APA150-BG456IX79 - Microsemi Corp.

June 2009 i

v5.8

ProASICPLUS® Flash Family FPGAs

Features and Benefits

High Capacity

Commercial and Industrial

• 75,000 to 1 Million System Gates

• 27 k to 198 kbits of Two-Port SRAM

• 66 to 712 User I/Os

Military

• 300, 000 to 1 million System Gates

• 72 k to 198 kbits of Two Port SRAM

• 158 to 712 User I/Os

Reprogrammable Flash Technology

• 0.22 µm 4 LM Flash-Based CMOS Process

• Live At Power-Up (LAPU) Level 0 Support

• Single-Chip Solution

• No Configuration Device Required

• Retains Programmed Design during Power-Down/Up Cycles

• Mil/Aero Devices Operate over Full Military Temperature

Range

Performance

• 3.3 V, 32-Bit PCI, up to 50 MHz (33 MHz over military

temperature)

• Two Integrated PLLs

• External System Performance up to 150 MHz

Secure Programming

• The Industry’s Most Effective Security Key (FlashLock®)

Low Power

• Low Impedance Flash Switches

• Segmented Hierarchical Routing Structure

• Small, Efficient, Configurable (Combinatorial or Sequential)

Logic Cells

High Performance Routing Hierarchy

• Ultra-Fast Local and Long-Line Network

• High-Speed Very Long-Line Network

• High-Performance, Low Skew, Splittable Global Network

• 100% Routability and Utilization

I/O

• Schmitt-Trigger Option on Every Input

• 2.5 V/3.3 V Support with Individually-Selectable Voltage and

Slew Rate

• Bidirectional Global I/Os

• Compliance with PCI Specification Revision 2.2

• Boundary-Scan Test IEEE Std. 1149.1 (JTAG) Compliant

• Pin Compatible Packages across the ProASICPLUS Family

Unique Clock Conditioning Circuitry

• PLL with Flexible Phase, Multiply/Divide and Delay

Capabilities

• Internal and/or External Dynamic PLL Configuration

• Two LVPECL Differential Pairs for Clock or Data Inputs

Standard FPGA and ASIC Design Flow

• Flexibility with Choice of Industry-Standard Front-End Tools

• Efficient Design through Front-End Timing and Gate Optimization

ISP Support

• In-System Programming (ISP) via JTAG Port

SRAMs and FIFOs

• SmartGen Netlist Generation Ensures Optimal Usage of

Embedded Memory Blocks

• 24 SRAM and FIFO Configurations with Synchronous and

Asynchronous Operation up to 150 MHz (typical)

Table 1 • ProASICPLUS Product Profile

Device APA075 APA150 APA3001APA450 APA6001APA750 APA10001

Maximum System Gates 75,000 150,000 300,000 450,000 600,000 750,000 1,000,000

Tiles (Registers) 3,072 6,144 8,192 12,288 21,504 32,768 56,320

Embedded RAM Bits (k=1,024 bits) 27 k 36k 72 k 108 k 126 k 144 k 198 k

Embedded RAM Blocks (256x9) 12 16 32 48 56 64 88

LVPECL 222 2 2 2 2

PLL 222 2 2 2 2

Global Networks 4 4 4 4 4 4 4

Maximum Clocks 24 32 32 48 56 64 88

Maximum User I/Os 158 242 290 344 454 562 712

JTAG ISP Yes Yes Yes Yes Yes Yes Yes

PCI Yes Yes Yes Yes Yes Yes Yes

Package (by pin count)

TQFP 100, 144 100 – – – – –

PQFP 208 208 208 208 208 208 208

PBGA – 456 456 456 456 456 456

FBGA 144 144, 256 144, 256 144, 256, 484 256, 484, 676 676, 896 896, 1152

CQFP2208, 352 208, 352 208, 352

CCGA/LGA2624 624

Notes:

1. Available as Commercial/Industrial and Military/MIL-STD-883B devices.

2. These packages are available only for Military/MIL-STD-883B devices.

v5.8

ProASICPLUS Flash Family FPGAs

ii v5.8

Ordering Information

APA1000 FG

Part Number

Speed Grade

Blank =Standard Speed

= 20% Slower than Standard

Package Type

PQ =Plastic Quad Flat Pack (0.5 mm pitch)

TQ =Thin Quad Flat Pack (0.5 mm pitch)

FG =Fine Pitch Ball Grid Array (1.0 mm pitch)

BG =Plastic Ball Grid Array (1.27 mm pitch)

CQ =Ceramic Quad Flat Pack (1.05 mm pitch)

CG =Ceramic Column Grid Array (1.27 mm pitch)

LG =Land Grid Array (1.27 mm pitch)

1152 I

Package Lead Count

Application (Ambient Temperature Range)

Lead-free packaging

Blank = Standard Packaging

G = RoHS Compliant Packaging

Blank = Commercial (0˚C to +70˚C)

I = Industrial (-40˚C to +85˚C)

PP = Pre-production

ES = Engineering Silicon (Room Temperature Only)

M = Military (-55˚C to 125˚C)

B = MIL-STD-883 Class B

150,000 Equivalent System GatesAPA150 =

75,000 Equivalent System GatesAPA075 =

APA300 300,000 Equivalent System Gates=

APA450 450,000 Equivalent System Gates=

APA600 600,000 Equivalent System Gates=

APA750 750,000 Equivalent System Gates=

APA1000 1,000,000 Equivalent System Gates=

ProASICPLUS Flash Family FPGAs

v5.8 iii

Device Resources

General Guideline

Maximum performance numbers in this datasheet are based on characterized data. Actel does not guarantee

performance beyond the limits specified within the datasheet.

User I/Os2

Commercial/Industrial Military/MIL-STD-883B

Device

TQFP

100-Pin

TQFP

144-Pin

PQFP

208-Pin

PBGA

456-Pin

FBGA

144-Pin

FBGA

256-Pin

FBGA

484-Pin

FBGA

676-Pin

FBGA

896-Pin

FBGA

1152-Pin

CQFP

208-Pin

CQFP

352-Pin

CCGA/

LGA

624-Pin

APA075 66 107 158 100

APA150 66 158 242 100 186 3

APA300 158 4290 4100 4186 3, 4 158 248

APA450 158 344 100 186 3344 3

APA600 158 4356 4186 3, 4 370 3454 158 248 440

APA750 158 356 454 562 5

APA1000 158 4356 4642 4, 5 712 5158 248 440

Notes:

1. Package Definitions: TQFP = Thin Quad Flat Pack, PQFP = Plastic Quad Flat Pack, PBGA = Plastic Ball Grid Array, FBGA = Fine Pitch Ball Grid

Array, CQFP = Ceramic Quad Flat Pack, CCGA = Ceramic Column Grid Array, LGA = Land Grid Array

2. Each pair of PECL I/Os is counted as one user I/O.

3. FG256 and FG484 are footprint-compatible packages.

4. Military Temperature Plastic Package Offering

5. FG896 and FG1152 are footprint-compatible packages.

ProASICPLUS Flash Family FPGAs

iv v5.8

Temperature Grade Offerings

Speed Grade and Temperature Matrix

Package APA075 APA150 APA300 APA450 APA600 APA750 APA1000

TQ100 C, I C, I

TQ144 C, I

PQ208 C, I C, I C, I, M C, I C, I, M C, I C, I, M

BG456 C, I C, I, M C, I C, I, M C, I C, I, M

FG144 C, I C, I C, I, M C, I

FG256 C, I C, I, M C, I C, I, M

FG484 C, I C, I, M

FG676 C, I, M C, I

FG896 C, I C, I, M

FG1152 C, I

CQ208 M, B M, B M, B

CQ352 M, B M, B M, B

CG624 M, B M, B

Note: C = Commercial

I = Industrial

M = Military

B = MIL-STD-883

–F Std.

C✓✓

I✓

M, B ✓

Note: C = Commercial

I = Industrial

M = Military

B = MIL-STD-883

v5.8 v

Table of Contents

ProASICPLUS Flash Family FPGAs

General Description

ProASICPLUS Architecture . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

Timing Control and Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-13

Sample Implementations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

Adjustable Clock Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

Clock Skew Minimization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16

PLL Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-21

Design Environment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

ISP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-28

Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-29

Package Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-30

Calculating Typical Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-31

Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-34

Tristate Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-45

Output Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-47

Input Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-49

Global Input Buffer Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-51

Predicted Global Routing Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-53

Global Routing Skew . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-53

Module Delays . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-54

Sample Macrocell Library Listing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-54

Embedded Memory Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-57

Pin Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-76

Recommended Design Practice for VPN/VPP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-77

Package Pin Assignments

100-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

144-Pin TQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3

208-Pin PQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5

208-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-12

352-Pin CQFP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-16

456-Pin PBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-22

144-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-37

256-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-40

484-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-45

676-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-51

896-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-59

1152-Pin FBGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-69

624-Pin CCGA/LGA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-78

Datasheet Information

List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1

Data Sheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

Export Administration Regulations (EAR) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8

Actel Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . 3-8

ProASICPLUS Flash Family FPGAs

v5.8 1-1

General Description

The ProASICPLUS family of devices, Actel’s second-

generation Flash FPGAs, offers enhanced performance

over Actel’s ProASIC family. It combines the advantages

of ASICs with the benefits of programmable devices

through nonvolatile Flash technology. This enables

engineers to create high-density systems using existing

ASIC or FPGA design flows and tools. In addition, the

ProASICPLUS family offers a unique clock conditioning

circuit based on two on-board phase-locked loops (PLLs).

The family offers up to one million system gates,

supported with up to 198 kbits of two-port SRAM and up

to 712 user I/Os, all providing 50 MHz PCI performance.

Advantages to the designer extend beyond

performance. Unlike SRAM-based FPGAs, four levels of

routing hierarchy simplify routing, while the use of Flash

technology allows all functionality to be live at power-

up. No external boot PROM is required to support device

programming. While on-board security mechanisms

prevent access to the program information,

reprogramming can be performed in-system to support

future design iterations and field upgrades. The device’s

architecture mitigates the complexity of ASIC migration

at higher user volume. This makes ProASICPLUS a cost-

effective solution for applications in the networking,

communications, computing, and avionics markets.

The ProASICPLUS family achieves its nonvolatility and

reprogrammability through an advanced Flash-based

0.22 μm LVCMOS process with four layers of metal.

Standard CMOS design techniques are used to

implement logic and control functions, including the

PLLs and LVPECL inputs. This results in predictable

performance compatible with gate arrays.

The ProASICPLUS architecture provides granularity

comparable to gate arrays. The device core consists of a

Sea-of-Tiles™. Each tile can be configured as a flip-flop,

latch, or three-input/one-output logic function by

programming the appropriate Flash switches. The

combination of fine granularity, flexible routing

resources, and abundant Flash switches allow 100%

utilization and over 95% routability for highly congested

designs. Tiles and larger functions are interconnected

through a four-level routing hierarchy.

Embedded two-port SRAM blocks with built-in FIFO/RAM

control logic can have user-defined depths and widths.

Users can also select programming for synchronous or

asynchronous operation, as well as parity generations or

checking.

The unique clock conditioning circuitry in each device

includes two clock conditioning blocks. Each block

provides a PLL core, delay lines, phase shifts (0° and

180°), and clock multipliers/dividers, as well as the

circuitry needed to provide bidirectional access to the

PLL. The PLL block contains four programmable

frequency dividers which allow the incoming clock signal

to be divided by a wide range of factors from 1 to 64.

The clock conditioning circuit also delays or advances the

incoming reference clock up to 8 ns (in increments of

0.25 ns). The PLL can be configured internally or

externally during operation without redesigning or

reprogramming the part. In addition to the PLL, there

are two LVPECL differential input pairs to accommodate

high-speed clock and data inputs.

To support customer needs for more comprehensive,

lower-cost, board-level testing, Actel’s ProASICPLUS

devices are fully compatible with IEEE Standard 1149.1

for test access port and boundary-scan test architecture.

For more information concerning the Flash FPGA

implementation, please refer to the "Boundary Scan

(JTAG)" section on page 1-11.

ProASICPLUS devices are available in a variety of high-

performance plastic packages. Those packages and the

performance features discussed above are described in

more detail in the following sections.

ProASICPLUS Flash Family FPGAs

1-2 v5.8

ProASICPLUS Architecture

The proprietary ProASICPLUS architecture provides

granularity comparable to gate arrays.

The ProASICPLUS device core consists of a Sea-of-Tiles

(Figure 1-1). Each tile can be configured as a three-input

logic function (e.g., NAND gate, D-Flip-Flop, etc.) by

programming the appropriate Flash switch

interconnections (Figure 1-2 and Figure 1-3 on page 1-3).

Tiles and larger functions are connected with any of the

four levels of routing hierarchy. Flash switches are

distributed throughout the device to provide

nonvolatile, reconfigurable interconnect programming.

Flash switches are programmed to connect signal lines to

the appropriate logic cell inputs and outputs. Dedicated

high-performance lines are connected as needed for fast,

low-skew global signal distribution throughout the core.

Maximum core utilization is possible for virtually any

design.

ProASICPLUS devices also contain embedded, two-port

SRAM blocks with built-in FIFO/RAM control logic.

Programming options include synchronous or

asynchronous operation, two-port RAM configurations,

user defined depth and width, and parity generation or

checking. Please see the "Embedded Memory

Configurations" section on page 1-23 for more

information.

Figure 1-1 • The ProASICPLUS Device Architecture

Figure 1-2 • Flash Switch

256x9 Two-Port SRAM

or FIFO Block

Logic Tile

256x9 Two Port SRAM

or FIFO Block

RAM Block

I/Os

Sensing Switching

Switch In

Switch Out

ord

Floating Gate

ProASICPLUS Flash Family FPGAs

v5.8 1-3

Live at Power-Up

The Actel Flash-based ProASICPLUS devices support

Level 0 of the live at power-up (LAPU) classification

standard. This feature helps in system component

initialization, executing critical tasks before the

processor wakes up, setting up and configuring memory

blocks, clock generation, and bus activity management.

The LAPU feature of Flash-based ProASICPLUS devices

greatly simplifies total system design and reduces total

system cost, often eliminating the need for Complex

Programmable Logic Device (CPLD) and clock generation

PLLs that are used for this purpose in a system. In

addition, glitches and brownouts in system power will

not corrupt the ProASICPLUS device's Flash configuration,

and unlike SRAM-based FPGAs, the device will not have

to be reloaded when system power is restored. This

enables the reduction or complete removal of the

configuration PROM, expensive voltage monitor,

brownout detection, and clock generator devices from

the PCB design. Flash-based ProASICPLUS devices simplify

total system design, and reduce cost and design risk,

while increasing system reliability and improving system

initialization time.

Flash Switch

Unlike SRAM FPGAs, ProASICPLUS uses a live-on-power-up

ISP Flash switch as its programming element.

In the ProASICPLUS Flash switch, two transistors share the

floating gate, which stores the programming

information. One is the sensing transistor, which is only

used for writing and verification of the floating gate

voltage. The other is the switching transistor. It can be

used in the architecture to connect/separate routing nets

or to configure logic. It is also used to erase the floating

gate (Figure 1-2 on page 1-2).

Logic Tile

The logic tile cell (Figure 1-3) has three inputs (any or all

of which can be inverted) and one output (which can

connect to both ultra-fast local and efficient long-line

routing resources). Any three-input, one-output logic

function (except a three-input XOR) can be configured as

one tile. The tile can be configured as a latch with clear

or set or as a flip-flop with clear or set. Thus, the tiles can

flexibly map logic and sequential gates of a design.

Figure 1-3 • Core Logic Tile

Local Routing

In 1

In 2 (CLK)

In 3 (Reset)

Efficient Long-Line Routing

ProASICPLUS Flash Family FPGAs

1-4 v5.8

Routing Resources

The routing structure of ProASICPLUS devices is designed

to provide high performance through a flexible four-

level hierarchy of routing resources: ultra-fast local

resources, efficient long-line resources, high-speed, very

long-line resources, and high performance global

networks.

The ultra-fast local resources are dedicated lines that

allow the output of each tile to connect directly to every

input of the eight surrounding tiles (Figure 1-4).

The efficient long-line resources provide routing for

longer distances and higher fanout connections. These

resources vary in length (spanning 1, 2, or 4 tiles), run

both vertically and horizontally, and cover the entire

ProASICPLUS device (Figure 1-5 on page 1-5). Each tile can

drive signals onto the efficient long-line resources, which

can in turn access every input of every tile. Active buffers

are inserted automatically by routing software to limit

the loading effects due to distance and fanout.

The high-speed, very long-line resources, which span the

entire device with minimal delay, are used to route very

long or very high fanout nets. (Figure 1-6 on page 1-6).

The high-performance global networks are low-skew,

high fanout nets that are accessible from external pins or

from internal logic (Figure 1-7 on page 1-7). These nets

are typically used to distribute clocks, resets, and other

high fanout nets requiring a minimum skew. The global

networks are implemented as clock trees, and signals can

be introduced at any junction. These can be employed

hierarchically with signals accessing every input on all

tiles.

Figure 1-4 • Ultra-Fast Local Resources

Inputs

Output

Ultra-Fast

Local Lines

(connects a tile to the

adjacent tile, I/O buffer,

or memory block)

LLL

ProASICPLUS Flash Family FPGAs

v5.8 1-5

Figure 1-5 • Efficient Long-Line Resources

LL LLLL

LLLLLL

LL LLLL

Logic Cell

Spans 1 Tile

Spans 2 Tiles

Spans 4 Tiles

Spans 1 Tile

Spans 2 Tiles

Spans 4 Tiles

Logic Tile

ProASICPLUS Flash Family FPGAs

1-6 v5.8

Clock Resources

The ProASICPLUS family offers powerful and flexible

control of circuit timing through the use of analog

circuitry. Each chip has two clock conditioning blocks

containing a phase-locked loop (PLL) core, delay lines,

phase shifter (0° and 180°), clock multiplier/dividers, and

all the circuitry needed for the selection and

interconnection of inputs to the global network (thus

providing bidirectional access to the PLL). This permits

the PLL block to drive inputs and/or outputs via the two

global lines on each side of the chip (four total lines).

This circuitry is discussed in more detail in the

"ProASICPLUS Clock Management System" section on

page 1-13.

Clock Trees

One of the main architectural benefits of ProASICPLUS is

the set of power- and delay-friendly global networks.

ProASICPLUS offers four global trees. Each of these trees

is based on a network of spines and ribs that reach all

the tiles in their regions (Figure 1-7 on page 1-7). This

flexible clock tree architecture allows users to map up to

88 different internal/external clocks in an APA1000

device. Details on the clock spines and various numbers

of the family are given in Table 1-1 on page 1-7.

