DESCRIPTION
The APS13295 Hall-effect switch is a three-wire, planar
Hall-effect sensor integrated circuit (IC) especially suited for
operation over extended temperature ranges (up to 125°C).
This Hall-effect switch IC is ideal for industrial and consumer
applications and features performance enhancements permitting
high-temperature operation up to 175°C junction temperatures.
In addition, the APS13295 includes a number of features
designed specifically to maximize system robustness such as
reverse-polarity protection, output current limiter, overvoltage,
and EMC protection.
The single silicon chip includes: a voltage regulator, a Hall
plate, small signal amplifier, chopper stabilization, Schmitt
trigger, and a short-circuit-protected open-drain output. A
south pole of sufficient strength turns the output on. Removal
of the magnetic field—or a north pole—turns the output off.
The devices include on-board transient protection for all pins,
permitting operation directly from unregulated or regulated
supplies from 2.8 to 24 V.
Two package styles provide a choice of through-hole or surface
mounting. Package type LH is a modified SOT23W, surface-
mount package, while UA is a three-lead ultra-mini SIP for
through-hole mounting. Both packages are lead (Pb) free and
RoHs compliant with 100% matte-tin leadframe plating.
APS13295-DS, Rev. 1
MCO-0000386
FEATURES AND BENEFITS
Unipolar switchpoints
Superior ruggedness and fault tolerance
Reverse-polarity and transient protection
Operation from –40°C to 175°C junction temperature
Output short-circuit and overvoltage protection
Superior temperature stability
Resistant to physical stress
High EMC immunity, ±12 kV HBM ESD
Operation from unregulated supplies, 2.8 to 24 V
Chopper stabilization
Solid-state reliability
Industry-standard packages and pinouts
Precision Hall-Effect Switch
for Consumer and Industrial Applications
PACKAGES:
Functional Block Diagram
Not to scale
APS13295
3-pin SOT23W
(suffix LH)
3-pin SIP
(suffix UA)
May 10, 2018
C
ONTROL
VCC
GND
VOUT
S
AMPLE
, H
OLD
&
A
VERAGING
H
ALL
A
MP
.
Hall
Element
D
YNAMIC
O
FFSET
C
ANCELLATION
L
OW
-P
ASS
F
ILTER
C
URRENT
L
IMIT
T
O
A
LL
S
UBCIRCUITS
R
EGULATOR
S
CHMITT
T
RIGGER
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
2
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
RoHS
COMPLIANT
SELECTION GUIDE
Part Number Packing
[1] Mounting Branding Ambient Temperature,
TA
Switchpoints
(Typ.)
BOP BRP
APS13295KLHALX 13-in. reel, 10000 pieces/reel 3-pin SOT23W surface mount A33
–40°C to 125°C 35 G 25 G
APS13295KLHALT
[2] 7-in. reel, 3000 pieces/reel 3-pin SOT23W surface mount A33
APS13295KUAA Bulk, 500 pieces/bag 3-pin SIP through hole A34
[1] Contact Allegro for additional packing options.
[2] Available through authorized Allegro distributors only.
V
SUPPLY
V
OUT
2
C
BYP
=
0.1 µF
1
R
PULL-UP
=
1 k
3
APS13295
VCC VOUT
GND
Figure 1: Typical Application Circuit
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
3
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
ABSOLUTE MAXIMUM RATINGS
Characteristic Symbol Notes Rating Units
Forward Supply Voltage [1] VCC 30 V
Reverse Supply Voltage [1] VRCC –18 V
Output Off Voltage [1] VOUT 30 V
Output Current [2] IOUT 60 mA
Reverse Output Current IROUT –50 mA
Magnetic Flux Density [3] B Unlimited
Maximum Junction Temperature TJ(max) 165 °C
For 500 hours 175 °C
Storage Temperature Tstg –65 to 170 °C
ESD Voltage VESD(HBM) Human Body Model according to AEC-Q100-002 ±12 kV
VESD(CDM) Charged Device Model according to AEC-Q100-011 ±1 kV
[1] This rating does not apply to extremely short voltage transients such as load dump and/or ESD. Those events have individual ratings,
specific to the respective transient voltage event.
[2] Through short-circuit current limiting device.
[3] Guaranteed by design.
