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ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FDMS8570S N-Channel PowerTrench(R) SyncFETTM 25 V, 60 A, 2.8 m Features General Description Max rDS(on) = 2.8 m at VGS = 10 V, ID = 24 A This N-Channel SyncFETTM is produced using Fairchild Semiconductor's advanced PowerTrench(R) process. Advancements in both silicon and package technologies have been combined to offer the lowest rDS(on) while maintaining excellent switching performance by extremely low Junction-toAmbient thermal resistance. This device has the added benefit of an efficient monolithic Schottky body diode. Max rDS(on) = 3.1 m at VGS = 4.5 V, ID = 22 A High performance technology for extremely low rDS(on) SyncFETTM Schottky Body Diode RoHS Compliant Applications Synchronous Rectifier for DC/DC Converters Telecom Secondary Side Rectification High End Server/Workstation Vcore Low Side Bottom Top Pin 1 S D D D S S G D 5 4 G D 6 3 D 7 2 S D 8 1 S S D Power 56 MOSFET Maximum Ratings TA = 25C unless otherwise noted Symbol VDS Drain to Source Voltage Parameter VGS Gate to Source Voltage Drain Current ID -Continuous (Package limited) TC = 25 C -Continuous TA = 25 C TJ, TSTG 12 V (Note 1a) 24 A 100 Single Pulse Avalanche Energy PD Units V 60 -Pulsed EAS Ratings 25 (Note 3) Power Dissipation TC = 25 C Power Dissipation TA = 25 C 45 48 (Note 1a) Operating and Storage Junction Temperature Range 2.5 -55 to +150 mJ W C Thermal Characteristics RJC Thermal Resistance, Junction to Case TC = 25 C RJA Thermal Resistance, Junction to Ambient 2.6 (Note 1a) 50 C/W Package Marking and Ordering Information Device Marking 10OD Device FDMS8570S (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 Package Power 56 1 Reel Size 13'' Tape Width 12 mm Quantity 3000 units www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM November 2014 Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage ID = 1 mA, VGS = 0 V BVDSS TJ Breakdown Voltage Temperature Coefficient 25 V ID = 10 mA, referenced to 25 C IDSS Zero Gate Voltage Drain Current VDS = 20 V, VGS = 0 V 500 A IGSS Gate to Source Leakage Current VGS = +12 V/-8 V, VDS = 0 V 100 nA 2.2 V 23 mV/C On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 1 mA VGS(th) TJ Gate to Source Threshold Voltage Temperature Coefficient ID = 10 mA, referenced to 25 C rDS(on) Static Drain to Source On Resistance gFS Forward Transconductance 1.1 1.5 -3 mV/C VGS = 10 V, ID = 24 A 2.1 2.8 VGS = 4.5 V, ID = 22 A 2.4 3.1 VGS = 10 V, ID = 24 A, TJ = 125 C 2.9 3.9 VDS = 5 V, ID = 24 A 215 m S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance Rg Gate Resistance VDS = 13 V, VGS = 0 V, f = 1 MHz 2825 pF 662 pF 94 pF 0.8 11 ns 4 ns Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Fall Time Qg Total Gate Charge Qg Total Gate Charge Qgs Gate to Source Gate Charge Qgd Gate to Drain "Miller" Charge VDD = 13 V, ID = 24 A, VGS = 10 V, RGEN = 6 33 ns 3 ns VGS = 0 V to 10 V 42 nC VGS = 0 V to 4.5 V VDD = 13 V, ID = 24 A 22 nC 6.4 nC 4.4 nC Drain-Source Diode Characteristics VSD Source to Drain Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = 2 A (Note 2) 0.6 0.8 VGS = 0 V, IS = 24 A (Note 2) 0.8 1.2 IF = 24 A, di/dt = 300 A/s V 22 ns 19 nC NOTES: 1. RJA is determined with the device mounted on a FR-4 board using a specified pad of 2 oz copper as shown below. RJC is guaranteed by design while RCA is determined by the user's board design. a) 50 C/W when mounted on a 1 in2 pad of 2 oz copper b) 125 C/W when mounted on a minimum pad of 2 oz copper. SS SF DS DF G SS SF DS DF G 2. Pulse Test: Pulse Width < 300 s, Duty cycle < 2.0%. 