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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM1117
SNOS412O FEBRUARY 2000REVISED JUNE 2020
LM1117 800-mA, Low-Dropout Linear Regulator
1
1 Features
1 For a newer drop-in alternative, see the TLV1117
Available in 1.8 V, 2.5 V, 3.3 V, 5 V, and
Adjustable Versions
Space-saving SOT-223 and WSON packages
Current limiting and thermal protection
Output current: 800 mA
Line regulation: 0.2% (maximum)
Load regulation: 0.4% (maximum)
Temperature range:
LM1117: 0°C to 125°C
LM1117I: 40°C to 125°C
2 Applications
AC drive power stage modules
Merchant network and server PSU
Industrial AC/DC
Ultrasound scanners
Servo drive control modules
3 Description
The LM1117 is a low dropout voltage regulator with a
dropout of 1.2 V at 800 mA of load current.
The LM1117 is available in an adjustable version,
which can set the output voltage from 1.25 to 13.8 V
with only two external resistors. In addition, it is
available in five fixed voltages, 1.8 V, 2.5 V, 3.3 V,
and 5 V.
The LM1117 offers current limiting and thermal
shutdown. Its circuit includes a Zener trimmed
bandgap reference to assure output voltage accuracy
to within ±1%.
A minimum of 10-µF tantalum capacitor is required at
the output to improve the transient response and
stability.
Device Information(1)
PART NUMBER PACKAGE BODY SIZE (NOM)
LM1117,
LM1117I
SOT-223 (4) 6.50 mm × 3.50 mm
TO-220 (3) 14.986 mm × 10.16 mm
TO-252 (3) 6.58 mm × 6.10 mm
WSON (8) 4.00 mm × 4.00 mm
TO-263 (3) 10.18 mm × 8.41 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
Adjustable Output Regulator
2
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Table of Contents
1 Features.................................................................. 1
2 Applications ........................................................... 1
3 Description............................................................. 1
4 Revision History..................................................... 2
5 Device Comparison Table..................................... 3
6 Pin Configuration and Functions......................... 4
7 Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 LM1117 Electrical Characteristics............................. 5
7.6 LM1117I Electrical Characteristics............................ 8
7.7 Typical Characteristics............................................ 10
8 Detailed Description............................................ 12
8.1 Overview................................................................. 12
8.2 Functional Block Diagram....................................... 12
8.3 Feature Description................................................. 12
8.4 Device Functional Modes........................................ 14
9 Application and Implementation ........................ 15
9.1 Application Information............................................ 15
9.2 Typical Application.................................................. 15
9.3 System Examples ................................................... 17
10 Power Supply Recommendations ..................... 18
11 Layout................................................................... 18
11.1 Layout Guidelines ................................................. 18
11.2 Layout Example .................................................... 22
12 Device and Documentation Support................. 23
12.1 Documentation Support ........................................ 23
12.2 Receiving Notification of Documentation Updates 23
12.3 Support Resources ............................................... 23
12.4 Trademarks........................................................... 23
12.5 Electrostatic Discharge Caution............................ 23
12.6 Glossary................................................................ 23
13 Mechanical, Packaging, and Orderable
Information........................................................... 23
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision N (January 2016) to Revision O Page
Added alternative device Features bullet .............................................................................................................................. 1
Changed Applications section ............................................................................................................................................... 1
Added Device Comparison Table .......................................................................................................................................... 3
Added Related Documentation section................................................................................................................................ 23
Changes from Revision M (March 2013) to Revision N Page
Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional
Modes,Application and Implementation section, Power Supply Recommendations section, Layout section, Device
and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1
Removed LM1117-N-2.85 option after part became inactive................................................................................................. 1
Removed TO-263 Pinout Side View image ........................................................................................................................... 4
Changes from Revision L (July 2012) to Revision M Page
Changed layout of National Data Sheet to TI format ........................................................................................................... 17
3
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5 Device Comparison Table
IOUT PARAMETER LM1117 TLV1117 UNIT
800 mA
Input voltage range (max) 15 15 V
Load regulation accuracy 1.6 1.6 %
PSRR (120 Hz) 75 75 dB
Recommended operating temperature 0 125 -40 125 °C
SOT-223 TJA 61.6 104.3 °C/W
TO-220 TJA 23.8 30.1 °C/W
TO-252 TJA 45.1 50.9 °C/W
TO-263 TJA 41.3 27.5 °C/W
WSON-8 TJA 39.3 38.3 °C/W
NOT CONNECTED
VOUT
VOUT
VOUT
1
2
3
4
8
7
6
5
ADJ/GND
VIN
VIN
VIN
VOUT
4
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6 Pin Configuration and Functions
DCY Package
4-Pin SOT
Top View
NDE Package
3-Pin TO-220
Top View
KTT Package
3-Pin TO-263
Top View
NDP Package
3-Pin TO-252
Top View
NGN Package
8-Pin WSON
Top View
When using the WSON package
Pins 2, 3 and 4 must be connected together and
Pins 5, 6 and 7 must be connected together
Pin Functions
PIN I/O DESCRIPTION
NAME TO-252 WSON SOT-223 TO-263 TO-220
ADJ/GND 1 1 1 1 1 Adjust pin for adjustable output option. Ground pin for fixed
output option.