The flexible use of the ProASICPLUS clock spine allows the

designer to cope with several design requirements. Users

implementing clock-resource intensive applications can

easily route external or gated internal clocks using global

routing spines. Users can also drastically reduce delay

penalties and save buffering resources by mapping

critical high fanout nets to spines. For design hints on

using these features, refer to Actel’s Efficient Use of

ProASIC Clock Trees application note.

Figure 1-6 • High-Speed, Very Long-Line Resources

PAD RING

I/O RING

High Speed Very Long-Line Resouces

SRAM

ProASICPLUS Flash Family FPGAs

v5.8 1-7

Note: This figure shows routing for only one global path.

Figure 1-7 • High-Performance Global Network

Table 1-1 • Clock Spines

APA075 APA150 APA300 APA450 APA600 APA750 APA1000

Global Clock Networks (Trees) 4 4 4 4 4 4 4

Clock Spines/Tree 6 8 8 12 14 16 22

Total Spines 24 32 32 48 56 64 88

Top or Bottom Spine Height (Tiles) 16 24 32 32 48 64 80

Tiles in Each Top or Bottom Spine 512 768 1,024 1,024 1,536 2,048 2,560

Total Tiles 3,072 6,144 8,192 12,288 21,504 32,768 56,320

Top Spine

Bottom Spine

Global

Pads Global

Pads

Global Networks

Global Spine

Global Ribs

High-Performance

Global Network

Scope of Spine

(Shaded area

plus local RAMs

and I/Os)

PAD RING

I/O RING

ProASICPLUS Flash Family FPGAs

1-8 v5.8

Array Coordinates

During many place-and-route operations in Actel’s

Designer software tool, it is possible to set constraints

that require array coordinates.

Table 1-2 is provided as a reference. The array coordinates

are measured from the lower left (0,0). They can be used in

region constraints for specific groups of core cells, I/Os, and

RAM blocks. Wild cards are also allowed.

I/O and cell coordinates are used for placement

constraints. Two coordinate systems are needed because

there is not a one-to-one correspondence between I/O

cells and core cells. In addition, the I/O coordinate system

changes depending on the die/package combination.

Core cell coordinates start at the lower left corner

(represented as (1,1)) or at (1,5) if memory blocks are

present at the bottom. Memory coordinates use the

same system and are indicated in Table 1-2. The memory

coordinates for an APA1000 are illustrated in Figure 1-8.

For more information on how to use constraints, see the

Designer User’s Guide or online help for ProASICPLUS

software tools.

Table 1-2 • Array Coordinates

Device

Logic Tile Memory Rows

AllMin. Max. Bottom Top

xy x y y y Min. Max.

APA075 1 1 96 32 – (33,33) or (33, 35) 0,0 97, 37

APA150 1 1 128 48 – (49,49) or (49, 51) 0,0 129, 53

APA300 1 5 128 68 (1,1) or (1,3) (69,69) or (69, 71) 0,0 129, 73

APA450 1 5 192 68 (1,1) or (1,3) (69,69) or (69, 71) 0,0 193, 73

APA600 1 5 224 100 (1,1) or (1,3) (101,101) or (101, 103) 0,0 225, 105

APA750 1 5 256 132 (1,1) or (1,3) (133,133) or (133, 135) 0,0 257, 137

APA1000 1 5 352 164 (1,1) or (1,3) (165,165) or (165, 167) 0,0 353, 169

Figure 1-8 • Core Cell Coordinates for the APA1000

(353,169)

(352,167)

(352,165)

(352,164)

(352,5)

(352,3)

(353,0)

(352,1)

(1,5)

(1,1)

(1,164)

(1,165)

(1,3)

(1,167)

(1,169)

(0,0)

Core

Memory

Blocks

Memory

Blocks

ProASICPLUS Flash Family FPGAs

v5.8 1-9

Input/Output Blocks

To meet complex system demands, the ProASICPLUS

family offers devices with a large number of user I/O

pins, up to 712 on the APA1000. Table 1-3 shows the

available supply voltage configurations (the PLL block

uses an independent 2.5 V supply on the AVDD and

AGND pins). All I/Os include ESD protection circuits. Each

I/O has been tested to 2000 V to the human body model

(per JESD22 (HBM)).

Six or seven standard I/O pads are grouped with a GND

pad and either a VDD (core power) or VDDP (I/O power)

pad. Two reference bias signals circle the chip. One

protects the cascaded output drivers, while the other

creates a virtual VDD supply for the I/O ring.

I/O pads are fully configurable to provide the maximum

flexibility and speed. Each pad can be configured as an

input, an output, a tristate driver, or a bidirectional

buffer (Figure 1-9 and Table 1-4).

Table 1-3 • ProASICPLUS I/O Power Supply Voltages

VDDP

2.5 V 3.3 V

Input Compatibility 2.5V 3.3V

Output Drive 2.5V 3.3V

Figure 1-9 • I/O Block Schematic Representation

3.3V/2.5V

Signal Control

Pull-up

Control

Pad

3.3 V/2.5 V Signal Control Drive

Strength and Slew-Rate Control

Table 1-4 • I/O Features

Function Description

I/O pads configured as inputs • Selectable 2.5 V or 3.3 V threshold levels

• Optional pull-up resistor

• Optionally configurable as Schmitt trigger input. The Schmitt trigger input option can be

configured as an input only, not a bidirectional buffer. This input type may be slower than

a standard input under certain conditions and has a typical hysteresis of 0.35 V. I/O macros

with an “S” in the standard I/O library have added Schmitt capabilities.

• 3.3 V PCI Compliant (except Schmitt trigger inputs)

I/O pads configured as outputs • Selectable 2.5 V or 3.3 V compliant output signals

• 2.5 V – JEDEC JESD 8-5

• 3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS)

• 3.3 V PCI compliant

• Ability to drive LVTTL and LVCMOS levels

• Selectable drive strengths

• Selectable slew rates

• Tristate

I/O pads configured as bidirectional

buffers

• Selectable 2.5 V or 3.3 V compliant output signals

• 2.5 V – JEDEC JESD 8-5

• 3.3 V – JEDEC JESD 8-A (LVTTL and LVCMOS)

• 3.3 V PCI compliant

• Optional pull-up resistor

• Selectable drive strengths

• Selectable slew rates

• Tristate

ProASICPLUS Flash Family FPGAs

1-10 v5.8

Power-Up Sequencing

While ProASICPLUS devices are live at power-up, the order

of VDD and VDDP power-up is important during system

start-up. VDD should be powered up simultaneously with

VDDP on ProASICPLUS devices. Failure to follow these

guidelines may result in undesirable pin behavior during

system start-up. For more information, refer to Actel’s

Power-Up Behavior of ProASICPLUS Devices application

note.

LVPECL Input Pads

In addition to standard I/O pads and power pads,

ProASICPLUS devices have a single LVPECL input pad on

both the east and west sides of the device, along with

AVDD and AGND pins to power the PLL block. The

LVPECL pad cell consists of an input buffer (containing a

low voltage differential amplifier) and a signal and its

complement, PPECL (I/P) (PECLN) and NPECL (PECLREF).

The LVPECL input pad cell differs from the standard I/O

cell in that it is operated from VDD only.

Since it is exclusively an input, it requires no output

signal, output enable signal, or output configuration

bits. As a special high-speed differential input, it also

does not require pull ups. Recommended termination for

LVPECL inputs is shown in Figure 1-10. The LVPECL pad

cell compares voltages on the PPECL (I/P) pad (as

illustrated in Figure 1-11) and the NPECL pad and sends

the results to the global MUX (Figure 1-14 on page 1-14).

This high-speed, low-skew output essentially controls the

clock conditioning circuit.

LVPECLs are designed to meet LVPECL JEDEC receiver

standard levels (Table 1-5).

Figure 1-10 • Recommended Termination for LVPECL Inputs

Figure 1-11 • LVPECL High and Low Threshold Values

Table 1-5 • LVPECL Receiver Specifications

Symbol Parameter Min. Max Units

VIH Input High Voltage 1.49 2.72 V

VIL Input Low Voltage 0.86 2.125 V

VID Differential Input Voltage 0.3 VDD V

PPECL

NPECL

From LVPECL Driver Data

Z = 50 Ω

R = 100 Ω

2.72

2.125

1.49

0.86

Voltage

ProASICPLUS Flash Family FPGAs

v5.8 1-11

Boundary Scan (JTAG)

ProASICPLUS devices are compatible with IEEE Standard

1149.1, which defines a set of hardware architecture and

mechanisms for cost-effective, board-level testing. The

basic ProASICPLUS boundary-scan logic circuit is composed

of the TAP (test access port), TAP controller, test data

registers, and instruction register (Figure 1-12). This

circuit supports all mandatory IEEE 1149.1 instructions

(EXTEST, SAMPLE/PRELOAD and BYPASS) and the

optional IDCODE instruction (Table 1-6).

Each test section is accessed through the TAP, which has

five associated pins: TCK (test clock input), TDI and TDO

(test data input and output), TMS (test mode selector)

and TRST (test reset input). TMS, TDI and TRST are

equipped with pull-up resistors to ensure proper

operation when no input data is supplied to them. These

pins are dedicated for boundary-scan test usage. Actel

recommends that a nominal 20 kΩ pull-up resistor is

added to TDO and TCK pins.

The TAP controller is a four-bit state machine (16 states)

that operates as shown in Figure 1-13 on page 1-12. The

’1’s and ‘0’s represent the values that must be present at

TMS at a rising edge of TCK for the given state transition

to occur. IR and DR indicate that the instruction register

or the data register is operating in that state.

ProASICPLUS devices have to be programmed at least

once for complete boundary-scan functionality to be

available. Prior to being programmed, EXTEST is not

available. If boundary-scan functionality is required prior

to programming, refer to online technical support on the

Actel website and search for ProASICPLUS BSDL.

Figure 1-12 • ProASICPLUS JTAG Boundary Scan Test Logic Circuit

Device

Logic

TDI

TCK

TMS

TRST

TDO

I/OI/OI/O I/OI/O

I/O

Bypass Register

Instruction

TAP

Controller

Test Data

Registers

Table 1-6 • Boundary-Scan Opcodes

Hex Opcode

EXTEST 00

SAMPLE/PRELOAD 01

IDCODE 0F

CLAMP 05

BYPASS FF

Table 1-6 • Boundary-Scan Opcodes

Hex Opcode

ProASICPLUS Flash Family FPGAs

1-12 v5.8

The TAP controller receives two control inputs (TMS and

TCK) and generates control and clock signals for the rest

of the test logic architecture. On power-up, the TAP

controller enters the Test-Logic-Reset state. To guarantee

a reset of the controller from any of the possible states,

TMS must remain high for five TCK cycles. The TRST pin

may also be used to asynchronously place the TAP

controller in the Test-Logic-Reset state.

ProASICPLUS devices support three types of test data

registers: bypass, device identification, and boundary

scan. The bypass register is selected when no other

test data transfer to other devices in a test data path.

The 32-bit device identification register is a shift register

with four fields (lowest significant byte (LSB), ID number,

part number and version). The boundary-scan register

observes and controls the state of each I/O pin.

Each I/O cell has three boundary-scan register cells, each

with a serial-in, serial-out, parallel-in, and parallel-out

pin. The serial pins are used to serially connect all the

boundary-scan register cells in a device into a boundary-

scan register chain, which starts at the TDI pin and ends

at the TDO pin. The parallel ports are connected to the

internal core logic tile and the input, output, and control

ports of an I/O buffer to capture and load data into the

Figure 1-13 • TAP Controller State Diagram

Test-Logic

Reset

Run-Test/

Idle Select-DR-

Scan

Capture-DR

Shift-DR

Exit-DR

Pause-DR

Exit2-DR

Update-DR

Select-IR-

Scan

Capture-IR

Shift-IR

Exit-IR

Pause-IR

Exit2-IR

Update-IR

110

ProASICPLUS Flash Family FPGAs

v5.8 1-13

Timing Control and

Characteristics

ProASICPLUS Clock Management System

ProASICPLUS devices provide designers with very flexible

clock conditioning capabilities. Each member of the

ProASICPLUS family contains two phase-locked loop (PLL)

blocks which perform the following functions:

• Clock Phase Adjustment via Programmable Delay

(250 ps steps from –7 ns to +8 ns)

• Clock Skew Minimization

• Clock Frequency Synthesis

Each PLL has the following key features:

• Input Frequency Range (fIN) = 1.5 to 180 MHz

• Feedback Frequency Range (fVCO) = 24 to 180 MHz

• Output Frequency Range (fOUT) = 8 to 180 MHz

• Output Phase Shift = 0 ° and 180 °

• Output Duty Cycle = 50%

• Low Output Jitter (max at 25°C)

–f

VCO <10 MHz. Jitter ±1% or better

– 10 MHz < fVCO < 60 MHz. Jitter ±2% or better

–f

VCO > 60 MHz. Jitter ±1% or better

Note: Jitter(ps) = Jitter(%)* period

For Example:

• Low Power Consumption – 6.9 mW (max – analog

supply) + 7.0μW/MHz (max – digital supply)

Physical Implementation

Each side of the chip contains a clock conditioning circuit

based on a 180 MHz PLL block (Figure 1-14 on page 1-

14). Two global multiplexed lines extend along each side

of the chip to provide bidirectional access to the PLL on

that side (neither MUX can be connected to the opposite

side's PLL). Each global line has optional LVPECL input

pads (described below). The global lines may be driven

by either the LVPECL global input pad or the outputs

from the PLL block, or both. Each global line can be

driven by a different output from the PLL. Unused global

pins can be configured as regular I/Os or left

unconnected. They default to an input with pull-up. The

two signals available to drive the global networks are as

follows (Figure 1-15 on page 1-15, Table 1-7 on page 1-

15, and Table 1-8 on page 1-16):

Global A (secondary clock)

• Output from Global MUX A

• Conditioned version of PLL output (fOUT) – delayed

or advanced

• Divided version of either of the above

• Further delayed version of either of the above

(0.25 ns, 0.50 ns, or 4.00 ns delay)1

Global B

• Output from Global MUX B

• Delayed or advanced version of fOUT

• Divided version of either of the above

• Further delayed version of either of the above

(0.25 ns, 0.50 ns, or 4.00 ns delay)2

Functional Description

Each PLL block contains four programmable dividers as

shown in Figure 1-14 on page 1-14. These allow

frequency scaling of the input clock signal as follows:

• The n divider divides the input clock by integer

factors from 1 to 32.

• The m divider in the feedback path allows

multiplication of the input clock by integer factors

ranging from 1 to 64.

• The two dividers together can implement any

combination of multiplication and division

resulting in a clock frequency between 24 and 180

MHz exiting the PLL core. This clock has a fixed

50% duty cycle.

• The output frequency of the PLL core is given by

the formula EQ 1-1 (fREF is the reference clock

frequency):

fOUT = fREF * m/n

EQ 1-1

• The third and fourth dividers (u and v) permit the

signals applied to the global network to each be

further divided by integer factors ranging from 1

to 4.

The implementations shown in EQ2 and EQ3 enable the

user to define a wide range of frequency multiplier and

divisors.

fGLB = m/(n*u)

EQ 1-2

fGLA = m/(n*v)

EQ 1-3

Jitter in picoseconds at 100 MHz = 0.01 * (1/100E6) = 100 ps

• Maximum Acquisition

Time

= 80 µs for fVCO > 40 MHz

= 30 µs for fVCO < 40 MHz

1. This mode is available through the delay feature of the Global MUX driver.

ProASICPLUS Flash Family FPGAs

1-14 v5.8

enable the user to define a wide range of frequency

multipliers and divisors. The clock conditioning circuit can

advance or delay the clock up to 8 ns (in increments of

0.25 ns) relative to the positive edge of the incoming

reference clock. The system also allows for the selection of

output frequency clock phases of 0° and 180°.

Prior to the application of signals to the rib drivers, they

pass through programmable delay units, one per global

network. These units permit the delaying of global

signals relative to other signals to assist in the control of

input set-up times. Not all possible combinations of input

and output modes can be used. The degrees of freedom

available in the bidirectional global pad system and in

the clock conditioning circuit have been restricted. This

avoids unnecessary and unwieldy design kit and software

work.

Notes:

1. FBDLY is a programmable delay line from 0 to 4 ns in 250 ps increments.

2. DLYA and DLYB are programmable delay lines, each with selectable values 0 ps, 250 ps, 500 ps, and 4 ns.

3. OBDIV will also divide the phase-shift since it takes place after the PLL Core.

Figure 1-14 • PLL Block – Top-Level View and Detailed PLL Block Diagram

AVDD AGND GND

VDD

External Feedback Signal

GLA

GLB

Dynamic

Configuration Bits

Flash

Configuration Bits

Clock Conditioning

Circuitry

(Top level view)

Global MUX A OUT

Global MUX B OUT

See Figure 1-15

on page 1-14

Input Pins to the PLL

GLB

GLA

÷u

÷v

PLL Core

0˚

180˚

Delay Line 0.0 ns, 0.25 ns,

0.50 ns and 4.00 ns

P+

P-

Clock from Core

(GLINT mode)

CLK

Deskew

Delay

2.95 ns

Delay Line

0.25 ns to

4.00 ns,

16 steps,

0.25 ns

increments

Delay Line 0.0 ns, 0.25 ns,

0.50 ns and 4.00 ns

Clock from Core

(GLINT mode)

CLKA

EXTFB XDLYSEL

Bypass Secondary

Bypass Primary

FIVDIV[4:0]

FBDIV[5:0]

FBSEL[1:0]

OAMUX[1:0]

DLYA[1:0]

DLYB[1:0]

OBDIV[1:0]

OBMUX[2:0]

OADIV[1:0]

FBDLY[3:0]

÷n

÷m

Clock Conditioning Circuitry Detailed Block Diagram

ProASICPLUS Flash Family FPGAs

v5.8 1-15

Note: When a signal from an I/O tile is connected to the core, it cannot be connected to the Global MUX at the same time.

