January 2013 I
© 2013 Microsemi Corporation
ProASIC3 Flash Family FPGAs
with Optional Soft ARM Support
Features and Benefits
High Capacity
• 15 k to 1 M System Gates
• Up to 144 kbits of True Dual-Port SRAM
• Up to 300 User I/Os
Reprogrammable Flash Technology
• 130-nm, 7-Layer Metal (6 Copper), Flash-Based CMOS
Process
• Instant On Level 0 Support
• Single-Chip Solution
• Retains Programmed Design when Powered Off
High Performance
• 350 MHz System Performance
• 3.3 V, 66 MHz 64-Bit PCI†
In-System Programming (ISP) and Security
• ISP Using On-Chip 128-Bit Advanced Encryption Standard
(AES) Decryption (except ARM®-enabled ProASIC®3 devices)
via JTAG (IEEE 1532–compliant)†
• FlashLock® to Secure FPGA Contents
Low Power
• Core Voltage for Low Power
• Support for 1.5 V-Only Systems
• Low-Impedance Flash Switches
High-Performance Routing Hierarchy
• Segmented, Hierarchical Routing and Clock Structure
Advanced I/O
• 700 Mbps DDR, LVDS-Capable I/Os (A3P250 and above)
• 1.5 V, 1.8 V, 2.5 V, and 3.3 V Mixed-Voltage Operation
• Wide Range Power Supply Voltage Support per JESD8-B,
Allowing I/Os to Operate from 2.7 V to 3.6 V
• Bank-Selectable I/O Voltages—up to 4 Banks per Chip
• Single-Ended I/O Standards: LVTTL, LVCMOS 3.3 V /
2.5 V / 1.8 V / 1.5 V, 3.3 V PCI / 3.3 V PCI-X† and LVCMOS
2.5 V / 5.0 V Input
• Differential I/O Standards: LVPECL, LVDS, B-LVDS, and
M-LVDS (A3P250 and above)
• I/O Registers on Input, Output, and Enable Paths
• Hot-Swappable and Cold Sparing I/Os‡
• Programmable Output Slew Rate† and Drive Strength
• Weak Pull-Up/-Down
• IEEE 1149.1 (JTAG) Boundary Scan Test
• Pin-Compatible Packages across the ProASIC3 Family
Clock Conditioning Circuit (CCC) and PLL†
• Six CCC Blocks, One with an Integrated PLL
• Configurable Phase-Shift, Multiply/Divide, Delay Capabilities
and External Feedback
• Wide Input Frequency Range (1.5 MHz to 350 MHz)
Embedded Memory†
• 1 kbit of FlashROM User Nonvolatile Memory
• SRAMs and FIFOs with Variable-Aspect-Ratio 4,608-Bit RAM
Blocks (×1, ×2, ×4, ×9, and ×18 organizations)†
• True Dual-Port SRAM (except ×18)
ARM Processor Support in ProASIC3 FPGAs
• M1 ProASIC3 Devices—ARM®Cortex™-M1 Soft Processor
Available with or without Debug
† A3P015 and A3P030 devices do not support this feature. ‡ Supported only by A3P015 and A3P030 devices.
ProASIC3 Devices A3P0151A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Cortex-M1 Devices 2M1A3P250 M1A3P400 M1A3P600 M1A3P1000
System Gates 15,000 30,000 60,000 125,000 250,000 400,000 600,000 1,000,000
Typical Equivalent Macrocells 128 256 512 1,024 2,048 – – –
VersaTiles (D-flip-flops) 384 768 1,536 3,072 6,144 9,216 13,824 24,576
RAM Kbits (1,024 bits) – – 18 36 36 54 108 144
4,608-Bit Blocks ––488122432
FlashROM Kbits 11111 1 1 1
Secure (AES) ISP 3– – Yes Yes Yes Yes Yes Yes
Integrated PLL in CCCs ––111 1 1 1
VersaNet Globals 46 6 18 18 18 18 18 18
I/O Banks 22224 4 4 4
Maximum User I/Os 49 81 96 133 157 194 235 300
Package Pins
QFN
CS
VQFP
TQFP
PQFP
FBGA
QN68 QN48, QN68,
QN132
VQ100
QN132
CS121
VQ100
TQ144
FG144
QN132
VQ100
TQ144
PQ208
FG144
QN132 5
VQ100
PQ208
FG144/256 5PQ208
FG144/256/
484
PQ208
FG144/256/
484
PQ208
FG144/256/
484
Notes:
1. A3P015 is not recommended for new designs.
2. Refer to the Cortex-M1 product brief for more information.
3. AES is not available for Cortex-M1 ProASIC3 devices.
4. Six chip (main) and three quadrant global networks are available for A3P060 and above.
5. The M1A3P250 device does not support this package.
6. For higher densities and support of additional features, refer to the ProASIC3E Flash Family FPGAs datasheet.
Revision 13
ProASIC3 Flash Family FPGAs
II Revision 13
I/Os Per Package 1
ProASIC3
Devices A3P0152A3P030 A3P060 A3P125 A3P250 3A3P400 3A3P600 A3P1000
Cortex-M1
Devices M1A3P250 3,5 M1A3P400 3M1A3P600 M1A3P1000
Package
I/O Type
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O
Single-Ended I/O4
Differential I/O Pairs
Single-Ended I/O4
Differential I/O Pairs
Single-Ended I/O4
Differential I/O Pairs
Single-Ended I/O4
Differential I/O Pairs
QN48 – 34 – – – – –––––
QN68 49 49 – – – – – – – – –
QN1325– 8180848719–– –––
CS121 – – 96 – – – ––––––
VQ100 – 77 71 71 68 13 – – – – –
TQ144 – – 91 100 – – ––––––
PQ208 – – – 133 151 34 151 34 154 35 154 35
FG144 – – 96 97 97 24 972597259725
FG2565,6 – – – – 157 38 178 38 177 43 177 44
FG4846– – – – – – 194 38 235 60 300 74
Notes:
1. When considering migrating your design to a lower- or higher-density device, refer to the ProASIC3 FPGA Fabric User’s Guide
to ensure complying with design and board migration requirements.
2. A3P015 is not recommended for new designs.
3. For A3P250 and A3P400 devices, the maximum number of LVPECL pairs in east and west banks cannot exceed 15. Refer to
the ProASIC3 FPGA Fabric User’s Guide for position assignments of the 15 LVPECL pairs.
4. Each used differential I/O pair reduces the number of single-ended I/Os available by two.
5. The M1A3P250 device does not support FG256 or QN132 packages.
6. FG256 and FG484 are footprint-compatible packages.
Table 1 • ProASIC3 FPGAs Package Sizes Dimensions
Package CS121 QN48 QN68 QN132 VQ100 TQ144 PQ208 FG144 FG256 FG484
Length × Width
(mm\mm)
6 × 6 6 × 6 8 × 8 8 × 8 14 × 14 20 × 20 28 × 28 13 × 13 17 × 17 23 × 23
Nominal Area
(mm2)
36 36 64 64 196 400 784 169 289 529
Pitch (mm) 0.5 0.4 0.4 0.5 0.5 0.5 0.5 1.0 1.0 1.0
Height (mm) 0.99 0.90 0.90 0.75 1.00 1.40 3.40 1.45 1.60 2.23
ProASIC3 Flash Family FPGAs
Revision 13 III
ProASIC3 Ordering Information
ProASIC3 Device Status
.
ProASIC3 Devices Status Cortex-M1 Devices Status
A3P015 Not recommended for new designs.
A3P030 Production
A3P060 Production
A3P125 Production
A3P250 Production M1A3P250 Production
A3P400 Production M1A3P400 Production
A3P600 Production M1A3P600 Production
A3P1000 Production M1A3P1000 Production
Speed Grade
Blank = Standard
1 = 15% Faster than Standard
2 = 25% Faster than Standard
A3P1000 FG
_
Part Number
ProASIC3 Devices
1
Package Type
VQ =Very Thin Quad Flat Pack (0.5 mm pitch)
QN =Quad Flat Pack No Leads (0.4 mm and 0.5 mm pitches)
TQ =Thin Quad Flat Pack (0.5 mm pitch)
144 I
Y
Package Lead Count
G
Lead-Free Packaging
Application (Temperature Range)
Blank = Commercial (0°C to +70°C Ambient Temperature)
I = Industrial (–40°C to +85°C Ambient Temperature)
Blank = Standard Packaging
G= RoHS-Compliant (Green) Packaging (some packages also halogen-free)
PP= Pre-Production
ES= Engineering Sample (Room Temperature Only)
30,000 System Gates
A3P030 =
15,000 System Gates (A3P015 is not recommended for new designs.)
A3P015 =
60,000 System Gates
A3P060 =
125,000 System Gates
A3P125 =
250,000 System Gates
A3P250 =
400,000 System Gates
A3P400 =
600,000 System Gates
A3P600 =
1,000,000 System Gates
A3P1000 =
ProASIC3 Devices with Cortex-M1
250,000 System Gates
M1A3P250 =
400,000 System Gates
M1A3P400 =
600,000 System Gates
M1A3P600 =
1,000,000 System Gates
M1A3P1000 =
PQ =Plastic Quad Flat Pack (0.5 mm pitch)
FG =Fine Pitch Ball Grid Array (1.0 mm pitch)
CS =Chip Scale Package (0.5 mm pitch)
Security Feature
Y = Device Includes License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio
Blank = Device Does Not Include License to Implement IP Based
on the Cryptography Research, Inc. (CRI) Patent Portfolio
ProASIC3 Flash Family FPGAs
IV Revision 13
Temperature Grade Offerings
Speed Grade and Temperature Grade Matrix
References made to ProASIC3 devices also apply to ARM-enabled ProASIC3 devices. The ARM-enabled part numbers start with
M1 (Cortex-M1).
Contact your local Microsemi representative for device availability: http://www.microsemi.com/soc/contact/default.aspx.
A3P015 and A3P030
The A3P015 and A3P030 are architecturally compatible; there are no RAM or PLL features.
Devices Not Recommended For New Designs
A3P015 is not recommended for new designs.
Package A3P015*A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Cortex-M1 Devices M1A3P250 M1A3P400 M1A3P600 M1A3P1000
QN48 – C, I – – – – – –
QN68 C, I C, I – – – – – –
QN132 – C, I C, I C, I C, I – – –
CS121 ––C, I–––– –
VQ100 – C, IC, IC, I C, I – – –
TQ144 ––C, IC, I––– –
PQ208 – – – C, I C, I C, I C, I C, I
FG144 – – C, I C, I C, I C, I C, I C, I
FG256 – – – – C, I C, I C, I C, I
FG484 – – – – – C, I C, I C, I
Note: *A3P015 is not recommended for new designs.
C = Commercial temperature range: 0°C to 70°C ambient temperature
I = Industrial temperature range: –40°C to 85°C ambient temperature
Temperature Grade Std. –1 –2
C1
I2
Notes:
1. C = Commercial temperature range: 0°C to 70°C ambient temperature
2. I = Industrial temperature range: –40°C to 85°C ambient temperature
ProASIC3 Flash Family FPGAs
Revision 13 V
Table of Contents
ProASIC3 Device Family Overview
General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
ProASIC3 DC and Switching Characteristics
General Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
Calculating Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6
User I/O Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-14
VersaTile Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-80
Global Resource Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-84
Clock Conditioning Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-89
Embedded SRAM and FIFO Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-91
Embedded FlashROM Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-107
JTAG 1532 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-108
Pin Descriptions
Supply Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
User Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
JTAG Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
Special Function Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Related Documents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4
Package Pin Assignments
QN48 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
QN68 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
QN132 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6
CS121 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-15
VQ100 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-18
TQ144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-23
PQ208 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-28
FG144 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-39
FG256 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-52
FG484 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-65
Datasheet Information
List of Changes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
Datasheet Categories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
Safety Critical, Life Support, and High-Reliability Applications Policy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13
Revision 13 1-1
1 – ProASIC3 Device Family Overview
General Description
ProASIC3, the third-generation family of Microsemi flash FPGAs, offers performance, density, and
features beyond those of the ProASICPLUS® family. Nonvolatile flash technology gives ProASIC3 devices
the advantage of being a secure, low power, single-chip solution that is Instant On. ProASIC3 is
reprogrammable and offers time-to-market benefits at an ASIC-level unit cost. These features enable
designers to create high-density systems using existing ASIC or FPGA design flows and tools.
ProASIC3 devices offer 1 kbit of on-chip, reprogrammable, nonvolatile FlashROM storage as well as
clock conditioning circuitry based on an integrated phase-locked loop (PLL). The A3P015 and A3P030
devices have no PLL or RAM support. ProASIC3 devices have up to 1 million system gates, supported
with up to 144 kbits of true dual-port SRAM and up to 300 user I/Os.
ProASIC3 devices support the ARM Cortex-M1 processor. The ARM-enabled devices have Microsemi
ordering numbers that begin with M1A3P (Cortex-M1) and do not support AES decryption.
Flash Advantages
Reduced Cost of Ownership
Advantages to the designer extend beyond low unit cost, performance, and ease of use. Unlike SRAM-
based FPGAs, flash-based ProASIC3 devices allow all functionality to be Instant On; no external boot
PROM is required. On-board security mechanisms prevent access to all the programming information
and enable secure remote updates of the FPGA logic. Designers can perform secure remote in-system
reprogramming to support future design iterations and field upgrades with confidence that valuable
intellectual property (IP) cannot be compromised or copied. Secure ISP can be performed using the
industry-standard AES algorithm. The ProASIC3 family device architecture mitigates the need for ASIC
migration at higher user volumes. This makes the ProASIC3 family a cost-effective ASIC replacement
solution, especially for applications in the consumer, networking/ communications, computing, and
avionics markets.
Security
The nonvolatile, flash-based ProASIC3 devices do not require a boot PROM, so there is no vulnerable
external bitstream that can be easily copied. ProASIC3 devices incorporate FlashLock, which provides a
unique combination of reprogrammability and design security without external overhead, advantages that
only an FPGA with nonvolatile flash programming can offer.
ProASIC3 devices utilize a 128-bit flash-based lock and a separate AES key to provide the highest level
of protection in the FPGA industry for intellectual property and configuration data. In addition, all
FlashROM data in ProASIC3 devices can be encrypted prior to loading, using the industry-leading
AES-128 (FIPS192) bit block cipher encryption standard. The AES standard was adopted by the National
Institute of Standards and Technology (NIST) in 2000 and replaces the 1977 DES standard. ProASIC3
devices have a built-in AES decryption engine and a flash-based AES key that make them the most
comprehensive programmable logic device security solution available today. ProASIC3 devices with
AES-based security provide a high level of protection for remote field updates over public networks such
as the Internet, and are designed to ensure that valuable IP remains out of the hands of system
overbuilders, system cloners, and IP thieves.
ARM-enabled ProASIC3 devices do not support user-controlled AES security mechanisms. Since the
ARM core must be protected at all times, AES encryption is always on for the core logic, so bitstreams
are always encrypted. There is no user access to encryption for the FlashROM programming data.
Security, built into the FPGA fabric, is an inherent component of the ProASIC3 family. The flash cells are
located beneath seven metal layers, and many device design and layout techniques have been used to
make invasive attacks extremely difficult. The ProASIC3 family, with FlashLock and AES security, is
unique in being highly resistant to both invasive and noninvasive attacks.
ProASIC3 Device Family Overview
1-2 Revision 13
Your valuable IP is protected with industry-standard security, making remote ISP possible. A ProASIC3
device provides the best available security for programmable logic designs.
Single Chip
Flash-based FPGAs store their configuration information in on-chip flash cells. Once programmed, the
configuration data is an inherent part of the FPGA structure, and no external configuration data needs to
be loaded at system power-up (unlike SRAM-based FPGAs). Therefore, flash-based ProASIC3 FPGAs
do not require system configuration components such as EEPROMs or microcontrollers to load device
configuration data. This reduces bill-of-materials costs and PCB area, and increases security and system
reliability.
Instant On
Flash-based ProASIC3 devices support Level 0 of the Instant On classification standard. This feature
helps in system component initialization, execution of critical tasks before the processor wakes up, setup
and configuration of memory blocks, clock generation, and bus activity management. The Instant On
feature of flash-based ProASIC3 devices greatly simplifies total system design and reduces total system
cost, often eliminating the need for CPLDs and clock generation PLLs that are used for these purposes in
a system. In addition, glitches and brownouts in system power will not corrupt the ProASIC3 device's
flash configuration, and unlike SRAM-based FPGAs, the device will not have to be reloaded when
system power is restored. This enables the reduction or complete removal of the configuration PROM,
expensive voltage monitor, brownout detection, and clock generator devices from the PCB design. Flash-
based ProASIC3 devices simplify total system design and reduce cost and design risk while increasing
system reliability and improving system initialization time.
Firm Errors
Firm errors occur most commonly when high-energy neutrons, generated in the upper atmosphere, strike
a configuration cell of an SRAM FPGA. The energy of the collision can change the state of the
configuration cell and thus change the logic, routing, or I/O behavior in an unpredictable way. These
errors are impossible to prevent in SRAM FPGAs. The consequence of this type of error can be a
complete system failure. Firm errors do not exist in the configuration memory of ProASIC3 flash-based
FPGAs. Once it is programmed, the flash cell configuration element of ProASIC3 FPGAs cannot be
altered by high-energy neutrons and is therefore immune to them. Recoverable (or soft) errors occur in
the user data SRAM of all FPGA devices. These can easily be mitigated by using error detection and
correction (EDAC) circuitry built into the FPGA fabric.
Low Power
Flash-based ProASIC3 devices exhibit power characteristics similar to an ASIC, making them an ideal
choice for power-sensitive applications. ProASIC3 devices have only a very limited power-on current
surge and no high-current transition period, both of which occur on many FPGAs.
ProASIC3 devices also have low dynamic power consumption to further maximize power savings.
ProASIC3 Flash Family FPGAs
Revision 13 1-3
Advanced Flash Technology
The ProASIC3 family offers many benefits, including nonvolatility and reprogrammability through an
advanced flash-based, 130-nm LVCMOS process with seven layers of metal. Standard CMOS design
techniques are used to implement logic and control functions. The combination of fine granularity,
enhanced flexible routing resources, and abundant flash switches allows for very high logic utilization
without compromising device routability or performance. Logic functions within the device are
interconnected through a four-level routing hierarchy.
Advanced Architecture
The proprietary ProASIC3 architecture provides granularity comparable to standard-cell ASICs. The
ProASIC3 device consists of five distinct and programmable architectural features (Figure 1-1 and
Figure 1-2 on page 1-4):
• FPGA VersaTiles
• Dedicated FlashROM
• Dedicated SRAM/FIFO memory†
• Extensive CCCs and PLLs†
• Advanced I/O structure
† The A3P015 and A3P030 do not support PLL or SRAM.
Note: *Not supported by A3P015 and A3P030 devices
Figure 1-1 • ProASIC3 Device Architecture Overview with Two I/O Banks (A3P015, A3P030, A3P060, and
A3P125)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block*
VersaTile
CCC
I/Os
ISP AES
Decryption*
User Nonvolatile
FlashROM Charge Pumps
Bank 0
Bank 1Bank 1
Bank 0Bank 0
Bank 1
ProASIC3 Device Family Overview
1-4 Revision 13
The FPGA core consists of a sea of VersaTiles. Each VersaTile can be configured as a three-input logic
function, a D-flip-flop (with or without enable), or a latch by programming the appropriate flash switch
interconnections. The versatility of the ProASIC3 core tile as either a three-input lookup table (LUT)
equivalent or as a D-flip-flop/latch with enable allows for efficient use of the FPGA fabric. The VersaTile
capability is unique to the Microsemi ProASIC family of third-generation architecture flash FPGAs.
VersaTiles are connected with any of the four levels of routing hierarchy. Flash switches are distributed
throughout the device to provide nonvolatile, reconfigurable interconnect programming. Maximum core
utilization is possible for virtually any design.
VersaTiles
The ProASIC3 core consists of VersaTiles, which have been enhanced beyond the ProASICPLUS® core
tiles. The ProASIC3 VersaTile supports the following:
• All 3-input logic functions—LUT-3 equivalent
• Latch with clear or set
• D-flip-flop with clear or set
• Enable D-flip-flop with clear or set
Refer to Figure 1-3 for VersaTile configurations.
Figure 1-2 • ProASIC3 Device Architecture Overview with Four I/O Banks (A3P250, A3P600, and A3P1000)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
(A3P600 and A3P1000)
RAM Block
4,608-Bit Dual-Port
SRAM or FIFO Block
VersaTile
CCC
I/Os
ISP AES
Decryption
User Nonvolatile
FlashROM Charge Pumps
Bank 0
Bank 3Bank 3
Bank 1Bank 1
Bank 2
Figure 1-3 • VersaTile Configurations
X1 Y
X2
X3 LUT-3 Data Y
CLK
Enable
CLR
D-FF
Data Y
CLK
CLR D-FF
LUT-3 Equivalent D-Flip-Flop with Clear or Set Enable D-Flip-Flop with Clear or Set
ProASIC3 Flash Family FPGAs
Revision 13 1-5
User Nonvolatile FlashROM
ProASIC3 devices have 1 kbit of on-chip, user-accessible, nonvolatile FlashROM. The FlashROM can
be used in diverse system applications:
• Internet protocol addressing (wireless or fixed)
• System calibration settings
• Device serialization and/or inventory control
• Subscription-based business models (for example, set-top boxes)
• Secure key storage for secure communications algorithms
• Asset management/tracking
• Date stamping
• Version management
The FlashROM is written using the standard ProASIC3 IEEE 1532 JTAG programming interface. The
core can be individually programmed (erased and written), and on-chip AES decryption can be used
selectively to securely load data over public networks (except in the A3P015 and A3P030 devices), as in
security keys stored in the FlashROM for a user design.
The FlashROM can be programmed via the JTAG programming interface, and its contents can be read
back either through the JTAG programming interface or via direct FPGA core addressing. Note that the
FlashROM can only be programmed from the JTAG interface and cannot be programmed from the
internal logic array.
The FlashROM is programmed as 8 banks of 128 bits; however, reading is performed on a byte-by-byte
basis using a synchronous interface. A 7-bit address from the FPGA core defines which of the 8 banks
and which of the 16 bytes within that bank are being read. The three most significant bits (MSBs) of the
FlashROM address determine the bank, and the four least significant bits (LSBs) of the FlashROM
address define the byte.
The ProASIC3 development software solutions, Libero® System-on-Chip (SoC) and Designer, have
extensive support for the FlashROM. One such feature is auto-generation of sequential programming
files for applications requiring a unique serial number in each part. Another feature allows the inclusion of
static data for system version control. Data for the FlashROM can be generated quickly and easily using
Libero SoC and Designer software tools. Comprehensive programming file support is also included to
allow for easy programming of large numbers of parts with differing FlashROM contents.
SRAM and FIFO
ProASIC3 devices (except the A3P015 and A3P030 devices) have embedded SRAM blocks along their
north and south sides. Each variable-aspect-ratio SRAM block is 4,608 bits in size. Available memory
configurations are 256×18, 512×9, 1k×4, 2k×2, and 4k×1 bits. The individual blocks have independent
read and write ports that can be configured with different bit widths on each port. For example, data can
be sent through a 4-bit port and read as a single bitstream. The embedded SRAM blocks can be
initialized via the device JTAG port (ROM emulation mode) using the UJTAG macro (except in A3P015
and A3P030 devices).
In addition, every SRAM block has an embedded FIFO control unit. The control unit allows the SRAM
block to be configured as a synchronous FIFO without using additional core VersaTiles. The FIFO width
and depth are programmable. The FIFO also features programmable Almost Empty (AEMPTY) and
Almost Full (AFULL) flags in addition to the normal Empty and Full flags. The embedded FIFO control
unit contains the counters necessary for generation of the read and write address pointers. The
embedded SRAM/FIFO blocks can be cascaded to create larger configurations.
PLL and CCC
ProASIC3 devices provide designers with very flexible clock conditioning capabilities. Each member of
the ProASIC3 family contains six CCCs. One CCC (center west side) has a PLL. The A3P015 and
A3P030 devices do not have a PLL.
The six CCC blocks are located at the four corners and the centers of the east and west sides.
All six CCC blocks are usable; the four corner CCCs and the east CCC allow simple clock delay
operations as well as clock spine access.
ProASIC3 Device Family Overview
1-6 Revision 13
The inputs of the six CCC blocks are accessible from the FPGA core or from one of several inputs
located near the CCC that have dedicated connections to the CCC block.
The CCC block has these key features:
• Wide input frequency range (fIN_CCC) = 1.5 MHz to 350 MHz
• Output frequency range (fOUT_CCC) = 0.75 MHz to 350 MHz
• Clock delay adjustment via programmable and fixed delays from –7.56 ns to +11.12 ns
• 2 programmable delay types for clock skew minimization
• Clock frequency synthesis (for PLL only)
Additional CCC specifications:
• Internal phase shift = 0°, 90°, 180°, and 270°. Output phase shift depends on the output divider
configuration (for PLL only).
• Output duty cycle = 50% ± 1.5% or better (for PLL only)
• Low output jitter: worst case < 2.5% × clock period peak-to-peak period jitter when single global
network used (for PLL only)
• Maximum acquisition time = 300 µs (for PLL only)
• Low power consumption of 5 mW
• Exceptional tolerance to input period jitter— allowable input jitter is up to 1.5 ns (for PLL only)
• Four precise phases; maximum misalignment between adjacent phases of 40 ps × (350 MHz /
fOUT_CCC) (for PLL only)
Global Clocking
ProASIC3 devices have extensive support for multiple clocking domains. In addition to the CCC and PLL
support described above, there is a comprehensive global clock distribution network.
Each VersaTile input and output port has access to nine VersaNets: six chip (main) and three quadrant
global networks. The VersaNets can be driven by the CCC or directly accessed from the core via
multiplexers (MUXes). The VersaNets can be used to distribute low-skew clock signals or for rapid
distribution of high fanout nets.
ProASIC3 Flash Family FPGAs
Revision 13 1-7
I/Os with Advanced I/O Standards
The ProASIC3 family of FPGAs features a flexible I/O structure, supporting a range of voltages (1.5 V,
1.8 V, 2.5 V, and 3.3 V). ProASIC3 FPGAs support many different I/O standards—single-ended and
differential.
The I/Os are organized into banks, with two or four banks per device. The configuration of these banks
determines the I/O standards supported (Table 1-1).
Each I/O module contains several input, output, and enable registers. These registers allow the
implementation of the following:
• Single-Data-Rate applications
• Double-Data-Rate applications—DDR LVDS, B-LVDS, and M-LVDS I/Os for point-to-point
communications
ProASIC3 banks for the A3P250 device and above support LVPECL, LVDS, B-LVDS and M-LVDS.
B-LVDS and M-LVDS can support up to 20 loads.
Hot-swap (also called hot-plug, or hot-insertion) is the operation of hot-insertion or hot-removal of a card
in a powered-up system.
Cold-sparing (also called cold-swap) refers to the ability of a device to leave system data undisturbed
when the system is powered up, while the component itself is powered down, or when power supplies
are floating.
Wide Range I/O Support
ProASIC3 devices support JEDEC-defined wide range I/O operation. ProASIC3 supports the JESD8-B
specification, covering both 3 V and 3.3 V supplies, for an effective operating range of 2.7 V to 3.6 V.
Wider I/O range means designers can eliminate power supplies or power conditioning components from
the board or move to less costly components with greater tolerances. Wide range eases I/O bank
management and provides enhanced protection from system voltage spikes, while providing the flexibility
to easily run custom voltage applications.
Specifying I/O States During Programming
You can modify the I/O states during programming in FlashPro. In FlashPro, this feature is supported for
PDB files generated from Designer v8.5 or greater. See the FlashPro User’s Guide for more information.
Note: PDB files generated from Designer v8.1 to Designer v8.4 (including all service packs) have
limited display of Pin Numbers only.
1. Load a PDB from the FlashPro GUI. You must have a PDB loaded to modify the I/O states during
programming.
2. From the FlashPro GUI, click PDB Configuration. A FlashPoint – Programming File Generator
window appears.
3. Click the Specify I/O States During Programming button to display the Specify I/O States During
Programming dialog box.
Table 1-1 • I/O Standards Supported
I/O Bank Type Device and Bank Location
I/O Standards Supported
LVTTL/
LVCMOS PCI/PCI-X
LVPECL, LVDS,
B-LVDS, M-LVDS
Advanced East and west Banks of A3P250 and
larger devices
Standard Plus North and south banks of A3P250 and
larger devices
All banks of A3P060 and A3P125
Not supported
Standard All banks of A3P015 and A3P030 Not
supported
Not supported
ProASIC3 Device Family Overview
1-8 Revision 13
4. Sort the pins as desired by clicking any of the column headers to sort the entries by that header.
Select the I/Os you wish to modify (Figure 1-4 on page 1-8).
5. Set the I/O Output State. You can set Basic I/O settings if you want to use the default I/O settings
for your pins, or use Custom I/O settings to customize the settings for each pin. Basic I/O state
settings:
1 – I/O is set to drive out logic High
0 – I/O is set to drive out logic Low
Last Known State – I/O is set to the last value that was driven out prior to entering the
programming mode, and then held at that value during programming
Z -Tristate: I/O is tristated
6. Click OK to return to the FlashPoint – Programming File Generator window.
Note: I/O States During programming are saved to the ADB and resulting programming files after
completing programming file generation.
Figure 1-4 • I/O States During Programming Window
Revision 13 2-1
2 – ProASIC3 DC and Switching Characteristics
General Specifications
Operating Conditions
Stresses beyond those listed in Ta b l e 2 - 1 may cause permanent damage to the device.
Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Absolute Maximum Ratings are stress ratings only; functional operation of the device at these or any
other conditions beyond those listed under the Recommended Operating Conditions specified in
Table 2-2 on page 2-2 is not implied.
Table 2-1 • Absolute Maximum Ratings
Symbol Parameter Limits Units
VCC DC core supply voltage –0.3 to 1.65 V
VJTAG JTAG DC voltage –0.3 to 3.75 V
VPUMP Programming voltage –0.3 to 3.75 V
VCCPLL Analog power supply (PLL) –0.3 to 1.65 V
VCCI DC I/O output buffer supply voltage –0.3 to 3.75 V
VMV DC I/O input buffer supply voltage –0.3 to 3.75 V
VI I/O input voltage –0.3 V to 3.6 V
(when I/O hot insertion mode is enabled)
–0.3 V to (VCCI + 1 V) or 3.6 V, whichever voltage is lower
(when I/O hot-insertion mode is disabled)
V
TSTG 2Storage temperature –65 to +150 °C
TJ2Junction temperature +125 °C
Notes:
1. The device should be operated within the limits specified by the datasheet. During transitions, the input signal may
undershoot or overshoot according to the limits shown in Table 2-4 on page 2-3.
2. VMV pins must be connected to the corresponding VCCI pins. See the "VMVx I/O Supply Voltage (quiet)" section on
page 3-1 for further information.
3. For flash programming and retention maximum limits, refer to Table 2-3 on page 2-2, and for recommended operating
limits, refer to Table 2-2 on page 2-2.
ProASIC3 DC and Switching Characteristics
2-2 Revision 13
Table 2-2 • Recommended Operating Conditions 1,2
Symbol Parameters 1Commercial Industrial Units
TAAmbient temperature 0 to +70 -40 to +85 °C
TJJunction temperature 0 to 85 -40 to 100 °C
VCC31.5 V DC core supply voltage 1.425 to 1.575 1.425 to 1.575 V
VJTAG JTAG DC voltage 1.4 to 3.6 1.4 to 3.6 V
VPUMP Programming voltage Programming Mode 4 3.15 to 3.45 3.15 to 3.45 V
Operation 5 0 to 3.6 0 to 3.6 V
VCCPLL Analog power supply (PLL) 1.425 to 1.575 1.425 to 1.575 V
VCCI and VMV 61.5 V DC supply voltage 1.425 to 1.575 1.425 to 1.575 V
1.8 V DC supply voltage 1.7 to 1.9 1.7 to 1.9 V
2.5 V DC supply voltage 2.3 to 2.7 2.3 to 2.7 V
3.3 V DC supply voltage 3.0 to 3.6 3.0 to 3.6 V
3.3 V wide range DC supply voltage 7 2.7 to 3.6 2.7 to 3.6 V
LVDS/B-LVDS/M-LVDS differential I/O 2.375 to 2.625 2.375 to 2.625 V
LVPECL differential I/O 3.0 to 3.6 3.0 to 3.6 V
Notes:
1. All parameters representing voltages are measured with respect to GND unless otherwise specified.
2. To ensure targeted reliability standards are met across ambient and junction operating temperatures, Microsemi
recommends that the user follow best design practices using Microsemi’s timing and power simulation tools.
3. The ranges given here are for power supplies only. The recommended input voltage ranges specific to each I/O
standard are given in Table 2-18 on page 2-18.
4. The programming temperature range supported is Tambient = 0°C to 85°C.
5. VPUMP can be left floating during operation (not programming mode).
6. VMV and VCCI should be at the same voltage within a given I/O bank. VMV pins must be connected to the
corresponding VCCI pins. See the "VMVx I/O Supply Voltage (quiet)" section on page 3-1 for further information.
7. 3.3 V wide range is compliant to the JESD8-B specification and supports 3.0 V VCCI operation.
Table 2-3 • Flash Programming Limits – Retention, Storage and Operating Temperature1
Product
Grade
Programming
Cycles
Program Retention
(biased/unbiased)
Maximum Storage
Temperature TSTG (°C) 2
Maximum Operating
Junction Temperature TJ (°C) 2
Commercial 500 20 years 110 100
Industrial 500 20 years 110 100
Notes:
1. This is a stress rating only; functional operation at any condition other than those indicated is not implied.
2. These limits apply for program/data retention only. Refer to Table 2-1 on page 2-1 and Table 2-2 for device operating
conditions and absolute limits.
ProASIC3 Flash Family FPGAs
Revision 13 2-3
I/O Power-Up and Supply Voltage Thresholds for Power-On Reset
(Commercial and Industrial)
Sophisticated power-up management circuitry is designed into every ProASIC®3 device. These circuits
ensure easy transition from the powered-off state to the powered-up state of the device. The many
different supplies can power up in any sequence with minimized current spikes or surges. In addition, the
I/O will be in a known state through the power-up sequence. The basic principle is shown in Figure 2-1
on page 2-4.
There are five regions to consider during power-up.
ProASIC3 I/Os are activated only if ALL of the following three conditions are met:
1. VCC and VCCI are above the minimum specified trip points (Figure 2-1 on page 2-4).
2. VCCI > VCC – 0.75 V (typical)
3. Chip is in the operating mode.
VCCI Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.2 V
Ramping down: 0.5 V < trip_point_down < 1.1 V
VCC Trip Point:
Ramping up: 0.6 V < trip_point_up < 1.1 V
Ramping down: 0.5 V < trip_point_down < 1 V
VCC and VCCI ramp-up trip points are about 100 mV higher than ramp-down trip points. This specifically
built-in hysteresis prevents undesirable power-up oscillations and current surges. Note the following:
• During programming, I/Os become tristated and weakly pulled up to VCCI.
• JTAG supply, PLL power supplies, and charge pump VPUMP supply have no influence on I/O
behavior.
PLL Behavior at Brownout Condition
Microsemi recommends using monotonic power supplies or voltage regulators to ensure proper power-
up behavior. Power ramp-up should be monotonic at least until VCC and VCCPLLX exceed brownout
activation levels. The VCC activation level is specified as 1.1 V worst-case (see Figure 2-1 on page 2-4
for more details).
When PLL power supply voltage and/or VCC levels drop below the VCC brownout levels (0.75 V ± 0.25
V), the PLL output lock signal goes low and/or the output clock is lost. Refer to the "Power-Up/-Down
Behavior of Low Power Flash Devices" chapter of the ProASIC3 FPGA Fabric User’s Guide for
information on clock and lock recovery.
Table 2-4 • Overshoot and Undershoot Limits 1
VCCI and VMV
Average VCCI–GND Overshoot or Undershoot
Duration as a Percentage of Clock Cycle2
Maximum Overshoot/
Undershoot2
2.7 V or less 10% 1.4 V
5% 1.49 V
3 V 10% 1.1 V
5% 1.19 V
3.3 V 10% 0.79 V
5% 0.88 V
3.6 V 10% 0.45 V
5% 0.54 V
Notes:
1. Based on reliability requirements at 85°C.
2. The duration is allowed at one out of six clock cycles. If the overshoot/undershoot occurs at one out of two cycles, the
maximum overshoot/undershoot has to be reduced by 0.15 V.
3. This table does not provide PCI overshoot/undershoot limits.
ProASIC3 DC and Switching Characteristics
2-4 Revision 13
Internal Power-Up Activation Sequence
1. Core
2. Input buffers
Output buffers, after 200 ns delay from input buffer activation
Thermal Characteristics
Introduction
The temperature variable in the Microsemi Designer software refers to the junction temperature, not the
ambient temperature. This is an important distinction because dynamic and static power consumption
cause the chip junction to be higher than the ambient temperature.
EQ 1 can be used to calculate junction temperature.
TJ = Junction Temperature = T + TA
EQ 1
where:
TA = Ambient Temperature
T = Temperature gradient between junction (silicon) and ambient T = ja * P
ja = Junction-to-ambient of the package. ja numbers are located in Table 2-5.
P = Power dissipation
Figure 2-1 • I/O State as a Function of VCCI and VCC Voltage Levels
Region 1: I/O buffers are OFF
Region 2: I/O buffers are ON.
I/Os are functional (except differential inputs)
but slower because VCCI / VCC are below
specification. For the same reason, input
buffers do not meet VIH / VIL levels, and
output buffers do not meet VOH / VOL levels.
Min VCCI datasheet specification
voltage at a selected I/O
standard; i.e., 1.425 V or 1.7 V
or 2.3 V or 3.0 V
VCC
VCC = 1.425 V
Region 1: I/O Buffers are OFF
Activation trip point:
V
a
= 0.85 V ± 0.25 V
Deactivation trip point:
V
d
= 0.75 V ± 0.25 V
Activation trip point:
V
a
= 0.9 V ± 0.3 V
Deactivation trip point:
V
d
= 0.8 V ± 0.3 V
VCC = 1.575 V
Region 5: I/O buffers are ON
and power supplies are within
specification.
I/Os meet the entire datasheet
and timer specifications for
speed, VIH / VIL, VOH / VOL,
etc.
Region 4: I/O
buffers are ON.
I/Os are functional
(except differential
but slower because VCCI
is below specification. For the
same reason, input buffers do not
meet VIH / VIL levels, and output
buffers do not meet VOH / VOL levels.
where VT can be from 0.58 V to 0.9 V (typically 0.75 V)
VCCI
Region 3: I/O buffers are ON.
I/Os are functional; I/O DC
specifications are met,
but I/Os are slower because
the VCC is below specification.
VCC = VCCI + VT
ProASIC3 Flash Family FPGAs
Revision 13 2-5
Package Thermal Characteristics
The device junction-to-case thermal resistivity is jc and the junction-to-ambient air thermal resistivity is
ja. The thermal characteristics for ja are shown for two air flow rates. The absolute maximum junction
temperature is 100°C. EQ 2 shows a sample calculation of the absolute maximum power dissipation
allowed for a 484-pin FBGA package at commercial temperature and in still air.
EQ 2
Maximum Power Allowed Max. junction temp. (C) Max. ambient temp. (C)–
ja(C/W)
------------------------------------------------------------------------------------------------------------------------------------------ 100C70C–
20.5C/W
------------------------------------- 1.463 W
·
===
Table 2-5 • Package Thermal Resistivities
Package Type Device Pin Count jc
ja
UnitsStill Air 200 ft./min. 500 ft./min.
Quad Flat No Lead A3P030 132 0.4 21.4 16.8 15.3 C/W
A3P060 132 0.3 21.2 16.6 15.0 C/W
A3P125 132 0.2 21.1 16.5 14.9 C/W
A3P250 132 0.1 21.0 16.4 14.8 C/W
Very Thin Quad Flat Pack (VQFP) All devices 100 10.0 35.3 29.4 27.1 C/W
Thin Quad Flat Pack (TQFP) All devices 144 11.0 33.5 28.0 25.7 C/W
Plastic Quad Flat Pack (PQFP) All devices 208 8.0 26.1 22.5 20.8 C/W
PQFP with embedded heatspreader All devices 208 3.8 16.2 13.3 11.9 C/W
Fine Pitch Ball Grid Array (FBGA) See note* 144 3.8 26.9 22.9 21.5 C/W
See note* 256 3.8 26.6 22.8 21.5 C/W
See note* 484 3.2 20.5 17.0 15.9 C/W
A3P1000 144 6.3 31.6 26.2 24.2 C/W
A3P1000 256 6.6 28.1 24.4 22.7 C/W
A3P1000 484 8.0 23.3 19.0 16.7 C/W
Note: *This information applies to all ProASIC3 devices except the A3P1000. Detailed device/package thermal
information will be available in future revisions of the datasheet.
