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FEATURES
SN54ABT541...JORWPACKAGE
SN74ABT541B...DB,DW,N,ORPWPACKAGE
(TOP VIEW)
OE1
VCC
120
A1 OE2
219
A2 Y1
318
A3 Y2
417
A4 Y3
516
A5 Y4
6 15
A6 Y5
714
A7 Y6
813
A8 Y7
912
GND Y8
10 11
SN54ABT541...FKPACKAGE
(TOP VIEW)
A3 4
A4 5
A5 6
A6 7
Y1
18
Y2
17
Y3
16
Y4
15
Y5
14
A7 8
120
219
OE1
VCC
A1
OE2
A2
3
Y6
13
A8
Y7
912
GND
Y8
10 11
DESCRIPTION/ORDERING INFORMATION
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
•State-of-the-Art EPIC-IIB™ BiCMOS DesignSignificantly Reduces Power Dissipation•Latch-Up Performance Exceeds 500 mA PerJEDEC Standard JESD-17•Typical V
OLP
(Output Ground Bounce) < 1 V atV
CC
= 5 V, T
A
= 25 °C•High-Impedance State During Power Up andPower Down•High-Drive Outputs (–32-mA I
OH
, 64-mA I
OL
)•Package Options Include Plastic Small-Outline(DW), Shrink Small-Outline (DB), and ThinShrink Small-Outline (PW) Packages, CeramicChip Carriers (FK), Ceramic Flat (W) Package,and Plastic (N) and Ceramic (J) DIPs
The SN54ABT541 and SN74ABT541B octal buffers and line drivers are ideal for driving bus lines or bufferingmemory address registers. The devices feature inputs and outputs on opposite sides of the package to facilitateprinted circuit board layout.
ORDERING INFORMATION
T
A
PACKAGE
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
PDIP – N Reel of 1000 SN74ABT541BN SN74ABT541BNTube of 25 SN74ABT541BDWSOIC – DW ABT541BReel of 2000 SN74ABT541BDWR–40 °C to 85 °C SN74ABT541BDBRSSOP – DB Reel of 2000 AB541BSN74ABT541BDBRG4Reel of 1050 SN74ABT541BPWTSSOP – PW AB541BReel of 2000 SN74ABT541BPWRCDIP – J Reel of 1000 SNJ54ABT541J SNJ54ABT541J–55 °C to 125 °C CFP – W Reel of 510 SNJ54ABT541W SNJ54ABT541WLCCC – FK Reel of 2200 SNJ54ABT541FK SNJ54ABT541FK
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available atwww.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.EPIC-IIB is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 1993–2006, Texas Instruments IncorporatedProducts conform to specifications per the terms of the TexasInstruments standard warranty. Production processing does notnecessarily include testing of all parameters.
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DESCRIPTION/ORDERING INFORMATION (CONTINUED)
OE1
O 2E
A1 Y1
To Seven Other Channels
1
19
18
2
OE1
OE2
A1
1
Y1
18
A2
2
Y2
17
A3
3
Y3
16
A4
4
Y4
15
A5
5
Y5
14
A6
6
Y6
13
A7
7
Y7
12
A8
8
9
19
Y8
11
1
&EN
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
The 3-state control gate is a two-input AND gate with active-low inputs so that if either output-enable ( OE1 orOE2) input is high, all eight outputs are in the high-impedance state.
When VCC is between 0 and 2.1 V, the device is in the high-impedance state during power up or power down.However, to ensure the high-impedance state above 2.1 V, OE should be tied to VCC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.
The SN54ABT541 is characterized for operation over the full military temperature range of –55 °C to 125 °C. TheSN74ABT541B is characterized for operation from –40 °C to 85 °C.
FUNCTION TABLE
INPUTS
OUTPUTS
YOE1 OE2 A
L L L LL L H HH X X ZX H X Z
LOGIC SYMBOL
(1)
LOGIC DIAGRAM (POSITIVE LOGIC)
(1) This symbol is in accordance withANSI/IEEE Std 91-1984 and IECPublication 617-12.
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Absolute Maximum Ratings
(1)
Recommended Operating Conditions
(1)
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
over recommended operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
V
CC
Supply voltage range –0.5 7 VV
I
Input voltage range
(2)
–0.5 7 VV
O
Voltage range applied to any output in the high or power-off state –0.5 5.5 VI
O
Current into any output in the low state SN54ABT541 96
mASN74ABT541B 128I
IK
Input clamp current V
I
< 0 –18 mAI
OK
Output clamp current V
O
< 0 –50 mAθ
JA
Package thermal impedance
(3)
DB package 115DW package 97
°C/WN package 67PW package 128T
stg
Storage temperature range –65 150 °C
(1) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratingsonly, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operatingconditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2) The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.(3) The package thermal impedance is calculated in accordance with JESD 51, except for through-hole packages, which use a trace lengthof zero.