VIN 3 2, 3, 4 3 3 3 I Input voltage pin for the regulator
VOUT 2 , TAB 5, 6, 7,
TAB 2, 4 2, TAB 2, TAB O Output voltage pin for the regulator
5
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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Maximum Input Voltage (VIN to GND) 20 V
Power Dissipation(2) Internally Limited
Junction Temperature (TJ)(2) 150 °C
Storage Temperature, Tstg –65 150 °C
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Pins listed as ±2000
V may actually have higher performance.
7.2 ESD Ratings VALUE UNIT
V(ESD) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
(1) The maximum power dissipation is a function of TJ(max) , RθJA, and TA. The maximum allowable power dissipation at any ambient
temperature is PD= (TJ(max)–TA)/RθJA. All numbers apply for packages soldered directly into a PCB.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted) MIN MAX UNIT
Input Voltage (VIN to GND) 15 V
Junction Temperature (TJ)(1) LM1117 0 125 °C
LM1117I 40 125
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC package thermal metrics application
report.
7.4 Thermal Information
THERMAL METRIC(1)
LM1117, LM1117I
UNIT
DCY
(SOT-223) NDE
(TO-220) NDP
(TO-252) NGN
(WSON) KTT
(TO-263)
4 PINS 3 PINS 3 PINS 8 PINS 3 PINS
RθJA Junction-to-ambient thermal resistance 61.6 23.8 45.1 39.3 41.3 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 42.5 16.6 52.1 31.4 44.1 °C/W
RθJB Junction-to-board thermal resistance 10.4 5.3 29.8 16.5 24.2 °C/W
ψJT Junction-to-top characterization parameter 2.9 3.1 4.5 0.3 10.9 °C/W
ψJB Junction-to-board characterization parameter 10.3 5.3 29.4 16.7 23.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 1.5 1.3 5.6 1.3 °C/W
(1) All limits are ensured by testing or statistical analysis.
(2) Typical Values represent the most likely parametric normal.
7.5 LM1117 Electrical Characteristics
unless otherwise specified, TJ= 25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VREF Reference Voltage
LM1117-ADJ
IOUT = 10 mA, VIN VOUT = 2 V, TJ= 25°C 1.238 1.25 1.262
V
LM1117-ADJ
10 mA IOUT 800 mA, 1.4 V
VIN VOUT 10 V
TJ= 25°C 1.25
over the junction temperature range
0°C to 125°C 1.225 1.27
6
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LM1117 Electrical Characteristics (continued)
unless otherwise specified, TJ= 25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
(3) Load and line regulation are measured at constant junction room temperature.
VOUT Output Voltage
LM1117-1.8
IOUT = 10 mA, VIN = 3.8 V, TJ= 25°C 1.782 1.8 1.818
V
LM1117-1.8
0IOUT 800 mA, 3.2 V VIN
10 V
TJ= 25°C 1.8
over the junction temperature range
0°C to 125°C 1.746 1.854
LM1117-2.5
IOUT = 10 mA, VIN = 4.5 V, TJ= 25°C 2.475 2.5 2.525
V
LM1117-2.5
0IOUT 800 mA, 3.9 V VIN
10 V
TJ= 25°C 2.5
over the junction temperature range
0°C to 125°C 2.45 2.55
LM1117-3.3
IOUT = 10 mA, VIN = 5 V TJ= 25°C 3.267 3.3 3.333
V
LM1117-3.3
0IOUT 800 mA, 4.75 V VIN
10 V
TJ= 25°C 3.3
over the junction temperature range
0°C to 125°C 3.235 3.365
LM1117-5.0
IOUT = 10 mA, VIN = 7 V, TJ= 25°C 4.95 5 5.05
V
LM1117-5.0
0IOUT 800 mA, 6.5 V VIN
12 V
TJ= 25°C 5
over the junction temperature range
0°C to 125°C 4.9 5.1
ΔVOUT Line Regulation(3)
LM1117-ADJ
IOUT = 10mA, 1.5V VIN-VOUT
13.75V
TJ= 25°C 0.035%
over the junction temperature range
0°C to 125°C 0.2%
LM1117-1.8
IOUT = 0 mA, 3.2 V VIN 10 V
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 6
LM1117-2.5
IOUT = 0 mA, 3.9 V VIN 10 V
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 6
LM1117-3.3
IOUT = 0 mA, 4.75 V VIN 15 V
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 6
LM1117-5.0
IOUT = 0 mA, 6.5 V VIN 15 V
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 10
ΔVOUT Load Regulation(3)
LM1117-ADJ
VIN VOUT = 3 V, 10 IOUT 800
mA
TJ= 25°C 0.2%
over the junction temperature range
0°C to 125°C 0.4%
LM1117-1.8
VIN = 3.2 V, 0 IOUT 800 mA
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 10
LM1117-2.5
VIN = 3.9 V, 0 IOUT 800 mA
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 10
LM1117-3.3
VIN = 4.75 V, 0 IOUT 800 mA
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 10
LM1117-5.0
VIN = 6.5 V, 0 IOUT 800 mA
TJ= 25°C 1 mV
over the junction temperature range
0°C to 125°C 15
7
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LM1117 Electrical Characteristics (continued)
unless otherwise specified, TJ= 25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
(5) The minimum output current required to maintain regulation.