ProASIC3 DC and Switching Characteristics
2-6 Revision 13
Temperature and Voltage Derating Factors
Calculating Power Dissipation
Quiescent Supply Current
Power per I/O Pin
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays
(normalized to TJ = 70°C, VCC = 1.425 V)
Array Voltage VCC
(V)
Junction Temperature (°C)
–40°C 0°C 25°C 70°C 85°C 100°C
1.425 0.88 0.93 0.95 1.00 1.02 1.04
1.500 0.83 0.88 0.90 0.95 0.96 0.98
1.575 0.80 0.84 0.87 0.91 0.93 0.94
Table 2-7 • Quiescent Supply Current Characteristics
A3P015 A3P030 A3P060 A3P125 A3P250 A3P400 A3P600 A3P1000
Typical (25°C) 2 mA 2 mA 2 mA 2 mA 3 mA 3 mA 5 mA 8 mA
Max. (Commercial) 10 mA 10 mA 10 mA 10 mA 20 mA 20 mA 30 mA 50 mA
Max. (Industrial) 15 mA 15 mA 15 mA 15 mA 30 mA 30 mA 45 mA 75 mA
Note: IDD Includes VCC, VPUMP, VCCI, and VMV currents. Values do not include I/O static
contribution, which is shown in Table 2-11 and Table 2-12 on page 2-8.
Table 2-8 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Advanced I/O Banks
VMV (V)
Static Power
PDC2 (mW) 1
Dynamic Power
PAC9 (µW/MHz) 2
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 16.22
3.3 V LVCMOS Wide Range3 3.3 – 16.22
2.5 V LVCMOS 2.5 – 5.12
1.8 V LVCMOS 1.8 – 2.13
1.5 V LVCMOS (JESD8-11) 1.5 – 1.45
3.3 V PCI 3.3 – 18.11
3.3 V PCI-X 3.3 – 18.11
Differential
LVDS 2.5 2.26 1.20
LVPECL 3.3 5.72 1.87
Notes:
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B
specification.
ProASIC3 Flash Family FPGAs
Revision 13 2-7
Table 2-9 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Standard Plus I/O Banks
VMV (V)
Static Power
PDC2 (mW) 1
Dynamic Power
PAC9 (µW/MHz) 2
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 16.23
3.3 V LVCMOS Wide Range33.3 – 16.23
2.5 V LVCMOS 2.5 – 5.14
1.8 V LVCMOS 1.8 – 2.13
1.5 V LVCMOS (JESD8-11) 1.5 – 1.48
3.3 V PCI 3.3 – 18.13
3.3 V PCI-X 3.3 – 18.13
Notes:
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B
specification.
Table 2-10 • Summary of I/O Input Buffer Power (Per Pin) – Default I/O Software Settings
Applicable to Standard I/O Banks
VMV (V)
Static Power
PDC2 (mW) 1
Dynamic Power
PAC9 (µW/MHz) 2
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 3.3 – 17.24
3.3 V LVCMOS Wide Range33.3 – 17.24
2.5 V LVCMOS 2.5 – 5.19
1.8 V LVCMOS 1.8 – 2.18
1.5 V LVCMOS (JESD8-11) 1.5 – 1.52
Notes:
1. PDC2 is the static power (where applicable) measured on VMV.
2. PAC9 is the total dynamic power measured on VCC and VMV.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B
specification.
ProASIC3 DC and Switching Characteristics
2-8 Revision 13
Table 2-11 • Summary of I/O Output Buffer Power (per pin) – Default I/O Software Settings1
Applicable to Advanced I/O Banks
CLOAD (pF) VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 35 3.3 – 468.67
3.3 V LVCMOS Wide Range4 35 3.3 – 468.67
2.5 V LVCMOS 35 2.5 – 267.48
1.8 V LVCMOS 35 1.8 – 149.46
1.5 V LVCMOS
(JESD8-11)
35 1.5 – 103.12
3.3 V PCI 10 3.3 – 201.02
3.3 V PCI-X 10 3.3 – 201.02
Differential
LVDS – 2.5 7.74 88.92
LVPECL – 3.3 19.54 166.52
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
Table 2-12 • Summary of I/O Output Buffer Power (Per Pin) – Default I/O Software Settings1
Applicable to Standard Plus I/O Banks
CLOAD (pF) VCCI (V)
Static Power
PDC3 (mW)2
Dynamic Power
PAC10 (µW/MHz)3
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 35 3.3 – 452.67
3.3 V LVCMOS Wide Range4 35 3.3 – 452.67
2.5 V LVCMOS 35 2.5 – 258.32
1.8 V LVCMOS 35 1.8 – 133.59
1.5 V LVCMOS (JESD8-11) 35 1.5 – 92.84
3.3 V PCI 10 3.3 – 184.92
3.3 V PCI-X 10 3.3 – 184.92
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VMV.
3. PAC10 is the total dynamic power measured on VCC and VMV.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
ProASIC3 Flash Family FPGAs
Revision 13 2-9
Table 2-13 • Summary of I/O Output Buffer Power (Per Pin) – Default I/O Software Settings 1
Applicable to Standard I/O Banks
CLOAD (pF) VCCI (V)
Static Power
PDC3 (mW) 2
Dynamic Power
PAC10 (µW/MHz) 3
Single-Ended
3.3 V LVTTL / 3.3 V LVCMOS 35 3.3 – 431.08
3.3 V LVCMOS Wide Range4 35 3.3 – 431.08
2.5 V LVCMOS 35 2.5 – 247.36
1.8 V LVCMOS 35 1.8 – 128.46
1.5 V LVCMOS (JESD8-11) 35 1.5 – 89.46
Notes:
1. Dynamic power consumption is given for standard load and software default drive strength and output slew.
2. PDC3 is the static power (where applicable) measured on VCCI.
3. PAC10 is the total dynamic power measured on VCC and VCCI.
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
ProASIC3 DC and Switching Characteristics
2-10 Revision 13
Power Consumption of Various Internal Resources
Table 2-14 • Different Components Contributing to Dynamic Power Consumption in ProASIC3 Devices
Parameter Definition
Device Specific Dynamic Contributions
(µW/MHz)
A3P1000
A3P600
A3P400
A3P250
A3P125
A3P060
A3P030
A3P015
PAC1 Clock contribution of a Global Rib 14.50 12.80 12.80 11.00 11.00 9.30 9.30 9.30
PAC2 Clock contribution of a Global Spine 2.48 1.85 1.35 1.58 0.81 0.81 0.41 0.41
PAC3 Clock contribution of a VersaTile row 0.81
PAC4 Clock contribution of a VersaTile used as a
sequential module
0.12
PAC5 First contribution of a VersaTile used as a
sequential module
0.07
PAC6 Second contribution of a VersaTile used as a
sequential module
0.29
PAC7 Contribution of a VersaTile used as a
combinatorial Module
0.29
PAC8 Average contribution of a routing net 0.70
PAC9 Contribution of an I/O input pin (standard
dependent)
See Table 2-8 on page 2-6 through
Table 2-10 on page 2-7.
PAC10 Contribution of an I/O output pin (standard
dependent)
See Table 2-11 on page 2-8 through
Table 2-13 on page 2-9.
PAC11 Average contribution of a RAM block during a
read operation
25.00
PAC12 Average contribution of a RAM block during a
write operation
30.00
PAC13 Dynamic contribution for PLL 2.60
Note: *For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi Power
spreadsheet calculator or SmartPower tool in Libero SoC software.
ProASIC3 Flash Family FPGAs
Revision 13 2-11
Power Calculation Methodology
This section describes a simplified method to estimate power consumption of an application. For more
accurate and detailed power estimations, use the SmartPower tool in Libero SoC software.
The power calculation methodology described below uses the following variables:
• The number of PLLs as well as the number and the frequency of each output clock generated
• The number of combinatorial and sequential cells used in the design
• The internal clock frequencies
• The number and the standard of I/O pins used in the design
• The number of RAM blocks used in the design
• Toggle rates of I/O pins as well as VersaTiles—guidelines are provided in Table 2-16 on
page 2-13.
• Enable rates of output buffers—guidelines are provided for typical applications in Table 2-17 on
page 2-13.
• Read rate and write rate to the memory—guidelines are provided for typical applications in
Table 2-17 on page 2-13. The calculation should be repeated for each clock domain defined in the
design.
Methodology
Total Power Consumption—PTOTAL
PTOTAL = PSTAT + PDYN
PSTAT is the total static power consumption.
PDYN is the total dynamic power consumption.
Total Static Power Consumption—PSTAT
PSTAT = PDC1 + NINPUTS* PDC2 + NOUTPUTS* PDC3
NINPUTS is the number of I/O input buffers used in the design.
NOUTPUTS is the number of I/O output buffers used in the design.
Table 2-15 • Different Components Contributing to the Static Power Consumption in ProASIC3 Devices
Parameter
Definition Device Specific Static Power (mW)
A3P1000
A3P600
A3P400
A3P250
A3P125
A3P060
A3P030
A3P015
PDC1 Array static power in Active mode See Table 2-7 on page 2-6.
PDC2 I/O input pin static power (standard-dependent) See Table 2-8 on page 2-6 through
Table 2-10 on page 2-7.
PDC3 I/O output pin static power (standard-dependent) See Table 2-11 on page 2-8 through
Table 2-13 on page 2-9.
PDC4 Static PLL contribution 2.55 mW
PDC5 Bank quiescent power (VCCI-dependent) See Table 2-7 on page 2-6.
Note: *For a different output load, drive strength, or slew rate, Microsemi recommends using the Microsemi Power
spreadsheet calculator or SmartPower tool in Libero SoC software.
ProASIC3 DC and Switching Characteristics
2-12 Revision 13
Total Dynamic Power Consumption—PDYN
PDYN = PCLOCK + PS-CELL + PC-CELL + PNET + PINPUTS + POUTPUTS + PMEMORY + PPLL
Global Clock Contribution—PCLOCK
PCLOCK = (PAC1 + NSPINE*PAC2 + NROW*PAC3 + NS-CELL* PAC4) * FCLK
NSPINE is the number of global spines used in the user design—guidelines are provided in the
"Spine Architecture" section of the Global Resources chapter in the ProASIC3 FPGA
Fabric User's Guide.
NROW is the number of VersaTile rows used in the design—guidelines are provided in the "Spine
Architecture" section of the Global Resources chapter in the ProASIC3 FPGA Fabric
User's Guide.
FCLK is the global clock signal frequency.
NS-CELL is the number of VersaTiles used as sequential modules in the design.
PAC1, PAC2, PAC3, and PAC4 are device-dependent.
Sequential Cells Contribution—PS-CELL
PS-CELL = NS-CELL * (PAC5 + 1 / 2 * PAC6) * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design. When a multi-tile
sequential cell is used, it should be accounted for as 1.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-16 on page 2-13.
FCLK is the global clock signal frequency.
Combinatorial Cells Contribution—PC-CELL
PC-CELL = NC-CELL* 1 / 2 * PAC7 * FCLK
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-16 on page 2-13.
FCLK is the global clock signal frequency.
Routing Net Contribution—PNET
PNET = (NS-CELL + NC-CELL) * 1 / 2 * PAC8 * FCLK
NS-CELL is the number of VersaTiles used as sequential modules in the design.
NC-CELL is the number of VersaTiles used as combinatorial modules in the design.
1 is the toggle rate of VersaTile outputs—guidelines are provided in Table 2-16 on page 2-13.
FCLK is the global clock signal frequency.
I/O Input Buffer Contribution—PINPUTS
PINPUTS = NINPUTS * 2 / 2 * PAC9 * FCLK
NINPUTS is the number of I/O input buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 2-16 on page 2-13.
FCLK is the global clock signal frequency.
I/O Output Buffer Contribution—POUTPUTS
POUTPUTS = NOUTPUTS * 2 / 2 * 1 * PAC10 * FCLK
NOUTPUTS is the number of I/O output buffers used in the design.
2 is the I/O buffer toggle rate—guidelines are provided in Table 2-16 on page 2-13.
1 is the I/O buffer enable rate—guidelines are provided in Table 2-17 on page 2-13.
FCLK is the global clock signal frequency.
ProASIC3 Flash Family FPGAs
Revision 13 2-13
RAM Contribution—PMEMORY
PMEMORY = PAC11 * NBLOCKS * FREAD-CLOCK * 2 + PAC12 * NBLOCK * FWRITE-CLOCK * 3
NBLOCKS is the number of RAM blocks used in the design.
FREAD-CLOCK is the memory read clock frequency.
2 is the RAM enable rate for read operations.
FWRITE-CLOCK is the memory write clock frequency.
3 is the RAM enable rate for write operations—guidelines are provided in Table 2-17 on page 2-13.
PLL Contribution—PPLL
PPLL = PDC4 + PAC13 *FCLKOUT
FCLKOUT is the output clock frequency.1
Guidelines
Toggle Rate Definition
A toggle rate defines the frequency of a net or logic element relative to a clock. It is a percentage. If the
toggle rate of a net is 100%, this means that this net switches at half the clock frequency. Below are
some examples:
• The average toggle rate of a shift register is 100% because all flip-flop outputs toggle at half of the
clock frequency.
• The average toggle rate of an 8-bit counter is 25%:
– Bit 0 (LSB) = 100%
– Bit 1 = 50%
– Bit 2 = 25%
–…
– Bit 7 (MSB) = 0.78125%
– Average toggle rate = (100% + 50% + 25% + 12.5% + . . . + 0.78125%) / 8
Enable Rate Definition
Output enable rate is the average percentage of time during which tristate outputs are enabled. When
nontristate output buffers are used, the enable rate should be 100%.
1. The PLL dynamic contribution depends on the input clock frequency, the number of output clock signals generated by the
PLL, and the frequency of each output clock. If a PLL is used to generate more than one output clock, include each output
clock in the formula by adding its corresponding contribution (PAC14 * FCLKOUT product) to the total PLL contribution.
Table 2-16 • Toggle Rate Guidelines Recommended for Power Calculation
Component Definition Guideline
1Toggle rate of VersaTile outputs 10%
2I/O buffer toggle rate 10%
Table 2-17 • Enable Rate Guidelines Recommended for Power Calculation
Component Definition Guideline
1I/O output buffer enable rate 100%
2RAM enable rate for read operations 12.5%
3RAM enable rate for write operations 12.5%
ProASIC3 DC and Switching Characteristics
2-14 Revision 13
User I/O Characteristics
Timing Model
Figure 2-2 • Timing Model
Operating Conditions: –2 Speed, Commercial Temperature Range (TJ = 70°C), Worst Case
VCC = 1.425 V
DQ
Y
Y
DQ
DQ DQ
Y
Combinational Cell
Combinational Cell
Combinational Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
Register Cell Register Cell
I/O Module
(Registered)
I/O Module
(Non-Registered)
LVPECL (Applicable to
Advanced I/O Banks Only)L
LVPECL
(Applicable
to Advanced
I/O Banks only)
LVDS,
BLVDS,
M-LVDS
(Applicable for
Advanced I/O
Banks only)
LVTTL 3.3 V Output drive
strength = 12 mA High slew rate
Y
Combinational Cell
Y
Combinational Cell
Y
Combinational Cell
I/O Module
(Non-Registered)
LVTTLOutput drive strength = 8 mA
High slew rate
I/O Module
(Non-Registered)
LVCMOS 1.5 VOutput drive strength = 4 mA
High slew rate
LVTTLOutput drive strength = 12 mA
High slew rate
I/O Module
(Non-Registered)
Input LVTTL
Clock
Input LVTTL
Clock
Input LVTTL
Clock
t
PD
= 0.56 ns t
PD
= 0.49 ns
t
DP
= 1.34 ns
t
PD
= 0.87 ns t
DP
= 2.64 ns (Advanced I/O Banks)
t
PD
= 0.47 ns
t
DP
= 3.66 ns (Advanced I/O Banks)
t
PD
= 0.47 ns t
DP
= 3.97 ns (Advanced I/O Banks)
t
PD
= 0.47 ns
t
PY
= 0.76 ns
(Advanced I/O Banks)
t
CLKQ
= 0.55 ns t
OCLKQ
= 0.59 ns
t
SUD
= 0.43 ns t
OSUD
= 0.31 ns
t
DP
= 2.64 ns
(Advanced I/O Banks)
t
PY
= 0.76 ns (Advanced I/O Banks)
t
PY
= 1.20 ns
t
CLKQ
= 0.55 ns
t
SUD
= 0.43 ns
t
PY
= 0.76 ns
(Advanced I/O Banks)
t
ICLKQ
= 0.24 ns
t
ISUD
= 0.26 ns
t
PY
= 1.05 ns
ProASIC3 Flash Family FPGAs
Revision 13 2-15
Figure 2-3 • Input Buffer Timing Model and Delays (example)
tPY
(R)
PAD
Y
Vtrip
GND tPY
(F)
Vtrip
50%
50%
VIH
VCC
VIL
tDIN
(R)
DIN
GND tDIN
(F)
50%50%
VCC
PAD Y
tPY
D
CLK
Q
I/O Interface
DIN
tDIN
To Array
tPY = MAX(tPY(R), tPY(F))
tDIN = MAX(tDIN(R), tDIN(F))
ProASIC3 DC and Switching Characteristics
2-16 Revision 13
Figure 2-4 • Output Buffer Model and Delays (example)
tDP
(R)
PAD VOL
tDP
(F)
Vtrip
Vtrip
VOH
VCC
D50% 50%
VCC
0 V
DOUT 50% 50% 0 V
tDOUT
(R)
tDOUT
(F)
From Array
PAD
tDP
Std
Load
D
CLK
Q
I/O Interface
DOUT
D
tDOUT
tDP = MAX(tDP(R), tDP(F))
tDOUT = MAX(tDOUT(R), tDOUT(F))
ProASIC3 Flash Family FPGAs
Revision 13 2-17
Figure 2-5 • Tristate Output Buffer Timing Model and Delays (example)
D
CLK
Q
D
CLK
Q
10% V
CCI
t
ZL
Vtrip
50%
t
HZ
90% VCCI
t
ZH
Vtrip
50% 50% t
LZ
50%
EOUT
PAD
D
E50%
t
EOUT (R)
50%t
EOUT (F)
PAD
DOUT
EOUT
D
I/O Interface
E
t
EOUT
t
ZLS
Vtrip
50%
t
ZHS
Vtrip
50%
EOUT
PAD
D
E50% 50%
t
EOUT (R)
t
EOUT (F)
50%
VCC
VCC
VCC
VCCI
VCC
VCC
VCC
VOH
VOL
VOL
t
ZL
, t
ZH
, t
HZ
, t
LZ
, t
ZLS
, t
ZHS
t
EOUT
= MAX(t
EOUT
(r), t
EOUT
(f))
ProASIC3 DC and Switching Characteristics
2-18 Revision 13
Overview of I/O Performance
Summary of I/O DC Input and Output Levels – Default I/O Software
Settings
Table 2-18 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions—Software Default Settings
Applicable to Advanced I/O Banks
I/O Standard
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option2
Slew
Rate
VIL VIH VOL VOH IOL1IOH1
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
3.3 V LVTTL /
3.3 V
LVCMOS
12 mA 12 mA High –0.3 0.8 2 3.6 0.4 2.4 12 12
3.3 V
LVCMOS
Wide Range3
100 µA 12 mA High –0.3 0.8 2 3.6 0.2 VCCI – 0.2 0.1 0.1
2.5 V
LVCMOS
12 mA 12 mA High –0.3 0.7 1.7 2.7 0.7 1.7 12 12
1.8 V
LVCMOS
12 mA 12 mA High –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 12 12
1.5 V
LVCMOS
12 mA 12 mA High –0.3 0.35 * VCCI 0.65 * VCCI 1.6 0.25 * VCCI 0.75 * VCCI 12 12
3.3 V PCI Per PCI specifications
3.3 V PCI-X Per PCI-X specifications
Notes:
1. Currents are measured at 85°C junction temperature.
2. Please note that 3.3 V LVCMOS wide range is applicable to 100 µA drive strength only. The configuration will NOT
operate at the equivalent software default drive strength. These values are for Normal Ranges ONLY.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B specification.
ProASIC3 Flash Family FPGAs
Revision 13 2-19
Table 2-19 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions—Software Default Settings
Applicable to Standard Plus I/O Banks
I/O Standard
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option2
Slew
Rate
VIL VIH VOL VOH IOL1
IOH
1
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
3.3 V LVTTL /
3.3 V
LVCMOS
12 mA 12 mA High –0.3 0.8 2 3.6 0.4 2.4 12 12
3.3 V
LVCMOS
Wide Range3
100 µA 12 mA High –0.3 0.8 2 3.6 0.2 VCCI – 0.2 0.1 0.1
2.5 V
LVCMOS
12 mA 12 mA High –0.3 0.7 1.7 2.7 0.7 1.7 12 12
1.8 V
LVCMOS
8 mA 8 mA High –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 8 8
1.5 V
LVCMOS
4 mA 4 mA High –0.3 0.35 * VCCI 0.65 * VCCI 1.6 0.25 * VCCI 0.75 * VCCI 4 4
3.3 V PCI Per PCI specifications
3.3 V PCI-X Per PCI-X specifications
Notes:
1. Currents are measured at 85°C junction temperature.
2. Please note that 3.3 V LVCMOS wide range is applicable to 100 µA drive strength only. The configuration will NOT
operate at the equivalent software default drive strength. These values are for Normal Ranges ONLY.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
ProASIC3 DC and Switching Characteristics
2-20 Revision 13
Table 2-20 • Summary of Maximum and Minimum DC Input and Output Levels Applicable to Commercial and
Industrial Conditions—Software Default Settings
Applicable to Standard I/O Banks
I/O Standard
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option2
Slew
Rate
VIL VIH VOL VOH IOL1IOH1
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
3.3 V LVTTL /
3.3 V
LVCMOS
8 mA 8 mA High –0.3 0.8 2 3.6 0.4 2.4 8 8
3.3 V
LVCMOS
Wide Range3
100 µA 8 mA High –0.3 0.8 2 3.6 0.2 VCCI – 0.2 0.1 0.1
2.5 V
LVCMOS
8 mA 8 mA High –0.3 0.7 1.7 3.6 0.7 1.7 8 8
1.8 V
LVCMOS
4 mA 4 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4
1.5 V
LVCMOS
2 mA 2 mA High –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 2 2
Notes:
1. Currents are measured at 85°C junction temperature.
2. Please note that 3.3 V LVCMOS wide range is applicable to 100 µA drive strength only. The configuration will NOT
operate at the equivalent software default drive strength. These values are for Normal Ranges ONLY.
3. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B specification.
Table 2-21 • Summary of Maximum and Minimum DC Input Levels
Applicable to Commercial and Industrial Conditions
DC I/O Standards
Commercial1Industrial2
IIL3IIH4IIL3IIH4
µA µA µA µA
3.3 V LVTTL / 3.3 V LVCMOS 10 10 15 15
3.3 V LVCMOS Wide Range 10 10 15 15
2.5 V LVCMOS 10 10 15 15
1.8 V LVCMOS 10 10 15 15
1.5 V LVCMOS 10 10 15 15
3.3 V PCI 10 10 15 15
3.3 V PCI-X 10 10 15 15
Notes:
1. Commercial range (0°C < TA < 70°C)
2. Industrial range (–40°C < TA < 85°C)
3. IIL is the input leakage current per I/O pin over recommended operation conditions where
–0.3V < VIN <VIL.
4. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
ProASIC3 Flash Family FPGAs
Revision 13 2-21
Summary of I/O Timing Characteristics – Default I/O Software
Settings
Table 2-22 • Summary of AC Measuring Points
Standard Measuring Trip Point (Vtrip)
3.3 V LVTTL / 3.3 V LVCMOS 1.4 V
3.3 V LVCMOS Wide Range 1.4 V
2.5 V LVCMOS 1.2 V
1.8 V LVCMOS 0.90 V
1.5 V LVCMOS 0.75 V
3.3 V PCI 0.285 * VCCI (RR)
0.615 * VCCI (FF)
3.3 V PCI-X 0.285 * VCCI (RR)
0.615 * VCCI (FF)
Table 2-23 • I/O AC Parameter Definitions
Parameter Parameter Definition
tDP Data to Pad delay through the Output Buffer
tPY Pad to Data delay through the Input Buffer
tDOUT Data to Output Buffer delay through the I/O interface
tEOUT Enable to Output Buffer Tristate Control delay through the I/O interface
tDIN Input Buffer to Data delay through the I/O interface
tHZ Enable to Pad delay through the Output Buffer—High to Z
tZH Enable to Pad delay through the Output Buffer—Z to High
tLZ Enable to Pad delay through the Output Buffer—Low to Z
tZL Enable to Pad delay through the Output Buffer—Z to Low
tZHS Enable to Pad delay through the Output Buffer with delayed enable—Z to High
tZLS Enable to Pad delay through the Output Buffer with delayed enable—Z to Low
ProASIC3 DC and Switching Characteristics
2-22 Revision 13
Table 2-24 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V,
Worst-Case VCCI (per standard)
Advanced I/O Banks
I/O Standard
Drive Strength
Equiv. Software Default
Drive Strength Option1
Slew Rate
Capacitive Load (pF)
External Resistor ()
tDOUT (ns)
tDP (ns)
tDIN (ns)
tPY (ns)
tEOUT (ns)
tZL (ns)
tZH (ns)
tLZ (ns)
tHZ (ns)
tZLS (ns)
tZHS (ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
12 mA 12 mA High 35 – 0.45 2.64 0.03 0.76 0.32 2.69 2.11 2.40 2.68 4.36 3.78 ns
3.3 V LVCMOS
Wide Range2
100 µA 12 mA High 35 – 0.45 4.08 0.03 0.76 0.32 4.08 3.20 3.71 4.14 6.61 5.74 ns
2.5 V LVCMOS 12 mA 12 mA High 35 – 0.45 2.66 0.03 0.98 0.32 2.71 2.56 2.47 2.57 4.38 4.23 ns
1.8 V LVCMOS 12 mA 12 mA High 35 – 0.45 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns
1.5 V LVCMOS 12 mA 12 mA High 35 – 0.45 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns
3.3 V PCI Per
PCI
spec
– High 10 25 40.45 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
3.3 V PCI-X Per
PCI-X
spec
– High 10 25 40.45 2.00 0.03 0.62 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
LVDS 24 mA – High – – 0.45 1.37 0.03 1.20 – – – – – – – ns
LVPECL 24 mA – High – – 0.45 1.34 0.03 1.05 – – – – – – – ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B specification.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
4. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on page 2-63 for
connectivity. This resistor is not required during normal operation.
ProASIC3 Flash Family FPGAs
Revision 13 2-23
Table 2-25 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V,
Worst-Case VCCI (per standard)
Standard Plus I/O Banks
I/O Standard
Drive Strength
Equiv. Software Default
Drive Strength Option1
Slew Rate
Capacitive Load (pF)
External Resistor
tDOUT (ns)
tDP (ns)
tDIN (ns)
tPY (ns)
tEOUT (ns)
tZL (ns)
tZH (ns)
tLZ (ns)
tHZ (ns)
tZLS (ns)
tZHS (ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
12 mA 12 mA High 35 – 0.45 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns
3.3 V LVCMOS
Wide Range2
100 µA 12 mA High 35 – 0.45 3.65 0.03 1.14 0.32 3.65 2.93 3.22 3.72 6.18 5.46 ns
2.5 V LVCMOS 12 mA 12 mA High 35 – 0.45 2.39 0.03 0.97 0.32 2.44 2.35 2.11 2.32 4.11 4.02 ns
1.8 V LVCMOS 8 mA 8 mA High 35 – 0.45 3.03 0.03 0.90 0.32 2.87 3.03 2.19 2.32 4.54 4.70 ns
1.5 V LVCMOS 4 mA 4 mA High 35 – 0.45 3.61 0.03 1.06 0.32 3.35 3.61 2.26 2.34 5.02 5.28 ns
3.3 V PCI Per
PCI
spec
– High 10 25 4 0.45 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns
3.3 V PCI-X Per
PCI-X
spec
– High 10 25 4 0.45 1.72 0.03 0.62 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
4. Resistance is used to measure I/O propagation delays as defined in PCI specifications. See Figure 2-10 on page 2-63 for
connectivity. This resistor is not required during normal operation.
ProASIC3 DC and Switching Characteristics
2-24 Revision 13
Table 2-26 • Summary of I/O Timing Characteristics—Software Default Settings
–2 Speed Grade, Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V,
Worst-Case VCCI (per standard)
Standard I/O Banks
I/O Standard
Drive Strength
Equiv. Software Default
Drive Strength Option1
Slew Rate
Capacitive Load (pF)
External Resistor
tDOUT (ns)
tDP (ns)
tDIN (ns)
tPY (ns)
tEOUT (ns)
tZL (ns)
tZH (ns)
tLZ (ns)
tHZ (ns)
Units
3.3 V LVTTL /
3.3 V LVCMOS
8 mA 8 mA High 35 – 0.45 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns
3.3 V LVCMOS
Wide Range2
100 µA 8 mA High 35 – 0.45 5.09 0.03 1.13 0.32 5.09 4.25 2.77 3.11 ns
2.5 V LVCMOS 8 mA 8 mA High 35 – 0.45 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns
1.8 V LVCMOS 4 mA 4 mA High 35 – 0.45 4.74 0.03 0.90 0.32 4.02 4.74 1.80 1.85 ns
1.5 V LVCMOS 2 mA 2 mA High 35 – 0.45 5.71 0.03 1.06 0.32 4.71 5.71 1.83 1.83 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B specification.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-25
Detailed I/O DC Characteristics
Table 2-27 • Input Capacitance
Symbol Definition Conditions Min. Max. Units
CIN Input capacitance VIN = 0, f = 1.0 MHz 8 pF
CINCLK Input capacitance on the clock pin VIN = 0, f = 1.0 MHz 8 pF
Table 2-28 • I/O Output Buffer Maximum Resistances1
Applicable to Advanced I/O Banks
Standard Drive Strength RPULL-DOWN ()2RPULL-UP ()3
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300
4 mA 100 300
6 mA 50 150
8 mA 50 150
12 mA 25 75
16 mA 17 50
24 mA 11 33
3.3 V LVCMOS Wide Range4100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 100 200
4 mA 100 200
6 mA 50 100
8 mA 50 100
12 mA 25 50
16 mA 20 40
24 mA 11 22
1.8 V LVCMOS 2 mA 200 225
4 mA 100 112
6 mA 50 56
8 mA 50 56
12 mA 20 22
16 mA 20 22
1.5 V LVCMOS 2 mA 200 224
4 mA 100 112
6 mA 67 75
8 mA 33 37
12 mA 33 37
3.3 V PCI/PCI-X Per PCI/PCI-X
specification
25 75
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCCI, drive strength selection, temperature, and process. For board design
considerations and detailed output buffer resistances, use the corresponding IBIS models located at
http://www.microsemi.com/soc/download/ibis/default.aspx.
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B
specification.
ProASIC3 DC and Switching Characteristics
2-26 Revision 13
Table 2-29 • I/O Output Buffer Maximum Resistances 1
Applicable to Standard Plus I/O Banks
Standard Drive Strength RPULL-DOWN ()2RPULL-UP ()3
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300
4 mA 100 300
6 mA 50 150
8 mA 50 150
12 mA 25 75
16 mA 25 75
3.3 V LVCMOS Wide Range4100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 100 200
4 mA 100 200
6 mA 50 100
8 mA 50 100
12 mA 25 50
1.8 V LVCMOS 2 mA 200 225
4 mA 100 112
6 mA 50 56
8 mA 50 56
1.5 V LVCMOS 2 mA 200 224
4 mA 100 112
3.3 V PCI/PCI-X Per PCI/PCI-X
specification
25 75
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCCI, drive strength selection, temperature, and process. For board design
considerations and detailed output buffer resistances, use the corresponding IBIS models located at
http://www.microsemi.com/soc/download/ibis/default.aspx.
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B
specification.
ProASIC3 Flash Family FPGAs
Revision 13 2-27
Table 2-30 • I/O Output Buffer Maximum Resistances1
Applicable to Standard I/O Banks
Standard Drive Strength
RPULL-DOWN
()2
RPULL-UP
()3
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 100 300
4 mA 100 300
6 mA 50 150
8 mA 50 150
3.3 V LVCMOS Wide Range4100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 100 200
4 mA 100 200
6 mA 50 100
8 mA 50 100
1.8 V LVCMOS 2 mA 200 225
4 mA 100 112
1.5 V LVCMOS 2 mA 200 224
Notes:
1. These maximum values are provided for informational reasons only. Minimum output buffer resistance
values depend on VCCI, drive strength selection, temperature, and process. For board design
considerations and detailed output buffer resistances, use the corresponding IBIS models located at
http://www.microsemi.com/soc/download/ibis/default.aspx.
2. R(PULL-DOWN-MAX) = (VOLspec) / IOLspec
3. R(PULL-UP-MAX) = (VCCImax – VOHspec) / IOHspec
4. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD-8B
specification.
Table 2-31 • I/O Weak Pull-Up/Pull-Down Resistances
Minimum and Maximum Weak Pull-Up/Pull-Down Resistance Values
VCCI
R(WEAK PULL-UP)1
()
R(WEAK PULL-DOWN)2
()
Min. Max. Min. Max.
3.3 V 10 k 45 k 10 k 45 k
3.3 V (wide range I/Os) 10 k 45 k 10 k 45 k
2.5 V 11 k 55 k 12 k 74 k
1.8 V 18 k 70 k 17 k 110 k
1.5 V 19 k 90 k 19 k 140 k
Notes:
1. R(WEAK PULL-UP-MAX) = (VCCIMAX – VOHspec) / I(WEAK PULL-UP-MIN)
2. R(WEAK PULL-DOWN-MAX) = (VOLspec) / I(WEAK PULL-DOWN-MIN)
ProASIC3 DC and Switching Characteristics
2-28 Revision 13
Table 2-32 • I/O Short Currents IOSH/IOSL
Applicable to Advanced I/O Banks
Drive Strength IOSL (mA)1IOSH (mA)1
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25
4 mA 27 25
6 mA 54 51
8 mA 54 51
12 mA 109 103
16 mA 127 132
24 mA 181 268
3.3 V LVCMOS Wide Range2100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 18 16
4 mA 18 16
6 mA 37 32
8 mA 37 32
12 mA 74 65
16 mA 87 83
24 mA 124 169
1.8 V LVCMOS 2 mA 11 9
4 mA 22 17
6 mA 44 35
8 mA 51 45
12 mA 74 91
16 mA 74 91
1.5 V LVCMOS 2 mA 16 13
4 mA 33 25
6 mA 39 32
8 mA 55 66
12 mA 55 66
3.3 V PCI/PCI-X Per PCI/PCI-X
specification
109 103
Notes:
1. TJ = 100°C
2. Applicable to 3.3 V LVCMOS Wide Range. IOSL/IOSH dependent on the I/O buffer drive strength selected
for wide range applications. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as
specified in the JESD8-B specification.
ProASIC3 Flash Family FPGAs
Revision 13 2-29
Table 2-33 • I/O Short Currents IOSH/IOSL
Applicable to Standard Plus I/O Banks
Drive Strength IOSL (mA)* IOSH (mA)*
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25
4 mA 27 25
6 mA 54 51
8 mA 54 51
12 mA 109 103
16 mA 109 103
3.3 V LVCMOS Wide Range2100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 18 16
4 mA 18 16
6 mA 37 32
8 mA 37 32
12 mA 74 65
1.8 V LVCMOS 2 mA 11 9
4 mA 22 17
6 mA 44 35
8 mA 44 35
1.5 V LVCMOS 2 mA 16 13
4 mA 33 25
3.3 V PCI/PCI-X Per PCI/PCI-X
specification
109 103
Notes:
1. TJ = 100°C
2. Applicable to 3.3 V LVCMOS Wide Range. IOSL/IOSH dependent on the I/O buffer drive strength
selected for wide range applications. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide
range as specified in the JESD8-B specification.
ProASIC3 DC and Switching Characteristics
2-30 Revision 13
The length of time an I/O can withstand IOSH/IOSL events depends on the junction temperature. The
reliability data below is based on a 3.3 V, 12 mA I/O setting, which is the worst case for this type of
analysis.
For example, at 100°C, the short current condition would have to be sustained for more than six months
to cause a reliability concern. The I/O design does not contain any short circuit protection, but such
protection would only be needed in extremely prolonged stress conditions.
Table 2-34 • I/O Short Currents IOSH/IOSL
Applicable to Standard I/O Banks
Drive Strength IOSL (mA)* IOSH (mA)*
3.3 V LVTTL / 3.3 V LVCMOS 2 mA 27 25
4 mA 27 25
6 mA 54 51
8 mA 54 51
3.3 V LVCMOS Wide Range2100 µA Same as regular
3.3 V LVCMOS
Same as regular
3.3 V LVCMOS
2.5 V LVCMOS 2 mA 18 16
4 mA 18 16
6 mA 37 32
8 mA 37 32
1.8 V LVCMOS 2 mA 11 9
4 mA 22 17
1.5 V LVCMOS 2 mA 16 13
Notes:
1. TJ = 100°C
2. Applicable to 3.3 V LVCMOS Wide Range. IOSL/IOSH dependent on the I/O buffer drive strength selected
for wide range applications. All LVCMOS 3.3 V software macros support LVCMOS 3.3 V wide range as
specified in the JESD-8B specification.
Table 2-35 • Duration of Short Circuit Event Before Failure
Temperature Time before Failure
–40°C > 20 years
0°C > 20 years
25°C > 20 years
70°C 5 years
85°C 2 years
100°C 6 months
Table 2-36 • I/O Input Rise Time, Fall Time, and Related I/O Reliability
Input Buffer Input Rise/Fall Time (min.) Input Rise/Fall Time (max.) Reliability
LVTTL/LVCMOS No requirement 10 ns * 20 years (110°C)
LVDS/B-LVDS/
M-LVDS/LVPECL
No requirement 10 ns * 10 years (100°C)
Note: *The maximum input rise/fall time is related to the noise induced into the input buffer trace. If the
noise is low, then the rise time and fall time of input buffers can be increased beyond the maximum
value. The longer the rise/fall times, the more susceptible the input signal is to the board noise.
Microsemi recommends signal integrity evaluation/characterization of the system to ensure that
there is no excessive noise coupling into input signals.
ProASIC3 Flash Family FPGAs
Revision 13 2-31
Single-Ended I/O Characteristics
3.3 V LVTTL / 3.3 V LVCMOS
Low-Voltage Transistor–Transistor Logic (LVTTL) is a general-purpose standard (EIA/JESD) for 3.3 V
applications. It uses an LVTTL input buffer and push-pull output buffer.
