0.06 ±0.4 ±1.4 LSB
Postcalibration ±0.02 ±0.04 ±0.2 ±0.6 LSB
Integral Nonlinearity (INL)
Precalibration ±0.03 ±0.19 ±0.68 ±1.2 LSB
Postcalibration ±0.03 ±0.07 ±0.42 ±0.6 LSB
ACCURACY, AVDD = DVDDIO =CVDD =
1.8 V
Differential Nonlinearity (DNL)
Precalibration ±0.02 ±0.08 ±0.5 ±1.8 LSB
Postcalibration ±0.01 ±0.06 ±0.2 ±1.0 LSB
Integral Nonlinearity (INL)
Precalibration ±0.04 ±0.2 ±0.5 ±1.8 LSB
Postcalibration ±0.02 ±0.1 ±0.3 ±1.1 LSB
MAIN DAC OUTPUTS
Offset Error −1 +1 −1 +1 −1 +1 −1 +1 mV
Gain Error Internal Reference −2 +2 −2 +2 −2 +2 −2 +2 % of FSR
Full-Scale Output Current
1
AVDD = 3.3 V
2
8
20
2
8
20
2
8
20
2
8
20
mA
AVDD = 1.8 V 2 8 2 8 2 8 2 8 mA
Output Common-Mode Level
(8 mA CMLx Pin)
−0.5 0 +1.2 −0.5 0 +1.2 −0.5 0 +1.2 −0.5 0 +1.2 V
Output Compliance Range
AVDD = 3.3 V, 8 mA Output
Common Mode Level = −0.5 −0.9 −0.1 −0.9 −0.1 −0.9 −0.1 −0.9 −0.1 V
Common Mode Level = 0 −0.4 +0.4 −0.4 +0.4 −0.4 +0.4 −0.4 +0.4 V
Common Mode Level = +1.2 0.8 1.5 0.8 1.5 0.8 1.5 0.8 1.5 V
Output Resistance 200 200 200 200 MΩ
Crosstalk, Q DAC to I DAC
(fOUT = 30 MHz)
95 95 95 95 dB
Crosstalk, Q DAC to I DAC
(fOUT = 60 MHz)
76 76 76 76 dB
MAIN DAC TEMPERATURE DRIFT
Offset 0 0 0 0 ppm/°C
Gain ±40 ±40 ±40 ±40 ppm/°C
Reference Voltage ±25 ±25 ±25 ±25 ppm/°C
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 6 of 52
Parameter
AD9114 AD9115 AD9116 AD9117
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
AUXDAC OUTPUTS
Resolution 10 10 10 10 Bits
Full-Scale Output Current
(Current Sourcing Mode)
125 125 125 125 µA
Voltage Output Mode
Output Compliance Range
(Sourcing 1 mA)
VSS VDD −
0.25
VSS VDD −
0.25
VSS VDD −
0.25
VSS VDD −
0.25
V
Output Compliance Range
(Sinking 1 mA)
VSS +
0.25
VDD VSS +
0.25
VDD VSS +
0.25
VDD VSS +
0.25
VDD V
Output Resistance in Current
Output Mode AVSS to 1 V
1 1 1 1 MΩ
AUXDAC Monotonicity
Guaranteed
10 10 10 10 Bits
REFERENCE OUTPUT
Internal Reference Voltage 0.98 1.025 1.08 0.98 1.025 1.08 0.98 1.025 1.08 0.98 1.025 1.08 V
Output Resistance 10 10 10 10 kΩ
REFERENCE INPUT
Voltage Compliance
AVDD = 3.3 V
0.1
1.25
0.1
1.25
0.1
1.25
0.1
1.25
V
AVDD = 1.8 V 0.1 1.0 0.1 1.0 0.1 1.0 0.1 1.0 V
Input Resistance External
Reference Mode
1 1 1 1 MΩ
DAC MATCHING
Gain Matching −1 +1 −1 +1 −1 +1 −1 +1 % of FSR
ANALOG SUPPLY VOLTAGES
AVDD 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
CVDD 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
DIGITAL SUPPLY VOLTAGES
DVDD 1.7 1.9 1.7 1.9 1.7 1.9 1.7 1.9 V
DVDDIO 1.7 3.5 1.7 3.5 1.7 3.5 1.7 3.5 V
POWER CONSUMPTION, AVDD =
DVDDIO = CVDD = 3.3 V
fDAC = 125 MSPS, IF = 12.5 MHz 220 220 220 220 mW
IAVDD 55 55 55 55 mA
IDVDD + IDVDDIO 10 10 10 10 mA
ICVDD 3 3 3 3 mA
Power-Down Mode with Clock
8.5
8.5
8.5
8.5
mW
Power-Down Mode No Clock 3 3 3 3 mW
Power Supply Rejection Ratio
−0.009
−0.009
−0.009
−0.009
% FSR/V
POWER CONSUMPTION, AVDD =
DVDDIO = CVDD = 1.8 V
fDAC = 125 MSPS, IF = 12.5 MHz 58 58 58 58 mW
IAVDD 24 24 24 24 mA
IDVDD + IDVDDIO 8 8 8 8 mA
ICVDD 2 2 2 2 mA
Power-Down Mode with Clock 12 12 12 12 mW
Power-Down Mode No Clock 850 850 850 850 µW
Power Supply Rejection Ratio −0.007 −0.007 −0.007 −0.007 % FSR/V
OPERATING RANGE −40 +25 +85 −40 +25 +85 −40 +25 +85 −40 +25 +85 °C
1 Based on a 1.6 kΩ external resistor for 20 mA full-scale current.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 7 of 52
DIGITAL SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 20 mA, maximum sample rate, unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit
DAC CLOCK INPUT (CLKIN)
VIH 2.1 3 V
VIL 0 0.9 V
Maximum Clock Rate 125 MSPS
SERIAL PERIPHERAL INTERFACE
Maximum Clock Rate (SCLK) 25 MHz
Minimum Pulse Width High 20 ns
Minimum Pulse Width Low 20 ns
Minimum SDIO and to SCLK Setup, t
DS
10
ns
Minimum SCLK to SDIO Hold, tDH 5 ns
Maximum SCLK to Valid SDIO, tDV 20 ns
Minimum SCLK to Invalid SDIO, tDNV 5 ns
INPUT DATA
1.8 V Q Channel or DCLKIO Falling Edge
Setup 0.25 ns
Hold 1.2 ns
1.8 V I Channel or DCLKIO Rising Edge
Setup 0.13 ns
Hold 1.1 ns
3.3 V Q Channel or DCLKIO Falling Edge
Setup −0.2 ns
Hold 1.5 ns
3.3 V I Channel or DCLKIO Rising Edge
Setup −0.2 ns
Hold 1.6 ns
DVDDIO = 3.3 V
VIH 2.1 3 V
VIL 0 0.9 V
DVDDIO = 1.8 V
VIH 1.2 1.8 V
VIL 0 0.5 V
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 8 of 52
AC SPECIFICATIONS
TMIN to TMAX, AVDD = 3.3 V, DVDD = 1.8 V, DVDDIO = 3.3 V, CVDD = 3.3 V, IxOUTFS = 20 mA, maximum sample rate, unless otherwise noted.
Table 3.
Parameter
AD9114 AD9115 AD9116 AD9117
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
DYNAMIC PERFORMANCE
Output Settling Time (tST) to 0.1% 11.5 11.5 11.5 11.5 ns
Output Rise Time (10% to 90%) 0.27 0.27 0.27 0.27 ns
Output Fall Time (90% to 10%) 0.27 0.27 0.27 0.27 ns
Output Noise (IOUTFS = 20mA) 1471 465 117 37 pA/√Hz
SPURIOUS FREE DYNAMIC RANGE (SFDR)
fDAC = 125 MSPS, fOUT = 10 MHz 76 85 85 85 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 55 55 55 55 dBc
TWO TONE INTERMODULATION
DISTORTION (IMD)
fDAC = 125 MSPS, fOUT = 10 MHz 81 81 81 82 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 60 60 60 61 dBc
NOISE SPECTRAL DENSITY (NSD),
EIGHT-TONE, 500 kHz TONE SPACING
fDAC = 125 MSPS, fOUT = 1 MHz −131 −141 −153 −163 dBc/Hz
fDAC = 125 MSPS, fOUT = 10 MHz −132 −143 −153 −157 dBc/Hz
fDAC = 125 MSPS, fOUT = 50 MHz −128 −138 −146 −149 dBc/Hz
W-CDMA ADJACENT CHANNEL LEAKAGE
RATIO (ACLR), SINGLE CARRIER
fDAC = 61.44 MSPS, fOUT = 20 MHz −78 −78 −78 −78 dBc
fDAC = 122.88 MSPS, fOUT = 30 MHz −80 −80 −80 −80 dBc
TMIN to TMAX, AVDD = 1.8 V, DVDD = 1.8 V, DVDDIO = 1.8 V, CVDD = 1.8 V, IxOUTFS = 8 mA, maximum sample rate, unless otherwise noted.
Table 4.
Parameter
AD9114 AD9115 AD9116 AD9117
Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
SPURIOUS FREE DYNAMIC RANGE (SFDR)
fDAC = 125 MSPS, fOUT = 10 MHz 73 76 76 76 dBc
fDAC = 125 MSPS, fOUT = 50 MHz 48 48 48 48 dBc
TWO TONE INTERMODULATION
DISTORTION (IMD)
f
DAC
= 125 MSPS, f
OUT
= 10 MHz
76
76
76
76
dBc
fDAC = 125 MSPS, fOUT = 50 MHz 50 50 50 50 dBc
NOISE SPECTRAL DENSITY (NSD),
EIGHT-TONE, 500 kHz TONE SPACING
fDAC = 125 MSPS, fOUT = 1 MHz −131 −143 −152 −158 dBc/Hz
fDAC = 125 MSPS, fOUT = 10 MHz −132 −143 −151 −152 dBc/Hz
fDAC = 125 MSPS, fOUT = 50 MHz −128 −138 −140 −141 dBc/Hz
W-CDMA ADJACENT CHANNEL LEAKAGE
RATIO (ACLR), SINGLE CARRIER
fDAC = 61.44 MSPS, fOUT = 20 MHz −69 −69 −69 −69 dBc
fDAC = 122.88 MSPS, fOUT = 30 MHz −72 −72 −72 −72 dBc
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 9 of 52
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
AVDD, DVDDIO, CVDD to AVSS,
DVSS, CVSS
−0.3 V to +3.9 V
DVDD to DVSS −0.3 V to +2.1 V
AVSS to DVSS, CVSS −0.3 V to +0.3 V
DVSS to AVSS, CVSS −0.3 V to +0.3 V
CVSS to AVSS, DVSS −0.3 V to +0.3 V
REFIO, FSADJQ, FSADJI, CMLQ,
CMLI to AVSS
−0.3 V to AVDD + 0.3 V
QOUTP, QOUTN, IOUTP, IOUTN,
RLQP, RLQN, RLIP, RLIN to AVSS
−1.0 V to AVDD + 0.3 V
DBn1 (MSB) to D0 (LSB), CS, SCLK,
SDIO, RESET to DVSS
−0.3 V to DVDDIO + 0.3 V
CLKIN to CVSS −0.3 V to CVDD + 0.3 V
Junction Temperature 125°C
Storage Temperature Range −65°C to +150°C
1 n stands for 7 for the AD9114, 9 for the AD9115, 11 for the AD9116, and 13
for the AD9117.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
Table 6.
Package Type θJA θJB1 θJC1 Unit
40-Lead LFCSP (with No Airflow
Movement)
29.8
19.0 3.4 °C/W
1 These calculations are intended to represent the thermal performance of the
indicated packages using a JEDEC multilayer test board. Do not assume the
same level of thermal performance in actual applications without a careful
inspection of the conditions in the application to determine that they are
similar to those assumed in these calculations.
ESD CAUTION
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 10 of 52
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
1
DB5
2
DB4
3
DB3 4
DB2 5DVDDIO 6
DVSS
7DVDD 8
DB1
9
DB0 (LSB)
10NC
23
24
25
26
27
28
29
30
22
21
11
NC
12
NC
13
NC
15
NC
17
CVDD
16
DCLKIO
18
CLKIN
19
CVSS 20
CMLQ
14
NC
33 FSADJI/AUXI
34 REFIO
35 RESET/PINMD
36 SCLK/CLKMD
37 SDIO/FORMAT
38 CS/PWRDN
39 DB7 (MSB)
40 DB6
32 FSADJQ/AUXQ
31 CMLI
TOP VIEW
(Not to Scale)
AD9114
07466-005
NOTES
1. NC = NO CONNECT
2. THE EXPOSED PAD IS CONNECTED TO AVSS AND
MUST BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
QOUTP
RLQP
AVSS
AVDD
RLIP
IOUTP
IOUTN
RLIN
QOUTN
RLQN
Figure 2. AD9114 Pin Configuration
Table 7. AD9114 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4
DB[5:2]
Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage Input (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage Output (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD
with a 1.0 µF capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 DB1 Digital Inputs
9 DB0 (LSB) Digital Input (LSB).
10 to
15
NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage Input (1.8 V to 3.3 V). CVDD must be ≥ DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on-chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (QRCML) is
disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a resistor, see
the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
21
RLQN
Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage Input (1.8 V to 3.3 V).
27 RLIP Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 11 of 52
Pin No. Mnemonic Description
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
31 CMLI I DAC Output Common-Mode Level. When the internal on-chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor, see
the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
32 FSADJQ/AUXQ Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QRSET) is disabled, this pin is the full-scale
current output adjust for Q DAC and must be connected to AVSS through a resistor, see the Theory of Operation
section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on-chip (QRSET) is enabled, this pin is the auxiliary Q DAC output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on-chip (IRSET) is disabled, this pin is the full-scale
current output adjust for I DAC and must be connected to AVSS through a resistor, see the Theory of Operation
section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on-chip (IRSET) is enabled, it is the auxiliary I DAC output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 µF capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO ≠ CLKIN, pulse 0 to 1 to edge trigger the internal retimer, see
the Retimer section.
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low (pull-down
to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the twos complement
input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB7 (MSB) Digital Input (MSB).
40 DB6 Digital Input.
EP (EPAD) The exposed pad is connected to AVSS and must be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 12 of 52
PIN 1
INDICATOR
1DB7
2DB6
3DB5 4DB4 5DVDDIO 6DVSS
7DVDD
8DB3
9DB2
10DB1
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
11
DB0 (LSB)
12
NC
13
NC
15
NC
17
CVDD
16
DCLKIO
18
CLKIN
19
CVSS20
CMLQ
14
NC
33FSADJI/AUXI
34REFIO
35RESET/PINMD
36SCLK/CLKMD
37SDIO/FORMAT
38CS/PWRDN
39DB9 (MSB)
40DB8
32FSADJQ/AUX
Q
31CMLI
TOP VIEW
(Not to Scale)
AD9115
07466-004
NOTES
1. NC = NO CONNECT
2
. THE EXPOSED PAD IS CONNECTED TO AVSS AND
MUST BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
Figure 3. AD9115 Pin Configuration
Table 8. AD9115 Pin Function Description
Pin No. Mnemonic Description
1 to 4 DB[7:4] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage Input (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage Output (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD
with a 1.0 μF capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 10 DB[3:1] Digital Inputs.
