IRF140
39.95 (1.573)
max.
17.15 (0.675)
16.64 (0.655)
30.40 (1.197)
30.15 (1.187)
26.67 (1.050)
max.
11.18 (0.440)
10.67 (0.420)
1
2
4.09 (0.161)
3.84 (0.151)
dia.
2 plcs.
20.32 (0.800)
18.80 (0.740)
dia.
7.87 (0.310)
6.99 (0.275)
12.07 (0.475)
11.30 (0.445)
1.78 (0.070)
1.52 (0.060)
1.09 (0.043)
0.97 (0.038)
dia.
2 plcs.
VGS Gate – Source Voltage
IDContinuous Drain Current (VGS = 0 , Tcase = 25°C)
(VGS = 0 , Tcase = 100°C)
IDM Pulsed Drain Current 1
PDPower Dissipation @ Tcase = 25°C
Linear Derating Factor
EAS Single Pulse Avalanche Energy 2
IAR Avalanche Current 2
EAR Repetitive Avalanche Energy 2
dv/dt Peak Diode Recovery 3
TJ, Tstg Operating and Storage Temperature Range
TLLead Temperature 1.6mm (0.63”) from case for 10 sec.
±20V
28A
20A
112A
125W
1.0W/°C
250mJ
28A
12.5mJ
5.5V/ns
-55 to +150°C
300°C
MECHANICAL DATA
Dimensions in mm (inches) N–CHANNEL
POWER MOSFET
ABSOLUTE MAXIMUM RATINGS (Tcase = 25°C unless otherwise stated)
FEATURES
• HERMETICALLY SEALED TO–3 METAL
PACKAGE
• SIMPLE DRIVE REQUIREMENTS
• SCREENING OPTIONS AVAILABLE
TO–3 Metal Package
Pin 1 – Gate Pin 2 – Source Case – Drain
Notes
1) Pulse Test: Pulse Width 300µs, δ≤2%
2) @ VDD = 25V , L 480µH , RG= 25, Peak IL= 28A , Starting TJ= 25°C
3) @ ISD 28A , di/dt 170A/µs , VDD BVDSS , TJ150°C , Suggested RG= 9.1
VDSS 100V
ID(cont) 28A
RDS(on) 0.077
Document Number 5349
Issue 1
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
Semelab Plc reserves the right to change test conditions, parameter limits and package dimensions without notice. Information furnished by Semelab is believed
to be both accurate and reliable at the time of going to press. However Semelab assumes no responsibility for any errors or omissions discovered in its use.
Semelab encourages customers to verify that datasheets are current before placing orders.
Parameter Test Conditions Min. Typ. Max. Unit
100
0.13
0.077
0.089
24
9.1 25
250
100
–100
1660
550
120
30 59
2.4 12
12 30.7
21
145
21
105
28
112
1.5
400
2.9
Negligible
5.0
13
1.67
0.12 30
VGS = 0 ID= 1mA
Reference to 25°C
ID= 1mA
VGS = 10V ID= 20A
VGS = 10V ID= 28A
VDS = VGS ID= 250µA
VDS 15V IDS = 20A
VGS = 0 VDS = 0.8BVDSS
TJ= 125°C
VGS = 20V
VGS = –20V
VGS = 0
VDS = 25V
f = 1MHz
VGS = 10V
ID= 28A
VDS = 0.5BVDSS
VDD = 50V
ID= 28A
RG= 9.1
IS= 28A TJ= 25°C
VGS = 0
IF= 28A TJ= 25°C
di/ dt100A/µsV
DD 50V
ELECTRICAL CHARACTERISTICS (Tcase = 25°C unless otherwise stated)
Drain – Source Breakdown Voltage
Temperature Coefficient of
Breakdown Voltage
Static Drain – Source On–State
Resistance 1
Gate Threshold Voltage
Forward Transconductance 1
Zero Gate Voltage Drain Current
Forward Gate
– Source Leakage
Reverse Gate
– Source Leakage
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate – Source Charge
Gate – Drain (“Miller”) Charge
Turn–On Delay Time
Rise Time
Turn–Off Delay Time
Fall Time
Continuous Source Current
Pulse Source Current 2
Diode Forward Voltage 1
Reverse Recovery Time
Reverse Recovery Charge 1
Forward Turn–On Time
V
V/°C
V
S
µA
nA
pF
nC
ns
A
V
ns
µC
nH
°C/W
BVDSS
BVDSS
TJ
RDS(on)
VGS(th)
gfs
IDSS
IGSS
IGSS
Ciss
Coss
Crss
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
IS
ISM
VSD
trr
Qrr
ton
LD
LS
RθJC
RθCS
RθJA
STATIC ELECTRICAL RATINGS
Notes
1) Pulse Test: Pulse Width 300ms, δ≤2%
2) Repetitive Rating – Pulse width limited by maximum junction temperature.
DYNAMIC CHARACTERISTICS
SOURCE – DRAIN DIODE CHARACTERISTICS
Internal Drain Inductance (measured from 6mm down drain lead to centre of die)
Internal Source Inductance (from 6mm down source lead to source bond pad)
Thermal Resistance Junction – Case
Thermal Resistance Case – Sink
Thermal Resistance Junction – Ambient
PACKAGE CHARACTERISTICS
THERMAL CHARACTERISTICS
IRF140
Document Number 5349
Issue 1
Semelab plc. Telephone +44(0)1455 556565. Fax +44(0)1455 552612.
E-mail: sales@semelab.co.uk Website: http://www.semelab.co.uk
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