VIN V
OUT Dropout Voltage(4)
IOUT = 100 mA TJ= 25°C 1.1 V
over the junction temperature range
0°C to 125°C 1.2
IOUT = 500 mA TJ= 25°C 1.15 V
over the junction temperature range
0°C to 125°C 1.25
IOUT = 800 mA TJ= 25°C 1.2 V
over the junction temperature range
0°C to 125°C 1.3
ILIMIT Current Limit VIN VOUT = 5 V, TJ= 25°C 800 1200 1500 mA
Minimum Load
Current(5) LM1117-ADJ
VIN = 15 V
TJ= 25°C 1.7 mA
over the junction temperature range
0°C to 125°C 5
Quiescent Current
LM1117-1.8
VIN 15 V
TJ= 25°C 5 mA
over the junction temperature range
0°C to 125°C 10
LM1117-2.5
VIN 15 V
TJ= 25°C 5 mA
over the junction temperature range
0°C to 125°C 10
LM1117-3.3
VIN 15 V
TJ= 25°C 5 mA
over the junction temperature range
0°C to 125°C 10
LM1117-5.0
VIN 15 V
TJ= 25°C 5 mA
over the junction temperature range
0°C to 125°C 10
Thermal Regulation TA= 25°C, 30-ms pulse 0.01 0.1 %/W
Ripple Regulation fRIPPLE = 1 20 Hz, VIN VOUT = 3
V VRIPPLE = 1 VPP
TJ= 25°C 75 dB
over the junction temperature range
0°C to 125°C 60
Adjust Pin Current TJ= 25°C 60 μA
over the junction temperature range 0°C to 125°C 120
Adjust Pin Current
Change 10 IOUT 80 0mA,
1.4 V VIN VOUT 10 V
TJ= 25°C 0.2 µA
over the junction temperature range
0°C to 125°C 5
Temperature Stability 0.5%
Long Term Stability TA= 125°C, 1000 Hrs 0.3%
RMS Output Noise (% of VOUT), 10 Hz f10 kHz 0.003%
8
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(1) All limits are ensured by testing or statistical analysis.
(2) Typical Values represent the most likely parametric normal.
(3) Load and line regulation are measured at constant junction room temperature.
7.6 LM1117I Electrical Characteristics
unless otherwise specified, TJ= 25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
VREF Reference Voltage
LM1117I-ADJ
IOUT = 10 mA, VIN VOUT = 2 V, TJ= 25°C 1.238 1.25 1.262
V
LM1117I-ADJ
10 mA IOUT 800 mA, 1.4 V
VIN VOUT 10 V
TJ= 25°C 1.25
over the junction
temperature range
–40°C to 125°C 1.2 1.29
VOUT Output Voltage
LM1117I-3.3
IOUT = 10 mA, VIN = 5 V, TJ= 25°C 3.267 3.3 3.333
V
LM1117I-3.3
0IOUT 800 mA, 4.75 V VIN
10 V
TJ= 25°C 3.3
over the junction
temperature range
–40°C to 125°C 3.168 3.432
LM1117I-5.0
IOUT = 10 mA, VIN = 7 V, TJ= 25°C 4.95 5 5.05
V
LM1117I-5.0
0IOUT 800 mA, 6.5 V VIN 12
V
TJ= 25°C 5
over the junction
temperature range
–40°C to 125°C 4.8 5.2
ΔVOUT Line Regulation(3)
LM1117I-ADJ
IOUT = 10 mA, 1.5 V VIN VOUT
13.75 V
TJ= 25°C 0.035%
over the junction
temperature range
–40°C to 125°C 0.3%
LM1117I-3.3
IOUT = 0 mA, 4.75 V VIN 15 V
TJ= 25°C 1
mV
over the junction
temperature range
–40°C to 125°C 10
LM1117I-5.0
IOUT = 0 mA, 6.5 V VIN 15 V
TJ= 25°C 1
mV
over the junction
temperature range
–40°C to 125°C 15
ΔVOUT Load Regulation(3)
LM1117I-ADJ
VIN VOUT = 3 V, 10 IOUT 800
mA
TJ= 25°C 0.2%
over the junction
temperature range
–40°C to 125°C 0.5%
LM1117I-3.3
VIN = 4.75 V, 0 IOUT 800 mA
TJ= 25°C 1
mV
over the junction
temperature range
–40°C to 125°C 15
LM1117I-5.0
VIN = 6.5 V, 0 IOUT 800 mA
TJ= 25°C 1
mV
over the junction
temperature range
–40°C to 125°C 20
9
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LM1117I Electrical Characteristics (continued)
unless otherwise specified, TJ= 25°C.