Figure 1-15 • Input Connectors to ProASICPLUS Clock Conditioning Circuitry

Table 1-7 • Clock-Conditioning Circuitry MUX Settings

MUX Datapath Comments

FBSEL

1 Internal Feedback

2 Internal Feedback and Advance Clock Using FBDLY –0.25 to –4 ns in 0.25 ns increments

3 External Feedback (EXTFB)

XDLYSEL

0 Feedback Unchanged

1 Deskew feedback by advancing clock by system delay Fixed delay of -2.95 ns

OBMUX GLB

0 Primary bypass, no divider

1 Primary bypass, use divider

2 Delay Clock Using FBDLY +0.25 to +4 ns in 0.25 ns increments

4 Phase Shift Clock by 0°

5 Reserved

6 Phase Shift Clock by +180°

7 Reserved

OAMUX GLA

0 Secondary bypass, no divider

1 Secondary bypass, use divider

2 Delay Clock Using FBDLY +0.25 to +4 ns in 0.25 ns increments

3 Phase Shift Clock by 0°

Configuration Tile

PECL Pad Cell

GLMX

Std. Pad Cell

NPECL

PPECL

CORE

Package Pins Physical I/O

Buffers

Global MUX

External

Feedback

Global MUX B

OUT

Global MUX A

OUT

Legend

Physical Pin

DATA Signals to the Core

DATA Signals to the PLL Block

DATA Signals to the Global MUX

Control Signals to the Global MUX

ProASICPLUS Flash Family FPGAs

1-16 v5.8

Lock Signal

An active-high Lock signal (added via the SmartGen PLL

development tool) indicates that the PLL has locked to

the incoming clock signal. The PLL will acquire and

maintain lock even when there is jitter on the incoming

clock signal. The PLL will maintain lock with an input

jitter up to 5% of the input period, with a maximum of

5 ns. Users can employ the Lock signal as a soft reset of

the logic driven by GLB and/or GLA. Note if FIN is not

within specified frequencies, then both the FOUT and lock

signal are indeterminate.

PLL Configuration Options

The PLL can be configured during design (via Flash-

configuration bits set in the programming bitstream) or

dynamically during device operation, thus eliminating

the need to reprogram the device. The dynamic

configuration bits are loaded into a serial-in/parallel-out

shift register provided in the clock conditioning circuit.

The shift register can be accessed either from user logic

within the device or via the JTAG port. Another option is

internal dynamic configuration via user-designed

hardware. Refer to Actel's ProASICPLUS PLL Dynamic

Reconfiguration Using JTAG application note for more

information.

For information on the clock conditioning circuit, refer

to Actel’s Using ProASICPLUS Clock Conditioning Circuits

application note.

Sample Implementations

Frequency Synthesis

Figure 1-16 on page 1-17 illustrates an example where

the PLL is used to multiply a 33 MHz external clock up to

133 MHz. Figure 1-17 on page 1-17 uses two dividers to

synthesize a 50 MHz output clock from a 40 MHz input

reference clock. The input frequency of 40 MHz is

multiplied by five and divided by four, giving an output

clock (GLB) frequency of 50 MHz. When dividers are

used, a given ratio can be generated in multiple ways,

allowing the user to stay within the operating frequency

ranges of the PLL. For example, in this case the input

divider could have been two and the output divider also

two, giving us a division of the input frequency by four

to go with the feedback loop division (effective

multiplication) by five.

Adjustable Clock Delay

Figure 1-18 on page 1-18 illustrates the delay of the

input clock by employing one of the adjustable delay

lines. This is easily done in ProASICPLUS by bypassing the

PLL core entirely and using the output delay line. Notice

also that the output clock can be effectively advanced

relative to the input clock by using the delay line in the

feedback path. This is shown in Figure 1-19 on page 1-18.

Clock Skew Minimization

Figure 1-20 on page 1-19 indicates how feedback from

the clock network can be used to create minimal skew

between the distributed clock network and the input

clock. The input clock is fed to the reference clock input

of the PLL. The output clock (GLA) feeds a clock network.

The feedback input to the PLL uses a clock input delayed

by a routing network. The PLL then adjusts the phase of

the input clock to match the delayed clock, thus

providing nearly zero effective skew between the two

clocks. Refer to Actel's Using ProASICPLUS Clock

Conditioning Circuits application note for more

information.

Table 1-8 • Clock-Conditioning Circuitry Delay-Line

Settings

Delay Line Delay Value (ns)

DLYB

1 +0.25

2 +0.50

3+4.0

DLYA

1 +0.25

2 +0.50

3+4.0

ProASICPLUS Flash Family FPGAs

v5.8 1-17

Figure 1-16 • Using the PLL 33 MHz In, 133 MHz Out

Figure 1-17 • Using the PLL 40 MHz In, 50 MHz Out

÷n

÷m

÷u

÷v

PLL Core

External Feedback

Global MUX B OUT

Global MUX A OUT

GLB

GLA

180

33 MHz

133 MHz

÷4

÷1

÷n

÷m

÷u

÷v

PLL Core

External Feedback

Global MUX B OUT

Global MUX A OUT

GLB

0˚

180˚

40 MHz 50 MHz

÷5

÷4

÷1

ProASICPLUS Flash Family FPGAs

1-18 v5.8

Figure 1-18 • Using the PLL to Delay the Input Clock

Figure 1-19 • Using the PLL to Advance the Input Clock

÷n

÷m

÷u

÷v

PLL Core

External Feedback

Global MUX B OUT

Global MUX A OUT

GLB

180

133 MHz

÷1

÷n

÷m

÷u

÷v

PLL Core

External Feedback

Global MUX B OUT

Global MUX A OUT

GLB

0˚

180˚

133 MHz

÷1

ProASICPLUS Flash Family FPGAs

v5.8 1-19

Figure 1-20 • Using the PLL for Clock Deskewing

÷u

÷v

÷n

÷m

PLL Core

External

Feedback

Global MUX B

OUT

Global MUX A

OUT

133 MHz

QSET

CLR

Off chip On chip

Reference

clock

180˚

0˚

ProASICPLUS Flash Family FPGAs

1-20 v5.8

Logic Tile Timing Characteristics

Timing characteristics for ProASICPLUS devices fall into

three categories: family dependent, device dependent,

and design dependent. The input and output buffer

characteristics are common to all ProASICPLUS family

members. Internal routing delays are device dependent.

Design dependency means that actual delays are not

determined until after placement and routing of the

user’s design are complete. Delay values may then be

determined by using the Timer utility or by performing

simulation with post-layout delays.

Critical Nets and Typical Nets

Propagation delays are expressed only for typical nets,

which are used for initial design performance evaluation.

Critical net delays can then be applied to the most

timing-critical paths. Critical nets are determined by net

property assignment prior to place-and-route. Refer to

the Actel Designer User’s Guide or online help for details

on using constraints.

Timing Derating

Since ProASICPLUS devices are manufactured with a

CMOS process, device performance will vary with

temperature, voltage, and process. Minimum timing

parameters reflect maximum operating voltage,

minimum operating temperature, and optimal process

variations. Maximum timing parameters reflect minimum

operating voltage, maximum operating temperature,

and worst-case process variations (within process

specifications). The derating factors shown in Table 1-9

should be applied to all timing data contained within

this datasheet.

All timing numbers listed in this datasheet represent

sample timing characteristics of ProASICPLUS devices.

Actual timing delay values are design-specific and can be

derived from the Timer tool in Actel’s Designer software

after place-and-route.

Table 1-9 • Temperature and Voltage Derating Factors

(Normalized to Worst-Case Commercial, TJ = 70°C, VDD = 2.3 V)

–55°C –40°C 0°C 25°C 70°C 85°C 110°C 125°C 135°C 150°C

2.3 V 0.840.860.910.941.001.021.051.131.181.27

2.5 V 0.810.820.870.900.950.981.011.091.131.21

2.7 V 0.770.790.830.860.910.930.961.041.081.16

Notes:

1. The user can set the junction temperature in Designer software to be any integer value in the range of –55°C to 175°C.

2. The user can set the core voltage in Designer software to be any value between 1.4 V and 1.6 V.

ProASICPLUS Flash Family FPGAs

v5.8 1-21

PLL Electrical Specifications

Parameter Value TJ ≤ –40°C Value TJ > –40°C Notes

Frequency Ranges

Reference Frequency fIN (min.) 2.0 MHz 1.5 MHz Clock conditioning circuitry (min.) lowest input

frequency

Reference Frequency fIN (max.) 180 MHz 180 MHz Clock conditioning circuitry (max.) highest input

frequency

OSC Frequency fVCO (min.) 60 24 MHz Lowest output frequency voltage controlled

oscillator

OSC Frequency fVCO (max.) 180 180 MHz Highest output frequency voltage controlled

oscillator

Clock Conditioning Circuitry fOUT (min.) fIN ≤ 40 = 18 MHz

fIN > 40 = 16 MHz

6 MHz Lowest output frequency clock conditioning

circuitry

Clock Conditioning Circuitry fOUT (max.) 180 180 MHz Highest output frequency clock conditioning

circuitry

Acquisition Time from Cold Start

Acquisition Time (max.) 80 μs 30 μsf

VCO ≤ 40 MHz

Acquisition Time (max.) 80 μs 80 μsf

VCO > 40 MHz

Long Term Jitter Peak-to-Peak Max.*

Temperature Frequency MHz

fVCO<

10<fV

CO<60

fVCO

>60

25°C (or higher) ±1% ±2% ±1% Jitter(ps) = Jitter(%)*period

For example:

Jitter in picoseconds at 100 MHz

= 0.01 * (1/100E6) = 100 ps

0°C ±1.5% ±2.5% ±1%

–40°C ±2.5% ±3.5% ±1%

–55°C ±2.5% ±3.5% ±1%

Power Consumption

Analog Supply Power (max.*) 6.9 mW per PLL

Digital Supply Current (max.) 7 μW/MHz

Duty Cycle 50% ±0.5%

Input Jitter Tolerance

5% input period (max.

5 ns)

Maximum jitter allowable on an input

clock to acquire and maintain lock.

Note: *High clock frequencies (>60 MHz) under typical setup conditions

ProASICPLUS Flash Family FPGAs

1-22 v5.8

PLL I/O Constraints

PLL locking is guaranteed only when the following constraints are followed:

Table 1-10 • PLL I/O Constraints

TJ ≤ –40°C Value TJ > –40°C

I/O Type PLL locking is guaranteed only when using low drive strength and

low slew rate I/O. PLL locking may be inconsistent when using high

drive strength or high slew rate I/Os

No Constraints

SSO APA300 Hermetic packages ≤ 8 SSO With FIN ≤ 180 MHz and

outputs switching

simultaneously

Plastic packages ≤ 16 SSO

APA600 Hermetic packages ≤ 16 SSO

Plastic packages ≤ 32 SSO

APA1000 Hermetic packages ≤ 16 SSO

Plastic packages ≤ 32 SSO

APA300 Hermetic packages ≤ 12 SSO With FIN ≤ 50 MHz and half

outputs switching on positive

clock edge, half switching on

the negative clock edge no less

than 10nsec later

Plastic packages ≤ 20 SSO

APA600 Hermetic packages ≤ 32 SSO

Plastic packages ≤ 64 SSO

APA1000 Hermetic packages ≤ 32 SSO

Plastic packages ≤ 64 SSO

ProASICPLUS Flash Family FPGAs

v5.8 1-23

User Security

ProASICPLUS devices have FlashLock protection bits that,

once programmed, block the entire programmed

contents from being read externally. Please refer to

Table 1-11 for details on the number of bits in the key for

each device. If locked, the user can only reprogram the

device employing the user-defined security key. This

protects the device from being read back and duplicated.

Since programmed data is stored in nonvolatile memory

cells (actually very small capacitors) rather than in the

wiring, physical deconstruction cannot be used to

compromise data. This type of security breach is further

discouraged by the placement of the memory cells

beneath the four metal layers (whose removal cannot be

accomplished without disturbing the charge in the

capacitor). This is the highest security provided in the

industry. For more information, refer to Actel’s Design

Security in Nonvolatile Flash and Antifuse FPGAs white

paper.

Embedded Memory Floorplan

The embedded memory is located across the top and

bottom of the device in 256x9 blocks (Figure 1-1 on page

1-2). Depending on the device, up to 88 blocks are

available to support a variety of memory configurations.

Each block can be programmed as an independent

memory array or combined (using dedicated memory

routing resources) to form larger, more complex memory

configurations. A single memory configuration could

include blocks from both the top and bottom memory

locations.

Embedded Memory Configurations

The embedded memory in the ProASICPLUS family

provides great configuration flexibility (Table 1-12). Each

ProASICPLUS block is designed and optimized as a two-

port memory (one read, one write). This provides 198

kbits of two-port and/or single port memory in the

APA1000 device.

Each memory block can be configured as FIFO or SRAM,

with independent selection of synchronous or

asynchronous read and write ports (Table 1-13).

Additional characteristics include programmable flags as

well as parity checking and generation. Figure 1-21 on

page 1-25 and Figure 1-22 on page 1-26 show the block

diagrams of the basic SRAM and FIFO blocks. Table 1-14

on page 1-25 and Table 1-15 on page 1-26 describe

memory block SRAM and FIFO interface signals,

respectively. A single memory block is designed to

operate at up to 150 MHz (standard speed grade typical

conditions). Each block is comprised of 256 9-bit words

(one read port, one write port). The memory blocks may

be cascaded in width and/or depth to create the desired

memory organization. (Figure 1-23 on page 1-27). This

provides optimal bit widths of 9 (one block), 18, 36, and

72, and optimal depths of 256, 512, 768, and 1,024. Refer

to Actel’s SmartGen User’s Guide for more information.

Figure 1-24 on page 1-27 gives an example of optimal

memory usage. Ten blocks with 23,040 bits have been

used to generate three arrays of various widths and

depths. Figure 1-25 on page 1-27 shows how RAM blocks

can be used in parallel to create extra read ports. In this

example, using only 10 of the 88 available blocks of the

APA1000 yields an effective 6,912 bits of multiple port

RAM. The Actel SmartGen software facilitates building

wider and deeper memory configurations for optimal

memory usage.

Table 1-11 • Flashlock Key Size by Device

Device Key Size

APA075 79 bits

APA150 79 bits

APA300 79 bits

APA450 119 bits

APA600 167 bits

APA750 191 bits

APA1000 263 bits

Table 1-12 • ProASICPLUS Memory Configurations by Device

Device Bottom Top

Maximum Width Maximum Depth

DWDW

APA075 0 12 256 108 1,536 9

APA150 0 16 256 144 2,048 9

APA300 16 16 256 144 2,048 9

APA450 24 24 256 216 3,072 9

APA600 28 28 256 252 3,584 9

ProASICPLUS Flash Family FPGAs

1-24 v5.8

APA750 32 32 256 288 4,096 9

APA1000 44 44 256 396 5,632 9

Table 1-13 • Basic Memory Configurations

Type Write Access Read Access Parity Library Cell Name

RAM Asynchronous Asynchronous Checked RAM256x9AA

RAM Asynchronous Asynchronous Generated RAM256x9AAP

RAM Asynchronous Synchronous Transparent Checked RAM256x9AST

RAM Asynchronous Synchronous Transparent Generated RAM256x9ASTP

RAM Asynchronous Synchronous Pipelined Checked RAM256x9ASR

RAM Asynchronous Synchronous Pipelined Generated RAM256x9ASRP

RAM Synchronous Asynchronous Checked RAM256x9SA

RAM Synchronous Asynchronous Generated RAM256xSAP

RAM Synchronous Synchronous Transparent Checked RAM256x9SST

RAM Synchronous Synchronous Transparent Generated RAM256x9SSTP

RAM Synchronous Synchronous Pipelined Checked RAM256x9SSR

RAM Synchronous Synchronous Pipelined Generated RAM256x9SSRP

FIFO Asynchronous Asynchronous Checked FIFO256x9AA

FIFO Asynchronous Asynchronous Generated FIFO256x9AAP

FIFO Asynchronous Synchronous Transparent Checked FIFO256x9AST

FIFO Asynchronous Synchronous Transparent Generated FIFO256x9ASTP

FIFO Asynchronous Synchronous Pipelined Checked FIFO256x9ASR

FIFO Asynchronous Synchronous Pipelined Generated FIFO256x9ASRP

FIFO Synchronous Asynchronous Checked FIFO256x9SA

FIFO Synchronous Asynchronous Generated FIFO256x9SAP

FIFO Synchronous Synchronous Transparent Checked FIFO256x9SST

FIFO Synchronous Synchronous Transparent Generated FIFO256x9SSTP

FIFO Synchronous Synchronous Pipelined Checked FIFO256x9SSR

FIFO Synchronous Synchronous Pipelined Generated FIFO256x9SSRP

Table 1-12 • ProASICPLUS Memory Configurations by Device

Device Bottom Top

Maximum Width Maximum Depth

DWDW

ProASICPLUS Flash Family FPGAs

v5.8 1-25

Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not

consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when

RAM blocks are cascaded and are automatically inserted by the software tools.

Figure 1-21 • Example SRAM Block Diagrams

Table 1-14 • Memory Block SRAM Interface Signals

SRAM Signal Bits In/Out Description

WCLKS 1 In Write clock used on synchronization on write side

RCLKS 1 In Read clock used on synchronization on read side

RADDR<0:7> 8 In Read address

RBLKB 1 In Read block select (active Low)

RDB 1 In Read pulse (active Low)

WADDR<0:7> 8 In Write address

WBLKB 1 In Write block select (active Low)

DI<0:8> 9 In Input data bits <0:8>, <8> can be used for parity In

WRB 1 In Write pulse (active Low)

DO<0:8> 9 Out Output data bits <0:8>, <8> can be used for parity Out

RPE 1 Out Read parity error (active High)

WPE 1 Out Write parity error (active High)

PARODD 1 In Selects Odd parity generation/detect when High, Even parity when Low

Note: Not all signals shown are used in all modes.

SRAM

(256x9)

DI <0:8> DO <0:8>

RADDR <0:7>

WADDR <0:7>

WRB RDB

WBLKB RBLKB

WCLKS RCLKS

RPE

PARODD

DI <0:8>

WADDR <0:7>

WRB

WBLKB

PARODD

WPE

SRAM

(256x9)

DI <0:8> DO <0:8>

WADDR <0:7>

WRB RDB

WBLKB RBLKB

WCLKS

RPE

PARODD

WPE

RADDR <0:7>

PARODD

DI <0:8> DO <0:8>

RADDR <0:7>WADDR <0:7>

WRB RDB

WBLKB RBLKB

RCLKS

RPE

WPE

DO <0:8>

RADDR <0:7>

RDB

RBLKB

RCLKS

RPE

Sync Write

and

Sync Read

Ports

Async Write

and

Async Read

Ports

Sync Write

and

Async Read

Ports

Async Write

and

Sync Read

Ports

SRAM

(256x9)

SRAM

(256x9)

ProASICPLUS Flash Family FPGAs

1-26 v5.8

Note: Each RAM block contains a multiplexer (called DMUX) for each output signal, increasing design efficiency. These DMUX cells do not

consume any core logic tiles and connect directly to high-speed routing resources between the RAM blocks. They are used when

RAM blocks are cascaded and are automatically inserted by the software tools.

