Precision Hall-Effect Switch
for Consumer and Industrial Applications
APS13295
11
Allegro MicroSystems, LLC
955 Perimeter Road
Manchester, NH 03103-3353 U.S.A.
www.allegromicro.com
POWER DERATING
The device must be operated below the maximum junction tem-
perature of the device, TJ(max). Under certain combinations of
peak conditions, reliable operation may require derating supplied
power or improving the heat dissipation properties of the appli-
cation. This section presents a procedure for correlating factors
affecting operating TJ. (Thermal data is also available on the
Allegro MicroSystems website.)
The Package Thermal Resistance, RθJA, is a figure of merit sum-
marizing the ability of the application and the device to dissipate
heat from the junction (die), through all paths to the ambient air.
Its primary component is the Effective Thermal Conductivity, K,
of the printed circuit board, including adjacent devices and traces.
Radiation from the die through the device case, RθJC, is relatively
small component of RθJA. Ambient air temperature, TA, and air
motion are significant external factors, damped by overmolding.
The resulting power dissipation capability directly reflects upon
the ability of the device to withstand extreme operating condi-
tions. The junction temperature mission profile specified in the
Absolute Maximum Ratings table designates a total operating life
capability based on qualification for the most extreme conditions,
where TJ may reach 175°C.
The silicon IC is heated internally when current is flowing into
the VCC terminal. When the output is on, current sinking into the
VOUT terminal generates additional heat. This may increase the
junction temperature, TJ, above the surrounding ambient tempera-
ture. The APS13295 is permitted to operate up to TJ = 175°C. As
mentioned above, an operating device will increase TJ according
to equations 1, 2, and 3 below. This allows an estimation of the
maximum ambient operating temperature.
PD = VIN × IIN (1)
ΔT = PD × RθJA (2)
TJ = TA + ΔT (3)
For example, given common conditions such as: TA= 25°C,
VCC = 12 V, ICC = 2 mA, VOUT = 185 mV, IOUT = 20 mA (output
on), and RθJA = 165°C/W, then:
PD = (VCC × ICC) + (VOUT × IOUT) =
(12 V × 2 mA) + (185 mV × 20 mA) =
24 mW + 3.7 mW = 27.7 mW
ΔT = PD × RθJA = 27.7 mW × 165°C/W = 4.6°C
TJ = TA + ΔT = 25°C + 4.6°C = 29.6°C
A worst-case estimate, PD(max), represents the maximum allow-
able power level (VCC(max), ICC(max)), without exceeding
TJ(max), at a selected RθJA.
For example, given the conditions RθJA = 228°C/W, TJ(max) =
175°C, VCC(max) = 24 V, ICC(max) = 4 mA, VOUT = 500 mV,
and IOUT = 25 mA (output on), the maximum allowable operating
ambient temperature can be determined.
The power dissipation required for the output is shown below:
PD(VOUT) = VOUT × IOUT = 500 mV × 25 mA = 12.5 mW
The power dissipation required for the IC supply is shown below:
PD(VCC) = VCC × ICC = 24 V × 4 mA = 96 mW
Next, by inverting using equation 2:
ΔT = PD × RθJA = [PD(VOUT) + PD(VCC)] × 228°C/W =
(12.5 mW + 96 mW) × 228°C/W =
108.5 mW × 228°C/W = 24.7°C
Finally, by inverting equation 3 with respect to voltage:
TA(est) = TJ(max) – ΔT = 175°C – 24.7°C = 150.3°C
In the above case, there is sufficient power dissipation capability
to operate up to TA(est).The example indicates that TA(max) can
be as high as 150.3°C without exceeding TJ(max). However, the
TA(max) rating of the device is 125°C; the APS13295 perfor-
mance is not guaranteed above TA = 125°C.