PARAMETER TEST CONDITIONS MIN(1) TYP(2) MAX(1) UNIT
(4) The dropout voltage is the input/output differential at which the circuit ceases to regulate against further reduction in input voltage. It is
measured when the output voltage has dropped 100 mV from the nominal value obtained at VIN = VOUT + 1.5 V.
(5) The minimum output current required to maintain regulation.
VIN-V OUT Dropout Voltage(4)
IOUT = 100 mA
TJ= 25°C 1.1
V
over the junction
temperature range
–40°C to 125°C 1.3
IOUT = 500 mA
TJ= 25°C 1.15
V
over the junction
temperature range
–40°C to 125°C 1.35
IOUT = 800 mA
TJ= 25°C 1.2
V
over the junction
temperature range
–40°C to 125°C 1.4
ILIMIT Current Limit VIN VOUT = 5 V, TJ= 25°C 800 1200 1500 mA
Minimum Load
Current(5) LM1117I-ADJ
VIN = 15 V
TJ= 25°C 1.7
mA
over the junction
temperature range
–40°C to 125°C 5
Quiescent Current
LM1117I-3.3
VIN 15 V
TJ= 25°C 5
mA
over the junction
temperature range
–40°C to 125°C 15
LM1117I-5.0
VIN 15 V
TJ= 25°C 5
mA
over the junction
temperature range
–40°C to 125°C 15
Thermal Regulation TA= 25°C, 30ms Pulse 0.01 0.1 %/W
Ripple Regulation fRIPPLE = 120 Hz, VIN VOUT = 3 V
VRIPPLE = 1 VPP
TJ= 25°C 75
dB
over the junction
temperature range
–40°C to 125°C 60
Adjust Pin Current TJ= 25°C 60 μA
over the junction temperature range –40°C to 125°C 120
Adjust Pin Current
Change 10 IOUT 800 mA,
1.4 V VIN VOUT 10 V
TJ= 25°C 0.2
µA
over the junction
temperature range
–40°C to 125°C 10
Temperature
Stability 0.5%
Long Term Stability TA= 125°C, 1000 Hrs 0.3%
RMS Output Noise (% of VOUT), 10 Hz f10 kHz 0.003%
10
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7.7 Typical Characteristics
Figure 1. Dropout Voltage (VIN V OUT) Figure 2. Short-Circuit Current
Figure 3. Load Regulation Figure 4. LM1117-ADJ Ripple Rejection
Figure 5. LM1117-ADJ Ripple Rejection vs Current Figure 6. Temperature Stability
11
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Typical Characteristics (continued)
Figure 7. Adjust Pin Current Figure 8. LM1117-5.0 Load Transient Response
Figure 9. LM1117-5.0 Line Transient Response
12
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8 Detailed Description
8.1 Overview
The LM1117 adjustable version develops a 1.25V reference voltage, VREF, between the output and the adjust
terminal. As shown in Figure 10, this voltage is applied across resistor R1 to generate a constant current I1. The
current IADJ from the adjust terminal could introduce error to the output. But since it is very small (60µA)
compared with the I1 and very constant with line and load changes, the error can be ignored. The constant
current I1 then flows through the output set resistor R2 and sets the output voltage to the desired level.
For fixed voltage devices, R1 and R2 are integrated inside the devices.
Figure 10. Basic Adjustable Regulator
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Load Regulation
The LM1117 regulates the voltage that appears between its output and ground pins, or between its output and
adjust pins. In some cases, line resistances can introduce errors to the voltage across the load. To obtain the
best load regulation, a few precautions are needed.
13
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Feature Description (continued)
Figure 11 shows a typical application using a fixed output regulator. The Rt1 and Rt2 are the line resistances. It
is obvious that the VLOAD is less than the VOUT by the sum of the voltage drops along the line resistances. In this
case, the load regulation seen at the RLOAD would be degraded from the data sheet specification. To improve
this, the load should be tied directly to the output terminal on the positive side and directly tied to the ground
terminal on the negative side.
Figure 11. Typical Application Using Fixed Output Regulator
When the adjustable regulator is used (Figure 12), the best performance is obtained with the positive side of the
resistor R1 tied directly to the output terminal of the regulator rather than near the load. This eliminates line drops
from appearing effectively in series with the reference and degrading regulation. For example, a 5V regulator with
0.05resistance between the regulator and load will have a load regulation due to line resistance of 0.05x IL.
If R1 (=125) is connected near the load, the effective line resistance will be 0.05(1+R2/R1) or in this case, it
is 4 times worse. In addition, the ground side of the resistor R2 can be returned near the ground of the load to
provide remote ground sensing and improve load regulation.