over recommended operating free-air temperature range (unless otherwise noted)
SN54ABT541 SN74ABT541B UNIT
MIN MAX MIN MAX
V
CC
Supply voltage 4.5 5.5 4.5 5.5 VV
IH
High-level input voltage 2 2 VV
IL
Low-level input voltage 0.8 0.8 VI
OH
High-level output current –24 –32 mAI
OL
Low-level output current 48 64 mA∆t/ ∆v Input transition rise or fall rate 5 5 ns/V∆t/ ∆V
CC
Power-up ramp rate 200 µs/VT
A
Operating free-air temperature –55 125 –40 85 °C
(1) All unused inputs of the device must be held at V
CC
or GND to ensure proper device operation. Refer to the TI application report,Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
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Electrical Characteristics
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
over operating free-air temperature range (unless otherwise noted)
T
A
= 25 °C SN54ABT51 SN74ABT541BPARAMETER TEST CONDITIONS UNITMIN TYP
(1)
MAX MIN MAX MIN MAX
V
IK
V
CC
= 4.5 V, I
I
= –18 mA –1.2 –1.2 –1.2 VV
OH
V
CC
= 4.5 V, I
OH
= –3 mA 2.5 2.5 2.5V
CC
= 5 V, I
OH
= –3 mA 3 3 3
VV
CC
= 4.5 V, I
OH
= –24 mA 2 2I
OH
= –32 mA 2
(2)
2V
OL
V
CC
= 4.5 V, I
OL
= 48 mA 0.55 0.55
VVI
OL
= 64 mA 0.55
(2)
0.55V
hys
100 mVI
I
V
CC
= 5.5 V, V
I
= V
CC
or GND ±1±1±1µAI
OZPU
V
CC
= 0 to 2.1 V, V
O
= 0.5 V to 2.7 V, OE = X ±50
(3)
±50
(3)
±50 µAI
OZPD
V
CC
= 2.1 V to 0, V
O
= 0.5 V to 2.7 V, OE = X ±50
(3)
±50
(3)
±50 µAI
OZH
V
CC
= 5.5 V, V
O
= 2.7 V 10 10 10 µAI
OZL
V
CC
= 5.5 V, V
O
= 0.5 V –10 –10 –10 µAI
off
V
CC
= 0 V, V
I
or V
O
≤4.5 V ±100 ±100 µAI
CEX
V
CC
= 5.5 V, V
O
= 5.5 V, Outputs high 50 50 µAI
O
V
CC
= 5.5 V
(4)
, V
O
= 2.5 V –50 –140 –180 –50 –180 –50 –180 mAI
CC
V
CC
= 5.5 V, Outputs high 5 250 250 250 µAI
O
= 0 V,
Outputs low 22 30 30 30 mAV
I
= V
CC
or GND
Outputs disabled 1 250 250 250 µA∆I
CC
V
CC
= 5.5 V, Outputs enabled 1.5 1.5 1.5 mAOne input at 3.4 V,
Outputs disabled 50 50 50 µAOther inputs at V
CC
or
Control Inputs 1.5 1.2 1.5 mAGND
(5)
C
i
V
I
= 2.5 V or 0.5 V 3 pFC
o
V
O
= 2.5 V or 0.5 V 6 pF
(1) All typical values are at V
CC
= 5 V.(2) On products compliant to MIL-PRF-38535, this parameter does not apply.(3) On products compliant to MIL-PRF-38535, this parameter is not production tested.(4) Not more than one output should be tested at a time, and the duration of the test should not exceed one second.(5) This is the increase in supply current for each input that is at the specified TTL voltage level rather than V
CC
or GND.
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Switching Characteristics, SN54ABT541
Switching Characteristics, SN74ABT541B
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
over recommended ranges of supply voltage and operating free-air temperature, C
L
= 50 pF (unless otherwise noted)(see Figure 1 )
VCC = 5 V,FROM TO
TA = 25 °CPARAMETER UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX
t
PLH
1 2.6 4.1 1 4.6A Y nst
PHL
1 2.9 4.2 1 4.7t
PZH
1.1 3.1 4.8 1.1 5.4OE Y nst
PZL
2.1 4.4 5.9 2.1 7t
PHZ
2.1 5.1 6.6 2.1 7.5OE Y nst
PLZ
1.7 4.7 6.2 1.7 6.7
over recommended ranges of supply voltage and operating free-air temperature, C
L
= 50 pF (unless otherwise noted)(see Figure 1 )
VCC = 5 V,FROM TO
TA = 25 °CPARAMETER UNIT(INPUT) (OUTPUT)
MIN TYP MAX MIN MAX
t
PLH
1 2 3.2 1 3.9A Y nst
PHL
1 2.6 3.5 1 3.9t
PZH
2 3.5 4.5 2 4OE Y nst
PZL
1.9 4 5.1 1.9 5.9t
PHZ
2.2 4.4 5.4 2.2 5.8OE Y nst
PLZ
1.5 3 4 1.5 4.4t
sk(o)
(1)
0.5 0.5 ns
(1) Skew between any two outputs of the same package switching in the same direction.