Table 2-37 • Minimum and Maximum DC Input and Output Levels
Applicable to Advanced I/O Banks
3.3 V LVTTL /
3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 27 25 10 10
4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 27 25 10 10
6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 54 51 10 10
8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 54 51 10 10
12 mA –0.3 0.8 2 3.6 0.4 2.4 12 12 109 103 10 10
16 mA –0.3 0.8 2 3.6 0.4 2.4 16 16 127 132 10 10
24 mA –0.3 0.8 2 3.6 0.4 2.4 24 24 181 268 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Table 2-38 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard Plus I/O Banks
3.3 V LVTTL /
3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 27 25 10 10
4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 27 25 10 10
6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 54 51 10 10
8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 54 51 10 10
12 mA –0.3 0.8 2 3.6 0.4 2.4 12 12 109 103 10 10
16 mA –0.3 0.8 2 3.6 0.4 2.4 16 16 109 103 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
ProASIC3 DC and Switching Characteristics
2-32 Revision 13
Table 2-39 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard I/O Banks
3.3 V LVTTL /
3.3 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.8 2 3.6 0.4 2.4 2 2 25 27 10 10
4 mA –0.3 0.8 2 3.6 0.4 2.4 4 4 25 27 10 10
6 mA –0.3 0.8 2 3.6 0.4 2.4 6 6 51 54 10 10
8 mA –0.3 0.8 2 3.6 0.4 2.4 8 8 51 54 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at 100°C junction temperature and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Figure 2-6 • AC Loading
Table 2-40 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF)
03.31.435
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Test Point
Test Point
Enable Path
Datapath 35 pF
R = 1 k R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
ProASIC3 Flash Family FPGAs
Revision 13 2-33
Timing Characteristics
Table 2-41 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 7.66 0.04 1.02 0.43 7.80 6.59 2.65 2.61 10.03 8.82 ns
–1 0.56 6.51 0.04 0.86 0.36 6.63 5.60 2.25 2.22 8.54 7.51 ns
–2 0.49 5.72 0.03 0.76 0.32 5.82 4.92 1.98 1.95 7.49 6.59 ns
6 mA Std. 0.66 4.91 0.04 1.02 0.43 5.00 4.07 2.99 3.20 7.23 6.31 ns
–1 0.56 4.17 0.04 0.86 0.36 4.25 3.46 2.54 2.73 6.15 5.36 ns
–2 0.49 3.66 0.03 0.76 0.32 3.73 3.04 2.23 2.39 5.40 4.71 ns
8 mA Std. 0.66 4.91 0.04 1.02 0.43 5.00 4.07 2.99 3.20 7.23 6.31 ns
–1 0.56 4.17 0.04 0.86 0.36 4.25 3.46 2.54 2.73 6.15 5.36 ns
–2 0.49 3.66 0.03 0.76 0.32 3.73 3.04 2.23 2.39 5.40 4.71 ns
12 mA Std. 0.66 3.53 0.04 1.02 0.43 3.60 2.82 3.21 3.58 5.83 5.06 ns
–1 0.56 3.00 0.04 0.86 0.36 3.06 2.40 2.73 3.05 4.96 4.30 ns
–2 0.49 2.64 0.03 0.76 0.32 2.69 2.11 2.40 2.68 4.36 3.78 ns
16 mA Std. 0.66 3.33 0.04 1.02 0.43 3.39 2.56 3.26 3.68 5.63 4.80 ns
–1 0.56 2.83 0.04 0.86 0.36 2.89 2.18 2.77 3.13 4.79 4.08 ns
–2 0.49 2.49 0.03 0.76 0.32 2.53 1.91 2.44 2.75 4.20 3.58 ns
24 mA Std. 0.66 3.08 0.04 1.02 0.43 3.13 2.12 3.32 4.06 5.37 4.35 ns
–1 0.56 2.62 0.04 0.86 0.36 2.66 1.80 2.83 3.45 4.57 3.70 ns
–2 0.49 2.30 0.03 0.76 0.32 2.34 1.58 2.48 3.03 4.01 3.25 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-34 Revision 13
Table 2-42 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 10.26 0.04 1.02 0.43 10.45 8.90 2.64 2.46 12.68 11.13 ns
–1 0.56 8.72 0.04 0.86 0.36 8.89 7.57 2.25 2.09 10.79 9.47 ns
–2 0.49 7.66 0.03 0.76 0.32 7.80 6.64 1.98 1.83 9.47 8.31 ns
6 mA Std. 0.66 7.27 0.04 1.02 0.43 7.41 6.28 2.98 3.04 9.65 8.52 ns
–1 0.56 6.19 0.04 0.86 0.36 6.30 5.35 2.54 2.59 8.20 7.25 ns
–2 0.49 5.43 0.03 0.76 0.32 5.53 4.69 2.23 2.27 7.20 6.36 ns
8 mA Std. 0.66 7.27 0.04 1.02 0.43 7.41 6.28 2.98 3.04 9.65 8.52 ns
–1 0.56 6.19 0.04 0.86 0.36 6.30 5.35 2.54 2.59 8.20 7.25 ns
–2 0.49 5.43 0.03 0.76 0.32 5.53 4.69 2.23 2.27 7.20 6.36 ns
12 mA Std. 0.66 5.58 0.04 1.02 0.43 5.68 4.87 3.21 3.42 7.92 7.11 ns
–1 0.56 4.75 0.04 0.86 0.36 4.84 4.14 2.73 2.91 6.74 6.05 ns
–2 0.49 4.17 0.03 0.76 0.32 4.24 3.64 2.39 2.55 5.91 5.31 ns
16 mA Std. 0.66 5.21 0.04 1.02 0.43 5.30 4.56 3.26 3.51 7.54 6.80 ns
–1 0.56 4.43 0.04 0.86 0.36 4.51 3.88 2.77 2.99 6.41 5.79 ns
–2 0.49 3.89 0.03 0.76 0.32 3.96 3.41 2.43 2.62 5.63 5.08 ns
24 mA Std. 0.66 4.85 0.04 1.02 0.43 4.94 4.54 3.32 3.88 7.18 6.78 ns
–1 0.56 4.13 0.04 0.86 0.36 4.20 3.87 2.82 3.30 6.10 5.77 ns
–2 0.49 3.62 0.03 0.76 0.32 3.69 3.39 2.48 2.90 5.36 5.06 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-35
Table 2-43 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 7.20 0.04 1.00 0.43 7.34 6.29 2.27 2.34 9.57 8.52 ns
–1 0.56 6.13 0.04 0.85 0.36 6.24 5.35 1.93 1.99 8.14 7.25 ns
–2 0.49 5.38 0.03 0.75 0.32 5.48 4.69 1.70 1.75 7.15 6.36 ns
6 mA Std. 0.66 4.50 0.04 1.00 0.43 4.58 3.82 2.58 2.88 6.82 6.05 ns
–1 0.56 3.83 0.04 0.85 0.36 3.90 3.25 2.19 2.45 5.80 5.15 ns
–2 0.49 3.36 0.03 0.75 0.32 3.42 2.85 1.92 2.15 5.09 4.52 ns
8 mA Std. 0.66 4.50 0.04 1.00 0.43 4.58 3.82 2.58 2.88 6.82 6.05 ns
–1 0.56 3.83 0.04 0.85 0.36 3.90 3.25 2.19 2.45 5.80 5.15 ns
–2 0.49 3.36 0.03 0.75 0.32 3.42 2.85 1.92 2.15 5.09 4.52 ns
12 mA Std. 0.66 3.16 0.04 1.00 0.43 3.22 2.58 2.79 3.22 5.45 4.82 ns
–1 0.56 2.69 0.04 0.85 0.36 2.74 2.20 2.37 2.74 4.64 4.10 ns
–2 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns
16 mA Std. 0.66 3.16 0.04 1.00 0.43 3.22 2.58 2.79 3.22 5.45 4.82 ns
–1 0.56 2.69 0.04 0.85 0.36 2.74 2.20 2.37 2.74 4.64 4.10 ns
–2 0.49 2.36 0.03 0.75 0.32 2.40 1.93 2.08 2.41 4.07 3.60 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-36 Revision 13
Table 2-44 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 9.68 0.04 1.00 0.43 9.86 8.42 2.28 2.21 12.09 10.66 ns
–1 0.56 8.23 0.04 0.85 0.36 8.39 7.17 1.94 1.88 10.29 9.07 ns
–2 0.49 7.23 0.03 0.75 0.32 7.36 6.29 1.70 1.65 9.03 7.96 ns
6 mA Std. 0.66 6.70 0.04 1.00 0.43 6.82 5.89 2.58 2.74 9.06 8.12 ns
–1 0.56 5.70 0.04 0.85 0.36 5.80 5.01 2.20 2.33 7.71 6.91 ns
–2 0.49 5.00 0.03 0.75 0.32 5.10 4.40 1.93 2.05 6.76 6.06 ns
8 mA Std. 0.66 6.70 0.04 1.00 0.43 6.82 5.89 2.58 2.74 9.06 8.12 ns
–1 0.56 5.70 0.04 0.85 0.36 5.80 5.01 2.20 2.33 7.71 6.91 ns
–2 0.49 5.00 0.03 0.75 0.32 5.10 4.40 1.93 2.05 6.76 6.06 ns
12 mA Std. 0.66 5.05 0.04 1.00 0.43 5.14 4.51 2.79 3.08 7.38 6.75 ns
–1 0.56 4.29 0.04 0.85 0.36 4.37 3.84 2.38 2.62 6.28 5.74 ns
–2 0.49 3.77 0.03 0.75 0.32 3.84 3.37 2.09 2.30 5.51 5.04 ns
16 mA Std. 0.66 5.05 0.04 1.00 0.43 5.14 4.51 2.79 3.08 7.38 6.75 ns
–1 0.56 4.29 0.04 0.85 0.36 4.37 3.84 2.38 2.62 6.28 5.74 ns
–2 0.49 3.77 0.03 0.75 0.32 3.84 3.37 2.09 2.30 5.51 5.04 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-45 • 3.3 V LVTTL / 3.3 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 7.07 0.04 1.00 0.43 7.20 6.23 2.07 2.15 ns
–1 0.56 6.01 0.04 0.85 0.36 6.12 5.30 1.76 1.83 ns
–2 0.49 5.28 0.03 0.75 0.32 5.37 4.65 1.55 1.60 ns
4 mA Std. 0.66 7.07 0.04 1.00 0.43 7.20 6.23 2.07 2.15 ns
–1 0.56 6.01 0.04 0.85 0.36 6.12 5.30 1.76 1.83 ns
–2 0.49 5.28 0.03 0.75 0.32 5.37 4.65 1.55 1.60 ns
6 mA Std. 0.66 4.41 0.04 1.00 0.43 4.49 3.75 2.39 2.69 ns
–1 0.56 3.75 0.04 0.85 0.36 3.82 3.19 2.04 2.29 ns
–2 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns
8 mA Std. 0.66 4.41 0.04 1.00 0.43 4.49 3.75 2.39 2.69 ns
–1 0.56 3.75 0.04 0.85 0.36 3.82 3.19 2.04 2.29 ns
–2 0.49 3.29 0.03 0.75 0.32 3.36 2.80 1.79 2.01 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-37
Table 2-46 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 9.46 0.04 1.00 0.43 9.64 8.54 2.07 2.04 ns
–1 0.56 8.05 0.04 0.85 0.36 8.20 7.27 1.76 1.73 ns
–2 0.49 7.07 0.03 0.75 0.32 7.20 6.38 1.55 1.52 ns
4 mA Std. 0.66 9.46 0.04 1.00 0.43 9.64 8.54 2.07 2.04 ns
–1 0.56 8.05 0.04 0.85 0.36 8.20 7.27 1.76 1.73 ns
–2 0.49 7.07 0.03 0.75 0.32 7.20 6.38 1.55 1.52 ns
6 mA Std. 0.66 6.57 0.04 1.00 0.43 6.69 5.98 2.40 2.57 ns
–1 0.56 5.59 0.04 0.85 0.36 5.69 5.09 2.04 2.19 ns
–2 0.49 4.91 0.03 0.75 0.32 5.00 4.47 1.79 1.92 ns
8 mA Std. 0.66 6.57 0.04 1.00 0.43 6.69 5.98 2.40 2.57 ns
–1 0.56 5.59 0.04 0.85 0.36 5.69 5.09 2.04 2.19 ns
–2 0.49 4.91 0.03 0.75 0.32 5.00 4.47 1.79 1.92 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-38 Revision 13
3.3 V LVCMOS Wide Range
Table 2-47 • Minimum and Maximum DC Input and Output Levels
Applicable to Advanced I/O Banks
3.3 V
LVCMOS
Wide Range
Equiv.
Software
Default
Drive
Strength
Option1
VIL VIH VOL VOH IOL IOH IOSL IOSH IIL2IIH3
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
V µA µA
Max.
mA4
Max.
mA4µA5µA5
100 µA 2 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 4 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 6 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
100 µA 8 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
100 µA 12 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 103 109 10 10
100 µA 16 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 132 127 10 10
100 µA 24 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 268 181 10 10
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
4. Currents are measured at 85°C junction temperature.
5. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
6. Software default selection highlighted in gray.
Table 2-48 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard Plus I/O Banks
3.3 V LVCMOS
Wide Range
Equiv.
Software
Default
Drive
Strength
Option1
VIL VIH VOL VOH IOL IOH IOSL IOSH IIL2IIH3
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VµAµA
Max.
mA4
Max.
mA4µA5µA5
100 µA 2 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 4 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 6 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
100 µA 8 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
100 µA 12 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 103 109 10 10
100 A 16 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 103 109 10 10
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
4. Currents are measured at 85°C junction temperature.
5. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
6. Software default selection highlighted in gray.
ProASIC3 Flash Family FPGAs
Revision 13 2-39
Table 2-49 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard I/O Banks
3.3 V
LVCMOS
Wide Range
Equiv.
Software
Default
Drive
Strength
Option1
VIL VIH VOL VOH IOL IOH IOSL IOSH IIL2IIH3
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VµAµA
Max.
mA4
Max.
mA4µA5µA5
100 µA 2 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 4 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 25 27 10 10
100 µA 6 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
100 µA 8 mA –0.3 0.8 2 3.6 0.2 VDD – 0.2 100 100 51 54 10 10
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
4. Currents are measured at 85°C junction temperature.
5. All LVMCOS 3.3 V software macros support LVCMOS 3.3 V wide range as specified in the JESD8-B specification.
6. Software default selection highlighted in gray.
ProASIC3 DC and Switching Characteristics
2-40 Revision 13
Timing Characteristics
Table 2-50 • 3.3 V LVTTL / 3.3 V LVCMOS HIgh Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
100 µA 4 mA Std. 0.60 11.84 0.04 1.02 0.43 11.84 10.00 4.10 4.04 15.23 13.40 ns
–1 0.51 10.07 0.04 0.86 0.36 10.07 8.51 3.48 3.44 12.96 11.40 ns
–2 0.45 8.84 0.03 0.76 0.32 8.84 7.47 3.06 3.02 11.38 10.00 ns
100 µA 6 mA Std. 0.60 7.59 0.04 1.02 0.43 7.59 6.18 4.62 4.95 10.98 9.57 ns
–1 0.51 6.45 0.04 0.86 0.36 6.45 5.25 3.93 4.21 9.34 8.14 ns
–2 0.45 5.67 0.03 0.76 0.32 5.67 4.61 3.45 3.70 8.20 7.15 ns
100 µA 8 mA Std. 0.60 7.59 0.04 1.02 0.43 7.59 6.18 4.62 4.95 10.98 9.57 ns
–1 0.51 6.45 0.04 0.86 0.36 6.45 5.25 3.93 4.21 9.34 8.14 ns
–2 0.45 5.67 0.03 0.76 0.32 5.67 4.61 3.45 3.70 8.20 7.15 ns
100 µA 12 mA Std. 0.60 5.46 0.04 1.02 0.43 5.46 4.29 4.97 5.54 8.86 7.68 ns
–1 0.51 4.65 0.04 0.86 0.36 4.65 3.65 4.22 4.71 7.53 6.54 ns
–2 0.45 4.08 0.03 0.76 0.32 4.08 3.20 3.71 4.14 6.61 5.74 ns
100 µA 16 mA Std. 0.60 5.15 0.04 1.02 0.43 5.15 3.89 5.04 5.69 8.55 7.29 ns
–1 0.51 4.38 0.04 0.86 0.36 4.38 3.31 4.29 4.84 7.27 6.20 ns
–2 0.45 3.85 0.03 0.76 0.32 3.85 2.91 3.77 4.25 6.38 5.44 ns
100 µA 24 mA Std. 0.60 4.75 0.04 1.02 0.43 4.75 3.22 5.14 6.28 8.15 6.61 ns
–1 0.51 4.04 0.04 0.86 0.36 4.04 2.74 4.37 5.34 6.93 5.62 ns
–2 0.45 3.55 0.03 0.76 0.32 3.55 2.40 3.84 4.69 6.09 4.94 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. Software default selection highlighted in gray.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-41
Table 2-51 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
100 µA 2 mA Std. 0.60 15.86 0.04 1.54 0.43 15.86 13.51 4.09 3.80 19.25 16.90 ns
–1 0.51 13.49 0.04 1.31 0.36 13.49 11.49 3.48 3.23 16.38 14.38 ns
–2 0.45 11.84 0.03 1.15 0.32 11.84 10.09 3.05 2.84 14.38 12.62 ns
100 µA 4 mA Std. 0.60 11.25 0.04 1.54 0.43 11.25 9.54 4.61 4.70 14.64 12.93 ns
–1 0.51 9.57 0.04 1.31 0.36 9.57 8.11 3.92 4.00 12.46 11.00 ns
–2 0.45 8.40 0.03 1.15 0.32 8.40 7.12 3.44 3.51 10.93 9.66 ns
100 µA 6 mA Std. 0.60 11.25 0.04 1.54 0.43 11.25 9.54 4.61 4.70 14.64 12.93 ns
–1 0.51 9.57 0.04 1.31 0.36 9.57 8.11 3.92 4.00 12.46 11.00 ns
–2 0.45 8.40 0.03 1.15 0.32 8.40 7.12 3.44 3.51 10.93 9.66 ns
100 µA 8 mA Std. 0.60 8.63 0.04 1.54 0.43 8.63 7.39 4.96 5.28 12.02 10.79 ns
–1 0.51 7.34 0.04 1.31 0.36 7.34 6.29 4.22 4.49 10.23 9.18 ns
–2 0.45 6.44 0.03 1.15 0.32 6.44 5.52 3.70 3.94 8.98 8.06 ns
100 µA 16 mA Std. 0.60 8.05 0.04 1.54 0.43 8.05 6.93 5.03 5.43 11.44 10.32 ns
–1 0.51 6.85 0.04 1.31 0.36 6.85 5.90 4.28 4.62 9.74 8.78 ns
–2 0.45 6.01 0.03 1.15 0.32 6.01 5.18 3.76 4.06 8.55 7.71 ns
100 µA 24 mA Std. 0.60 7.50 0.04 1.54 0.43 7.50 6.90 5.13 6.00 10.89 10.29 ns
–1 0.51 6.38 0.04 1.31 0.36 6.38 5.87 4.36 5.11 9.27 8.76 ns
–2 0.45 5.60 0.03 1.15 0.32 5.60 5.15 3.83 4.48 8.13 7.69 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-42 Revision 13
Table 2-52 • 3.3 V LVTTL / 3.3 V LVCMOS HIgh Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
100 µA 2 mA Std. 0.60 11.14 0.04 1.52 0.43 11.14 9.54 3.51 3.61 14.53 12.94 ns
–1 0.51 9.48 0.04 1.29 0.36 9.48 8.12 2.99 3.07 12.36 11.00 ns
–2 0.45 8.32 0.03 1.14 0.32 8.32 7.13 2.62 2.70 10.85 9.66 ns
100 µA 4 mA Std. 0.60 6.96 0.04 1.52 0.43 6.96 5.79 3.99 4.45 10.35 9.19 ns
–1 0.51 5.92 0.04 1.29 0.36 5.92 4.93 3.39 3.78 8.81 7.82 ns
–2 0.45 5.20 0.03 1.14 0.32 5.20 4.33 2.98 3.32 7.73 6.86 ns
100 µA 6 mA Std. 0.60 6.96 0.04 1.52 0.43 6.96 5.79 3.99 4.45 10.35 9.19 ns
–1 0.51 5.92 0.04 1.29 0.36 5.92 4.93 3.39 3.78 8.81 7.82 ns
–2 0.45 5.20 0.03 1.14 0.32 5.20 4.33 2.98 3.32 7.73 6.86 ns
100 µA 8 mA Std. 0.60 4.89 0.04 1.52 0.43 4.89 3.92 4.31 4.98 8.28 7.32 ns
–1 0.51 4.16 0.04 1.29 0.36 4.16 3.34 3.67 4.24 7.04 6.22 ns
–2 0.45 3.65 0.03 1.14 0.32 3.65 2.93 3.22 3.72 6.18 5.46 ns
100 µA 16 mA Std. 0.60 4.89 0.04 1.52 0.43 4.89 3.92 4.31 4.98 8.28 7.32 ns
–1 0.51 4.16 0.04 1.29 0.36 4.16 3.34 3.67 4.24 7.04 6.22 ns
–2 0.45 3.65 0.03 1.14 0.32 3.65 2.93 3.22 3.72 6.18 5.46 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. Software default selection highlighted in gray.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-43
Table 2-53 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
100 µA 2 mA Std. 0.60 14.97 0.04 1.52 0.43 14.97 12.79 3.52 3.41 18.36 16.18 ns
–1 0.51 12.73 0.04 1.29 0.36 12.73 10.88 2.99 2.90 15.62 13.77 ns
–2 0.45 11.18 0.03 1.14 0.32 11.18 9.55 2.63 2.55 13.71 12.08 ns
100 µA 4 mA Std. 0.60 10.36 0.04 1.52 0.43 10.36 8.93 3.99 4.24 13.75 12.33 ns
–1 0.51 8.81 0.04 1.29 0.36 8.81 7.60 3.39 3.60 11.70 10.49 ns
–2 0.45 7.74 0.03 1.14 0.32 7.74 6.67 2.98 3.16 10.27 9.21 ns
100 µA 6 mA Std. 0.60 10.36 0.04 1.52 0.43 10.36 8.93 3.99 4.24 13.75 12.33 ns
–1 0.51 8.81 0.04 1.29 0.36 8.81 7.60 3.39 3.60 11.70 10.49 ns
–2 0.45 7.74 0.03 1.14 0.32 7.74 6.67 2.98 3.16 10.27 9.21 ns
100 µA 8 mA Std. 0.60 7.81 0.04 1.52 0.43 7.81 6.85 4.32 4.76 11.20 10.24 ns
–1 0.51 6.64 0.04 1.29 0.36 6.64 5.82 3.67 4.05 9.53 8.71 ns
–2 0.45 5.83 0.03 1.14 0.32 5.83 5.11 3.22 3.56 8.36 7.65 ns
100 µA 16 mA Std. 0.60 7.81 0.04 1.52 0.43 7.81 6.85 4.32 4.76 11.20 10.24 ns
–1 0.51 6.64 0.04 1.29 0.36 6.64 5.82 3.67 4.05 9.53 8.71 ns
–2 0.45 5.83 0.03 1.14 0.32 5.83 5.11 3.22 3.56 8.36 7.65 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-44 Revision 13
Table 2-54 • 3.3 V LVTTL / 3.3 V LVCMOS HIgh Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
100 µA 2 mA Std. 0.60 10.93 0.04 1.52 0.43 10.93 9.46 3.20 3.32 ns
–1 0.51 9.29 0.04 1.29 0.36 9.29 8.04 2.72 2.82 ns
–2 0.45 8.16 0.03 1.13 0.32 8.16 7.06 2.39 2.48 ns
100 µA 4 mA Std. 0.60 10.93 0.04 1.52 0.43 10.93 9.46 3.20 3.32 ns
–1 0.51 9.29 0.04 1.29 0.36 9.29 8.04 2.72 2.82 ns
–2 0.45 8.16 0.03 1.13 0.32 8.16 7.06 2.39 2.48 ns
100 µA 6 mA Std. 0.60 6.82 0.04 1.52 0.43 6.82 5.70 3.70 4.16 ns
–1 0.51 5.80 0.04 1.29 0.36 5.80 4.85 3.15 3.54 ns
–2 0.45 5.09 0.03 1.13 0.32 5.09 4.25 2.77 3.11 ns
100 µA 8 mA Std. 0.60 6.82 0.04 1.52 0.43 6.82 5.70 3.70 4.16 ns
–1 0.51 5.80 0.04 1.29 0.36 5.80 4.85 3.15 3.54 ns
–2 0.45 5.09 0.03 1.13 0.32 5.09 4.25 2.77 3.11 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. Software default selection highlighted in gray.
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-45
Table 2-55 • 3.3 V LVTTL / 3.3 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Equiv.
Software
Default
Drive
Strength
Option1
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
100 µA 2 mA Std. 0.60 14.64 0.04 1.52 0.43 14.64 12.97 3.21 3.15 ns
–1 0.51 12.45 0.04 1.29 0.36 12.45 11.04 2.73 2.68 ns
–2 0.45 10.93 0.03 1.13 0.32 10.93 9.69 2.39 2.35 ns
100 µA 4 mA Std. 0.60 14.64 0.04 1.52 0.43 14.64 12.97 3.21 3.15 ns
–1 0.51 12.45 0.04 1.29 0.36 12.45 11.04 2.73 2.68 ns
–2 0.45 10.93 0.03 1.13 0.32 10.93 9.69 2.39 2.35 ns
100 µA 6 mA Std. 0.60 10.16 0.04 1.52 0.43 10.16 9.08 3.71 3.98 ns
–1 0.51 8.64 0.04 1.29 0.36 8.64 7.73 3.15 3.39 ns
–2 0.45 7.58 0.03 1.13 0.32 7.58 6.78 2.77 2.97 ns
100 µA 8 mA Std. 0.60 10.16 0.04 1.52 0.43 10.16 9.08 3.71 3.98 ns
–1 0.51 8.64 0.04 1.29 0.36 8.64 7.73 3.15 3.39 ns
–2 0.45 7.58 0.03 1.13 0.32 7.58 6.78 2.77 2.97 ns
Notes:
1. The minimum drive strength for any LVCMOS 3.3 V software configuration when run in wide range is ±100 µA. Drive
strength displayed in the software is supported for normal range only. For a detailed I/V curve, refer to the IBIS models.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-46 Revision 13
2.5 V LVCMOS
Low-Voltage CMOS for 2.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-
purpose 2.5 V applications.
Table 2-56 • Minimum and Maximum DC Input and Output Levels
Applicable to Advanced I/O Banks
2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1 IIH2
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.7 1.7 2.7 0.7 1.7 2 2 18 16 10 10
4 mA –0.3 0.7 1.7 2.7 0.7 1.7 4 4 18 16 10 10
6 mA –0.3 0.7 1.7 2.7 0.7 1.7 6 6 37 32 10 10
8 mA –0.3 0.7 1.7 2.7 0.7 1.7 8 8 37 32 10 10
12 mA –0.3 0.7 1.7 2.7 0.7 1.7 12 12 74 65 10 10
16 mA –0.3 0.7 1.7 2.7 0.7 1.7 16 16 87 83 10 10
24 mA –0.3 0.7 1.7 2.7 0.7 1.7 24 24 124 169 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Table 2-57 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard Plus I/O Banks
2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.7 1.7 2.7 0.7 1.7 2 2 18 16 10 10
4 mA –0.3 0.7 1.7 2.7 0.7 1.7 4 4 18 16 10 10
6 mA –0.3 0.7 1.7 2.7 0.7 1.7 6 6 37 32 10 10
8 mA –0.3 0.7 1.7 2.7 0.7 1.7 8 8 37 32 10 10
12 mA –0.3 0.7 1.7 2.7 0.7 1.7 12 12 74 65 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
ProASIC3 Flash Family FPGAs
Revision 13 2-47
Table 2-58 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard I/O Banks
2.5 V LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive Strength
Min.
V
Max.,
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.7 1.7 3.6 0.7 1.7 2 2 16 18 10 10
4 mA –0.3 0.7 1.7 3.6 0.7 1.7 4 4 16 18 10 10
6 mA –0.3 0.7 1.7 3.6 0.7 1.7 6 6 32 37 10 10
8 mA –0.3 0.7 1.7 3.6 0.7 1.7 8 8 32 37 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Figure 2-7 • AC Loading
Table 2-59 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF)
02.51.235
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Test Point
Test Point
Enable Path
Datapath 35 pF
R = 1 k R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
ProASIC3 DC and Switching Characteristics
2-48 Revision 13
Timing Characteristics
Table 2-60 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.60 8.66 0.04 1.31 0.43 7.83 8.66 2.68 2.30 10.07 10.90 ns
–1 0.51 7.37 0.04 1.11 0.36 6.66 7.37 2.28 1.96 8.56 9.27 ns
–2 0.45 6.47 0.03 0.98 0.32 5.85 6.47 2.00 1.72 7.52 8.14 ns
6 mA Std. 0.60 5.17 0.04 1.31 0.43 5.04 5.17 3.05 3.00 7.27 7.40 ns
–1 0.51 4.39 0.04 1.11 0.36 4.28 4.39 2.59 2.55 6.19 6.30 ns
–2 0.45 3.86 0.03 0.98 0.32 3.76 3.86 2.28 2.24 5.43 5.53 ns
8 mA Std. 0.60 5.17 0.04 1.31 0.43 5.04 5.17 3.05 3.00 7.27 7.40 ns
–1 0.51 4.39 0.04 1.11 0.36 4.28 4.39 2.59 2.55 6.19 6.30 ns
–2 0.45 3.86 0.03 0.98 0.32 3.76 3.86 2.28 2.24 5.43 5.53 ns
12 mA Std. 0.60 3.56 0.04 1.31 0.43 3.63 3.43 3.30 3.44 5.86 5.67 ns
–1 0.51 3.03 0.04 1.11 0.36 3.08 2.92 2.81 2.92 4.99 4.82 ns
–2 0.45 2.66 0.03 0.98 0.32 2.71 2.56 2.47 2.57 4.38 4.23 ns
16 mA Std. 0.60 3.35 0.04 1.31 0.43 3.41 3.06 3.36 3.55 5.65 5.30 ns
–1 0.51 2.85 0.04 1.11 0.36 2.90 2.60 2.86 3.02 4.81 4.51 ns
–2 0.45 2.50 0.03 0.98 0.32 2.55 2.29 2.51 2.65 4.22 3.96 ns
24 mA Std. 0.60 3.09 0.04 1.31 0.43 3.15 2.44 3.44 4.00 5.38 4.68 ns
–1 0.51 2.63 0.04 1.11 0.36 2.68 2.08 2.92 3.40 4.58 3.98 ns
–2 0.45 2.31 0.03 0.98 0.32 2.35 1.82 2.57 2.98 4.02 3.49 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-49
Table 2-61 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.60 11.40 0.04 1.31 0.43 11.22 11.40 2.68 2.20 13.45 13.63 ns
–1 0.51 9.69 0.04 1.11 0.36 9.54 9.69 2.28 1.88 11.44 11.60 ns
–2 0.45 8.51 0.03 0.98 0.32 8.38 8.51 2.00 1.65 10.05 10.18 ns
6 mA Std. 0.60 7.96 0.04 1.31 0.43 8.11 7.81 3.05 2.89 10.34 10.05 ns
–1 0.51 6.77 0.04 1.11 0.36 6.90 6.65 2.59 2.46 8.80 8.55 ns
–2 0.45 5.94 0.03 0.98 0.32 6.05 5.84 2.28 2.16 7.72 7.50 ns
8 mA Std. 0.60 7.96 0.04 1.31 0.43 8.11 7.81 3.05 2.89 10.34 10.05 ns
–1 0.51 6.77 0.04 1.11 0.36 6.90 6.65 2.59 2.46 8.80 8.55 ns
–2 0.45 5.94 0.03 0.98 0.32 6.05 5.84 2.28 2.16 7.72 7.50 ns
12 mA Std. 0.60 6.18 0.04 1.31 0.43 6.29 5.92 3.30 3.32 8.53 8.15 ns
–1 0.51 5.26 0.04 1.11 0.36 5.35 5.03 2.81 2.83 7.26 6.94 ns
–2 0.45 4.61 0.03 0.98 0.32 4.70 4.42 2.47 2.48 6.37 6.09 ns
16 mA Std. 0.60 5.76 0.04 1.31 0.43 5.87 5.53 3.36 3.44 8.11 7.76 ns
–1 0.51 4.90 0.04 1.11 0.36 4.99 4.70 2.86 2.92 6.90 6.60 ns
–2 0.45 4.30 0.03 0.98 0.32 4.38 4.13 2.51 2.57 6.05 5.80 ns
24 mA Std. 0.60 5.51 0.04 1.31 0.43 5.50 5.51 3.43 3.87 7.74 7.74 ns
–1 0.51 4.68 0.04 1.11 0.36 4.68 4.68 2.92 3.29 6.58 6.59 ns
–2 0.45 4.11 0.03 0.98 0.32 4.11 4.11 2.56 2.89 5.78 5.78 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-50 Revision 13
Table 2-62 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 8.28 0.04 1.30 0.43 7.41 8.28 2.25 2.07 9.64 10.51 ns
–1 0.56 7.04 0.04 1.10 0.36 6.30 7.04 1.92 1.76 8.20 8.94 ns
–2 0.49 6.18 0.03 0.97 0.32 5.53 6.18 1.68 1.55 7.20 7.85 ns
6 mA Std. 0.66 4.85 0.04 1.30 0.43 4.65 4.85 2.59 2.71 6.88 7.09 ns
–1 0.56 4.13 0.04 1.10 0.36 3.95 4.13 2.20 2.31 5.85 6.03 ns
–2 0.49 3.62 0.03 0.97 0.32 3.47 3.62 1.93 2.02 5.14 5.29 ns
8 mA Std. 0.66 4.85 0.04 1.30 0.43 4.65 4.85 2.59 2.71 6.88 7.09 ns
–1 0.56 4.13 0.04 1.10 0.36 3.95 4.13 2.20 2.31 5.85 6.03 ns
–2 0.49 3.62 0.03 0.97 0.32 3.47 3.62 1.93 2.02 5.14 5.29 ns
12 mA Std. 0.66 3.21 0.04 1.30 0.43 3.27 3.14 2.82 3.11 5.50 5.38 ns
–1 0.56 2.73 0.04 1.10 0.36 2.78 2.67 2.40 2.65 4.68 4.57 ns
–2 0.49 2.39 0.03 0.97 0.32 2.44 2.35 2.11 2.32 4.11 4.02 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-63 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
4 mA Std. 0.66 10.84 0.04 1.30 0.43 10.64 10.84 2.26 1.99 12.87 13.08 ns
–1 0.56 9.22 0.04 1.10 0.36 9.05 9.22 1.92 1.69 10.95 11.12 ns
–2 0.49 8.10 0.03 0.97 0.32 7.94 8.10 1.68 1.49 9.61 9.77 ns
6 mA Std. 0.66 7.37 0.04 1.30 0.43 7.50 7.36 2.59 2.61 9.74 9.60 ns
–1 0.56 6.27 0.04 1.10 0.36 6.38 6.26 2.20 2.22 8.29 8.16 ns
–2 0.49 5.50 0.03 0.97 0.32 5.60 5.50 1.93 1.95 7.27 7.17 ns
8 mA Std. 0.66 7.37 0.04 1.30 0.43 7.50 7.36 2.59 2.61 9.74 9.60 ns
–1 0.56 6.27 0.04 1.10 0.36 6.38 6.26 2.20 2.22 8.29 8.16 ns
–2 0.49 5.50 0.03 0.97 0.32 5.60 5.50 1.93 1.95 7.27 7.17 ns
12 mA Std. 0.66 5.63 0.04 1.30 0.43 5.73 5.51 2.83 3.01 7.97 7.74 ns
–1 0.56 4.79 0.04 1.10 0.36 4.88 4.68 2.41 2.56 6.78 6.59 ns
–2 0.49 4.20 0.03 0.97 0.32 4.28 4.11 2.11 2.25 5.95 5.78 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-51
Table 2-64 • 2.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 8.20 0.04 1.29 0.43 7.24 8.20 2.03 1.91 ns
–1 0.56 6.98 0.04 1.10 0.36 6.16 6.98 1.73 1.62 ns
–2 0.49 6.13 0.03 0.96 0.32 5.41 6.13 1.52 1.43 ns
4 mA Std. 0.66 8.20 0.04 1.29 0.43 7.24 8.20 2.03 1.91 ns
–1 0.56 6.98 0.04 1.10 0.36 6.16 6.98 1.73 1.62 ns
–2 0.49 6.13 0.03 0.96 0.32 5.41 6.13 1.52 1.43 ns
6 mA Std. 0.66 4.77 0.04 1.29 0.43 4.55 4.77 2.38 2.55 ns
–1 0.56 4.05 0.04 1.10 0.36 3.87 4.05 2.03 2.17 ns
–2 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns
8 mA Std. 0.66 4.77 0.04 1.29 0.43 4.55 4.77 2.38 2.55 ns
–1 0.56 4.05 0.04 1.10 0.36 3.87 4.05 2.03 2.17 ns
–2 0.49 3.56 0.03 0.96 0.32 3.40 3.56 1.78 1.91 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-65 • 2.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 11.00 0.04 1.29 0.43 10.37 11.00 2.03 1.83 ns
–1 0.56 9.35 0.04 1.10 0.36 8.83 9.35 1.73 1.56 ns
–2 0.49 8.21 0.03 0.96 0.32 7.75 8.21 1.52 1.37 ns
4 mA Std. 0.66 11.00 0.04 1.29 0.43 10.37 11.00 2.03 1.83 ns
–1 0.56 9.35 0.04 1.10 0.36 8.83 9.35 1.73 1.56 ns
–2 0.49 8.21 0.03 0.96 0.32 7.75 8.21 1.52 1.37 ns
6 mA Std. 0.66 7.50 0.04 1.29 0.43 7.36 7.50 2.39 2.46 ns
–1 0.56 6.38 0.04 1.10 0.36 6.26 6.38 2.03 2.10 ns
–2 0.49 5.60 0.03 0.96 0.32 5.49 5.60 1.78 1.84 ns
8 mA Std. 0.66 7.50 0.04 1.29 0.43 7.36 7.50 2.39 2.46 ns
–1 0.56 6.38 0.04 1.10 0.36 6.26 6.38 2.03 2.10 ns
–2 0.49 5.60 0.03 0.96 0.32 5.49 5.60 1.78 1.84 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-52 Revision 13
1.8 V LVCMOS
Low-voltage CMOS for 1.8 V is an extension of the LVCMOS standard (JESD8-5) used for general-
purpose 1.8 V applications. It uses a 1.8 V input buffer and a push-pull output buffer.