11 DB0 (LSB) Digital Input (LSB).
12 to 15 NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage Input (1.8 V to 3.3 V). CVDD must be ≥ DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on-chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (QRCML) is
disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a resistor, see
the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
21 RLQN Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage Input (1.8 V to 3.3 V).
27 RLIP Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 13 of 52
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on-chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (IRCML) is
disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor,
see the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
32
FSADJQ/AUXQ
Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QR
SET
) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor, see the Theory of
Operation section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on-chip (QRSET) is enabled, this pin is the auxiliary Q DAC output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on-chip (IRSET) is disabled, this pin is the full-scale
current output adjust for I DAC and must be connected to AVSS through a resistor, see the Theory of Operation
section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on-chip (IRSET) is enabled, it is the auxiliary I DAC output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 µF capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO ≠ CLKIN, pulse 0 to 1 to edge trigger the internal retime, see
the Retimer section.
37
SDIO/FORMAT
Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low (pull-down
to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the twos complement
input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for the
SPI port.
39 DB9 (MSB) Digital Input (MSB).
40 DB82 Digital Input.
EP (EPAD) The exposed pad is connected to AVSS and must be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 14 of 52
PIN 1
INDICATOR
1
DB9
2DB8
3DB7 4DB6 5DVDDIO 6DVSS
7
DVDD 8
DB5
9DB4
10DB3
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
11
DB2
12
DB1
13
DB0 (LSB)
15
NC
17
CVDD
16
DCLKIO
18
CLKIN
19
CVSS 20
CMLQ
14
NC
33 FSADJI/AUXI
34 REFIO
35 RESET/PINMD
36 SCLK/CLKMD
37 SDIO/FORMAT
38 CS/PWRDN
39 DB11 (MSB)
40 DB10
32 FSADJQ/AUXQ
31 CMLI
TOP VIEW
(Not to Scale)
AD9116
NOTES
1. NC = NO CONNECT
2. THE EXPOSED PAD IS CONNECTED TO AVSS AND
MUST BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
07466-003
Figure 4. AD9116 Pin Configuration
Table 9. AD9116 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[9:6] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage Input (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7
DVDD
Digital Core Supply Voltage Output (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD
with a 1.0 µF capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 12 DB[5:1] Digital Inputs.
13 DB0 (LSB) Digital Input (LSB).
14, 15 NC No Connect. These pins are not connected to the chip.
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage Input (1.8 V to 3.3 V). CVDD must be ≥ DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on-chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (QRCML) is
disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a resistor,
see the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
21 RLQN Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage Input (1.8 V to 3.3 V).
27 RLIP Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 15 of 52
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on-chip (IRCML) is enabled, this pin is connected to the
on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (IRCML) is
disabled, this pin is the common mode load for I DAC and must be connected to AVSS through a resistor, see
the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
32
FSADJQ/AUXQ
Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QR
SET
) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor, see the Theory of
Operation section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on-chip (QRSET) is enabled, this pin is the auxiliary Q DAC output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on-chip (IRSET) is disabled, this pin is the full-scale
current output adjust for I DAC and must be connected to AVSS through a resistor, see the Theory of Operation
section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on-chip (IRSET) is enabled, it is the auxiliary I DAC output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 µF capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO ≠ CLKIN, pulse 0 to 1 to edge trigger the internal retime, see
the Retimer section.
37
SDIO/FORMAT
Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low
(pull-down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the
twos complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB11 (MSB) Digital Input (MSB).
40 DB10 Digital Input.
EP (EPAD) The exposed pad is connected to AVSS and must be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 16 of 52
PIN 1
INDICATOR
1DB11
2DB10
3DB9 4DB8 5DVDDIO 6DVSS
7DVDD
8DB7
9DB6
10DB5
23 QOUTP
24 RLQP
25 AVSS
26 AVDD
27 RLIP
28 IOUTP
29 IOUTN
30 RLIN
22 QOUTN
21 RLQN
11
DB4
12
DB3
13
DB2
15
DB0 (LSB)
17
CVDD
16
DCLKIO
18
CLKIN
19
CVSS20
CMLQ
14
DB1
33FSADJI/AUXI
34REFIO
35RESET/PINMD
36SCLK/CLKMD
37SDIO/FORMAT
38CS/PWRDN
39DB13 (MSB)
40DB12
32FSADJQ/AUX
Q
31CMLI
TOP VIEW
(Not to Scale)
AD9117
07466-002
NOTES
1. THE EXPOSED PAD IS CONNECTED TO AVSS AND
MUST BE SOLDERED TO THE GROUND PLANE.
EXPOSED METAL AT PACKAGE CORNERS IS
CONNECTED TO THIS PAD.
Figure 5. AD9117 Pin Configuration
Table 10. AD9117 Pin Function Descriptions
Pin No. Mnemonic Description
1 to 4 DB[11:8] Digital Inputs.
5 DVDDIO Digital I/O Supply Voltage Input (1.8 V to 3.3 V Nominal).
6 DVSS Digital Common.
7 DVDD Digital Core Supply Voltage Output (1.8 V). Strap DVDD to DVDDIO at 1.8 V. If DVDDIO > 1.8 V, bypass DVDD
with a 1.0 μF capacitor; however, do not otherwise connect it. The LDO should not drive external loads.
8 to 14 DB[7:1] Digital Inputs.
15 DB0 (LSB) Digital Input (LSB).
16 DCLKIO Data Input/Output Clock. Clock used to qualify input data.
17 CVDD Sampling Clock Supply Voltage Input (1.8 V to 3.3 V). CVDD must be ≥ DVDD.
18 CLKIN LVCMOS Sampling Clock Input.
19 CVSS Sampling Clock Supply Voltage Common.
20 CMLQ Q DAC Output Common-Mode Level. When the internal on-chip (QRCML) is enabled, this pin is connected to
the on-chip QRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (QRCML) is
disabled, this pin is the common-mode load for Q DAC and must be connected to AVSS through a resistor,
see the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
21 RLQN Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTN externally.
22 QOUTN Complementary Q DAC Current Output. Full-scale current is sourced when all data bits are 0s.
23 QOUTP Q DAC Current Output. Full-scale current is sourced when all data bits are 1s.
24 RLQP Load Resistor (62.5 Ω) to the CMLQ Pin. For the internal load resistor to be used, this pin should be tied to
QOUTP externally.
25 AVSS Analog Common.
26 AVDD Analog Supply Voltage Input (1.8 V to 3.3 V).
27 RLIP Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTP externally.
28 IOUTP I DAC Current Output. Full-scale current is sourced when all data bits are 1s.
29 IOUTN Complementary I DAC Current Output. Full-scale current is sourced when all data bits are 0s.
30 RLIN Load Resistor (62.5 Ω) to the CMLI Pin. For the internal load resistor to be used, this pin should be tied to
IOUTN externally.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 17 of 52
Pin No. Mnemonic Description
31 CMLI I DAC Output Common-Mode Level. When the internal on-chip (IRCML) is enabled, this pin is connected to
the on-chip IRCML resistor. It is recommended to leave this pin unconnected. When the internal on-chip (IRCML)
is disabled, this pin is the common-mode load for I DAC and must be connected to AVSS through a resistor,
see the Using the Internal Termination Resistors section. Recommended value for this external resistor is 0 Ω.
32
FSADJQ/AUXQ
Full-Scale Current Output Adjust (FSADJQ). When the internal on chip (QR
SET
) is disabled, this pin is the full-
scale current output adjust for Q DAC and must be connected to AVSS through a resistor, see the Theory of
Operation section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary Q DAC Output (AUXQ). When the internal on-chip (QR
SET
) is enabled, this pin is the auxiliary Q DAC output.
33 FSADJI/AUXI Full-Scale Current Output Adjust (FSADJI). When the internal on-chip (IRSET) is disabled, this pin is the full-scale
current output adjust for I DAC and must be connected to AVSS through a resistor, see the Theory of Operation
section. Nominal value for this external resistor is 4 kΩ for 8 mA output current.
Auxiliary I DAC Output (AUXI). When the internal on-chip (IRSET) is enabled, it is the auxiliary I DAC output.
34 REFIO Reference Input/Output. Serves as a reference input when the internal reference is disabled. Provides a 1.0 V
reference output when in internal reference mode (a 0.1 µF capacitor to AVSS is required).
35 RESET/PINMD This pin defines the operation mode of the part. A logic low (pull-down to DVSS) sets the part in SPI mode.
Pulse RESET high to reset the SPI registers to their default values.
A logic high (pull-up to DVDDIO) puts the device into pin mode (PINMD).
36 SCLK/CLKMD Clock Input for Serial Port (SCLK). In SPI mode, this pin is the clock input for the serial port.
Clock Mode (CLKMD). In pin mode, CLKMD determines the phase of the internal retiming clock. When
DCLKIO = CLKIN, tie it to 0. When DCLKIO ≠ CLKIN, pulse 0 to 1 to edge trigger the internal retime, see
the Retimer section.
37 SDIO/FORMAT Serial Port Input/Output (SDIO). In SPI mode, this pin is the bidirectional data line for the serial port.
Format Pin (FORMAT). In pin mode, FORMAT determines the data format of digital data. A logic low
(pull-down to DVSS) selects the binary input data format. A logic high (pull-up to DVDDIO) selects the
twos complement input data format.
38 CS/PWRDN Active Low Chip Select (CS). In SPI mode, this pin serves as the active low chip select.
Power-Down (PWRDN). In pin mode, a logic high (pull-up to DVDDIO) powers down the device, except for
the SPI port.
39 DB13 (MSB) Digital Input (MSB).
40 DB12 Digital Input.
EP (EPAD) The exposed pad is connected to AVSS and must be soldered to the ground plane. Exposed metal at the
package corners is connected to this pad.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 18 of 52
TYPICAL PERFORMANCE CHARACTERISTICS
AVDD, DVDD, DVDDIO, CVDD = 1.8 V, IxOUTFS = 8 mA, maximum sample rate (125 MSPS), unless otherwise noted.
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–2.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
PRECALIBRATION INL (LSB)
07466-006
Figure 6. AD9117 Precalibration INL at 1.8 V, 8 mA (DVDD = 1.8 V)
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–2.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
PRECALIBRATION DNL (LSB)
07466-007
Figure 7. AD9117 Precalibration DNL at 1.8 V, 8 mA (DVDD = 1.8 V)
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
PRECALIBRATION INL (LSB)
0
7466-008
Figure 8. AD9117 Precalibration INL at 3.3 V, 20 mA (DVDD = 1.8 V)
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–2.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
POSTCALIBRATION INL (LSB)
07466-009
Figure 9. AD9117 Postcalibration INL at 1.8 V, 8 mA (DVDD = 1.8 V)
2.0
1.5
1.0
0.5
0
–0.5
–1.0
–2.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
POSTCALIBRATION DNL (LSB)
07466-010
Figure 10. AD9117 Postcalibration DNL at 1.8 V, 8 mA (DVDD = 1.8 V)
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
POSTCALIBRATION INL (LSB)
0
7466-011
Figure 11. AD9117 Postcalibration INL at 3.3 V, 20 mA (DVDD = 1.8 V)
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 19 of 52
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
PRECALIBRATION DNL (LSB)
0
7466-012
Figure 12. AD9117 Precalibration DNL at 3.3 V, 20 mA
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
PRECALIBRATION INL (LSB)
0
7466-013
Figure 13. AD9116 Precalibration INL at 1.8 V, 8 mA
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
PRECALIBRATION DNL (LSB)
0
7466-014
Figure 14. AD9116 Precalibration DNL at 1.8 V, 8 mA
1.5
1.0
0.5
0
–0.5
–1.0
–1.5
0 2048 4096 6144 8192 10,240 12,288 14,336 16,384
CODE
POSTCALIBRATION DNL (LSB)
0
7466-015
Figure 15. AD9117 Postcalibration DNL at 3.3 V, 20 mA
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
POSTCALIBRATION INL (LSB)
0
7466-016
Figure 16. AD9116 Postcalibration INL at 1.8 V, 8 mA
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
POSTCALIBRATION DNL (LSB)
0
7466-017
Figure 17. AD9116 Postcalibration DNL at 1.8 V, 8 mA
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 20 of 52
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
PRECALIBRATION INL (LSB)
0
7466-018
Figure 18. AD9116 Precalibration INL at 3.3 V, 20 mA
0.5
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.5
–0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
PRECALIBRATION DNL (LSB)
0
7466-019
Figure 19. AD9116 Precalibration DNL at 3.3 V, 20 mA
0.25
0.20
0.15
0.10
0.05
0
–0.05
