Data Sheet
June 29, 2009
EHW007A0B Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS08-002 ver. 1.01
PDF name: ehw007_ds.pd
f
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Enterprise Networks including Power over Ethernet
(PoE)
Options
Negative Remote On/Off logic
Over current/Over temperature/Over voltage
protections (Auto-restart)
Heat plate version (-H)
Surface Mount version (-S)
Features
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
High efficiency 92.5% at 12.0V full load
(Vin=48Vdc)
Industry standard, DOSA compliant footprint
58.4mm x 22.8mm x 8.1mm
(2.30 in x 0.9 in x 0.32 in)
Low profile height and reduced component skyline
Wide input voltage range: 36-75 Vdc
Tightly regulated output
Constant switching frequency
Positive remote On/Off logic
Input under/over voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Remote sense
No reverse current during output shutdown
Output Voltage adjust: 90% to 110% of Vo,nom
Wide operating temperature range (-40°C to 85°C)
Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module
UL*Recognized to UL60950-1, CAN/CSA† C22.2
No.60950-1, and EN60950-1(
VDE
‡ 0805-1)
Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed
for Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ISO**9001 and ISO 14001 certified manufacturing
facilities
Description
The EHW007A0B, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 7A of
output current and provide a precisely regulated output voltage of 12.0V over a wide range of input voltages (VIN = 36
- 75Vdc). The modules achieve typical full load efficiency of 92.5%. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
Standard features include remote On/Off, remote sense, output voltage adjustment, overvoltage, overcurrent and
overtemperature protection.
RoHS Compliant
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter Device Symbol Min Max Unit
Input Voltage
Continuous All VIN -0.3 80 Vdc
Transient, operational (≤100 ms) All VIN,trans -0.3 100 Vdc
Operating Ambient Temperature All TA -40 85 °C
(see Thermal Considerations section)
Storage Temperature All Tstg -55 125 °C
I/O Isolation voltage (100% factory Hi-Pot tested) All ⎯ ⎯ 2250 Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter Device Symbol Min Typ Max Unit
Operating Input Voltage All VIN 36 48 75 Vdc
Maximum Input Current
(VIN= VIN, min to VIN, max, IO=IO, max) All IIN,max 2.75 3.0 Adc
Input No Load Current
(VIN = VIN, nom, IO = 0, module enabled) All IIN,No load 70 mA
Input Stand-by Current All
(VIN = VIN, nom, module disabled)
IIN,stand-by 5 8 mA
Inrush Transient All I2t 0.5 A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All 30 mAp-p
Input Ripple Rejection (120Hz) All 50 dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 6 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter Device Symbol Min Typ Max Unit
Nominal Output Voltage Set-point
VIN=VIN, min, IO=IO, max, TA=25°C) All VO, set 11.8 12.0 12.24 Vdc
Output Voltage
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
All VO 11.64 ⎯ 12.36 % VO, set
Output Regulation
Line (VIN=VIN, min to VIN, max) All
⎯ ⎯ ±0.2 % VO, set
Load (IO=IO, min to IO, max) All ⎯ ⎯ ±0.2 % VO, set
Temperature (Tref=TA, min to TA, max) All
⎯ ⎯ ±1.0 % VO, set
Output Ripple and Noise on nominal output
(VIN=VIN, nom ,IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth) All ⎯ 20 30 mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth) All ⎯ 50 100 mVpk-pk
External Capacitance All CO, max 0 ⎯ 2,000 μF
Output Current All Io 0 ⎯ 7 Adc
Output Current Limit Inception (Hiccup Mode )
(VO= 90% of VO, set) All IO, lim 105 120 130 % Io
Output Short-Circuit Current
(VO≤250mV) ( Hiccup Mode ) All IO, s/c 5 Arms
Efficiency
VIN= VIN, nom, TA=25°C, IO=IO, max , VO= VO,set All η 92.5 %
VIN= VIN, nom, TA=25°C, IO=0.5IO, max , VO= VO,set All η 91.5 %
Switching Frequency All fsw 400 kHz
Dynamic Load Response
(dIo/dt=0.1A/μs; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk ⎯ 3 ⎯ % VO, set
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
(dIo/dt=1.0A/μs; VIN = VIN, nom; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation All Vpk ⎯ 5 ⎯ % VO, set
Settling Time (Vo<10% peak deviation) All ts ⎯ 200 ⎯ μs
Isolation Specifications
Parameter Device Symbol Min Typ Max Unit
Isolation Capacitance All Ciso ⎯ 1000 ⎯ pF
Isolation Resistance All Riso 100 ⎯ ⎯ MΩ
I/O Isolation Voltage (100% factory Hi-pot tested) All All ⎯ ⎯ 2250 Vdc
General Specifications
Parameter Device Symbol Min Typ Max Unit
All FIT 235.0 109/Hours
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence) All MTBF 4,254,493 Hours
Weight (Open Frame) All 21
(0.77) g
(oz.)