Table 2-66 • Minimum and Maximum DC Input and Output Levels
Applicable to Advanced I/O Banks
1.8 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.,
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 2 2 11 9 10 10
4 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 4 4 22 17 10 10
6 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 6 6 44 35 10 10
8 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 8 8 51 45 10 10
12 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 12 12 74 91 10 10
16 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.9 0.45 VCCI – 0.45 16 16 74 91 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Table 2-67 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard Plus I/O I/O Banks
1.8 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 11 9 10 10
4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 22 17 10 10
6 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 6 6 44 35 10 10
8 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 8 8 44 35 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN <V CCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
ProASIC3 Flash Family FPGAs
Revision 13 2-53
Table 2-68 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard I/O Banks
1.8 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 2 2 9 11 10 10
4 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.45 VCCI – 0.45 4 4 17 22 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Figure 2-8 • AC Loading
Table 2-69 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF)
01.80.935
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Test Point
Test Point
Enable Path
Datapath 35 pF
R = 1 k R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
ProASIC3 DC and Switching Characteristics
2-54 Revision 13
Timing Characteristics
Table 2-70 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 11.86 0.04 1.22 0.43 9.14 11.86 2.77 1.66 11.37 14.10 ns
–1 0.56 10.09 0.04 1.04 0.36 7.77 10.09 2.36 1.41 9.67 11.99 ns
–2 0.49 8.86 0.03 0.91 0.32 6.82 8.86 2.07 1.24 8.49 10.53 ns
4 mA Std. 0.66 6.91 0.04 1.22 0.43 5.86 6.91 3.22 2.84 8.10 9.15 ns
–1 0.56 5.88 0.04 1.04 0.36 4.99 5.88 2.74 2.41 6.89 7.78 ns
–2 0.49 5.16 0.03 0.91 0.32 4.38 5.16 2.41 2.12 6.05 6.83 ns
6 mA Std. 0.66 4.45 0.04 1.22 0.43 4.18 4.45 3.53 3.38 6.42 6.68 ns
–1 0.56 3.78 0.04 1.04 0.36 3.56 3.78 3.00 2.88 5.46 5.69 ns
–2 0.49 3.32 0.03 0.91 0.32 3.12 3.32 2.64 2.53 4.79 4.99 ns
8 mA Std. 0.66 3.92 0.04 1.22 0.43 3.93 3.92 3.60 3.52 6.16 6.16 ns
–1 0.56 3.34 0.04 1.04 0.36 3.34 3.34 3.06 3.00 5.24 5.24 ns
–2 0.49 2.93 0.03 0.91 0.32 2.93 2.93 2.69 2.63 4.60 4.60 ns
12 mA Std. 0.66 3.53 0.04 1.22 0.43 3.60 3.04 3.70 4.08 5.84 5.28 ns
–1 0.56 3.01 0.04 1.04 0.36 3.06 2.59 3.15 3.47 4.96 4.49 ns
–2 0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns
16 mA Std. 0.66 3.53 0.04 1.22 0.43 3.60 3.04 3.70 4.08 5.84 5.28 ns
–1 0.56 3.01 0.04 1.04 0.36 3.06 2.59 3.15 3.47 4.96 4.49 ns
–2 0.49 2.64 0.03 0.91 0.32 2.69 2.27 2.76 3.05 4.36 3.94 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-55
Table 2-71 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 15.53 0.04 1.22 0.43 14.11 15.53 2.78 1.60 16.35 17.77 ns
–1 0.56 13.21 0.04 1.04 0.36 12.01 13.21 2.36 1.36 13.91 15.11 ns
–2 0.49 11.60 0.03 0.91 0.32 10.54 11.60 2.07 1.19 12.21 13.27 ns
4 mA Std. 0.66 10.48 0.04 1.22 0.43 10.41 10.48 3.23 2.73 12.65 12.71 ns
–1 0.56 8.91 0.04 1.04 0.36 8.86 8.91 2.75 2.33 10.76 10.81 ns
–2 0.49 7.82 0.03 0.91 0.32 7.77 7.82 2.41 2.04 9.44 9.49 ns
6 mA Std. 0.66 8.05 0.04 1.22 0.43 8.20 7.84 3.54 3.27 10.43 10.08 ns
–1 0.56 6.85 0.04 1.04 0.36 6.97 6.67 3.01 2.78 8.88 8.57 ns
–2 0.49 6.01 0.03 0.91 0.32 6.12 5.86 2.64 2.44 7.79 7.53 ns
8 mA Std. 0.66 7.50 0.04 1.22 0.43 7.64 7.30 3.61 3.41 9.88 9.53 ns
–1 0.56 6.38 0.04 1.04 0.36 6.50 6.21 3.07 2.90 8.40 8.11 ns
–2 0.49 5.60 0.03 0.91 0.32 5.71 5.45 2.69 2.55 7.38 7.12 ns
12 mA Std. 0.66 7.29 0.04 1.22 0.43 7.23 7.29 3.71 3.95 9.47 9.53 ns
–1 0.56 6.20 0.04 1.04 0.36 6.15 6.20 3.15 3.36 8.06 8.11 ns
–2 0.49 5.45 0.03 0.91 0.32 5.40 5.45 2.77 2.95 7.07 7.12 ns
16 mA Std. 0.66 7.29 0.04 1.22 0.43 7.23 7.29 3.71 3.95 9.47 9.53 ns
–1 0.56 6.20 0.04 1.04 0.36 6.15 6.20 3.15 3.36 8.06 8.11 ns
–2 0.49 5.45 0.03 0.91 0.32 5.40 5.45 2.77 2.95 7.07 7.12 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-56 Revision 13
Table 2-72 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 11.33 0.04 1.20 0.43 8.72 11.33 2.24 1.52 10.96 13.57 ns
–1 0.56 9.64 0.04 1.02 0.36 7.42 9.64 1.91 1.29 9.32 11.54 ns
–2 0.49 8.46 0.03 0.90 0.32 6.51 8.46 1.68 1.14 8.18 10.13 ns
4 mA Std. 0.66 6.48 0.04 1.20 0.43 5.48 6.48 2.65 2.60 7.72 8.72 ns
–1 0.56 5.51 0.04 1.02 0.36 4.66 5.51 2.25 2.21 6.56 7.42 ns
–2 0.49 4.84 0.03 0.90 0.32 4.09 4.84 1.98 1.94 5.76 6.51 ns
6 mA Std. 0.66 4.06 0.04 1.20 0.43 3.84 4.06 2.93 3.10 6.07 6.30 ns
–1 0.56 3.45 0.04 1.02 0.36 3.27 3.45 2.49 2.64 5.17 5.36 ns
–2 0.49 3.03 0.03 0.90 0.32 2.87 3.03 2.19 2.32 4.54 4.70 ns
8 mA Std. 0.66 4.06 0.04 1.20 0.43 3.84 4.06 2.93 3.10 6.07 6.30 ns
–1 0.56 3.45 0.04 1.02 0.36 3.27 3.45 2.49 2.64 5.17 5.36 ns
–2 0.49 3.03 0.03 0.90 0.32 2.87 3.03 2.19 2.32 4.54 4.70 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-57
Table 2-73 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 14.80 0.04 1.20 0.43 13.49 14.80 2.25 1.46 15.73 17.04 ns
–1 0.56 12.59 0.04 1.02 0.36 11.48 12.59 1.91 1.25 13.38 14.49 ns
–2 0.49 11.05 0.03 0.90 0.32 10.08 11.05 1.68 1.09 11.75 12.72 ns
4 mA Std. 0.66 9.90 0.04 1.20 0.43 9.73 9.90 2.65 2.50 11.97 12.13 ns
–1 0.56 8.42 0.04 1.02 0.36 8.28 8.42 2.26 2.12 10.18 10.32 ns
–2 0.49 7.39 0.03 0.90 0.32 7.27 7.39 1.98 1.86 8.94 9.06 ns
6 mA Std. 0.66 7.44 0.04 1.20 0.43 7.58 7.32 2.94 2.99 9.81 9.56 ns
–1 0.56 6.33 0.04 1.02 0.36 6.44 6.23 2.50 2.54 8.35 8.13 ns
–2 0.49 5.55 0.03 0.90 0.32 5.66 5.47 2.19 2.23 7.33 7.14 ns
8 mA Std. 0.66 7.44 0.04 1.20 0.43 7.58 7.32 2.94 2.99 9.81 9.56 ns
–1 0.56 6.33 0.04 1.02 0.36 6.44 6.23 2.50 2.54 8.35 8.13 ns
–2 0.49 5.55 0.03 0.90 0.32 5.66 5.47 2.19 2.23 7.33 7.14 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-74 • 1.8 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.7 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 11.21 0.04 1.20 0.43 8.53 11.21 1.99 1.21 ns
–1 0.56 9.54 0.04 1.02 0.36 7.26 9.54 1.69 1.03 ns
–2 0.49 8.37 0.03 0.90 0.32 6.37 8.37 1.49 0.90 ns
4 mA Std. 0.66 6.34 0.04 1.20 0.43 5.38 6.34 2.41 2.48 ns
–1 0.56 5.40 0.04 1.02 0.36 4.58 5.40 2.05 2.11 ns
–2 0.49 4.74 0.03 0.90 0.32 4.02 4.74 1.80 1.85 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-58 Revision 13
1.5 V LVCMOS (JESD8-11)
Low-Voltage CMOS for 1.5 V is an extension of the LVCMOS standard (JESD8-5) used for general-
purpose 1.5 V applications. It uses a 1.5 V input buffer and a push-pull output buffer.
Table 2-75 • 1.8 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 15.01 0.04 1.20 0.43 13.15 15.01 1.99 1.99 ns
–1 0.56 12.77 0.04 1.02 0.36 11.19 12.77 1.70 1.70 ns
–2 0.49 11.21 0.03 0.90 0.32 9.82 11.21 1.49 1.49 ns
4 mA Std. 0.66 10.10 0.04 1.20 0.43 9.55 10.10 2.41 2.37 ns
–1 0.56 8.59 0.04 1.02 0.36 8.13 8.59 2.05 2.02 ns
–2 0.49 7.54 0.03 0.90 0.32 7.13 7.54 1.80 1.77 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-76 • Minimum and Maximum DC Input and Output Levels
Applicable to Advanced I/O Banks
1.5 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.,
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 2 2 16 13 10 10
4 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 4 4 33 25 10 10
6 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 6 6 39 32 10 10
8 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 8 8 55 66 10 10
12 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 12 12 55 66 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
ProASIC3 Flash Family FPGAs
Revision 13 2-59
Table 2-77 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard Plus I/O Banks
1.5 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 2 2 16 13 10 10
4 mA –0.3 0.35 * VCCI 0.65 * VCCI 1.575 0.25 * VCCI 0.75 * VCCI 4 4 33 25 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Table 2-78 • Minimum and Maximum DC Input and Output Levels
Applicable to Standard I/O Banks
1.5 V
LVCMOS VIL VIH VOL VOH IOL IOH IOSL IOSH IIL1IIH2
Drive
Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max.
V
Min.
VmAmA
Max.
mA3
Max.
mA3µA4µA4
2 mA –0.3 0.35 * VCCI 0.65 * VCCI 3.6 0.25 * VCCI 0.75 * VCCI 2 2 13 16 10 10
Notes:
1. IIL is the input leakage current per I/O pin over recommended operation conditions where –0.3 V < VIN < VIL.
2. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN < VCCI. Input current is
larger when operating outside recommended ranges.
3. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
4. Currents are measured at 85°C junction temperature.
5. Software default selection highlighted in gray.
Figure 2-9 • AC Loading
Table 2-79 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF)
0 1.5 0.75 35
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Test Point
Test Point
Enable Path
Datapath 35 pF
R = 1 k R to VCCI for tLZ / tZL / tZLS
R to GND for tHZ / tZH / tZHS
35 pF for tZH / tZHS / tZL / tZLS
35 pF for tHZ / tLZ
ProASIC3 DC and Switching Characteristics
2-60 Revision 13
Timing Characteristics
Table 2-80 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP t
DIN t
PY t
EOUT t
ZL t
ZH t
LZ t
HZ t
ZLS t
ZHS Units
2 mA Std. 0.66 8.36 0.04 1.44 0.43 6.82 8.36 3.39 2.77 9.06 10.60 ns
–1 0.56 7.11 0.04 1.22 0.36 5.80 7.11 2.88 2.35 7.71 9.02 ns
–2 0.49 6.24 0.03 1.07 0.32 5.10 6.24 2.53 2.06 6.76 7.91 ns
4 mA Std. 0.66 5.31 0.04 1.44 0.43 4.85 5.31 3.74 3.40 7.09 7.55 ns
–1 0.56 4.52 0.04 1.22 0.36 4.13 4.52 3.18 2.89 6.03 6.42 ns
–2 0.49 3.97 0.03 1.07 0.32 3.62 3.97 2.79 2.54 5.29 5.64 ns
6 mA Std. 0.66 4.67 0.04 1.44 0.43 4.55 4.67 3.82 3.56 6.78 6.90 ns
–1 0.56 3.97 0.04 1.22 0.36 3.87 3.97 3.25 3.03 5.77 5.87 ns
–2 0.49 3.49 0.03 1.07 0.32 3.40 3.49 2.85 2.66 5.07 5.16 ns
8 mA Std. 0.66 4.08 0.04 1.44 0.43 4.15 3.58 3.94 4.20 6.39 5.81 ns
–1 0.56 3.47 0.04 1.22 0.36 3.53 3.04 3.36 3.58 5.44 4.95 ns
–2 0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns
12 mA Std. 0.66 4.08 0.04 1.44 0.43 4.15 3.58 3.94 4.20 6.39 5.81 ns
–1 0.56 3.47 0.04 1.22 0.36 3.53 3.04 3.36 3.58 5.44 4.95 ns
–2 0.49 3.05 0.03 1.07 0.32 3.10 2.67 2.95 3.14 4.77 4.34 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-61
Table 2-81 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Advanced I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 12.78 0.04 1.44 0.43 12.81 12.78 3.40 2.64 15.05 15.02 ns
–1 0.56 10.87 0.04 1.22 0.36 10.90 10.87 2.89 2.25 12.80 12.78 ns
–2 0.49 9.55 0.03 1.07 0.32 9.57 9.55 2.54 1.97 11.24 11.22 ns
4 mA Std. 0.66 10.01 0.04 1.44 0.43 10.19 9.55 3.75 3.27 12.43 11.78 ns
–1 0.56 8.51 0.04 1.22 0.36 8.67 8.12 3.19 2.78 10.57 10.02 ns
–2 0.49 7.47 0.03 1.07 0.32 7.61 7.13 2.80 2.44 9.28 8.80 ns
6 mA Std. 0.66 9.33 0.04 1.44 0.43 9.51 8.89 3.83 3.43 11.74 11.13 ns
–1 0.56 7.94 0.04 1.22 0.36 8.09 7.56 3.26 2.92 9.99 9.47 ns
–2 0.49 6.97 0.03 1.07 0.32 7.10 6.64 2.86 2.56 8.77 8.31 ns
8 mA Std. 0.66 8.91 0.04 1.44 0.43 9.07 8.89 3.95 4.05 11.31 11.13 ns
–1 0.56 7.58 0.04 1.22 0.36 7.72 7.57 3.36 3.44 9.62 9.47 ns
–2 0.49 6.65 0.03 1.07 0.32 6.78 6.64 2.95 3.02 8.45 8.31 ns
12 mA Std. 0.66 8.91 0.04 1.44 0.43 9.07 8.89 3.95 4.05 11.31 11.13 ns
–1 0.56 7.58 0.04 1.22 0.36 7.72 7.57 3.36 3.44 9.62 9.47 ns
–2 0.49 6.65 0.03 1.07 0.32 6.78 6.64 2.95 3.02 8.45 8.31 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-62 Revision 13
Table 2-82 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 7.83 0.04 1.42 0.43 6.42 7.83 2.71 2.55 8.65 10.07 ns
–1 0.56 6.66 0.04 1.21 0.36 5.46 6.66 2.31 2.17 7.36 8.56 ns
–2 0.49 5.85 0.03 1.06 0.32 4.79 5.85 2.02 1.90 6.46 7.52 ns
4 mA Std. 0.66 4.84 0.04 1.42 0.43 4.49 4.84 3.03 3.13 6.72 7.08 ns
–1 0.56 4.12 0.04 1.21 0.36 3.82 4.12 2.58 2.66 5.72 6.02 ns
–2 0.49 3.61 0.03 1.06 0.32 3.35 3.61 2.26 2.34 5.02 5.28 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-83 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 1.4 V
Applicable to Standard Plus I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
2 mA Std. 0.66 12.08 0.04 1.42 0.43 12.01 12.08 2.72 2.43 14.24 14.31 ns
–1 0.56 10.27 0.04 1.21 0.36 10.21 10.27 2.31 2.06 12.12 12.18 ns
–2 0.49 9.02 0.03 1.06 0.32 8.97 9.02 2.03 1.81 10.64 10.69 ns
4 mA Std. 0.66 9.28 0.04 1.42 0.43 9.45 8.91 3.04 3.00 11.69 11.15 ns
–1 0.56 7.89 0.04 1.21 0.36 8.04 7.58 2.58 2.55 9.94 9.49 ns
–2 0.49 6.93 0.03 1.06 0.32 7.06 6.66 2.27 2.24 8.73 8.33 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-84 • 1.5 V LVCMOS High Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 7.65 0.04 1.42 0.43 6.31 7.65 2.45 2.45 ns
–1 0.56 6.50 0.04 1.21 0.36 5.37 6.50 2.08 2.08 ns
–2 0.49 5.71 0.03 1.06 0.32 4.71 5.71 1.83 1.83 ns
Notes:
1. Software default selection highlighted in gray.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-63
3.3 V PCI, 3.3 V PCI-X
Peripheral Component Interface for 3.3 V standard specifies support for 33 MHz and 66 MHz PCI Bus
applications.
AC loadings are defined per the PCI/PCI-X specifications for the datapath; Microsemi loadings for enable
path characterization are described in Figure 2-10.
AC loadings are defined per PCI/PCI-X specifications for the datapath; Microsemi loading for tristate is
described in Tab l e 2 - 8 7 .
Table 2-85 • 1.5 V LVCMOS Low Slew
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard I/O Banks
Drive
Strength
Speed
Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ Units
2 mA Std. 0.66 12.33 0.04 1.42 0.43 11.79 12.33 2.45 2.32 ns
–1 0.56 10.49 0.04 1.21 0.36 10.03 10.49 2.08 1.98 ns
–2 0.49 9.21 0.03 1.06 0.32 8.81 9.21 1.83 1.73 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-86 • Minimum and Maximum DC Input and Output Levels
3.3 V PCI/PCI-X VIL VIH VOL VOH IOL IOH IOSL IOSH IIL IIH
Drive Strength
Min.
V
Max.
V
Min.
V
Max.
V
Max,.
V
Min.
VmAmA
Max.
mA1
Max.
mA1µA2µA2
Per PCI specification Per PCI curves 10 10
Notes:
1. Currents are measured at high temperature (100°C junction temperature) and maximum voltage.
2. Currents are measured at 85°C junction temperature.
Figure 2-10 • AC Loading
Test Point
Enable Path
R to VCCI for tLZ / tZL / tZLS
10 pF for tZH / tZHS / tZL / tZLS
5 pF for tHZ / tLZ
R to GND for tHZ / tZH / tZHS
R = 1 k
Test Point
Datapath
R = 25 R to VCCI for tDP (F)
R to GND for tDP (R)
Table 2-87 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V) CLOAD (pF)
0 3.3 0.285 * VCCI for tDP(R)
0.615 * VCCI for tDP(F)
10
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
ProASIC3 DC and Switching Characteristics
2-64 Revision 13
Timing Characteristics
Differential I/O Characteristics
Physical Implementation
Configuration of the I/O modules as a differential pair is handled by Microsemi Designer software when
the user instantiates a differential I/O macro in the design.
Differential I/Os can also be used in conjunction with the embedded Input Register (InReg), Output
Register (OutReg), Enable Register (EnReg), and Double Data Rate (DDR). However, there is no
support for bidirectional I/Os or tristates with the LVPECL standards.
LVDS
Low-Voltage Differential Signaling (ANSI/TIA/EIA-644) is a high-speed, differential I/O standard. It
requires that one data bit be carried through two signal lines, so two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-11. The
building blocks of the LVDS transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVPECL implementation because the output standard
specifications are different.
Along with LVDS I/O, ProASIC3 also supports Bus LVDS structure and Multipoint LVDS (M-LVDS)
configuration (up to 40 nodes).
Table 2-88 • 3.3 V PCI/PCI-X
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Advanced I/O Banks
Speed Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
Std. 0.66 2.68 0.04 0.86 0.43 2.73 1.95 3.21 3.58 4.97 4.19 ns
–1 0.56 2.28 0.04 0.73 0.36 2.32 1.66 2.73 3.05 4.22 3.56 ns
–2 0.49 2.00 0.03 0.65 0.32 2.04 1.46 2.40 2.68 3.71 3.13 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-89 • 3.3 V PCI/PCI-X
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Applicable to Standard Plus I/O Banks
Speed Grade tDOUT tDP tDIN tPY tEOUT tZL tZH tLZ tHZ tZLS tZHS Units
Std. 0.66 2.31 0.04 0.85 0.43 2.35 1.70 2.79 3.22 4.59 3.94 ns
–1 0.56 1.96 0.04 0.72 0.36 2.00 1.45 2.37 2.74 3.90 3.35 ns
–2 0.49 1.72 0.03 0.64 0.32 1.76 1.27 2.08 2.41 3.42 2.94 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Figure 2-11 • LVDS Circuit Diagram and Board-Level Implementation
140 100
Z0 = 50
Z0 = 50
165
165
+
–
P
N
P
N
INBUF_LVDS
OUTBUF_LVDS
FPGA FPGA
Bourns Part Number: CAT16-LV4F12
ProASIC3 Flash Family FPGAs
Revision 13 2-65
Timing Characteristics
Table 2-90 • LVDS Minimum and Maximum DC Input and Output Levels
DC Parameter Description Min. Typ. Max. Units
VCCI Supply Voltage 2.375 2.5 2.625 V
VOL Output Low Voltage 0.9 1.075 1.25 V
VOH Output High Voltage 1.25 1.425 1.6 V
IOL 1 Output Lower Current 0.65 0.91 1.16 mA
IOH 1 Output High Current 0.65 0.91 1.16 mA
VI Input Voltage 0 2.925 V
IIH 2,3 Input High Leakage Current 10 µA
IIL 2,4 Input Low Leakage Current 10 µA
VODIFF Differential Output Voltage 250 350 450 mV
VOCM Output Common Mode Voltage 1.125 1.25 1.375 V
VICM Input Common Mode Voltage 0.05 1.25 2.35 V
VIDIFF Input Differential Voltage 100 350 mV
Notes:
1. IOL/ IOH defined by VODIFF/(Resistor Network)
2. Currents are measured at 85°C junction temperature.
3. IIH is the input leakage current per I/O pin over recommended operating conditions VIH < VIN <VCCI. Input current is
larger when operating outside recommended ranges.
4. IIL is the input leakage current per I/O pin over recommended operation conditions where -0.3 V < VIN <VIL.
Table 2-91 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V)
1.075 1.325 Cross point
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Table 2-92 • LVDS
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 2.3 V
Speed Grade tDOUT tDP tDIN tPY Units
Std. 0.66 1.83 0.04 1.60 ns
–1 0.56 1.56 0.04 1.36 ns
–2 0.49 1.37 0.03 1.20 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-66 Revision 13
B-LVDS/M-LVDS
Bus LVDS (B-LVDS) and Multipoint LVDS (M-LVDS) specifications extend the existing LVDS standard to
high-performance multipoint bus applications. Multidrop and multipoint bus configurations may contain
any combination of drivers, receivers, and transceivers. Microsemi LVDS drivers provide the higher drive
current required by B-LVDS and M-LVDS to accommodate the loading. The drivers require series
terminations for better signal quality and to control voltage swing. Termination is also required at both
ends of the bus since the driver can be located anywhere on the bus. These configurations can be
implemented using the TRIBUF_LVDS and BIBUF_LVDS macros along with appropriate terminations.
Multipoint designs using Microsemi LVDS macros can achieve up to 200 MHz with a maximum of 20
loads. A sample application is given in Figure 2-12. The input and output buffer delays are available in
the LVDS section in Table 2-92.
Example: For a bus consisting of 20 equidistant loads, the following terminations provide the required
differential voltage, in worst-case Industrial operating conditions, at the farthest receiver: RS=60 and
RT=70, given Z0=50 (2") and Zstub =50 (~1.5").
LVPECL
Low-Voltage Positive Emitter-Coupled Logic (LVPECL) is another differential I/O standard. It requires
that one data bit be carried through two signal lines. Like LVDS, two pins are needed. It also requires
external resistor termination.
The full implementation of the LVDS transmitter and receiver is shown in an example in Figure 2-13. The
building blocks of the LVPECL transmitter-receiver are one transmitter macro, one receiver macro, three
board resistors at the transmitter end, and one resistor at the receiver end. The values for the three driver
resistors are different from those used in the LVDS implementation because the output standard
specifications are different.
Figure 2-12 • B-LVDS/M-LVDS Multipoint Application Using LVDS I/O Buffers
...
R
T
R
T
BIBUF_LVDS
R
+
-
T
+
-
R
+
-
T
+
-
D
+
-
EN EN EN EN EN
Receiver Transceiver Receiver TransceiverDriver
R
S
R
S
R
S
R
S
R
S
R
S
R
S
R
S
R
S
R
S
Z
stub
Z
stub
Z
stub
Z
stub
Z
stub
Z
stub
Z
stub
Z
stub
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Z
0
Figure 2-13 • LVPECL Circuit Diagram and Board-Level Implementation
187 W 100
Z0 = 50
Z0 = 50
100
100
+
–
P
N
P
N
INBUF_LVPECL
OUTBUF_LVPECL
FPGA FPGA
Bourns Part Number: CAT16-PC4F12
ProASIC3 Flash Family FPGAs
Revision 13 2-67
Timing Characteristics
Table 2-93 • Minimum and Maximum DC Input and Output Levels
DC Parameter Description Min. Max. Min. Max. Min. Max. Units
VCCI Supply Voltage 3.0 3.3 3.6 V
VOL Output Low Voltage 0.96 1.27 1.06 1.43 1.30 1.57 V
VOH Output High Voltage 1.8 2.11 1.92 2.28 2.13 2.41 V
VIL, VIH Input Low, Input High Voltages 0 3.6 0 3.6 0 3.6 V
VODIFF Differential Output Voltage 0.625 0.97 0.625 0.97 0.625 0.97 V
VOCM Output Common-Mode Voltage 1.762 1.98 1.762 1.98 1.762 1.98 V
VICM Input Common-Mode Voltage 1.01 2.57 1.01 2.57 1.01 2.57 V
VIDIFF Input Differential Voltage 300 300 300 mV
Table 2-94 • AC Waveforms, Measuring Points, and Capacitive Loads
Input Low (V) Input High (V) Measuring Point* (V)
1.64 1.94 Cross point
Note: *Measuring point = Vtrip. See Table 2-22 on page 2-21 for a complete table of trip points.
Table 2-95 • LVPECL
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V, Worst-Case VCCI = 3.0 V
Speed Grade tDOUT tDP tDIN tPY Units
Std. 0.66 1.80 0.04 1.40 ns
–1 0.56 1.53 0.04 1.19 ns
–2 0.49 1.34 0.03 1.05 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-68 Revision 13
I/O Register Specifications
Fully Registered I/O Buffers with Synchronous Enable and
Asynchronous Preset
Figure 2-14 • Timing Model of Registered I/O Buffers with Synchronous Enable and Asynchronous Preset
INBUF
INBUF INBUF
TRIBUF
CLKBUF
INBUF
INBUF
CLKBUF
Data Input I/O Register with:
Active High Enable
Active High Preset
Positive-Edge Triggered
Data Output Register and
Enable Output Register with:
Active High Enable
Active High Preset
Postive-Edge Triggered
Pad Out
CLK
Enable
Preset
Data_out
Data
EOUT
DOUT
Enable
CLK
DQ
DFN1E1P1
PRE
DQ
DFN1E1P1
PRE
DQ
DFN1E1P1
PRE
D_Enable
A
B
C
D
EE
E
EF
G
H
I
J
L
K
Y
Core
Array
ProASIC3 Flash Family FPGAs
Revision 13 2-69
Table 2-96 • Parameter Definition and Measuring Nodes
Parameter Name Parameter Definition
Measuring Nodes
(from, to)*
tOCLKQ Clock-to-Q of the Output Data Register H, DOUT
tOSUD Data Setup Time for the Output Data Register F, H
tOHD Data Hold Time for the Output Data Register F, H
tOSUE Enable Setup Time for the Output Data Register G, H
tOHE Enable Hold Time for the Output Data Register G, H
tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register L, DOUT
tOREMPRE Asynchronous Preset Removal Time for the Output Data Register L, H
tORECPRE Asynchronous Preset Recovery Time for the Output Data Register L, H
tOECLKQ Clock-to-Q of the Output Enable Register H, EOUT
tOESUD Data Setup Time for the Output Enable Register J, H
tOEHD Data Hold Time for the Output Enable Register J, H
tOESUE Enable Setup Time for the Output Enable Register K, H
tOEHE Enable Hold Time for the Output Enable Register K, H
tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register I, EOUT
tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register I, H
tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register I, H
tICLKQ Clock-to-Q of the Input Data Register A, E
tISUD Data Setup Time for the Input Data Register C, A
tIHD Data Hold Time for the Input Data Register C, A
tISUE Enable Setup Time for the Input Data Register B, A
tIHE Enable Hold Time for the Input Data Register B, A
tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register D, E
tIREMPRE Asynchronous Preset Removal Time for the Input Data Register D, A
tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register D, A
Note: *See Figure 2-14 on page 2-68 for more information.
ProASIC3 DC and Switching Characteristics
2-70 Revision 13
Fully Registered I/O Buffers with Synchronous Enable and
Asynchronous Clear
Figure 2-15 • Timing Model of the Registered I/O Buffers with Synchronous Enable and Asynchronous Clear
Enable
CLK
Pad Out
CLK
Enable
CLR
Data_out
Data
Y
AA
EOUT
DOUT
Core
Array
DQ
DFN1E1C1
E
CLR
DQ
DFN1E1C1
E
CLR
DQ
DFN1E1C1
E
CLR
D_Enable
BB
CC
DD
EE
FF
GG
LL
HH
JJ
KK
CLKBUF
INBUF
INBUF
TRIBUF
INBUF INBUF CLKBUF
INBUF
Data Input I/O Register with
Active High Enable
Active High Clear
Positive-Edge Triggered Data Output Register and
Enable Output Register with
Active High Enable
Active High Clear
Positive-Edge Triggered
ProASIC3 Flash Family FPGAs
Revision 13 2-71
Table 2-97 • Parameter Definition and Measuring Nodes
Parameter Name Parameter Definition
Measuring Nodes
(from, to)*
tOCLKQ Clock-to-Q of the Output Data Register HH, DOUT
tOSUD Data Setup Time for the Output Data Register FF, HH
tOHD Data Hold Time for the Output Data Register FF, HH
tOSUE Enable Setup Time for the Output Data Register GG, HH
tOHE Enable Hold Time for the Output Data Register GG, HH
tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register LL, DOUT
tOREMCLR Asynchronous Clear Removal Time for the Output Data Register LL, HH
tORECCLR Asynchronous Clear Recovery Time for the Output Data Register LL, HH
tOECLKQ Clock-to-Q of the Output Enable Register HH, EOUT
tOESUD Data Setup Time for the Output Enable Register JJ, HH
tOEHD Data Hold Time for the Output Enable Register JJ, HH
tOESUE Enable Setup Time for the Output Enable Register KK, HH
tOEHE Enable Hold Time for the Output Enable Register KK, HH
tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register II, EOUT
tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register II, HH
tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register II, HH
tICLKQ Clock-to-Q of the Input Data Register AA, EE
tISUD Data Setup Time for the Input Data Register CC, AA
tIHD Data Hold Time for the Input Data Register CC, AA
tISUE Enable Setup Time for the Input Data Register BB, AA
tIHE Enable Hold Time for the Input Data Register BB, AA
tICLR2Q Asynchronous Clear-to-Q of the Input Data Register DD, EE
tIREMCLR Asynchronous Clear Removal Time for the Input Data Register DD, AA
tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register DD, AA
Note: *See Figure 2-15 on page 2-70 for more information.
ProASIC3 DC and Switching Characteristics
2-72 Revision 13
Input Register
Timing Characteristics
Figure 2-16 • Input Register Timing Diagram
50%
Preset
Clear
Out_1
CLK
Data
Enable
t
ISUE
50%
50%
t
ISUD
t
IHD
50% 50%
t
ICLKQ
10
t
IHE
t
IRECPRE
t
IREMPRE
t
IRECCLR
t
IREMCLR
t
IWCLR
t
IWPRE
t
IPRE2Q
t
ICLR2Q
t
ICKMPWH
t
ICKMPWL
50% 50%
50% 50% 50%
50% 50%
50% 50% 50% 50% 50% 50%
50%
Table 2-98 • Input Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tICLKQ Clock-to-Q of the Input Data Register 0.24 0.27 0.32 ns
tISUD Data Setup Time for the Input Data Register 0.26 0.30 0.35 ns
tIHD Data Hold Time for the Input Data Register 0.00 0.00 0.00 ns
tISUE Enable Setup Time for the Input Data Register 0.37 0.42 0.50 ns
tIHE Enable Hold Time for the Input Data Register 0.00 0.00 0.00 ns
tICLR2Q Asynchronous Clear-to-Q of the Input Data Register 0.45 0.52 0.61 ns
tIPRE2Q Asynchronous Preset-to-Q of the Input Data Register 0.45 0.52 0.61 ns
tIREMCLR Asynchronous Clear Removal Time for the Input Data Register 0.00 0.00 0.00 ns
tIRECCLR Asynchronous Clear Recovery Time for the Input Data Register 0.22 0.25 0.30 ns
tIREMPRE Asynchronous Preset Removal Time for the Input Data Register 0.00 0.00 0.00 ns
tIRECPRE Asynchronous Preset Recovery Time for the Input Data Register 0.22 0.25 0.30 ns
tIWCLR Asynchronous Clear Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 ns
tIWPRE Asynchronous Preset Minimum Pulse Width for the Input Data Register 0.22 0.25 0.30 ns
tICKMPWH Clock Minimum Pulse Width High for the Input Data Register 0.36 0.41 0.48 ns
tICKMPWL Clock Minimum Pulse Width Low for the Input Data Register 0.32 0.37 0.43 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-73
Output Register
Timing Characteristics
Figure 2-17 • Output Register Timing Diagram
Preset
Clear
DOUT
CLK
Data_out
Enable
t
OSUE
50%
50%
t
OSUD
t
OHD
50% 50%
t
OCLKQ
10
t
OHE
t
ORECPRE
t
OREMPRE
t
ORECCLR
t
OREMCLR
t
OWCLR
t
OWPRE
t
OPRE2Q
t
OCLR2Q
t
OCKMPWH
t
OCKMPWL
50% 50%
50% 50% 50%
50% 50%
50% 50% 50% 50% 50% 50%
50%
50%
Table 2-99 • Output Data Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tOCLKQ Clock-to-Q of the Output Data Register 0.59 0.67 0.79 ns
tOSUD Data Setup Time for the Output Data Register 0.31 0.36 0.42 ns
tOHD Data Hold Time for the Output Data Register 0.00 0.00 0.00 ns
tOSUE Enable Setup Time for the Output Data Register 0.44 0.50 0.59 ns
tOHE Enable Hold Time for the Output Data Register 0.00 0.00 0.00 ns
tOCLR2Q Asynchronous Clear-to-Q of the Output Data Register 0.80 0.91 1.07 ns
tOPRE2Q Asynchronous Preset-to-Q of the Output Data Register 0.80 0.91 1.07 ns
tOREMCLR Asynchronous Clear Removal Time for the Output Data Register 0.00 0.00 0.00 ns
tORECCLR Asynchronous Clear Recovery Time for the Output Data Register 0.22 0.25 0.30 ns
tOREMPRE Asynchronous Preset Removal Time for the Output Data Register 0.00 0.00 0.00 ns
tORECPRE Asynchronous Preset Recovery Time for the Output Data Register 0.22 0.25 0.30 ns
tOWCLR Asynchronous Clear Minimum Pulse Width for the Output Data Register 0.22 0.25 0.30 ns
tOWPRE Asynchronous Preset Minimum Pulse Width for the Output Data Register 0.22 0.25 0.30 ns
tOCKMPWH Clock Minimum Pulse Width High for the Output Data Register 0.36 0.41 0.48 ns
tOCKMPWL Clock Minimum Pulse Width Low for the Output Data Register 0.32 0.37 0.43 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-74 Revision 13
Output Enable Register
Figure 2-18 • Output Enable Register Timing Diagram
50%
Preset
Clear
EOUT
CLK
D_Enable
Enable
t
OESUE
50%
50%
t
OESUD
t
OEHD
50% 50%
t
OECLKQ
10
t
OEHE
t
OERECPRE
t
OEREMPRE
t
OERECCLR
t
OEREMCLR
t
OEWCLR
t
OEWPRE
t
OEPRE2Q
t
OECLR2Q
t
OECKMPWH
t
OECKMPWL
50% 50%
50% 50% 50%
50% 50%
50% 50% 50% 50% 50% 50%
50%
ProASIC3 Flash Family FPGAs
Revision 13 2-75
Timing Characteristics
Table 2-100 • Output Enable Register Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tOECLKQ Clock-to-Q of the Output Enable Register 0.59 0.67 0.79 ns
tOESUD Data Setup Time for the Output Enable Register 0.31 0.36 0.42 ns
tOEHD Data Hold Time for the Output Enable Register 0.00 0.00 0.00 ns
tOESUE Enable Setup Time for the Output Enable Register 0.44 0.50 0.58 ns
tOEHE Enable Hold Time for the Output Enable Register 0.00 0.00 0.00 ns
tOECLR2Q Asynchronous Clear-to-Q of the Output Enable Register 0.67 0.76 0.89 ns
tOEPRE2Q Asynchronous Preset-to-Q of the Output Enable Register 0.67 0.76 0.89 ns
tOEREMCLR Asynchronous Clear Removal Time for the Output Enable Register 0.00 0.00 0.00 ns
tOERECCLR Asynchronous Clear Recovery Time for the Output Enable Register 0.22 0.25 0.30 ns
tOEREMPRE Asynchronous Preset Removal Time for the Output Enable Register 0.00 0.00 0.00 ns
tOERECPRE Asynchronous Preset Recovery Time for the Output Enable Register 0.22 0.25 0.30 ns
tOEWCLR Asynchronous Clear Minimum Pulse Width for the Output Enable Register 0.22 0.25 0.30 ns
tOEWPRE Asynchronous Preset Minimum Pulse Width for the Output Enable Register 0.22 0.25 0.30 ns
tOECKMPWH Clock Minimum Pulse Width High for the Output Enable Register 0.36 0.41 0.48 ns
tOECKMPWL Clock Minimum Pulse Width Low for the Output Enable Register 0.32 0.37 0.43 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-76 Revision 13
DDR Module Specifications
Input DDR Module
Figure 2-19 • Input DDR Timing Model
Table 2-101 • Parameter Definitions
Parameter Name Parameter Definition Measuring Nodes (from, to)
tDDRICLKQ1 Clock-to-Out Out_QR B, D
tDDRICLKQ2 Clock-to-Out Out_QF B, E
tDDRISUD Data Setup Time of DDR input A, B
tDDRIHD Data Hold Time of DDR input A, B
tDDRICLR2Q1 Clear-to-Out Out_QR C, D
tDDRICLR2Q2 Clear-to-Out Out_QF C, E
tDDRIREMCLR Clear Removal C, B
tDDRIRECCLR Clear Recovery C, B
Input DDR
Data
CLK
CLKBUF
INBUF
Out_QF
(to core)
FF2
FF1
INBUF
CLR
DDR_IN
E
A
B
C
D
Out_QR
(to core)
ProASIC3 Flash Family FPGAs
Revision 13 2-77
Timing Characteristics
Figure 2-20 • Input DDR Timing Diagram
t
DDRICLR2Q2
t
DDRIREMCLR
t
DDRIRECCLR
t
DDRICLR2Q1
12 3 4 5 6 7 8 9
CLK
Data
CLR
Out_QR
Out_QF
t
DDRICLKQ1
246
357
t
DDRIHD
t
DDRISUD
t
DDRICLKQ2
Table 2-102 • Input DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tDDRICLKQ1 Clock-to-Out Out_QR for Input DDR 0.27 0.31 0.37 ns
tDDRICLKQ2 Clock-to-Out Out_QF for Input DDR 0.39 0.44 0.52 ns
tDDRISUD Data Setup for Input DDR (Fall) 0.25 0.28 0.33 ns
Data Setup for Input DDR (Rise) 0.25 0.28 0.33 ns
tDDRIHD Data Hold for Input DDR (Fall) 0.00 0.00 0.00 ns
Data Hold for Input DDR (Rise) 0.00 0.00 0.00 ns
tDDRICLR2Q1 Asynchronous Clear-to-Out Out_QR for Input DDR 0.46 0.53 0.62 ns
tDDRICLR2Q2 Asynchronous Clear-to-Out Out_QF for Input DDR 0.57 0.65 0.76 ns
tDDRIREMCLR Asynchronous Clear Removal time for Input DDR 0.00 0.00 0.00 ns
tDDRIRECCLR Asynchronous Clear Recovery time for Input DDR 0.22 0.25 0.30 ns
tDDRIWCLR Asynchronous Clear Minimum Pulse Width for Input DDR 0.22 0.25 0.30 ns
tDDRICKMPWH Clock Minimum Pulse Width High for Input DDR 0.36 0.41 0.48 ns
tDDRICKMPWL Clock Minimum Pulse Width Low for Input DDR 0.32 0.37 0.43 ns
FDDRIMAX Maximum Frequency for Input DDR 350 309 263 MHz
Note: For specific junction temperature and voltage-supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-78 Revision 13
Output DDR Module
Figure 2-21 • Output DDR Timing Model
Table 2-103 • Parameter Definitions
Parameter Name Parameter Definition Measuring Nodes (from, to)
tDDROCLKQ Clock-to-Out B, E
tDDROCLR2Q Asynchronous Clear-to-Out C, E
tDDROREMCLR Clear Removal C, B
tDDRORECCLR Clear Recovery C, B
tDDROSUD1 Data Setup Data_F A, B
tDDROSUD2 Data Setup Data_R D, B
tDDROHD1 Data Hold Data_F A, B
tDDROHD2 Data Hold Data_R D, B
Data_F
(from core)
CLK
CLKBUF
Out
FF2
INBUF
CLR
DDR_OUT
Output DDR
FF1
0
1
X
X
X
X
X
X
X
A
B
D
E
C
C
B
OUTBUF
Data_R
(from core)
ProASIC3 Flash Family FPGAs
Revision 13 2-79
Timing Characteristics
Figure 2-22 • Output DDR Timing Diagram
116
1
7
2
8
3
910
45
28 3 9
tDDROREMCLR
tDDROHD1
tDDROREMCLR
tDDROHD2
tDDROSUD2
tDDROCLKQ
tDDRORECCLR
CLK
Data_R
Data_F
CLR
Out
tDDROCLR2Q
7104
Table 2-104 • Output DDR Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tDDROCLKQ Clock-to-Out of DDR for Output DDR 0.70 0.80 0.94 ns
tDDROSUD1 Data_F Data Setup for Output DDR 0.38 0.43 0.51 ns
tDDROSUD2 Data_R Data Setup for Output DDR 0.38 0.43 0.51 ns
tDDROHD1 Data_F Data Hold for Output DDR 0.00 0.00 0.00 ns
tDDROHD2 Data_R Data Hold for Output DDR 0.00 0.00 0.00 ns
tDDROCLR2Q Asynchronous Clear-to-Out for Output DDR 0.80 0.91 1.07 ns
tDDROREMCLR Asynchronous Clear Removal Time for Output DDR 0.00 0.00 0.00 ns
tDDRORECCLR Asynchronous Clear Recovery Time for Output DDR 0.22 0.25 0.30 ns
tDDROWCLR1 Asynchronous Clear Minimum Pulse Width for Output DDR 0.22 0.25 0.30 ns
tDDROCKMPWH Clock Minimum Pulse Width High for the Output DDR 0.36 0.41 0.48 ns
tDDROCKMPWL Clock Minimum Pulse Width Low for the Output DDR 0.32 0.37 0.43 ns
FDDOMAX Maximum Frequency for the Output DDR 350 309 263 MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-80 Revision 13
VersaTile Characteristics
VersaTile Specifications as a Combinatorial Module
The ProASIC3 library offers all combinations of LUT-3 combinatorial functions. In this section, timing
characteristics are presented for a sample of the library. For more details, refer to the Fusion, IGLOO®/e,
and ProASIC3/E Macro Library Guide.