3. EAS of 45 mJ is based on starting TJ = 25 C, L = 0.4 mH, IAS = 15 A, VDD = 23 V, VGS = 10 V. 100% test at L = 0.1 mH, IAS = 23.8 A. (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 2 www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM Electrical Characteristics TJ = 25 C unless otherwise noted 100 4.5 NORMALIZED DRAIN TO SOURCE ON-RESISTANCE ID, DRAIN CURRENT (A) VGS = 10V VGS = 4.5 V 80 VGS = 3.5 V VGS = 3 V 60 VGS = 2.5 V 40 20 PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 0 0 0.3 0.6 0.9 1.2 PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX VGS = 2.5 V 3.6 2.7 VGS = 3 V 1.8 0.9 VGS = 10 V 0.5 1.5 0 20 Figure 1. On Region Characteristics rDS(on), DRAIN TO 1.3 1.2 1.1 1.0 0.9 0.8 -25 0 25 50 75 SOURCE ON-RESISTANCE (m) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 1.4 100 7 ID = 28 A 6 5 4 TJ = 125 oC 3 2 1 100 125 150 PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 8 TJ = 25 oC 2 3 TJ, JUNCTION TEMPERATURE (oC) 4 5 6 7 8 9 10 VGS, GATE TO SOURCE VOLTAGE (V) Figure 3. Normalized On Resistance vs Junction Temperature Figure 4. On-Resistance vs Gate to Source Voltage 100 100 IS, REVERSE DRAIN CURRENT (A) PULSE DURATION = 80 s DUTY CYCLE = 0.5% MAX 80 ID, DRAIN CURRENT (A) 80 9 ID = 28 A VGS = 10 V -50 60 Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage 1.6 0.7 -75 40 ID, DRAIN CURRENT (A) VDS, DRAIN TO SOURCE VOLTAGE (V) 1.5 VGS = 3.5 V VGS = 4.5 V VDS = 5 V 60 TJ = 25 oC TJ = 150 oC 40 20 TJ = -55 oC 0 1.0 1.5 2.0 2.5 10 TJ = 150 oC TJ = 25 oC 1 TJ = -55 oC 0.1 0.01 0.0 3.0 0.2 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) VGS, GATE TO SOURCE VOLTAGE (V) Figure 5. Transfer Characteristics (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 VGS = 0 V Figure 6. Source to Drain Diode Forward Voltage vs Source Current 3 www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM Typical Characteristics TJ = 25 C unless otherwise noted 10000 ID = 28 A 8 CAPACITANCE (pF) VGS, GATE TO SOURCE VOLTAGE (V) 10 6 VDD = 13 V VDD = 10 V 4 VDD = 15 V Ciss 1000 Coss 100 Crss 2 f = 1 MHz VGS = 0 V 0 0 10 20 30 40 10 0.1 50 1 Figure 7. Gate Charge Characteristics 120 ID, DRAIN CURRENT (A) IAS, AVALANCHE CURRENT (A) TJ = 25 oC 10 TJ = 100 oC TJ = 125 oC 1 0.001 0.01 0.1 1 100 VGS = 10 V 80 VGS = 4.5 V 60 40 Limited by Package 20 10 100 o RJC = 2.6 C/W 0 25 1000 50 125 150 Figure 10. Maximum Continuous Drain Current vs Ambient Temperature 200 100 10000 P(PK), PEAK TRANSIENT POWER (W) ID, DRAIN CURRENT (A) 100 TC, CASE TEMPERATURE ( C) Figure 9. Unclamped Inductive Switching Capability 100 us 10 1 ms 10 ms 100 ms THIS AREA IS LIMITED BY rDS(on) 1s SINGLE PULSE TJ = MAX RATED 10 s RJA = 125 oC/W DC o TA = 25 C 0.01 0.01 75 o tAV, TIME IN AVALANCHE (ms) 0.1 30 Figure 8. Capacitance vs Drain to Source Voltage 100 1 10 VDS, DRAIN TO SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC) 0.1 1 10 100 VDS, DRAIN to SOURCE VOLTAGE (V) TA = 25 oC 100 10 1 0.1 -4 10 -3 10 -2 10 -1 10 0 10 1 10 100 1000 t, PULSE WIDTH (s) Figure 12. Single Pulse Maximum Power Dissipation Figure 11. Forward Bias Safe Operating Area (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 SINGLE PULSE R JA = 125 oC/W 1000 4 www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM Typical Characteristics TJ = 25 C unless otherwise noted NORMALIZED THERMAL IMPEDANCE, ZJA 2 1 0.1 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM 0.01 t1 t2 SINGLE PULSE 1E-3 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZJA x RJA + TA o RJA = 125 C/W 1E-4 -4 10 -3 10 -2 10 -1 0 10 10 1 10 100 1000 t, RECTANGULAR PULSE DURATION (s) Figure 13. Junction-to-Ambient Transient Thermal Response Curve (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 5 www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM Typical Characteristics TJ = 25 C unless otherwise noted SyncFETTM Schottky body diode Characteristics Fairchild's SyncFETTM process embeds a Schottky diode in parallel with PowerTrench MOSFET. This diode exhibits similar characteristics to a discrete external Schottky diode in parallel with a MOSFET. Figure 14 shows the reverse recovery characteristic of the FDMS8570S. Schottky barrier diodes exhibit significant leakage at high temperature and high reverse voltage. This will increase the power in the device. 30 IDSS, REVERSE LEAKAGE CURRENT (A) -2 25 CURRENT (A) 20 di/dt = 300 A/s 15 10 5 0 -5 0 50 100 150 200 250 TIME (ns) TJ = 125 oC -3 10 TJ = 100 oC -4 10 -5 10 TJ = 25 oC -6 10 0 5 10 15 20 25 VDS, REVERSE VOLTAGE (V) Figure 15. SyncFETTM body diode reverse leakage versus drain-source voltage Figure 14. FDMS8570S SyncFETTM body diode reverse recovery characteristic (c)2012 Fairchild Semiconductor Corporation FDMS8570S Rev.D3 10 6 www.fairchildsemi.com FDMS8570S N-Channel PowerTrench(R) SyncFETTM Typical Characteristics (continued) PQFN8 5X6, 1.27P CASE 483AE ISSUE A 5.10 PKG CL 8 5.10 3.91 A SEE DETAIL B B 5 1.27 8 7 6 5 0.77 4.52 PKG CL 5.85 5.65 6.15 3.75 6.61 KEEP OUT AREA 1.27 1 4 1 TOP VIEW 2 3 4 0.61 1.27 3.81 OPTIONAL DRAFT ANGLE MAY APPEAR ON FOUR SIDES OF THE PACKAGE SEE DETAIL C 5.00 4.80 LAND PATTERN RECOMMENDATION 0.35 0.15 0.10 C 0.05 0.00 SIDE VIEW 8X 0.08 C 5.20 4.80 1.10 0.90 3.81 0.35 0.15 DETAIL C SCALE: 2:1 1.27 0.51 (8X) 0.31 (0.34) 0.10 1 2 3 C A B 4 0.76 0.51 (0.52) 6.25 5.90 3.48+0.30 -0.10 (0.50) (0.30) (2X) 8 0.20+0.10 -0.15 (8X) 7 6 3.96 3.61 BOTTOM VIEW 0.30 0.05 5 C SEATING PLANE DETAIL B SCALE: 2:1 NOTES: UNLESS OTHERWISE SPECIFIED A. PACKAGE STANDARD REFERENCE: JEDEC MO-240, ISSUE A, VAR. AA,. B. DIMENSIONS DO NOT INCLUDE BURRS OR MOLD FLASH. MOLD FLASH OR BURRS DOES NOT EXCEED 0.10MM. C. ALL DIMENSIONS ARE IN MILLIMETERS. D. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-2009. E. IT IS RECOMMENDED TO HAVE NO TRACES OR VIAS WITHIN THE KEEP OUT AREA. ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor's product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. "Typical" parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. 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