PR31MA11NTZ
Series
■ Features
IT
(rms)≤0.06A, Non-Zero Cross type
DIP 6pin
SSR
1. Output current, IT(rms)≤0.06A
2. Non-zero crossing functionary
3. 6 pin DIP package (SMT gullwing also available)
4. High repetitive peak off-state voltage (VDRM : 600V)
5. Superior noise immunity (dV/dt : MIN. 500V/µs)
6. Response time, ton : MAX. 100µs
7. Lead-free components are also available (see Model
Line-up section in this datasheet)
8. Double transfer mold construction (Ideal for Flow
Soldering)
9. High isolation voltage between input and output
(Viso(rms) : 5.0kV)
■ Description
PR31MA11NTZ Series Solid State Relays (SSR)
are an integration of an infrared emitting diode (IRED),
a Phototriac Detector. These devices are ideally suited
for controlling high voltage AC loads with solid state
reliability while providing 5.0kV isolation (Viso(rms))
from input to output.
1
Notice The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
Date Mar. 31. 2004
© SHARP Corporation
■ Agency approvals/Compliance
1. Isolated interface between high voltage AC devices
and lower voltage DC control circuitry.
2. Switching small capacity fans and heaters.
3. Phase or power control in applications such as
lighting and temperature control equipment.
■ Applications
1. Package resin : UL flammability grade (94V-0)
■ Internal Connection Diagram
1
6
4
1
3
5
2
2
3
4
5
6
Anode
Cathode
NC
Anode/Cathode
No external connection
Cathode/Anode
2
■ Outline Dimensions (Unit : mm)
1. Through-Hole [ex. PR31MA11NTZF] 2. SMT Gullwing Lead-Form [ex. PR31MA11NXPF]
7.12±0.5
θ
θ
θ : 0 to 13˚
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2
1.2±0.3
1 2 3
6 5 4
0.5TYP.
2.9±0.5
0.5±0.1
2.54±0.25
3.25±0.5
3.5±0.5
0.26±0.1
R31MA1
SHARP
mark
"S"
Date code (2 digit)
Model No.
Factory identification mark
Anode
mark
7.12±0.5
7.62±0.3
Epoxy resin
6.5±0.5
0.6±0.2 1.2±0.3
2.54±0.25
3.5±0.5
0.35±0.25
1.0+0.4
−0
1.0+0.4
−0
10.0+0
−0.5
0.26±0.1
1 2 3
6 5 4
R31MA1
SHARP
mark
"S"
Date code (2 digit)
Model No.
Factory identification mark
Anode
mark
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
Product mass : approx. 0.33gProduct mass : approx. 0.35g
∗Pin is not allowed external connection
5
Date code (2 digit)
Rank mark
There is no rank mark indicator and currently there are no rank offered for this device.
A.D.
1990
1991
1992
1993
1994
1995
1996
1997
1998
1999
2000
2001
Mark
A
B
C
D
E
F
H
J
K
L
M
N
Mark
P
R
S
T
U
V
W
X
A
B
C
Mark
1
2
3
4
5
6
7
8
9
O
N
D
Month
January
February
March
April
May
June
July
August
September
October
November
December
A.D
2002
2003
2004
2005
2006
2007
2008
2009
2010
2011
2012
·
·
··
·
·
2nd digit
Month of production
1st digit
Year of production
Factory identification mark
Factory identification Mark
no mark
Country of origin
Japan
* This factory marking is for identification purpose only.
Please contact the local SHARP sales representative to see the actural status of the
production.
3
repeats in a 20 year cycle
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
■ Electro-optical Characteristics
Parameter Symbol Unit
Input
Output
(Ta=25˚C)
Forward voltage
Reverse current
Repetitive peak OFF-state current
ON-state voltage
Holding current
Critical rate of rise of OFF-state voltage
Minimum trigger current
Isolation resistance
Turn-on time
VF
IR
IDRM
VT
IH
dV/dt
IFT
RISO
ton
V
µA
µA
V
mA
V/µs
mA
Ω
µs
IF=20mA
VR=3V
VD=VDRM
IT=60mA
VD=6V
VD=1/√−
2 ·VDRM
VD=6V, RL=100Ω
DC500V,40 to 60%RH
V
D=
6V, R
L=
100Ω, I
F=
20mA
Conditions
−
−
−
−
0.1
500
−
5
×
1010
−
1.2
−
−
−
1.0
−
−
1011
−
1.4
10
1
2.5
3.5
−
10
−
100
MIN. TYP. MAX.
Transfer
charac-
teristics
■ Absolute Maximum Ratings
4
Parameter Symbol Rating Unit
(Ta=25˚C)
Forward current
Reverse voltage
RMS ON-state current
Peak one cycle surge current
Repetitive peak OFF-state voltage
Isolation voltage
Operating temperature
Storage temperature
Soldering temperature
*2
*1
IF
VR
IT(rms)
Isurge
VDRM
Viso(rms)
Topr
Tstg
Tsol
mA
V
mA
A
V
kV
˚C
˚C
˚C
*4
*3
*3
*5
50
6
60
1.2
600
5.0
−30 to +80
−55 to +125
270
*1 40 to 60%RH, AC for 1minute, f=60Hz
*2 For 10s
*3 Refer to Fig.1, Fig.2
*4 f=50Hz sine wave
*5 Lead solder plating models: 260˚C
Input
Output
PR31MA11NTZ Series
1mm
Soldering area
Sheet No.: D4-A00101EN
Lead Form
Shipping Package
Model No.