–0.10
–0.15
–0.25
–0.20
0 128 256 384 512 640 768 896 1024
CODE
PRECALIBRATION INL (LSB)
0
7466-020
Figure 20. AD9115 Precalibration INL at 1.8 V, 8 mA
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–0.8
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
POSTCALIBRATION INL (LSB)
0
7466-021
Figure 21. AD9116 Postcalibration INL at 3.3 V, 20 mA
0.5
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.5
–0.4
0 512 1024 1536 2048 2560 3072 3584 4096
CODE
POSTCALIBRATION DNL (LSB)
07466-022
Figure 22. AD9116 Postcalibration DNL at 3.3 V, 20 mA
0.25
0.20
0.15
0.10
0.05
0
–0.05
–0.10
–0.15
–0.25
–0.20
0 128 256 384 512 640 768 896 1024
CODE
POSTCALIBRATION INL (LSB)
07466-023
Figure 23. AD9115 Postcalibration INL at 1.8 V, 8 mA
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 21 of 52
0.08
0.06
0.02
0.04
–0.02
0
–0.04
–0.06
–0.08
0 128 256 384 512 640 768 896 1024
CODE
PRECALIBRATION DNL (LSB)
07466-024
Figure 24. AD9115 Precalibration DNL at 1.8 V, 8 mA
0.25
0.20
0.15
0.10
0.05
0
–0.05
–0.10
–0.15
–0.25
–0.20
0 128 256 384 512 640 768 896 1024
CODE
PRECALIBRATION INL (LSB)
0
7466-025
Figure 25. AD9115 Precalibration INL at 3.3 V, 20 mA
0.08
0.06
0.02
0.04
–0.02
0
–0.04
–0.06
–0.08
0 128 256 384 512 640 768 896 1024
CODE
PRECALIBRATION DNL (LSB)
07466-026
Figure 26. AD9115 Precalibration DNL at 3.3 V, 20 mA
0.08
0.06
0.02
0.04
–0.02
0
–0.04
–0.06
–0.08
0 128 256 384 512 640 768 896 1024
CODE
POSTCALIBRATION DNL (LSB)
07466-027
Figure 27. AD9115 Postcalibration DNL at 1.8 V, 8 mA
0.25
0.20
0.15
0.10
0.05
0
–0.05
–0.10
–0.15
–0.25
–0.20
0 128 256 384 512 640 768 896 1024
CODE
POSTCALIBRATION INL (LSB)
0
7466-028
Figure 28. AD9115 Postcalibration INL at 3.3 V, 20 mA
0.08
0.06
0.02
0.04
–0.02
0
–0.04
–0.06
–0.08
0 128 256 384 512 640 768 896 1024
CODE
POSTCALIBRATION DNL (LSB)
07466-029
Figure 29. AD9115 Postcalibration DNL at 3.3 V, 20 mA
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 22 of 52
0.035
0.015
0.025
0.005
0
–0.005
–0.015
–0.025
–0.035
032 64 96 128 160 192 224 256
CODE
PRECALIBRATION INL (LSB)
07466-030
Figure 30. AD9114 Precalibration INL at 1.8 V, 8 mA
0.025
0.020
0.015
0.010
0.005
0
–0.005
–0.010
–0.015
–0.020
–0.025
032 64 96 128 160 192 224 256
CODE
PRECALIBRATION DNL (LSB)
07466-031
Figure 31. AD9114 Precalibration DNL at 1.8 V, 8 mA
0.03
0.02
0.01
0
–0.01
–0.02
–0.03
032 64 96 128 160 192 224 256
CODE
PRECALIBRATION INL (LSB)
07466-032
Figure 32. AD9114 Precalibration INL at 3.3 V, 20 mA
0.035
0.015
0.025
0.005
0
–0.005
–0.015
–0.025
–0.035
032 64 96 128 160 192 224 256
CODE
POSTCALIBRATION INL (LSB)
07466-033
Figure 33. AD9114 Postcalibration INL at 1.8 V, 8 mA
0.025
0.020
0.015
0.010
0.005
0
–0.005
–0.010
–0.015
–0.020
–0.025
032 64 96 128 160 192 224 256
CODE
POSTCALIBRATION DNL (LSB)
07466-034
Figure 34. AD9114 Postcalibration DNL at 1.8 V, 8 mA
0.03
0.02
0.01
0
–0.01
–0.02
–0.03
032 64 96 128 160 192 224 256
CODE
POSTCALIBRATION INL (LSB)
07466-035
Figure 35. AD9114 Postcalibration INL at 3.3 V, 20 mA
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 23 of 52
0.025
0.020
0.015
0.010
0.005
0
–0.005
–0.010
–0.015
–0.020
–0.025
0 32 64 96 128 160 192 224 256
CODE
PRECALIBRATION DNL (LSB)
07466-036
Figure 36. AD9114 Precalibration DNL at 3.3 V, 20 mA
–
124
–130
–136
–142
–148
–154
–160
0 1020304050
f
OUT
(MHz)
NSD (dBc)
AD9117
AD9116
AD9115
AD9114
07466-137
Figure 37. NSD at 8 mA vs. fOUT, 1.8 V
–160
–
136
–139
–142
–145
–148
–151
–154
–157
0 1020305 15253540455055
07466-201
fOUT
(MHz)
NSD (dBm/Hz)
–40°C
+85°C
+25°C
Figure 38. AD9117 NSD at Three Temperatures 8 mA vs. fOUT, 1.8 V
0.025
0.020
0.015
0.010
0.005
0
–0.005
–0.010
–0.015
–0.020
–0.025
0326496128
CODE
160 192 224 256
POSTCALIBRATION DNL (LSB)
07466-039
Figure 39. AD9114 Postcalibration DNL at 3.3 V, 20 mA
–166
–160
–154
–148
–142
–136
–130
–
124
0 1020305 15253540455055
07466-200
fOUT
(MHz)
NSD (dBc)
AD9117
AD9116
AD9115
AD9114
Figure 40. NSD at 20 mA vs. fOUT, 3.3 V
–160
–
136
–139
–142
–145
–148
–151
–154
–157
0 1020305 15253540455055
07466-202
fOUT
(MHz)
NSD (dBm/Hz)
–40°C
+85°C
+25°C
Figure 41. AD9117 NSD at Three Temperatures 8 mA vs. fOUT, 3.3 V
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 24 of 52
–166
–160
–154
–148
–142
–136
–130
0 5 1
0 15 20 25 30 35 40 4550 55
f
OUT (MHz)
NSD (dBc)
1.8V, 4mA
1.8V, 8mA
07466-142
Figure 42. AD9117 NSD at Two Output Currents vs. fOUT, 1.8 V
07466-090
START 1MHz 1.5MHz/DIV STOP 16MHz
(dBm)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Figure 43. AD9117 Two Tone Spectrum at 1.8 V
50
60
70
80
90
5 10 15 20 25 30 35 40 45 50
fOUT
(MHz)
IMD (dBc)
AD9117
AD9116
AD9115
AD9114
07466-144
Figure 44. All IMD 8 mA vs. fOUT, 1.8 V
–166
–160
–154
–148
–142
–136
–130
0 5 10
15 20 25 30 35 40 45 50 55
fOUT(MHz)
NSD (dBc)
3.3V, 20mA
3.3V, 8mA
3.3V, 4mA
07466-145
Figure 45. AD9117 NSD at Three Output Currents vs. fOUT, 3.3 V
07466-091
START 1MHz 1.5MHz/DIV STOP 16MHz
(dBm)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Figure 46. AD9117 Two Tone Spectrum at 3.3 V
54
66
60
72
84
78
96
90
5 10 15 20 25 30 35 40 45 50
AD9117
AD9116
AD9115
AD9114
f
OUT
(MHz)
IMD (dBc)
07466-147
Figure 47. All IMD 20 mA vs. fOUT, 3.3 V
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 25 of 52
48
84
78
72
66
60
54
5 101520253035404550
07466-195
f
OUT
(MHz)
IMD (dBc)
–40°C
+85°C
+25°C
Figure 48. AD9117 IMD at Three Temperatures 8 mA vs. fOUT, 1.8 V
45
50
55
60
65
70
75
80
85
90
5 101520253035404550
0dB
–3dB
–6dB
07466-092
f
OUT
(MHz)
IMD (dBc)
Figure 49. AD9117 IMD at Three Digital Signal Levels vs. fOUT, 1.8 V
50
56
62
68
74
80
86
5 101520253035404550
f
OUT
(MHz)
IMD (dBc)
4mA
8mA
07466-150
Figure 50. AD9117 IMD at Two Output Currents vs. fOUT, 1.8 V
63
90
87
84
81
78
75
72
69
66
5 101520253035404550
07466-196
f
OUT
(MHz)
IMD (dBc)
–40°C
+85°C
+25°C
Figure 51. AD9117 IMD at Three Temperatures 20 mA vs. fOUT, 3.3 V
55
60
65
70
75
80
85
90
5 101520253035404550
0dB
–3dB
–6dB
07466-093
f
IN
(MHz)
IMD (dBc)
Figure 52. AD9117 IMD at Three Digital Signal Levels vs. fOUT, 3.3 V
56
62
68
74
80
92
86
5 101520253035404550
f
OUT
(MHz)
IMD (dBc)
4mA
20mA
8mA
07466-153
Figure 53. AD9117 IMD at Three Output Currents vs. fOUT, 3.3 V
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 26 of 52
07466-088
START 1MHz 1.5MHz/DIV STOP 16MHz
(dBm)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Figure 54. AD9117 Singe Tone Spectrum, 1.8 V
40
50
60
70
80
90
0 102030405060
f
OUT
(MHz)
SFDR (dBc)
AD9117
AD9116
AD9115
AD9114
07466-155
Figure 55. SFDR at 8 mA vs. fOUT, 1.8 V
42
48
54
60
66
72
78
84
90
0 5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
SFDR (dBc)
–40°C
+25°C
+85°C
07466-156
Figure 56. AD9117 SFDR at Three Temperatures 8 mA vs. fOUT, 1.8 V
07466-089
START 1MHz 1.5MHz/DIV STOP 16MHz
(dBm)
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
–100
Figure 57. AD9117 Singe Tone Spectrum, 3.3 V
54
60
66
72
84
78
90
96
0 102030405060
f
OUT
(MHz)
SFDR (dBc)
AD9117
AD9116
AD9115
AD9114
07466-158
Figure 58. AD9117 SFDR at 20 mA vs. fOUT, 3.3 V
56
62
68
74
80
86
92
98
0 5 10 15 20 25 30 35 40 45 50 55 60
f
OUT
(MHz)
SFDR (dBc)
–40°C
+25°C
+85°C
07466-159
Figure 59. AD9117 SFDR at Three Temperatures 8 mA vs. fOUT, 3.3 V
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 27 of 52
42
50
58
66
74
82
90
98
0 5 10 15 20 25 30 35 40 45 50 55 60
07466-094
f
OUT
(MHz)
SFDR (dBc)
0dB
–6dB
–3dB
Figure 60. AD9117 SFDR at Three Digital Signal Levels vs. fOUT, 1.8 V
42
48
54
60
66
72
78
84
90
96
0 102030405060
f
OUT
(MHz)
SFDR (dBc)
4mA
8mA
07466-161
Figure 61. AD9117 SFDR at Two Currents vs. fOUT, 1.8 V
CENTER 22.90MHz
TOTAL CARRIER POWER –12.17dBm/7.87420MHz
REF CARRIER POWER –12.17dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. –12.17dBm 5.000MHz 3.840MHz –77.40 –89.56 –78.68 –90.84
2. –80.85dBm 10.00MHz 3.840MHz –78.90 –91.06 –78.27 –90.43
15.00MHz 3.840MHz –78.02 –90.18 –70.99 –83.15
10dB/DI
V
VBW 300kHz
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
SPAN 38.84MHz
RES BW 30kHz SWEEP 126ms (601pts)
STEP
2dB
AC COUPLED: UNSPECIFIED
BELOW 20MHz
INPUT ATT
8.00dB
07466-162
Figure 62. AD9117 ACLR One-Carrier, 1.8 V
50
58
66
74
82
90
98
0 5 10 15 20 25 30 35 40 45 50 55 60
07466-095
f
OUT
(MHz)
SFDR (dBc)
0dB
–6dB
–3dB
Figure 63. AD9117 SFDR at Three Digital Signal Levels vs. fOUT., 3.3 V
42
48
54
60
66
72
78
84
90
96
0 102030405060
f
OUT
(MHz)
SFDR (dBc)
4mA
8mA 20mA
07466-164
Figure 64. AD9117 SFDR at Three Currents vs. fOUT, 3.3V
CENTER 22.90MHz
10dB/DI
V
VBW 300kHz SPAN 38.84MHz
STEP
2dB
INPUT ATT
8.00dB
TOTAL CARRIER POWER –12.17dBm/7.87420MHz
REF CARRIER POWER –12.17dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. –12.17dBm 5.000MHz 3.840MHz –77.40 –89.56 –78.68 –90.84
2. –80.85dBm 10.00MHz 3.840MHz –78.90 –91.06 –78.27 –90.43
15.00MHz 3.840MHz –78.02 –90.18 –70.99 –83.15
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
RES BW 30kHz SWEEP 126ms (601pts)
AC COUPLED: UNSPECIFIED
BELOW 20MHz
07466-165
Figure 65. AD9117 ACLR One-Carrier, 3.3 V
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 28 of 52
–78
–72
–66
–
60
15 20 25 30 35 40 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
07466-166
Figure 66. AD9117 One-Carrier W-CDMA First ACLR vs. fOUT, 1.8 V
–80
–74
–68
–
62
15 20 25 30 35 40 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
07466-167
Figure 67. AD9117 One-Carrier W-CDMA Second ACLR vs. fOUT, 1.8 V
–80
–74
–68
–
62
20 25 30 35 40 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
07466-168
Figure 68. AD9117 One-Carrier W-CDMA Third ACLR vs. fOUT, 1.8 V
–78
–72
–66
–
60
15 20 25 30 35 40 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
07466-169
Figure 69. AD9117 One-Carrier W-CDMA First ACLR vs. fOUT, 3.3 V
–80
–74
–68
–
62
15 25 35 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
07466-170
Figure 70. AD9117 One-Carrier W-CDMA Second ACLR vs. fOUT, 3.3 V
–80
–74
–68
–
62
20 25 30 35 40 45
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
07466-171
Figure 71. AD9117 One-Carrier W-CDMA Third ACLR vs. fOUT, 3.3 V
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 29 of 52
CENTER 22.90MHz
10dB/DI
V
VBW 300kHz SPAN 38.84MHz
STEP
2dB
INPUT ATT
8.00dB
TOTAL CARRIER POWER –15.23dBm/7.87420MHz
REF CARRIER POWER –18.09dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. –18.09dBm 5.000MHz 3.840MHz –72.11 –90.24 –71.97 –90.09
2. –18.40dBm 10.00MHz 3.840MHz –72.98 –91.10 –72.55 –90.68
15.00MHz 3.840MHz –69.93 –88.05 –72.30 –90.42
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
RES BW 30kHz SWEEP 126ms (601pts)
AC COUPLED: UNSPECIFIED
BELOW 20MHz
07466-172
Figure 72. AD9117 ACLR Two-Carrier, 1.8 V
–74
–68
–62
–56
–
50
15 20 25 30 35 40
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
07466-173
Figure 73. AD9117 Two-Carrier W-CDMA First ACLR vs. fOUT, 1.8 V
–74
–68
–62
–56
–
50
15 20 25 30 35 40
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
07466-174
Figure 74. AD9117 Two-Carrier W-CDMA Second ACLR vs. fOUT, 1.8 V
CENTER 22.90MHz
10dB/DI
V
VBW 300kHz SPAN 38.84MHz
STEP
2dB
INPUT ATT
8.00dB
TOTAL CARRIER POWER –15.23dBm/7.87420MHz
REF CARRIER POWER –18.09dBm/4.03420MHz
RCC FILTER: OFF FILTER ALPHA 0.22
1. –18.09dBm 5.000MHz 3.840MHz –72.11 –90.24 –71.97 –90.09
2. –18.40dBm 10.00MHz 3.840MHz –72.98 –91.10 –72.55 –90.68
15.00MHz 3.840MHz –69.93 –88.05 –72.30 –90.42
OFFSET
FREQ
INTEG
BW dBc dBm dBc
LOWER UPPER
dBm
RES BW 30kHz SWEEP 126ms (601pts)
AC COUPLED: UNSPECIFIED
BELOW 20MHz
07466-175
Figure 75. AD9117 ACLR Two-Carrier, 3.3 V
–74
–68
–62
–56
–
50
15 20 25 30 35 40
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
07466-176
Figure 76. AD9117 Two-Carrier W-CDMA First ACLR vs. fOUT, 3.3 V
–74
–68
–62
–56
–
50
15 20 25 30 35 40
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
07466-177
Figure 77. AD9117 Two-Carrier W-CDMA Second ACLR vs. fOUT, 3.3 V
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 30 of 52
–74
–68
–56
–62
–
50
20 25 30 35 40
f
OUT (MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
0
7466-178
Figure 78. AD9117 Two-Carrier W-CDMA Third ACLR vs. fOUT, 1.8 V
0.4
0.3
0.2
0.1
0
–0.1
–0.2
–0.3
–0.5
–0.4
0
CODE
AUXDAC DNL (LSB)
128 256 384 512 640 768 896 1024
0
7466-047
Figure 79. AD9114/AD9115/AD9116/AD9117 AUXDAC DNL
CVDD
DVDD
AVDD @ 4mA OUT
AVDD @ 8mA OUT
TOTAL CURRENT @ 4mA OUT
TOTAL CURRENT @ 8mA OUT
40
30
20
10
0
0 20 40 60 80 100 120 140
fDAC
(MHz)
SUPPLY CURRENT (mA)
07466-048
Figure 80. AD9114/AD9115/AD9116/AD9117 Supply Current vs. fDAC, 1.8 V
–74
–68
–56
–62
–
50
20 25 30 35 40
fOUT
(MHz)
ACLR (dBc)
4mA PRECAL
4mA POSTCAL
8mA PRECAL
8mA POSTCAL
16mA PRECAL
16mA POSTCAL
0
7466-181
Figure 81. AD9117 Two-Carrier W-CDMA Third ACLR vs. fOUT, 3.3 V
1.0
0.8
0.6
0.4
0.2
0
–0.2
–0.4
–0.6
–1.0
–0.8
0
CODE
AUXDAC INL (LSB)
128 256 384 512 640 768 896 1024
0
7466-044
Figure 82. AD9114/AD9115/AD9116/AD9117 AUXDAC INL
0
10
20
30
40
50
60
70
80
0 20406080100120140
f
DAC
(MHz)
CUR
R
ENT (
m
A)
CVDD
DVDD
AVDD @ 20mA OUT
TOTAL CURRENT @ 20mA OUT
TOTAL CURRENT @ 8mA OUT
TOTAL CURRENT @ 4mA OUT
AVDD @ 8mA OUT
AVDD @ 4mA OUT
0
7466-183
Figure 83. AD9114/AD9115/AD9116/AD9117Supply Current vs. fDAC, 3.3 V
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 31 of 52
TERMINOLOGY
Linearity Error or Integral Nonlinearity (INL)
Linearity error is defined as the maximum deviation of the
actual analog output from the ideal output, determined by
a straight line drawn from zero scale to full scale.