Figure 12. Best Load Regulation Using Adjustable Output Regulator
14
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8.4 Device Functional Modes
8.4.1 Protection Diodes
Under normal operation, the LM1117 regulators do not need any protection diode. With the adjustable device,
the internal resistance between the adjust and output terminals limits the current. No diode is needed to divert
the current around the regulator even with capacitor on the adjust terminal. The adjust pin can take a transient
signal of ±25V with respect to the output voltage without damaging the device.
When a output capacitor is connected to a regulator and the input is shorted to ground, the output capacitor will
discharge into the output of the regulator. The discharge current depends on the value of the capacitor, the
output voltage of the regulator, and rate of decrease of VIN. In the LM1117 regulators, the internal diode between
the output and input pins can withstand microsecond surge currents of 10A to 20A. With an extremely large
output capacitor (1000 µF), and with input instantaneously shorted to ground, the regulator could be damaged.
In this case, an external diode is recommended between the output and input pins to protect the regulator, as
shown in Figure 13.
Figure 13. Regulator With Protection Diode
15
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The LM1117 is a versatile and high performance linear regulator with a wide temperature range and tight
line/load regulation operation. An output capacitor is required to further improve transient response and stability.
For the adjustable option, the ADJ pin can also be bypassed to achieve very high ripple-rejection ratios. The
LM1117 is versatile in its applications, including its uses as a post regulator for DC/DC converters, battery
chargers, and microprocessor supplies.
9.2 Typical Application
Figure 14. 1.25-V to 10-V Adjustable Regulator With Improved Ripple Rejection
9.2.1 Design Requirements
The device component count is very minimal, employing two resistors as part of a voltage divider circuit and an
output capacitor for load regulation. A 10-μF tantalum on the input is a suitable input capacitor for almost all
applications. An optional bypass capacitor across R2 can also be used to improve PSRR. See Recommended
Operating Conditions for more information.
9.2.2 Detailed Design Procedure
The output voltage is set based on the selection of the two resistors, R1 and R2, as shown in Figure 14. For
details on capacitor selection, refer to External Capacitors.
9.2.2.1 External Capacitors
9.2.2.1.1 Input Bypass Capacitor
An input capacitor is recommended. A 10-µF tantalum on the input is a suitable input capacitor for almost all
applications.
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Typical Application (continued)
9.2.2.1.2 Adjust Terminal Bypass Capacitor
The adjust terminal can be bypassed to ground with a bypass capacitor (CADJ) to improve ripple rejection. This
bypass capacitor prevents ripple from being amplified as the output voltage is increased. At any ripple frequency,
the impedance of the CADJ should be less than R1 to prevent the ripple from being amplified:
1/(2π× fRIPPLE × CADJ) < R1 (1)
The R1 is the resistor between the output and the adjust pin. Its value is normally in the range of 100-200. For
example, with R1 = 124and fRIPPLE = 120Hz, the CADJ should be > 11µF.
9.2.2.1.3 Output Capacitor
The output capacitor is critical in maintaining regulator stability, and must meet the required conditions for both
minimum amount of capacitance and equivalent series resistance (ESR). The minimum output capacitance
required by the LM1117 is 10 µF, if a tantalum capacitor is used. Any increase of the output capacitance will
merely improve the loop stability and transient response. The ESR of the output capacitor should range between
0.3 Ωto 22 Ω. In the case of the adjustable regulator, when the CADJ is used, a larger output capacitance (22-µF
tantalum) is required.
9.2.3 Application Curve
As shown in Figure 15, the dropout voltage will vary with output current and temperature. Care should be taken
during design to ensure the dropout voltage requirement is met across the entire operating temperature and
output current range.
Figure 15. Dropout Voltage (VIN VOUT)
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9.3 System Examples
Several circuits can be realized with the LM1117. The circuit diagrams in this section demonstrate multiple
system examples that can be utilized in many applications.
Figure 16. Fixed Output Regulator Figure 17. Adjusting Output of Fixed Regulators
Figure 18. Regulator With Reference Figure 19. 5-V Logic Regulator With Electronic
Shutdown*
Figure 20. Battery Backed-Up Regulated Supply
Figure 21. Low Dropout Negative Supply
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10 Power Supply Recommendations
The input supply to the LM1117 must be kept at a voltage level such that its maximum rating is not exceeded.
The minimum dropout voltage must also be met with extra headroom when possible to keep the LM1117 in
regulation. An input capacitor is recommended. For more information regarding capacitor selection, refer to
External Capacitors.
11 Layout
11.1 Layout Guidelines
Some layout guidelines must be followed to ensure proper regulation of the output voltage with minimum noise.
Traces carrying the load current must be wide to reduce the amount of parasitic trace inductance and the
feedback loop from VOUT to ADJ must be kept as short as possible. To improve PSRR, a bypass capacitor can
be placed at the ADJ pin and must be located as close as possible to the IC. In cases when VIN shorts to ground,
an external diode must be placed from VOUT to VIN to divert the surge current from the output capacitor and
protect the IC. The diode must be placed close to the corresponding IC pins to increase their effectiveness.