Through-Hole
MAX.10
Sleeve
50pcs/sleeve
Taping
1 000pcs/reel
SMT Gullwing
PR31MA11NTZF PR31MA11NXPF 600
IFT[mA]
(VD=6V,
RL=100Ω)
VDRM
[V]
5
Please contact a local SHARP sales representative to see the actual status of the production.
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
■ Model Line-up (1) (Lead-free components)
■ Model Line-up (2) (Lead solder plating components)
Lead Form
Shipping Package
Model No.
Through-Hole
MAX.10
Sleeve
50pcs/sleeve
Taping
1 000pcs/reel
SMT Gullwing
PR31MA11NTZ −600
IFT[mA]
(VD=6V,
RL=100Ω)
VDRM
[V]
6
PR31MA11NTZ Series
0 10050
0
10
20
30
40
50
60
−30
Forward current IF (mA)
Ambient temperature Ta (˚C)
Fig.1 Forward Current vs. Ambient
Temperature
Fig.2 RMS ON-state Current vs.
Ambient Temperature
Sheet No.: D4-A00101EN
050100
0
20
30
40
50
60
70
10
−30
RMS ON-state current IT (mA)
Ambient temperature Ta (˚C)
Resistance
load,
60Hz
AC200V
0.9 1.0 1.1 1.2 1.3 1.4 1.5
10
100
1
5
50
0˚C
−25˚C
50˚C
25˚C
Ta=75˚C
Forward current IF (mA)
Forward voltage VF (V)
Fig.3 Forward Current vs. Forward Voltage Fig.4 Minimum Trigger Current vs.
Ambient Temperature
−30 0 20 406080100
0
2
4
6
8
10
12
VD=6V
RL=100Ω
Minimum trigger current IFT (mA)
Ambient temperature Ta (˚C)
Fig.5 ON-state Voltage vs.
Ambient Temperature
Fig.6 Relative Holding Current vs.
Ambient Temperature
−40 −20 0 20 40 8060 100
1.0
1.2
1.3
1.5
1.4
1.6
1.7
1.8
1.9
2.0
ON-state voltage VT (V)
Ambient temperature Ta (˚C)
1.1
IT=60mA
−40 −20 0 20 406080100
10
100
1 000
Relative holding current IH(t˚C)/IH(25˚C)×100%
Ambient temperature Ta (˚C)
VD=6V
7
PR31MA11NTZ Series
Fig.8 Turn-on Time vs. Forward Current
Sheet No.: D4-A00101EN
Remarks : Please be aware that all data in the graph are just for reference.
Fig.7 ON-state Current vs. ON-state Voltage
10 20 30 40 50 60 70
Turn-on time ton (µs)
Forward current IF (mA)
VD=6V
RL=100Ω
Ta=25˚C
1
10
100
0 0.5 1 1.5 2
0
20
40
60
80
100
IF=20mA
Ta=25˚C
ON-state current IT (mA)
ON-state voltage VT (V)
8
PR31MA11NTZ Series
■ Design Considerations
In order for the SSR to turn off, the triggering current (IF) must be 0.1mA or less.
In phase control applications or where the SSR is being by a pulse signal, please ensure that the pulse width
is a minimum of 1ms.
When the input current (IF) is below 0.1mA, the output Triac will be in the open circuit mode. However, if the
voltage across the Triac, VD, increases faster than rated dV/dt, the Triac may turn on. To avoid this situation,
please incorporate a snubber circuit. Due to the many different types of load that can be driven, we can
merely recommend some circuit values to start with : Cs=0.022µF and Rs=47Ω. The operation of the SSR
and snubber circuit should be tested and if unintentional switching occurs, please adjust the snubber circuit
component values accordingly.
Any snubber or Varistor used for the above mentioned scenarios should be located as close to the main
output triac as possible.
All pins shall be used by soldering on the board. (Socket and others shall not be used.)
● Degradation
In general, the emission of the IRED used in SSR will degrade over time.
In the case where long term operation and / or constant extreme temperature fluctuations will be applied to
the devices, please allow for a worst case scenario of 50% degradation over 5years.
Therefore in order to maintain proper operation, a design implementing these SSRs should provide at least
twice the minimum required triggering current from initial operation.
● Design guide
Sheet No.: D4-A00101EN
● Recommended Operating Conditions
Parameter Symbol Unit
Input
Output
Input signal current at ON state
Input signal current at OFF state
Load supply voltage
Load supply current
Frequency
Operating temperature
IF(ON)
IF(OFF)
VOUT(rms)
IOUT(rms)
f
Topr
mA
mA
V
mA
Hz
˚C
−
−
−
Locate snubber circuit between output terminals
(Cs=0.022µF, Rs=47Ω)
−
−
Conditions
20
0
−
−
50
−20
25
0.1
240
IT(rms)×80%(∗)
60
70
MIN. MAX.
