CPC1006N 60V Normally-Open Single-Pole 4-Pin SOP OptoMOS(R) Relay INTEGRATED CIRCUITS DIVISION Parameter Blocking Voltage Load Current On-Resistance (max) LED Current to operate Rating 60 75 10 0.5 Units VP mArms / mADC mA Features * Designed for EN50130-4 Compliant Security Systems * 1500Vrms Input/Output Isolation * Only 0.5mA of LED Current Required to Operate * Small 4-Pin SOP Package * High Reliability * Arc-Free With No Snubbing Circuits * No EMI/RFI Generation * Immune to Radiated EM Fields * Tape & Reel Version Available * Flammability Rating UL 94 V-0 Applications * Security * Passive Infrared Detectors (PIR) * Data Signalling * Sensor Circuitry * Instrumentation * Multiplexers * Data Acquisition * Electronic Switching * I/O Subsystems * Meters (Watt-Hour, Water, Gas) * Medical Equipment--Patient/Equipment Isolation * Aerospace * Industrial Controls Description The CPC1006N is a miniature single-pole, normally-open (1-Form-A) solid state relay in a 4-pin SOP package that employs optically coupled MOSFET technology to provide 1500Vrms of input to output isolation. The relay outputs are constructed with efficient MOSFET switches and photovoltaic die that use IXYS Integrated Circuits Division's patented OptoMOS architecture while the input, a highly efficient infrared LED, provides the optically coupled control. Using IXYS Integrated Circuits Division's state of the art double-molded vertical construction packaging to produce one of the world's smallest relays, the CPC1006N offers board space savings of at least 20% over the competitor's larger 4-pin SOP relay. Approvals * UL Recognized Component: File E76270 * CSA Certified Component: Certificate 1172007 * EN/IEC 60950-1 Certified Component: TUV Certificate B 13 12 82667 003 Ordering Information Part # CPC1006N CPC1006NTR Description 4-Pin SOP (100/tube) 4-Pin SOP (2000/reel) Pin Configuration + Control - Control 1 4 3 2 Load Load Switching Characteristics of Normally-Open Devices Form-A IF 90% 10% ILOAD ton DS-CPC1006N-R05 www.ixysic.com toff 1 INTEGRATED CIRCUITS DIVISION CPC1006N Absolute Maximum Ratings @ 25C Parameter Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 Isolation Voltage Input to Output ESD Rating, Human Body Model Operational Temperature Storage Temperature 1 2 Ratings 60 5 50 1 70 400 1500 4 -40 to +85 -40 to +125 Absolute Maximum Ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Units VP V mA A mW mW Vrms kV C C Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. Derate linearly 1.33 mW / C Derate linearly 3.33 mW / C Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous Peak On-Resistance 1 Off-State Leakage Current Switching Speeds Turn-On Turn-Off Output Capacitance Input Characteristics Input Control Current to Activate 2 Input Control Current to Deactivate Input Voltage Drop Reverse Input Current Common Characteristics Capacitance, Input to Output 1 2 2 Conditions Symbol Min Typ Max Units IF=0.5mA t=10ms IF=0.5mA, IL=75mA IF=0mA, VL=60VP IL ILPK RON ILEAK - 7 - 75 350 10 1 mArms / mADC mAP IF=0mA, VL=50V, f=1MHz ton toff COUT - 5 10 10 - ms ms pF IL=75mA IF=5mA VR=5V IF IF VF IR 0.05 0.9 - 0.1 1.2 - 0.5 1.5 10 mA mA V A VIO=0V, f=1MHz CIO - 1 - pF IF=2mA, VL=10V A Measurement taken within 1 second of on-time. For applications requiring high temperature operation (greater than 60C) a minimum LED drive current of 2mA is recommended. www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1006N PERFORMANCE DATA* 25 10 15 10 5 5 0 5 0 0.099 0.108 0.117 0.126 0.135 0.144 0.153 Turn-On Time (ms) 0.400 0.415 0.430 0.445 0.460 0.475 0.490 Turn-Off Time (ms) Typical IF for Switch Operation (N=50, IL=75mA) Typical On-Resistance Distribution (N=50, IF=0.5mA, IL=75mA) Typical Blocking Voltage Distribution (N=50, IF=0mA) 25 15 10 5 20 15 10 5 0.08 0.09 0.10 0.11 LED Forward Current (mA) 6.7 0.12 1.4 1.3 1.1 1.0 -40 0.18 IF=5mA IF=2mA IF=1mA -20 7.2 80 150 100 Turn-On Time (Ps) 0.10 0.08 0 20 40 60 Temperature (C) 80 100 Typical Turn-Off Time vs. LED Forward Current (IL=50mA) 446 445 0 Typical Turn-On Time vs. Temperature (IL=50mA) IF=1mA IF=2mA IF=5mA 400 300 200 0 -40 -20 0 20 40 60 Temperature (C) 10 20 30 40 LED Forward Current (mA) 80 100 50 Typical Turn-Off Time vs. Temperature (IL=50mA) 700 100 -20 91 447 50 500 0.12 90 443 10 20 30 40 LED Forward Current (mA) 600 0.14 85 86 87 88 89 Blocking Voltage (VP) 444 0 Typical IF for Switch Operation vs. Temperature (IL=50mA) 84 448 200 100 5 449 0 20 40 60 Temperature (C) 10 83 50 0 15 7.3 250 0.16 0.06 -40 6.9 7.0 7.1 On-Resistance (:) Turn-Off Time (Ps) 1.5 300 Turn-On Time (Ps) IF=50mA IF=20mA IF=10mA 6.8 Typical Turn-On Time vs. LED Forward Current (IL=50mA) Typical LED Forward Voltage Drop vs. Temperature 1.6 20 0 0 0.07 1.2 25 Device Count (N) Device Count (N) 20 Device Count (N) 10 0 0 LED Forward Voltage (V) 15 1.235 1.240 1.245 1.250 1.255 1.260 1.265 LED Forward Voltage (V) 25 IF (mA) 20 Device Count (N) 15 Typical Turn-Off Time (N=50, IF=2mA, IL=75mA) 25 20 Device Count (N) Device Count (N) 25 20 Typical Turn-On Time (N=50, IF=2mA, IL=75mA) Turn-Off Time (Ps) 30 Typical LED Forward Voltage Drop (N=50, IF=5mA) 600 500 400 IF=5mA IF=2mA IF=1mA 300 200 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R05 www.ixysic.com 3 INTEGRATED CIRCUITS DIVISION CPC1006N PERFORMANCE DATA* Typical On-Resistance vs. Temperature (IF=1mA, IL=50mA) 12 Typical Load Current vs. Load Voltage (IF=0.5mA) 100 80 10 9 8 7 Load Current (mA) 75 Load Current (mA) On-Resistance (:) 11 50 0 -50 6 -20 0 20 40 60 Temperature (C) 80 100 Typical Blocking Voltage vs. Temperature 10 Leakage Current (nA) Blocking Voltage (VP) 94 92 90 88 86 84 -40 70 65 60 55 50 -100 -0.6 -20 0 20 40 60 Temperature (C) 80 -0.2 0.0 0.2 Load Voltage (V) 0.4 Typical Leakage vs. Temperature Measured Across Pins 3&4 (VL=60V) 14 6 4 2 800 -40 0.6 8 0 -40 100 45 -0.4 Output Capacitance (pF) 5 -40 Maximum Load Current vs. Temperature (IF=1mA) -20 0 20 40 60 Temperature (C) 80 100 Output Capacitance vs. Load Voltage (IF=0mA, f=1MHz) 12 10 8 6 4 -20 0 20 40 60 Temperature (C) 80 100 10s 100s 0 10 20 30 40 Load Voltage (V) 50 60 Energy Rating Curve (IF=0.5mA) Load Current (mA) 700 600 500 400 300 200 100 0 10Ps 100Ps 1ms 10ms 100ms Time 1s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 4 www.ixysic.com R05 INTEGRATED CIRCUITS DIVISION CPC1006N Manufacturing Information Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC1006N MSL 3 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (Tc) Dwell Time (tp) Max Reflow Cycles CPC1006N 260C 30 seconds 3 Board Wash IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include, but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. R05 www.ixysic.com 5 INTEGRATED CIRCUITS DIVISION CPC1006N MECHANICAL DIMENSIONS CPC1006N 4.089 0.025 (0.161 0.001) Recommended PCB Land Pattern 0.203 Typ (0.008 Typ) 6.096 0.102 (0.240 0.004) 3.810 0.025 (0.150 0.001) 0.55 (0.022) 0.559 0.127 (0.022 0.005) 5.50 (0.217) 0.910 0.025 (0.036 0.001) Pin 1 2.54 Typ (0.100 Typ) 1.45 (0.057) 2.030 0.025 (0.080 0.001) 0.481 (0.019) 0-0.1 (0-0.004) 2.54 (0.10) Package standoff: 0.064 0.040 (0.0025 0.0015) Dimensions mm (inches) 0.381 TYP. (0.015 TYP.) CPC1006NTR Tape & Reel 330.2 Dia (13.00 Dia) Top Cover Tape Thickness 0.102 Max (0.004 Max) W=12.00 (0.472) B0=4.70 (0.185) K0=2.70 (0.106) K1=2.30 (0.091) P1=8.00 (0.315) A0=6.50 (0.256) User Direction of Feed Dimensions mm (inches) Embossed Carrier Embossment NOTE: All dimensional tolerances per Standard EIA-481-2 except as noted For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits Division's Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division's product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice. 6 Specification: DS-CPC1006N-R05 (c)Copyright 2018, IXYS Integrated Circuits Division OptoMOS(R) is a registered trademark of IXYS Integrated Circuits Division All rights reserved. Printed in USA. 1/30/2018