Weight (with Heatplate) All 33
(1.16) g
(oz.)
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter Device Symbol Min Typ Max Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current All Ion/off ⎯ 0.3 1.0 mA
Logic Low - On/Off Voltage All Von/off -0.7 ⎯ 1.2 Vdc
Logic High Voltage – (Typ = Open Collector) All Von/off ⎯ 5 Vdc
Logic High maximum allowable leakage current All Ion/off ⎯ ⎯ 10 μA
Turn-On Delay and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay
= from instant at which VIN=VIN, min until VO = 10% of VO,
)
All Tdelay ― 20 ― msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until Vo=10% of VO,set)
All Tdelay ― ― 150 msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set) All Trise ― 5 12 msec
Output voltage overshoot – Startup
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC All
― 3 % VO, set
Remote Sense Range All VSENSE 10 % VO, set
Output Voltage Adjustment Range All 90 110 % VO, set
Output Overvoltage Protection All VO, limit 13.8 ⎯ 16.5 Vdc
Overtemperature Protection – Hiccup Auto Restart All Tref ⎯ 135 ⎯ OC
Input Undervoltage Lockout All VUVLO
Turn-on Threshold ⎯ 34 36 Vdc
Turn-off Threshold 30 32 ⎯ Vdc
Hysterisis 1 2 3 Vdc
Input Overvoltage Lockout All VOVLO
Turn-on Threshold 76 79 ⎯ Vdc
Turn-off Threshold ⎯ 81 83 Vdc
Hysterisis 1 2
⎯ Vdc
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 5
Characteristic Curves
The following figures provide typical characteristics for the EHW007A0B (12.0V, 7A) at 25oC. The figures are
identical for either positive or negative remote On/Off logic.
70
75
80
85
90
95
01234567
Vin = 48
V
Vin = 75
V
Vin = 36
V
EFFICIENCY, η (%)
OUTPUT CURRENT, IO (A)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) VO (V) (200mV/div)
TIME, t (100µs/div)
Figure 1. Converter Efficiency versus Output Current. Figure 4. Transient Response to 1.0A/µS Dynamic
Load Change from 50% to 75% to 50% of full load.
OUTPUT VOLTAGE
VO (V) (50mV/div)
TIME, t (2μs/div)
OUTPUT VOLTAGE On/Off VOLTAGE
VO (V) (5V/div) VOn/Off (V) (5V/div)
TIME, t (5ms/div)
Figur e 2. Ty pic al ou tp ut ripp le an d noi s e (VIN = VIN,NOM,
Io = Io,max). Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = VIN,NOM, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) VO (V) (200mV/div)
TIME, t (200µs/div)
OUTPUT VOLTAGE INPUT VOLTAGE
VO (V) (5V/div) VIN (V) (20V/div)
TIME, t (20ms/div)
Figure 3. Tr ans ie n t Resp onse to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% o f full load. Figure 6. Typical Start-up Using Input Voltage (VIN =
VIN,NOM, Io = Io,max).
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 6
Test Configurations
TO OSCILLOSCOPE CURRENT PROBE
LTES T
12μH
BATTER Y
CS 220μF
E.S .R .<0 .1Ω
@ 20 °C 100kHz
33-100μF
Vi n+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTES T) of 12μH. Capacitor CS offsets
possible batt ery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
NOTE: All voltage measurements to be t aken a t the module
terminals, as shown ab ove. If sockets are used then
Kelvin connections are required at the mo dule terminals
to avoid measurement errors due to socket contact
resistance.
V
O (+)
V
O
( – )
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact Rdistribution
Rcontact Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Effici ency Te s t
Setup.
η =
VO. IO
VIN. IIN
x 100 %
Efficiency
Design Considerations
Input Fi l tering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33-
100μF electrolytic capacitor (ESR<0.7Ω at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be
grounded, or both the input and output pins are
to be kept floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding –60 Vdc but less than or
equal to –75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 6 A fast-acting fuse in the ungrounded lead.