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PARAMETER MEASURMENT INFORMATION
th
tsu
DataInput
TimingInput
0V
0V
0V
tW
Input
0V
Input
Output
Waveform1
S1at7V
(seeNoteB)
Output
Waveform2
S1atOpen
(seeNoteB)
VOL
VOH
0V
»0V
Output
Output
Output
Control
1.5V
1.5V 1.5V
1.5V
1.5V
FromOutput
UnderTest
C =50pF
(seeNote A)
L
LOADCIRCUIT
S1
7V
Open
GND
500 Ω
500 Ω
TEST S1
t /t
PLH PHL Open
7V
t /t
PLZ PZL
Open
t /t
PHZ PZH
VOLTAGEWAVEFORMS
ENABLE ANDDISABLETIMES
LOW- ANDHIGH-LEVEL ENABLING
VOLTAGEWAVEFORMS
PROPAGATIONDELAY TIMES
INVERTING ANDNONINVERTINGOUTPUTS
NOTES: A. C includesprobeandjigcapacitance.
B. Waveform1isforanoutputwithinternalconditionssuchthattheoutputislow,exceptwhendisabledbytheoutputcontrol.
Waveform2isforanoutputwithinternalconditionssuchthattheoutputishigh,exceptwhendisabledbytheoutputcontrol.
C. Allinputpulsesaresuppliedbygeneratorshavingthefollowingcharacteristics:PRR 10MHz,Z =50 ,t
.
D. Theoutputsaremeasuredoneatatime,withonetransitionpermeasurement.
L
O r
£Ω£
£
2.5ns,
t 2.5ns
f
VOLTAGEWAVEFORMS
PULSEDURATION
VOLTAGEWAVEFORMS
SETUP ANDHOLDTIMES
3V
3V
3V
1.5V
VM
3.5V
tPZL tPLZ
tPHZ
tPZH
V–0.3V
OH
V +0.3V
OL
1.5V
1.5V 1.5V
1.5V
VOL
VOH
3V
3V
VOH
VOL
1.5V
1.5V
VM
1.5V
tPLH tPHL
tPLH
tPHL
SN54ABT541, SN74ABT541BOCTAL BUFFERS/DRIVERS
WITH 3-STATE OUTPUTS
SCBS093L – DECEMBER 1993 – REVISED DECEMBER 2006
Figure 1. Load Circuit and Voltage Waveforms
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-9471801Q2A ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-9471801QRA ACTIVE CDIP J 20 1 TBD Call TI Call TI
5962-9471801QSA ACTIVE CFP W 20 1 TBD Call TI Call TI
SN74ABT541BDBLE OBSOLETE SSOP DB 20 TBD Call TI Call TI
SN74ABT541BDBR ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDBRE4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDBRG4 ACTIVE SSOP DB 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDW ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDWE4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDWG4 ACTIVE SOIC DW 20 25 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDWR ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDWRE4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BDWRG4 ACTIVE SOIC DW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BN ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT541BNE4 ACTIVE PDIP N 20 20 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
SN74ABT541BNSR ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BNSRE4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BNSRG4 ACTIVE SO NS 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BPW ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN74ABT541BPWE4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BPWG4 ACTIVE TSSOP PW 20 70 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BPWLE OBSOLETE TSSOP PW 20 TBD Call TI Call TI
SN74ABT541BPWR ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BPWRE4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SN74ABT541BPWRG4 ACTIVE TSSOP PW 20 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
SNJ54ABT541FK ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
SNJ54ABT541J ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type
SNJ54ABT541W ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN54ABT541, SN74ABT541B :
•Catalog: SN74ABT541
•Automotive: SN74ABT541B-Q1
•Enhanced Product: SN74ABT541B-EP
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
SN74ABT541BDBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1
SN74ABT541BDWR SOIC DW 20 2000 330.0 24.4 10.8 13.0 2.7 12.0 24.0 Q1
SN74ABT541BNSR SO NS 20 2000 330.0 24.4 8.2 13.0 2.5 12.0 24.0 Q1
SN74ABT541BPWR TSSOP PW 20 2000 330.0 16.4 6.95 7.1 1.6 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
SN74ABT541BDBR SSOP DB 20 2000 367.0 367.0 38.0
SN74ABT541BDWR SOIC DW 20 2000 367.0 367.0 45.0
SN74ABT541BNSR SO NS 20 2000 367.0 367.0 45.0
SN74ABT541BPWR TSSOP PW 20 2000 367.0 367.0 38.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
4040065 /E 12/01
28 PINS SHOWN
Gage Plane
8,20
7,40
0,55
0,95
0,25
38
12,90
12,30
28
10,50
24
8,50
Seating Plane
9,907,90
30
10,50
9,90
0,38
5,60
5,00
15
0,22
14
A
28
1
2016
6,50
6,50
14
0,05 MIN
5,905,90
DIM
A MAX
A MIN
PINS **
2,00 MAX
6,90
7,50
0,65 M
0,15
0°–ā8°
0,10
0,09
0,25
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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