Figure 2-23 • Sample of Combinatorial Cells
MAJ3
A
C
BY
MUX2
B
0
1
A
S
Y
AY
B
B
A
XOR2 Y
NOR2
B
A
Y
B
A
YOR2
INV
A
Y
AND2
B
A
Y
NAND3
B
A
C
XOR3 Y
B
A
C
NAND2
ProASIC3 Flash Family FPGAs
Revision 13 2-81
Figure 2-24 • Timing Model and Waveforms
tPD
A
B
tPD = MAX(tPD(RR), tPD(RF), tPD(FF), tPD(FR))
where edges are applicable for the particular
combinatorial cell
Y
NAND2 or
Any Combinatorial
Logic
tPD
tPD
50%
VCC
VCC
VCC
50%
GND
A, B, C
50% 50%
50%
(RR)
(RF) GND
OUT
OUT
GND
50%
(FF)
(FR)
tPD
tPD
ProASIC3 DC and Switching Characteristics
2-82 Revision 13
Timing Characteristics
VersaTile Specifications as a Sequential Module
The ProASIC3 library offers a wide variety of sequential cells, including flip-flops and latches. Each has a
data input and optional enable, clear, or preset. In this section, timing characteristics are presented for a
representative sample from the library. For more details, refer to the Fusion, IGLOO/e, and ProASIC3/E
Macro Library Guide.
Table 2-105 • Combinatorial Cell Propagation Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Combinatorial Cell Equation Parameter –2 –1 Std. Units
INV Y = !A tPD 0.40 0.46 0.54 ns
AND2 Y = A · B tPD 0.47 0.54 0.63 ns
NAND2 Y = !(A · B) tPD 0.47 0.54 0.63 ns
OR2 Y = A + B tPD 0.49 0.55 0.65 ns
NOR2 Y = !(A + B) tPD 0.49 0.55 0.65 ns
XOR2 Y = A Bt
PD 0.74 0.84 0.99 ns
MAJ3 Y = MAJ(A, B, C) tPD 0.70 0.79 0.93 ns
XOR3 Y = A B Ct
PD 0.87 1.00 1.17 ns
MUX2 Y = A !S + B S tPD 0.51 0.58 0.68 ns
AND3 Y = A · B · C tPD 0.56 0.64 0.75 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Figure 2-25 • Sample of Sequential Cells
DQ
DFN1
Data
CLK
Out
DQ
DFN1C1
Data
CLK
Out
CLR
DQ
DFI1E1P1
Data
CLK
Out
En
PRE
DQ
DFN1E1
Data
CLK
Out
En
ProASIC3 Flash Family FPGAs
Revision 13 2-83
Timing Characteristics
Figure 2-26 • Timing Model and Waveforms
PRE
CLR
Out
CLK
Data
EN
tSUE
50%
50%
tSUD
tHD
50% 50%
tCLKQ
0
tHE
tRECPRE tREMPRE
tRECCLR tREMCLRtWCLR
tWPRE
tPRE2Q tCLR2Q
tCKMPWH tCKMPWL
50% 50%
50% 50% 50%
50% 50%
50% 50% 50% 50% 50% 50%
50%
50%
Table 2-106 • Register Delays
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tCLKQ Clock-to-Q of the Core Register 0.55 0.63 0.74 ns
tSUD Data Setup Time for the Core Register 0.43 0.49 0.57 ns
tHD Data Hold Time for the Core Register 0.00 0.00 0.00 ns
tSUE Enable Setup Time for the Core Register 0.45 0.52 0.61 ns
tHE Enable Hold Time for the Core Register 0.00 0.00 0.00 ns
tCLR2Q Asynchronous Clear-to-Q of the Core Register 0.40 0.45 0.53 ns
tPRE2Q Asynchronous Preset-to-Q of the Core Register 0.40 0.45 0.53 ns
tREMCLR Asynchronous Clear Removal Time for the Core Register 0.00 0.00 0.00 ns
tRECCLR Asynchronous Clear Recovery Time for the Core Register 0.22 0.25 0.30 ns
tREMPRE Asynchronous Preset Removal Time for the Core Register 0.00 0.00 0.00 ns
tRECPRE Asynchronous Preset Recovery Time for the Core Register 0.22 0.25 0.30 ns
tWCLR Asynchronous Clear Minimum Pulse Width for the Core Register 0.22 0.25 0.30 ns
tWPRE Asynchronous Preset Minimum Pulse Width for the Core Register 0.22 0.25 0.30 ns
tCKMPWH Clock Minimum Pulse Width High for the Core Register 0.32 0.37 0.43 ns
tCKMPWL Clock Minimum Pulse Width Low for the Core Register 0.36 0.41 0.48 ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-84 Revision 13
Global Resource Characteristics
A3P250 Clock Tree Topology
Clock delays are device-specific. Figure 2-27 is an example of a global tree used for clock routing. The
global tree presented in Figure 2-27 is driven by a CCC located on the west side of the A3P250 device. It
is used to drive all D-flip-flops in the device.
Global Tree Timing Characteristics
Global clock delays include the central rib delay, the spine delay, and the row delay. Delays do not
include I/O input buffer clock delays, as these are I/O standard–dependent, and the clock may be driven
and conditioned internally by the CCC module. For more details on clock conditioning capabilities, refer
to the "Clock Conditioning Circuits" section on page 2-89. Table 2-108 to Table 2-114 on page 2-88
present minimum and maximum global clock delays within each device. Minimum and maximum delays
are measured with minimum and maximum loading.
Figure 2-27 • Example of Global Tree Use in an A3P250 Device for Clock Routing
Central
Global Rib
VersaTile
Rows
Global Spine
CCC
ProASIC3 Flash Family FPGAs
Revision 13 2-85
Timing Characteristics
Table 2-107 • A3P015 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2 Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.66 0.81 0.75 0.92 0.88 1.08 ns
tRCKH Input High Delay for Global Clock 0.67 0.84 0.76 0.96 0.89 1.13 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.18 0.21 0.25 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage-supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-108 • A3P030 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.67 0.81 0.76 0.92 0.89 1.09 ns
tRCKH Input High Delay for Global Clock 0.68 0.85 0.77 0.97 0.91 1.14 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.18 0.21 0.24 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-86 Revision 13
Table 2-109 • A3P060 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.710.930.811.050.951.24 ns
tRCKH Input High Delay for Global Clock 0.700.960.801.090.941.28 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-110 • A3P125 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.770.990.871.121.031.32 ns
tRCKH Input High Delay for Global Clock 0.761.020.871.161.021.37 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-87
Table 2-111 • A3P250 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.80 1.01 0.91 1.15 1.07 1.36 ns
tRCKH Input High Delay for Global Clock 0.78 1.04 0.89 1.18 1.04 1.39 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-112 • A3P400 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.871.090.991.241.171.46 ns
tRCKH Input High Delay for Global Clock 0.86 1.11 0.98 1.27 1.15 1.49 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-88 Revision 13
Table 2-113 • A3P600 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.87 1.09 0.99 1.24 1.17 1.46 ns
tRCKH Input High Delay for Global Clock 0.86 1.11 0.98 1.27 1.15 1.49 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.34 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
Table 2-114 • A3P1000 Global Resource
Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description
–2 –1 Std.
UnitsMin.1Max.2Min.1Max.2Min.1Max.2
tRCKL Input Low Delay for Global Clock 0.94 1.16 1.07 1.32 1.26 1.55 ns
tRCKH Input High Delay for Global Clock 0.93 1.19 1.06 1.35 1.24 1.59 ns
tRCKMPWH Minimum Pulse Width High for Global Clock 0.75 0.85 1.00 ns
tRCKMPWL Minimum Pulse Width Low for Global Clock 0.85 0.96 1.13 ns
tRCKSW Maximum Skew for Global Clock 0.26 0.29 0.35 ns
Notes:
1. Value reflects minimum load. The delay is measured from the CCC output to the clock pin of a sequential element,
located in a lightly loaded row (single element is connected to the global net).
2. Value reflects maximum load. The delay is measured on the clock pin of the farthest sequential element, located in a fully
loaded row (all available flip-flops are connected to the global net in the row).
3. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-89
Clock Conditioning Circuits
CCC Electrical Specifications
Timing Characteristics
Table 2-115 • ProASIC3 CCC/PLL Specification
Parameter Minimum Typical Maximum Units
Clock Conditioning Circuitry Input Frequency fIN_CCC 1.5 350 MHz
Clock Conditioning Circuitry Output Frequency fOUT_CCC 0.75 350 MHz
Serial Clock (SCLK) for Dynamic PLL1125 MHz
Delay Increments in Programmable Delay Blocks2, 3 2004ps
Number of Programmable Values in Each Programmable
Delay Block
32
Input Period Jitter 1.5 ns
CCC Output Peak-to-Peak Period Jitter FCCC_OUT Max Peak-to-Peak Period Jitter
1 Global
Network
Used
3 Global
Networks
Used
0.75 MHz to 24 MHz 0.50% 0.70%
24 MHz to 100 MHz 1.00% 1.20%
100 MHz to 250 MHz 1.75% 2.00%
250 MHz to 350 MHz 2.50% 5.60%
Acquisition Time
(A3P250 and A3P1000 only) LockControl = 0 300 µs
LockControl = 1 300 µs
(all other dies) LockControl = 0 300 µs
LockControl = 1 6.0 ms
Tracking Jitter 5
(A3P250 and A3P1000 only) LockControl = 0 1.6 ns
LockControl = 1 1.6 ns
(all other dies) LockControl = 0 1.6 ns
LockControl = 1 0.8 ns
Output Duty Cycle 48.5 51.5 %
Delay Range in Block: Programmable Delay 12, 3 0.6 5.56 ns
Delay Range in Block: Programmable Delay 22, 3 0.225 5.56 ns
Delay Range in Block: Fixed Delay2, 3 2.2 ns
Notes:
1. Maximum value obtained for a –2 speed-grade device in worst-case commercial conditions. For specific junction
temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
2. This delay is a function of voltage and temperature. See Table 2-6 on page 2-6 for deratings.
3. TJ = 25°C, VCC = 1.5 V
4. When the CCC/PLL core is generated by Microsemi core generator software, not all delay values of the specified delay
increments are available. Refer to the Libero SoC Online Help for more information.
5. Tracking jitter is defined as the variation in clock edge position of PLL outputs with reference to the PLL input clock
edge. Tracking jitter does not measure the variation in PLL output period, which is covered by the period jitter
parameter.
6. The A3P030 device does not contain a PLL.
ProASIC3 DC and Switching Characteristics
2-90 Revision 13
Note: Peak-to-peak jitter measurements are defined by Tpeak-to-peak = Tperiod_max – Tperiod_min.
Figure 2-28 • Peak-to-Peak Jitter Definition
T
period_max
T
period_min
Output Signal
ProASIC3 Flash Family FPGAs
Revision 13 2-91
Embedded SRAM and FIFO Characteristics
SRAM
Figure 2-29 • RAM Models
ADDRA11 DOUTA8
DOUTA7
DOUTA0
DOUTB8
DOUTB7
DOUTB0
ADDRA10
ADDRA0
DINA8
DINA7
DINA0
WIDTHA1
WIDTHA0
PIPEA
WMODEA
BLKA
WENA
CLKA
ADDRB11
ADDRB10
ADDRB0
DINB8
DINB7
DINB0
WIDTHB1
WIDTHB0
PIPEB
WMODEB
BLKB
WENB
CLKB
RAM4K9
RADDR8 RD17
RADDR7 RD16
RADDR0 RD0
WD17
WD16
WD0
WW1
WW0
RW1
RW0
PIPE
REN
RCLK
RAM512X18
WADDR8
WADDR7
WADDR0
WEN
WCLK
RESET
RESET
ProASIC3 DC and Switching Characteristics
2-92 Revision 13
Timing Waveforms
Figure 2-30 • RAM Read for Pass-Through Output. Applicable to Both RAM4K9 and RAM512x18.
Figure 2-31 • RAM Read for Pipelined Output. Applicable to Both RAM4K9 and RAM512x18.
CLK
[R|W]ADDR
BLK
WEN
DOUT|RD
A0A1A2
D
0
D
1
D
2
t
CYC
t
CKH
t
CKL
t
AS
tAH
t
BKS
t
ENS
t
ENH
t
DOH1
t
BKH
D
n
t
CKQ1
CLK
[R|W]ADDR
BLK
WEN
DOUT|RD
A0A1A2
D0D1
tCYC
tCKH tCKL
tAS tAH
tBKS
tENS tENH
tDOH2
tCKQ2
tBKH
Dn
ProASIC3 Flash Family FPGAs
Revision 13 2-93
Figure 2-32 • RAM Write, Output Retained. Applicable to Both RAM4K9 and RAM512x18.
Figure 2-33 • RAM Write, Output as Write Data (WMODE = 1). Applicable to RAM4K9 Only.
tCYC
tCKH tCKL
A0A1A2
DI0DI1
tAS tAH
tBKS
tENS tENH
tDS tDH
CLK
BLK
WEN
[R|W]ADDR
DIN|RD
Dn
DOUT|RD
tBKH
D2
tCYC
tCKH tCKL
A0A1A2
DI0DI1
tAS tAH
tBKS
tENS
tDS tDH
CLK
BLK
WEN
ADDR
DIN
tBKH
DOUT
(pass-through) DI1
DnDI0
DOUT
(pipelined) DI0DI1
Dn
DI2
ProASIC3 DC and Switching Characteristics
2-94 Revision 13
Timing Characteristics
Figure 2-34 • RAM Reset. Applicable to Both RAM4K9 and RAM512x18.
CLK
RESET
DOUT|RD Dn
tCYC
tCKH tCKL
tRSTBQ
Dm
Table 2-116 • RAM4K9
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tAS Address setup time 0.25 0.28 0.33 ns
tAH Address hold time 0.00 0.00 0.00 ns
tENS REN, WEN setup time 0.14 0.16 0.19 ns
tENH REN, WEN hold time 0.10 0.11 0.13 ns
tBKS BLK setup time 0.23 0.27 0.31 ns
tBKH BLK hold time 0.02 0.02 0.02 ns
tDS Input data (DIN) setup time 0.18 0.21 0.25 ns
tDH Input data (DIN) hold time 0.00 0.00 0.00 ns
tCKQ1 Clock High to new data valid on DOUT (output retained, WMODE = 0) 2.36 2.68 3.15 ns
Clock High to new data valid on DOUT (flow-through, WMODE = 1) 1.79 2.03 2.39 ns
tCKQ2 Clock High to new data valid on DOUT (pipelined) 0.89 1.02 1.20 ns
tC2CWWL1Address collision clk-to-clk delay for reliable write after write on same
address—Applicable to Closing Edge
0.33 0.28 0.25 ns
tC2CWWH1Address collision clk-to-clk delay for reliable write after write on same
address—Applicable to Rising Edge
0.30 0.26 0.23 ns
tC2CRWH1Address collision clk-to-clk delay for reliable read access after write on same
address—Applicable to Opening Edge
0.45 0.38 0.34 ns
tC2CWRH1Address collision clk-to-clk delay for reliable write access after read on same
address— Applicable to Opening Edge
0.49 0.42 0.37 ns
tRSTBQ RESET Low to data out Low on DOUT (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on DOUT (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET removal 0.29 0.33 0.38 ns
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
Based cSoCs and FPGAs.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-95
tRECRSTB RESET recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET minimum pulse width 0.21 0.24 0.29 ns
tCYC Clock cycle time 3.23 3.68 4.32 ns
FMAX Maximum frequency 310 272 231 MHz
Table 2-116 • RAM4K9
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V (continued)
Parameter Description –2 –1 Std. Units
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
Based cSoCs and FPGAs.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-96 Revision 13
Table 2-117 • RAM512X18
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tAS Address setup time 0.25 0.28 0.33 ns
tAH Address hold time 0.00 0.00 0.00 ns
tENS REN, WEN setup time 0.13 0.15 0.17 ns
tENH REN, WEN hold time 0.10 0.11 0.13 ns
tDS Input data (WD) setup time 0.18 0.21 0.25 ns
tDH Input data (WD) hold time 0.00 0.00 0.00 ns
tCKQ1 Clock High to new data valid on RD (output retained) 2.16 2.46 2.89 ns
tCKQ2 Clock High to new data valid on RD (pipelined) 0.90 1.02 1.20 ns
tC2CRWH1Address collision clk-to-clk delay for reliable read access after write on same
address—Applicable to Opening Edge
0.50 0.43 0.38 ns
tC2CWRH1Address collision clk-to-clk delay for reliable write access after read on same
address—Applicable to Opening Edge
0.59 0.50 0.44 ns
tRSTBQ RESET Low to data out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to data out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET removal 0.29 0.33 0.38 ns
tRECRSTB RESET recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET minimum pulse width 0.21 0.24 0.29 ns
tCYC Clock cycle time 3.23 3.68 4.32 ns
FMAX Maximum frequency 310 272 231 MHz
Notes:
1. For more information, refer to the application note Simultaneous Read-Write Operations in Dual-Port SRAM for Flash-
Based cSoCs and FPGAs.
2. For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 Flash Family FPGAs
Revision 13 2-97
FIFO
Figure 2-35 • FIFO Model
FIFO4K18
RW2
RD17
RW1
RD16
RW0
WW2
WW1
WW0 RD0
ESTOP
FSTOP
FULL
AFULL
EMPTY
AFVAL11
AEMPTY
AFVAL10
AFVAL0
AEVAL11
AEVAL10
AEVAL0
REN
RBLK
RCLK
WEN
WBLK
WCLK
RPIPE
WD17
WD16
WD0
RESET
ProASIC3 DC and Switching Characteristics
2-98 Revision 13
Timing Waveforms
Figure 2-36 • FIFO Read
Figure 2-37 • FIFO Write
t
ENS
t
ENH
t
CKQ1
t
CKQ2
t
CYC
D
0
D
1
D
n
D
n
D
0
D
2
D
1
t
BKS
t
BKH
RCLK
RBLK
REN
RD
(flow-through)
RD
(pipelined)
WCLK
WEN
WD
t
ENS
t
ENH
t
DS
t
DH
t
CYC
DI
0
DI
1
t
BKH
t
BKS
WBLK
ProASIC3 Flash Family FPGAs
Revision 13 2-99
Figure 2-38 • FIFO Reset
Figure 2-39 • FIFO EMPTY Flag and AEMPTY Flag Assertion
MATCH (A0)
tMPWRSTB
tRSTFG
tRSTCK
tRSTAF
RCLK/
WCLK
RESET
EMPTY
AEMPTY
WA/RA
(Address Counter)
tRSTFG
tRSTAF
FULL
AFULL
RCLK
NO MATCH NO MATCH Dist = AEF_TH MATCH (EMPTY)
t
CKAF
t
RCKEF
EMPTY
AEMPTY
t
CYC
WA/RA
(Address Counter)
ProASIC3 DC and Switching Characteristics
2-100 Revision 13
Figure 2-40 • FIFO FULL Flag and AFULL Flag Assertion
Figure 2-41 • FIFO EMPTY Flag and AEMPTY Flag Deassertion
Figure 2-42 • FIFO FULL Flag and AFULL Flag Deassertion
NO MATCH NO MATCH Dist = AFF_TH MATCH (FULL)
tCKAF
tWCKFF
tCYC
WCLK
FULL
AFULL
WA/RA
(Address Counter)
WCLK
WA/RA
(Address Counter) MATCH
(EMPTY) NO MATCH NO MATCH NO MATCH Dist = AEF_TH + 1
NO MATCH
RCLK
EMPTY
1st Rising
Edge
After 1st
Write
2nd Rising
Edge
After 1st
Write
t
RCKEF
t
CKAF
AEMPTY
Dist = AFF_TH – 1
MATCH (FULL) NO MATCH NO MATCH NO MATCH NO MATCH
tWCKF
tCKAF
1st Rising
Edge
After 1st
Read
1st Rising
Edge
After 2nd
Read
RCLK
WA/RA
(Address Counter)
WCLK
FULL
AFULL
ProASIC3 Flash Family FPGAs
Revision 13 2-101
Timing Characteristics
Table 2-118 • FIFO (for all dies except A3P250)
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 1.34 1.52 1.79 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.17 2.47 2.90 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.94 1.07 1.26 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency for FIFO 310 272 231 MHz
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for derating values.
ProASIC3 DC and Switching Characteristics
2-102 Revision 13
Table 2-119 • FIFO (for A3P250 only, aspect-ratio-dependent)
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 3.26 3.71 4.36 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.17 2.47 2.90 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.94 1.07 1.26 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency for FIFO 310 272 231 MHz
ProASIC3 Flash Family FPGAs
Revision 13 2-103
Table 2-120 • A3P250 FIFO 512×8
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 3.75 4.27 5.02 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.17 2.47 2.90 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.94 1.07 1.26 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency for FIFO 310 272 231 MHz
ProASIC3 DC and Switching Characteristics
2-104 Revision 13
Table 2-121 • A3P250 FIFO 1k×4
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 4.05 4.61 5.42 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.36 2.68 3.15 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.89 1.02 1.20 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency for FIFO 310 272 231 MHz
ProASIC3 Flash Family FPGAs
Revision 13 2-105
Table 2-122 • A3P250 FIFO 2k×2
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 4.39 5.00 5.88 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.36 2.68 3.15 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.89 1.02 1.20 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on RD (flow-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on RD (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency for FIFO 310 272 231 MHz
ProASIC3 DC and Switching Characteristics
2-106 Revision 13
Table 2-123 • A3P250 FIFO 4k×1
Worst Commercial-Case Conditions: TJ = 70°C, VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tENS REN, WEN Setup Time 4.86 5.53 6.50 ns
tENH REN, WEN Hold Time 0.00 0.00 0.00 ns
tBKS BLK Setup Time 0.19 0.22 0.26 ns
tBKH BLK Hold Time 0.00 0.00 0.00 ns
tDS Input Data (WD) Setup Time 0.18 0.21 0.25 ns
tDH Input Data (WD) Hold Time 0.00 0.00 0.00 ns
tCKQ1 Clock High to New Data Valid on RD (flow-through) 2.36 2.68 3.15 ns
tCKQ2 Clock High to New Data Valid on RD (pipelined) 0.89 1.02 1.20 ns
tRCKEF RCLK High to Empty Flag Valid 1.72 1.96 2.30 ns
tWCKFF WCLK High to Full Flag Valid 1.63 1.86 2.18 ns
tCKAF Clock High to Almost Empty/Full Flag Valid 6.19 7.05 8.29 ns
tRSTFG RESET Low to Empty/Full Flag Valid 1.69 1.93 2.27 ns
tRSTAF RESET Low to Almost Empty/Full Flag Valid 6.13 6.98 8.20 ns
tRSTBQ RESET Low to Data Out Low on DO (pass-through) 0.92 1.05 1.23 ns
RESET Low to Data Out Low on DO (pipelined) 0.92 1.05 1.23 ns
tREMRSTB RESET Removal 0.29 0.33 0.38 ns
tRECRSTB RESET Recovery 1.50 1.71 2.01 ns
tMPWRSTB RESET Minimum Pulse Width 0.21 0.24 0.29 ns
tCYC Clock Cycle Time 3.23 3.68 4.32 ns
FMAX Maximum Frequency 310 272 231 MHz
ProASIC3 Flash Family FPGAs
Revision 13 2-107
Embedded FlashROM Characteristics
Timing Characteristics
Figure 2-43 • Timing Diagram
A
0
A
1
t
SU
t
HOLD
t
SU
t
HOLD
t
SU
t
HOLD
t
CKQ2
t
CKQ2
t
CKQ2
CLK
Address
Data D
0
D
0
D
1
Table 2-124 • Embedded FlashROM Access Time
Parameter Description –2 –1 Std. Units
tSU Address Setup Time 0.53 0.61 0.71 ns
tHOLD Address Hold Time 0.00 0.00 0.00 ns
tCK2Q Clock to Out 21.42 24.40 28.68 ns
FMAX Maximum Clock Frequency 15 15 15 MHz
ProASIC3 DC and Switching Characteristics
2-108 Revision 13
JTAG 1532 Characteristics
JTAG timing delays do not include JTAG I/Os. To obtain complete JTAG timing, add I/O buffer delays to
the corresponding standard selected; refer to the I/O timing characteristics in the "User I/O
Characteristics" section on page 2-14 for more details.
Timing Characteristics
Table 2-125 • JTAG 1532
Commercial-Case Conditions: TJ = 70°C, Worst-Case VCC = 1.425 V
Parameter Description –2 –1 Std. Units
tDISU Test Data Input Setup Time 0.50 0.57 0.67 ns
tDIHD Test Data Input Hold Time 1.00 1.13 1.33 ns
tTMSSU Test Mode Select Setup Time 0.50 0.57 0.67 ns
tTMDHD Test Mode Select Hold Time 1.00 1.13 1.33 ns
tTCK2Q Clock to Q (data out) 6.00 6.80 8.00 ns
tRSTB2Q Reset to Q (data out) 20.00 22.67 26.67 ns
FTCKMAX TCK Maximum Frequency 25.00 22.00 19.00 MHz
tTRSTREM ResetB Removal Time 0.00 0.00 0.00 ns
tTRSTREC ResetB Recovery Time 0.20 0.23 0.27 ns
tTRSTMPW ResetB Minimum Pulse TBD TBD TBD ns
Note: For specific junction temperature and voltage supply levels, refer to Table 2-6 on page 2-6 for
derating values.
Revision 13 3-1
3 – Pin Descriptions
Supply Pins
GND Ground
Ground supply voltage to the core, I/O outputs, and I/O logic.
GNDQ Ground (quiet)
Quiet ground supply voltage to input buffers of I/O banks. Within the package, the GNDQ plane is
decoupled from the simultaneous switching noise originated from the output buffer ground domain. This
minimizes the noise transfer within the package and improves input signal integrity. GNDQ must always
be connected to GND on the board.
VCC Core Supply Voltage
Supply voltage to the FPGA core, nominally 1.5 V. VCC is required for powering the JTAG state machine
in addition to VJTAG. Even when a device is in bypass mode in a JTAG chain of interconnected devices,
both VCC and VJTAG must remain powered to allow JTAG signals to pass through the device.
VCCIBx I/O Supply Voltage
Supply voltage to the bank's I/O output buffers and I/O logic. Bx is the I/O bank number. There are up to
eight I/O banks on low power flash devices plus a dedicated VJTAG bank. Each bank can have a
separate VCCI connection. All I/Os in a bank will run off the same VCCIBx supply. VCCI can be 1.5 V,
1.8 V, 2.5 V, or 3.3 V, nominal voltage. Unused I/O banks should have their corresponding VCCI pins tied
to GND.
VMVx I/O Supply Voltage (quiet)
Quiet supply voltage to the input buffers of each I/O bank. x is the bank number. Within the package, the
VMV plane biases the input stage of the I/Os in the I/O banks. This minimizes the noise transfer within
the package and improves input signal integrity. Each bank must have at least one VMV connection, and
no VMV should be left unconnected. All I/Os in a bank run off the same VMVx supply. VMV is used to
provide a quiet supply voltage to the input buffers of each I/O bank. VMVx can be 1.5 V, 1.8 V, 2.5 V, or
3.3 V, nominal voltage. Unused I/O banks should have their corresponding VMV pins tied to GND. VMV
and VCCI should be at the same voltage within a given I/O bank. Used VMV pins must be connected to
the corresponding VCCI pins of the same bank (i.e., VMV0 to VCCIB0, VMV1 to VCCIB1, etc.).
VCCPLA/B/C/D/E/F PLL Supply Voltage
Supply voltage to analog PLL, nominally 1.5 V.
When the PLLs are not used, the Designer place-and-route tool automatically disables the unused PLLs
to lower power consumption. The user should tie unused VCCPLx and VCOMPLx pins to ground.
Microsemi recommends tying VCCPLx to VCC and using proper filtering circuits to decouple VCC noise
from the PLLs. Refer to the PLL Power Supply Decoupling section of the "Clock Conditioning Circuits in
IGLOO and ProASIC3 Devices" chapter of the ProASIC3 FPGA Fabric User’s Guide for a complete
board solution for the PLL analog power supply and ground.
There is one VCCPLF pin on ProASIC3 devices.
VCOMPLA/B/C/D/E/F PLL Ground
Ground to analog PLL power supplies. When the PLLs are not used, the Designer place-and-route tool
automatically disables the unused PLLs to lower power consumption. The user should tie unused
VCCPLx and VCOMPLx pins to ground.
There is one VCOMPLF pin on ProASIC3 devices.
VJTAG JTAG Supply Voltage
Low power flash devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run
at any voltage from 1.5 V to 3.3 V (nominal). Isolating the JTAG power supply in a separate I/O bank
gives greater flexibility in supply selection and simplifies power supply and PCB design. If the JTAG
interface is neither used nor planned for use, the VJTAG pin together with the TRST pin could be tied to
GND. It should be noted that VCC is required to be powered for JTAG operation; VJTAG alone is
Pin Descriptions
3-2 Revision 13
insufficient. If a device is in a JTAG chain of interconnected boards, the board containing the device can
be powered down, provided both VJTAG and VCC to the part remain powered; otherwise, JTAG signals
will not be able to transition the device, even in bypass mode.
Microsemi recommends that VPUMP and VJTAG power supplies be kept separate with independent
filtering capacitors rather than supplying them from a common rail.
VPUMP Programming Supply Voltage
ProASIC3 devices support single-voltage ISP of the configuration flash and FlashROM. For
programming, VPUMP should be 3.3 V nominal. During normal device operation, VPUMP can be left
floating or can be tied (pulled up) to any voltage between 0 V and the VPUMP maximum. Programming
power supply voltage (VPUMP) range is listed in Table 2-2 on page 2-2.
When the VPUMP pin is tied to ground, it will shut off the charge pump circuitry, resulting in no sources of
oscillation from the charge pump circuitry.
For proper programming, 0.01 µF and 0.33 µF capacitors (both rated at 16 V) are to be connected in
parallel across VPUMP and GND, and positioned as close to the FPGA pins as possible.
Microsemi recommends that VPUMP and VJTAG power supplies be kept separate with independent
filtering capacitors rather than supplying them from a common rail.
User Pins
I/O User Input/Output
The I/O pin functions as an input, output, tristate, or bidirectional buffer. Input and output signal levels are
compatible with the I/O standard selected.
During programming, I/Os become tristated and weakly pulled up to VCCI. With VCCI, VMV, and VCC
supplies continuously powered up, when the device transitions from programming to operating mode, the
I/Os are instantly configured to the desired user configuration.
Unused I/Os are configured as follows:
• Output buffer is disabled (with tristate value of high impedance)
• Input buffer is disabled (with tristate value of high impedance)
• Weak pull-up is programmed
GL Globals
GL I/Os have access to certain clock conditioning circuitry (and the PLL) and/or have direct access to the
global network (spines). Additionally, the global I/Os can be used as regular I/Os, since they have
identical capabilities. Unused GL pins are configured as inputs with pull-up resistors.
See more detailed descriptions of global I/O connectivity in the "Clock Conditioning Circuits in IGLOO
and ProASIC3 Devices" chapter of the ProASIC3 FPGA Fabric User’s Guide. All inputs labeled GC/GF
are direct inputs into the quadrant clocks. For example, if GAA0 is used for an input, GAA1 and GAA2
are no longer available for input to the quadrant globals. All inputs labeled GC/GF are direct inputs into
the chip-level globals, and the rest are connected to the quadrant globals. The inputs to the global
network are multiplexed, and only one input can be used as a global input.
Refer to the I/O Structure section of the handbook for the device you are using for an explanation of the
naming of global pins.
FF Flash*Freeze Mode Activation Pin
Flash*Freeze is available on IGLOO, ProASIC3L, and RT ProASIC3 devices. It is not supported on
ProASIC3/E devices. The FF pin is a dedicated input pin used to enter and exit Flash*Freeze mode. The
FF pin is active-low, has the same characteristics as a single-ended I/O, and must meet the maximum
rise and fall times. When Flash*Freeze mode is not used in the design, the FF pin is available as a
regular I/O. For IGLOOe, ProASIC3EL, and RT ProASIC3 only, the FF pin can be configured as a
Schmitt trigger input.
When Flash*Freeze mode is used, the FF pin must not be left floating to avoid accidentally entering
Flash*Freeze mode. While in Flash*Freeze mode, the Flash*Freeze pin should be constantly asserted.
The Flash*Freeze pin can be used with any single-ended I/O standard supported by the I/O bank in
which the pin is located, and input signal levels compatible with the I/O standard selected. The FF pin
ProASIC3 Flash Family FPGAs
Revision 13 3-3
should be treated as a sensitive asynchronous signal. When defining pin placement and board layout,
simultaneously switching outputs (SSOs) and their effects on sensitive asynchronous pins must be
considered.
Unused FF or I/O pins are tristated with weak pull-up. This default configuration applies to both
Flash*Freeze mode and normal operation mode. No user intervention is required.
JTAG Pins
Low power flash devices have a separate bank for the dedicated JTAG pins. The JTAG pins can be run
at any voltage from 1.5 V to 3.3 V (nominal). VCC must also be powered for the JTAG state machine to
operate, even if the device is in bypass mode; VJTAG alone is insufficient. Both VJTAG and VCC to the
part must be supplied to allow JTAG signals to transition the device. Isolating the JTAG power supply in a
separate I/O bank gives greater flexibility in supply selection and simplifies power supply and PCB
design. If the JTAG interface is neither used nor planned for use, the VJTAG pin together with the TRST
pin could be tied to GND.
TCK Test Clock
Test clock input for JTAG boundary scan, ISP, and UJTAG. The TCK pin does not have an internal pull-
up/-down resistor. If JTAG is not used, Microsemi recommends tying off TCK to GND through a resistor
placed close to the FPGA pin. This prevents JTAG operation in case TMS enters an undesired state.
Note that to operate at all VJTAG voltages, 500 to 1 k will satisfy the requirements. Refer to Tab l e 1
for more information.
TDI Test Data Input
Serial input for JTAG boundary scan, ISP, and UJTAG usage. There is an internal weak pull-up resistor
on the TDI pin.
TDO Test Data Output
Serial output for JTAG boundary scan, ISP, and UJTAG usage.
TMS Test Mode Select
The TMS pin controls the use of the IEEE 1532 boundary scan pins (TCK, TDI, TDO, TRST). There is an
internal weak pull-up resistor on the TMS pin.
TRST Boundary Scan Reset Pin
The TRST pin functions as an active low input to asynchronously initialize (or reset) the boundary scan
circuitry. There is an internal weak pull-up resistor on the TRST pin. If JTAG is not used, an external pull-
down resistor could be included to ensure the test access port (TAP) is held in reset mode. The resistor
values must be chosen from Table 1 and must satisfy the parallel resistance value requirement. The
values in Tab l e 1 correspond to the resistor recommended when a single device is used, and the
equivalent parallel resistor when multiple devices are connected via a JTAG chain.
In critical applications, an upset in the JTAG circuit could allow entrance to an undesired JTAG state. In
such cases, Microsemi recommends tying off TRST to GND through a resistor placed close to the FPGA
pin.
Note that to operate at all VJTAG voltages, 500 to 1 k will satisfy the requirements.
Table 1 • Recommended Tie-Off Values for the TCK and TRST Pins
VJTAG Tie-Off Resistance
VJTAG at 3.3 V 200 to 1 k
VJTAG at 2.5 V 200 to 1 k
VJTAG at 1.8 V 500 to 1 k
VJTAG at 1.5 V 500 to 1 k
Notes:
1. Equivalent parallel resistance if more than one device is on the JTAG chain
2. The TCK pin can be pulled up/down.
3. The TRST pin is pulled down.
Pin Descriptions
3-4 Revision 13
Special Function Pins
NC No Connect
This pin is not connected to circuitry within the device. These pins can be driven to any voltage or can be
left floating with no effect on the operation of the device.
DC Do Not Connect
This pin should not be connected to any signals on the PCB. These pins should be left unconnected.
Related Documents
User’s Guides
ProASIC FPGA Fabric User’s Guide
http://www.microsemi.com/soc/documents/PA3_UG.pdf
Packaging
The following documents provide packaging information and device selection for low power flash
devices.
Product Catalog
http://www.microsemi.com/soc/documents/ProdCat_PIB.pdf
Lists devices currently recommended for new designs and the packages available for each member of
the family. Use this document or the datasheet tables to determine the best package for your design, and
which package drawing to use.
Package Mechanical Drawings
http://www.microsemi.com/soc/documents/PckgMechDrwngs.pdf
This document contains the package mechanical drawings for all packages currently or previously
supplied by Actel. Use the bookmarks to navigate to the package mechanical drawings.
Additional packaging materials are at http://www.microsemi.com/products/solutions/package/docs.aspx.