Figure 1-22 • Basic FIFO Block Diagrams

Table 1-15 • Memory Block FIFO Interface Signals

FIFO Signal Bits In/Out Description

WCLKS 1 In Write clock used for synchronization on write side

RCLKS 1 In Read clock used for synchronization on read side

LEVEL <0:7> 8 In Direct configuration implements static flag logic

RBLKB 1 In Read block select (active Low)

RDB 1 In Read pulse (active Low)

RESET 1 In Reset for FIFO pointers (active Low)

WBLKB 1 In Write block select (active Low)

DI<0:8> 9 In Input data bits <0:8>, <8> will be generated parity if PARGEN is true

WRB 1 In Write pulse (active Low)

FULL, EMPTY 2 Out FIFO flags. FULL prevents write and EMPTY prevents read

EQTH, GEQTH 2 Out EQTH is true when the FIFO holds the number of words specified by the LEVEL signal.

GEQTH is true when the FIFO holds (LEVEL) words or more

DO<0:8> 9 Out Output data bits <0:8>. <8> will be parity output if PARGEN is true.

RPE 1 Out Read parity error (active High)

WPE 1 Out Write parity error (active High)

LGDEP <0:2> 3 In Configures DEPTH of the FIFO to 2 (LGDEP+1)

PARODD 1 In Parity generation/detect – Even when Low, Odd when High

FIFO

(256x9)

LEVEL<0:7> DO <0:8>

DI<0:8>

WRB

RDB

WBLKB

RBLKB

RPE

PARODD

WPE

LGDEP<0:2>

FULL

EMPTY

EQTH

GEQTH

WCLKS

RCLKS

RESET

RPE

WPE

FULL

EMPTY

EQTH

GEQTH

DO <0:8>

RPE

WPE

FULL

EMPTY

EQTH

GEQTH

DI <0:8> DO <0:8>

LEVEL <0:7>

WRB

RDB

WBLKB

RBLKB

RPE

PARODD

WPE

LGDEP<0:2>

DI <0:8>

LEVEL <0:7>

WRB

RDB

WBLKB

RBLKB

PARODD

LGDEP<0:2>

FULL

EMPTY

EQTH

GEQTH

RCLKS

RESET

LEVEL<0:7>

DI<0:8>

WRB

RDB

WBLKB

RBLKB

PARODD

LGDEP<0:2>

WCLKS

DO <0:8>

FIFO

(256x9)

FIFO

(256x9)

FIFO

(256x9)

Sync Write

and

Sync Read

Ports

Sync Write

and

Async Read

Ports

Async Write

and

Sync Read

Ports

Async Write

and

Async Read

Ports

ProASICPLUS Flash Family FPGAs

v5.8 1-27

Figure 1-23 • APA1000 Memory Block Architecture

Figure 1-24 • Example Showing Memory Arrays with Different Widths and Depths

Figure 1-25 • Multi-Port Memory Usage

Word

Depth

Word Width

88 blocks

256

Word

Depth

Word Width

1,024 words x 9 bits, 1 read, 1 write

512 words x 18 bits, 1 read, 1 write

256 words x 18 bits, 1 read, 1 write

Total Memory Blocks Used = 10

Total Memory Bits = 23,040

256

99 9

256

512 words x 9 bits, 4 read, 1 write

256 words x 9 bits, 2 read, 1 write

Total Memory Blocks Used = 10

Total Memory Bits = 6,912

Word

Depth

Word Width

Write Port Write Port

Read Ports

999 9

256

ProASICPLUS Flash Family FPGAs

1-28 v5.8

Design Environment

The ProASICPLUS family of FPGAs is fully supported by

both Actel's Libero® Integrated Design Environment

(IDE) and Designer FPGA Development software. Actel

Libero IDE is an integrated design manager that

seamlessly integrates design tools while guiding the user

through the design flow, managing all design and log

files, and passing necessary design data among tools.

Additionally, Libero IDE allows users to integrate both

schematic and HDL synthesis into a single flow and verify

the entire design in a single environment (see Actel’s

website for more information about Libero IDE). Libero

IDE includes Synplify® AE from Synplicity®, ViewDraw®

AE from Mentor Graphics®, ModelSim® HDL Simulator

from Mentor Graphics, WaveFormer Lite™ AE from

SynaptiCAD®, PALACE™ AE Physical Synthesis from

Magma, and Designer software from Actel.

PALACE is an effective tool when designing with

ProASICPLUS. PALACE AE Physical Synthesis from Magma

takes an EDIF netlist and optimizes the performance of

ProASICPLUS devices through a physical placement-driven

process, ensuring that timing closure is easily achieved.

Actel's Designer software is a place-and-route tool that

provides a comprehensive suite of back-end support

tools for FPGA development. The Designer software

includes the following:

• Timer – a world-class integrated static timing

analyzer and constraints editor that support

timing-driven place-and-route

• NetlistViewer – a design netlist schematic viewer

• ChipPlanner – a graphical floorplanner viewer and

editor

• SmartPower – allows the designer to quickly

estimate the power consumption of a design

• PinEditor – a graphical application for editing pin

assignments and I/O attributes

• I/O Attribute Editor – displays all assigned and

unassigned I/O macros and their attributes in a

spreadsheet format

With the Designer software, a user can lock the design

pins before layout while minimally impacting the results

of place-and-route. Additionally, Actel’s back-annotation

flow is compatible with all the major simulators. Another

tool included in the Designer software is the SmartGen

macro builder, which easily creates popular and

commonly used logic functions for implementation into

your schematic or HDL design.

Actel's Designer software is compatible with the most

popular FPGA design entry and verification tools from

EDA vendors, such as Mentor Graphics, Synplicity,

Synopsys, and Cadence Design Systems. The Designer

software is available for both the Windows and UNIX

operating systems.

ISP

The user can generate *.bit or *.stp programming files

from the Designer software and can use these files to

program a device.

ProASICPLUS devices can be programmed in-system. For

more information on ISP of ProASICPLUS devices, refer to

the In-System Programming ProASICPLUS Devices and

Performing Internal In-System Programming Using Actel’s

ProASICPLUS Devices application notes. Prior to being

programmed for the first time, the ProASICPLUS device I/Os

are in a tristate condition with the pull-up resistor option

enabled.

ProASICPLUS Flash Family FPGAs

v5.8 1-29

Related Documents

Application Notes

Efficient Use of ProASIC Clock Trees

http://www.actel.com/documents/A500K_Clocktree_AN.pdf

I/O Features in ProASICPLUS Flash FPGAs

http://www.actel.com/documents/APA_LVPECL_AN.pdf

Power-Up Behavior of ProASICPLUS Devices

http://www.actel.com/documents/APA_PowerUp_AN.pdf

ProASICPLUS PLL Dynamic Reconfiguration Using JTAG

http://www.actel.com/documents/APA_PLLdynamic_AN.pdf

Using ProASICPLUS Clock Conditioning Circuits

http://www.actel.com/documents/APA_PLL_AN.pdf

In-System Programming ProASICPLUS Devices

http://www.actel.com/documents/APA_External_ISP_AN.pdf

Performing Internal In-System Programming Using Actel’s ProASICPLUS Devices

http://www.actel.com/documents/APA_Microprocessor_AN.pdf

ProASICPLUS RAM and FIFO Blocks

http://www.actel.com/documents/APA_RAM_FIFO_AN.pdf

White Paper

Design Security in Nonvolatile Flash and Antifuse FPGAs

http://www.actel.com/documents/DesignSecurity_WP.pdf

User’s Guide

Designer User’s Guide

http://www.actel.com/documents/designer_UG.pdf

SmartGen Cores Reference Guide

http://www.actel.com/documents/gen_refguide_ug.pdf

ProASIC and ProASICPLUS Macro Library Guide

http://www.actel.com/documents/pa_libguide_UG.pdf

Additional Information

The following link contains additional information on ProASICPLUS devices.

http://www.actel.com/products/proasicplus/default.aspx

ProASICPLUS Flash Family FPGAs

1-30 v5.8

Package Thermal Characteristics

The ProASICPLUS family is available in several package

types with a range of pin counts. Actel has selected

packages based on high pin count, reliability factors, and

superior thermal characteristics.

Thermal resistance defines the ability of a package to

conduct heat away from the silicon, through the

package to the surrounding air. Junction-to-ambient

thermal resistance is measured in degrees Celsius/Watt

and is represented as Theta ja (Θja). The lower the

thermal resistance, the more efficiently a package will

dissipate heat.

A package’s maximum allowed power (P) is a function of

maximum junction temperature (TJ), maximum ambient

operating temperature (TA), and junction-to-ambient

thermal resistance Θja. Maximum junction temperature is

the maximum allowable temperature on the active

surface of the IC and is 110° C. P is defined as:

EQ 1-4

Θja is a function of the rate (in linear feet per minute

(lfpm)) of airflow in contact with the package. When the

estimated power consumption exceeds the maximum

allowed power, other means of cooling, such as

increasing the airflow rate, must be used. The maximum

power dissipation allowed for a Military temperature

device is specified as a function of Θjc. The absolute

maximum junction temperature is 150°C.

The calculation of the absolute maximum power

dissipation allowed for a Military temperature

application is illustrated in the following example for a

456-pin PBGA package:

EQ 1-5

PTJTA

–

Θja

------------------

Table 1-16 • Package Thermal Characteristics

Plastic Packages Pin Count θjc

θja

UnitsStill Air

1.0 m/s

200 ft./min.

2.5 m/s

500 ft./min.

Thin Quad Flat Pack (TQFP) 100 14.0 33.5 27.4 25.0 °C/W

Thin Quad Flat Pack (TQFP) 144 11.0 33.5 28.0 25.7 °C/W

Plastic Quad Flat Pack (PQFP)1208 8.0 26.1 22.5 20.8 °C/W

PQFP with Heat spreader2208 3.8 16.2 13.3 11.9 °C/W

Plastic Ball Grid Array (PBGA) 456 3.0 15.6 12.5 11.6 °C/W

Fine Pitch Ball Grid Array (FBGA) 144 3.8 26.9 22.9 21.5 °C/W

Fine Pitch Ball Grid Array (FBGA) 256 3.8 26.6 22.8 21.5 °C/W

Fine Pitch Ball Grid Array (FBGA)3484 3.2 18.0 14.7 13.6 °C/W

Fine Pitch Ball Grid Array (FBGA)4484 3.2 20.5 17.0 15.9 °C/W

Fine Pitch Ball Grid Array (FBGA) 676 3.2 16.4 13.0 12.0 °C/W

Fine Pitch Ball Grid Array (FBGA) 896 2.4 13.6 10.4 9.4 °C/W

Fine Pitch Ball Grid Array (FBGA) 1152 1.8 12.0 8.9 7.9 °C/W

Ceramic Quad Flat Pack (CQFP) 208 2.0 22.0 19.8 18.0 °C/W

Ceramic Quad Flat Pack (CQFP) 352 2.0 17.9 16.1 14.7 °C/W

Ceramic Column Grid Array (CCGA/LGA) 624 6.5 8.9 8.5 8.0 °C/W

Notes:

1. Valid for the following devices irrespective of temperature grade: APA075, APA150, and APA300

2. Valid for the following devices irrespective of temperature grade: APA450, APA600, APA750, and APA1000

3. Depopulated Array

4. Full array

Maximum Power Allowed Max. junction temp. (°C) Max. case temp. (°C)–

θjc(°C/W)

------------------------------------------------------------------------------------------------------------------------ 150°C 125°C–

3.0°C/W

--------------------------------------8.333W===

ProASICPLUS Flash Family FPGAs

v5.8 1-31

Calculating Typical Power Dissipation

ProASICPLUS device power is calculated with both a static and an active component. The active component is a function

of both the number of tiles utilized and the system speed. Power dissipation can be calculated using the following

formula:

Total Power Consumption—Ptotal

Ptotal = Pdc + Pac

where:

Global Clock Contribution—Pclock

Pclock, the clock component of power dissipation, is given by the piece-wise model:

for R < 15000 the model is: (P1 + (P2*R) - (P7*R2)) * Fs (lightly-loaded clock trees)

for R > 15000 the model is: (P10 + P11*R) * Fs (heavily-loaded clock trees)

where:

Storage-Tile Contribution—Pstorage

Pstorage, the storage-tile (Register) component of AC power dissipation, is given by

Pstorage = P5 * ms * Fs

where:

Pdc = 7 mW for the APA075

8 mW for the APA150

11 mW for the APA300

12 mW for the APA450

12 mW for the APA600

13 mW for the APA750

19 mW for the APA1000

Pdc includes the static components of PVDDP + PVDD + PAVDD

Pac =P

clock + Pstorage + Plogic + Poutputs + Pinputs + Ppll + Pmemory

P1 = 100 µW/MHz is the basic power consumption of the clock tree per MHz of the clock

P2 = 1.3 µW/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of the

clock

P7 = 0.00003 µW/MHz is a correction factor for partially-loaded clock trees

P10 = 6850 µW/MHz is the basic power consumption of the clock tree per MHz of the clock

P11 = 0.4 µW/MHz is the incremental power consumption of the clock tree per storage tile – also per MHz of

the clock

R =

the number of storage tiles clocked by this clock

Fs = the clock frequency

P5 = 1.1 μW/MHz is the average power consumption of a storage tile per MHz of its output toggling rate. The

maximum output toggling rate is Fs/2.

ms = the number of storage tiles (Register) switching during each Fs cycle

Fs = the clock frequency

ProASICPLUS Flash Family FPGAs

1-32 v5.8

Logic-Tile Contribution—Plogic

Plogic, the logic-tile component of AC power dissipation, is given by

Plogic = P3 * mc * Fs

where:

I/O Output Buffer Contribution—Poutputs

Poutputs, the I/O component of AC power dissipation, is given by

Poutputs = (P4 + (Cload * VDDP2)) * p * Fp

where:

I/O Input Buffer's Buffer Contribution—Pinputs

The input’s component of AC power dissipation is given by

Pinputs = P8 * q * Fq

where:

PLL Contribution—Ppll

Ppll = P9 * Npll

where:

RAM Contribution—Pmemory

Finally, Pmemory, the memory component of AC power consumption, is given by

Pmemory = P6 * Nmemory * Fmemory * Ememory

where:

P3 = 1.4 μW/MHz is the average power consumption of a logic tile per MHz of its output toggling rate. The

maximum output toggling rate is Fs/2.

mc = the number of logic tiles switching during each Fs cycle

Fs = the clock frequency

P4 = 326 μW/MHz is the intrinsic power consumption of an output pad normalized per MHz of the output

frequency. This is the total I/O current VDDP

Cload = the output load

p = the number of outputs

Fp = the average output frequency

P8 = 29 μW/MHz is the intrinsic power consumption of an input pad normalized per MHz of the input

frequency.

q = the number of inputs

Fq = the average input frequency

P9 = 7.5 mW. This value has been estimated at maximum PLL clock frequency.

NPll = number of PLLs used

P6 = 175 μW/MHz is the average power consumption of a memory block per MHz of the clock

Nmemory = the number of RAM/FIFO blocks

(1 block = 256 words * 9 bits)

Fmemory = the clock frequency of the memory

Ememory = the average number of active blocks divided by the total number of blocks (N) of the memory.

• Typical values for Ememory would be 1/4 for a 1k x 8,9,16, 32 memory and 1/16 for a 4kx8,

9, 16, and 32 memory configuration

• In addition, an application-dependent component to Ememory can be considered. For

example, for a 1kx8 memory configuration using only 1 cycle out of 2, Ememory = 1/4*1/2 = 1/8

ProASICPLUS Flash Family FPGAs

v5.8 1-33

The following is an APA750 example using a shift register design with 13,440 storage tiles (Register) and 0 logic tiles.

This design has one clock at 10 MHz, and 24 outputs toggling at 5 MHz. We then calculate the various components as

follows:

Pclock

=> Pclock = (P1 + (P2*R) - (P7*R2)) * Fs = 121.5 mW

Pstorage

=> Pstorage = P5 * ms * Fs = 147.8 mW

Plogic

=> Plogic = 0 mW

Poutputs

=> Poutputs = (P4 + (Cload * VDDP2)) * p * Fp = 91.4 mW

Pinputs

=> Pinputs = P8 * q * Fq = 0.3 mW

Pmemory

=> Pmemory = 0 mW

Pac

=> 361 mW

Ptotal

Pdc + Pac = 374 mW (typical)

Fs = 10 MHz

R = 13,440

ms = 13,440 (in a shift register 100% of storage tiles are toggling at each clock cycle and Fs = 10 MHz)

mc = 0 (no logic tiles in this shift register)

Cload = 40 pF

VDDP = 3.3 V

p=24

Fp = 5 MHz

q=1

Fq = 10 MHz

Nmemory = 0 (no RAM/FIFO blocks in this shift register)

ProASICPLUS Flash Family FPGAs

1-34 v5.8

Operating Conditions

Standard and –F parts are the same unless otherwise noted. All –F parts are only available as commercial.

Performance Retention

For devices operated and stored at 110°C or less, the

performance retention period is 20 years after

programming. For devices operated and stored at

temperatures greater than 110°C, refer to Table 1-19 on

page 1-35 to determine the performance retention

period. Actel does not guarantee performance if the

performance retention period is exceeded. Designers can

determine the performance retention period from the

following table.

Evaluate the percentage of time spent at the highest

temperature, then determine the next highest

temperature to which the device will be exposed. In

Table 1-19 on page 1-35, find the temperature profile

that most closely matches the application.

Example – the ambient temperature of a system cycles

between 100°C (25% of the time) and 50°C (75% of the

time). No forced ventilation cooling system is in use. An

APA600-PQ208M FPGA operates in the system,

dissipating 1 W. The package thermal resistance

(junction-to-ambient) in still air Θja is 20°C/W, indicating

that the junction temperature of the FPGA will be 120°C

(25% of the time) and 70°C (75% of the time). The entry

in Table 1-19 on page 1-35, which most closely matches

the application, is 25% at 125°C with 75% at 110°C.

Performance retention in this example is at least 16.0

years.

Note that exceeding the stated retention period may

result in a performance degradation in the FPGA below

the worst-case performance indicated in the Actel Timer.

To ensure that performance does not degrade below the

worst-case values in the Actel Timer, the FPGA must be

reprogrammed within the performance retention

period. In addition, note that performance retention is

independent of whether or not the FPGA is operating.