Differential Nonlinearity (DNL)
DNL is the measure of the variation in analog value, normalized
to full scale, associated with a 1 LSB change in digital input code.
Monotonicity
A DAC is monotonic if the output either increases or remains
constant as the digital input increases.
Offset Error
Offset error is the deviation of the output current from the ideal
of zero. For IOUTP, the 0 mA output is expected when the inputs
are all 0. For IOUTN, the 0 mA output is expected when all inputs
are set to 1.
Gain Error
Gain error is the difference between the actual and the ideal
output span. The actual span is determined by the difference
between the output when all inputs are set to 1 and the output
when all inputs are set to 0.
Output Compliance Range
The output compliance range is the range of allowable voltage at
the output of a current output DAC. Operation beyond the
maximum compliance limits can cause either output stage
saturation or breakdown, resulting in nonlinear performance.
Temperature Drift
Temperature drift is specified as the maximum change from
the ambient value (25°C) to the value at either TMIN or TMAX.
For offset and gain drift, the drift is reported in ppm of full-
scale range per degree Celsius (ppm FSR/°C). For reference
drift, the drift is reported in parts per million per degree
Celsius (ppm/°C).
Power Supply Rejection
Power supply rejection is the maximum change in the full-scale
output as the supplies are varied from minimum to maximum
specified voltages.
Settling Time
Settling time is the time required for the output to reach and
remain within a specified error band around its final value,
measured from the start of the output transition.
Spurious Free Dynamic Range (SFDR)
SFDR is the difference, in decibels (dB), between the peak
amplitude of the output signal and the peak spurious signal
between dc and the frequency equal to half the input data rate.
Total Harmonic Distortion (THD)
THD is the ratio of the rms sum of the first six harmonic
components to the rms value of the measured fundamental.
It is expressed as a percentage (%) or in decibels (dB).
Signal-to-Noise Ratio (SNR)
SNR is the ratio of the rms value of the measured output signal
to the rms sum of all other spectral components below the Nyquist
frequency, excluding the first six harmonics and dc. The value
for SNR is expressed in decibels (dB).
Adjacent Channel Leakage Ratio (ACLR)
ACLR is the ratio in decibels relative to the carrier (dBc)
between the measured power within a channel relative to
its adjacent channel.
Complex Image Rejection
In a traditional two-part upconversion, two images are created
around the second IF frequency. These images have the effect
of wasting transmitter power and system bandwidth. By placing
the real part of a second complex modulator in series with the
first complex modulator, either the upper or lower frequency
image near the second IF can be rejected.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 32 of 52
THEORY OF OPERATION
I DAC
Q DAC
AUX1DAC
AUX2DAC
BAND
GAP
CLOCK
DIST
10kΩ
QR
SET
2kΩ
IR
SET
2kΩ
I
REF
100µA
IR
CM
60Ω TO
260Ω
QR
CM
60Ω TO
260Ω
62.5Ω
62.5Ω
62.5Ω
62.5Ω
SPI
INTERFACE
1 INTO 2
INTERLEAVED
DATA
INTERFACE
I DATA
Q DATA
1.8V
LDO
1V
AD9117
RLIN
IOUTN
IOUTP
RLIP
AVDD
AVSS
RLQP
QOUTP
QOUTN
RLQN
DB11
DB10
DB9
DB8
DVDDIO
DVSS
DVDD
DB7
DB6
DB5
DB12
DB13 (MSB)
CS/PWRDN
SDIO/FORMAT
SCLK/CLKMD
RESET/PINMD
REFIO
FSADJQ/AUXQ
FSADJI/AUXI
CMLI
DB4
DB3
DB2
DB1
(LSB) DB0
DCLKIO
CVDD
CLKIN
CVSS
CMLQ
07466-050
Figure 84. Simplified Block Diagram
Figure 84 shows a simplified block diagram of the AD9114/
AD9115/AD9116/AD9117 that consists of two DACs, digital
control logic, and a full-scale output current control. Each DAC
contains a PMOS current source array capable of providing a
maximum of 20 mA. The arrays are divided into 31 equal currents
that make up the five most significant bits (MSBs). The next four
bits, or middle bits, consist of 15 equal current sources whose
value is 1/16 of an MSB current source. The remaining LSBs are
binary weighted fractions of the current sources of the middle
bits. Implementing the middle and lower bits with current sources,
instead of an R-2R ladder, enhances its dynamic performance for
multitone or low amplitude signals and helps maintain the high
output impedance of the main DACs (that is, >200 MΩ).
The current sources are switched to one or the other of the two
output nodes (IOUTP or IOUTN) via PMOS differential current
switches. The switches are based on the architecture that was
pioneered in the AD976x family, with further refinements to
reduce distortion contributed by the switching transient. This
switch architecture also reduces various timing errors and provides
matching complementary drive signals to the inputs of the
differential current switches.
The analog and digital I/O sections of the AD9114/AD9115/
AD9116/AD9117 have separate power supply inputs (AVDD and
DVDDIO) that can operate independently over a 1.8 V to 3.3 V
range. The core digital section requires 1.8 V. An optional on-chip
LDO is provided for DVDDIO supplies greater than 1.8 V, or the
1.8 V can be supplied directly through DVDD. A 1.0 μF bypass
capacitor at DVDD (Pin 7) is required when using the LDO.
The core is capable of operating at a rate of up to 125 MSPS. It
consists of edge-triggered latches and the segment decoding logic
circuitry. The analog section includes PMOS current sources,
associated differential switches, a 1.0 V band gap voltage
reference, and a reference control amplifier.
Each DAC full-scale output current is regulated by the reference
control amplifier and can be set from 4 mA to 20 mA via an external
resistor, xRSET, connected to its full-scale adjust pin (FSADJx).
The external resistor, in combination with both the reference control
amplifier and voltage reference, VREFIO, sets the reference current,
IxREF, which is replicated to the segmented current sources with the
proper scaling factor. The full-scale current, IxOUTFS, is 32 × IxREF.
Optional on-chip xRSET resistors are provided that can be pro-
grammed between a nominal value of 1.6 kΩ to 8 kΩ (20 mA to
4 mA IxOUTFS, respectively).
The AD9114/AD9115/AD9116/AD9117 provide the option of
setting the output common mode to a value other than AGND via
the output common-mode pin (CMLI and CMLQ). This facilitates
directly interfacing the output of the AD9114/AD9115/AD9116/
AD9117 to components that require common-mode levels greater
than 0 V.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 33 of 52
SERIAL PERIPHERAL INTERFACE (SPI)
The serial port of the AD9114/AD9115/AD9116/AD9117 is a
flexible, synchronous serial communications port that allows easy
interfacing to many industry-standard microcontrollers and micro-
processors. The serial I/O is compatible with most synchronous
transfer formats, including both the Motorola SPI and Intel® SSR
protocols. The interface allows read/write access to all registers
that configure the AD9114/AD9115/AD9116/AD9117. Single or
multiple byte transfers are supported, as well as MSB first or
LSB first transfer formats. The serial interface port of the AD9114/
AD9115/AD9116/AD9117 is configured as a single I/O pin on
the SDIO pin.
GENERAL OPERATION OF THE SERIAL INTERFACE
There are two phases to a communication cycle on the AD9114/
AD9115/AD9116/AD9117. Phase 1 is the instruction cycle, which
is the writing of an instruction byte into the AD9114/AD9115/
AD9116/AD9117, coinciding with the first eight SCLK rising
edges. In Phase 2, the instruction byte provides the serial port
controller of the AD9114/AD9115/AD9116/AD9117 with infor-
mation regarding the data transfer cycle. The Phase 1 instruction
byte defines whether the upcoming data transfer is a read or write,
the number of bytes in the data transfer, and the starting register
address for the first byte of the data transfer. The first eight SCLK
rising edges of each communication cycle are used to write the
instruction byte into the AD9114/AD9115/AD9116/AD9117.
A Logic 1 on Pin 35 (RESET/PINMD), followed by a Logic 0,
resets the SPI port timing to the initial state of the instruction
cycle. This is true regardless of the present state of the internal
registers or the other signal levels present at the inputs to the
SPI port. If the SPI port is in the midst of an instruction cycle
or a data transfer cycle, none of the present data is written.
The remaining SCLK edges are for Phase 2 of the communication
cycle. Phase 2 is the actual data transfer between the AD9114/
AD9115/AD9116/AD9117 and the system controller. Phase 2
of the communication cycle is a transfer of one, two, three, or
four data bytes, as determined by the instruction byte. Using a
multibyte transfer is the preferred method. Single byte
data transfers are useful to reduce CPU overhead when register
access requires one byte only. Registers change immediately
upon writing to the last bit of each transfer byte.
INSTRUCTION BYTE
The instruction byte contains the information shown in Table 11.
Table 11.
MSB LSB
DB7 DB6 DB5 DB4 DB3 DB2 DB1 DB0
R/W N1 N0 A4 A3 A2 A1 A0
R/W (Bit 7 of the instruction byte) determines whether a read or a
write data transfer occurs after the instruction byte write. Logic 1
indicates a read operation. Logic 0 indicates a write operation.
N1 and N0 (Bit 6 and Bit 5 of the instruction byte) determine the
number of bytes to be transferred during the data transfer cycle.
The bit decodes are shown in Table 12.
Table 12. Byte Transfer Count
N1 N0 Description
0 0 Transfer 1 byte
0 1 Transfer 2 bytes
1 0 Transfer 3 bytes
1 1 Transfer 4 bytes
A4, A3, A2, A1, and A0 (Bit 4, Bit 3, Bit 2, Bit 1, and Bit 0 of the
instruction byte) determine which register is accessed during the
data transfer portion of the communications cycle. For multi-
byte transfers, this address is the starting byte address. The
following register addresses are generated internally by the
AD9114/AD9115/AD9116/AD9117 based on the LSBFIRST bit
(Register 0x00, Bit 6).
SERIAL INTERFACE PORT PIN DESCRIPTIONS
SCLK—Serial Clock
The serial clock pin is used to synchronize data to and from the
AD9114/AD9115/AD9116/AD9117 and to run the internal state
machines. The SCLK maximum frequency is 25 MHz. All data
input to the AD9114/AD9115/AD9116/AD9117 is registered on
the rising edge of SCLK. This is shown in Figure 85 and Figure 87
for write instructions where the SCLK rising edges are lined up in
the middle of the data. All data is driven out of the AD9114/AD9115/
AD9116/AD9117 on the falling edge of SCLK. This is shown in
Figure 86 and Figure 88 for read cycles where the SCLK falling
edges line up in the middle of the data in the data transfer cycle.
CS—Chip Select
An active low input starts and gates a communications cycle. It
allows more than one device to be used on the same serial commu-
nications lines. The SDIO/FORMAT pin reaches a high impedance
state when this input is high. Chip select should stay low during
the entire communication cycle.
SDIO—Serial Data I/O
The SDIO pin is used as a bidirectional data line to transmit
and receive data.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 34 of 52
MSB/LSB TRANSFERS
The serial port of the AD9114/AD9115/AD9116/AD9117 can
support both most significant bit (MSB) first or least significant
bit (LSB) first data formats. This functionality is controlled by the
LSBFIRST bit (Register 0x00, Bit 6). The default is MSB first
(LSBFIRST = 0).
When LSBFIRST = 0 (MSB first), the instruction and data bytes
must be written from the most significant bit to the least significant
bit. Multibyte data transfers in MSB first format start with an
instruction byte that includes the register address of the most
significant data byte. Subsequent data bytes should follow in
order from a high address to a low address. In MSB first mode,
the serial port internal byte address generator decrements for
each data byte of the multibyte communications cycle.
When LSBFIRST = 1 (LSB first), the instruction and data bytes
must be written from the least significant bit to the most significant
bit. Multibyte data transfers in LSB first format start with an
instruction byte that includes the register address of the least
significant data byte followed by multiple data bytes. The serial
port internal byte address generator increments for each byte of
the multibyte communication cycle.
If the MSB first mode is active, the serial port controller data
address of the AD9114/AD9115/AD9116/AD9117 decrements
from the data address written toward 0x00 for multibyte I/O
operations. If the LSB first mode is active, the serial port controller
address increments from the data address written toward 0x1F
for multibyte I/O operations.
SERIAL PORT OPERATION
The serial port configuration of the AD9114/AD9115/AD9116/
AD9117 is controlled by Register 0x00. It is important to note
that the configuration changes immediately upon writing to the
last bit of the register. For multibyte transfers, writing to this
register can occur during the middle of the communications
cycle. Care must be taken to compensate for this new configu-
ration for the remaining bytes of the current communications cycle.
The same considerations apply to setting the software reset bit
(Register 0x00, Bit 5). All registers are set to their default values
except Register 0x00, which remains unchanged.
Use of single-byte transfers or initiating a software reset is
recommended when changing serial port configurations to
prevent unexpected device behavior.
R/W N1 N0 A4 A3 A2 A1 A0 D7
N
D6
N
D5
N
D0
0
D1
0
D2
0
D3
0
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO
07466-291
Figure 85. Serial Register Interface Timing, MSB First Write
R/W N1 N0 A4 A3 A2 A1 A0 D7
N
D6
N
D5
N
D0
0
D1
0
D2
0
D3
0
INSTRUCTION CYCLE DATA TRANSFER CYCLE
CS
SCLK
SDIO
07466-386
Figure 86. Serial Register Interface Timing, MSB First Read
A0 A1 A2 A3 A4 N0 N1 R/W D0
0
D1
0
D2
0
D7
N
D6
N
D5
N
D4
N
INSTRUCTION CYCLE DATA TRANSFER CYCLE
SCLK
SDIO
07466-289
CS
Figure 87. Serial Register Interface Timing, LSB First Write
A0 A1 A2 A3 A4 N0 N1 R/W D00D10D20D7N
D6N
D5N
D4N
INSTRUCTION CYCLE DATA TRANSFER CYCLE
SCLK
SDIO
CS
07466-388
Figure 88. Serial Register Interface Timing, LSB First Read
PIN MODE
The AD9114/AD9115/AD9116/AD9117 can also be operated
without ever writing to the serial port. With RESET/PINMD
(Pin 35) tied high, the SCLK pin becomes CLKMD to provide
for clock mode control (see the Retimer section), the SDIO
pin becomes FORMAT and selects the input data format, and
the CS/PWRDN pin serves to power down the device. The
pins are not latched at power up. If you change the format, it
should change with about a 1µs delay.