PINOUT DIAGRAMS AND TERMINAL LIST
1
3
2
GND
VOUT
VCC
1
2
3
GND
VOUT
VCC
3-pin SOT23W
(suffix LH)
3-pin SIP
(suffix UA)
Terminal List
Name Description Number
LH UA
VCC Connects power supply to chip 1 1
VOUT Output from circuit 2 3
GND Ground 3 2
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
4
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
ELECTRICAL CHARACTERISTICS: Valid over full operating voltage, ambient temperature range TA = –40°C to 125°C,
and with CBYP = 0.1 µF, unless otherwise specified
Characteristics Symbol Test Conditions Min. Typ.[1] Max. Unit
[2]
ELECTRICAL CHARACTERISTICS
Forward Supply Voltage VCC Operating, TJ < 175°C 2.8 24 V
Supply Current ICC 1 2 3 mA
Output Leakage Current IOUTOFF VOUTOFF = 24 V, B < BRP 10 µA
Output Saturation Voltage VOUT(SAT) IOUT = 20 mA, B > BOP 200 500 mV
Output Off Voltage VOUTOFF B < BRP 24 V
Power-On Time [3] tON
VCC ≥ VCC(min), B < BRP(min) – 10 G,
B > BOP(max) + 10 G 25 µs
Power-On State, Output
[3] POS VCC ≥ VCC(min), t < tON Low
Chopping Frequency fC 800 kHz
Output Rise Time
[4] trRPULL-UP = 1 kΩ, CL = 20 pF 0.2 2 µs
Output Fall Time
[4] tfRPULL-UP = 1 kΩ, CL = 20 pF 0.1 2 µs
TRANSIENT PROTECTION CHARACTERISTICS
Output Short-Circuit Current Limit IOM 30 60 mA
Output Zener Clamp Voltage VZoutput IOUTOFF = 3 mA; TA = 25°C, Output Off 30 V
Reverse Battery Current IRCC VRCC = –18 V, TA = 25°C –5 mA
Supply Zener Clamp Voltage VZICC = ICC(max) + 3 mA, TA = 25°C 30 V
MAGNETIC CHARACTERISTICS
Operate Point BOP 35 50 G
Release Point BRP 5 25 G
Hysteresis BHYS (BOP – BRP) 7 10 20 G
[1] Typical data are at TA = 25°C and VCC = 12 V.
[2] 1 G (gauss) = 0.1 mT (millitesla).
[3] Guaranteed by device design and characterization.
[4] CL = oscilloscope probe capacitance.
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
5
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
THERMAL CHARACTERISTICS: May require derating at maximum conditions; see application information
Characteristic Symbol Test Conditions Value Units
Package Thermal Resistance RθJA
Package LH, 1-layer PCB with copper limited to solder pads 228 °C/W
Package LH, 2-layer PCB with 0.463 in.
2 of copper area each side
connected by thermal vias 110 °C/W
Package UA, 1-layer PCB with copper limited to solder pads 165 °C/W
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
25 45 65 85 105 125 145 165 185
Maximum Allowable VCC (V)
Temperature (°C)
Power Derating Curve
TJ(max) = 175°C; ICC = ICC(max), IOUT = 0 mA (Output Off)
VCC(max)
VCC(min)
Package UA, 1-layer PCB
(RθJA = 165 °C/W)
Package LH, 1-layer PCB
(RθJA = 228 °C/W)
Package LH, 2-layer PCB
(RθJA = 110 °C/W)
TJ(max)
0
100
200
300
400
500
600
700
800
900
1000
1100
1200
1300
1400
1500
1600
1700
1800
1900
25 45 65 85 105 125 145 165 185
Power Dissipation, PD(mW)
Temperature (°C)
Power Dissipation versus Ambient Temperature
Package LH, 2-layer PCB
(RθJA = 110°C/W)
Package UA, 1-layer PCB
(R
θJA
= 165°C/W)
Package LH, 1-layer PCB
(RθJA = 228°C/W)
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
6
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
CHARACTERISTIC PERFORMANCE DATA
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
-60 -40 -20 020 40 60 80 100 120 140
ICC (mA)
T
A
C)
Average Supply Current versus Ambient Temperature
2.8
12
24
VCC (V)
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
2 6 10 14 18 22 26
ICC (mA)
VCC (V)
Average Supply Current versus Supply Voltage
-40
25
125
TAC)
0
50
100
150
200
250
300
350
400
450
500
2 6 10 14 18 22 26
VOUT(SAT) (mV)
VCC (V)
Average Low Output Voltage versus Supply Voltage for IOUT = 20 mA
-40
25
125
TA(°C)
0
50
100