The retention period of a device in storage at a given

temperature will be the same as the retention period of

a device operating at that junction temperature.

Table 1-17 • Absolute Maximum Ratings*

Parameter Condition Minimum Maximum Units

Supply Voltage Core (VDD)–0.33.0V

Supply Voltage I/O Ring (VDDP)–0.34.0V

DC Input Voltage –0.3 VDDP + 0.3 V

PCI DC Input Voltage –1.0 VDDP + 1.0 V

PCI DC Input Clamp Current (absolute) VIN < –1 or VIN = VDDP + 1 V 10 mA

LVPECL Input Voltage –0.3 VDDP + 0.5 V

GND 00V

Note: *Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. Exposure to

absolute maximum rated conditions for extended periods may affect device reliability. Devices should not be operated outside the

Recommended Operating Conditions.

Table 1-18 • Programming, Storage, and Operating Limits

Product Grade Programming Cycles (min.) Program Retention (min.)

Storage Temperature Operating

Min. Max.

TJ Max.

Junction

Temperature

Commercial 500 20 years –55°C 110°C 110°C

Industrial 500 20 years –55°C 110°C 110°C

Military 100 Refer to Table 1-19 on page 1-35 –65°C 150°C 150°C

MIL-STD-883 100 Refer to Table 1-19 on page 1-35 –65°C 150°C 150°C

ProASICPLUS Flash Family FPGAs

v5.8 1-35

Table 1-19 • Military Temperature Grade Product Performance Retention

Minimum Time at TJ

110°C or below

Minimum Time at TJ

125°C or below

Minimum Time at TJ

135°C or below

Minimum Time at TJ

150°C or below

Minimum

Performance

Retention (Years)

100% 20.0

90% 10% 18.2

75% 25% 16

90% 10% 15.4

50% 50% 13.3

90% 10% 11.8

75% 25% 11.4

100% 10

90% 10% 9.1

50% 50% 8

75% 25% 8

90% 10% 7.7

75% 25% 7.3

50% 50% 6.7

75% 25% 5.7

100% 5

90% 10% 4.5

50% 50% 4.4

50% 50% 4

75% 25% 4

50% 50% 3.3

100% 2.5

ProASICPLUS Flash Family FPGAs

1-36 v5.8

Table 1-20 • Recommended Maximum Operating Conditions Programming and PLL Supplies

Parameter Condition

Commercial/Industrial/Military/MIL-STD-883

UnitsMinimum Maximum

VPP During Programming 15.8 16.5 V

Normal Operation1016.5V

VPN During Programming –13.8 –13.2 V

Normal Operation2–13.8 0.5 V

IPP During Programming 25 mA

IPN During Programming 10 mA

AVDD VDD VDD V

AGND GND GND V

Notes:

1. Please refer to the "VPP Programming Supply Pin" section on page 1-77 for more information.

2. Please refer to the "VPN Programming Supply Pin" section on page 1-77 for more information.

Table 1-21 • Recommended Operating Conditions

Parameter Symbol

Limits

Commercial Industrial Military/MIL-STD-883

DC Supply Voltage (2.5 V I/Os) VDD and VDDP 2.5 V ± 0.2 V 2.5 V ± 0.2 V 2.5 V ± 0.2 V

DC Supply Voltage (3.3 V I/Os) VDDP

VDD

3.3 V ± 0.3 V

2.5 V ± 0.2 V

3.3 V ± 0.3 V

2.5 V ± 0.2 V

3.3 V ± 0.3 V

2.5 V ± 0.2 V

Operating Ambient Temperature Range TA, TC0°C to 70°C –40°C to 85°C –55°C (TA) to 125°C (TC)

Maximum Operating Junction Temperature TJ110°C 110°C 150°C

Note: For I/O long-term reliability, external pull-up resistors cannot be used to increase output voltage above VDDP.

ProASICPLUS Flash Family FPGAs

v5.8 1-37

Table 1-22 • DC Electrical Specifications (VDDP = 2.5 V ±0.2V)

Symbol Parameter Conditions

Commercial/Industrial/

Military/MIL-STD-8831, 2

Min. Typ. Max. Units

VOH Output High Voltage

High Drive (OB25LPH)

Low Drive (OB25LPL)

IOH = –6 mA

IOH = –12 mA

IOH = –24 mA

IOH = –3 mA

IOH = –6 mA

IOH = –8 mA

2.1

2.0

1.7

2.1

1.9

1.7

VOL Output Low Voltage

High Drive (OB25LPH)

Low Drive (OB25LPL)

IOL = 8 mA

IOL = 15 mA

IOL = 24 mA

IOL = 4 mA

IOL = 8 mA

IOL = 15 mA

0.2

0.4

0.7

0.2

0.4

0.7

VIH6 Input High Voltage 1.7 VDDP + 0.3 V

VIL7 Input Low Voltage –0.3 0.7 V

RWEAKPULLUP Weak Pull-up Resistance

(OTB25LPU)

VIN ≥ 1.25 V 6 56 kΩ

HYST Input Hysteresis Schmitt See Table 1-4 on page 1-9 0.3 0.35 0.45 V

IIN Input Current with pull up (VIN = GND) –240 – 20 µA

without pull up (VIN = GND or VDD) –10 10 µA

IDDQ Quiescent Supply Current

(standby)

Commercial

VIN = GND4 or VDD Std. 5.0 15 mA

–F35.0 25 mA

IDDQ Quiescent Supply Current

(standby)

Industrial

VIN = GND4 or VDD Std.

5.0 20 mA

IDDQ Quiescent Supply Current

(standby)

Military/MIL-STD-883

VIN = GND4 or VDD Std.

5.0 25 mA

IOZ Tristate Output Leakage Current VOH = GND or VDD Std. –10 10 µA

–F3, 5 –10 100 µA

Notes:

1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.

2. All process conditions. Military: Junction Temperature: –55 to +150°C.

3. All –F parts are available only as commercial.

4. No pull-up resistor.

5. This will not exceed 2 mA total per device.

6. During transitions, the input signal may overshoot to VDDP +1.0V for a limited time of no larger than 10% of the duty cycle.

7. During transitions, the input signal may undershoot to -1.0V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

1-38 v5.8

IOSH Output Short Circuit Current High

High Drive (OB25LPH)

Low Drive (OB25LPL)

VIN = VSS

–120

–100

IOSL Output Short Circuit Current Low

High Drive (OB25LPH)

Low Drive (OB25LPL)

VIN = VDDP

100

CI/O I/O Pad Capacitance 10 pF

CCLK Clock Input Pad Capacitance 10 pF

Table 1-22 • DC Electrical Specifications (VDDP = 2.5 V ±0.2V) (Continued)

Symbol Parameter Conditions

Commercial/Industrial/

Military/MIL-STD-8831, 2

Min. Typ. Max. Units

Notes:

1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.

2. All process conditions. Military: Junction Temperature: –55 to +150°C.

3. All –F parts are available only as commercial.

4. No pull-up resistor.

5. This will not exceed 2 mA total per device.

6. During transitions, the input signal may overshoot to VDDP +1.0V for a limited time of no larger than 10% of the duty cycle.

7. During transitions, the input signal may undershoot to -1.0V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

v5.8 1-39

Table 1-23 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)

Applies to Commercial and Industrial Temperature Only

Symbol Parameter Conditions

Commercial/Industrial1

UnitsMin. Typ. Max.

VOH Output High Voltage

3.3 V I/O, High Drive (OB33P)

3.3 V I/O, Low Drive (OB33L)

IOH = –14 mA

IOH = –24 mA

IOH = –6 mA

IOH = –12 mA

0.9∗VDDP

2.4

0.9∗VDDP

2.4

VOL Output Low Voltage

3.3 V I/O, High Drive (OB33P)

3.3 V I/O, Low Drive (OB33L)

IOL = 15 mA

IOL = 20 mA

IOL = 28 mA

IOL = 7 mA

IOL = 10 mA

IOL = 15 mA

0.1VDDP

0.4

0.7

0.1VDDP

0.4

0.7

VIH5Input High Voltage

3.3 V Schmitt Trigger Inputs

3.3 V LVTTL/LVCMOS

2.5 V Mode

1.6

1.7

VDDP + 0.3

VIL6Input Low Voltage

3.3 V Schmitt Trigger Inputs

3.3 V LVTTL/LVCMOS

2.5 V Mode

–0.3

0.8

0.7

RWEAKPULLUP Weak Pull-up Resistance

(IOB33U)

VIN ≥ 1.5 V 7 43 kΩ

RWEAKPULLUP Weak Pull-up Resistance

(IOB25U)

VIN ≥ 1.5 V 7 43 kΩ

IIN Input Current with pull up (VIN = GND) –300 –40 µA

without pull up (VIN = GND or VDD) –10 10 µA

IDDQ Quiescent Supply Current

(standby)

Commercial

VIN = GND3 or VDD Std. 5.015mA

–F25.0 25 mA

IDDQ Quiescent Supply Current

(standby)

Industrial

VIN = GND3 or VDD

Std. 5.0 20 mA

IDDQ Quiescent Supply Current

(standby)

Military

VIN = GND3 or VDD

Std. 5.0 25 mA

Notes:

1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.

2. All –F parts are only available as commercial.

3. No pull-up resistor required.

4. This will not exceed 2 mA total per device.

5. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle.

6. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

1-40 v5.8

IOZ Tristate Output Leakage

Current

VOH = GND or VDD Std. –10 10 µA

–F2, 4 –10 100 µA

IOSH Output Short Circuit Current

High

3.3 V High Drive (OB33P)

3.3 V Low Drive (OB33L)

VIN = GND

–200

–100

IOSL Output Short Circuit Current

Low

3.3 V High Drive

3.3 V Low Drive

VIN = VDD

200

100

CI/O I/O Pad Capacitance 10 pF

CCLK Clock Input Pad Capacitance 10 pF

Table 1-23 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) (Continued)

Applies to Commercial and Industrial Temperature Only

Symbol Parameter Conditions

Commercial/Industrial1

UnitsMin. Typ. Max.

Notes:

1. All process conditions. Commercial/Industrial: Junction Temperature: –40 to +110°C.

2. All –F parts are only available as commercial.

3. No pull-up resistor required.

4. This will not exceed 2 mA total per device.

5. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle.

6. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

v5.8 1-41

Table 1-24 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V)

Applies to Military Temperature and MIL-STD-883B Temperature Only

Symbol Parameter Conditions

Military/MIL-STD-883B1

UnitsMin. Typ. Max.

VOH Output High Voltage

3.3 V I/O, High Drive, High Slew

(OB33PH)

3.3V I/O, High Drive, Normal/

Low Slew (OB33PN/OB33PL)

3.3 V I/O, Low Drive , High/

Normal/Low Slew (OB33LH/

OB33LN/OB33LL)

IOH = –8 mA

IOH = –16 mA

IOH = –3mA

IOH = –8mA

IOH = –3 mA

IOH = –8 mA

0.9∗VDDP

2.4

0.9∗VDDP

2.4

0.9∗VDDP

2.4

VOL Output Low Voltage

3.3 V I/O, High Drive, High Slew

(OB33PH)

3.3V I/O, High Drive, Normal/

Low Slew (OB33PN/OB33PL))

3.3 V I/O, Low Drive, High/

Normal/Low Slew (OB33LH/

OB33LN/OB33LL)

IOL = 12 mA

IOL = 17 mA

IOL = 28 mA

IOL = 4 mA

IOL = 6 mA

IOL = 13 mA

IOL = 4 mA

IOL = 6 mA

IOL = 13 mA

0.1VDDP

0.4

0.7

0.1VDDP

0.4

0.7

0.1VDDP

0.4

0.7

VIH4Input High Voltage

3.3 V Schmitt Trigger Inputs

3.3 V LVTTL/LVCMOS

2.5 V Mode

1.6

1.7

VDDP + 0.3

VIL5Input Low Voltage

3.3 V Schmitt Trigger Inputs

3.3 V LVTTL/LVCMOS

2.5 V Mode

–0.3

0.7

0.8

0.7

RWEAKPULLUP Weak Pull-up Resistance

(IOB33U)

VIN ≥ 1.5 V 7 43 kΩ

RWEAKPULLUP Weak Pull-up Resistance

(IOB25U)

VIN ≥ 1.5 V 7 43 kΩ

IIN Input Current with pull up (VIN = GND) –300 –40 µA

without pull up (VIN = GND or VDD) –10 10 µA

IDDQ Quiescent Supply Current

(standby)

Commercial

VIN = GND2 or VDD Std. 5.015mA

–F 5.0 25 mA

Notes:

1. All process conditions. Military Temperature / MIL-STD-883 Class B: Junction Temperature: –55 to +125°C.

2. No pull-up resistor required.

3. This will not exceed 2 mA total per device.

4. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle.

5. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

1-42 v5.8

IDDQ Quiescent Supply Current

(standby)

Industrial

VIN = GND2 or VDD

Std. 5.0 20 mA

IDDQ Quiescent Supply Current

(standby)

Military

VIN = GND2 or VDD

Std. 5.0 25 mA

IOZ Tristate Output Leakage

Current

VOH = GND or VDD Std. –10 10 µA

–F3–10 100 µA

IOSH Output Short Circuit Current

High

3.3 V High Drive (OB33P)

3.3 V Low Drive (OB33L)

VIN = GND

–200

–100

IOSL Output Short Circuit Current

Low

3.3 V High Drive

3.3 V Low Drive

VIN = VDD

200

100

CI/O I/O Pad Capacitance 10 pF

CCLK Clock Input Pad Capacitance 10 pF

Table 1-24 • DC Electrical Specifications (VDDP = 3.3 V ±0.3 V and VDD = 2.5 V ±0.2 V) (Continued)

Applies to Military Temperature and MIL-STD-883B Temperature Only

Symbol Parameter Conditions

Military/MIL-STD-883B1

UnitsMin. Typ. Max.

Notes:

1. All process conditions. Military Temperature / MIL-STD-883 Class B: Junction Temperature: –55 to +125°C.

2. No pull-up resistor required.

3. This will not exceed 2 mA total per device.

4. During transitions, the input signal may overshoot to VDDP +1.0 V for a limited time of no larger than 10% of the duty cycle.

5. During transitions, the input signal may undershoot to –1.0 V for a limited time of no larger than 10% of the duty cycle.

ProASICPLUS Flash Family FPGAs

v5.8 1-43

Table 1-25 • DC Specifications (3.3 V PCI Operation)1

Symbol Parameter Condition

Commercial/

Industrial2,3 Military/MIL-STD- 8832,3

UnitsMin. Max. Min. Max.

VDD Supply Voltage for Core 2.3 2.7 2.3 2.7 V

VDDP Supply Voltage for I/O Ring 3.0 3.6 3.0 3.6 V

VIH Input High Voltage 0.5VDDP VDDP + 0.5 0.5VDDP VDDP + 0.5 V

VIL Input Low Voltage –0.5 0.3VDDP –0.5 0.3VDDP V

IIPU Input Pull-up Voltage40.7VDDP 0.7VDDP V

IIL Input Leakage Current50 < VIN < VDDP Std. –10 10 –50 50 μA

–F3, 6–10 100 μA

VOH Output High Voltage IOUT = –500 µA 0.9VDDP 0.9VDDP V

VOL Output Low Voltage IOUT = 1500 µA 0.1VDDP 0.1VDDP V

CIN Input Pin Capacitance (except CLK) 10 10 pF

CCLK CLK Pin Capacitance 5 12 5 12 pF

Notes:

1. For PCI operation, use GL33, OTB33PH, OB33PH, IOB33PH, IB33, or IB33S macro library cell only.

2. All process conditions. Junction Temperature: –40 to +110°C for Commercial and Industrial devices and –55 to +125°C for Military.

3. All –F parts are available as commercial only.

4. This specification is guaranteed by design. It is the minimum voltage to which pull-up resistors are calculated to pull a floated

network. Designers with applications sensitive to static power utilization should ensure that the input buffer is conducting minimum

current at this input voltage.

5. Input leakage currents include hi-Z output leakage for all bidirectional buffers with tristate outputs.

6. The sum of the leakage currents for all inputs shall not exceed 2mA per device.

ProASICPLUS Flash Family FPGAs

1-44 v5.8

Table 1-26 • AC Specifications (3.3 V PCI Revision 2.2 Operation)

Symbol Parameter Condition

Commercial/Industrial/Military/MIL-STD- 883

UnitsMin. Max.