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 1.2V. The maximum Ion/off during a
logic low is 1mA, the switch should be maintain a
logic low level whilst sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 5V, and the maximum
allowable leakage current at Von/off = 5V is 1μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between
the remote-sense pins and the output terminals must
not exceed the output voltage sense range given in
the Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] ≤ 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACT AND
DISTRIBUTION LOSS
E
SUPPLY II
CONTACT
RESISTANCE
Figure 11. Circuit Configuration for remote
sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault conditions,
the unit is equipped with a thermal shutdown circuit.
The unit will shutdown if the thermal reference point
Tref (Figure 13), exceeds 135oC (typical), but the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 8
Feature Descriptions (continued)
one second or by toggling the remote on/off signal for
at least one second. If the unit is configured with the
auto-restart option (4), it will remain in the hiccup
mode as long as the overcurrent condition exists; it
operates normally, once the output current is brought
back into its specified range. The average output
current during hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figur e 12. Circ uit Configuration to Trim Outpu t
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
=
−22.10
%
511
downtrim
R
Where 100% ,
,×
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛−
=Δ
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:
8% =Δ
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−=
−22.10
8
511
downtrim
R
ΚΩ=
−655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−
Δ
−
Δ×
Δ+××
=
−22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where 100% ,
,×
⎟
⎟
⎠
⎞
⎜
⎜
⎝
⎛−
=Δ
seto
setodesired
V
VV
For example, to trim-up the output voltage of the
module by 5% to 12.6V, Rtrim-up is calculated is as
follows:
5% =
Δ
ΚΩ
⎥
⎦
⎤
⎢
⎣
⎡−−
×
+××
=
−22.10
5
511
5225.1 )5100(0.1211.5
uptrim
R
ΚΩ=
−8.938
uptrim
R
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output
voltage of the module can be increased, which at the
same output current would increase the power output
of the module. Care should be taken to ensure that
the maximum output power of the module remains at
or below the maximum rated power (Maximum rated
power = VO,set x IO,max).
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference point, Tref used in the
specifications for open frame modules is shown in
Figure 13. For reliable operation this temperature
should not exceed 123oC.
The thermal reference point, Tref used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
should not exceed 110oC.
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 9
Thermal Considerations (continued)
Figure 13. Tref Temperature Measurement
Location for Open Frame Mod ul e .
Figure 14. Tref Temperature Measurement
Location for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 3m/s (600 ft./min)
forced airflow are shown in Figure 14.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
OUTPUT CURRENT, IO (A)
2
3
4
5
6
7
8
20 30 40 50 60 70 80 90
1.0 m/s
(200 LFM)
2.0 m/s
(400 LFM)
3.0 m/s
(600 LFM)
0.5 m/s
(100 LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 14. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
20 30 40 50 60 70 80 90
1.0 m/s
(200 LFM)
2.0 m/s
(400 LFM)
0.5 m/s
(100 LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figur e 15. Output Curr ent Derati n g fo r th e Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
20 30 40 50 60 70 80 90
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figur e 16. Output Curr ent Derati n g fo r th e Module
with Heatplate and 0.25 in. heat sink; Airflow in
the Transverse Direction from Vout(+) to Vout(-);
Vin =48V.
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
20 30 40 50 60 70 80 90
1.0 m/s
(200 LFM)
0.5 m/s
(100 LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figur e 17. Output Curr ent Derati n g fo r th e Module
with Heatplate and 0.5 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
AIRFLOW
AIRFLOW
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 10
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
3
4
5
6
7
8
20 30 40 50 60 70 80 90
0.5 m/s
(100 LFM)
NC
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current De rating for the Module
with Heatplate and 1.0 in. heat sink; Airflow in the
Transverse Direction from Vout(+) to Vout(-); Vin
=48V.
Surface Mount Information
Pick and Place
The EHW007A0B modules use an open frame
construction and are designed for a fully automated
assembly process. The modules are fitted with a
label designed to provide a large surface area for pick
and place operations. The label meets all the
requirements for surface mount processing, as well as
safety standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 17. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The EHW007A0B power modules are lead free
modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP (°C)
0
50
10 0
15 0
200
250
300
Preheat zone
max 4
o
Cs
-1
So ak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Coo ling
zo ne
1- 4
o
Cs
-1
T
lim
above
205
o
C
REFLOW TIME (S)
Figure 18. Reflow Profile for Tin/Lead (Sn/Pb)
process
MAX TEMP SOLDER (°C)
200
205
210
215
220
225
230
235
240
0 102030405060
Figure 19. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 11
Surface Mount Information (continued)
Lead Free Soldering
The –Z version of the EHW007A0B modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 20.