Operation is otherwise exactly as defined by the default register
values in Table 13; therefore, external resistors at FSADJI and
FSADJQ are needed to set the DAC currents, and both DACs
are active. This is also a convenient quick checkout mode. DAC
currents can be externally adjusted in pin mode by sourcing or
sinking currents at the FSADJI/AUXI and FSADJQ/AUXQ
pins, as desired, with the fixed resistors installed. An op amp
output with appropriate series resistance is one of many
possibilities. This has the same effect as changing the resistor
value. Place at least 10 kΩ resistors in series right at the DAC
to guard against accidental short circuits and noise
modulation. The REFIO pin can be adjusted ±25% in a similar
manner, if desired.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 35 of 52
SPI REGISTER MAP
Table 13.
Name Addr Default Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
SPI Control 0x00 0x00 Reserved LSBFIRST Reset LNGINS Reserved
Power-Down 0x01 0x40 LDOOFF LDOSTAT PWRDN Q DACOFF I DACOFF QCLKOFF ICLKOFF EXTREF
Data Control 0x02 0x34 TWOS Reserved IFIRST IRISING SIMULBIT DCI_EN DCOSGL DCODBL
I DAC Gain
0x03
0x00
Reserved
I DACGAIN[5:0]
IRSET 0x04 0x00 IRSETEN Reserved IRSET[5:0]
IRCML 0x05 0x00 IRCMLEN Reserved IRCML[5:0]
Q DAC Gain 0x06 0x00 Reserved Q DACGAIN[5:0]
QRSET 0x07 0x00 QRSETEN Reserved QRSET[5:0]
QRCML 0x08 0x00 QRCMLEN Reserved QRCML[5:0]
AUXDAC Q 0x09 0x00 QAUXDAC[7:0]
AUX CTLQ 0x0A 0x00 QAUXEN QAUXRNG[1:0] QAUXOFS[2:0] QAUXDAC[9:8]
AUXDAC I 0x0B 0x00 IAUXDAC[7:0]
AUX CTLI
0x0C
0x00
IAUXEN
IAUXRNG[1:0]
IAUXOFS[2:0]
IAUXDAC[9:8]
Reference Resistor 0x0D 0x00 Reserved RREF[5:0]
Cal Control 0x0E 0x00 PRELDQ PRELDI CALSELQ CALSELI CALCLK DIVSEL[2:0]
Cal Memory
0x0F
0x00
CALSTATQ
CALSTATI
Reserved
CALMEMQ[1:0]
CALMEMI[1:0]
Memory Address 0x10 0x00 Reserved MEMADDR[5:0]
Memory Data 0x11 0x34 Reserved MEMDATA[5:0]
Memory R/W 0x12 0x00 CALRSTQ CALRSTI CALEN SMEMWR SMEMRD UNCALQ UNCALI
CLKMODE 0x14 0x00 CLKMODEQ[1:0] Searching Reacquire CLKMODEN CLKMODEI[1:0]
Version 0x1F 0x0A Version[7:0]
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 36 of 52
SPI REGISTER DESCRIPTIONS
Reading these registers returns previously written values for all defined register bits, unless otherwise noted.
Table 14.
Register Address Bit Name Description
SPI Control 0x00 6 LSBFIRST 0 (default): MSB first per SPI standard.
1: LSB first per SPI standard.
Note that the user must always change the LSB/MSB order in single-byte
instructions to avoid erratic behavior due to bit order errors.
5 Reset Executes software reset of SPI and controllers, reloads default register values,
except Register 0x00.
1: set software reset; write 0 on the next (or any following) cycle to release reset.
4 LNGINS 0 (default): the SPI instruction word uses a 5-bit address.
1: the SPI instruction word uses a 13-bit address.
Power Down
0x01
7
LDOOFF
0 (default): LDO voltage regulator on.
1: turns core LDO voltage regulator off.
6 LDOSTAT 0: indicates that the core LDO voltage regulator is off.
1 (default): indicates that the core LDO voltage regulator is on.
5 PWRDN 0 (default): all analog, digital circuitry and SPI logic are powered on.
1: powers down all analog and digital circuitry, except for SPI logic.
4 Q DACOFF 0 (default): turns on Q DAC output current.
1: turns off Q DAC output current.
3 I DACOFF 0 (default): turns on I DAC output current.
1: turns off I DAC output current.
2 QCLKOFF 0 (default): turns on Q DAC clock.
1: turns off Q DAC clock.
1 ICLKOFF 0 (default): turns on I DAC clock.
1: turns off I DAC clock.
0 EXTREF 0 (default): turns on internal voltage reference.
1: powers down the internal voltage reference (external reference required).
Data Control 0x02 7 TWOS 0 (default): Unsigned binary input data format.
1: twos complement input data format.
5 IFIRST 0: pairing of data—Q first of pair on data input pads.
1(default): pairing of data—I first of pair on data input pads (default).
4 IRISING 0: Q data latched on DCLKIO rising edge.
1(default): I data latched on DCLKIO rising edge (default).
3 SIMULBIT 0 (default): allows simultaneous input and output enable on DCLKIO.
1: disallows simultaneous input and output enable on DCLKIO.
2 DCI_EN Controls the use of the DCLKIO pad for the data clock input.
0: data clock input disabled.
1(default): data clock input enabled.
1 DCOSGL Controls the use of the DCLKIO pad for the data clock output.
0 (default): data clock output disabled.
1: data clock output enabled; regular strength driver.
0 DCODBL Controls the use of the DCLKIO pad for the data clock output.
0 (default): DCODBL data clock output disabled.
1: DCODBL data clock output enabled; paralleled with DCOSGL for 2× drive current.
I DAC Gain
0x03
5:0
I DACGAIN[5:0]
DAC I fine gain adjustment; alters the full-scale current, as shown in Figure 99.
Default IDACGAIN = 0x00.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 37 of 52
Register Address Bit Name Description
IRSET 0x04 7 IRSETEN 0 (default): IRSET resistor value for I channel is set by an external resistor connected
to the FADJI/AUXI pin. Nominal value for this external resistor is 4 kΩ.
1: enables the on-chip IRSET value to be changed for I channel.
5:0 IRSET[5:0] Changes the value of the on-chip IRSET resistor; this scales the full-scale current of
the DAC in ~0.25 dB steps twos complement (nonlinear), see Figure 98.
000000 (default): IRSET = 2 kΩ.
011111: IRSET = 8 kΩ.
100000: IRSET = 1.6 kΩ.
111111: IRSET = 2 kΩ.
IRCML 0x05 7 IRCMLEN 0 (default): IRCML resistor value for the I channel is set by an external resistor
connected to CMLI pin. Recommended value for this external resistor is 0 Ω.
1: enables on-chip IRCML adjustment for I channel.
5:0 IRCML[5:0] Changes the value of the on-chip IRCML resistor for I channel; this adjusts the
common-mode level of the DAC output stage.
000000 (default): IRCML = 60 Ω.
100000: IRCML = 160 Ω.
111111: IRCML = 260 Ω.
Q DAC Gain 0x06 5:0 Q DACGAIN[5:0] DAC Q fine gain adjustment; alters the full-scale current, as shown in Figure 99.
Default QDACGAIN = 0x00.
QRSET 0x07 7 QRSETEN 0 (default): QRSET resistor value for Q channel is set by an external resistor
connected to FADJI/AUXI pin. Nominal value for this external resistor is 4 kΩ.
1: enables on-chip QRSET adjustment for Q channel.
5:0 QRSET[5:0] Changes the value of the on-chip QRSET resistor; this scales the full-scale current of
the DAC in ~0.25 dB steps twos complement (nonlinear).
000000 (default): QRSET = 2 kΩ.
011111: QRSET = 8 kΩ.
100000: QRSET = 1.6 kΩ.
111111: QRSET = 2 kΩ.
QRCML 0x08 7 QRCMLEN 0 (default): QRCML resistor value for the Q channel is set by an external resistor
connected to CMLQ pin. Recommended value for this external resistor is 0 Ω.
1: enables on-chip QRCML adjustment.
5:0 QRCML[5:0] Changes the value of the on-chip QRCML resistor for Q channel; this adjusts the
common-mode level of the DAC output stage.
000000 (default): QRCML = 60 Ω.
100000: QRCML = 160 Ω.
111111: QRCML = 260 Ω.
AUXDAC Q 0x09 7:0 QAUXDAC[7:0] AUXDAC Q output voltage adjustment word LSBs.
0x3FF: sets AUXDAC Q output to full scale.
0x200: sets AUXDAC Q output to midscale.
0x000 (default): sets AUXDAC Q output to bottom of scale.
AUX CTLQ 0x0A 7 QAUXEN 0 (default): AUXDAC Q output disabled.
1: enables AUXDAC Q output.
6:5 QAUXRNG[1:0] 00 (default): sets AUXDAC Q output voltage range to 2 V.
01: sets AUXDAC Q output voltage range to 1.5 V.
10: sets AUXDAC Q output voltage range to 1.0 V.
11: sets AUXDAC Q output voltage range to 0.5 V.
4:2 QAUXOFS[2:0] 000 (default): sets AUXDAC Q top of range to 1.0 V.
001: sets AUXDAC Q top of range to 1.5 V.
010: sets AUXDAC Q top of range to 2.0 V.
011: sets AUXDAC Q top of range to 2.5 V.
100: sets AUXDAC Q top of range to 2.9 V.
1:0 QAUXDAC[9:8] AUXDAC Q output voltage adjustment word MSBs (default = 00).
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 38 of 52
Register Address Bit Name Description
AUXDAC I 0x0B 7:0 IAUXDAC[7:0] AUXDAC I output voltage adjustment word LSBs.
0x3FF: sets AUXDAC I output to full scale.
0x200: sets AUXDAC I output to midscale.
0x000 (default): sets AUXDAC I output to bottom of scale.
AUX CTLI 0x0C 7 IAUXEN 0 (default): AUXDAC I output disabled.
1: enables AUXDAC I output.
6:5 IAUXRNG[1:0] 00 (default): sets AUXDAC I output voltage range to 2 V.
01: sets AUXDAC I output voltage range to 1.5 V.
10: sets AUXDAC I output voltage range to 1.0 V.
11: sets AUXDAC I output voltage range to 0.5 V.
4:2 IAUXOFS[2:0] 000 (default): sets AUXDAC I top of range to 1.0 V.
001: sets AUXDAC I top of range to 1.5 V.
010: sets AUXDAC I top of range to 2.0 V.
011: sets AUXDAC I top of range to 2.5 V.
100: sets AUXDAC I top of range to 2.9 V.
1:0 IAUXDAC[9:8] AUX DAC I output voltage adjustment word MSBs (default = 00).
Reference
Resistor
0x0D 5:0 RREF[5:0] Permits an adjustment of the on-chip reference voltage and output at REFIO (see
Figure 97) twos complement.
000000 (default): sets the value of RREF to 10 kΩ, VREF = 1.0 V.
011111: sets the value of RREF to 12 kΩ, VREF = 1.2 V.
100000: sets the value of RREF to 8 kΩ, VREF = 0.8 V.
111111: sets the value of R
REF
to 10 kΩ, V
REF
= 1.0 V.
Cal Control 0x0E 7 PRELDQ 0 (default): preloads Q DAC calibration reference set to 32.
1: preloads Q DAC calibration reference set by user (Cal Address 1).
6 PRELDI 0 (default): preloads I DAC calibration reference set to 32.
1: preloads I DAC calibration reference set by user (Cal Address 1).
5 CALSELQ 0 (default): Q DAC self-calibration done.
1: selects Q DAC self-calibration.
4 CALSELI 0 (default): I DAC self-calibration done.
1: selects I DAC self-calibration.
3 CALCLK 0 (default): calibration clock disabled.
1: calibrates clock enabled.
2:0 DIVSEL[2:0] Calibration clock divide ratio from DAC clock rate.
000 (default): divide by 256.
001: divide by 128.
…
110: divide by 4.
111: divide by 2.
Cal Memory 0x0F 7 CALSTATQ 0 (default): Q DAC calibration in progress.
1: calibration of Q DAC complete.
6 CALSTATI 0 (default): I DAC calibration in progress.
1: calibration of I DAC complete.
3:2 CALMEMQ[1:0] Status of Q DAC calibration memory.
00 (default): uncalibrated.
01: self-calibrated.
10: user-calibrated.
1:0 CALMEMI[1:0] Status of I DAC calibration memory.
00 (default): uncalibrated.
01: self-calibrated.
10: user-calibrated.
Memory Address 0x10 5:0 MEMADDR[5:0] Address of static memory to be accessed.
Memory Data 0x11 5:0 MEMDATA[5:0] Data for static memory access.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 39 of 52
Register Address Bit Name Description
Memory R/W 0x12 7 CALRSTQ 0 (default): no action.
1: clears CALSTATQ.
6 CALRSTI 0 (default): no action.
1: clears CALSTATI.
4
CALEN
0 (default): no action.
1: initiates device self-calibration.
3 SMEMWR 0 (default): no action.
1: writes to static memory (calibration coefficients).
2 SMEMRD 0 (default): no action.
1: reads from static memory (calibration coefficients).
1 UNCALQ 0 (default): no action.
1: resets Q DAC calibration coefficients to default (uncalibrated).
0 UNCALI 0 (default): no action.
1: resets I DAC calibration coefficients to default (uncalibrated).
CLKMODE 0x14 7:6 CLKMODEQ[1:0] Depending on CLKMODEN bit setting, these two bits reflect the phase relationship
between DCLKIO and CLKIN, as described in Table 16.
If CLKMODEN = 0, read only; reports the clock phase chosen by the retime.
If CLKMODEN = 1, read/write; value in this register sets Q clock phases; force if
needed to better synchronize the DACs (see the Retimer section).
4 Searching Datapath retimer status bit.
0 (default): clock relationship established.
1: indicates that the internal datapath retimer is searching for clock relationship
(device output is not usable while this bit is high).
3 Reacquire Edge triggered, 0 to 1 causes the retimer to reacquire the clock relationship.
2 CLKMODEN 0 (default): CLKMODEI/CLKMODEQ values computed by the two retimers and read
back in CLKMODEI[1:0] and CLKMODEQ[1:0].
1: CLKMODE values set in CLKMODEI[1:0] override both I and Q retimers.
1:0 CLKMODEI[1:0] Depending on CLKMODEN bit setting, these two bits reflect the phase relationship
between DCLKIO and CLKIN, as described in Table 16.
If CLKMODEN = 0, read only; reports the clock phase chosen by the retimer.
If CLKMODEN = 1, read/write; value in this register sets I clock phases; force if
needed to better synchronize the DACs (see the Retimer section).
Version 0x1F 7:0 Version[7:0] Hardware version of the device. This register is set to 0x0A for the latest version of
the device.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 40 of 52
DIGITAL INTERFACE OPERATION
Digital data for the I and Q DACs is supplied over a single
parallel bus (DB[n:0], where n is 7 for the AD9114, is 9 for the
AD9115, is 11 for the AD9116, and 13 for the AD9117)
accompanied by a qualifying clock (DCLKIO). The I and Q
data are provided to the chip in an interleaved double data rate
(DDR) format. The maximum guaranteed data rate is 250 MSPS
with a 125 MHz clock. The order of data pairing and the sampling
edge selection is user programmable using the IFIRST and
IRISING data control bits, resulting in four possible timing
diagrams. These timing diagrams are shown in Figure 89,
Figure 90, Figure 91, and Figure 92.
