March 2002 / A
Page 1
SEMICONDUCTOR
TAK CHEON
G
®
500 mW DO-35 Hermetically
Sealed Glass Fast Switching
Diodes
Absolute Maximum Ratings TA = 25°C unless otherwise noted
Symbol Parameter Value Units
PD Power Dissipation 500 mW
TSTG Storage Temperature Range -65 to +200 °C
TJ Operating Junction Temperature +175 °C
WIV Working Inverse Voltage 75 V
IO Average Rectified Current 150 mA
IFM Non-repetitive Peak Forward Current 450 mA
IFSURGE Peak Forward Surge Current 2 A
These ratings are limiting values above which the serviceability of the diode may be impaired.
Specification Features:
Fast Switching Device (TRR <4.0 nS)
DO-35 Package (JEDEC)
Through-Hole Device Type Mounting
Hermetically Sealed Glass
Compression Bonded Construction
All external surfaces are corrosion resistant and leads are readily solderable
Cathode indicated by polarity band
Electrical Characteristics TA = 25°C unless otherwise noted
Limits
Symbol Parameter Test Condition
Min Max
Unit
BV Breakdown Voltage IR=100µA
IR=5µA
100
75
Volts
IR Reverse Leakage Current VR=20V
VR=75V
25
5
nA
µA
VF Forward Voltage TC1N4448, TC1N914B
TC1N4148, TC1N4148
TC1N4448, TC1N914B
IF=5mA
IF=10mA
IF=100mA
0.62 0.72
1.0
1.0
Volts
TRR Reverse Recovery Time IF=IR=10mA
RL=100Ω
IRR=1mA
4 nS
C Capacitance VR=0V, f=1MHZ 4 pF
Cathode Anode
ELECTRICAL SYMBOL
TC1N4148/TC1N4448/TC1N914B
L
xx
xx
DEVICE MARKING DIAGRAM
L : Lo
g
o
TC1Nxxxx : Device Code
AXIAL LEAD
DO35
March 2002 / A
Page 2
SEMICONDUCTOR
TAK CHEON
G
®
Electrical Symbol Definition Typical Characteristics
Symbol Parameter
BV Breakdown Voltage @ IR
IR Reverse Leakage Current @ VR
VR Reverse Voltage
IF Forward Current
VF Forward Voltage @ IF
Ordering Information
Device Package Quantity
TC1Nxxxx Bulk 10,000
TC1Nxxxx.TB Tape and Ammo 5,000
TC1Nxxxx.TR Tape and Reel 10,000
TC1Nxxxx Others (…contact Tak Cheong sales representatives)
Axial-Lead Tape Packaging Standards
This axial-lead component’s packaging requirements use in automatic testing and assembly equipment. And this standard practices for
lead-tape packaging of axial-lead components meets the requirements of EIA Standard RS-296-D “Lead-taping of Components on Axial
Lead Configuration for Automatic Insertion”.
V
I
(
mV
)
(
V
)
(
mA
)
(
µ
A
)
VF
IF
BV
IR
IR
VR
(
nA
)
March 2002 / A
Page 3
SEMICONDUCTOR
TAK CHEON
G
®
Tape & Reel Packaging Information
Tape & Reel Outline
Reel Dimensions
DIM Millimeters
D1 356
D2 30
D3 84
W1 77.5
Quantity Per Reel
PKG Type Quantity Per Reel
DO-35 10,000
March 2002 / A
Page 4
SEMICONDUCTOR
TAK CHEON
G
®
Tape & Ammo Packaging Information
Tape & Ammo
Outline
Quantity Per Ammo
Box
PKG Type Quantity Per Box
DO-35 5,000
Taping Dimensions
Description Millimeters
Standard Width 52 26
Tape Spacing (B) 52 ± 0.69 26 +0.5 / -0
Component Pitch (C) 5.08 ± 0.4 5.08 ± 0.4
Untaped Lead (L1 – L2) ± 0.69 ± 0.69
Glass Offset (F) ± 0.69 ± 0.69
Bent (D) 1.2 Max 1.2 Max
Tape Width (G) 6.138 ± 0.576 6.138 ± 0.576
Tape Mismatch (E) 0.55 Max 0.55 Max
Taped Lead (G) 3.2 Min 3.2 Min
Lead Beyond Tape (H) 0 0
250mm x 80mm x 80mm
March 2002 / A
Page 5
SEMICONDUCTOR
TAK CHEON
G
®
Bulk Packaging Information
Bulk Outline
Quantity Per Box
PKG Type Quantity Per Box
DO-35 10,000
Plastic Bag
250mm x 80mm x 80mm
DO-35 1000 x 10 Plastic Bag
Quantity Per Plastic Bag