150
200
250
300
350
400
450
500
-60 -40 -20 020 40 60 80 100 120 140
V
OUT(SAT)
(mV)
TAC)
Average Low Output Voltage versus Ambient Temperature for IOUT = 20 mA
2.8
12
24
VCC (V)
0
50
100
150
200
250
300
350
400
450
500
2 6 10 14 18 22 26
V
OUT(SAT)
(mV)
VCC (V)
Average Low Output Voltage versus Supply Voltage for IOUT = 20 mA
-40
25
125
TAC)
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
7
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
CHARACTERISTIC PERFORMANCE DATA (continued)
10
15
20
25
30
35
40
45
50
55
60
-60 -40 -20 020 40 60 80 100 120 140
BOP (G)
TAC)
Average Operate Point versus Ambient Temperature
2.8
12
24
VCC (V)
10
15
20
25
30
35
40
45
50
55
60
2 6 10 14 18 22 26
BOP (G)
VCC (V)
Average Operate Point versus Supply Voltage
-40
25
125
TAC)
5
7
9
11
13
15
17
19
21
23
25
-60 -40 -20 020 40 60 80 100 120 140
B
HYS
(G)
TAC)
Average Switchpoint Hysteresis versus Ambient Temperature
2.8
12
24
VCC (V)
5
7
9
11
13
15
17
19
21
23
25
2 6 10 14 18 22 26
BHYS (G)
VCC (V)
Average Switchpoint Hysteresis versus Supply Voltage
-40
25
125
TAC)
5
10
15
20
25
30
35
40
45
50
-60 -40 -20 020 40 60 80 100 120 140
BRP (G)
T
A
C)
Average Release Point versus Ambient Temperature
2.8
12
24
VCC (V)
5
10
15
20
25
30
35
40
45
50
2 6 10 14 18 22 26
BRP (G)
VCC (V)
Average Release Point versus Supply Voltage
-40
25
125
TAC)
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
8
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
OPERATION
The output of the APS13295 switches low (turns on) when a
south-polarity magnetic field perpendicular to the Hall element
exceeds the operate point threshold, BOP (see Figure 2). After
turn-on, the output voltage is VOUT(SAT). The output transistor is
capable of continuously sinking up to 30 mA. When the magnetic
field is reduced below the release point, BRP, the device output
goes high (turns off) to VOUTOFF.
Switch to High
Switch to Low
B
RP
B
OP
V
OUT(SAT)
V
OUTOFF
B+
(south)
0
B
HYS
V
OUT
V+
0
Figure 2: Device Switching Behavior
On the horizontal axis, the B+ direction indicates increasing
south polarity magnetic field strength.
The difference in the magnetic operate and release points is the
hysteresis, BHYS , of the device. This built-in hysteresis allows
clean switching of the output even in the presence of external
mechanical vibration and electrical noise.
POWER-ON BEHAVIOR
Device power-on occurs once tON has elapsed. During the
time prior to tON, and after VCCVCC(min), the output state is
VOUT(SAT). After tON has elapsed, the output will correspond with
the applied magnetic field for B > BOP or B < BRP. See Figure 3
for an example.
Powering-on the device in the hysteresis range (less than BOP and
higher than BRP) will give an output state of VOUTOFF. The cor-
rect state is attained after the first excursion beyond BOP or BRP
.
t
t
V
V
CC
(min)
t
ON
0
Output State
Undefined for
V
CC
< V
CC
(min) POS
V
OUT (SAT)
V
OUT(OFF)
V
V
OUT
V
CC
Key
POS
B > B
OP
B < B
RP
, B
RP
< B < B
OP
Figure 3: Power-On Sequence and Timing
FUNCTIONAL DESCRIPTION
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
9
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Applications
It is strongly recommended that an external bypass capacitor be
connected (in close proximity to the Hall element) between the
supply and ground of the device to guarantee correct performance
under harsh environmental conditions and to reduce noise from
internal circuitry. As is shown in Figure 1: Typical Application
Circuit, a 0.1 µF capacitor is required. In applications where max-
imum robustness is required, additional measures may be taken.