DCLKIO
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9114, 9 FOR THE AD9115, 11 FOR THE
AD9116, AND 13 FOR THE AD9117.
DB[n:0] Z A B C D E F G H
I DATA Z B D F
Q DATA Y A C E
07466-051
Figure 89. Timing Diagram with IFIRST = 0, IRISING = 0
DCLKIO
ZA B C D E F G H
I DATA Y A C E
Q DATA X Z B D
07466-052
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9114, 9 FOR THE AD9115, 11 FOR THE
AD9116, AND 13 FOR THE AD9117.
DB[n:0]
Figure 90. Timing Diagram with IFIRST = 0, IRISING = 1
DCLKIO
ZA B C D E F G H
I DATA Z B D F
Q DATA A C E G
07466-053
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9114, 9 FOR THE AD9115, 11 FOR THE
AD9116, AND 13 FOR THE AD9117.
DB[n:0]
Figure 91. Timing Diagram with IFIRST = 1, IRISING = 0
DCLKIO
ZA B C D E F G H
I DATA Y A C E
Q DATA Z B D F
07466-054
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9114, 9 FOR THE AD9115, 11 FOR THE
AD9116, AND 13 FOR THE AD9117.
DB[n:0]
Figure 92. Timing Diagram with IFIRST = 1, IRISING = 1
Ideally, the rising and falling edges of the clock fall in the center
of the keep-in window formed by the setup and hold times, tS
and tH. Refer to Table 2 for setup and hold times. A detailed
timing diagram is shown in Figure 93.
DCLKIO
DB[n:0]
t
S
t
H
t
S
t
H
07466-055
NOTES:
1. DB[n:0], WHERE n IS 7 FOR THE AD9114, 9 FOR THE
AD9115, 11 FOR THE AD9116, AND 13 FOR THE AD9117.
Figure 93. Setup and Hold Times for All Input Modes
In addition to the different timing modes listed in Table 2, the
input data can also be presented to the device in either unsigned
binary or twos complement format. The format type is chosen
via the TWOS data control bit.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 41 of 52
4320
D-FF D-FF
5
D-FFD-FF D-FF
OR
DCLKIO-INT CLKIN-INT
DB[n:0]
(INPUT)
TO DAC CORE I
OUT
I
OUT
DELAY1
DELAY2
DELAY1
RETIMER-CLK
IE
IE OE
DCLKIO
(INPUT/OUTPUT)
CLKIN
(INPUT)
NOTES
D-FFs:
0: RISING OR FALLING EDGE
TRIGGERED FOR I OR Q DATA.
1, 2, 3, 4: RISING EDGE TRIGGERED.
RETIMER-CLK
07466-056
1
D-FF
Figure 94. Simplified Diagram of AD9114/AD9115/AD9116/AD9117 Timing
DIGITAL DATA LATCHING AND RETIMER SECTION
The AD9114/AD9115/AD9116/AD9117 have two clock inputs,
DCLKIO and CLKIN. The CLKIN is the analog clock whose
jitter affects DAC performance, and the DCLKIO is a digital clock
from an FPGA that needs to have a fixed relationship with the
input data to ensure that the data is sampled correctly by the
flip-flops on the pads.
Figure 94 is a simplified diagram of the entire data capture
system in the AD9114/AD9115/AD9116/AD9117. The double
data rate input data (DB[n:0], where n is 7 for the AD9114, is 9
for the AD9115, is 11 for the AD9116, and 13 for the AD9117) is
latched at the pads/pins either on the rising edge or the falling edge
of the DCLKIO-INT clock, as determined by IRISING, Bit 4 of
SPI Address 0x02. Bit 5 of SPI Address 0x02, IFIRST, determines
which channel data is latched first (that is, I or Q). The captured
data is then retimed to the internal clock (CLKIN-INT) in the
retimer block before being sent to the final analog DAC core
(D-FF 4), which controls the current steering output switches. All
delay blocks depicted in Figure 94 are non-inverting, and any wires
without an explicit delay block can be assumed to have no delay.
Only one channel is shown in Figure 94 with the data pads
(DB[n:0], where n is 7 for the AD9114, is 9 for the AD9115, is
11 for the AD9116, and 13 for the AD9117) serving as double
data rate pads for both channels.
The default PINMD and SPI settings are IE = high (closed) and
OE = low (open). These settings are enabled when RESET/PINMD
(Pin 35) is held high. In this mode, the user has to supply both
DCLKIO and CLKIN. In PINMD, it is also recommended that the
DCLKIO and the CLKIN be in phase for proper functioning of
the DAC, which can easily be ensured by tying the pins together
on the PCB. If the user can access the SPI, setting Bit 2 of SPI
Address 0x02, DCI_EN, to logic low causes the CLKIN to be
used as the DCLKIO also.
Setting Bit 1 or Bit 0 of SPI Address 0x02, DCOSGL or DCODBL,
to logic high allows the user to get a DCLKIO output from the
CLKIN input for use in the user’s PCB system.
It is strongly recommended that DCI_EN = DCOSGL = high,
or DCI_EN = DCODBL = high not be used, even though the
device may appear to function correctly. Similarly, DCOSGL
and DCODBL should not be set to logic high simultaneously.
Retimer
The AD9114/AD9115/AD9116/AD9117 have an internal data
retimer circuit that compares the CLKIN-INT and DCLKIO-INT
clocks and, depending on their phase relationship, selects a
retimer clock (RETIMER-CLK) to safely transfer data from the
DCLKIO used at the chip’s input interface to the CLKIN used to
clock the analog DAC cores (D-FF 4).
The retimer selects one of the three phases shown in Figure 95.
The retimer is controlled by the CLKMODE SPI bits as is
shown in Table 15.
1/2 PERIOD
1/4 PERIOD 1/2 PERIOD
DATA
CLOCK
RETIMER-CLKs
180°
90°
270°
07466-057
Figure 95. RETIMER-CLK Phases
Note that, in most cases, more than one retimer phase works
and, in such cases, the retimer arbitrarily picks one phase that
works. The retimer cannot pick the best or safest phase. If the
user has a working knowledge of the exact phase relationship
between DCLKIO and CLKIN (and thus DCLKIO-INT and
CLKIN-INT because the delay is approximately the same for
both clocks and equal to DELAY1), then the retimer can be
forced to this phase with CLKMODEN = 1, as described in
Table 15 and the following paragraphs.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 42 of 52
Table 15. Timer Register List
Bit Name Description
CLKMODEQ[1:0] Q datapath retimer clock selected output. Valid after the searching bit goes low.
Searching High indicates that the internal datapath retimer is searching for the clock relationship (DAC is not usable until it is low again).
Reacquire Changing this bit from 0 to 1 causes the datapath retimer circuit to reacquire the clock relationship.
CLKMODEN 0: Uses the CLKMODEI/CLKMODEQ values (as computed by the two internal retimers) for I and Q clocking.
1: Uses the CLKMODE value set in CLKMODEI[1:0] to override the bits for both the I and Q retimers (that is, force the retimer).
CLKMODEI[1:0] I datapath retimer clock selected output. Valid after searching goes low. If CLKMODEN = 1, a value written to this
register overrides both I and Q automatic retimer values.
Table 16. CLKMODEI/CLKMODEQ Details
CLKMODEI[1:0]/CLKMODEQ[1:0] DCLKIO-to-CLKIN Phase Relationship RETIMER-CLK Selected
00 0° to 90° Phase 2
01 90° to 180° Phase 3
10 180° to 270° Phase 3
11 270° to 360° Phase 1
When RESET is pulsed high and then returns low (the part is in
SPI mode), the retimer runs and automatically selects a suitable
clock phase for the RETIMER-CLK within 128 clock cycles. The
SPI searching bit, Bit 4 of SPI Address 0x14, returns to low,
indicating that the retimer has locked and the part is ready for
use. The reacquire bit, Bit 3 of SPI Address 0x14, can be used to
reinitiate phase detection in the I and Q retimers at any time.
CLKMODEQ[1:0] and CLKMODEI[1:0] bits of SPI Address 0x14
provide readback for the values picked by the internal phase
detectors in the retimer (see Table 16).
To force the two retimers (I and Q) to pick a particular phase
for the retimer clock (they must both be forced to the same value),
CLKMODEN, Bit 2 of the SPI Address 0x14, should be set high
and the required phase value is written into CLKMODEI[1:0].
For example, if the DCLKIO and the CLKIN are in phase to first
order, the user could safely force the retimers to pick Phase 2 for
the RETIMER-CLK. This forcing function may be useful for
synchronizing multiple devices.
In pin mode, it is expected that the user tie CLKIN and DCLKIO
together. The device has a small amount of programmable func-
tionality using the now unused SPI pins (SCLK, SDIO, and CS).
If the two chip clocks are tied together, the SCLK pin can be
tied to ground, and the chip uses a clock for the retimer that is
180° out of phase with the two input clocks (that is, Phase 2,
which is the safest and best option). The chip has an additional
option in pin mode when the redefined SCLK pin is high. Use
this mode if using pin mode, but CLKIN and DCLKIO are not
tied together (that is, not in phase). Holding SCLK high causes
the internal clock detector to use the phase detector output to
determine which clock to use in the retimer (that is, select a
suitable RETIMER-CLK phase). The action of taking SCLK
high causes the internal phase detector to reexamine the two
clocks and determine the relative phase. Whenever the user
wants to reevaluate the relative phase of the two clocks, the
SCLK pin can be taken low and then high again.
ESTIMATING THE OVERALL DAC PIPELINE DELAY
DAC pipeline latency is affected by the phase of the RETIMER-
CLK that is selected. If latency is critical to the system and must be
constant, the retimer should be forced to a particular phase and
not be allowed to automatically select a phase each time.
Consider the case in which DCLKIO = CLKIN (that is, in
phase), and the RETIMER-CLK is forced to Phase 2. Assume
that IRISING is 1 (that is, I data is latched on the rising edge
and Q data is latched on the falling edge). Then the latency to the
output for the I channel is four clock cycles total; one clock cycle
from the input interface (D-FF 1, not D-FF0 as it latches data
on either edge and does not cause any delay), two clock cycles
from the retimer (D-FF 2 and D-FF 4, but not D-FF 3 because it
is latched on the half clock cycle or 180°), and one clock cycle
going through the analog core (D-FF 5). The latency to the output
for the Q channel from the time the falling edge latches it at the
pads in D-FF 0 is 3.5 clock cycles (no delay due to D-FF0, 1 clock
cycle due to D-FF 1, ½ clock cycle to D-FF 2, 1 clock cycle to
D-FF 4, and 1 clock cycle to D-FF 5). This latency for the AD9714/
AD9715/AD9716/AD9717 is case specific and needs to be calcu-
lated based on the RETIMER-CLK phase that is automatically
selected or manually forced.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 43 of 52
REFERENCE OPERATION
The AD9114/AD9115/AD9116/AD9117 contains an internal
1.0 V band gap reference. The internal reference can be disabled by
setting Bit 0 (EXTREF) of the power-down register (Address 0x01)
through the SPI interface. To use the internal reference, decouple
the REFIO pin to AVSS with a 0.1 μF capacitor, enable the
internal reference, and clear Bit 0 of the power-down register
(Address 0x01) through the SPI interface. Note that this is the
default configuration. The internal reference voltage is present
at REFIO. If the voltage at REFIO is to be used anywhere else in
the circuit, an external buffer amplifier with an input bias current of
less than 100 nA must be used to avoid loading the reference. An
example of the use of the internal reference is shown in Figure 96.
CURRENT
SCALING
x32
AD9114/AD9115/
AD9116/AD9117 I DAC
OR
Q DAC
07466-218
I
xOUTFS
xR
SET
0.1µF
REFIO
I
xREF
AVSS
FSADJx
V
BG
1.0V
+
–
Figure 96. Internal Reference Configuration
REFIO serves as either an input or an output, depending on
whether the internal or an external reference is used. Table 17
summarizes the reference operation.
Table 17. Reference Operation
Reference Mode REFIO Pin Register Setting
Internal Connect 0.1 µF
capacitor
Register 0x01, Bit 0 = 0
(default)
External Apply external
reference
Register 0x01, Bit 0 = 1
(for power saving)
An external reference can be used in applications requiring tighter
gain tolerances or lower temperature drift. In addition, a variable
external voltage reference can be used to implement a method
for gain control of the DAC output.
Recommendations When Using an External Reference
Apply the external reference to the REFIO pin. The internal
reference can be directly overdriven by the external reference,
or the internal reference can be powered down to save power
consumption.
The external 0.1 µF compensation capacitor on REFIO is not
required unless specified by the external voltage reference
manufacturer. The input impedance of REFIO is 10 kΩ when
the internal reference is powered up and 1 MΩ when it is
powered down.
REFERENCE CONTROL AMPLIFIER
The AD9114/AD9115/AD9116/AD9117 contains a control
amplifier that regulates the full-scale output current, IxOUTFS.
The control amplifier is configured as a V-I converter, as shown
in Figure 96. The output current, IxREF, is determined by the ratio of
the VREFIO and an external resistor, xRSET, as stated in Equation 4 (see
the DAC Transfer Function section). IxREF is mirrored to the
segmented current sources with the proper scale factor to set
IxOUTFS, as stated in Equation 3 (see the DAC Transfer Function
section).
The control amplifier allows a 10:1 adjustment span of IxOUTFS
from 2 mA to 20 mA by setting IxREF between 62.5 µA and 625 µA
(xRSET between 1.6 kΩ and 16 kΩ). When using a resistor larger
than 4 kΩ, split the resistor with 4 kΩ plus the additional
resistance needed, for example, 16 kΩ made of a 4 kΩ + 12 kΩ
combination, and add a 1 µF capacitor from 4 kΩ to ground.
The wide adjustment span of IxOUTFS provides several benefits.
The first relates directly to the power dissipation of the
AD9114/AD9115/AD9116/AD9117, which is proportional to
IxOUTFS (see the DAC Transfer Function section). The second
benefit relates to the ability to adjust the output over a 8 dB
range with 0.25 dB steps, which is useful for controlling the
transmitted power. The small signal bandwidth of the reference
control amplifier is approximately 500 kHz. This allows the
device to be used for low frequency, small signal multiplying
applications.
DAC TRANSFER FUNCTION
The AD9114/AD9115/AD9116/AD9117 provides two differential
current outputs, IOUTP/IOUTN and QOUTP/ QOUTN. IOUTP
and QOUTP provide a near full-scale current output, IxOUTFS,
when all bits are high (that is, DAC CODE = 2N − 1, where N = 8,
10, 12, or 14 for the AD9114, AD9115, AD9116, and AD9117,
respectively), while IOUTN and QOUTN, the complementary
outputs, provide no current. The current outputs appearing at the
positive DAC outputs, IOUTP and QOUTP, and at the negative
DAC outputs, IOUTN and QOUTN, are a function of both the
input code and IxOUTFS and can be expressed as follows:
IOUTP = (IDAC CODE/2N) × IIOUTFS (1)
QOUTP = (QDAC CODE/2N) × IQOUTFS
IOUTN = ((2N − 1) − IDAC CODE)/2N × IIOUTFS (2)
QOUTN = ((2N − 1) − QDAC CODE)/2N × IQOUTFS
where:
IDAC CODE and QDAC CODE = 0 to 2N − 1 (that is, decimal
representation).