Revision 13 4-1
4 – Package Pin Assignments
QN48
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
48
1
Pin 1
Package Pin Assignments
4-2 Revision 13
QN48
Pin Number A3P030 Function
1 IO82RSB1
2 GEC0/IO73RSB1
3 GEA0/IO72RSB1
4 GEB0/IO71RSB1
5GND
6 VCCIB1
7 IO68RSB1
8 IO67RSB1
9 IO66RSB1
10 IO65RSB1
11 IO64RSB1
12 IO62RSB1
13 IO61RSB1
14 IO60RSB1
15 IO57RSB1
16 IO55RSB1
17 IO53RSB1
18 VCC
19 VCCIB1
20 IO46RSB1
21 IO42RSB1
22 TCK
23 TDI
24 TMS
25 VPUMP
26 TDO
27 TRST
28 VJTAG
29 IO38RSB0
30 GDB0/IO34RSB0
31 GDA0/IO33RSB0
32 GDC0/IO32RSB0
33 VCCIB0
34 GND
35 VCC
36 IO25RSB0
37 IO24RSB0
38 IO22RSB0
39 IO20RSB0
40 IO18RSB0
41 IO16RSB0
42 IO14RSB0
43 IO10RSB0
44 IO08RSB0
45 IO06RSB0
46 IO04RSB0
47 IO02RSB0
48 IO00RSB0
QN48
Pin Number A3P030 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-3
QN68
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
Pin A1 Mark
1
68
Package Pin Assignments
4-4 Revision 13
QN68
Pin Number A3P015 Function
1 IO82RSB1
2 IO80RSB1
3 IO78RSB1
4 IO76RSB1
5 GEC0/IO73RSB1
6 GEA0/IO72RSB1
7 GEB0/IO71RSB1
8VCC
9GND
10 VCCIB1
11 IO68RSB1
12 IO67RSB1
13 IO66RSB1
14 IO65RSB1
15 IO64RSB1
16 IO63RSB1
17 IO62RSB1
18 IO60RSB1
19 IO58RSB1
20 IO56RSB1
21 IO54RSB1
22 IO52RSB1
23 IO51RSB1
24 VCC
25 GND
26 VCCIB1
27 IO50RSB1
28 IO48RSB1
29 IO46RSB1
30 IO44RSB1
31 IO42RSB1
32 TCK
33 TDI
34 TMS
35 VPUMP
36 TDO
37 TRST
38 VJTAG
39 IO40RSB0
40 IO37RSB0
41 GDB0/IO34RSB0
42 GDA0/IO33RSB0
43 GDC0/IO32RSB0
44 VCCIB0
45 GND
46 VCC
47 IO31RSB0
48 IO29RSB0
49 IO28RSB0
50 IO27RSB0
51 IO25RSB0
52 IO24RSB0
53 IO22RSB0
54 IO21RSB0
55 IO19RSB0
56 IO17RSB0
57 IO15RSB0
58 IO14RSB0
59 VCCIB0
60 GND
61 VCC
62 IO12RSB0
63 IO10RSB0
64 IO08RSB0
65 IO06RSB0
66 IO04RSB0
67 IO02RSB0
68 IO00RSB0
QN68
Pin Number A3P015 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-5
QN68
Pin Number A3P030 Function
1 IO82RSB1
2 IO80RSB1
3 IO78RSB1
4 IO76RSB1
5 GEC0/IO73RSB1
6 GEA0/IO72RSB1
7 GEB0/IO71RSB1
8VCC
9GND
10 VCCIB1
11 IO68RSB1
12 IO67RSB1
13 IO66RSB1
14 IO65RSB1
15 IO64RSB1
16 IO63RSB1
17 IO62RSB1
18 IO60RSB1
19 IO58RSB1
20 IO56RSB1
21 IO54RSB1
22 IO52RSB1
23 IO51RSB1
24 VCC
25 GND
26 VCCIB1
27 IO50RSB1
28 IO48RSB1
29 IO46RSB1
30 IO44RSB1
31 IO42RSB1
32 TCK
33 TDI
34 TMS
35 VPUMP
36 TDO
37 TRST
38 VJTAG
39 IO40RSB0
40 IO37RSB0
41 GDB0/IO34RSB0
42 GDA0/IO33RSB0
43 GDC0/IO32RSB0
44 VCCIB0
45 GND
46 VCC
47 IO31RSB0
48 IO29RSB0
49 IO28RSB0
50 IO27RSB0
51 IO25RSB0
52 IO24RSB0
53 IO22RSB0
54 IO21RSB0
55 IO19RSB0
56 IO17RSB0
57 IO15RSB0
58 IO14RSB0
59 VCCIB0
60 GND
61 VCC
62 IO12RSB0
63 IO10RSB0
64 IO08RSB0
65 IO06RSB0
66 IO04RSB0
67 IO02RSB0
68 IO00RSB0
QN68
Pin Number A3P030 Function
Package Pin Assignments
4-6 Revision 13
QN132
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
A37
A1
A12
A36
D4
D3
D1
D2
A25
A48
A24 A13
B34
B1
B11
B44
B22 B12
C31
C1
C10
B33
B23
C30
C21
C40
C20 C11
Optional
Corner Pad (4x)
Pin A1Mark
ProASIC3 Flash Family FPGAs
Revision 13 4-7
QN132
Pin Number A3P030 Function
A1 IO01RSB1
A2 IO81RSB1
A3 NC
A4 IO80RSB1
A5 GEC0/IO77RSB1
A6 NC
A7 GEB0/IO75RSB1
A8 IO73RSB1
A9 NC
A10 VCC
A11 IO71RSB1
A12 IO68RSB1
A13 IO63RSB1
A14 IO60RSB1
A15 NC
A16 IO59RSB1
A17 IO57RSB1
A18 VCC
A19 IO54RSB1
A20 IO52RSB1
A21 IO49RSB1
A22 IO48RSB1
A23 IO47RSB1
A24 TDI
A25 TRST
A26 IO44RSB0
A27 NC
A28 IO43RSB0
A29 IO42RSB0
A30 IO40RSB0
A31 IO39RSB0
A32 GDC0/IO36RSB0
A33 NC
A34 VCC
A35 IO34RSB0
A36 IO31RSB0
A37 IO26RSB0
A38 IO23RSB0
A39 NC
A40 IO22RSB0
A41 IO20RSB0
A42 IO18RSB0
A43 VCC
A44 IO15RSB0
A45 IO12RSB0
A46 IO10RSB0
A47 IO09RSB0
A48 IO06RSB0
B1 IO02RSB1
B2 IO82RSB1
B3 GND
B4 IO79RSB1
B5 NC
B6 GND
B7 IO74RSB1
B8 NC
B9 GND
B10 IO70RSB1
B11 IO67RSB1
B12 IO64RSB1
B13 IO61RSB1
B14 GND
B15 IO58RSB1
B16 IO56RSB1
B17 GND
B18 IO53RSB1
B19 IO50RSB1
B20 GND
B21 IO46RSB1
B22 TMS
B23 TDO
B24 IO45RSB0
QN132
Pin Number A3P030 Function
B25 GND
B26 NC
B27 IO41RSB0
B28 GND
B29 GDA0/IO37RSB0
B30 NC
B31 GND
B32 IO33RSB0
B33 IO30RSB0
B34 IO27RSB0
B35 IO24RSB0
B36 GND
B37 IO21RSB0
B38 IO19RSB0
B39 GND
B40 IO16RSB0
B41 IO13RSB0
B42 GND
B43 IO08RSB0
B44 IO05RSB0
C1 IO03RSB1
C2 IO00RSB1
C3 NC
C4 IO78RSB1
C5 GEA0/IO76RSB1
C6 NC
C7 NC
C8 VCCIB1
C9 IO69RSB1
C10 IO66RSB1
C11 IO65RSB1
C12 IO62RSB1
C13 NC
C14 NC
C15 IO55RSB1
C16 VCCIB1
QN132
Pin Number A3P030 Function
Package Pin Assignments
4-8 Revision 13
C17 IO51RSB1
C18 NC
C19 TCK
C20 NC
C21 VPUMP
C22 VJTAG
C23 NC
C24 NC
C25 NC
C26 GDB0/IO38RSB0
C27 NC
C28 VCCIB0
C29 IO32RSB0
C30 IO29RSB0
C31 IO28RSB0
C32 IO25RSB0
C33 NC
C34 NC
C35 VCCIB0
C36 IO17RSB0
C37 IO14RSB0
C38 IO11RSB0
C39 IO07RSB0
C40 IO04RSB0
D1 GND
D2 GND
D3 GND
D4 GND
QN132
Pin Number A3P030 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-9
QN132
Pin Number A3P060 Function
A1 GAB2/IO00RSB1
A2 IO93RSB1
A3 VCCIB1
A4 GFC1/IO89RSB1
A5 GFB0/IO86RSB1
A6 VCCPLF
A7 GFA1/IO84RSB1
A8 GFC2/IO81RSB1
A9 IO78RSB1
A10 VCC
A11 GEB1/IO75RSB1
A12 GEA0/IO72RSB1
A13 GEC2/IO69RSB1
A14 IO65RSB1
A15 VCC
A16 IO64RSB1
A17 IO63RSB1
A18 IO62RSB1
A19 IO61RSB1
A20 IO58RSB1
A21 GDB2/IO55RSB1
A22 NC
A23 GDA2/IO54RSB1
A24 TDI
A25 TRST
A26 GDC1/IO48RSB0
A27 VCC
A28 IO47RSB0
A29 GCC2/IO46RSB0
A30 GCA2/IO44RSB0
A31 GCA0/IO43RSB0
A32 GCB1/IO40RSB0
A33 IO36RSB0
A34 VCC
A35 IO31RSB0
A36 GBA2/IO28RSB0
A37 GBB1/IO25RSB0
A38 GBC0/IO22RSB0
A39 VCCIB0
A40 IO21RSB0
A41 IO18RSB0
A42 IO15RSB0
A43 IO14RSB0
A44 IO11RSB0
A45 GAB1/IO08RSB0
A46 NC
A47 GAB0/IO07RSB0
A48 IO04RSB0
B1 IO01RSB1
B2 GAC2/IO94RSB1
B3 GND
B4 GFC0/IO88RSB1
B5 VCOMPLF
B6 GND
B7 GFB2/IO82RSB1
B8 IO79RSB1
B9 GND
B10 GEB0/IO74RSB1
B11 VMV1
B12 GEB2/IO70RSB1
B13 IO67RSB1
B14 GND
B15 NC
B16 NC
B17 GND
B18 IO59RSB1
B19 GDC2/IO56RSB1
B20 GND
B21 GNDQ
B22 TMS
B23 TDO
B24 GDC0/IO49RSB0
QN132
Pin Number A3P060 Function
B25 GND
B26 NC
B27 GCB2/IO45RSB0
B28 GND
B29 GCB0/IO41RSB0
B30 GCC1/IO38RSB0
B31 GND
B32 GBB2/IO30RSB0
B33 VMV0
B34 GBA0/IO26RSB0
B35 GBC1/IO23RSB0
B36 GND
B37 IO20RSB0
B38 IO17RSB0
B39 GND
B40 IO12RSB0
B41 GAC0/IO09RSB0
B42 GND
B43 GAA1/IO06RSB0
B44 GNDQ
C1 GAA2/IO02RSB1
C2 IO95RSB1
C3 VCC
C4 GFB1/IO87RSB1
C5 GFA0/IO85RSB1
C6 GFA2/IO83RSB1
C7 IO80RSB1
C8 VCCIB1
C9 GEA1/IO73RSB1
C10 GNDQ
C11 GEA2/IO71RSB1
C12 IO68RSB1
C13 VCCIB1
C14 NC
C15 NC
C16 IO60RSB1
QN132
Pin Number A3P060 Function
Package Pin Assignments
4-10 Revision 13
C17 IO57RSB1
C18 NC
C19 TCK
C20 VMV1
C21 VPUMP
C22 VJTAG
C23 VCCIB0
C24 NC
C25 NC
C26 GCA1/IO42RSB0
C27 GCC0/IO39RSB0
C28 VCCIB0
C29 IO29RSB0
C30 GNDQ
C31 GBA1/IO27RSB0
C32 GBB0/IO24RSB0
C33 VCC
C34 IO19RSB0
C35 IO16RSB0
C36 IO13RSB0
C37 GAC1/IO10RSB0
C38 NC
C39 GAA0/IO05RSB0
C40 VMV0
D1 GND
D2 GND
D3 GND
D4 GND
QN132
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-11
QN132
Pin Number A3P125 Function
A1 GAB2/IO69RSB1
A2 IO130RSB1
A3 VCCIB1
A4 GFC1/IO126RSB1
A5 GFB0/IO123RSB1
A6 VCCPLF
A7 GFA1/IO121RSB1
A8 GFC2/IO118RSB1
A9 IO115RSB1
A10 VCC
A11 GEB1/IO110RSB1
A12 GEA0/IO107RSB1
A13 GEC2/IO104RSB1
A14 IO100RSB1
A15 VCC
A16 IO99RSB1
A17 IO96RSB1
A18 IO94RSB1
A19 IO91RSB1
A20 IO85RSB1
A21 IO79RSB1
A22 VCC
A23 GDB2/IO71RSB1
A24 TDI
A25 TRST
A26 GDC1/IO61RSB0
A27 VCC
A28 IO60RSB0
A29 GCC2/IO59RSB0
A30 GCA2/IO57RSB0
A31 GCA0/IO56RSB0
A32 GCB1/IO53RSB0
A33 IO49RSB0
A34 VCC
A35 IO44RSB0
A36 GBA2/IO41RSB0
A37 GBB1/IO38RSB0
A38 GBC0/IO35RSB0
A39 VCCIB0
A40 IO28RSB0
A41 IO22RSB0
A42 IO18RSB0
A43 IO14RSB0
A44 IO11RSB0
A45 IO07RSB0
A46 VCC
A47 GAC1/IO05RSB0
A48 GAB0/IO02RSB0
B1 IO68RSB1
B2 GAC2/IO131RSB1
B3 GND
B4 GFC0/IO125RSB1
B5 VCOMPLF
B6 GND
B7 GFB2/IO119RSB1
B8 IO116RSB1
B9 GND
B10 GEB0/IO109RSB1
B11 VMV1
B12 GEB2/IO105RSB1
B13 IO101RSB1
B14 GND
B15 IO98RSB1
B16 IO95RSB1
B17 GND
B18 IO87RSB1
B19 IO81RSB1
B20 GND
B21 GNDQ
B22 TMS
B23 TDO
B24 GDC0/IO62RSB0
QN132
Pin Number A3P125 Function
B25 GND
B26 NC
B27 GCB2/IO58RSB0
B28 GND
B29 GCB0/IO54RSB0
B30 GCC1/IO51RSB0
B31 GND
B32 GBB2/IO43RSB0
B33 VMV0
B34 GBA0/IO39RSB0
B35 GBC1/IO36RSB0
B36 GND
B37 IO26RSB0
B38 IO21RSB0
B39 GND
B40 IO13RSB0
B41 IO08RSB0
B42 GND
B43 GAC0/IO04RSB0
B44 GNDQ
C1 GAA2/IO67RSB1
C2 IO132RSB1
C3 VCC
C4 GFB1/IO124RSB1
C5 GFA0/IO122RSB1
C6 GFA2/IO120RSB1
C7 IO117RSB1
C8 VCCIB1
C9 GEA1/IO108RSB1
C10 GNDQ
C11 GEA2/IO106RSB1
C12 IO103RSB1
C13 VCCIB1
C14 IO97RSB1
C15 IO93RSB1
C16 IO89RSB1
QN132
Pin Number A3P125 Function
Package Pin Assignments
4-12 Revision 13
C17 IO83RSB1
C18 VCCIB1
C19 TCK
C20 VMV1
C21 VPUMP
C22 VJTAG
C23 VCCIB0
C24 NC
C25 NC
C26 GCA1/IO55RSB0
C27 GCC0/IO52RSB0
C28 VCCIB0
C29 IO42RSB0
C30 GNDQ
C31 GBA1/IO40RSB0
C32 GBB0/IO37RSB0
C33 VCC
C34 IO24RSB0
C35 IO19RSB0
C36 IO16RSB0
C37 IO10RSB0
C38 VCCIB0
C39 GAB1/IO03RSB0
C40 VMV0
D1 GND
D2 GND
D3 GND
D4 GND
QN132
Pin Number A3P125 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-13
QN132
Pin Number A3P250 Function
A1 GAB2/IO117UPB3
A2 IO117VPB3
A3 VCCIB3
A4 GFC1/IO110PDB3
A5 GFB0/IO109NPB3
A6 VCCPLF
A7 GFA1/IO108PPB3
A8 GFC2/IO105PPB3
A9 IO103NDB3
A10 VCC
A11 GEA1/IO98PPB3
A12 GEA0/IO98NPB3
A13 GEC2/IO95RSB2
A14 IO91RSB2
A15 VCC
A16 IO90RSB2
A17 IO87RSB2
A18 IO85RSB2
A19 IO82RSB2
A20 IO76RSB2
A21 IO70RSB2
A22 VCC
A23 GDB2/IO62RSB2
A24 TDI
A25 TRST
A26 GDC1/IO58UDB1
A27 VCC
A28 IO54NDB1
A29 IO52NDB1
A30 GCA2/IO51PPB1
A31 GCA0/IO50NPB1
A32 GCB1/IO49PDB1
A33 IO47NSB1
A34 VCC
A35 IO41NPB1
A36 GBA2/IO41PPB1
A37 GBB1/IO38RSB0
A38 GBC0/IO35RSB0
A39 VCCIB0
A40 IO28RSB0
A41 IO22RSB0
A42 IO18RSB0
A43 IO14RSB0
A44 IO11RSB0
A45 IO07RSB0
A46 VCC
A47 GAC1/IO05RSB0
A48 GAB0/IO02RSB0
B1 IO118VDB3
B2 GAC2/IO116UDB3
B3 GND
B4 GFC0/IO110NDB3
B5 VCOMPLF
B6 GND
B7 GFB2/IO106PSB3
B8 IO103PDB3
B9 GND
B10 GEB0/IO99NDB3
B11 VMV3
B12 GEB2/IO96RSB2
B13 IO92RSB2
B14 GND
B15 IO89RSB2
B16 IO86RSB2
B17 GND
B18 IO78RSB2
B19 IO72RSB2
B20 GND
B21 GNDQ
B22 TMS
B23 TDO
B24 GDC0/IO58VDB1
QN132
Pin Number A3P250 Function
B25 GND
B26 IO54PDB1
B27 GCB2/IO52PDB1
B28 GND
B29 GCB0/IO49NDB1
B30 GCC1/IO48PDB1
B31 GND
B32 GBB2/IO42PDB1
B33 VMV1
B34 GBA0/IO39RSB0
B35 GBC1/IO36RSB0
B36 GND
B37 IO26RSB0
B38 IO21RSB0
B39 GND
B40 IO13RSB0
B41 IO08RSB0
B42 GND
B43 GAC0/IO04RSB0
B44 GNDQ
C1 GAA2/IO118UDB3
C2 IO116VDB3
C3 VCC
C4 GFB1/IO109PPB3
C5 GFA0/IO108NPB3
C6 GFA2/IO107PSB3
C7 IO105NPB3
C8 VCCIB3
C9 GEB1/IO99PDB3
C10 GNDQ
C11 GEA2/IO97RSB2
C12 IO94RSB2
C13 VCCIB2
C14 IO88RSB2
C15 IO84RSB2
C16 IO80RSB2
QN132
Pin Number A3P250 Function
Package Pin Assignments
4-14 Revision 13
C17 IO74RSB2
C18 VCCIB2
C19 TCK
C20 VMV2
C21 VPUMP
C22 VJTAG
C23 VCCIB1
C24 IO53NSB1
C25 IO51NPB1
C26 GCA1/IO50PPB1
C27 GCC0/IO48NDB1
C28 VCCIB1
C29 IO42NDB1
C30 GNDQ
C31 GBA1/IO40RSB0
C32 GBB0/IO37RSB0
C33 VCC
C34 IO24RSB0
C35 IO19RSB0
C36 IO16RSB0
C37 IO10RSB0
C38 VCCIB0
C39 GAB1/IO03RSB0
C40 VMV0
D1 GND
D2 GND
D3 GND
D4 GND
QN132
Pin Number A3P250 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-15
CS121
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Notes:
1. This is the bottom view of the package.
2. The die attach paddle center of the package is tied to ground (GND).
11 10 123456789
A
B
C
D
E
F
G
H
J
K
L
Package Pin Assignments
4-16 Revision 13
CS121
Pin Number A3P060 Function
A1 GNDQ
A2 IO01RSB0
A3 GAA1/IO03RSB0
A4 GAC1/IO07RSB0
A5 IO15RSB0
A6 IO13RSB0
A7 IO17RSB0
A8 GBB1/IO22RSB0
A9 GBA1/IO24RSB0
A10 GNDQ
A11 VMV0
B1 GAA2/IO95RSB1
B2 IO00RSB0
B3 GAA0/IO02RSB0
B4 GAC0/IO06RSB0
B5 IO08RSB0
B6 IO12RSB0
B7 IO16RSB0
B8 GBC1/IO20RSB0
B9 GBB0/IO21RSB0
B10 GBB2/IO27RSB0
B11 GBA2/IO25RSB0
C1 IO89RSB1
C2 GAC2/IO91RSB1
C3 GAB1/IO05RSB0
C4 GAB0/IO04RSB0
C5 IO09RSB0
C6 IO14RSB0
C7 GBA0/IO23RSB0
C8 GBC0/IO19RSB0
C9 IO26RSB0
C10 IO28RSB0
C11 GBC2/IO29RSB0
D1 IO88RSB1
D2 IO90RSB1
D3 GAB2/IO93RSB1
D4 IO10RSB0
D5 IO11RSB0
D6 IO18RSB0
D7 IO32RSB0
D8 IO31RSB0
D9 GCA2/IO41RSB0
D10 IO30RSB0
D11 IO33RSB0
E1 IO87RSB1
E2 GFC0/IO85RSB1
E3 IO92RSB1
E4 IO94RSB1
E5 VCC
E6 VCCIB0
E7 GND
E8 GCC0/IO36RSB0
E9 IO34RSB0
E10 GCB1/IO37RSB0
E11 GCC1/IO35RSB0
F1 VCOMPLF
F2 GFB0/IO83RSB1
F3 GFA0/IO82RSB1
F4 GFC1/IO86RSB1
F5 VCCIB1
F6 VCC
F7 VCCIB0
F8 GCB2/IO42RSB0
F9 GCC2/IO43RSB0
F10 GCB0/IO38RSB0
F11 GCA1/IO39RSB0
G1 VCCPLF
G2 GFB2/IO79RSB1
G3 GFA1/IO81RSB1
G4 GFB1/IO84RSB1
G5 GND
G6 VCCIB1
CS121
Pin Number A3P060 Function
G7 VCC
G8 GDC0/IO46RSB0
G9 GDA1/IO49RSB0
G10 GDB0/IO48RSB0
G11 GCA0/IO40RSB0
H1 IO75RSB1
H2 IO76RSB1
H3 GFC2/IO78RSB1
H4 GFA2/IO80RSB1
H5 IO77RSB1
H6 GEC2/IO66RSB1
H7 IO54RSB1
H8 GDC2/IO53RSB1
H9 VJTAG
H10 TRST
H11 IO44RSB0
J1 GEC1/IO74RSB1
J2 GEC0/IO73RSB1
J3 GEB1/IO72RSB1
J4 GEA0/IO69RSB1
J5 GEB2/IO67RSB1
J6 IO62RSB1
J7 GDA2/IO51RSB1
J8 GDB2/IO52RSB1
J9 TDI
J10 TDO
J11 GDC1/IO45RSB0
K1 GEB0/IO71RSB1
K2 GEA1/IO70RSB1
K3 GEA2/IO68RSB1
K4 IO64RSB1
K5 IO60RSB1
K6 IO59RSB1
K7 IO56RSB1
K8 TCK
K9 TMS
CS121
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-17
K10 VPUMP
K11 GDB1/IO47RSB0
L1 VMV1
L2 GNDQ
L3 IO65RSB1
L4 IO63RSB1
L5 IO61RSB1
L6 IO58RSB1
L7 IO57RSB1
L8 IO55RSB1
L9 GNDQ
L10 GDA0/IO50RSB0
L11 VMV1
CS121
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-19
VQ100
Pin Number A3P030 Function
1GND
2 IO82RSB1
3 IO81RSB1
4 IO80RSB1
5 IO79RSB1
6 IO78RSB1
7 IO77RSB1
8 IO76RSB1
9GND
10 IO75RSB1
11 IO74RSB1
12 GEC0/IO73RSB1
13 GEA0/IO72RSB1
14 GEB0/IO71RSB1
15 IO70RSB1
16 IO69RSB1
17 VCC
18 VCCIB1
19 IO68RSB1
20 IO67RSB1
21 IO66RSB1
22 IO65RSB1
23 IO64RSB1
24 IO63RSB1
25 IO62RSB1
26 IO61RSB1
27 IO60RSB1
28 IO59RSB1
29 IO58RSB1
30 IO57RSB1
31 IO56RSB1
32 IO55RSB1
33 IO54RSB1
34 IO53RSB1
35 IO52RSB1
36 IO51RSB1
37 VCC
38 GND
39 VCCIB1
40 IO49RSB1
41 IO47RSB1
42 IO46RSB1
43 IO45RSB1
44 IO44RSB1
45 IO43RSB1
46 IO42RSB1
47 TCK
48 TDI
49 TMS
50 NC
51 GND
52 VPUMP
53 NC
54 TDO
55 TRST
56 VJTAG
57 IO41RSB0
58 IO40RSB0
59 IO39RSB0
60 IO38RSB0
61 IO37RSB0
62 IO36RSB0
63 GDB0/IO34RSB0
64 GDA0/IO33RSB0
65 GDC0/IO32RSB0
66 VCCIB0
67 GND
68 VCC
69 IO31RSB0
70 IO30RSB0
71 IO29RSB0
72 IO28RSB0
VQ100
Pin Number A3P030 Function
73 IO27RSB0
74 IO26RSB0
75 IO25RSB0
76 IO24RSB0
77 IO23RSB0
78 IO22RSB0
79 IO21RSB0
80 IO20RSB0
81 IO19RSB0
82 IO18RSB0
83 IO17RSB0
84 IO16RSB0
85 IO15RSB0
86 IO14RSB0
87 VCCIB0
88 GND
89 VCC
90 IO12RSB0
91 IO10RSB0
92 IO08RSB0
93 IO07RSB0
94 IO06RSB0
95 IO05RSB0
96 IO04RSB0
97 IO03RSB0
98 IO02RSB0
99 IO01RSB0
100 IO00RSB0
VQ100
Pin Number A3P030 Function
Package Pin Assignments
4-20 Revision 13
VQ100
Pin Number A3P060 Function
1GND
2 GAA2/IO51RSB1
3 IO52RSB1
4 GAB2/IO53RSB1
5 IO95RSB1
6 GAC2/IO94RSB1
7 IO93RSB1
8 IO92RSB1
9GND
10 GFB1/IO87RSB1
11 GFB0/IO86RSB1
12 VCOMPLF
13 GFA0/IO85RSB1
14 VCCPLF
15 GFA1/IO84RSB1
16 GFA2/IO83RSB1
17 VCC
18 VCCIB1
19 GEC1/IO77RSB1
20 GEB1/IO75RSB1
21 GEB0/IO74RSB1
22 GEA1/IO73RSB1
23 GEA0/IO72RSB1
24 VMV1
25 GNDQ
26 GEA2/IO71RSB1
27 GEB2/IO70RSB1
28 GEC2/IO69RSB1
29 IO68RSB1
30 IO67RSB1
31 IO66RSB1
32 IO65RSB1
33 IO64RSB1
34 IO63RSB1
35 IO62RSB1
36 IO61RSB1
37 VCC
38 GND
39 VCCIB1
40 IO60RSB1
41 IO59RSB1
42 IO58RSB1
43 IO57RSB1
44 GDC2/IO56RSB1
45 GDB2/IO55RSB1
46 GDA2/IO54RSB1
47 TCK
48 TDI
49 TMS
50 VMV1
51 GND
52 VPUMP
53 NC
54 TDO
55 TRST
56 VJTAG
57 GDA1/IO49RSB0
58 GDC0/IO46RSB0
59 GDC1/IO45RSB0
60 GCC2/IO43RSB0
61 GCB2/IO42RSB0
62 GCA0/IO40RSB0
63 GCA1/IO39RSB0
64 GCC0/IO36RSB0
65 GCC1/IO35RSB0
66 VCCIB0
67 GND
68 VCC
69 IO31RSB0
70 GBC2/IO29RSB0
71 GBB2/IO27RSB0
72 IO26RSB0
VQ100
Pin Number A3P060 Function
73 GBA2/IO25RSB0
74 VMV0
75 GNDQ
76 GBA1/IO24RSB0
77 GBA0/IO23RSB0
78 GBB1/IO22RSB0
79 GBB0/IO21RSB0
80 GBC1/IO20RSB0
81 GBC0/IO19RSB0
82 IO18RSB0
83 IO17RSB0
84 IO15RSB0
85 IO13RSB0
86 IO11RSB0
87 VCCIB0
88 GND
89 VCC
90 IO10RSB0
91 IO09RSB0
92 IO08RSB0
93 GAC1/IO07RSB0
94 GAC0/IO06RSB0
95 GAB1/IO05RSB0
96 GAB0/IO04RSB0
97 GAA1/IO03RSB0
98 GAA0/IO02RSB0
99 IO01RSB0
100 IO00RSB0
VQ100
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-21
VQ100
Pin Number A3P125 Function
1GND
2 GAA2/IO67RSB1
3 IO68RSB1
4 GAB2/IO69RSB1
5 IO132RSB1
6 GAC2/IO131RSB1
7 IO130RSB1
8 IO129RSB1
9GND
10 GFB1/IO124RSB1
11 GFB0/IO123RSB1
12 VCOMPLF
13 GFA0/IO122RSB1
14 VCCPLF
15 GFA1/IO121RSB1
16 GFA2/IO120RSB1
17 VCC
18 VCCIB1
19 GEC0/IO111RSB1
20 GEB1/IO110RSB1
21 GEB0/IO109RSB1
22 GEA1/IO108RSB1
23 GEA0/IO107RSB1
24 VMV1
25 GNDQ
26 GEA2/IO106RSB1
27 GEB2/IO105RSB1
28 GEC2/IO104RSB1
29 IO102RSB1
30 IO100RSB1
31 IO99RSB1
32 IO97RSB1
33 IO96RSB1
34 IO95RSB1
35 IO94RSB1
36 IO93RSB1
37 VCC
38 GND
39 VCCIB1
40 IO87RSB1
41 IO84RSB1
42 IO81RSB1
43 IO75RSB1
44 GDC2/IO72RSB1
45 GDB2/IO71RSB1
46 GDA2/IO70RSB1
47 TCK
48 TDI
49 TMS
50 VMV1
51 GND
52 VPUMP
53 NC
54 TDO
55 TRST
56 VJTAG
57 GDA1/IO65RSB0
58 GDC0/IO62RSB0
59 GDC1/IO61RSB0
60 GCC2/IO59RSB0
61 GCB2/IO58RSB0
62 GCA0/IO56RSB0
63 GCA1/IO55RSB0
64 GCC0/IO52RSB0
65 GCC1/IO51RSB0
66 VCCIB0
67 GND
68 VCC
69 IO47RSB0
70 GBC2/IO45RSB0
71 GBB2/IO43RSB0
72 IO42RSB0
VQ100
Pin Number A3P125 Function
73 GBA2/IO41RSB0
74 VMV0
75 GNDQ
76 GBA1/IO40RSB0
77 GBA0/IO39RSB0
78 GBB1/IO38RSB0
79 GBB0/IO37RSB0
80 GBC1/IO36RSB0
81 GBC0/IO35RSB0
82 IO32RSB0
83 IO28RSB0
84 IO25RSB0
85 IO22RSB0
86 IO19RSB0
87 VCCIB0
88 GND
89 VCC
90 IO15RSB0
91 IO13RSB0
92 IO11RSB0
93 IO09RSB0
94 IO07RSB0
95 GAC1/IO05RSB0
96 GAC0/IO04RSB0
97 GAB1/IO03RSB0
98 GAB0/IO02RSB0
99 GAA1/IO01RSB0
100 GAA0/IO00RSB0
VQ100
Pin Number A3P125 Function
Package Pin Assignments
4-22 Revision 13
VQ100
Pin Number A3P250 Function
1GND
2 GAA2/IO118UDB3
3 IO118VDB3
4 GAB2/IO117UDB3
5 IO117VDB3
6 GAC2/IO116UDB3
7 IO116VDB3
8 IO112PSB3
9GND
10 GFB1/IO109PDB3
11 GFB0/IO109NDB3
12 VCOMPLF
13 GFA0/IO108NPB3
14 VCCPLF
15 GFA1/IO108PPB3
16 GFA2/IO107PSB3
17 VCC
18 VCCIB3
19 GFC2/IO105PSB3
20 GEC1/IO100PDB3
21 GEC0/IO100NDB3
22 GEA1/IO98PDB3
23 GEA0/IO98NDB3
24 VMV3
25 GNDQ
26 GEA2/IO97RSB2
27 GEB2/IO96RSB2
28 GEC2/IO95RSB2
29 IO93RSB2
30 IO92RSB2
31 IO91RSB2
32 IO90RSB2
33 IO88RSB2
34 IO86RSB2
35 IO85RSB2
36 IO84RSB2
37 VCC
38 GND
39 VCCIB2
40 IO77RSB2
41 IO74RSB2
42 IO71RSB2
43 GDC2/IO63RSB2
44 GDB2/IO62RSB2
45 GDA2/IO61RSB2
46 GNDQ
47 TCK
48 TDI
49 TMS
50 VMV2
51 GND
52 VPUMP
53 NC
54 TDO
55 TRST
56 VJTAG
57 GDA1/IO60USB1
58 GDC0/IO58VDB1
59 GDC1/IO58UDB1
60 IO52NDB1
61 GCB2/IO52PDB1
62 GCA1/IO50PDB1
63 GCA0/IO50NDB1
64 GCC0/IO48NDB1
65 GCC1/IO48PDB1
66 VCCIB1
67 GND
68 VCC
69 IO43NDB1
70 GBC2/IO43PDB1
71 GBB2/IO42PSB1
72 IO41NDB1
VQ100
Pin Number A3P250 Function
73 GBA2/IO41PDB1
74 VMV1
75 GNDQ
76 GBA1/IO40RSB0
77 GBA0/IO39RSB0
78 GBB1/IO38RSB0
79 GBB0/IO37RSB0
80 GBC1/IO36RSB0
81 GBC0/IO35RSB0
82 IO29RSB0
83 IO27RSB0
84 IO25RSB0
85 IO23RSB0
86 IO21RSB0
87 VCCIB0
88 GND
89 VCC
90 IO15RSB0
91 IO13RSB0
92 IO11RSB0
93 GAC1/IO05RSB0
94 GAC0/IO04RSB0
95 GAB1/IO03RSB0
96 GAB0/IO02RSB0
97 GAA1/IO01RSB0
98 GAA0/IO00RSB0
99 GNDQ
100 VMV0
VQ100
Pin Number A3P250 Function
Package Pin Assignments
4-24 Revision 13
TQ144
Pin Number A3P060 Function
1 GAA2/IO51RSB1
2 IO52RSB1
3 GAB2/IO53RSB1
4 IO95RSB1
5 GAC2/IO94RSB1
6 IO93RSB1
7 IO92RSB1
8 IO91RSB1
9VCC
10 GND
11 VCCIB1
12 IO90RSB1
13 GFC1/IO89RSB1
14 GFC0/IO88RSB1
15 GFB1/IO87RSB1
16 GFB0/IO86RSB1
17 VCOMPLF
18 GFA0/IO85RSB1
19 VCCPLF
20 GFA1/IO84RSB1
21 GFA2/IO83RSB1
22 GFB2/IO82RSB1
23 GFC2/IO81RSB1
24 IO80RSB1
25 IO79RSB1
26 IO78RSB1
27 GND
28 VCCIB1
29 GEC1/IO77RSB1
30 GEC0/IO76RSB1
31 GEB1/IO75RSB1
32 GEB0/IO74RSB1
33 GEA1/IO73RSB1
34 GEA0/IO72RSB1
35 VMV1
36 GNDQ
37 NC
38 GEA2/IO71RSB1
39 GEB2/IO70RSB1
40 GEC2/IO69RSB1
41 IO68RSB1
42 IO67RSB1
43 IO66RSB1
44 IO65RSB1
45 VCC
46 GND
47 VCCIB1
48 NC
49 IO64RSB1
50 NC
51 IO63RSB1
52 NC
53 IO62RSB1
54 NC
55 IO61RSB1
56 NC
57 NC
58 IO60RSB1
59 IO59RSB1
60 IO58RSB1
61 IO57RSB1
62 NC
63 GND
64 NC
65 GDC2/IO56RSB1
66 GDB2/IO55RSB1
67 GDA2/IO54RSB1
68 GNDQ
69 TCK
70 TDI
71 TMS
72 VMV1
TQ144
Pin Number A3P060 Function
73 VPUMP
74 NC
75 TDO
76 TRST
77 VJTAG
78 GDA0/IO50RSB0
79 GDB0/IO48RSB0
80 GDB1/IO47RSB0
81 VCCIB0
82 GND
83 IO44RSB0
84 GCC2/IO43RSB0
85 GCB2/IO42RSB0
86 GCA2/IO41RSB0
87 GCA0/IO40RSB0
88 GCA1/IO39RSB0
89 GCB0/IO38RSB0
90 GCB1/IO37RSB0
91 GCC0/IO36RSB0
92 GCC1/IO35RSB0
93 IO34RSB0
94 IO33RSB0
95 NC
96 NC
97 NC
98 VCCIB0
99 GND
100 VCC
101 IO30RSB0
102 GBC2/IO29RSB0
103 IO28RSB0
104 GBB2/IO27RSB0
105 IO26RSB0
106 GBA2/IO25RSB0
107 VMV0
108 GNDQ
TQ144
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-25
109 NC
110 NC
111 GBA1/IO24RSB0
112 GBA0/IO23RSB0
113 GBB1/IO22RSB0
114 GBB0/IO21RSB0
115 GBC1/IO20RSB0
116 GBC0/IO19RSB0
117 VCCIB0
118 GND
119 VCC
120 IO18RSB0
121 IO17RSB0
122 IO16RSB0
123 IO15RSB0
124 IO14RSB0
125 IO13RSB0
126 IO12RSB0
127 IO11RSB0
128 NC
129 IO10RSB0
130 IO09RSB0
131 IO08RSB0
132 GAC1/IO07RSB0
133 GAC0/IO06RSB0
134 NC
135 GND
136 NC
137 GAB1/IO05RSB0
138 GAB0/IO04RSB0
139 GAA1/IO03RSB0
140 GAA0/IO02RSB0
141 IO01RSB0
142 IO00RSB0
143 GNDQ
144 VMV0
TQ144
Pin Number A3P060 Function
Package Pin Assignments
4-26 Revision 13
TQ144
Pin Number A3P125 Function
1 GAA2/IO67RSB1
2 IO68RSB1
3 GAB2/IO69RSB1
4 IO132RSB1
5 GAC2/IO131RSB1
6 IO130RSB1
7 IO129RSB1
8 IO128RSB1
9VCC
10 GND
11 VCCIB1
12 IO127RSB1
13 GFC1/IO126RSB1
14 GFC0/IO125RSB1
15 GFB1/IO124RSB1
16 GFB0/IO123RSB1
17 VCOMPLF
18 GFA0/IO122RSB1
19 VCCPLF
20 GFA1/IO121RSB1
21 GFA2/IO120RSB1
22 GFB2/IO119RSB1
23 GFC2/IO118RSB1
24 IO117RSB1
25 IO116RSB1
26 IO115RSB1
27 GND
28 VCCIB1
29 GEC1/IO112RSB1
30 GEC0/IO111RSB1
31 GEB1/IO110RSB1
32 GEB0/IO109RSB1
33 GEA1/IO108RSB1
34 GEA0/IO107RSB1
35 VMV1
36 GNDQ
37 NC
38 GEA2/IO106RSB1
39 GEB2/IO105RSB1
40 GEC2/IO104RSB1
41 IO103RSB1
42 IO102RSB1
43 IO101RSB1
44 IO100RSB1
45 VCC
46 GND
47 VCCIB1
48 IO99RSB1
49 IO97RSB1
50 IO95RSB1
51 IO93RSB1
52 IO92RSB1
53 IO90RSB1
54 IO88RSB1
55 IO86RSB1
56 IO84RSB1
57 IO83RSB1
58 IO82RSB1
59 IO81RSB1
60 IO80RSB1
61 IO79RSB1
62 VCC
63 GND
64 VCCIB1
65 GDC2/IO72RSB1
66 GDB2/IO71RSB1
67 GDA2/IO70RSB1
68 GNDQ
69 TCK
70 TDI
71 TMS
72 VMV1
TQ144
Pin Number A3P125 Function
73 VPUMP
74 NC
75 TDO
76 TRST
77 VJTAG
78 GDA0/IO66RSB0
79 GDB0/IO64RSB0
80 GDB1/IO63RSB0
81 VCCIB0
82 GND
83 IO60RSB0
84 GCC2/IO59RSB0
85 GCB2/IO58RSB0
86 GCA2/IO57RSB0
87 GCA0/IO56RSB0
88 GCA1/IO55RSB0
89 GCB0/IO54RSB0
90 GCB1/IO53RSB0
91 GCC0/IO52RSB0
92 GCC1/IO51RSB0
93 IO50RSB0
94 IO49RSB0
95 NC
96 NC
97 NC
98 VCCIB0
99 GND
100 VCC
101 IO47RSB0
102 GBC2/IO45RSB0
103 IO44RSB0
104 GBB2/IO43RSB0
105 IO42RSB0
106 GBA2/IO41RSB0
107 VMV0
108 GNDQ
TQ144
Pin Number A3P125 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-27
109 GBA1/IO40RSB0
110 GBA0/IO39RSB0
111 GBB1/IO38RSB0
112 GBB0/IO37RSB0
113 GBC1/IO36RSB0
114 GBC0/IO35RSB0
115 IO34RSB0
116 IO33RSB0
117 VCCIB0
118 GND
119 VCC
120 IO29RSB0
121 IO28RSB0
122 IO27RSB0
123 IO25RSB0
124 IO23RSB0
125 IO21RSB0
126 IO19RSB0
127 IO17RSB0
128 IO16RSB0
129 IO14RSB0
130 IO12RSB0
131 IO10RSB0
132 IO08RSB0
133 IO06RSB0
134 VCCIB0
135 GND
136 VCC
137 GAC1/IO05RSB0
138 GAC0/IO04RSB0
139 GAB1/IO03RSB0
140 GAB0/IO02RSB0
141 GAA1/IO01RSB0
142 GAA0/IO00RSB0
143 GNDQ
144 VMV0
TQ144
Pin Number A3P125 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-29
PQ208
Pin Number A3P125 Function
1GND
2 GAA2/IO67RSB1
3 IO68RSB1
4 GAB2/IO69RSB1
5 IO132RSB1
6 GAC2/IO131RSB1
7NC
8NC
9 IO130RSB1
10 IO129RSB1
11 NC
12 IO128RSB1
13 NC
14 NC
15 NC
16 VCC
17 GND
18 VCCIB1
19 IO127RSB1
20 NC
21 GFC1/IO126RSB1
22 GFC0/IO125RSB1
23 GFB1/IO124RSB1
24 GFB0/IO123RSB1
25 VCOMPLF
26 GFA0/IO122RSB1
27 VCCPLF
28 GFA1/IO121RSB1
29 GND
30 GFA2/IO120RSB1
31 NC
32 GFB2/IO119RSB1
33 NC
34 GFC2/IO118RSB1
35 IO117RSB1
36 NC
37 IO116RSB1
38 IO115RSB1
39 NC
40 VCCIB1
41 GND
42 IO114RSB1
43 IO113RSB1
44 GEC1/IO112RSB1
45 GEC0/IO111RSB1
46 GEB1/IO110RSB1
47 GEB0/IO109RSB1
48 GEA1/IO108RSB1
49 GEA0/IO107RSB1
50 VMV1
51 GNDQ
52 GND
53 NC
54 NC
55 GEA2/IO106RSB1
56 GEB2/IO105RSB1
57 GEC2/IO104RSB1
58 IO103RSB1
59 IO102RSB1
60 IO101RSB1
61 IO100RSB1
62 VCCIB1
63 IO99RSB1
64 IO98RSB1
65 GND
66 IO97RSB1
67 IO96RSB1
68 IO95RSB1
69 IO94RSB1
70 IO93RSB1
71 VCC
72 VCCIB1
PQ208
Pin Number A3P125 Function
73 IO92RSB1
74 IO91RSB1
75 IO90RSB1
76 IO89RSB1
77 IO88RSB1
78 IO87RSB1
79 IO86RSB1
80 IO85RSB1
81 GND
82 IO84RSB1
83 IO83RSB1
84 IO82RSB1
85 IO81RSB1
86 IO80RSB1
87 IO79RSB1
88 VCC
89 VCCIB1
90 IO78RSB1
91 IO77RSB1
92 IO76RSB1
93 IO75RSB1
94 IO74RSB1
95 IO73RSB1
96 GDC2/IO72RSB1
97 GND
98 GDB2/IO71RSB1
99 GDA2/IO70RSB1
100 GNDQ
101 TCK
102 TDI
103 TMS
104 VMV1
105 GND
106 VPUMP
107 NC
108 TDO
PQ208
Pin Number A3P125 Function
Package Pin Assignments
4-30 Revision 13
109 TRST
110 VJTAG
111 GDA0/IO66RSB0
112 GDA1/IO65RSB0
113 GDB0/IO64RSB0
114 GDB1/IO63RSB0
115 GDC0/IO62RSB0
116 GDC1/IO61RSB0
117 NC
118 NC
119 NC
120 NC
121 NC
122 GND
123 VCCIB0
124 NC
125 NC
126 VCC
127 IO60RSB0
128 GCC2/IO59RSB0
129 GCB2/IO58RSB0
130 GND
131 GCA2/IO57RSB0
132 GCA0/IO56RSB0
133 GCA1/IO55RSB0
134 GCB0/IO54RSB0
135 GCB1/IO53RSB0
136 GCC0/IO52RSB0
137 GCC1/IO51RSB0
138 IO50RSB0
139 IO49RSB0
140 VCCIB0
141 GND
142 VCC
143 IO48RSB0
144 IO47RSB0
PQ208
Pin Number A3P125 Function
145 IO46RSB0
146 NC
147 NC
148 NC
149 GBC2/IO45RSB0
150 IO44RSB0
151 GBB2/IO43RSB0
152 IO42RSB0
153 GBA2/IO41RSB0
154 VMV0
155 GNDQ
156 GND
157 NC
158 GBA1/IO40RSB0
159 GBA0/IO39RSB0
160 GBB1/IO38RSB0
161 GBB0/IO37RSB0
162 GND
163 GBC1/IO36RSB0
164 GBC0/IO35RSB0
165 IO34RSB0
166 IO33RSB0
167 IO32RSB0
168 IO31RSB0
169 IO30RSB0
170 VCCIB0
171 VCC
172 IO29RSB0
173 IO28RSB0
174 IO27RSB0
175 IO26RSB0
176 IO25RSB0
177 IO24RSB0
178 GND
179 IO23RSB0
180 IO22RSB0
PQ208
Pin Number A3P125 Function
181 IO21RSB0
182 IO20RSB0
183 IO19RSB0
184 IO18RSB0
185 IO17RSB0
186 VCCIB0
187 VCC
188 IO16RSB0
189 IO15RSB0
190 IO14RSB0
191 IO13RSB0
192 IO12RSB0
193 IO11RSB0
194 IO10RSB0
195 GND
196 IO09RSB0
197 IO08RSB0
198 IO07RSB0
199 IO06RSB0
200 VCCIB0
201 GAC1/IO05RSB0
202 GAC0/IO04RSB0
203 GAB1/IO03RSB0
204 GAB0/IO02RSB0
205 GAA1/IO01RSB0
206 GAA0/IO00RSB0
207 GNDQ
208 VMV0