In Figure 4: Enhanced Protection Circuit, a resistor in series with
the VCC pin and a capacitor on the VOUT pin enhance the EMC
immunity of the device. It is up to the user to fully qualify the
Allegro sensor IC in their end system to ensure they achieve their
system requirements.
These devices are sensitive in the direction perpendicular to the
branded package face, and may be configured to sense magnetic
fields in a variety of orientations, such as the ones shown in
Figure 5.
Extensive applications information for Hall-effect devices is
available in:
Hall-Effect IC Applications Guide, AN27701,
Hall-Effect Devices: Guidelines for Designing Subassemblies
Using Hall-Effect Devices AN27703.1
Soldering Methods for Allegro’s Products – SMD and
Through-Hole, AN26009
All are provided on the Allegro website:
www.allegromicro.com
Figure 5: Sensing Congurations
VSUPPLY
VOUT
2
CBYP =
0.1 µF
1
RPULL-UP
=
1 k
COUT =
4.7 nF
RS =
100
VPULL-U P
3
APS13295
VCC VOUT
GND
A
A
A
RS and COUT are recommended for maximum
robustness in an automotive environment.
Figure 4: Enhanced Protection Circuit
PCB
N
S
S
N
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
10
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Amp
Clock/Logic
Hall Element
Sample and
Hold
Low-Pass
Filter
Regulator
A limiting factor for switchpoint accuracy when using Hall-effect
technology is the small-signal voltage developed across the Hall
plate. This voltage is proportionally small relative to the offset
that can be produced at the output of the Hall sensor. This makes
it difficult to process the signal and maintain an accurate, reliable
output over the specified temperature and voltage range. Chopper
stabilization is a proven approach used to minimize Hall offset.
The Allegro technique, dynamic quadrature offset cancellation,
removes key sources of the output drift induced by temperature
and package stress. This offset reduction technique is based on
a signal modulation-demodulation process. Figure 6: Model of
Chopper Stabilization Circuit (Dynamic Offset Cancellation)
illustrates how it is implemented.
The undesired offset signal is separated from the magnetically
induced signal in the frequency domain through modulation.
The subsequent demodulation acts as a modulation process for
the offset causing the magnetically induced signal to recover its
original spectrum at baseband while the DC offset becomes a
high-frequency signal. Then, using a low-pass filter, the signal
passes while the modulated DC offset is suppressed. Allegro’s
innovative chopper stabilization technique uses a high-frequency
clock. The high-frequency operation allows a greater sampling
rate that produces higher accuracy, reduced jitter, and faster sig-
nal processing. Additionally, filtering is more effective and results
in a lower noise analog signal at the sensor output. Devices such
as the APS13295 that use this approach have an extremely stable
quiescent Hall output voltage, are immune to thermal stress,
and have precise recoverability after temperature cycling. This
technique is made possible through the use of a BiCMOS process
which allows the use of low-offset and low-noise amplifiers
in combination with high-density logic and sample-and-hold
circuits.
Figure 6: Model of Chopper Stabilization Circuit
(Dynamic O󰀨set Cancellation)
CHOPPER STABILIZATION
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
POWER DERATING
The device must be operated below the maximum junction tem-
perature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The resulting power dissipation capability directly reflects upon
the ability of the device to withstand extreme operating condi-
tions. The junction temperature mission profile specified in the
Absolute Maximum Ratings table designates a total operating life
capability based on qualification for the most extreme conditions,
where TJ may reach 175°C.
The silicon IC is heated internally when current is flowing into
the VCC terminal. When the output is on, current sinking into the
VOUT terminal generates additional heat. This may increase the
junction temperature, TJ, above the surrounding ambient tempera-
ture. The APS13295 is permitted to operate up to TJ = 175°C. As
mentioned above, an operating device will increase TJ according
to equations 1, 2, and 3 below. This allows an estimation of the
maximum ambient operating temperature.
PD = VIN × IIN (1)
ΔT = PD × RθJA (2)
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 2 mA, VOUT = 185 mV, IOUT = 20 mA (output
on), and RθJA = 165°C/W, then:
PD = (VCC × ICC) + (VOUT × IOUT) =
(12 V × 2 mA) + (185 mV × 20 mA) =
24 mW + 3.7 mW = 27.7 mW
ΔT = PD × RθJA = 27.7 mW × 165°C/W = 4.6°C
TJ = TA + ΔT = 25°C + 4.6°C = 29.6°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding
TJ(max), at a selected RθJA.