IIOUTFS and IQOUTFS are functions of the reference currents, IIREF
and IQREF, respectively, which are nominally set by a reference
voltage, VREFIO, and external resistors, IRSET and QRSET, respectively.
IIOUTFS and IQOUTFS can be expressed as follows:
IIOUTFS = 32 × IIREF (3)
IQOUTFS = 32 × IQREF
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 44 of 52
where:
IIREF = VREFIO/IRSET (4)
IQREF = VREFIO/QRSET
or
IIOUTFS = 32 × VREFIO/IRSET (5)
IQOUTFS = 32 × VREFIO/QRSET
A differential pair (IOUTP/IOUTN or QOUTP/QOUTN)
typically drives a resistive load directly or via a transformer. If
dc coupling is required, the differential pair (IOUTP/IOUTN or
QOUTP/QOUTN) should be connected to matching resistive
loads, xRLOAD, that are tied to analog common, AVSS. The single-
ended voltage output appearing at the positive and negative nodes is
VIOUTP = IOUTP × IRLOAD (6)
VQOUTP = QOUTP × QRLOAD
VIOUTN = IOUTN × IRLOAD (7)
VQOUTN = QOUTN × QRLOAD
To achieve the maximum output compliance of 1 V at the nominal
20 mA output current, IRLOAD = QRLOAD must be set to 50 Ω.
Substituting the values of IOUTP, IOUTN, IxREF, and VIDIFF can
be expressed as
VIDIFF = {(2 × IDAC CODE − (2N − 1))/2N} ×
(32 × VREFIO/IRSET) × IRLOAD (8)
Equation 8 highlights some of the advantages of operating the
AD9114/AD9115/AD9116/AD9117 differentially. First, the
differential operation helps cancel common-mode error sources
associated with IOUTP and IOUTN, such as noise, distortion,
and dc offsets. Second, the differential code-dependent current and
subsequent voltage, VIDIFF, is twice the value of the single-ended
voltage output (that is, VIOUTP or VIOUTB), thus providing twice the
signal power to the load. Note that the gain drift temperature
performance for a single-ended output (VIOUTP and VIOUTN) or
differential output of the AD9114/AD9115/AD9116/ AD9117
can be enhanced by selecting temperature tracking resistors for
xRLOAD and xRSET because of their ratiometric relationship, as
shown in Equation 8.
ANALOG OUTPUT
The complementary current outputs in each DAC, IOUTP/
IOUTN and QOUTP/QOUTN, can be configured for single-
ended or differential operation. IOUTP/IOUTN and QOUTP/
QOUTN can be converted into complementary single-ended
voltage outputs, VIOUTP and VIOUTN as well as VQOUTP and VQOUTN via
a load resistor, xRLOAD, as described in the DAC Transfer Function
section by Equation 6 through Equation 8. The differential
voltages, VIDIFF and VQDIFF, existing between VIOUTP and VIOUTN,
and VQOUTP and VQOUTN, can also be converted to a single-ended
voltage via a transformer or a differential amplifier configuration.
The ac performance of the AD9114/AD9115/AD9116/AD9117 is
optimum and is specified using a differential transformer-coupled
output in which the voltage swing at IOUTP and IOUTN is
limited to ±0.5 V. The distortion and noise performance of the
AD9114/AD9115/AD9116/AD9117 can be enhanced when it is
configured for differential operation. The common-mode error
sources of both IOUTP/IOUTN and QOUTP/QOUTN can be
significantly reduced by the common-mode rejection of a
transformer or differential amplifier. These common-mode error
sources include even-order distortion products and noise.
The enhancement in distortion performance becomes more
significant as the frequency content of the reconstructed waveform
increases and/or its amplitude increases. This is due to the first-
order cancellation of various dynamic common-mode distortion
mechanisms, digital feedthrough, and noise. Performing a
differential-to-single-ended conversion via a transformer also
provides the ability to deliver twice the reconstructed signal
power to the load (assuming no source termination). Because
the output currents of IOUTP/IOUTN and QOUTP/QOUTN
are complementary, they become additive when processed
differentially.
SELF-CALIBRATION
The AD9114/AD9115/AD9116/AD9117 have a self-calibration
feature that improves the DNL of the device. Performing a self-
calibration on the device improves device performance in low
frequency applications. The device performance in applications
where the analog output frequencies are above 5 MHz are generally
influenced more by dynamic device behavior than by DNL and,
in these cases, self-calibration is unlikely to produce measurable
benefits. The calibration clock frequency is equal to the DAC clock
divided by the division factor chosen by the DIVSEL value. There
is a fixed pre-divider of 16 and it is multiplied by the DIVSEL,
which has a range of divide by 2 -256. Each calibration clock
cycle is between 32 and 2048 DAC input clock cycles, depending
on the value of DIVSEL[2:0] (Register 0x0E, Bits[2:0]). The
frequency of the calibration clock should be between 0.5 MHz
and 4 MHz for reliable calibrations. Best results are obtained by
setting DIVSEL[2:0] to produce a calibration clock frequency
between these values. Separate self-calibration hardware is
included for each DAC. The DACs can be self-calibrated
individually or simultaneously.
To perform a device self-calibration, use the following procedure:
1. Write 0x00 to Register 0x12. This ensures that the UNCALI
and UNCALQ bits (Bit 1 and Bit 0) are reset.
2. Set up a calibration clock between 0.5 MHz and 4 MHz
using DIVSEL[2:0], and then enable the calibration clock
by setting the CALCLK bit (Register 0x0E, Bit 3).
3. Select the DAC(s) to self-calibrate by setting either Bit 4
(CALSELI) for the I DAC and/or Bit 5 (CALSELQ) for
the Q DAC in Register 0x0E. Note that each DAC contains
independent calibration hardware so that they can be
calibrated simultaneously.
4. Start self-calibration by setting Bit 4 (CALEN) in Register 0x12.
Wait approximately 300 calibration clock cycles.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 45 of 52
5. Check if the self-calibration has completed by reading
Bit 6 (CALSTATI) and Bit 7 (CALSTATQ) in Register 0x0F.
Logic 1 indicates that the calibration has completed.
6. When the self-calibration has completed, write 0x00 to
Register 0x12.
7. Disable the calibration clock by clearing Bit 3 (CALCLK)
in Register 0x0E.
The AD9114/AD9115/AD9116/AD9117 allow reading and
writing of the calibration coefficients. There are 32 coefficients
in total. The read/write feature of the coefficients can be useful for
improving the results of the self-calibration routine by averaging
the results of several self-calibration cycles and loading the
averaged results back into the device.
To read the calibration coefficients, use the following steps:
1. Select which DAC core to read by setting either Bit 4
(CALSELI) for the I DAC or Bit 5 (CALSELQ) for the
Q DAC in Register 0x0E. Write the address of the first
coefficient (0x01) to Register 0x10.
2. Set Bit 2 (SMEMRD) in Register 0x12 by writing 0x04 to
Register 0x12.
3. Read the 6-bit value of the first coefficient by reading the
contents of Register 0x11.
4. Clear the SMEMRD bit by writing 0x00 to Register 0x12.
5. Repeat Step 2 through Step 4 for each of the remaining 31
coefficients by incrementing the address by 1 for each read.
6. Deselect the DAC core by clearing either Bit 4 (CALSELI)
for the I DAC and/or Bit 5 (CALSELQ) for the Q DAC in
Register 0x0E.
To write the calibration coefficients to the device, use the
following steps:
1. Select which DAC core to write to by setting either Bit 4
(CALSELI) for the I DAC or Bit 5 (CALSELQ) for the
Q DAC in Register 0x0E.
2. Set Bit 3 (SMEMWR) in Register 0x12 by writing 0x08 to
Register 0x12.
3. Write the address of the first coefficient (0x01) to
Register 0x10.
4. Write the value of the first coefficient to Register 0x11.
5. Repeat Step 2 through Step 4 for each of the remaining 31
coefficients by incrementing the address by one for each write.
6. Clear the SMEMWR bit by writing 0x00 to Register 0x12.
7. Deselect the DAC core by clearing either Bit 4 (CALSELI)
for the I DAC or Bit 5 (CALSELQ) for the Q DAC in
Register 0x0E.
COARSE GAIN ADJUSTMENT
Option 1
A coarse full-scale output current adjustment can be achieved
using the lower six bits in Register 0x0D. This adds or subtracts
up to 20% from the band gap voltage on Pin 34 (REFIO), and
the voltage on the FSADJx resistors tracks this change. As a result,
the DAC full-scale current varies by the same amount. A secondary
effect to changing the REFIO voltage is that the full-scale voltage in
the AUXDAC also changes by the same magnitude. The register
uses twos complement format, in which 011111 maximizes the
voltage on the REFIO node and 100000 minimizes the voltage.
1.30
1.25
1.20
1.15
1.10
1.05
1.00
0.95
0.90
0.85
0.80
0 8 16 24 32 40 48 56
CODE
V
REF
(V)
07466-058
Figure 97. Typical VREF Voltage vs. Code
Option 2
While using the internal FSADJx resistors, each main DAC can
achieve independently controlled coarse gain using the lower six
bits of Register 0x04 (IRSET[5:0]) and Register 0x07 (QRSET[5:0]).
Unlike Coarse Gain Option 1, this impacts only the main DAC
full-scale output current. The register uses twos complement
format and allows the output current to be changed in
approximately 0.25 dB steps.
20
18
22
16
10
12
14
8
6
4
2
0 102030405060
xR
SET
CODE
I
F
(mA)
V
OUT_Q
OR V
OUT_I
07466-059
Figure 98. Effect of xRSET Code
Option 3
Even when the device is in pin mode, full-scale values can be
adjusted by sourcing or sinking current from the FSADJx pins.
Any noise injected here appears as amplitude modulation of the
output. Thus, a portion of the required series resistance (at least
20 kΩ) must be installed right at the pin. A range of ±10% is
quite practical using this method.
Option 4
As in Option 3, when the device is in pin mode, both full-scale
values can be adjusted by sourcing or sinking current from the
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 46 of 52
REFIO pin. Noise injected here appears as amplitude modulation
of the output; therefore, a portion of the required series resistance
(at least 10 kΩ) must be installed at the pin. A range of ±25% is
quite practical when using this method.
Fine Gain
Each main DAC has independent fine gain control using the
lower six bits in Register 0x03 (I DACGAIN[5:0]) and Register
0x06 (Q DACGAIN[5:0]). Unlike Coarse Gain Option 1, this
impacts only the main DAC full-scale output current. These
registers use straight binary format. One application in which
straight binary format is critical is for side-band suppression
while using a quadrature modulator. This is described in more
detail in the Applications Information section.
11.10
11.00
10.90
10.80
10.70
10.60
10.50
0 8 16 24 32 40 48 56 64
GAIN DAC CODE
IOUTFS (mA)
3.3V DAC1
3.3V DAC2
1.8V DAC1
1.8V DAC2
0
7466-060
Figure 99. Typical DAC Gain Characteristics
USING THE INTERNAL TERMINATION RESISTORS
The AD9117/AD9116/AD9115/AD9114 have four 62.5 Ω
termination internal resistors (two for each DAC output).
To use these resistors to convert the DAC output current to a
voltage, connect each DAC output pin to the adjacent load pin.
For example, on the I DAC, IOUTP must be shorted to RLIP
and IOUTN must be shorted to RLIN. In addition, the CMLI
or CMLQ pin must be connected to ground directly or through
a resistor. If the output current is at the nominal 20 mA and the
CMLI or CMLQ pin is tied directly to ground, this produces a
dc common-mode bias voltage on the DAC output equal to
0.625 V. If the DAC dc bias must be higher than 0.625 V, an
external resistor can be connected between the CMLI or CMLQ
pin and ground. This part also has an internal common-mode
resistor that can be enabled. This is explained in the Using the
Internal Common-Mode Resistor section.
I DAC
OR
Q DAC
xR
CM
CML
RLIN
IOUTN
IOUTP
RLIP
62.5Ω
62.5Ω
07466-061
Figure 100. Simplified Internal Load Options
Using the Internal Common-Mode Resistor
These devices contain an adjustable internal common-mode
resistor that can be used to increase the dc bias of the DAC
outputs. By default, the common-mode resistor is not connected.
When enabled, it can be adjusted from ~60 Ω to ~260 Ω. Each
main DAC has an independent adjustment using the lower six bits
in Register 0x05 (IRCML[5:0]) and Register 0x08 (QRCML[5:0]).
260
220
240
200
180
160
140
120
100
80
60
0 8 16 24 32 40 48 56
CODE
RESISTANCE (Ω)
07466-062
Figure 101. Typical CML Resistor Value vs. Register Code
Using the CMLx Pins for Optimal Performance
The CMLx pins also serve to change the DAC bias voltages in
the parts allowing them to run at higher dc output bias voltages.
When running the bias voltage below 0.9 V and an AVDD of
3.3 V, the parts perform optimally when the CMLx pins are tied
to ground. When the dc bias increases above 0.9 V, set the CMLx
pins at 0.5 V for optimal performance. The maximum dc bias
on the DAC output should be kept at or below 1.2 V when the
supply is 3.3 V. When the supply is 1.8 V, keep the dc bias close
to 0 V and connect the CMLx pins directly to ground.
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 47 of 52
APPLICATIONS INFORMATION
OUTPUT CONFIGURATIONS
The following sections illustrate some typical output configu-
rations for the AD9114/AD9115/AD9116/AD9117. Unless
otherwise noted, it is assumed that IxOUTFS is set to a nominal
20 mA. For applications requiring the optimum dynamic
performance, a differential output configuration is suggested.
A differential output configuration can consist of either an RF
transformer or a differential op amp configuration. The trans-
former configuration provides the optimum high frequency
performance and is recommended for any application that
allows ac coupling. The differential op amp configuration is
suitable for applications requiring dc coupling, signal gain,
and/or a low output impedance.
A single-ended output is suitable for applications in which low
cost and low power consumption are primary concerns.
DIFFERENTIAL COUPLING USING A TRANSFORMER
An RF transformer can be used to perform a differential-to-
single-ended signal conversion, as shown in Figure 102. The
distortion performance of a transformer typically exceeds
that available from standard op amps, particularly at higher
frequencies. Transformer coupling provides excellent rejection
of common-mode distortion (that is, even-order harmonics)
over a wide frequency range. It also provides electrical isolation
and can deliver voltage gain without adding noise. Transformers
with different impedance ratios can also be used for impedance
matching purposes. The main disadvantages of transformer
coupling are low frequency roll-off, lack of power gain, and
high output impedance.
AD9114/AD9115/
AD9116/AD9117
IOUTN
IOUTP
29
28
OPTIONAL R
DIFF
R
LOAD
07466-063
Figure 102. Differential Output Using a Transformer
The center tap on the primary side of the transformer must be
connected to a voltage that keeps the voltages on IOUTP and
IOUTN within the output common-mode voltage range of the
device. Note that the dc component of the DAC output current
is equal to IIOUTFS and flows out of both IOUTP and IOUTN.