IOH(AC) Switching Current High 0 < VOUT ≤ 0.3VDDP*–12VDDP mA

0.3VDDP ≤ VOUT < 0.9VDDP*(–17.1 + (VDDP – VOUT)) mA

0.7VDDP < VOUT < VDDP*See equation C – page 124 of

the PCI Specification

document rev. 2.2

(Test Point) VOUT = 0.7VDDP*–32VDDP mA

IOL(AC) Switching Current Low VDDP > VOUT ≥ 0.6VDDP*16VDDP mA

0.6VDDP > VOUT > 0.1VDDP 1(26.7VOUT)mA

0.18VDDP > VOUT > 0*See equation D – page 124 of

the PCI Specification

document rev. 2.2

(Test Point) VOUT = 0.18VDDP 38VDDP mA

ICL Low Clamp Current –3 < VIN ≤ –1 –25 + (VIN + 1)/0.015 mA

ICH High Clamp Current VDDP + 4 > VIN ≥ VDDP + 1 25 + (VIN – VDDP – 1)/0.015 mA

slewROutput Rise Slew Rate 0.2VDDP to 0.6VDDP load*14V/ns

slewFOutput Fall Slew Rate 0.6VDDP to 0.2VDDP load*14V/ns

Note: * Refer to the PCI Specification document rev. 2.2.

output

buffer

1/2 in. max

10 pF

1kΩ

output

buffer 10 pF

1kΩ

Pad Loading Applicable to the Rising Edge PCI

Pad Loading Applicable to the Falling Edge PCI

ProASICPLUS Flash Family FPGAs

v5.8 1-45

Tristate Buffer Delays

Figure 1-26 • Tristate Buffer Delays

Table 1-27 • Worst-Case Commercial Conditions

VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C

Macro Type Description

Max

tDLH1Max

tDHL2Max

tENZH3Max

tENZL4

UnitsStd. –F Std. –F Std. –F Std. –F

OTB33PH 3.3 V, PCI Output Current, High Slew Rate 2.0 2.4 2.2 2.6 2.2 2.6 2.0 2.4 ns

OTB33PN 3.3 V, High Output Current, Nominal Slew Rate 2.2 2.6 2.9 3.5 2.4 2.9 2.1 2.5 ns

OTB33PL 3.3 V, High Output Current, Low Slew Rate 2.5 3.0 3.2 3.9 2.7 3.3 2.8 3.4 ns

OTB33LH 3.3 V, Low Output Current, High Slew Rate 2.6 3.1 4.0 4.8 2.8 3.4 3.0 3.6 ns

OTB33LN 3.3 V, Low Output Current, Nominal Slew Rate 2.9 3.5 4.3 5.2 3.2 3.8 4.1 4.9 ns

OTB33LL 3.3 V, Low Output Current, Low Slew Rate 3.0 3.6 5.6 6.7 3.3 3.9 5.5 6.6 ns

Notes:

1. tDLH=Data-to-Pad High

2. tDHL=Data-to-Pad Low

3. tENZH=Enable-to-Pad, Z to High

4. tENZL = Enable-to-Pad, Z to Low

5. All –F parts are only available as commercial.

Table 1-28 • Worst-Case Commercial Conditions

VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C

Macro Type Description

Max

tDLH1Max

tDHL2Max

tENZH3Max

tENZL4

UnitsStd. –F Std. –F Std. –F Std. –F

OTB25LPHH 2.5 V, Low Power, High Output Current, High Slew Rate52.0 2.4 2.1 2.5 2.3 2.7 2.0 2.4 ns

OTB25LPHN 2.5 V, Low Power, High Output Current, Nominal Slew Rate52.4 2.9 3.0 3.6 2.7 3.2 2.1 2.5 ns

OTB25LPHL 2.5 V, Low Power, High Output Current, Low Slew Rate52.9 3.5 3.2 3.8 3.1 3.8 2.7 3.2 ns

OTB25LPLH 2.5 V, Low Power, Low Output Current, High Slew Rate52.7 3.3 4.6 5.5 3.0 3.6 2.6 3.1 ns

Notes:

1. tDLH=Data-to-Pad High

2. tDHL=Data-to-Pad Low

3. tENZH=Enable-to-Pad, Z to High

4. tENZL = Enable-to-Pad, Z to Low

5. Low power I/O work with VDDP=2.5 V ±10% only. VDDP=2.3 V for delays.

6. All –F parts are only available as commercial.

PAD

OTBx

A50%

PAD

50%

DLH

50%

DHL

EN 50%

PAD

50%

ENZL

50%

10%

EN 50%

PAD

GND

50%

ENZH

50%

90%

DDP

35pF

ProASICPLUS Flash Family FPGAs

1-46 v5.8

OTB25LPLN 2.5 V, Low Power, Low Output Current, Nominal Slew Rate53.5 4.2 4.2 5.1 3.8 4.5 3.8 4.6 ns

OTB25LPLL 2.5 V, Low Power, Low Output Current, Low Slew Rate54.0 4.8 5.3 6.4 4.2 5.1 5.1 6.1 ns

Table 1-29 • Worst-Case Military Conditions

VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max

tDLH1Max

tDHL2Max

tENZH3Max

tENZL4

UnitsStd. Std. Std. Std.

OTB33PH 3.3 V, PCI Output Current, High Slew Rate 2.2 2.4 2.3 2.1 ns

OTB33PN 3.3 V, High Output Current, Nominal Slew Rate 2.4 3.2 2.7 2.3 ns

OTB33PL 3.3 V, High Output Current, Low Slew Rate 2.7 3.5 2.9 3.0 ns

OTB33LH 3.3 V, Low Output Current, High Slew Rate 2.7 4.3 3.0 3.1 ns

OTB33LN 3.3 V, Low Output Current, Nominal Slew Rate 3.3 4.7 3.4 4.4 ns

OTB33LL 3.3 V, Low Output Current, Low Slew Rate 3.2 6.0 3.5 5.9 ns

Notes:

1. tDLH=Data-to-Pad High

2. tDHL=Data-to-Pad Low

3. tENZH=Enable-to-Pad, Z to High

4. tENZL = Enable-to-Pad, Z to Low

Table 1-30 • Worst-Case Military Conditions

VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max

tDLH1Max

tDHL2Max

tENZH3Max

tENZL4

UnitsStd. Std. Std. Std.

OTB25LPHH 2.5 V, Low Power, High Output Current, High Slew Rate52.3 2.3 2.4 2.1 ns

OTB25LPHN 2.5 V, Low Power, High Output Current, Nominal Slew

Rate5

2.7 3.2 2.8 2.1 ns

OTB25LPHL 2.5 V, Low Power, High Output Current, Low Slew Rate53.2 3.5 3.3 2.8 ns

OTB25LPLH 2.5 V, Low Power, Low Output Current, High Slew Rate53.0 5.0 3.2 2.8 ns

OTB25LPLN 2.5 V, Low Power, Low Output Current, Nominal Slew Rate53.7 4.5 4.1 4.1 ns

OTB25LPLL 2.5 V, Low Power, Low Output Current, Low Slew Rate54.4 5.8 4.4 5.4 ns

Notes:

1. tDLH=Data-to-Pad High

2. tDHL=Data-to-Pad Low

3. tENZH=Enable-to-Pad, Z to High

4. tENZL = Enable-to-Pad, Z to Low

5. Low power I/O work with VDDP=2.5V ±10% only. VDDP=2.3V for delays.

Table 1-28 • Worst-Case Commercial Conditions

VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C

Macro Type Description

Max

tDLH1Max

tDHL2Max

tENZH3Max

tENZL4

UnitsStd. –F Std. –F Std. –F Std. –F

Notes:

1. tDLH=Data-to-Pad High

2. tDHL=Data-to-Pad Low

3. tENZH=Enable-to-Pad, Z to High

4. tENZL = Enable-to-Pad, Z to Low

5. Low power I/O work with VDDP=2.5 V ±10% only. VDDP=2.3 V for delays.

6. All –F parts are only available as commercial.

ProASICPLUS Flash Family FPGAs

v5.8 1-47

Output Buffer Delays

Figure 1-27 • Output Buffer Delays

Table 1-31 • Worst-Case Commercial Conditions

VDDP = 3.0 V, VDD = 2.3 V, 35 pF load, TJ = 70°C

Macro Type Description

Max tDLH1Max tDHL2

UnitsStd. –F Std. –F

OB33PH 3.3 V, PCI Output Current, High Slew Rate 2.0 2.4 2.2 2.6 ns

OB33PN 3.3 V, High Output Current, Nominal Slew Rate 2.2 2.6 2.9 3.5 ns

OB33PL 3.3 V, High Output Current, Low Slew Rate 2.5 3.0 3.2 3.9 ns

OB33LH 3.3 V, Low Output Current, High Slew Rate 2.6 3.1 4.0 4.8 ns

OB33LN 3.3 V, Low Output Current, Nominal Slew Rate 2.9 3.5 4.3 5.2 ns

OB33LL 3.3 V, Low Output Current, Low Slew Rate 3.0 3.6 5.6 6.7 ns

Notes:

1. tDLH = Data-to-Pad High

2. tDHL = Data-to-Pad Low

3. All –F parts are only available as commercial.

Table 1-32 • Worst-Case Commercial Conditions

VDDP = 2.3 V, VDD = 2.3 V, 35 pF load, TJ = 70°C

Macro Type Description

Max tDLH1Max tDHL2

UnitsStd. –F Std. –F

OB25LPHH 2.5 V, Low Power, High Output Current, High Slew Rate32.0 2.4 2.1 2.6 ns

OB25LPHN 2.5 V, Low Power, High Output Current, Nominal Slew Rate32.4 2.9 3.0 3.6 ns

OB25LPHL 2.5 V, Low Power, High Output Current, Low Slew Rate32.9 3.5 3.2 3.8 ns

OB25LPLH 2.5 V, Low Power, Low Output Current, High Slew Rate32.7 3.3 4.6 5.5 ns

OB25LPLN 2.5 V, Low Power, Low Output Current, Nominal Slew Rate33.5 4.2 4.2 5.1 ns

OB25LPLL 2.5 V, Low Power, Low Output Current, Low Slew Rate34.0 4.8 5.3 6.4 ns

Notes:

1. tDLH = Data-to-Pad High

2. tDHL = Data-to-Pad Low

3. Low-power I/Os work with VDDP=2.5 V ±10% only. VDDP=2.3 V for delays.

4. All –F parts are only available as commercial.

PAD

A50%

PAD

50%

DLH

50%

DHL

35pF

OBx

ProASICPLUS Flash Family FPGAs

1-48 v5.8

Table 1-33 • Worst-Case Military Conditions

VDDP = 3.0V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max.

tDLH1Max.

tDHL2

UnitsStd. Std.

OB33PH 3.3V, PCI Output Current, High Slew Rate 2.1 2.3 ns

OB33PN 3.3V, High Output Current, Nominal Slew Rate 2.5 3.2 ns

OB33PL 3.3V, High Output Current, Low Slew Rate 2.7 3.5 ns

OB33LH 3.3V, Low Output Current, High Slew Rate 2.7 4.3 ns

OB33LN 3.3V, Low Output Current, Nominal Slew Rate 3.3 4.7 ns

OB33LL 3.3V, Low Output Current, Low Slew Rate 3.3 6.1 ns

Notes:

1. tDLH = Data-to-Pad High

2. tDHL = Data-to-Pad Low

Table 1-34 • Worst-Case Military Conditions

VDDP = 2.3 V, VDD = 2.3V, 35 pF load, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max.

tDLH1Max.

tDHL2

UnitsStd. Std.

OB25LPHH 2.5V, Low Power, High Output Current, High Slew Rate32.3 2.4 ns

OB25LPHN 2.5V, Low Power, High Output Current, Nominal Slew Rate32.7 3.3 ns

OB25LPHL 2.5V, Low Power, High Output Current, Low Slew Rate33.2 3.5 ns

OB25LPLH 2.5V, Low Power, Low Output Current, High Slew Rate33.0 5.0 ns

OB25LPLN 2.5V, Low Power, Low Output Current, Nominal Slew Rate33.9 4.6 ns

OB25LPLL 2.5V, Low Power, Low Output Current, Low Slew Rate34.3 5.7 ns

Notes:

1. tDLH = Data-to-Pad High

2. tDHL = Data-to-Pad Low

3. Low power I/O work with VDDP=2.5V ±10% only. VDDP=2.3V for delays.

ProASICPLUS Flash Family FPGAs

v5.8 1-49

Input Buffer Delays

Figure 1-28 • Input Buffer Delays

Table 1-35 • Worst-Case Commercial Conditions

VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C

Macro Type Description

Max. tINYH1 Max. tINYL2

UnitsStd. –F Std. –F

IB33 3.3 V, CMOS Input Levels3, No Pull-up Resistor 0.4 0.5 0.6 0.7 ns

IB33S 3.3 V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger 0.6 0.7 0.8 0.9 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3 V for delays.

5. All –F parts are only available as commercial.

Table 1-36 • Worst-Case Commercial Conditions

VDDP = 2.3 V, VDD = 2.3 V, TJ = 70°C

Macro Type Description

Max. tINYH1 Max. tINYL2

UnitsStd. –F Std. –F

IB25LP 2.5 V, CMOS Input Levels3, Low Power 0.9 1.1 0.6 0.8 ns

IB25LPS 2.5 V, CMOS Input Levels3, Low Power, Schmitt Trigger 0.7 0.9 0.9 1.1 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3 V for delays.

5. All –F parts are only available as commercial.

PAD Y

PAD

DDP

0 V

50%

GND

50%

INYH

50%

IN YL

IBx

ProASICPLUS Flash Family FPGAs

1-50 v5.8

Table 1-37 • Worst-Case Military Conditions

VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max. tINYH1 Max. tINYL2

UnitsStd. Std.

IB33 3.3V, CMOS Input Levels3, No Pull-up Resistor 0.5 0.6 ns

IB33S 3.3V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger 0.6 0.8 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3V for delays.

Table 1-38 • Worst-Case Military Conditions

VDDP = 2.3V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max. tINYH1 Max. tINYL2

UnitsStd. Std.

IB25LP 2.5V, CMOS Input Levels3, Low Power 0.9 0.7 ns

IB25LPS 2.5V, CMOS Input Levels3, Low Power, Schmitt Trigger 0.8 1.0 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3V for delays.

ProASICPLUS Flash Family FPGAs

v5.8 1-51

Global Input Buffer Delays

Table 1-39 • Worst-Case Commercial Conditions

VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C

Macro Type Description

Max. tINYH1 Max. tINYL2 Units

Std.3–F Std.3–F

GL33 3.3 V, CMOS Input Levels4, No Pull-up Resistor 1.0 1.2 1.1 1.3 ns

GL33S 3.3 V, CMOS Input Levels4, No Pull-up Resistor, Schmitt Trigger 1.0 1.2 1.1 1.3 ns

PECL PPECL Input Levels 1.0 1.2 1.1 1.3 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. Applies to Military ProASICPLUS devices.

4. LVTTL delays are the same as CMOS delays.

5. For LP Macros, VDDP=2.3 V for delays.

6. All –F parts are only available as commercial.

Table 1-40 • Worst-Case Commercial Conditions

VDDP = 2.3 V, VDD = 2.3 V, TJ = 70°C

Macro Type Description

Max. tINYH1 Max. tINYL2 Units

Std.3–F Std.3–F

GL25LP 2.5 V, CMOS Input Levels4, Low Power 1.1 1.2 1.0 1.3 ns

GL25LPS 2.5 V, CMOS Input Levels4, Low Power, Schmitt Trigger 1.3 1.6 1.0 1.1 ns

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. Applies to Military ProASICPLUS devices.

4. LVTTL delays are the same as CMOS delays.

5. For LP Macros, VDDP=2.3 V for delays.

6. All –F parts are only available as commercial.

ProASICPLUS Flash Family FPGAs

1-52 v5.8

Table 1-41 • Worst-Case Military Conditions

VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max. tINYH1 Max. tINYL2

Std. Std.

GL33 3.3V, CMOS Input Levels3, No Pull-up Resistor 1.1 1.1

GL33S 3.3V, CMOS Input Levels3, No Pull-up Resistor, Schmitt Trigger 1.1 1.1

PECL PPECL Input Levels 1.1 1.1

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3V for delays.

Table 1-42 • Worst-Case Military Conditions

VDDP = 2.3V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Macro Type Description

Max. tINYH1 Max. tINYL2

Std. Std.

GL25LP 2.5V, CMOS Input Levels3, Low Power 1.0 1.1

GL25LPS 2.5V, CMOS Input Levels3, Low Power, Schmitt Trigger 1.4 1.0

Notes:

1. tINYH = Input Pad-to-Y High

2. tINYL = Input Pad-to-Y Low

3. LVTTL delays are the same as CMOS delays.

4. For LP Macros, VDDP=2.3V for delays.

ProASICPLUS Flash Family FPGAs

v5.8 1-53

Predicted Global Routing Delay

Global Routing Skew

Table 1-43 • Worst-Case Commercial Conditions1

VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C

Parameter Description

Max.

UnitsStd. –F2

tRCKH Input Low to High31.1 1.3 ns

tRCKL Input High to Low31.0 1.2 ns

tRCKH Input Low to High40.8 1.0 ns

tRCKL Input High to Low40.8 1.0 ns

Notes:

1. The timing delay difference between tile locations is less than 15ps.

2. All –F parts are only available as commercial.

3. Highly loaded row 50%.

4. Minimally loaded row.

Table 1-44 • Worst-Case Military Conditions

VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Parameter Description Max. Units

tRCKH Input Low to High (high loaded row of 50%) 1.1 ns

tRCKL Input High to Low (high loaded row of 50%) 1.0 ns

tRCKH Input Low to High (minimally loaded row) 0.8 ns

tRCKL Input High to Low (minimally loaded row) 0.8 ns

Note: * The timing delay difference between tile locations is less than 15 ps.

Table 1-45 • Worst-Case Commercial Conditions

VDDP = 3.0 V, VDD = 2.3 V, TJ = 70°C

Parameter Description

Max.

UnitsStd. –F*

tRCKSWH Maximum Skew Low to High 270 320 ps

tRCKSHH Maximum Skew High to Low 270 320 ps

Note: *All –F parts are only available as commercial.

Table 1-46 • Worst-Case Commercial Conditions

VDDP = 3.0V, VDD = 2.3V, TJ = 125°C for Military/MIL-STD-883

Parameter Description Max. Units

tRCKSWH Maximum Skew Low to High 270 ps

tRCKSHH Maximum Skew High to Low 270 ps

ProASICPLUS Flash Family FPGAs

1-54 v5.8

Module Delays

Sample Macrocell Library Listing

Figure 1-29 • Module Delays

Table 1-47 • Worst-Case Military Conditions1

VDD = 2.3 V, TJ = 70º C, TJ = 70°C, TJ = 125°C for Military/MIL-STD-883

Cell Name Description

Std. –F2

Max Min Max Min Units

NAND2 2-Input NAND 0.5 0.6 ns

AND2 2-Input AND 0.7 0.8 ns

NOR3 3-Input NOR 0.8 1.0 ns

MUX2L 2-1 MUX with Active Low Select 0.5 0.6 ns

OA21 2-Input OR into a 2-Input AND 0.8 1.0 ns

XOR2 2-Input Exclusive OR 0.6 0.8 ns

LDL Active Low Latch (LH/HL)

LH30.9 1.1

CLK-Q HL30.8 0.9 ns

tsetup 0.7 0.8 ns

thold 0.1 0.2 ns

DFFL Negative Edge-Triggered D-type Flip-Flop (LH/HL)

CLK-Q

LH30.9 1.1

HL30.8 1.0 ns

tsetup 0.6 0.7 ns

thold 0.0 0.0 ns

Notes:

1. Intrinsic delays have a variable component, coupled to the input slope of the signal. These numbers assume an input slope typical of

local interconnect.

2. All –F parts are only available as commercial.

3. LH and HL refer to the Q transitions from Low to High and High to Low, respectively.

50%

50%50%

50% 50%

DALH

C50%50%

50%

DBLH

DAHL DBHL

DCHL

DCLH

50%

ProASICPLUS Flash Family FPGAs

v5.8 1-55

Table 1-48 • Recommended Operating Conditions

Parameter Symbol

Limits

Commercial/Industrial Military/MIL-STD-883

Maximum Clock Frequency* fCLOCK 180 MHz 180 MHz

Maximum RAM Frequency* fRAM 150 MHz 150 MHz

Maximum Rise/Fall Time on Inputs*

• Schmitt Trigger Mode (10% to 90%)

• Non-Schmitt Trigger Mode (10% to

90%)

tR/tF

N/A

100 ns

10 ns

Maximum LVPECL Frequency* 180 MHz 180 MHz

Maximum TCK Frequency (JTAG) fTCK 10 MHz 10 MHz

Note: *All –F parts will be 20% slower than standard commercial devices.