PQ208
Pin Number A3P125 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-31
PQ208
Pin Number A3P250 Function
1GND
2 GAA2/IO118UDB3
3 IO118VDB3
4 GAB2/IO117UDB3
5 IO117VDB3
6 GAC2/IO116UDB3
7 IO116VDB3
8 IO115UDB3
9 IO115VDB3
10 IO114UDB3
11 IO114VDB3
12 IO113PDB3
13 IO113NDB3
14 IO112PDB3
15 IO112NDB3
16 VCC
17 GND
18 VCCIB3
19 IO111PDB3
20 IO111NDB3
21 GFC1/IO110PDB3
22 GFC0/IO110NDB3
23 GFB1/IO109PDB3
24 GFB0/IO109NDB3
25 VCOMPLF
26 GFA0/IO108NPB3
27 VCCPLF
28 GFA1/IO108PPB3
29 GND
30 GFA2/IO107PDB3
31 IO107NDB3
32 GFB2/IO106PDB3
33 IO106NDB3
34 GFC2/IO105PDB3
35 IO105NDB3
36 NC
37 IO104PDB3
38 IO104NDB3
39 IO103PSB3
40 VCCIB3
41 GND
42 IO101PDB3
43 IO101NDB3
44 GEC1/IO100PDB3
45 GEC0/IO100NDB3
46 GEB1/IO99PDB3
47 GEB0/IO99NDB3
48 GEA1/IO98PDB3
49 GEA0/IO98NDB3
50 VMV3
51 GNDQ
52 GND
53 NC
54 NC
55 GEA2/IO97RSB2
56 GEB2/IO96RSB2
57 GEC2/IO95RSB2
58 IO94RSB2
59 IO93RSB2
60 IO92RSB2
61 IO91RSB2
62 VCCIB2
63 IO90RSB2
64 IO89RSB2
65 GND
66 IO88RSB2
67 IO87RSB2
68 IO86RSB2
69 IO85RSB2
70 IO84RSB2
71 VCC
72 VCCIB2
PQ208
Pin Number A3P250 Function
73 IO83RSB2
74 IO82RSB2
75 IO81RSB2
76 IO80RSB2
77 IO79RSB2
78 IO78RSB2
79 IO77RSB2
80 IO76RSB2
81 GND
82 IO75RSB2
83 IO74RSB2
84 IO73RSB2
85 IO72RSB2
86 IO71RSB2
87 IO70RSB2
88 VCC
89 VCCIB2
90 IO69RSB2
91 IO68RSB2
92 IO67RSB2
93 IO66RSB2
94 IO65RSB2
95 IO64RSB2
96 GDC2/IO63RSB2
97 GND
98 GDB2/IO62RSB2
99 GDA2/IO61RSB2
100 GNDQ
101 TCK
102 TDI
103 TMS
104 VMV2
105 GND
106 VPUMP
107 NC
108 TDO
PQ208
Pin Number A3P250 Function
Package Pin Assignments
4-32 Revision 13
109 TRST
110 VJTAG
111 GDA0/IO60VDB1
112 GDA1/IO60UDB1
113 GDB0/IO59VDB1
114 GDB1/IO59UDB1
115 GDC0/IO58VDB1
116 GDC1/IO58UDB1
117 IO57VDB1
118 IO57UDB1
119 IO56NDB1
120 IO56PDB1
121 IO55RSB1
122 GND
123 VCCIB1
124 NC
125 NC
126 VCC
127 IO53NDB1
128 GCC2/IO53PDB1
129 GCB2/IO52PSB1
130 GND
131 GCA2/IO51PSB1
132 GCA1/IO50PDB1
133 GCA0/IO50NDB1
134 GCB0/IO49NDB1
135 GCB1/IO49PDB1
136 GCC0/IO48NDB1
137 GCC1/IO48PDB1
138 IO47NDB1
139 IO47PDB1
140 VCCIB1
141 GND
142 VCC
143 IO46RSB1
144 IO45NDB1
PQ208
Pin Number A3P250 Function
145 IO45PDB1
146 IO44NDB1
147 IO44PDB1
148 IO43NDB1
149 GBC2/IO43PDB1
150 IO42NDB1
151 GBB2/IO42PDB1
152 IO41NDB1
153 GBA2/IO41PDB1
154 VMV1
155 GNDQ
156 GND
157 NC
158 GBA1/IO40RSB0
159 GBA0/IO39RSB0
160 GBB1/IO38RSB0
161 GBB0/IO37RSB0
162 GND
163 GBC1/IO36RSB0
164 GBC0/IO35RSB0
165 IO34RSB0
166 IO33RSB0
167 IO32RSB0
168 IO31RSB0
169 IO30RSB0
170 VCCIB0
171 VCC
172 IO29RSB0
173 IO28RSB0
174 IO27RSB0
175 IO26RSB0
176 IO25RSB0
177 IO24RSB0
178 GND
179 IO23RSB0
180 IO22RSB0
PQ208
Pin Number A3P250 Function
181 IO21RSB0
182 IO20RSB0
183 IO19RSB0
184 IO18RSB0
185 IO17RSB0
186 VCCIB0
187 VCC
188 IO16RSB0
189 IO15RSB0
190 IO14RSB0
191 IO13RSB0
192 IO12RSB0
193 IO11RSB0
194 IO10RSB0
195 GND
196 IO09RSB0
197 IO08RSB0
198 IO07RSB0
199 IO06RSB0
200 VCCIB0
201 GAC1/IO05RSB0
202 GAC0/IO04RSB0
203 GAB1/IO03RSB0
204 GAB0/IO02RSB0
205 GAA1/IO01RSB0
206 GAA0/IO00RSB0
207 GNDQ
208 VMV0
PQ208
Pin Number A3P250 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-33
PQ208
Pin Number A3P400 Function
1GND
2 GAA2/IO155UDB3
3 IO155VDB3
4 GAB2/IO154UDB3
5 IO154VDB3
6 GAC2/IO153UDB3
7 IO153VDB3
8 IO152UDB3
9 IO152VDB3
10 IO151UDB3
11 IO151VDB3
12 IO150PDB3
13 IO150NDB3
14 IO149PDB3
15 IO149NDB3
16 VCC
17 GND
18 VCCIB3
19 IO148PDB3
20 IO148NDB3
21 GFC1/IO147PDB3
22 GFC0/IO147NDB3
23 GFB1/IO146PDB3
24 GFB0/IO146NDB3
25 VCOMPLF
26 GFA0/IO145NPB3
27 VCCPLF
28 GFA1/IO145PPB3
29 GND
30 GFA2/IO144PDB3
31 IO144NDB3
32 GFB2/IO143PDB3
33 IO143NDB3
34 GFC2/IO142PDB3
35 IO142NDB3
36 NC
37 IO141PSB3
38 IO140PDB3
39 IO140NDB3
40 VCCIB3
41 GND
42 IO138PDB3
43 IO138NDB3
44 GEC1/IO137PDB3
45 GEC0/IO137NDB3
46 GEB1/IO136PDB3
47 GEB0/IO136NDB3
48 GEA1/IO135PDB3
49 GEA0/IO135NDB3
50 VMV3
51 GNDQ
52 GND
53 VMV2
54 NC
55 GEA2/IO134RSB2
56 GEB2/IO133RSB2
57 GEC2/IO132RSB2
58 IO131RSB2
59 IO130RSB2
60 IO129RSB2
61 IO128RSB2
62 VCCIB2
63 IO125RSB2
64 IO123RSB2
65 GND
66 IO121RSB2
67 IO119RSB2
68 IO117RSB2
69 IO115RSB2
70 IO113RSB2
71 VCC
72 VCCIB2
PQ208
Pin Number A3P400 Function
73 IO112RSB2
74 IO111RSB2
75 IO110RSB2
76 IO109RSB2
77 IO108RSB2
78 IO107RSB2
79 IO106RSB2
80 IO104RSB2
81 GND
82 IO102RSB2
83 IO101RSB2
84 IO100RSB2
85 IO99RSB2
86 IO98RSB2
87 IO97RSB2
88 VCC
89 VCCIB2
90 IO94RSB2
91 IO92RSB2
92 IO90RSB2
93 IO88RSB2
94 IO86RSB2
95 IO84RSB2
96 GDC2/IO82RSB2
97 GND
98 GDB2/IO81RSB2
99 GDA2/IO80RSB2
100 GNDQ
101 TCK
102 TDI
103 TMS
104 VMV2
105 GND
106 VPUMP
107 NC
108 TDO
PQ208
Pin Number A3P400 Function
Package Pin Assignments
4-34 Revision 13
109 TRST
110 VJTAG
111 GDA0/IO79VDB1
112 GDA1/IO79UDB1
113 GDB0/IO78VDB1
114 GDB1/IO78UDB1
115 GDC0/IO77VDB1
116 GDC1/IO77UDB1
117 IO76VDB1
118 IO76UDB1
119 IO75NDB1
120 IO75PDB1
121 IO74RSB1
122 GND
123 VCCIB1
124 NC
125 NC
126 VCC
127 IO72NDB1
128 GCC2/IO72PDB1
129 GCB2/IO71PSB1
130 GND
131 GCA2/IO70PSB1
132 GCA1/IO69PDB1
133 GCA0/IO69NDB1
134 GCB0/IO68NDB1
135 GCB1/IO68PDB1
136 GCC0/IO67NDB1
137 GCC1/IO67PDB1
138 IO66NDB1
139 IO66PDB1
140 VCCIB1
141 GND
142 VCC
143 IO65RSB1
144 IO64NDB1
PQ208
Pin Number A3P400 Function
145 IO64PDB1
146 IO63NDB1
147 IO63PDB1
148 IO62NDB1
149 GBC2/IO62PDB1
150 IO61NDB1
151 GBB2/IO61PDB1
152 IO60NDB1
153 GBA2/IO60PDB1
154 VMV1
155 GNDQ
156 GND
157 VMV0
158 GBA1/IO59RSB0
159 GBA0/IO58RSB0
160 GBB1/IO57RSB0
161 GBB0/IO56RSB0
162 GND
163 GBC1/IO55RSB0
164 GBC0/IO54RSB0
165 IO52RSB0
166 IO49RSB0
167 IO46RSB0
168 IO43RSB0
169 IO40RSB0
170 VCCIB0
171 VCC
172 IO36RSB0
173 IO35RSB0
174 IO34RSB0
175 IO33RSB0
176 IO32RSB0
177 IO31RSB0
178 GND
179 IO29RSB0
180 IO28RSB0
PQ208
Pin Number A3P400 Function
181 IO27RSB0
182 IO26RSB0
183 IO25RSB0
184 IO24RSB0
185 IO23RSB0
186 VCCIB0
187 VCC
188 IO21RSB0
189 IO20RSB0
190 IO19RSB0
191 IO18RSB0
192 IO17RSB0
193 IO16RSB0
194 IO15RSB0
195 GND
196 IO13RSB0
197 IO11RSB0
198 IO09RSB0
199 IO07RSB0
200 VCCIB0
201 GAC1/IO05RSB0
202 GAC0/IO04RSB0
203 GAB1/IO03RSB0
204 GAB0/IO02RSB0
205 GAA1/IO01RSB0
206 GAA0/IO00RSB0
207 GNDQ
208 VMV0
PQ208
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-35
PQ208
Pin Number A3P600 Function
1GND
2 GAA2/IO174PDB3
3 IO174NDB3
4 GAB2/IO173PDB3
5 IO173NDB3
6 GAC2/IO172PDB3
7 IO172NDB3
8 IO171PDB3
9 IO171NDB3
10 IO170PDB3
11 IO170NDB3
12 IO169PDB3
13 IO169NDB3
14 IO168PDB3
15 IO168NDB3
16 VCC
17 GND
18 VCCIB3
19 IO166PDB3
20 IO166NDB3
21 GFC1/IO164PDB3
22 GFC0/IO164NDB3
23 GFB1/IO163PDB3
24 GFB0/IO163NDB3
25 VCOMPLF
26 GFA0/IO162NPB3
27 VCCPLF
28 GFA1/IO162PPB3
29 GND
30 GFA2/IO161PDB3
31 IO161NDB3
32 GFB2/IO160PDB3
33 IO160NDB3
34 GFC2/IO159PDB3
35 IO159NDB3
36 VCC
37 IO152PDB3
38 IO152NDB3
39 IO150PSB3
40 VCCIB3
41 GND
42 IO147PDB3
43 IO147NDB3
44 GEC1/IO146PDB3
45 GEC0/IO146NDB3
46 GEB1/IO145PDB3
47 GEB0/IO145NDB3
48 GEA1/IO144PDB3
49 GEA0/IO144NDB3
50 VMV3
51 GNDQ
52 GND
53 VMV2
54 GEA2/IO143RSB2
55 GEB2/IO142RSB2
56 GEC2/IO141RSB2
57 IO140RSB2
58 IO139RSB2
59 IO138RSB2
60 IO137RSB2
61 IO136RSB2
62 VCCIB2
63 IO135RSB2
64 IO133RSB2
65 GND
66 IO131RSB2
67 IO129RSB2
68 IO127RSB2
69 IO125RSB2
70 IO123RSB2
71 VCC
72 VCCIB2
PQ208
Pin Number A3P600 Function
73 IO120RSB2
74 IO119RSB2
75 IO118RSB2
76 IO117RSB2
77 IO116RSB2
78 IO115RSB2
79 IO114RSB2
80 IO112RSB2
81 GND
82 IO111RSB2
83 IO110RSB2
84 IO109RSB2
85 IO108RSB2
86 IO107RSB2
87 IO106RSB2
88 VCC
89 VCCIB2
90 IO104RSB2
91 IO102RSB2
92 IO100RSB2
93 IO98RSB2
94 IO96RSB2
95 IO92RSB2
96 GDC2/IO91RSB2
97 GND
98 GDB2/IO90RSB2
99 GDA2/IO89RSB2
100 GNDQ
101 TCK
102 TDI
103 TMS
104 VMV2
105 GND
106 VPUMP
107 GNDQ
108 TDO
PQ208
Pin Number A3P600 Function
Package Pin Assignments
4-36 Revision 13
109 TRST
110 VJTAG
111 GDA0/IO88NDB1
112 GDA1/IO88PDB1
113 GDB0/IO87NDB1
114 GDB1/IO87PDB1
115 GDC0/IO86NDB1
116 GDC1/IO86PDB1
117 IO84NDB1
118 IO84PDB1
119 IO82NDB1
120 IO82PDB1
121 IO81PSB1
122 GND
123 VCCIB1
124 IO77NDB1
125 IO77PDB1
126 NC
127 IO74NDB1
128 GCC2/IO74PDB1
129 GCB2/IO73PSB1
130 GND
131 GCA2/IO72PSB1
132 GCA1/IO71PDB1
133 GCA0/IO71NDB1
134 GCB0/IO70NDB1
135 GCB1/IO70PDB1
136 GCC0/IO69NDB1
137 GCC1/IO69PDB1
138 IO67NDB1
139 IO67PDB1
140 VCCIB1
141 GND
142 VCC
143 IO65PSB1
144 IO64NDB1
PQ208
Pin Number A3P600 Function
145 IO64PDB1
146 IO63NDB1
147 IO63PDB1
148 IO62NDB1
149 GBC2/IO62PDB1
150 IO61NDB1
151 GBB2/IO61PDB1
152 IO60NDB1
153 GBA2/IO60PDB1
154 VMV1
155 GNDQ
156 GND
157 VMV0
158 GBA1/IO59RSB0
159 GBA0/IO58RSB0
160 GBB1/IO57RSB0
161 GBB0/IO56RSB0
162 GND
163 GBC1/IO55RSB0
164 GBC0/IO54RSB0
165 IO52RSB0
166 IO50RSB0
167 IO48RSB0
168 IO46RSB0
169 IO44RSB0
170 VCCIB0
171 VCC
172 IO36RSB0
173 IO35RSB0
174 IO34RSB0
175 IO33RSB0
176 IO32RSB0
177 IO31RSB0
178 GND
179 IO29RSB0
180 IO28RSB0
PQ208
Pin Number A3P600 Function
181 IO27RSB0
182 IO26RSB0
183 IO25RSB0
184 IO24RSB0
185 IO23RSB0
186 VCCIB0
187 VCC
188 IO20RSB0
189 IO19RSB0
190 IO18RSB0
191 IO17RSB0
192 IO16RSB0
193 IO14RSB0
194 IO12RSB0
195 GND
196 IO10RSB0
197 IO09RSB0
198 IO08RSB0
199 IO07RSB0
200 VCCIB0
201 GAC1/IO05RSB0
202 GAC0/IO04RSB0
203 GAB1/IO03RSB0
204 GAB0/IO02RSB0
205 GAA1/IO01RSB0
206 GAA0/IO00RSB0
207 GNDQ
208 VMV0
PQ208
Pin Number A3P600 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-37
PQ208
Pin Number A3P1000 Function
1GND
2 GAA2/IO225PDB3
3 IO225NDB3
4 GAB2/IO224PDB3
5 IO224NDB3
6 GAC2/IO223PDB3
7 IO223NDB3
8 IO222PDB3
9 IO222NDB3
10 IO220PDB3
11 IO220NDB3
12 IO218PDB3
13 IO218NDB3
14 IO216PDB3
15 IO216NDB3
16 VCC
17 GND
18 VCCIB3
19 IO212PDB3
20 IO212NDB3
21 GFC1/IO209PDB3
22 GFC0/IO209NDB3
23 GFB1/IO208PDB3
24 GFB0/IO208NDB3
25 VCOMPLF
26 GFA0/IO207NPB3
27 VCCPLF
28 GFA1/IO207PPB3
29 GND
30 GFA2/IO206PDB3
31 IO206NDB3
32 GFB2/IO205PDB3
33 IO205NDB3
34 GFC2/IO204PDB3
35 IO204NDB3
36 VCC
37 IO199PDB3
38 IO199NDB3
39 IO197PSB3
40 VCCIB3
41 GND
42 IO191PDB3
43 IO191NDB3
44 GEC1/IO190PDB3
45 GEC0/IO190NDB3
46 GEB1/IO189PDB3
47 GEB0/IO189NDB3
48 GEA1/IO188PDB3
49 GEA0/IO188NDB3
50 VMV3
51 GNDQ
52 GND
53 VMV2
54 GEA2/IO187RSB2
55 GEB2/IO186RSB2
56 GEC2/IO185RSB2
57 IO184RSB2
58 IO183RSB2
59 IO182RSB2
60 IO181RSB2
61 IO180RSB2
62 VCCIB2
63 IO178RSB2
64 IO176RSB2
65 GND
66 IO174RSB2
67 IO172RSB2
68 IO170RSB2
69 IO168RSB2
70 IO166RSB2
71 VCC
72 VCCIB2
PQ208
Pin Number A3P1000 Function
73 IO162RSB2
74 IO160RSB2
75 IO158RSB2
76 IO156RSB2
77 IO154RSB2
78 IO152RSB2
79 IO150RSB2
80 IO148RSB2
81 GND
82 IO143RSB2
83 IO141RSB2
84 IO139RSB2
85 IO137RSB2
86 IO135RSB2
87 IO133RSB2
88 VCC
89 VCCIB2
90 IO128RSB2
91 IO126RSB2
92 IO124RSB2
93 IO122RSB2
94 IO120RSB2
95 IO118RSB2
96 GDC2/IO116RSB2
97 GND
98 GDB2/IO115RSB2
99 GDA2/IO114RSB2
100 GNDQ
101 TCK
102 TDI
103 TMS
104 VMV2
105 GND
106 VPUMP
107 GNDQ
108 TDO
PQ208
Pin Number A3P1000 Function
Package Pin Assignments
4-38 Revision 13
109 TRST
110 VJTAG
111 GDA0/IO113NDB1
112 GDA1/IO113PDB1
113 GDB0/IO112NDB1
114 GDB1/IO112PDB1
115 GDC0/IO111NDB1
116 GDC1/IO111PDB1
117 IO109NDB1
118 IO109PDB1
119 IO106NDB1
120 IO106PDB1
121 IO104PSB1
122 GND
123 VCCIB1
124 IO99NDB1
125 IO99PDB1
126 NC
127 IO96NDB1
128 GCC2/IO96PDB1
129 GCB2/IO95PSB1
130 GND
131 GCA2/IO94PSB1
132 GCA1/IO93PDB1
133 GCA0/IO93NDB1
134 GCB0/IO92NDB1
135 GCB1/IO92PDB1
136 GCC0/IO91NDB1
137 GCC1/IO91PDB1
138 IO88NDB1
139 IO88PDB1
140 VCCIB1
141 GND
142 VCC
143 IO86PSB1
144 IO84NDB1
PQ208
Pin Number A3P1000 Function
145 IO84PDB1
146 IO82NDB1
147 IO82PDB1
148 IO80NDB1
149 GBC2/IO80PDB1
150 IO79NDB1
151 GBB2/IO79PDB1
152 IO78NDB1
153 GBA2/IO78PDB1
154 VMV1
155 GNDQ
156 GND
157 VMV0
158 GBA1/IO77RSB0
159 GBA0/IO76RSB0
160 GBB1/IO75RSB0
161 GBB0/IO74RSB0
162 GND
163 GBC1/IO73RSB0
164 GBC0/IO72RSB0
165 IO70RSB0
166 IO67RSB0
167 IO63RSB0
168 IO60RSB0
169 IO57RSB0
170 VCCIB0
171 VCC
172 IO54RSB0
173 IO51RSB0
174 IO48RSB0
175 IO45RSB0
176 IO42RSB0
177 IO40RSB0
178 GND
179 IO38RSB0
180 IO35RSB0
PQ208
Pin Number A3P1000 Function
181 IO33RSB0
182 IO31RSB0
183 IO29RSB0
184 IO27RSB0
185 IO25RSB0
186 VCCIB0
187 VCC
188 IO22RSB0
189 IO20RSB0
190 IO18RSB0
191 IO16RSB0
192 IO15RSB0
193 IO14RSB0
194 IO13RSB0
195 GND
196 IO12RSB0
197 IO11RSB0
198 IO10RSB0
199 IO09RSB0
200 VCCIB0
201 GAC1/IO05RSB0
202 GAC0/IO04RSB0
203 GAB1/IO03RSB0
204 GAB0/IO02RSB0
205 GAA1/IO01RSB0
206 GAA0/IO00RSB0
207 GNDQ
208 VMV0
PQ208
Pin Number A3P1000 Function
Package Pin Assignments
4-40 Revision 13
FG144
Pin Number A3P060 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO04RSB0
A4 GAB1/IO05RSB0
A5 IO08RSB0
A6 GND
A7 IO11RSB0
A8 VCC
A9 IO16RSB0
A10 GBA0/IO23RSB0
A11 GBA1/IO24RSB0
A12 GNDQ
B1 GAB2/IO53RSB1
B2 GND
B3 GAA0/IO02RSB0
B4 GAA1/IO03RSB0
B5 IO00RSB0
B6 IO10RSB0
B7 IO12RSB0
B8 IO14RSB0
B9 GBB0/IO21RSB0
B10 GBB1/IO22RSB0
B11 GND
B12 VMV0
C1 IO95RSB1
C2 GFA2/IO83RSB1
C3 GAC2/IO94RSB1
C4 VCC
C5 IO01RSB0
C6 IO09RSB0
C7 IO13RSB0
C8 IO15RSB0
C9 IO17RSB0
C10 GBA2/IO25RSB0
C11 IO26RSB0
C12 GBC2/IO29RSB0
D1 IO91RSB1
D2 IO92RSB1
D3 IO93RSB1
D4 GAA2/IO51RSB1
D5 GAC0/IO06RSB0
D6 GAC1/IO07RSB0
D7 GBC0/IO19RSB0
D8 GBC1/IO20RSB0
D9 GBB2/IO27RSB0
D10 IO18RSB0
D11 IO28RSB0
D12 GCB1/IO37RSB0
E1 VCC
E2 GFC0/IO88RSB1
E3 GFC1/IO89RSB1
E4 VCCIB1
E5 IO52RSB1
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO35RSB0
E9 VCCIB0
E10 VCC
E11 GCA0/IO40RSB0
E12 IO30RSB0
F1 GFB0/IO86RSB1
F2 VCOMPLF
F3 GFB1/IO87RSB1
F4 IO90RSB1
F5 GND
F6 GND
F7 GND
F8 GCC0/IO36RSB0
F9 GCB0/IO38RSB0
F10 GND
F11 GCA1/IO39RSB0
F12 GCA2/IO41RSB0
FG144
Pin Number A3P060 Function
G1 GFA1/IO84RSB1
G2 GND
G3 VCCPLF
G4 GFA0/IO85RSB1
G5 GND
G6 GND
G7 GND
G8 GDC1/IO45RSB0
G9 IO32RSB0
G10 GCC2/IO43RSB0
G11 IO31RSB0
G12 GCB2/IO42RSB0
H1 VCC
H2 GFB2/IO82RSB1
H3 GFC2/IO81RSB1
H4 GEC1/IO77RSB1
H5 VCC
H6 IO34RSB0
H7 IO44RSB0
H8 GDB2/IO55RSB1
H9 GDC0/IO46RSB0
H10 VCCIB0
H11 IO33RSB0
H12 VCC
J1 GEB1/IO75RSB1
J2 IO78RSB1
J3 VCCIB1
J4 GEC0/IO76RSB1
J5 IO79RSB1
J6 IO80RSB1
J7 VCC
J8 TCK
J9 GDA2/IO54RSB1
J10 TDO
J11 GDA1/IO49RSB0
J12 GDB1/IO47RSB0
FG144
Pin Number A3P060 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-41
K1 GEB0/IO74RSB1
K2 GEA1/IO73RSB1
K3 GEA0/IO72RSB1
K4 GEA2/IO71RSB1
K5 IO65RSB1
K6 IO64RSB1
K7 GND
K8 IO57RSB1
K9 GDC2/IO56RSB1
K10 GND
K11 GDA0/IO50RSB0
K12 GDB0/IO48RSB0
L1 GND
L2 VMV1
L3 GEB2/IO70RSB1
L4 IO67RSB1
L5 VCCIB1
L6 IO62RSB1
L7 IO59RSB1
L8 IO58RSB1
L9 TMS
L10 VJTAG
L11 VMV1
L12 TRST
M1 GNDQ
M2 GEC2/IO69RSB1
M3 IO68RSB1
M4 IO66RSB1
M5 IO63RSB1
M6 IO61RSB1
M7 IO60RSB1
M8 NC
M9 TDI
M10 VCCIB1
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P060 Function
Package Pin Assignments
4-42 Revision 13
FG144
Pin Number A3P125 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO02RSB0
A4 GAB1/IO03RSB0
A5 IO11RSB0
A6 GND
A7 IO18RSB0
A8 VCC
A9 IO25RSB0
A10 GBA0/IO39RSB0
A11 GBA1/IO40RSB0
A12 GNDQ
B1 GAB2/IO69RSB1
B2 GND
B3 GAA0/IO00RSB0
B4 GAA1/IO01RSB0
B5 IO08RSB0
B6 IO14RSB0
B7 IO19RSB0
B8 IO22RSB0
B9 GBB0/IO37RSB0
B10 GBB1/IO38RSB0
B11 GND
B12 VMV0
C1 IO132RSB1
C2 GFA2/IO120RSB1
C3 GAC2/IO131RSB1
C4 VCC
C5 IO10RSB0
C6 IO12RSB0
C7 IO21RSB0
C8 IO24RSB0
C9 IO27RSB0
C10 GBA2/IO41RSB0
C11 IO42RSB0
C12 GBC2/IO45RSB0
D1 IO128RSB1
D2 IO129RSB1
D3 IO130RSB1
D4 GAA2/IO67RSB1
D5 GAC0/IO04RSB0
D6 GAC1/IO05RSB0
D7 GBC0/IO35RSB0
D8 GBC1/IO36RSB0
D9 GBB2/IO43RSB0
D10 IO28RSB0
D11 IO44RSB0
D12 GCB1/IO53RSB0
E1 VCC
E2 GFC0/IO125RSB1
E3 GFC1/IO126RSB1
E4 VCCIB1
E5 IO68RSB1
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO51RSB0
E9 VCCIB0
E10 VCC
E11 GCA0/IO56RSB0
E12 IO46RSB0
F1 GFB0/IO123RSB1
F2 VCOMPLF
F3 GFB1/IO124RSB1
F4 IO127RSB1
F5 GND
F6 GND
F7 GND
F8 GCC0/IO52RSB0
F9 GCB0/IO54RSB0
F10 GND
F11 GCA1/IO55RSB0
F12 GCA2/IO57RSB0
FG144
Pin Number A3P125 Function
G1 GFA1/IO121RSB1
G2 GND
G3 VCCPLF
G4 GFA0/IO122RSB1
G5 GND
G6 GND
G7 GND
G8 GDC1/IO61RSB0
G9 IO48RSB0
G10 GCC2/IO59RSB0
G11 IO47RSB0
G12 GCB2/IO58RSB0
H1 VCC
H2 GFB2/IO119RSB1
H3 GFC2/IO118RSB1
H4 GEC1/IO112RSB1
H5 VCC
H6 IO50RSB0
H7 IO60RSB0
H8 GDB2/IO71RSB1
H9 GDC0/IO62RSB0
H10 VCCIB0
H11 IO49RSB0
H12 VCC
J1 GEB1/IO110RSB1
J2 IO115RSB1
J3 VCCIB1
J4 GEC0/IO111RSB1
J5 IO116RSB1
J6 IO117RSB1
J7 VCC
J8 TCK
J9 GDA2/IO70RSB1
J10 TDO
J11 GDA1/IO65RSB0
J12 GDB1/IO63RSB0
FG144
Pin Number A3P125 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-43
K1 GEB0/IO109RSB1
K2 GEA1/IO108RSB1
K3 GEA0/IO107RSB1
K4 GEA2/IO106RSB1
K5 IO100RSB1
K6 IO98RSB1
K7 GND
K8 IO73RSB1
K9 GDC2/IO72RSB1
K10 GND
K11 GDA0/IO66RSB0
K12 GDB0/IO64RSB0
L1 GND
L2 VMV1
L3 GEB2/IO105RSB1
L4 IO102RSB1
L5 VCCIB1
L6 IO95RSB1
L7 IO85RSB1
L8 IO74RSB1
L9 TMS
L10 VJTAG
L11 VMV1
L12 TRST
M1 GNDQ
M2 GEC2/IO104RSB1
M3 IO103RSB1
M4 IO101RSB1
M5 IO97RSB1
M6 IO94RSB1
M7 IO86RSB1
M8 IO75RSB1
M9 TDI
M10 VCCIB1
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P125 Function
Package Pin Assignments
4-44 Revision 13
FG144
Pin Number A3P250 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO02RSB0
A4 GAB1/IO03RSB0
A5 IO16RSB0
A6 GND
A7 IO29RSB0
A8 VCC
A9 IO33RSB0
A10 GBA0/IO39RSB0
A11 GBA1/IO40RSB0
A12 GNDQ
B1 GAB2/IO117UDB3
B2 GND
B3 GAA0/IO00RSB0
B4 GAA1/IO01RSB0
B5 IO14RSB0
B6 IO19RSB0
B7 IO22RSB0
B8 IO30RSB0
B9 GBB0/IO37RSB0
B10 GBB1/IO38RSB0
B11 GND
B12 VMV1
C1 IO117VDB3
C2 GFA2/IO107PPB3
C3 GAC2/IO116UDB3
C4 VCC
C5 IO12RSB0
C6 IO17RSB0
C7 IO24RSB0
C8 IO31RSB0
C9 IO34RSB0
C10 GBA2/IO41PDB1
C11 IO41NDB1
C12 GBC2/IO43PPB1
D1 IO112NDB3
D2 IO112PDB3
D3 IO116VDB3
D4 GAA2/IO118UPB3
D5 GAC0/IO04RSB0
D6 GAC1/IO05RSB0
D7 GBC0/IO35RSB0
D8 GBC1/IO36RSB0
D9 GBB2/IO42PDB1
D10 IO42NDB1
D11 IO43NPB1
D12 GCB1/IO49PPB1
E1 VCC
E2 GFC0/IO110NDB3
E3 GFC1/IO110PDB3
E4 VCCIB3
E5 IO118VPB3
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO48PDB1
E9 VCCIB1
E10 VCC
E11 GCA0/IO50NDB1
E12 IO51NDB1
F1 GFB0/IO109NPB3
F2 VCOMPLF
F3 GFB1/IO109PPB3
F4 IO107NPB3
F5 GND
F6 GND
F7 GND
F8 GCC0/IO48NDB1
F9 GCB0/IO49NPB1
F10 GND
F11 GCA1/IO50PDB1
F12 GCA2/IO51PDB1
FG144
Pin Number A3P250 Function
G1 GFA1/IO108PPB3
G2 GND
G3 VCCPLF
G4 GFA0/IO108NPB3
G5 GND
G6 GND
G7 GND
G8 GDC1/IO58UPB1
G9 IO53NDB1
G10 GCC2/IO53PDB1
G11 IO52NDB1
G12 GCB2/IO52PDB1
H1 VCC
H2 GFB2/IO106PDB3
H3 GFC2/IO105PSB3
H4 GEC1/IO100PDB3
H5 VCC
H6 IO79RSB2
H7 IO65RSB2
H8 GDB2/IO62RSB2
H9 GDC0/IO58VPB1
H10 VCCIB1
H11 IO54PSB1
H12 VCC
J1 GEB1/IO99PDB3
J2 IO106NDB3
J3 VCCIB3
J4 GEC0/IO100NDB3
J5 IO88RSB2
J6 IO81RSB2
J7 VCC
J8 TCK
J9 GDA2/IO61RSB2
J10 TDO
J11 GDA1/IO60UDB1
J12 GDB1/IO59UDB1
FG144
Pin Number A3P250 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-45
K1 GEB0/IO99NDB3
K2 GEA1/IO98PDB3
K3 GEA0/IO98NDB3
K4 GEA2/IO97RSB2
K5 IO90RSB2
K6 IO84RSB2
K7 GND
K8 IO66RSB2
K9 GDC2/IO63RSB2
K10 GND
K11 GDA0/IO60VDB1
K12 GDB0/IO59VDB1
L1 GND
L2 VMV3
L3 GEB2/IO96RSB2
L4 IO91RSB2
L5 VCCIB2
L6 IO82RSB2
L7 IO80RSB2
L8 IO72RSB2
L9 TMS
L10 VJTAG
L11 VMV2
L12 TRST
M1 GNDQ
M2 GEC2/IO95RSB2
M3 IO92RSB2
M4 IO89RSB2
M5 IO87RSB2
M6 IO85RSB2
M7 IO78RSB2
M8 IO76RSB2
M9 TDI
M10 VCCIB2
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P250 Function
Package Pin Assignments
4-46 Revision 13
FG144
Pin Number A3P400 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO02RSB0
A4 GAB1/IO03RSB0
A5 IO16RSB0
A6 GND
A7 IO30RSB0
A8 VCC
A9 IO34RSB0
A10 GBA0/IO58RSB0
A11 GBA1/IO59RSB0
A12 GNDQ
B1 GAB2/IO154UDB3
B2 GND
B3 GAA0/IO00RSB0
B4 GAA1/IO01RSB0
B5 IO14RSB0
B6 IO19RSB0
B7 IO23RSB0
B8 IO31RSB0
B9 GBB0/IO56RSB0
B10 GBB1/IO57RSB0
B11 GND
B12 VMV1
C1 IO154VDB3
C2 GFA2/IO144PPB3
C3 GAC2/IO153UDB3
C4 VCC
C5 IO12RSB0
C6 IO17RSB0
C7 IO25RSB0
C8 IO32RSB0
C9 IO53RSB0
C10 GBA2/IO60PDB1
C11 IO60NDB1
C12 GBC2/IO62PPB1
D1 IO149NDB3
D2 IO149PDB3
D3 IO153VDB3
D4 GAA2/IO155UPB3
D5 GAC0/IO04RSB0
D6 GAC1/IO05RSB0
D7 GBC0/IO54RSB0
D8 GBC1/IO55RSB0
D9 GBB2/IO61PDB1
D10 IO61NDB1
D11 IO62NPB1
D12 GCB1/IO68PPB1
E1 VCC
E2 GFC0/IO147NDB3
E3 GFC1/IO147PDB3
E4 VCCIB3
E5 IO155VPB3
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO67PDB1
E9 VCCIB1
E10 VCC
E11 GCA0/IO69NDB1
E12 IO70NDB1
F1 GFB0/IO146NPB3
F2 VCOMPLF
F3 GFB1/IO146PPB3
F4 IO144NPB3
F5 GND
F6 GND
F7 GND
F8 GCC0/IO67NDB1
F9 GCB0/IO68NPB1
F10 GND
F11 GCA1/IO69PDB1
F12 GCA2/IO70PDB1
FG144
Pin Number A3P400 Function
G1 GFA1/IO145PPB3
G2 GND
G3 VCCPLF
G4 GFA0/IO145NPB3
G5 GND
G6 GND
G7 GND
G8 GDC1/IO77UPB1
G9 IO72NDB1
G10 GCC2/IO72PDB1
G11 IO71NDB1
G12 GCB2/IO71PDB1
H1 VCC
H2 GFB2/IO143PDB3
H3 GFC2/IO142PSB3
H4 GEC1/IO137PDB3
H5 VCC
H6 IO75PDB1
H7 IO75NDB1
H8 GDB2/IO81RSB2
H9 GDC0/IO77VPB1
H10 VCCIB1
H11 IO73PSB1
H12 VCC
J1 GEB1/IO136PDB3
J2 IO143NDB3
J3 VCCIB3
J4 GEC0/IO137NDB3
J5 IO125RSB2
J6 IO116RSB2
J7 VCC
J8 TCK
J9 GDA2/IO80RSB2
J10 TDO
J11 GDA1/IO79UDB1
J12 GDB1/IO78UDB1
FG144
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-47
K1 GEB0/IO136NDB3
K2 GEA1/IO135PDB3
K3 GEA0/IO135NDB3
K4 GEA2/IO134RSB2
K5 IO127RSB2
K6 IO121RSB2
K7 GND
K8 IO104RSB2
K9 GDC2/IO82RSB2
K10 GND
K11 GDA0/IO79VDB1
K12 GDB0/IO78VDB1
L1 GND
L2 VMV3
L3 GEB2/IO133RSB2
L4 IO128RSB2
L5 VCCIB2
L6 IO119RSB2
L7 IO114RSB2
L8 IO110RSB2
L9 TMS
L10 VJTAG
L11 VMV2
L12 TRST
M1 GNDQ
M2 GEC2/IO132RSB2
M3 IO129RSB2
M4 IO126RSB2
M5 IO124RSB2
M6 IO122RSB2
M7 IO117RSB2
M8 IO115RSB2
M9 TDI
M10 VCCIB2
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P400 Function
Package Pin Assignments
4-48 Revision 13
FG144
Pin Number A3P600 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO02RSB0
A4 GAB1/IO03RSB0
A5 IO10RSB0
A6 GND
A7 IO34RSB0
A8 VCC
A9 IO50RSB0
A10 GBA0/IO58RSB0
A11 GBA1/IO59RSB0
A12 GNDQ
B1 GAB2/IO173PDB3
B2 GND
B3 GAA0/IO00RSB0
B4 GAA1/IO01RSB0
B5 IO13RSB0
B6 IO19RSB0
B7 IO31RSB0
B8 IO39RSB0
B9 GBB0/IO56RSB0
B10 GBB1/IO57RSB0
B11 GND
B12 VMV1
C1 IO173NDB3
C2 GFA2/IO161PPB3
C3 GAC2/IO172PDB3
C4 VCC
C5 IO16RSB0
C6 IO25RSB0
C7 IO28RSB0
C8 IO42RSB0
C9 IO45RSB0
C10 GBA2/IO60PDB1
C11 IO60NDB1
C12 GBC2/IO62PPB1
D1 IO169PDB3
D2 IO169NDB3
D3 IO172NDB3
D4 GAA2/IO174PPB3
D5 GAC0/IO04RSB0
D6 GAC1/IO05RSB0
D7 GBC0/IO54RSB0
D8 GBC1/IO55RSB0
D9 GBB2/IO61PDB1
D10 IO61NDB1
D11 IO62NPB1
D12 GCB1/IO70PPB1
E1 VCC
E2 GFC0/IO164NDB3
E3 GFC1/IO164PDB3
E4 VCCIB3
E5 IO174NPB3
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO69PDB1
E9 VCCIB1
E10 VCC
E11 GCA0/IO71NDB1
E12 IO72NDB1
F1 GFB0/IO163NPB3
F2 VCOMPLF
F3 GFB1/IO163PPB3
F4 IO161NPB3
F5 GND
F6 GND
F7 GND
F8 GCC0/IO69NDB1
F9 GCB0/IO70NPB1
F10 GND
F11 GCA1/IO71PDB1
F12 GCA2/IO72PDB1
FG144
Pin Number A3P600 Function
G1 GFA1/IO162PPB3
G2 GND
G3 VCCPLF
G4 GFA0/IO162NPB3
G5 GND
G6 GND
G7 GND
G8 GDC1/IO86PPB1
G9 IO74NDB1
G10 GCC2/IO74PDB1
G11 IO73NDB1
G12 GCB2/IO73PDB1
H1 VCC
H2 GFB2/IO160PDB3
H3 GFC2/IO159PSB3
H4 GEC1/IO146PDB3
H5 VCC
H6 IO80PDB1
H7 IO80NDB1
H8 GDB2/IO90RSB2
H9 GDC0/IO86NPB1
H10 VCCIB1
H11 IO84PSB1
H12 VCC
J1 GEB1/IO145PDB3
J2 IO160NDB3
J3 VCCIB3
J4 GEC0/IO146NDB3
J5 IO129RSB2
J6 IO131RSB2
J7 VCC
J8 TCK
J9 GDA2/IO89RSB2
J10 TDO
J11 GDA1/IO88PDB1
J12 GDB1/IO87PDB1
FG144
Pin Number A3P600 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-49
K1 GEB0/IO145NDB3
K2 GEA1/IO144PDB3
K3 GEA0/IO144NDB3
K4 GEA2/IO143RSB2
K5 IO119RSB2
K6 IO111RSB2
K7 GND
K8 IO94RSB2
K9 GDC2/IO91RSB2
K10 GND
K11 GDA0/IO88NDB1
K12 GDB0/IO87NDB1
L1 GND
L2 VMV3
L3 GEB2/IO142RSB2
L4 IO136RSB2
L5 VCCIB2
L6 IO115RSB2
L7 IO103RSB2
L8 IO97RSB2
L9 TMS
L10 VJTAG
L11 VMV2
L12 TRST
M1 GNDQ
M2 GEC2/IO141RSB2
M3 IO138RSB2
M4 IO123RSB2
M5 IO126RSB2
M6 IO134RSB2
M7 IO108RSB2
M8 IO99RSB2
M9 TDI
M10 VCCIB2
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P600 Function
Package Pin Assignments
4-50 Revision 13
FG144
Pin Number A3P1000 Function
A1 GNDQ
A2 VMV0
A3 GAB0/IO02RSB0
A4 GAB1/IO03RSB0
A5 IO10RSB0
A6 GND
A7 IO44RSB0
A8 VCC
A9 IO69RSB0
A10 GBA0/IO76RSB0
A11 GBA1/IO77RSB0
A12 GNDQ
B1 GAB2/IO224PDB3
B2 GND
B3 GAA0/IO00RSB0
B4 GAA1/IO01RSB0
B5 IO13RSB0
B6 IO26RSB0
B7 IO35RSB0
B8 IO60RSB0
B9 GBB0/IO74RSB0
B10 GBB1/IO75RSB0
B11 GND
B12 VMV1
C1 IO224NDB3
C2 GFA2/IO206PPB3
C3 GAC2/IO223PDB3
C4 VCC
C5 IO16RSB0
C6 IO29RSB0
C7 IO32RSB0
C8 IO63RSB0
C9 IO66RSB0
C10 GBA2/IO78PDB1
C11 IO78NDB1
C12 GBC2/IO80PPB1
D1 IO213PDB3
D2 IO213NDB3
D3 IO223NDB3
D4 GAA2/IO225PPB3
D5 GAC0/IO04RSB0
D6 GAC1/IO05RSB0
D7 GBC0/IO72RSB0
D8 GBC1/IO73RSB0
D9 GBB2/IO79PDB1
D10 IO79NDB1
D11 IO80NPB1
D12 GCB1/IO92PPB1
E1 VCC
E2 GFC0/IO209NDB3
E3 GFC1/IO209PDB3
E4 VCCIB3
E5 IO225NPB3
E6 VCCIB0
E7 VCCIB0
E8 GCC1/IO91PDB1
E9 VCCIB1
E10 VCC
E11 GCA0/IO93NDB1
E12 IO94NDB1
F1 GFB0/IO208NPB3
F2 VCOMPLF
F3 GFB1/IO208PPB3
F4 IO206NPB3
F5 GND
F6 GND
F7 GND
F8 GCC0/IO91NDB1
F9 GCB0/IO92NPB1
F10 GND
F11 GCA1/IO93PDB1
F12 GCA2/IO94PDB1
FG144
Pin Number A3P1000 Function
G1 GFA1/IO207PPB3
G2 GND
G3 VCCPLF
G4 GFA0/IO207NPB3
G5 GND
G6 GND
G7 GND
G8 GDC1/IO111PPB1
G9 IO96NDB1
G10 GCC2/IO96PDB1
G11 IO95NDB1
G12 GCB2/IO95PDB1
H1 VCC
H2 GFB2/IO205PDB3
H3 GFC2/IO204PSB3
H4 GEC1/IO190PDB3
H5 VCC
H6 IO105PDB1
H7 IO105NDB1
H8 GDB2/IO115RSB2
H9 GDC0/IO111NPB1
H10 VCCIB1
H11 IO101PSB1
H12 VCC
J1 GEB1/IO189PDB3
J2 IO205NDB3
J3 VCCIB3
J4 GEC0/IO190NDB3
J5 IO160RSB2
J6 IO157RSB2
J7 VCC
J8 TCK
J9 GDA2/IO114RSB2
J10 TDO
J11 GDA1/IO113PDB1
J12 GDB1/IO112PDB1
FG144
Pin Number A3P1000 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-51
K1 GEB0/IO189NDB3
K2 GEA1/IO188PDB3
K3 GEA0/IO188NDB3
K4 GEA2/IO187RSB2
K5 IO169RSB2
K6 IO152RSB2
K7 GND
K8 IO117RSB2
K9 GDC2/IO116RSB2
K10 GND
K11 GDA0/IO113NDB1
K12 GDB0/IO112NDB1
L1 GND
L2 VMV3
L3 GEB2/IO186RSB2
L4 IO172RSB2
L5 VCCIB2
L6 IO153RSB2
L7 IO144RSB2
L8 IO140RSB2
L9 TMS
L10 VJTAG
L11 VMV2
L12 TRST
M1 GNDQ
M2 GEC2/IO185RSB2
M3 IO173RSB2
M4 IO168RSB2
M5 IO161RSB2
M6 IO156RSB2
M7 IO145RSB2
M8 IO141RSB2
M9 TDI
M10 VCCIB2
M11 VPUMP
M12 GNDQ
FG144
Pin Number A3P1000 Function
Package Pin Assignments
4-52 Revision 13
FG256
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Note: This is the bottom view of the package.