The center tap of the transformer should provide a path for this
dc current. In most applications, AGND provides the most
convenient voltage for the transformer center tap. The comple-
mentary voltages appearing at IOUTP and IOUTN (that is,
VIOUTP and VIOUTN) swing symmetrically around AGND and
should be maintained with the specified output compliance
range of the AD9114/AD9115/AD9116/AD9117.
A differential resistor, RDIFF, can be inserted in applications in
which the output of the transformer is connected to the load,
RLOAD, via a passive reconstruction filter or cable. RDIFF, as
reflected by the transformer, is chosen to provide a source
termination that results in a low voltage standing wave ratio
(VSWR). Note that approximately half the signal power is
dissipated across RDIFF.
SINGLE-ENDED BUFFERED OUTPUT USING
AN OP AMP
An op amp, such as the ADA4899-1, can be used to perform a single-
ended current-to-voltage conversion, as shown in Figure 103.
Figure 103 is a simplified schematic. The REFIO pin must be
buffered to keep the load current less than 100 nA. The AD9114/
AD9115/AD9116/AD9117 are configured with a pair of series
resistors, RS, off each output. For best distortion performance, RS
should be set to 0 Ω. The feedback resistor, RFB, determines the
peak-to-peak signal swing by the formula
VOUT = RFB × IFS
The common-mode voltage of the output is determined by the
formula
2
1FS
FB
B
FB
REF
CM
IR
R
R
VV
The maximum and minimum voltages out of the amplifier are,
respectively,
B
FB
REF
MAX R
R
VV 1
VMIN = VMAX − IFS × RFB
+5V
AD9114/AD9115/
AD9116/AD9117
IOUTP
IOUTN
29
R
FB
V
OUT
REFIO
34
28
R
S
AVSS
25
C
F
C
R
S
R
B
+
–
ADA4899-1
–5V
07466-064
Figure 103. Single-Supply, Single-Ended Buffer
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 48 of 52
DIFFERENTIAL BUFFERED OUTPUT
USING AN OP AMP
A dual op amp (see the circuit shown in Figure 104) can be
used in a differential version of the single-ended buffer shown
in Figure 103. Figure 104 is a simplified schematic. The REFIO
pin must be buffered to keep the load current less than 100 nA.
The same RC network is used to form a one-pole differential,
low-pass filter to isolate the op amp inputs from the high
frequency images produced by the DAC outputs. The feedback
resistors, RFB, determine the differential peak-to-peak signal swing
by the formula
VOUT = 2 × RFB × IFS
The maximum and minimum single-ended voltages out of the
amplifier are, respectively,
+×=
B
FB
REFMAX
R
R
VV 1
VMIN = VMAX − RFB × IFS
The common-mode voltage of the differential output is
determined by the formula
VCM = VMAX − RFB × IFS
AD9114/AD9115/
AD9116/AD9117
IOUTP
IOUTN
RFB
VOUT
REFIO 34
28
RS
AVSS 25
CF
C
RFB
RB
CF
RS
RB
29
+
–
ADA4841-2
+
–
ADA4841-2
07466-065
Figure 104. Single-Supply Differential Buffer
AUXILIARY DACs
The DACs of the AD9114/AD9115/AD9116/AD9117 feature
two versatile and independent 10-bit auxiliary DACs suitable
for dc offset correction and similar tasks.
Because the AUXDACs are driven through the SPI port, they
should never be used in timing-critical applications, such as
inside analog feedback loops.
To keep the pin count reasonable, these auxiliary DACs each
share a pin with the corresponding FSADJx resistor. They are,
therefore, usable only when enabled and when that DAC is
operated on its internal full-scale resistors. A simple I-to-V
converter is implemented on-chip with selectable shunt resistors
(3.2 kΩ to 16 kΩ) such that if REFIO is set to exactly 1 V, REFIO/2
equals 0.5 V and the following equation describes the no load
output voltage:
kΩ16
5.
1
V5
.0
−
−
=
S
DAC
OUT
R
I
V
Figure 105 illustrates the function of all the SPI bits controlling
these DACs with the exception of the QAUXEN (Register 0x0A)
and IAUXEN (Register 0x0C) bits and gating to prohibit
RS < 3.2 kΩ.
+
–
OP AMP
AUXDAC
[9:0]
AVDD
RNG0
RNG1
REFIO
2
16kΩ 16kΩ
16kΩ
4kΩ 8kΩ
OFS2
OFS1
OFS0
(OFS > 4 = 4)
AUX
PIN
RNG: 00 = 125µAf
S
01 = 62µAf
S
10 = 31µAf
S
11 = 16µAf
S
07466-066
Figure 105. AUXDAC Simplified Circuit Diagram
The SPI speed limits the update rate of the auxiliary DACs. The
data is inverted such that IAUXDAC is full scale at 0x000 and zero
at 0x1FF, as shown in Figure 106.
3.0
2.8
2.6
2.4
2.2
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
010 20 30 40 50 60 70 80 90 100 120 130
DAC CURRENT (µA)
OUTPUT (V)
110
R
OFFSET
= 3.3kΩ
R
OFFSET
= 4kΩ
R
OFFSET
= 5.3kΩ
R
OFFSET
= 8kΩ
R
OFFSET
= 16kΩ
OP AMP OUTPUT VOLTAGE vs.
CHANGES IN R
OFFSET
AND DAC CURRENT IN µA
07466-067
Figure 106. AUXDAC Op Amp Output vs. Current, AVDD = 3.3 V No Load,
AUXDAC 0x1FF to 0x000
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 49 of 52
Two registers are assigned to each DAC with 10 bits for the
actual DAC current to be generated, a 3-bit offset (and gain)
adjustment, a 2-bit current range adjustment, and an enable/
disable bit. Setting the QAUXOFS (Register 0x0A) and
IAUXOFS (Register 0x0C) bits to all 1s disables the respective
op amp and routes the DAC current directly to the respective
FSADJI/AUXI or FSADJQ/AUXQ pins. This is especially useful
when the loads to be driven are beyond the limited capability of
the on-chip amplifier.
When not enabled (QAUXEN or IAUXEN = 0), the respective
DAC output is in open circuit.
DAC-TO-MODULATOR INTERFACING
The auxiliary DACs can be used for local oscillator (LO)
cancellation when the DAC output is followed by a quadrature
modulator. This LO feedthrough is caused by the input referred
dc offset voltage of the quadrature modulator (and the DAC
output offset voltage mismatch) and can degrade system
performance. Typical DAC-to-quadrature modulator interfaces
are shown in Figure 107 and Figure 108, with the series resistor
value chosen to give an appropriate adjustment range. Figure 107
also shows external load resistors in use. Often, the input common-
mode voltage for the modulator is much higher than the output
compliance range of the DAC, so that ac coupling or a dc level
shift is necessary. If the required common-mode input voltage
on the quadrature modulator matches that of the DAC, the dc
blocking capacitors in Figure 107 can be removed and the on-chip
resistors can be connected.
AD9114/AD9115/
AD9116/AD9117
AUXDAC1
AD9114/AD9115/
AD9116/AD9117
I DAC
5kΩ
TO
100kΩ
50Ω50Ω
OPTIONAL
PASSIVE
FILTERING
MODULATOR V+
QUADRATURE
MODULATOR
I OR Q
INPUTS
0.1µF
0.1µF
07466-268
Figure 107. Typical Use of Auxiliary DACs
Figure 108 shows a greatly simplified circuit that takes full
advantage of the internal components supplied in the DAC.
A low-pass or band-pass passive filter is recommended when
spurious signals from the DAC (distortion and DAC images) at the
quadrature modulator inputs can affect the system performance. In
the example shown in Figure 108, the filter must be able to pass dc
to properly bias the modulator. Placing the filter at the location
shown in Figure 107 and Figure 108 allows easy design of the filter,
because the source and load impedances can easily be designed
close to 50 Ω for a 20 mA full-scale output. When the resistance
at the modulator inputs is known, an optimum value for the
series resistor can be calculated from the modulator input
offset voltage ratings.
AD9114/AD9115/
AD9116/AD9117
AUXDAC
AD9114/AD9115/
AD9116/AD9117
I OR Q DAC
5kΩ
50Ω50Ω
100Ω
OPTIONAL
LOW- PASS
FILTERING
ADL5370
FAMILY
I OR Q INPUTS
07466-269
Figure 108. Typical Use of Auxiliary DACs When DC Coupling to Quadrature
Modulator ADL537x Family
CORRECTING FOR NONIDEAL PERFORMANCE OF
QUADRATURE MODULATORS ON THE IF-TO-RF
CONVERSION
Analog quadrature modulators make it very easy to realize
single sideband radios. These DACs are most often used to make
radio transmitters, such as in cell phone towers. However, there
are several nonideal aspects of quadrature modulator performance.
Among these analog degradations are gain mismatch and LO
feedthrough.
Gain Mismatch
The gain in the real and imaginary signal paths of the quadrature
modulator may not be matched perfectly. This leads to less than
optimal image rejection because the cancellation of the negative
frequency image is less than perfect.
LO Feedthrough
The quadrature modulator has a finite dc referred offset, as well
as coupling from its LO port to the signal inputs. These can lead
to a significant spectral spur at the frequency of the quadrature
modulator LO.
The AD9114/AD9115/AD9116/AD9117 have the capability to
correct for both of these analog degradations. However, understand
that these degradations drift over temperature; therefore, if close to
optimal single sideband performance is desired, a scheme for
sensing these degradations over temperature and correcting
them may be necessary.
I/Q CHANNEL GAIN MATCHING
Fine gain matching is achieved by adjusting the values in the DAC
fine gain adjustment registers. For the I DAC, these values are in
the I DAC Gain register (Register 0x03, I DACGAIN[5:0]). For the
Q DAC, these values are in the Q DAC gain register (Register 0x06,
Q DACGAIN[5:0]). These are 6-bit values that cover ±2% of full
scale. To perform gain compensation by starting from the default
values of zero, raise the value of one of these registers a few steps
until it can be determined if the amplitude of the unwanted
image is increased or decreased. If the unwanted image increases in
amplitude, remove the step and try the same adjustment on the
other DAC control register. Iterate register changes until the
rejection cannot be improved further. If the fine gain adjustment
range is not sufficient to find a null (that is, the register goes full
scale with no null apparent), adjust the course gain settings of the
two DACs accordingly and try again. Variations on this simple
method are possible.
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 50 of 52
Note that LO feedthrough compensation is independent of
phase compensation. However, gain compensation can affect
the LO compensation because the gain compensation may change
the common-mode level of the signal. The dc offset of some
modulators is common-mode level dependent. Therefore, it is
recommended that the gain adjustment be performed prior to
LO compensation.
LO FEEDTHROUGH COMPENSATION
To achieve LO feedthrough compensation in a circuit, each
output of the two AUXDACs must be connected through a
10 kΩ resistor to one side of the differential DAC output. See
the Auxiliary DACs section for details of how to use AUXDACs.
The purpose of these connections is to drive a very small amount
of current into the nodes at the quadrature modulator inputs,
thereby adding a slight dc bias to one or the other of the
quadrature modulator signal inputs.
To achieve LO feedthrough compensation, the user should start
with the default conditions of the AUXDAC registers and then
increment the magnitude of one or the other AUXDAC output
voltages. While this is being done, the amplitude of the LO
feedthrough at the quadrature modulator output should be
sensed. If the LO feedthrough amplitude increases, try either
decreasing the output voltage of the AUXDAC being adjusted
or try adjusting the output voltage of the other AUXDAC. It
may take practice before an effective algorithm is achieved. The
AD9114/AD9115/AD9116/ AD9117 evaluation board can be
used to adjust the LO feedthrough down to the noise floor,
although this is not stable over temperature.
RESULTS OF GAIN AND OFFSET CORRECTION
The results of gain and offset correction can be seen in Figure 109
and Figure 110. Figure 109 shows the output spectrum of the
quadrature demodulator before gain and offset correction.
Figure 110 shows the output spectrum after correction. The
LO feedthrough spur at 450 MHz has been suppressed to the
noise level. This result can be achieved by applying the correction,
but the correction must be repeated after a large change in
temperature.
Note that gain matching improves the negative frequency
image rejection, but it is also related to the phase mismatch in
the quadrature modulator. It can be improved by adjusting the
relative phase between the two quadrature signals at the digital side
or properly designing the low-pass filter between the DACs and
quadrature modulators. Phase mismatch is frequency dependent;
therefore, routines must be developed to adjust it if wideband
signals are desired.
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
447.5 449.0 450.0 451.0 452.5
FREQUENCY (MHz)
dB
07466-070
Figure 109. AD9114/AD9115/AD9116/AD9117 and ADL5370 with a Single-
Tone Signal at 450 MHz, No Gain or LO Compensation
5
–5
–15
–25
–35
–45
–55
–65
–75
–85
–95
0
–10
–20
–30
–40
–50
–60
–70
–80
–90
447.5 449.0 450.0 451.0 452.5
FREQUENCY (MHz)
dB
07466-071
Figure 110. AD9114/AD9115/AD9116/AD9117 and ADL5370 with a Single-
Tone Signal at 450 MHz, Gain and LO Compensation Optimized
Data Sheet AD9114/AD9115/AD9116/AD9117
Rev. D | Page 51 of 52
OUTLINE DIMENSIONS
1
40
10
11
31
30
21
20
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
06-01-2012-D
0.50
BSC
PIN 1
INDICATOR
4.50 REF
0.20 MIN
0.50
0.40
0.30
TOP VIEW
12° MAX 0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.25
4.10 SQ
3.95
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
5.85
5.75 SQ
5.65
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
(BOTTOM VIEW)
Figure 111. 40-Lead Lead Frame Chip Scale Package [LFCSP]
6 mm × 6 mm and 0.85 mm Package Height
(CP-40-1)
Dimensions shown in millimeters
10-23-2017-B
0.50
BSC
BOTTOM VIEWTOP VIEW
SIDE VIEW
PIN 1
INDICATOR
0.05 MAX
0.02 NOM
0.20 REF
COPLANARITY
0.08
0.30
0.23
0.18
6.10
6.00 SQ
5.90
0.80
0.75
0.70
0.45
0.40
0.35
0.20 MIN
4.25
4.10 SQ
3.95
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5.
40
1
11
20
21
30
31
10
PKG-004354
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
DETAIL A
(JEDEC 95)
EXPOSED
PAD
SEATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 112. 40-Lead Lead Frame Chip Scale Package [LFCSP]
6 mm × 6 mm and 0.75 mm Package Height
(CP-40-9)
Dimensions shown in millimeters
AD9114/AD9115/AD9116/AD9117 Data Sheet
Rev. D | Page 52 of 52
ORDERING GUIDE
Model
1
Temperature Range
Package Description
Package Option
AD9114BCPZ −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9114BCPZRL7 −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9115BCPZ −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9115BCPZRL7 −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9116BCPZ −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9116BCPZRL7 −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9117BCPZ −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9117BCPZRL7 −40°C to +85°C 40-Lead LFCSP CP-40-1
AD9117BCPZN −40°C to +85°C 40-Lead LFCSP CP-40-9
AD9117BCPZNRL7
−40°C to +85°C
40-Lead LFCSP
CP-40-9
AD9114-DPG2-EBZ Evaluation Board
AD9115-DPG2-EBZ Evaluation Board
AD9116-DPG2-EBZ Evaluation Board
AD9117-DPG2-EBZ Evaluation Board
1 Z = RoHS Compliant Part.
©2008–2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D07466-0-12/17(D)