For example, given the conditions RθJA = 228°C/W, TJ(max) =
175°C, VCC(max) = 24 V, ICC(max) = 4 mA, VOUT = 500 mV,
and IOUT = 25 mA (output on), the maximum allowable operating
ambient temperature can be determined.
The power dissipation required for the output is shown below:
PD(VOUT) = VOUT × IOUT = 500 mV × 25 mA = 12.5 mW
The power dissipation required for the IC supply is shown below:
PD(VCC) = VCC × ICC = 24 V × 4 mA = 96 mW
Next, by inverting using equation 2:
ΔT = PD × RθJA = [PD(VOUT) + PD(VCC)] × 228°C/W =
(12.5 mW + 96 mW) × 228°C/W =
108.5 mW × 228°C/W = 24.7°C
Finally, by inverting equation 3 with respect to voltage:
TA(est) = TJ(max) – ΔT = 175°C – 24.7°C = 150.3°C
In the above case, there is sufficient power dissipation capability
to operate up to TA(est).The example indicates that TA(max) can
be as high as 150.3°C without exceeding TJ(max). However, the
TA(max) rating of the device is 125°C; the APS13295 perfor-
mance is not guaranteed above TA = 125°C.
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
12
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
0.55 REF
Gauge Plane
Seating Plane
0.25 BSC
0.95 BSC
0.95
1.00
0.70
2.40
2
1
AActive Area Depth, 0.28 mm REF
B
C
B
Reference land pattern layout
All pads a minimum of 0.20 mm from all adjacent pads; adjust as necessary
to meet application process requirements and PCB layout tolerances
Branding scale and appearance at supplier discretion
A
PCB Layout Reference View
Branded Face
CStandard Branding Reference View
1
A33
2.90 +0.10
–0.20
4°±4°
8X 10° REF
0.180+0.020
–0.053
0.05 +0.10
–0.05
0.25 MIN
1.91 +0.19
–0.06
2.98 +0.12
–0.08
1.00 ±0.13
0.40 ±0.10
For Reference Only; not for tooling use (reference dwg. 802840)
Dimensions in millimeters
Dimensions exclusive of mold flash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
DHall element, not to scale
D
D
D
1.49
0.96
3
Package LH, 3-Pin (SOT-23W)
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
13
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
Package UA, 3-Pin SIP
2 31
1.27 NOM
1.02
MAX
45°
45°
C
1.52 ±0.05
B
Gate and tie bar burr area
A
B
C
Dambar removal protrusion (6×)
A
D
Active Area Depth, 0.50 mm ±0.08
Branding scale and appearance at supplier discretion
Mold Ejector
Pin Indent
0.41 +0.03
–0.06
0.43 +0.05
–0.07
14.99 ±0.25
4.09 +0.08
–0.05
3.02 +0.08
–0.05
0.79 REF
10°
Branded
Face
For Reference Only Not for Tooling Use
NOT TO SCALE
Dimensions in millimeters
Dimensions exclusive of moldflash, gate burrs, and dambar protrusions
Exact case and lead configuration at supplier discretion within limits shown
(Reference DWG-0000406, Rev. 1)
0.51 REF
DStandard Branding Reference View
A34
1
E
E
2.04
1.44 E
EHall element, not to scale
Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
14
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
For the latest version of this document, visit our website:
www.allegromicro.com
Copyright ©2018, Allegro MicroSystems, LLC
Allegro MicroSystems, LLC reserves the right to make, from time to time, such departures from the detail specifications as may be required to
permit improvements in the performance, reliability, or manufacturability of its products. Before placing an order, the user is cautioned to verify that
the information being relied upon is current.
Allegro’s products are not to be used in any devices or systems, including but not limited to life support devices or systems, in which a failure of
Allegro’s product can reasonably be expected to cause bodily harm.
The information included herein is believed to be accurate and reliable. However, Allegro MicroSystems, LLC assumes no responsibility for its
use; nor for any infringement of patents or other rights of third parties which may result from its use.
Copies of this document are considered uncontrolled documents.
Revision History
Number Date Description
February 26, 2018 Initial release
1 May 10, 2018 Corrected part numbers in selection guide (page 2); renamed RLOAD to RPULL-UP (page 2, 4, 9).