Table 1-49 • Slew Rates Measured at C = 30pF, Nominal Power Supplies and 25°C

Type Trig. Level Rising Edge (ns) Slew Rate (V/ns) Falling Edge (ns) Slew Rate (V/ns) PCI Mode

OB33PH 10%-90% 1.60 1.65 1.65 1.60 Yes

OB33PN 10%-90% 1.57 1.68 3.32 0.80 No

OB33PL 10%-90% 1.57 1.68 1.99 1.32 No

OB33LH 10%-90% 3.80 0.70 4.84 0.55 No

OB33LN 10%-90% 4.19 0.63 3.37 0.78 No

OB33LL 10%-90% 5.49 0.48 2.98 0.89 No

OB25LPHH 10%-90% 1.55 1.29 1.56 1.28 No

OB25LPHN 10%-90% 1.70 1.18 2.08 0.96 No

OB25LPHL 10%-90% 1.97 1.02 2.09 0.96 No

OB25LPLH 10%-90% 3.57 0.56 3.93 0.51 No

OB25LPLN 10%-90% 4.65 0.43 3.28 0.61 No

OB25LPLL 10%-90% 5.52 0.36 3.44 0.58 No

Notes:

1. Standard and –F parts.

2. All –F only available as commercial.

ProASICPLUS Flash Family FPGAs

1-56 v5.8

Table 1-50 • JTAG Switching Characteristics

Description Symbol Min Max Unit

Output delay from TCK falling to TDI, TMS tTCKTDI –4 4 ns

TDO Setup time before TCK rising tTDOTCK 10 ns

TDO Hold time after TCK rising tTCKTDO 0 ns

TCK period tTCK 100 21,000 ns

RCK period tRCK 100 1,000 ns

Notes:

1. For DC electrical specifications of the JTAG pins (TCK, TDI, TMS, TDO, TRST), refer to Table 1-22 on page 1-37 when VDDP = 2.5 V

and Table 1-24 on page 1-41 when VDDP = 3.3 V.

2. If RCK is being used, there is no minimum on the TCK period.

Figure 1-30 • JTAG Operation Timing

TCK

TMS, TDI

TDO

tTCK

tTCKTDI

tTCKTDO

tTDOTCK

ProASICPLUS Flash Family FPGAs

v5.8 1-57

Embedded Memory Specifications

This section discusses ProASICPLUS SRAM/FIFO embedded

memory and its interface signals, including timing

diagrams that show the relationships of signals as they

pertain to single embedded memory blocks (Table 1-51).

Table 1-13 on page 1-24 shows basic SRAM and FIFO

configurations. Simultaneous read and write to the same

location must be done with care. On such accesses the DI

bus is output to the DO bus. Refer to the ProASICPLUS

RAM and FIFO Blocks application note for more

information.

Enclosed Timing Diagrams—SRAM Mode:

•"Synchronous SRAM Read, Access Timed Output

Strobe (Synchronous Transparent)" section on

page 1-58

•"Synchronous SRAM Read, Pipeline Mode Outputs

(Synchronous Pipelined)" section on page 1-59

•"Asynchronous SRAM Write" section on page 1-60

•"Asynchronous SRAM Read, Address Controlled,

RDB=0" section on page 1-61

•"Asynchronous SRAM Read, RDB Controlled"

section on page 1-62

•"Synchronous SRAM Write"

• Embedded Memory Specifications

The difference between synchronous transparent and

pipeline modes is the timing of all the output signals

from the memory. In transparent mode, the outputs will

change within the same clock cycle to reflect the data

requested by the currently valid access to the memory. If

clock cycles are short (high clock speed), the data

requires most of the clock cycle to change to valid values

(stable signals). Processing of this data in the same clock

cycle is nearly impossible. Most designers add registers at

all outputs of the memory to push the data processing

into the next clock cycle. An entire clock cycle can then

be used to process the data. To simplify use of this

memory setup, suitable registers have been

implemented as part of the memory primitive and are

available to the user in the synchronous pipeline mode.

In this mode, the output signals will change shortly after

the second rising edge, following the initiation of the

read access.

Table 1-51 • Memory Block SRAM Interface Signals

SRAM Signal Bits In/Out Description

WCLKS 1 In Write clock used on synchronization on write side

RCLKS 1 In Read clock used on synchronization on read side

RADDR<0:7> 8 In Read address

RBLKB 1 In True read block select (active Low)

RDB 1 In True read pulse (active Low)

WADDR<0:7> 8 In Write address

WBLKB 1 In Write block select (active Low)

DI<0:8> 9 In Input data bits <0:8>, <8> can be used for parity In

WRB 1 In Negative true write pulse

DO<0:8> 9 Out Output data bits <0:8>, <8> can be used for parity Out

RPE 1 Out Read parity error (active High)

WPE 1 Out Write parity error (active High)

PARODD 1 In Selects Odd parity generation/detect when high, Even when low

Note: Not all signals shown are used in all modes.

ProASICPLUS Flash Family FPGAs

1-58 v5.8

Synchronous SRAM Read, Access Timed Output Strobe (Synchronous Transparent)

Note: The plot shows the normal operation status.

Figure 1-31 • Synchronous SRAM Read, Access Timed Output Strobe (Synchronous Transparent)

Table 1-52 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

OCA New DO access from RCLKS ↑ 7.5 ns

OCH Old DO valid from RCLKS ↑ 3.0 ns

RACH RADDR hold from RCLKS ↑ 0.5 ns

RACS RADDR setup to RCLKS ↑ 1.0 ns

RDCH RDB hold from RCLKS ↑ 0.5 ns

RDCS RDB setup to RCLKS ↑ 1.0 ns

RPCA New RPE access from RCLKS ↑ 9.5 ns

RPCH Old RPE valid from RCLKS ↑ 3.0 ns

Note: All –F speed grade devices are 20% slower than the standard numbers.

RADDR

RPE

RCLKS

RBD, RBLKB

New Valid Data Out

Cycle Start

Old Data Out

New Valid

Address

tRACS

tRDCS

tRDCH

tRACH

tOCH

tRPCH

tCMH

tOCA

tRPCA

tCCYC

tCML

ProASICPLUS Flash Family FPGAs

v5.8 1-59

Synchronous SRAM Read, Pipeline Mode Outputs (Synchronous Pipelined)

Note: The plot shows the normal operation status.

Figure 1-32 • Synchronous SRAM Read, Pipeline Mode Outputs (Synchronous Pipelined)

Table 1-53 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = 0°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

OCA New DO access from RCLKS ↑ 2.0 ns

OCH Old DO valid from RCLKS ↑ 0.75 ns

RACH RADDR hold from RCLKS ↑ 0.5 ns

RACS RADDR setup to RCLKS ↑ 1.0 ns

RDCH RDB hold from RCLKS ↑ 0.5 ns

RDCS RDB setup to RCLKS ↑ 1.0 ns

RPCA New RPE access from RCLKS ↑ 4.0 ns

RPCH Old RPE valid from RCLKS ↑ 1.0 ns

Note: All –F speed grade devices are 20% slower than the standard numbers.

RCLKS

RPE

DO New Valid Data Out

Cycle Start

New RPE Out

RADDR New Valid

Address

RDB, RBLKB

tRACS tOCA

tRPCH

tOCH

tRPCA

tCML

tCMH

tCCYC

tRACH

tRDCH

tRDCS

Old Data Out

Old RPE Out

ProASICPLUS Flash Family FPGAs

1-60 v5.8

Asynchronous SRAM Write

Note: The plot shows the normal operation status.

Figure 1-33 • Asynchronous SRAM Write

Table 1-54 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883B

Symbol txxx Description Min. Max. Units Notes

AWRH WADDR hold from WB ↑ 1.0 ns

AWRS WADDR setup to WB ↓ 0.5 ns

DWRH DI hold from WB ↑ 1.5 ns

DWRS DI setup to WB ↑ 0.5 ns PARGEN is inactive.

DWRS DI setup to WB ↑ 2.5 ns PARGEN is active.

WPDA WPE access from DI 3.0 ns WPE is invalid, while PARGEN is

active.

WPDH WPE hold from DI 1.0 ns

WRCYC Cycle time 7.5 ns

WRMH WB high phase 3.0 ns Inactive

WRML WB low phase 3.0 ns Active

Note: All –F speed grade devices are 20% slower than the standard numbers.

WRB, WBLKB

WADDR

WPE

tAWRS

tWPDA

tAWRH

tDWRS

tWRML tWRMH

tWRCYC

tWPDH

tDWRH

ProASICPLUS Flash Family FPGAs

v5.8 1-61

Asynchronous SRAM Read, Address Controlled, RDB=0

Note: The plot shows the normal operation status.

Figure 1-34 • Asynchronous SRAM Read, Address Controlled, RDB=0

Table 1-55 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883B

Symbol txxx Description Min. Max. Units Notes

ACYC Read cycle time 7.5 ns

OAA New DO access from RADDR stable 7.5 ns

OAH Old DO hold from RADDR stable 3.0 ns

RPAA New RPE access from RADDR stable 10.0 ns

RPAH Old RPE hold from RADDR stable 3.0 ns

Note: All –F speed grade devices are 20% slower than the standard numbers.

RPE

RADDR

tOAH

tRPAH

tOAA

tRPAA

tACYC

ProASICPLUS Flash Family FPGAs

1-62 v5.8

Asynchronous SRAM Read, RDB Controlled

Note: The plot shows the normal operation status.

Figure 1-35 • Asynchronous SRAM Read, RDB Controlled

Table 1-56 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

ORDA New DO access from RB ↓7.5 ns

ORDH Old DO valid from RB ↓3.0 ns

RDCYC Read cycle time 7.5 ns

RDMH RB high phase 3.0 ns Inactive setup to new cycle

RDML RB low phase 3.0 ns Active

RPRDA New RPE access from RB ↓9.5 ns

RPRDH Old RPE valid from RB ↓3.0 ns

Note: All –F speed grade devices are 20% slower than the standard numbers.

RB=(RDB+RBLKB)

RPE

tORDH

tORDA

tRPRDA

tRDML

tRDCYC

tRDMH

tRPRDH

ProASICPLUS Flash Family FPGAs

v5.8 1-63

Synchronous SRAM Write

Note: The plot shows the normal operation status.

Figure 1-36 • Synchronous SRAM Write

Table 1-57 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

DCH DI hold from WCLKS ↑ 0.5 ns

DCS DI setup to WCLKS ↑ 1.0 ns

WACH WADDR hold from WCLKS ↑ 0.5 ns

WDCS WADDR setup to WCLKS ↑ 1.0 ns

WPCA New WPE access from WCLKS ↑ 3.0 ns WPE is invalid while

PARGEN is active

WPCH Old WPE valid from WCLKS ↑ 0.5 ns

WRCH, WBCH WRB & WBLKB hold from WCLKS ↑ 0.5 ns

WRCS, WBCS WRB & WBLKB setup to WCLKS ↑ 1.0 ns

Notes:

1. On simultaneous read and write accesses to the same location, DI is output to DO.

2. All –F speed grade devices are 20% slower than the standard numbers.

WCLKS

WPE

WADDR, DI

WRB, WBLKB

Cycle Start

tWRCH, tWBCH

tWRCS, tWBCS

tDCS, tWDCS

tWPCH

tDCH, tWACH

tWPCA

tCMH tCML

tCCYC

ProASICPLUS Flash Family FPGAs

1-64 v5.8

Synchronous Write and Read to the Same Location

Note: The plot shows the normal operation status.

Figure 1-37 • Synchronous Write and Read to the Same Location

Table 1-58 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

WCLKRCLKS WCLKS ↑to RCLKS ↑setup time – 0.1 ns

WCLKRCLKH WCLKS ↑to RCLKS ↑hold time 7.0 ns

OCH Old DO valid from RCLKS ↑3.0 ns OCA/OCH displayed for

Access Timed Output

OCA New DO valid from RCLKS ↑7.5 ns

Notes:

1. This behavior is valid for Access Timed Output and Pipelined Mode Output. The table shows the timings of an Access Timed Output.

2. During synchronous write and synchronous read access to the same location, the new write data will be read out if the active write

clock edge occurs before or at the same time as the active read clock edge. The negative setup time insures this behavior for WCLKS

and RCLKS driven by the same design signal.

3. If WCLKS changes after the hold time, the data will be read.

4. A setup or hold time violation will result in unknown output data.

5. All –F speed grade devices are 20% slower than the standard numbers.

* New data is read if WCLKS ↑occurs before setup time.

The data stored is read if WCLKS ↑occurs after hold time.

RCLKS

WCLKS

tWCLKRCLKH

New Data*

Last Cycle Data

tWCLKRCLKS

tOCH

tCCYC

tCMH tCML

tOCA

ProASICPLUS Flash Family FPGAs

v5.8 1-65

Asynchronous Write and Synchronous Read to the Same Location

Note: The plot shows the normal operation status.

Figure 1-38 • Asynchronous Write and Synchronous Read to the Same Location

Table 1-59 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

WBRCLKS WB ↓to RCLKS ↑setup time –0.1 ns

WBRCLKH WB ↓to RCLKS ↑ hold time 7.0 ns

OCH Old DO valid from RCLKS ↑3.0 ns OCA/OCH displayed for

Access Timed Output

OCA New DO valid from RCLKS ↑7.5 ns

DWRRCLKS DI to RCLKS ↑ setup time 0 ns

DWRH DI to WB ↑ hold time 1.5 ns

Notes:

1. This behavior is valid for Access Timed Output and Pipelined Mode Output. The table shows the timings of an Access Timed Output.

2. In asynchronous write and synchronous read access to the same location, the new write data will be read out if the active write

signal edge occurs before or at the same time as the active read clock edge. If WB changes to low after hold time, the data will be

read.

3. A setup or hold time violation will result in unknown output data.

4. All –F speed grade devices are 20% slower than the standard numbers.

* New data is read if WB ↓occurs before setup time.

The stored data is read if WB ↓occurs after hold time.

WB = {WRB + WBLKB}

RCLKS

tBRCLKH

New Data*

Last Cycle Data

tWRCKS

tOCH

tOCA

tDWRRCLKS tDWRH

tCCYC

tCMH tCML

ProASICPLUS Flash Family FPGAs

1-66 v5.8

Asynchronous Write and Read to the Same Location

Note: The plot shows the normal operation status.

Figure 1-39 • Asynchronous Write and Read to the Same Location

Table 1-60 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

ORDA New DO access from RB ↓7.5 ns

ORDH Old DO valid from RB ↓3.0 ns

OWRA New DO access from WB ↑3.0 ns

OWRH Old DO valid from WB ↑0.5 ns

RAWRS RB ↓or RADDR from WB ↓5.0 ns

RAWRH RB ↑or RADDR from WB ↑5.0 ns

Notes:

1. During an asynchronous read cycle, each write operation (synchronous or asynchronous) to the same location will automatically

trigger a read operation which updates the read data. Refer to the ProASICPLUS RAM and FIFO Blocks application note for more

information.

2. Violation or RAWRS will disturb access to the OLD data.

3. Violation of RAWRH will disturb access to the NEWER data.

4. All –F speed grade devices are 20% slower than the standard numbers.

RB, RADDR

OLD NEWERNEW

tORDA

tORDH

tOWRH

tRAWRH

WB = {WRB+WBLKB}

tOWRA

tRAWRS

ProASICPLUS Flash Family FPGAs

v5.8 1-67

Synchronous Write and Asynchronous Read to the Same Location

Note: The plot shows the normal operation status.

Figure 1-40 • Synchronous Write and Asynchronous Read to the Same Location

Table 1-61 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

ORDA New DO access from RB ↓7.5 ns

ORDH Old DO valid from RB ↓3.0 ns

OWRA New DO access from WCLKS ↓3.0 ns

OWRH Old DO valid from WCLKS ↓0.5 ns

RAWCLKS RB ↓or RADDR from WCLKS ↑5.0 ns

RAWCLKH RB ↑or RADDR from WCLKS ↓5.0 ns

Notes:

1. During an asynchronous read cycle, each write operation (synchronous or asynchronous) to the same location will automatically

trigger a read operation which updates the read data.

2. Violation of RAWCLKS will disturb access to OLD data.

3. Violation of RAWCLKH will disturb access to NEWER data.

4. All –F speed grade devices are 20% slower than the standard numbers.

RB, RADDR

OLD NEW NEWER

tORDA

tORDH

tRAWCLKS

tRAWCLKH

WCLKS

tOWRH

tOWRA

ProASICPLUS Flash Family FPGAs

1-68 v5.8

Asynchronous FIFO Full and Empty Transitions

The asynchronous FIFO accepts writes and reads while

not full or not empty. When the FIFO is full, all writes are

inhibited. Conversely, when the FIFO is empty, all reads

are inhibited. A problem is created if the FIFO is written

to during the transition from full to not full, or read

during the transition from empty to not empty. The

exact time at which the write or read operation changes

from inhibited to accepted after the read (write) signal

which causes the transition from full or empty to not full

or not empty is indeterminate. For slow cycles, this

indeterminate period starts 1 ns after the RB (WB)

transition, which deactivates full or not empty and ends

3 ns after the RB (WB) transition. For fast cycles, the

indeterminate period ends 3 ns (7.5 ns – RDL (WRL)) after

the RB (WB) transition, whichever is later (Table 1-1 on

page 1-7).

The timing diagram for write is shown in Figure 1-38 on

page 1-65. The timing diagram for read is shown in

Figure 1-39 on page 1-66. For basic SRAM configurations,

see Table 1-14 on page 1-25. When reset is asserted, the

empty flag will be asserted, the counters will reset, the

outputs go to zero, but the internal RAM is not erased.

Enclosed Timing Diagrams – FIFO Mode:

The following timing diagrams apply only to single cell;

they are not applicable to cascaded cells. For more

information, refer to the ProASICPLUS RAM/FIFO Blocks

application note.