Per J-STD-020 Re v. C
0
50
100
150
200
250
300
Reflow Time (Seconds)
Reflow Temp (°C)
Heating Zone
1°C/Second
Pe ak Temp 260°C
* Min. Time Above 235°C
15 Seconds
*Time Above 217°C
60 Sec o nds
Cooling
Zone
Figure 20. Recomm en de d line ar re flow profile
using Sn/Ag/Cu solder.
MSL Rating
The EHW007A0B modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Pow er Module s : Sold ering a nd Clean in g
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3°C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210°C. For Pb solder, the recommended pot
temperature is 260°C, while the Pb-free solder pot is
270°C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 12
EMC Considerations
The circuit and plots in Figure 21 shows a suggested configuration to meet the conducted emission limits of EN55022
Class B.
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
x
xxxxx
x xMES CE0508091459_fin QP
MES CE0508091459_pre PK
0
10
20
30
40
50
60
70
80
Level [dBµV]
150k 300k 500k 1M 2M 3M 4M 5M 7M 10M 30M
Frequency [Hz]
+
+++++
+ +MES CE0508091459_fin AV
MES CE0508091459_pre AV
Figure 21. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 13
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View*
Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 14
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View*
* Top side label includes Lineage Power name, product designation and date code.
Side
View
Bottom
View
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 15
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View*
* Bottom side label includes Lineage Power name, product designation and date code.
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 16
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm ± 0.5 mm [x.xx in. ± 0.02 in.] (Unless otherwise indicated)
x.xx mm ± 0.25 mm [x.xxx in ± 0.010 in.]
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin Function
1 Vi(+)
2 ON/OFF
3 Vi(-)
4 Vo(-)
5 SENSE(-)
6 TRIM
7 SENSE(+)
8 Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
LINEAGE POWER 17
Packaging Details
The surface mount versions of the EHW007A0B (suffix
–S) are supplied as standard in the plastic trays shown
in Figure 22.
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012Ω/sq
Color Clear
Capacity 12 power modules
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
EHW007A0B (suffix –S) surface mount module will
contain 4 full trays plus one empty hold down tray
giving a total number of 48 power modules.
Figure 22. Surface Mount Packaging Tray
Data Sheet
June 29, 2009
EHW007A0B Series Eighth-Brick Power Modules
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
Document No: DS08-002 ver. 1.01
PDF name: ehw007_ds.pdf
World Wide Headquarters
Li neage Power Corporation
3000 Skyline Drive, Mesquite, TX 75149, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-284-2626)
www.linea gepower.com
e-mail: te chsupport1 @lineagepowe r.com
Asia-Pacific Headquarters
Te l: +65 6416 4283
Europe, Middle-East and Afr ica Headquar ters
Te l: +49 898 780 672 80
India Head quarters
Te l: +91 80 28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product(s) or information.
© 2008 Lineage Power Corporation, (Mesquite, Texas) All International Rights Reserved.
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes Input Voltage Output
Voltage Output
Current On/Off
Logic Connector
Type Comcodes
EHW007A0B41Z 48V (36-75Vdc) 12.0V 7A Negative Through hole CC109145100
EHW007A0B41-HZ 48V (36-75Vdc) 12.0V 7A Negative Through hole CC109143194
EHW007A0B41-SZ 48V (36-75Vdc) 12.0V 7A Negative Surface mount CC109147402
Table 2. Device Coding Sc heme and Options
Characteristic Character and Position Definition
Form Factor E E = Eighth Brick
Family Designator H
Input Voltage W W = Wide Input Voltage Range, 36V -75V
Output Current 007A0 007A0 = 007.0 Amps Rated Output Current
Ratings
Output Voltage B B = 12.0 Vout Nominal
Omit = No Pin Trim
6 6 = Pin Length: 3.68 mm ± 0.25mm , (0.145 in. ± 0.010 in.)
Pin Length
8 8 = Pin Length: 2.79 mm ± 0.25mm , (0.110 in. ± 0.010 in.)
Action following Omit = Latching Mode
Protective Shutdown 4 4 = Auto-restart following shutdown (Overcurrent/Overvoltage)
Omit = Positive Logic
On/Off logic 1 1 = Negative Logic
-
Customer Specific XY XY = Customer Specific Modified Code, Omit for Standard Code
Omit = Standard open Frame Module
H H = Heat plate (not available with –S option)
Mechanical Features
S S = Surface mount connections
Omit = RoHS 5/6, Lead Based Solder Used
Options
RoHS Z Z = RoHS 6/6 Compliant, Lead free