11.1.1 Heatsink Requirements
When an integrated circuit operates with an appreciable current, its junction temperature is elevated. It is
important to quantify its thermal limits in order to achieve acceptable performance and reliability. This limit is
determined by summing the individual parts consisting of a series of temperature rises from the semiconductor
junction to the operating environment. A one-dimensional steady-state model of conduction heat transfer is
demonstrated in Figure 22. The heat generated at the device junction flows through the die to the die attach pad,
through the lead frame to the surrounding case material, to the printed circuit board, and eventually to the
ambient environment. Below is a list of variables that may affect the thermal resistance and in turn the need for a
heatsink.
Table 1. Component and Application Variables
RθJC (COMPONENT VARIABLES) RθJA (APPLICATION VARIABLES)
Leadframe Size and Material Mounting Pad Size, Material, and Location
No. of Conduction Pins Placement of Mounting Pad
Die Size PCB Size and Material
Die Attach Material Traces Length and Width
Molding Compound Size and Material Adjacent Heat Sources
Volume of Air
Ambient Temperatue
Shape of Mounting Pad
The case temperature is measured at the point where the leads contact with the mounting pad surface
Figure 22. Cross-Sectional View of Integrated Circuit Mounted on a Printed Circuit Board
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(1) Tab of device attached to topside copper
The LM1117 regulators have internal thermal shutdown to protect the device from over-heating. Under all
possible operating conditions, the junction temperature of the LM1117 must be within the range of 0°C to 125°C.
A heatsink may be required depending on the maximum power dissipation and maximum ambient temperature of
the application. To determine if a heatsink is needed, the power dissipated by the regulator, PD, must be
calculated:
IIN = IL+ IG(2)
PD= (VIN-VOUT)I L+ VINIG(3)
Figure 23 shows the voltages and currents which are present in the circuit.
Figure 23. Power Dissipation Diagram
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):
TR(max) = TJ(max)-TA(max)
where
TJ(max) is the maximum allowable junction temperature (125°C) which will be encountered in the application
TA(max) is the maximum ambient temperature which will be encountered in the application (4)
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient
thermal resistance (RθJA) can be calculated:
RθJA = TR(max)/PD(5)
For the maximum allowable value for θJA, refer to the Thermal Information table.
As a design aid, Table 2 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area.
Figure 24 and Figure 25 reflects the same test results as what are in the Table 2
Figure 26 and Figure 27 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-
223 and TO-252 device. Figure 28 and Figure 29 shows the maximum allowable power dissipation vs. copper
area (in2) for the SOT-223 and TO-252 devices. Please see AN1028 for power enhancement techniques to be
used with SOT-223 and TO-252 packages.
The AN-1187 Leadless Leadframe Package (LLP) application note discusses improved thermal performance and
power dissipation for the WSON.
Table 2. RθJA Different Heatsink Area
LAYOUT COPPER AREA THERMAL RESISTANCE
Top Side (in2)(1) Bottom Side (in2) (θJA,°C/W) SOT-223 (θJA,°C/W) TO-252
1 0.0123 0 136 103
2 0.066 0 123 87
3 0.3 0 84 60
4 0.53 0 75 54
5 0.76 0 69 52
6 1 0 66 47
7 0 0.2 115 84
8 0 0.4 98 70
9 0 0.6 89 63
10 0 0.8 82 57
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Table 2. RθJA Different Heatsink Area (continued)
LAYOUT COPPER AREA THERMAL RESISTANCE
11 0 1 79 57
12 0.066 0.066 125 89
13 0.175 0.175 93 72
14 0.284 0.284 83 61
15 0.392 0.392 75 55
16 0.5 0.5 70 53
Figure 24. RθJA vs 1-oz Copper Area for SOT-223 Figure 25. RθJA vs 2-oz Copper Area for TO-252
Figure 26. Maximum Allowable Power Dissipation vs
Ambient Temperature for SOT-223 Figure 27. Maximum Allowable Power Dissipation vs
Ambient Temperature for TO-252
Figure 28. Maximum Allowable Power Dissipation vs 1-oz
Copper Area for SOT-223 Figure 29. Maximum Allowable Power Dissipation vs 2-oz
Copper Area for TO-252
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Figure 30. Top View of the Thermal Test Pattern in Actual Scale
Figure 31. Bottom View of the Thermal Test Pattern in Actual Scale
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11.2 Layout Example
Figure 32. Layout Example (SOT-223)
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
Texas Instruments, AN-1187 Leadless Leadframe Package (LLP) application note
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1117DT-1.8/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-1.8
LM1117DT-2.5/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-2.5
LM1117DT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-3.3
LM1117DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-5.0
LM1117DT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-ADJ
LM1117DTX-1.8/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-1.8
LM1117DTX-2.5/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-2.5
LM1117DTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-3.3
LM1117DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-5.0