•"Asynchronous FIFO Read" section on page 1-70

•"Asynchronous FIFO Write" section on page 1-71

•"Synchronous FIFO Read, Access Timed Output

Strobe (Synchronous Transparent)" section on

page 1-72

•"Synchronous FIFO Read, Pipeline Mode Outputs

(Synchronous Pipelined)" section on page 1-73

•"Synchronous FIFO Write" section on page 1-74

•"FIFO Reset" section on page 1-75

Table 1-62 • Memory Block FIFO Interface Signals

FIFO Signal Bits In/Out Description

WCLKS 1 In Write clock used for synchronization on write side

RCLKS 1 In Read clock used for synchronization on read side

LEVEL <0:7>* 8 In Direct configuration implements static flag logic

RBLKB 1 In Read block select (active Low)

RDB 1 In Read pulse (active Low)

RESET 1 In Reset for FIFO pointers (active Low)

WBLKB 1 In Write block select (active Low)

DI<0:8> 9 In Input data bits <0:8>, <8> will be generated if PARGEN is true

WRB 1 In Write pulse (active Low)

FULL, EMPTY 2 Out FIFO flags. FULL prevents write and EMPTY prevents read

EQTH, GEQTH* 2 Out EQTH is true when the FIFO holds the number of words specified by the LEVEL signal.

GEQTH is true when the FIFO holds (LEVEL) words or more

DO<0:8> 9 Out Output data bits <0:8>

RPE 1 Out Read parity error (active High)

WPE 1 Out Write parity error (active High)

LGDEP <0:2> 3 In Configures DEPTH of the FIFO to 2 (LGDEP+1)

PARODD 1 In Selects Odd parity generation/detect when high, Even when low

Note: *LEVEL is always eight bits (0000.0000, 0000.0001). That means for values of DEPTH greater than 256, not all values will be

possible, e.g. for DEPTH=512, the LEVEL can only have the values 2, 4, . . ., 512. The LEVEL signal circuit will generate signals that

indicate whether the FIFO is exactly filled to the value of LEVEL (EQTH) or filled equal or higher (GEQTH) than the specified LEVEL.

Since counting starts at 0, EQTH will become true when the FIFO holds (LEVEL+1) words for 512-bit FIFOs.

ProASICPLUS Flash Family FPGAs

v5.8 1-69

Note: All –F speed grade devices are 20% slower than the standard numbers.

Figure 1-41 • Write Timing Diagram

Note: All –F speed grade devices are 20% slower than the standard numbers.

Figure 1-42 • Read Timing Diagram

Write acceptedWrite inhibited

FULL

Write

cycle

1 ns

3 ns

Read acceptedRead inhibited

EMPTY

Read

cycle

1 ns

3 ns

ProASICPLUS Flash Family FPGAs

1-70 v5.8

Asynchronous FIFO Read

Note: The plot shows the normal operation status.

Figure 1-43 • Asynchronous FIFO Read

Table 1-63 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

ERDH, FRDH,

THRDH

Old EMPTY, FULL, EQTH, & GETH valid hold

time from RB ↑0.5 ns Empty/full/thresh are invalid from the end of

hold until the new access is complete

ERDA New EMPTY access from RB ↑3.01ns

FRDA FULL↓ access from RB ↑3.01ns

ORDA New DO access from RB ↓7.5 ns

ORDH Old DO valid from RB ↓3.0 ns

RDCYC Read cycle time 7.5 ns

RDWRS WB ↑, clearing EMPTY, setup to

RB ↓

3.02ns Enabling the read operation

1.0 ns Inhibiting the read operation

RDH RB high phase 3.0 ns Inactive

RDL RB low phase 3.0 ns Active

RPRDA New RPE access from RB ↓9.5 ns

RPRDH Old RPE valid from RB ↓4.0 ns

THRDA EQTH or GETH access from RB↑4.5 ns

Notes:

1. At fast cycles, ERDA and FRDA = MAX (7.5 ns – RDL), 3.0 ns.

2. At fast cycles, RDWRS (for enabling read) = MAX (7.5 ns – WRL), 3.0 ns.

3. All –F speed grade devices are 20% slower than the standard numbers.

RB = (RDB+RBLKB)

RPE

RDATA

EMPTY

EQTH, GETH

FULL

(Empty inhibits read)

Cycle Start

tRDWRS tERDH, tFRDH

tERDA, tFRDA

tTHRDH

tORDH

tRPRDH

tORDA

tRPRDA

tRDL tRDH

tRPRDA

tRDL

tRDCYC

tRDH

tTHRDA

ProASICPLUS Flash Family FPGAs

v5.8 1-71

Asynchronous FIFO Write

Note: The plot shows the normal operation status.

Figure 1-44 • Asynchronous FIFO Write

Table 1-64 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

DWRH DI hold from WB ↑ 1.5 ns

DWRS DI setup to WB ↑ 0.5 ns PARGEN is inactive

DWRS DI setup to WB ↑ 2.5 ns PARGEN is active

EWRH, FWRH,

THWRH

Old EMPTY, FULL, EQTH, & GETH valid hold

time after WB ↑0.5 ns Empty/full/thresh are invalid from the end

of hold until the new access is complete

EWRA EMPTY ↓ access from WB ↑ 3.01ns

FWRA New FULL access from WB ↑3.01ns

THWRA EQTH or GETH access from WB ↑4.5 ns

WPDA WPE access from DI 3.0 ns WPE is invalid while PARGEN is active

WPDH WPE hold from DI 1.0 ns

WRCYC Cycle time 7.5 ns

WRRDS RB ↑, clearing FULL, setup to

WB ↓

3.02ns Enabling the write operation

1.0 Inhibiting the write operation

WRH WB high phase 3.0 ns Inactive

WRL WB low phase 3.0 ns Active

Notes:

1. At fast cycles, EWRA, FWRA = MAX (7.5 ns – WRL), 3.0 ns.

2. At fast cycles, WRRDS (for enabling write) = MAX (7.5 ns – RDL), 3.0 ns.

3. All –F speed grade devices are 20% slower than the standard numbers.

4. After FIFO reset, WRB needs an initial falling edge prior to any write actions.

WPE

WDATA (Full inhibits write)

WB = (WRB+WBLKB)

EMPTY

EQTH, GETH

FULL

Cycle Start

tWRRDS tDWRH

tWPDH

tWPDA

tDWRS

tEWRH, tFWRH

tEWRA, tFWRA

tTHWRH

tTHWRA

tWRH

tWRL

tWRCYC

ProASICPLUS Flash Family FPGAs

1-72 v5.8

Synchronous FIFO Read, Access Timed Output Strobe (Synchronous Transparent)

Note: The plot shows the normal operation status.

Figure 1-45 • Synchronous FIFO Read, Access Timed Output Strobe (Synchronous Transparent)

Table 1-65 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

ECBA New EMPTY access from RCLKS ↓3.01ns

FCBA FULL ↓ access from RCLKS ↓ 3.01ns

ECBH, FCBH,

THCBH

Old EMPTY, FULL, EQTH, & GETH valid hold

time from RCLKS ↓1.0 ns Empty/full/thresh are invalid from the end

of hold until the new access is complete

OCA New DO access from RCLKS ↑7.5 ns

OCH Old DO valid from RCLKS ↑ 3.0 ns

RDCH RDB hold from RCLKS ↑ 0.5 ns

RDCS RDB setup to RCLKS ↑ 1.0 ns

RPCA New RPE access from RCLKS ↑ 9.5 ns

RPCH Old RPE valid from RCLKS ↑ 3.0 ns

HCBA EQTH or GETH access from RCLKS ↓ 4.5 ns

Notes:

1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMH), 3.0 ns.

2. All –F speed grade devices are 20% slower than the standard numbers.

RCLK

RPE

RDATA

EMPTY

EQTH, GETH

FULL

RDB

tRDCH

tOCH

tRPCH

tRDCS

Old Data Out New Valid Data Out (Empty Inhibits Read)

Cycle Start

tECBH, tFCBH

tECBA, tFCBA

tOCA

tRPCA

tCMH tCML

tCCYC

tTHCBH

tHCBA

ProASICPLUS Flash Family FPGAs

v5.8 1-73

Synchronous FIFO Read, Pipeline Mode Outputs (Synchronous Pipelined)

Note: The plot shows the normal operation status.

Figure 1-46 • Synchronous FIFO Read, Pipeline Mode Outputs (Synchronous Pipelined)

Table 1-66 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

ECBA New EMPTY access from RCLKS ↓ 3.01ns

FCBA FULL ↓ access from RCLKS ↓ 3.01ns

ECBH, FCBH,

THCBH

Old EMPTY, FULL, EQTH, & GETH valid hold

time from RCLKS ↓

1.0 ns Empty/full/thresh are invalid from the end of

hold until the new access is complete

OCA New DO access from RCLKS ↑ 2.0 ns

OCH Old DO valid from RCLKS ↑ 0.75 ns

RDCH RDB hold from RCLKS ↑ 0.5 ns

RDCS RDB setup to RCLKS ↑ 1.0 ns

RPCA New RPE access from RCLKS ↑ 4.0 ns

RPCH Old RPE valid from RCLKS ↑ 1.0 ns

HCBA EQTH or GETH access from RCLKS ↓ 4.5 ns

Notes:

1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMS), 3.0 ns.

2. All –F speed grade devices are 20% slower than the standard numbers.

RCLK

RPE

RDATA

EMPTY

EQTH, GETH

FULL

Old Data Out New Valid Data Out

RDB

Cycle Start

Old RPE Out New RPE Out

tECBH, tFCBH

tRDCH

tRDCS

tOCA

tECBA, tFCBA

tTHCBH

tHCBA

tCMH tCML

tCCYC

tRPCH

tOCH

tRPCA

ProASICPLUS Flash Family FPGAs

1-74 v5.8

Synchronous FIFO Write

Note: The plot shows the normal operation status.

Figure 1-47 • Synchronous FIFO Write

Table 1-67 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CCYC Cycle time 7.5 ns

CMH Clock high phase 3.0 ns

CML Clock low phase 3.0 ns

DCH DI hold from WCLKS ↑ 0.5 ns

DCS DI setup to WCLKS ↑ 1.0 ns

FCBA New FULL access from WCLKS ↓3.01ns

ECBA EMPTY↓ access from WCLKS ↓ 3.01ns

ECBH,

FCBH,

HCBH

Old EMPTY, FULL, EQTH, & GETH valid hold

time from WCLKS ↓1.0 ns Empty/full/thresh are invalid from the end of

hold until the new access is complete

HCBA EQTH or GETH access from WCLKS ↓ 4.5 ns

WPCA New WPE access from WCLKS ↑ 3.0 ns WPE is invalid, while PARGEN is active

WPCH Old WPE valid from WCLKS ↑ 0.5 ns

WRCH, WBCH WRB & WBLKB hold from WCLKS ↑ 0.5 ns

WRCS, WBCS WRB & WBLKB setup to WCLKS ↑ 1.0 ns

Notes:

1. At fast cycles, ECBA and FCBA = MAX (7.5 ns – CMH), 3.0 ns.

2. All –F speed grade devices are 20% slower than the standard numbers.

WCLKS

WPE

EMPTY

EQTH, GETH

FULL

(Full Inhibits Write)

WRB, WBLKB

Cycle Start

tWRCH, tWBCH tECBH, tFCBH

tECBA, tFCBA

tHCBA

tWRCS, tWBCS

tDCS

tWPCA

tCMH tCML

tCCYC

tWPCH

tDCH

tHCBH

ProASICPLUS Flash Family FPGAs

v5.8 1-75

FIFO Reset

Notes:

1. During reset, either the enables (WRB and RBD) OR the clocks (WCLKS and RCKLS) must be low.

2. The plot shows the normal operation status.

Figure 1-48 • FIFO Reset

Table 1-68 • TJ = 0°C to 110°C; VDD = 2.3 V to 2.7 V for Commercial/industrial

TJ = –55°C to 150°C, VDD = 2.3 V to 2.7 V for Military/MIL-STD-883

Symbol txxx Description Min. Max. Units Notes

CBRSH1WCLKS or RCLKS ↑ hold from RESETB ↑ 1.5 ns Synchronous mode only

CBRSS1WCLKS or RCLKS ↓ setup to RESETB ↑ 1.5 ns Synchronous mode only

ERSA New EMPTY ↑ access from RESETB ↓ 3.0 ns

FRSA FULL ↓ access from RESETB ↓ 3.0 ns

RSL RESETB low phase 7.5 ns

THRSA EQTH or GETH access from RESETB ↓ 4.5 ns

WBRSH1WB ↓ hold from RESETB ↑ 1.5 ns Asynchronous mode only

WBRSS1WB ↑ setup to RESETB ↑ 1.5 ns Asynchronous mode only

Notes:

1. During rest, the enables (WRB and RBD) must be high OR the clocks (WCLKS and RCKLS) must be low.

2. All –F speed grade devices are 20% slower than the standard numbers.

RESETB

EMPTY

EQTH, GETH

FULL

WRB/RBD

Cycle Start

WCLKS, RCLKS

tERSA, tFRSA

tTHRSA

tCBRSS

tWBRSS

tCBRSH

tWBRSH

tRSL

Pin Description

User Pins

I/O User Input/Output

The I/O pin functions as an input, output, tristate, or

bidirectional buffer. Input and output signal levels are

compatible with standard LVTTL and LVCMOS

specifications. Unused I/O pins are configured as inputs

with pull-up resistors.

NC No Connect

To maintain compatibility with other Actel ProASICPLUS

products, it is recommended that this pin not be

connected to the circuitry on the board.

GL Global Pin

Low skew input pin for clock or other global signals. This

pin can be configured with an internal pull-up resistor.

When it is not connected to the global network or the

clock conditioning circuit, it can be configured and used

as a normal I/O.

GLMX Global Multiplexing Pin

Low skew input pin for clock or other global signals. This

pin can be used in one of two special ways (refer to

Actel’s Using ProASICPLUS Clock Conditioning Circuits).

When the external feedback option is selected for the

PLL block, this pin is routed as the external feedback

source to the clock conditioning circuit.

In applications where two different signals access the

same global net at different times through the use of

GLMXx and GLMXLx macros, this pin will be fixed as one

of the source pins.

This pin can be configured with an internal pull-up

resistor. When it is not connected to the global network

or the clock conditioning circuit, it can be configured and

used as any normal I/O. If not used, the GLMXx pin will

be configured as an input with pull-up.

Dedicated Pins

GND Ground

Common ground supply voltage.

VDD Logic Array Power Supply Pin

2.5 V supply voltage.

VDDP I/O Pad Power Supply Pin

2.5 V or 3.3 V supply voltage.

TMS Test Mode Select

The TMS pin controls the use of boundary-scan circuitry.

This pin has an internal pull-up resistor.

TCK Test Clock

Clock input pin for boundary scan (maximum 10 MHz). Actel

recommends adding a nominal 20 kΩ pull-up resistor to this

pin.

TDI Test Data In

Serial input for boundary scan. A dedicated pull-up

resistor is included to pull this pin high when not being

driven.

TDO Test Data Out

Serial output for boundary scan. Actel recommends

adding a nominal 20kΩ pull-up resistor to this pin.

TRST Test Reset Input

Asynchronous, active-low input pin for resetting

boundary-scan circuitry. This pin has an internal pull-up

resistor. For more information, please refer to Power-up

Behavior of ProASICPLUS Devices application note.

Special Function Pins

RCK Running Clock

A free running clock is needed during programming if

the programmer cannot guarantee that TCK will be

uninterrupted. If not used, this pin has an internal pull-

up and can be left floating.

NPECL User Negative Input

Provides high speed clock or data signals to the PLL

block. If unused, leave the pin unconnected.

PPECL User Positive Input

Provides high speed clock or data signals to the PLL

block. If unused, leave the pin unconnected.

AVDD PLL Power Supply

Analog VDD should be VDD (core voltage) 2.5 V (nominal)

and be decoupled from GND with suitable decoupling

capacitors to reduce noise. For more information, refer

to Actel’s Using ProASICPLUS Clock Conditioning Circuits

application note. If the clock conditioning circuitry is not

used in a design, AVDD can either be left floating or tied

to 2.5 V.

AGND PLL Power Ground

The analog ground can be connected to the system

ground. For more information, refer to Actel’s Using

ProASICPLUS Clock Conditioning Circuits application note.

If the PLLs or clock conditioning circuitry are not used in

a design, AGND should be tied to GND.

ProASICPLUS Flash Family FPGAs

v5.8 1-77

VPP Programming Supply Pin

This pin may be connected to any voltage between GND

and 16.5 V during normal operation, or it can be left

unconnected.2 For information on using this pin during

programming, see the In-System Programming

ProASICPLUS Devices application note. Actel recommends

floating the pin or connecting it to VDDP

VPN Programming Supply Pin

This pin may be connected to any voltage between 0.5V

and –13.8 V during normal operation, or it can be left

unconnected.3 For information on using this pin during

programming, see the In-System Programming

ProASICPLUS Devices application note. Actel recommends

floating the pin or connecting it to GND.

Recommended Design Practice

for VPN/VPP

ProASICPLUS Devices – APA450, APA600,

APA750, APA1000

Bypass capacitors are required from VPP to GND and VPN

to GND for all ProASICPLUS devices during programming.

During the erase cycle, ProASICPLUS devices may have

current surges on the VPP and VPN power supplies. The

only way to maintain the integrity of the power

distribution to the ProASICPLUS device during these

current surges is to counteract the inductance of the

finite length conductors that distribute the power to the

device. This can be accomplished by providing sufficient

bypass capacitance between the VPP and VPN pins and

GND (using the shortest paths possible). Without

sufficient bypass capacitance to counteract the

inductance, the VPP and VPN pins may incur a voltage

spike beyond the voltage that the device can withstand.

This issue applies to all programming configurations.

The solution prevents spikes from damaging the

ProASICPLUS devices. Bypass capacitors are required for

the VPP and VPN pads. Use a 0.01 µF to 0.1 µF ceramic

capacitor with a 25 V or greater rating. To filter low-

frequency noise (decoupling), use a 4.7 µF (low ESR, <1

<Ω, tantalum, 25 V or greater rating) capacitor. The

capacitors should be located as close to the device pins as

possible (within 2.5 cm is desirable). The smaller, high-

frequency capacitor should be placed closer to the device

pins than the larger low-frequency capacitor. The same

dual-capacitor circuit should be used on both the VPP and

VPN pins (Figure 1-49).

ProASICPLUS Devices – APA075, APA150,

APA300

These devices do not require bypass capacitors on the VPP

and VPN pins as long as the total combined distance of

the programming cable and the trace length on the

board is less than or equal to 30 inches. Note: For trace

lengths greater than 30 inches, use the bypass capacitor

recommendations in the previous section.

2. There is a nominal 40 kΩ pull-up resistor on VPP

3. There is a nominal 40 kΩ pull-down resistor on VPN.

Figure 1-49 • ProASICPLUS VPP and VPN Capacitor Requirements

2.5cm

0.1μF

0.01μFProgramming

Header

Supplies

4.7μF

Actel

ProASIC

Device

0.1μF

0.01μF

4.7μF

PLUS