PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR 144 ELECTRICAL SPECIFICATIONS Nominal Frequency 14.7456MHz Frequency Tolerance/Stability 50ppm Maximum over -20C to +70C (Inclusive of all conditions: Calibration Tolerance at 25C, Frequency Stability over the Operating Temperature Range, Supply Voltage Change, Output Load Change, First Year Aging at 25, 260C Reflow, Shock, and Vibration) Aging at 25C 5ppm/Year Maximum Supply Voltage 3.3Vdc 5% Input Current 12mA Maximum Output Voltage Logic High (Voh) 90% of Vdd Minimum (IOH = -8mA) Output Voltage Logic Low (Vol) 10% of Vdd Maximum (IOL = +8mA) Rise/Fall Time 6nSec Maximum (Measured at 20% to 80% of waveform) Duty Cycle 50 5(%) (Measured at 50% of waveform) Load Drive Capability 30pF Maximum Output Logic Type CMOS Pin 1 Connection Tri-State Pin 1 Input Voltage (Vih and Vil) 90% of Vdd Minimum or No Connect to Enable Output, 10% of Vdd Maximum to Disable Output Disable Current 8mA Maximum (Pin 1 = Ground) Absolute Clock Jitter 350pSec Maximum Start Up Time 10mSec Maximum Storage Temperature Range -55C to 125C ENVIRONMENTAL & MECHANICAL SPECIFICATIONS ESD Susceptibility MIL-STD-883, Method 3015, Class 1, HBM: 1500Vdc Fine Leak Test MIL-STD-883, Method 1014, Condition A Gross Leak Test MIL-STD-883, Method 1014, Condition C Mechanical Shock MIL-STD-883, Method 2002, Condition B Moisture Resistance MIL-STD-883, Method 1004 Moisture Sensitivity J-STD-020, MSL 1 Resistance to Soldering Heat MIL-STD-202, Method 210, Condition K Resistance to Solvents MIL-STD-202, Method 215 Solderability MIL-STD-883, Method 2003 Temperature Cycling MIL-STD-883, Method 1010, Condition B Thermal Shock MIL-STD-883, Method 1011, Condition B Vibration MIL-STD-883, Method 2007, Condition A www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 1 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR MECHANICAL DIMENSIONS (all dimensions in millimeters) MARKING ORIENTATION 2.50 0.15 1.05 0.15 3.20 0.15 0.75 0.10 (X4) 2 3 1.20 0.10 4 CONNECTION 1 Tri-State 2 Ground 3 Output 4 Supply Voltage LINE MARKING 1.00 0.10 1 PIN 1 E14.745 E=Ecliptek Designator 2 XXXXX XXXXX=Ecliptek Manufacturing Identifier 1.00 0.10 Suggested Solder Pad Layout All Dimensions in Millimeters 0.95 (X4) 1.20 (X4) Solder Land (X4) 1.00 0.80 All Tolerances are 0.1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 2 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR CLOCK OUTPUT TRI-STATE INPUT OUTPUT WAVEFORM & TIMING DIAGRAM VIH VIL VOH 80% of Waveform OUTPUT DISABLE (HIGH IMPEDANCE STATE) 50% of Waveform 20% of Waveform VOL tPLZ Fall Time Rise Time tPZL TW T Duty Cycle (%) = TW/T x 100 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 3 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR Test Circuit for CMOS Output Oscilloscope + + Power Supply _ Current Meter _ Supply Voltage (VDD) Frequency Counter Probe (Note 2) Output + Voltage Meter _ 0.01F (Note 1) 0.1F (Note 1) Ground CL (Note 3) Tri-State or Power Down Note 1: An external 0.01F ceramic bypass capacitor in parallel with a 0.1F high frequency ceramic bypass capacitor close (less than 2mm) to the package ground and supply voltage pin is required. Note 2: A low input capacitance (<12pF), 10X Attentuation Factor, High Impedance (>10Mohms), and High bandwidth (>300MHz) passive probe is recommended. Note 3: Capacitance value CL includes sum of all probe and fixture capacitance. See applicable specification sheet for `Load Drive Capability'. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 4 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR Tape & Reel Dimensions Quantity Per Reel: 1,000 units All Dimensions in Millimeters Compliant to EIA-481 4.00 0.10 2.00 0.05 0.60 MAX DIA 1.50 +0.10/-0.00 0.10 MAX 1.75 0.10 3.50 0.05 8.00 0.30 B0 DIA 1.00 MIN 4.00 0.10 A0 1.50 MIN K0 14.40 MAX DIA 40 MIN Access Hole at Slot Location 180 MAX DIA 50 MIN DIA 20.20 MIN DIA 13.00 0.20 2.50 MIN Width 10 MIN Depth Tape slot in Core for Tape Start 8.40 +1.50/-0.00 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 5 of 7 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak High Temperature Infrared/Convection TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Time (t) tP 3C/second Maximum 150C 175C 200C 60 - 180 Seconds 3C/second Maximum 217C 60 - 150 Seconds 260C Maximum for 10 Seconds Maximum 250C +0/-5C 20 - 40 seconds 6C/second Maximum 8 minutes Maximum Level 1 www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 6 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200 PART NUMBER DATA SHEET EP13E7D2H-14.7456M TR Recommended Solder Reflow Methods Critical Zone TL to T P Temperature (T) TP Ramp-up Ramp-down TL TS Max TS Min tL t S Preheat t 25C to Peak Low Temperature Infrared/Convection 240C TS MAX to TL (Ramp-up Rate) Preheat - Temperature Minimum (TS MIN) - Temperature Typical (TS TYP) - Temperature Maximum (TS MAX) - Time (tS MIN) Ramp-up Rate (TL to TP) Time Maintained Above: - Temperature (TL) - Time (tL) Peak Temperature (TP) Target Peak Temperature (TP Target) Time within 5C of actual peak (tp) Ramp-down Rate Time 25C to Peak Temperature (t) Moisture Sensitivity Level Time (t) tP 5C/second Maximum N/A 150C N/A 60 - 120 Seconds 5C/second Maximum 150C 200 Seconds Maximum 240C Maximum 240C Maximum 2 Times / 230C Maximum 1 Time 10 seconds Maximum 2 Times / 80 seconds Maximum 1 Time 5C/second Maximum N/A Level 1 Low Temperature Manual Soldering 185C Maximum for 10 seconds Maximum, 2 times Maximum. High Temperature Manual Soldering 260C Maximum for 5 seconds Maximum, 2 times Maximum. www.ecliptek.com | Specification Subject to Change Without Notice | Revision H 12/11/2012 | Page 7 of 7 Ecliptek Corporation 3545 Cadillac Ave., Costa Mesa, CA 92626 1-800-ECLIPTEK or 714.433.1200