LM1117DTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR 0 to 125 LM1117
DT-ADJ
LM1117IDT-3.3/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-3.3
LM1117IDT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-5.0
LM1117IDT-ADJ/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-ADJ
LM1117IDTX-3.3/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-3.3
LM1117IDTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-5.0
LM1117IDTX-ADJ/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS
& no Sb/Br) SN Level-2-260C-1 YEAR -40 to 125 LM1117
IDT-ADJ
LM1117ILD-ADJ/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR -40 to 125 1117IAD
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1117IMP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N05B
LM1117IMP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N06B
LM1117IMP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N03B
LM1117IMPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N05B
LM1117IMPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N06B
LM1117IMPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM -40 to 125 N03B
LM1117LD-1.8/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-18
LM1117LD-2.5/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-25
LM1117LD-3.3/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-33
LM1117LD-ADJ/NOPB ACTIVE WSON NGN 8 1000 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117ADJ
LM1117LDX-1.8/NOPB ACTIVE WSON NGN 8 4500 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117-18
LM1117LDX-ADJ/NOPB ACTIVE WSON NGN 8 4500 Green (RoHS
& no Sb/Br) SN Level-3-260C-168 HR 0 to 125 1117ADJ
LM1117MP-1.8/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N12A
LM1117MP-2.5/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N13A
LM1117MP-3.3/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N05A
LM1117MP-5.0/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N06A
LM1117MP-ADJ/NOPB ACTIVE SOT-223 DCY 4 1000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N03A
LM1117MPX-1.8/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N12A
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2020
Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM1117MPX-2.5/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N13A
LM1117MPX-3.3 ACTIVE SOT-223 DCY 4 2000 TBD Call TI Call TI N05A
LM1117MPX-3.3/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N05A
LM1117MPX-5.0/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N06A
LM1117MPX-ADJ/NOPB ACTIVE SOT-223 DCY 4 2000 Green (RoHS
& no Sb/Br) SN Level-1-260C-UNLIM 0 to 125 N03A
LM1117S-ADJ/NOPB ACTIVE DDPAK/
TO-263 KTT 3 45 Green (RoHS
& no Sb/Br) SN Level-3-245C-168 HR 0 to 125 LM1117S
ADJ
LM1117SX-3.3/NOPB ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) SN Level-3-245C-168 HR 0 to 125 LM1117S
3.3
LM1117SX-5.0/NOPB ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) SN Level-3-245C-168 HR 0 to 125 LM1117S
5.0
LM1117SX-ADJ/NOPB ACTIVE DDPAK/
TO-263 KTT 3 500 Green (RoHS
& no Sb/Br) SN Level-3-245C-168 HR 0 to 125 LM1117S
ADJ
LM1117T-2.5/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) SN Level-1-NA-UNLIM 0 to 125 LM1117T
2.5
LM1117T-3.3/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) SN Level-1-NA-UNLIM 0 to 125 LM1117T
3.3
LM1117T-5.0/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) SN Level-1-NA-UNLIM 0 to 125 LM1117T
5.0
LM1117T-ADJ/NOPB ACTIVE TO-220 NDE 3 45 Green (RoHS
& no Sb/Br) SN Level-1-NA-UNLIM 0 to 125 LM1117T
ADJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
PACKAGE OPTION ADDENDUM
www.ti.com 9-Jun-2020
Addendum-Page 4
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2
LM1117ILD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117LD-1.8/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117LD-2.5/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117LD-3.3/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 12-May-2020
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM1117LD-ADJ/NOPB WSON NGN 8 1000 178.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117LDX-1.8/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117LDX-ADJ/NOPB WSON NGN 8 4500 330.0 12.4 4.3 4.3 1.3 8.0 12.0 Q1
LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-3.3 SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 330.0 16.4 7.0 7.5 2.2 12.0 16.0 Q3
LM1117SX-3.3/NOPB DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM1117SX-5.0/NOPB DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
LM1117SX-ADJ/NOPB DDPAK/
TO-263 KTT 3 500 330.0 24.4 10.75 14.85 5.0 16.0 24.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 12-May-2020
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM1117DTX-1.8/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117DTX-2.5/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117DTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117DTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117IDTX-3.3/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117IDTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117IDTX-ADJ/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0
LM1117ILD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0