(∗) See Fig.2 about derating curve (IT(rms) vs. ambient temperature).
9
PR31MA11NTZ Series
✩ For additional design assistance, please review our corresponding Optoelectronic Application Notes.
● Standard Circuit
Tr1
R1
D1
V1
+VCC
AC Line
Load
ZS
ZS : Surge absorption circuit (Snubber circuit)
SSR
61
24
Sheet No.: D4-A00101EN
● Recommended Foot Print (reference)
SMT Gullwing Lead-form
2.542.54
1.7
2.2
8.2
(Unit : mm)
■ Manufacturing Guidelines
Reflow Soldering:
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
● Soldering Method
Flow Soldering :
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Other notices
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
10
1234
300
200
100
00
(˚C)
Terminal : 260˚C peak
( package surface : 250˚C peak)
Preheat
150 to 180˚C, 120s or less
Reflow
220˚C or more, 60s or less
(min)
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
11
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
Solvent cleaning :
Solvent temperature should be 45˚C or below. Immersion time should be 3minutes or less.
Ultrasonic cleaning :
The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time,
size of PCB and mounting method of the device.
Therefore, please make sure the device withstands the ultrasonic cleaning in actual conditions in advance of
mass production.
Recommended solvent materials :
Ethyl alcohol, Methyl alcohol and Isopropyl alcohol.
In case the other type of solvent materials are intended to be used, please make sure they work fine in
actual using conditions since some materials may erode the packaging resin.
● Cleaning instructions
This product shall not contain the following materials.
And they are not used in the production process for this device.
Regulation substances : CFCs, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
Specific brominated flame retardants such as the PBBOs and PBBs are not used in this product at all.
● Presence of ODC
■ Package specification
12
12.0
6.7
5.8
10.8
520
±2
● Sleeve package
Through-Hole
Package materials
Sleeve : HIPS (with anti-static material)
Stopper : Styrene-Elastomer
Package method
MAX. 50pcs of products shall be packaged in a sleeve.
Both ends shall be closed by tabbed and tabless stoppers.
The product shall be arranged in the sleeve with its anode mark on the tabless stopper side.
MAX. 20 sleeves in one case.
Sleeve outline dimensions
(Unit : mm)
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
13
● Tape and Reel package
SMT Gullwing
Package materials
Carrier tape : A-PET (with anti-static material)
Cover tape : PET (three layer system)
Reel : PS
Carrier tape structure and Dimensions
F
K
EI
DJ
B
H
H
A
C
G
5˚MAX.
Dimensions List (Unit:mm)
A
16.0±0.3
B
7.5±0.1
C
1.75±0.1
D
12.0±0.1
E
2.0±0.1
H
10.4±0.1
I
0.4±0.05
J
4.2±0.1
K
7.8±0.1
F
4.0±0.1
G
φ1.5+0.1
−0
a
c
e
g
f
b
d
Dimensions List (Unit : mm)
a
330
b
17.5±1.5
c
100±1.0
d
13±0.5
e
23±1.0
f
2.0±0.5
g
2.0±0.5
Pull-out direction
[Packing : 1 000pcs/reel]
Reel structure and Dimensions
Direction of product insertion
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
· The circuit application examples in this publication are
provided to explain representative applications of
SHARP devices and are not intended to guarantee any
circuit design or license any intellectual property rights.
SHARP takes no responsibility for any problems rela-
ted to any intellectual property right of a third party re-
sulting from the use of SHARP's devices.
· Contact SHARP in order to obtain the latest device
specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the spec-
ifications, characteristics, data, materials, structure,
and other contents described herein at any time without
notice in order to improve design or reliability. Manufac-
turing locations are also subject to change without no-
tice.
· Observe the following points when using any devices
in this publication. SHARP takes no responsibility for
damage caused by improper use of the devices which
does not meet the conditions and absolute maximum
ratings to be used specified in the relevant specification
sheet nor meet the following conditions:
(i) The devices in this publication are designed for use
in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant
design should be taken to ensure reliability and safety
when SHARP devices are used for or in connection
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connec-
tion with equipment that requires an extremely high lev-
el of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· If the SHARP devices listed in this publication fall with-
in the scope of strategic products described in the For-
eign Exchange and Foreign Trade Law of Japan, it is
necessary to obtain approval to export such SHARP de-
vices.
· This publication is the proprietary product of SHARP
and is copyrighted, with all rights reserved. Under the
copyright laws, no part of this publication may be repro-
duced or transmitted in any form or by any means, elec-
tronic or mechanical, for any purpose, in whole or in
part, without the express written permission of SHARP.
Express written permission is also required before any
use of this publication may be made by a third party.
· Contact and consult with a SHARP representative if
there are any questions about the contents of this pub-
lication.
14
■ Important Notices
PR31MA11NTZ Series
Sheet No.: D4-A00101EN