LM1117IMP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117IMP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117IMP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117IMPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117IMPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117IMPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117LD-1.8/NOPB WSON NGN 8 1000 210.0 185.0 35.0
LM1117LD-2.5/NOPB WSON NGN 8 1000 210.0 185.0 35.0
LM1117LD-3.3/NOPB WSON NGN 8 1000 210.0 185.0 35.0
LM1117LD-ADJ/NOPB WSON NGN 8 1000 210.0 185.0 35.0
LM1117LDX-1.8/NOPB WSON NGN 8 4500 367.0 367.0 35.0
LM1117LDX-ADJ/NOPB WSON NGN 8 4500 367.0 367.0 35.0
LM1117MP-1.8/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117MP-2.5/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117MP-3.3/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117MP-5.0/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117MP-ADJ/NOPB SOT-223 DCY 4 1000 367.0 367.0 35.0
LM1117MPX-1.8/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117MPX-2.5/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117MPX-3.3 SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117MPX-3.3/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117MPX-5.0/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117MPX-ADJ/NOPB SOT-223 DCY 4 2000 367.0 367.0 35.0
LM1117SX-3.3/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
LM1117SX-5.0/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
LM1117SX-ADJ/NOPB DDPAK/TO-263 KTT 3 500 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 12-May-2020
Pack Materials-Page 3
MECHANICAL DATA
NDE0003B
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MECHANICAL DATA
KTT0003B
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BOTTOM SIDE OF PACKAGE
TS3B (Rev F)
MECHANICAL DATA
MPDS094A – APRIL 2001 – REVISED JUNE 2002
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DCY (R-PDSO-G4) PLASTIC SMALL-OUTLINE
4202506/B 06/2002
6,30 (0.248)
6,70 (0.264)
2,90 (0.114)
3,10 (0.122)
6,70 (0.264)
7,30 (0.287) 3,70 (0.146)
3,30 (0.130)
0,02 (0.0008)
0,10 (0.0040)
1,50 (0.059)
1,70 (0.067)
0,23 (0.009)
0,35 (0.014)
1 2 3
4
0,66 (0.026)
0,84 (0.033)
1,80 (0.071) MAX
Seating Plane
0°–10°
Gauge Plane
0,75 (0.030) MIN
0,25 (0.010)
0,08 (0.003)
0,10 (0.004) M
2,30 (0.091)
4,60 (0.181) M
0,10 (0.004)
NOTES: A. All linear dimensions are in millimeters (inches).
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion.
D. Falls within JEDEC TO-261 Variation AA.
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PACKAGE OUTLINE
C
8X 0.35
0.25
2X
2.4
0.8 MAX
(0.25)
(0.25) (0.2)
(0.15)
0.05
0.00
8X 0.6
0.4
3 0.05
2.2 0.05
6X 0.8
A4.1
3.9 B
4.1
3.9
(0.2) TYP
WSON - 0.8 mm max heightNGN0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214794/A 11/2019
PIN 1 INDEX AREA
SEATING PLANE
0.08 C
1
45
8
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED SYMM
SYMM
9
DETAIL A
SEE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
SCALE 3.000
PIN 1 ID DETAIL A
PIN 1 ID
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EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
8X (0.3)
(3)
(3.3)
6X (0.8)
(2.2)
( 0.2) VIA
TYP (0.85)
(1.25)
8X (0.5)
(R0.05) TYP
WSON - 0.8 mm max heightNGN0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214794/A 11/2019
SYMM
1
45
8
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SYMM 9
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
EXPOSED
METAL
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
EXPOSED
METAL
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EXAMPLE STENCIL DESIGN
(R0.05) TYP
0.59
4X (1.31)
8X (0.3)
8X (0.5)
4X (0.98)
(3.3)
(0.755)
6X (0.8)
WSON - 0.8 mm max heightNGN0008A
PLASTIC SMALL OUTLINE - NO LEAD
4214794/A 11/2019
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 9:
78% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
45
8
METAL
TYP
SYMM 9
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PACKAGE OUTLINE
C
10.42
9.40
6.73
6.35
6.22
5.97 1.27
0.88
5.46
4.96
2.285
4.57
1.02
0.64
3X 0.88
0.64
2.55 MAX
0.88
0.46
8
8
1.14
0.89
0.60
0.46
0.17
0.51 MIN
4.32 MIN
(2.345)
(2.5)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Reference JEDEC registration TO-252.
0.25 C A B
TOP & BOTTOM
PKG
1
2
3
OPTIONAL
SEATING PLANE
4
3
2
1
SCALE 1.500
A
B
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EXAMPLE BOARD LAYOUT
0.07 MAX
ALL AROUND 0.07 MIN
ALL AROUND
(4.57)
2X (1.3) 2X (2.15) (5.7)
(5.5)
(2.285)(4.38)
(R0.05) TYP
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers
SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004).
5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented.
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE: 8X
SYMM
PKG
1
3
4
SEE SOLDER MASK
DETAIL
EXPOSED
METAL
METAL EDGE
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED) SOLDER MASK DETAIL
EXPOSED
METAL
METAL UNDER
SOLDER MASK
SOLDER MASK
OPENING
SOLDER MASK DEFINED
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EXAMPLE STENCIL DESIGN
2X (2.15)
2X (1.3)
(4.57)
(4.38)
(1.32) TYP
(1.35) TYP
(0.26) (R0.05) TYP
16X (1.12)
16X (1.15)
TO-252 - 2.55 mm max heightNDP0003B
TRANSISTOR OUTLINE
4219870/A 03/2018
NOTES: (continued)
6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
7. Board assembly site may have different recommendations for stencil design.
PKG
SOLDER PASTE EXAMPLE
BASED ON 0.125 MM THICK STENCIL
SCALE: 8X
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