13579111315 246810121416
C
E
G
J
L
N
R
D
F
H
K
M
P
T
B
A
A1 Ball Pad Corner
ProASIC3 Flash Family FPGAs
Revision 13 4-53
FG256
Pin Number A3P250 Function
A1 GND
A2 GAA0/IO00RSB0
A3 GAA1/IO01RSB0
A4 GAB0/IO02RSB0
A5 IO07RSB0
A6 IO10RSB0
A7 IO11RSB0
A8 IO15RSB0
A9 IO20RSB0
A10 IO25RSB0
A11 IO29RSB0
A12 IO33RSB0
A13 GBB1/IO38RSB0
A14 GBA0/IO39RSB0
A15 GBA1/IO40RSB0
A16 GND
B1 GAB2/IO117UDB3
B2 GAA2/IO118UDB3
B3 NC
B4 GAB1/IO03RSB0
B5 IO06RSB0
B6 IO09RSB0
B7 IO12RSB0
B8 IO16RSB0
B9 IO21RSB0
B10 IO26RSB0
B11 IO30RSB0
B12 GBC1/IO36RSB0
B13 GBB0/IO37RSB0
B14 NC
B15 GBA2/IO41PDB1
B16 IO41NDB1
C1 IO117VDB3
C2 IO118VDB3
C3 NC
C4 NC
C5 GAC0/IO04RSB0
C6 GAC1/IO05RSB0
C7 IO13RSB0
C8 IO17RSB0
C9 IO22RSB0
C10 IO27RSB0
C11 IO31RSB0
C12 GBC0/IO35RSB0
C13 IO34RSB0
C14 NC
C15 IO42NPB1
C16 IO44PDB1
D1 IO114VDB3
D2 IO114UDB3
D3 GAC2/IO116UDB3
D4 NC
D5 GNDQ
D6 IO08RSB0
D7 IO14RSB0
D8 IO18RSB0
D9 IO23RSB0
D10 IO28RSB0
D11 IO32RSB0
D12 GNDQ
D13 NC
D14 GBB2/IO42PPB1
D15 NC
D16 IO44NDB1
E1 IO113PDB3
E2 NC
E3 IO116VDB3
E4 IO115UDB3
E5 VMV0
E6 VCCIB0
E7 VCCIB0
E8 IO19RSB0
FG256
Pin Number A3P250 Function
E9 IO24RSB0
E10 VCCIB0
E11 VCCIB0
E12 VMV1
E13 GBC2/IO43PDB1
E14 IO46RSB1
E15 NC
E16 IO45PDB1
F1 IO113NDB3
F2 IO112PPB3
F3 NC
F4 IO115VDB3
F5 VCCIB3
F6 GND
F7 VCC
F8 VCC
F9 VCC
F10 VCC
F11 GND
F12 VCCIB1
F13 IO43NDB1
F14 NC
F15 IO47PPB1
F16 IO45NDB1
G1 IO111NDB3
G2 IO111PDB3
G3 IO112NPB3
G4 GFC1/IO110PPB3
G5 VCCIB3
G6 VCC
G7 GND
G8 GND
G9 GND
G10 GND
G11 VCC
G12 VCCIB1
FG256
Pin Number A3P250 Function
Package Pin Assignments
4-54 Revision 13
G13 GCC1/IO48PPB1
G14 IO47NPB1
G15 IO54PDB1
G16 IO54NDB1
H1 GFB0/IO109NPB3
H2 GFA0/IO108NDB3
H3 GFB1/IO109PPB3
H4 VCOMPLF
H5 GFC0/IO110NPB3
H6 VCC
H7 GND
H8 GND
H9 GND
H10 GND
H11 VCC
H12 GCC0/IO48NPB1
H13 GCB1/IO49PPB1
H14 GCA0/IO50NPB1
H15 NC
H16 GCB0/IO49NPB1
J1 GFA2/IO107PPB3
J2 GFA1/IO108PDB3
J3 VCCPLF
J4 IO106NDB3
J5 GFB2/IO106PDB3
J6 VCC
J7 GND
J8 GND
J9 GND
J10 GND
J11 VCC
J12 GCB2/IO52PPB1
J13 GCA1/IO50PPB1
J14 GCC2/IO53PPB1
J15 NC
J16 GCA2/IO51PDB1
FG256
Pin Number A3P250 Function
K1 GFC2/IO105PDB3
K2 IO107NPB3
K3 IO104PPB3
K4 NC
K5 VCCIB3
K6 VCC
K7 GND
K8 GND
K9 GND
K10 GND
K11 VCC
K12 VCCIB1
K13 IO52NPB1
K14 IO55RSB1
K15 IO53NPB1
K16 IO51NDB1
L1 IO105NDB3
L2 IO104NPB3
L3 NC
L4 IO102RSB3
L5 VCCIB3
L6 GND
L7 VCC
L8 VCC
L9 VCC
L10 VCC
L11 GND
L12 VCCIB1
L13 GDB0/IO59VPB1
L14 IO57VDB1
L15 IO57UDB1
L16 IO56PDB1
M1 IO103PDB3
M2 NC
M3 IO101NPB3
M4 GEC0/IO100NPB3
FG256
Pin Number A3P250 Function
M5 VMV3
M6 VCCIB2
M7 VCCIB2
M8 NC
M9 IO74RSB2
M10 VCCIB2
M11 VCCIB2
M12 VMV2
M13 NC
M14 GDB1/IO59UPB1
M15 GDC1/IO58UDB1
M16 IO56NDB1
N1 IO103NDB3
N2 IO101PPB3
N3 GEC1/IO100PPB3
N4 NC
N5 GNDQ
N6 GEA2/IO97RSB2
N7 IO86RSB2
N8 IO82RSB2
N9 IO75RSB2
N10 IO69RSB2
N11 IO64RSB2
N12 GNDQ
N13 NC
N14 VJTAG
N15 GDC0/IO58VDB1
N16 GDA1/IO60UDB1
P1 GEB1/IO99PDB3
P2 GEB0/IO99NDB3
P3 NC
P4 NC
P5 IO92RSB2
P6 IO89RSB2
P7 IO85RSB2
P8 IO81RSB2
FG256
Pin Number A3P250 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-55
P9 IO76RSB2
P10 IO71RSB2
P11 IO66RSB2
P12 NC
P13 TCK
P14 VPUMP
P15 TRST
P16 GDA0/IO60VDB1
R1 GEA1/IO98PDB3
R2 GEA0/IO98NDB3
R3 NC
R4 GEC2/IO95RSB2
R5 IO91RSB2
R6 IO88RSB2
R7 IO84RSB2
R8 IO80RSB2
R9 IO77RSB2
R10 IO72RSB2
R11 IO68RSB2
R12 IO65RSB2
R13 GDB2/IO62RSB2
R14 TDI
R15 NC
R16 TDO
T1 GND
T2 IO94RSB2
T3 GEB2/IO96RSB2
T4 IO93RSB2
T5 IO90RSB2
T6 IO87RSB2
T7 IO83RSB2
T8 IO79RSB2
T9 IO78RSB2
T10 IO73RSB2
T11 IO70RSB2
T12 GDC2/IO63RSB2
FG256
Pin Number A3P250 Function
T13 IO67RSB2
T14 GDA2/IO61RSB2
T15 TMS
T16 GND
FG256
Pin Number A3P250 Function
Package Pin Assignments
4-56 Revision 13
FG256
Pin Number A3P400 Function
A1 GND
A2 GAA0/IO00RSB0
A3 GAA1/IO01RSB0
A4 GAB0/IO02RSB0
A5 IO16RSB0
A6 IO17RSB0
A7 IO22RSB0
A8 IO28RSB0
A9 IO34RSB0
A10 IO37RSB0
A11 IO41RSB0
A12 IO43RSB0
A13 GBB1/IO57RSB0
A14 GBA0/IO58RSB0
A15 GBA1/IO59RSB0
A16 GND
B1 GAB2/IO154UDB3
B2 GAA2/IO155UDB3
B3 IO12RSB0
B4 GAB1/IO03RSB0
B5 IO13RSB0
B6 IO14RSB0
B7 IO21RSB0
B8 IO27RSB0
B9 IO32RSB0
B10 IO38RSB0
B11 IO42RSB0
B12 GBC1/IO55RSB0
B13 GBB0/IO56RSB0
B14 IO44RSB0
B15 GBA2/IO60PDB1
B16 IO60NDB1
C1 IO154VDB3
C2 IO155VDB3
C3 IO11RSB0
C4 IO07RSB0
C5 GAC0/IO04RSB0
C6 GAC1/IO05RSB0
C7 IO20RSB0
C8 IO24RSB0
C9 IO33RSB0
C10 IO39RSB0
C11 IO45RSB0
C12 GBC0/IO54RSB0
C13 IO48RSB0
C14 VMV0
C15 IO61NPB1
C16 IO63PDB1
D1 IO151VDB3
D2 IO151UDB3
D3 GAC2/IO153UDB3
D4 IO06RSB0
D5 GNDQ
D6 IO10RSB0
D7 IO19RSB0
D8 IO26RSB0
D9 IO30RSB0
D10 IO40RSB0
D11 IO46RSB0
D12 GNDQ
D13 IO47RSB0
D14 GBB2/IO61PPB1
D15 IO53RSB0
D16 IO63NDB1
E1 IO150PDB3
E2 IO08RSB0
E3 IO153VDB3
E4 IO152VDB3
E5 VMV0
E6 VCCIB0
E7 VCCIB0
E8 IO25RSB0
FG256
Pin Number A3P400 Function
E9 IO31RSB0
E10 VCCIB0
E11 VCCIB0
E12 VMV1
E13 GBC2/IO62PDB1
E14 IO65RSB1
E15 IO52RSB0
E16 IO66PDB1
F1 IO150NDB3
F2 IO149NPB3
F3 IO09RSB0
F4 IO152UDB3
F5 VCCIB3
F6 GND
F7 VCC
F8 VCC
F9 VCC
F10 VCC
F11 GND
F12 VCCIB1
F13 IO62NDB1
F14 IO49RSB0
F15 IO64PPB1
F16 IO66NDB1
G1 IO148NDB3
G2 IO148PDB3
G3 IO149PPB3
G4 GFC1/IO147PPB3
G5 VCCIB3
G6 VCC
G7 GND
G8 GND
G9 GND
G10 GND
G11 VCC
G12 VCCIB1
FG256
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-57
G13 GCC1/IO67PPB1
G14 IO64NPB1
G15 IO73PDB1
G16 IO73NDB1
H1 GFB0/IO146NPB3
H2 GFA0/IO145NDB3
H3 GFB1/IO146PPB3
H4 VCOMPLF
H5 GFC0/IO147NPB3
H6 VCC
H7 GND
H8 GND
H9 GND
H10 GND
H11 VCC
H12 GCC0/IO67NPB1
H13 GCB1/IO68PPB1
H14 GCA0/IO69NPB1
H15 NC
H16 GCB0/IO68NPB1
J1 GFA2/IO144PPB3
J2 GFA1/IO145PDB3
J3 VCCPLF
J4 IO143NDB3
J5 GFB2/IO143PDB3
J6 VCC
J7 GND
J8 GND
J9 GND
J10 GND
J11 VCC
J12 GCB2/IO71PPB1
J13 GCA1/IO69PPB1
J14 GCC2/IO72PPB1
J15 NC
J16 GCA2/IO70PDB1
FG256
Pin Number A3P400 Function
K1 GFC2/IO142PDB3
K2 IO144NPB3
K3 IO141PPB3
K4 IO120RSB2
K5 VCCIB3
K6 VCC
K7 GND
K8 GND
K9 GND
K10 GND
K11 VCC
K12 VCCIB1
K13 IO71NPB1
K14 IO74RSB1
K15 IO72NPB1
K16 IO70NDB1
L1 IO142NDB3
L2 IO141NPB3
L3 IO125RSB2
L4 IO139RSB3
L5 VCCIB3
L6 GND
L7 VCC
L8 VCC
L9 VCC
L10 VCC
L11 GND
L12 VCCIB1
L13 GDB0/IO78VPB1
L14 IO76VDB1
L15 IO76UDB1
L16 IO75PDB1
M1 IO140PDB3
M2 IO130RSB2
M3 IO138NPB3
M4 GEC0/IO137NPB3
FG256
Pin Number A3P400 Function
M5 VMV3
M6 VCCIB2
M7 VCCIB2
M8 IO108RSB2
M9 IO101RSB2
M10 VCCIB2
M11 VCCIB2
M12 VMV2
M13 IO83RSB2
M14 GDB1/IO78UPB1
M15 GDC1/IO77UDB1
M16 IO75NDB1
N1 IO140NDB3
N2 IO138PPB3
N3 GEC1/IO137PPB3
N4 IO131RSB2
N5 GNDQ
N6 GEA2/IO134RSB2
N7 IO117RSB2
N8 IO111RSB2
N9 IO99RSB2
N10 IO94RSB2
N11 IO87RSB2
N12 GNDQ
N13 IO93RSB2
N14 VJTAG
N15 GDC0/IO77VDB1
N16 GDA1/IO79UDB1
P1 GEB1/IO136PDB3
P2 GEB0/IO136NDB3
P3 VMV2
P4 IO129RSB2
P5 IO128RSB2
P6 IO122RSB2
P7 IO115RSB2
P8 IO110RSB2
FG256
Pin Number A3P400 Function
Package Pin Assignments
4-58 Revision 13
P9 IO98RSB2
P10 IO95RSB2
P11 IO88RSB2
P12 IO84RSB2
P13 TCK
P14 VPUMP
P15 TRST
P16 GDA0/IO79VDB1
R1 GEA1/IO135PDB3
R2 GEA0/IO135NDB3
R3 IO127RSB2
R4 GEC2/IO132RSB2
R5 IO123RSB2
R6 IO118RSB2
R7 IO112RSB2
R8 IO106RSB2
R9 IO100RSB2
R10 IO96RSB2
R11 IO89RSB2
R12 IO85RSB2
R13 GDB2/IO81RSB2
R14 TDI
R15 NC
R16 TDO
T1 GND
T2 IO126RSB2
T3 GEB2/IO133RSB2
T4 IO124RSB2
T5 IO116RSB2
T6 IO113RSB2
T7 IO107RSB2
T8 IO105RSB2
T9 IO102RSB2
T10 IO97RSB2
T11 IO92RSB2
T12 GDC2/IO82RSB2
FG256
Pin Number A3P400 Function
T13 IO86RSB2
T14 GDA2/IO80RSB2
T15 TMS
T16 GND
FG256
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-59
FG256
Pin Number A3P600 Function
A1 GND
A2 GAA0/IO00RSB0
A3 GAA1/IO01RSB0
A4 GAB0/IO02RSB0
A5 IO11RSB0
A6 IO16RSB0
A7 IO18RSB0
A8 IO28RSB0
A9 IO34RSB0
A10 IO37RSB0
A11 IO41RSB0
A12 IO43RSB0
A13 GBB1/IO57RSB0
A14 GBA0/IO58RSB0
A15 GBA1/IO59RSB0
A16 GND
B1 GAB2/IO173PDB3
B2 GAA2/IO174PDB3
B3 GNDQ
B4 GAB1/IO03RSB0
B5 IO13RSB0
B6 IO14RSB0
B7 IO21RSB0
B8 IO27RSB0
B9 IO32RSB0
B10 IO38RSB0
B11 IO42RSB0
B12 GBC1/IO55RSB0
B13 GBB0/IO56RSB0
B14 IO52RSB0
B15 GBA2/IO60PDB1
B16 IO60NDB1
C1 IO173NDB3
C2 IO174NDB3
C3 VMV3
C4 IO07RSB0
C5 GAC0/IO04RSB0
C6 GAC1/IO05RSB0
C7 IO20RSB0
C8 IO24RSB0
C9 IO33RSB0
C10 IO39RSB0
C11 IO44RSB0
C12 GBC0/IO54RSB0
C13 IO51RSB0
C14 VMV0
C15 IO61NPB1
C16 IO63PDB1
D1 IO171NDB3
D2 IO171PDB3
D3 GAC2/IO172PDB3
D4 IO06RSB0
D5 GNDQ
D6 IO10RSB0
D7 IO19RSB0
D8 IO26RSB0
D9 IO30RSB0
D10 IO40RSB0
D11 IO45RSB0
D12 GNDQ
D13 IO50RSB0
D14 GBB2/IO61PPB1
D15 IO53RSB0
D16 IO63NDB1
E1 IO166PDB3
E2 IO167NPB3
E3 IO172NDB3
E4 IO169NDB3
E5 VMV0
E6 VCCIB0
E7 VCCIB0
E8 IO25RSB0
FG256
Pin Number A3P600 Function
E9 IO31RSB0
E10 VCCIB0
E11 VCCIB0
E12 VMV1
E13 GBC2/IO62PDB1
E14 IO67PPB1
E15 IO64PPB1
E16 IO66PDB1
F1 IO166NDB3
F2 IO168NPB3
F3 IO167PPB3
F4 IO169PDB3
F5 VCCIB3
F6 GND
F7 VCC
F8 VCC
F9 VCC
F10 VCC
F11 GND
F12 VCCIB1
F13 IO62NDB1
F14 IO64NPB1
F15 IO65PPB1
F16 IO66NDB1
G1 IO165NDB3
G2 IO165PDB3
G3 IO168PPB3
G4 GFC1/IO164PPB3
G5 VCCIB3
G6 VCC
G7 GND
G8 GND
G9 GND
G10 GND
G11 VCC
G12 VCCIB1
FG256
Pin Number A3P600 Function
Package Pin Assignments
4-60 Revision 13
G13 GCC1/IO69PPB1
G14 IO65NPB1
G15 IO75PDB1
G16 IO75NDB1
H1 GFB0/IO163NPB3
H2 GFA0/IO162NDB3
H3 GFB1/IO163PPB3
H4 VCOMPLF
H5 GFC0/IO164NPB3
H6 VCC
H7 GND
H8 GND
H9 GND
H10 GND
H11 VCC
H12 GCC0/IO69NPB1
H13 GCB1/IO70PPB1
H14 GCA0/IO71NPB1
H15 IO67NPB1
H16 GCB0/IO70NPB1
J1 GFA2/IO161PPB3
J2 GFA1/IO162PDB3
J3 VCCPLF
J4 IO160NDB3
J5 GFB2/IO160PDB3
J6 VCC
J7 GND
J8 GND
J9 GND
J10 GND
J11 VCC
J12 GCB2/IO73PPB1
J13 GCA1/IO71PPB1
J14 GCC2/IO74PPB1
J15 IO80PPB1
J16 GCA2/IO72PDB1
FG256
Pin Number A3P600 Function
K1 GFC2/IO159PDB3
K2 IO161NPB3
K3 IO156PPB3
K4 IO129RSB2
K5 VCCIB3
K6 VCC
K7 GND
K8 GND
K9 GND
K10 GND
K11 VCC
K12 VCCIB1
K13 IO73NPB1
K14 IO80NPB1
K15 IO74NPB1
K16 IO72NDB1
L1 IO159NDB3
L2 IO156NPB3
L3 IO151PPB3
L4 IO158PSB3
L5 VCCIB3
L6 GND
L7 VCC
L8 VCC
L9 VCC
L10 VCC
L11 GND
L12 VCCIB1
L13 GDB0/IO87NPB1
L14 IO85NDB1
L15 IO85PDB1
L16 IO84PDB1
M1 IO150PDB3
M2 IO151NPB3
M3 IO147NPB3
M4 GEC0/IO146NPB3
FG256
Pin Number A3P600 Function
M5 VMV3
M6 VCCIB2
M7 VCCIB2
M8 IO117RSB2
M9 IO110RSB2
M10 VCCIB2
M11 VCCIB2
M12 VMV2
M13 IO94RSB2
M14 GDB1/IO87PPB1
M15 GDC1/IO86PDB1
M16 IO84NDB1
N1 IO150NDB3
N2 IO147PPB3
N3 GEC1/IO146PPB3
N4 IO140RSB2
N5 GNDQ
N6 GEA2/IO143RSB2
N7 IO126RSB2
N8 IO120RSB2
N9 IO108RSB2
N10 IO103RSB2
N11 IO99RSB2
N12 GNDQ
N13 IO92RSB2
N14 VJTAG
N15 GDC0/IO86NDB1
N16 GDA1/IO88PDB1
P1 GEB1/IO145PDB3
P2 GEB0/IO145NDB3
P3 VMV2
P4 IO138RSB2
P5 IO136RSB2
P6 IO131RSB2
P7 IO124RSB2
P8 IO119RSB2
FG256
Pin Number A3P600 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-61
P9 IO107RSB2
P10 IO104RSB2
P11 IO97RSB2
P12 VMV1
P13 TCK
P14 VPUMP
P15 TRST
P16 GDA0/IO88NDB1
R1 GEA1/IO144PDB3
R2 GEA0/IO144NDB3
R3 IO139RSB2
R4 GEC2/IO141RSB2
R5 IO132RSB2
R6 IO127RSB2
R7 IO121RSB2
R8 IO114RSB2
R9 IO109RSB2
R10 IO105RSB2
R11 IO98RSB2
R12 IO96RSB2
R13 GDB2/IO90RSB2
R14 TDI
R15 GNDQ
R16 TDO
T1 GND
T2 IO137RSB2
T3 GEB2/IO142RSB2
T4 IO134RSB2
T5 IO125RSB2
T6 IO123RSB2
T7 IO118RSB2
T8 IO115RSB2
T9 IO111RSB2
T10 IO106RSB2
T11 IO102RSB2
T12 GDC2/IO91RSB2
FG256
Pin Number A3P600 Function
T13 IO93RSB2
T14 GDA2/IO89RSB2
T15 TMS
T16 GND
FG256
Pin Number A3P600 Function
Package Pin Assignments
4-62 Revision 13
FG256
Pin Number A3P1000 Function
A1 GND
A2 GAA0/IO00RSB0
A3 GAA1/IO01RSB0
A4 GAB0/IO02RSB0
A5 IO16RSB0
A6 IO22RSB0
A7 IO28RSB0
A8 IO35RSB0
A9 IO45RSB0
A10 IO50RSB0
A11 IO55RSB0
A12 IO61RSB0
A13 GBB1/IO75RSB0
A14 GBA0/IO76RSB0
A15 GBA1/IO77RSB0
A16 GND
B1 GAB2/IO224PDB3
B2 GAA2/IO225PDB3
B3 GNDQ
B4 GAB1/IO03RSB0
B5 IO17RSB0
B6 IO21RSB0
B7 IO27RSB0
B8 IO34RSB0
B9 IO44RSB0
B10 IO51RSB0
B11 IO57RSB0
B12 GBC1/IO73RSB0
B13 GBB0/IO74RSB0
B14 IO71RSB0
B15 GBA2/IO78PDB1
B16 IO81PDB1
C1 IO224NDB3
C2 IO225NDB3
C3 VMV3
C4 IO11RSB0
C5 GAC0/IO04RSB0
C6 GAC1/IO05RSB0
C7 IO25RSB0
C8 IO36RSB0
C9 IO42RSB0
C10 IO49RSB0
C11 IO56RSB0
C12 GBC0/IO72RSB0
C13 IO62RSB0
C14 VMV0
C15 IO78NDB1
C16 IO81NDB1
D1 IO222NDB3
D2 IO222PDB3
D3 GAC2/IO223PDB3
D4 IO223NDB3
D5 GNDQ
D6 IO23RSB0
D7 IO29RSB0
D8 IO33RSB0
D9 IO46RSB0
D10 IO52RSB0
D11 IO60RSB0
D12 GNDQ
D13 IO80NDB1
D14 GBB2/IO79PDB1
D15 IO79NDB1
D16 IO82NSB1
E1 IO217PDB3
E2 IO218PDB3
E3 IO221NDB3
E4 IO221PDB3
E5 VMV0
E6 VCCIB0
E7 VCCIB0
E8 IO38RSB0
E9 IO47RSB0
E10 VCCIB0
E11 VCCIB0
E12 VMV1
FG256
Pin Number A3P1000 Function
E13 GBC2/IO80PDB1
E14 IO83PPB1
E15 IO86PPB1
E16 IO87PDB1
F1 IO217NDB3
F2 IO218NDB3
F3 IO216PDB3
F4 IO216NDB3
F5 VCCIB3
F6 GND
F7 VCC
F8 VCC
F9 VCC
F10 VCC
F11 GND
F12 VCCIB1
F13 IO83NPB1
F14 IO86NPB1
F15 IO90PPB1
F16 IO87NDB1
G1 IO210PSB3
G2 IO213NDB3
G3 IO213PDB3
G4 GFC1/IO209PPB3
G5 VCCIB3
G6 VCC
G7 GND
G8 GND
G9 GND
G10 GND
G11 VCC
G12 VCCIB1
G13 GCC1/IO91PPB1
G14 IO90NPB1
G15 IO88PDB1
G16 IO88NDB1
H1 GFB0/IO208NPB3
H2 GFA0/IO207NDB3
FG256
Pin Number A3P1000 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-63
H3 GFB1/IO208PPB3
H4 VCOMPLF
H5 GFC0/IO209NPB3
H6 VCC
H7 GND
H8 GND
H9 GND
H10 GND
H11 VCC
H12 GCC0/IO91NPB1
H13 GCB1/IO92PPB1
H14 GCA0/IO93NPB1
H15 IO96NPB1
H16 GCB0/IO92NPB1
J1 GFA2/IO206PSB3
J2 GFA1/IO207PDB3
J3 VCCPLF
J4 IO205NDB3
J5 GFB2/IO205PDB3
J6 VCC
J7 GND
J8 GND
J9 GND
J10 GND
J11 VCC
J12 GCB2/IO95PPB1
J13 GCA1/IO93PPB1
J14 GCC2/IO96PPB1
J15 IO100PPB1
J16 GCA2/IO94PSB1
K1 GFC2/IO204PDB3
K2 IO204NDB3
K3 IO203NDB3
K4 IO203PDB3
K5 VCCIB3
K6 VCC
K7 GND
K8 GND
FG256
Pin Number A3P1000 Function
K9 GND
K10 GND
K11 VCC
K12 VCCIB1
K13 IO95NPB1
K14 IO100NPB1
K15 IO102NDB1
K16 IO102PDB1
L1 IO202NDB3
L2 IO202PDB3
L3 IO196PPB3
L4 IO193PPB3
L5 VCCIB3
L6 GND
L7 VCC
L8 VCC
L9 VCC
L10 VCC
L11 GND
L12 VCCIB1
L13 GDB0/IO112NPB1
L14 IO106NDB1
L15 IO106PDB1
L16 IO107PDB1
M1 IO197NSB3
M2 IO196NPB3
M3 IO193NPB3
M4 GEC0/IO190NPB3
M5 VMV3
M6 VCCIB2
M7 VCCIB2
M8 IO147RSB2
M9 IO136RSB2
M10 VCCIB2
M11 VCCIB2
M12 VMV2
M13 IO110NDB1
M14 GDB1/IO112PPB1
FG256
Pin Number A3P1000 Function
M15 GDC1/IO111PDB1
M16 IO107NDB1
N1 IO194PSB3
N2 IO192PPB3
N3 GEC1/IO190PPB3
N4 IO192NPB3
N5 GNDQ
N6 GEA2/IO187RSB2
N7 IO161RSB2
N8 IO155RSB2
N9 IO141RSB2
N10 IO129RSB2
N11 IO124RSB2
N12 GNDQ
N13 IO110PDB1
N14 VJTAG
N15 GDC0/IO111NDB1
N16 GDA1/IO113PDB1
P1 GEB1/IO189PDB3
P2 GEB0/IO189NDB3
P3 VMV2
P4 IO179RSB2
P5 IO171RSB2
P6 IO165RSB2
P7 IO159RSB2
P8 IO151RSB2
P9 IO137RSB2
P10 IO134RSB2
P11 IO128RSB2
P12 VMV1
P13 TCK
P14 VPUMP
P15 TRST
P16 GDA0/IO113NDB1
R1 GEA1/IO188PDB3
R2 GEA0/IO188NDB3
R3 IO184RSB2
R4 GEC2/IO185RSB2
FG256
Pin Number A3P1000 Function
Package Pin Assignments
4-64 Revision 13
R5 IO168RSB2
R6 IO163RSB2
R7 IO157RSB2
R8 IO149RSB2
R9 IO143RSB2
R10 IO138RSB2
R11 IO131RSB2
R12 IO125RSB2
R13 GDB2/IO115RSB2
R14 TDI
R15 GNDQ
R16 TDO
T1 GND
T2 IO183RSB2
T3 GEB2/IO186RSB2
T4 IO172RSB2
T5 IO170RSB2
T6 IO164RSB2
T7 IO158RSB2
T8 IO153RSB2
T9 IO142RSB2
T10 IO135RSB2
T11 IO130RSB2
T12 GDC2/IO116RSB2
T13 IO120RSB2
T14 GDA2/IO114RSB2
T15 TMS
T16 GND
FG256
Pin Number A3P1000 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-65
FG484
Note
For Package Manufacturing and Environmental information, visit the Resource Center at
http://www.microsemi.com/soc/products/solutions/package/docs.aspx.
Note: This is the bottom view of the package.
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
12345678910111213141516171819202122
A1 Ball Pad Corner
Package Pin Assignments
4-66 Revision 13
FG484
Pin Number A3P400 Function
A1 GND
A2 GND
A3 VCCIB0
A4 NC
A5 NC
A6 IO15RSB0
A7 IO18RSB0
A8 NC
A9 NC
A10 IO23RSB0
A11 IO29RSB0
A12 IO35RSB0
A13 IO36RSB0
A14 NC
A15 NC
A16 IO50RSB0
A17 IO51RSB0
A18 NC
A19 NC
A20 VCCIB0
A21 GND
A22 GND
B1 GND
B2 VCCIB3
B3 NC
B4 NC
B5 NC
B6 NC
B7 NC
B8 NC
B9 NC
B10 NC
B11 NC
B12 NC
B13 NC
B14 NC
B15 NC
B16 NC
B17 NC
B18 NC
B19 NC
B20 NC
B21 VCCIB1
B22 GND
C1 VCCIB3
C2 NC
C3 NC
C4 NC
C5 GND
C6 NC
C7 NC
C8 VCC
C9 VCC
C10 NC
C11 NC
C12 NC
C13 NC
C14 VCC
C15 VCC
C16 NC
C17 NC
C18 GND
C19 NC
C20 NC
C21 NC
C22 VCCIB1
D1 NC
D2 NC
D3 NC
D4 GND
D5 GAA0/IO00RSB0
D6 GAA1/IO01RSB0
FG484
Pin Number A3P400 Function
D7 GAB0/IO02RSB0
D8 IO16RSB0
D9 IO17RSB0
D10 IO22RSB0
D11 IO28RSB0
D12 IO34RSB0
D13 IO37RSB0
D14 IO41RSB0
D15 IO43RSB0
D16 GBB1/IO57RSB0
D17 GBA0/IO58RSB0
D18 GBA1/IO59RSB0
D19 GND
D20 NC
D21 NC
D22 NC
E1 NC
E2 NC
E3 GND
E4 GAB2/IO154UDB3
E5 GAA2/IO155UDB3
E6 IO12RSB0
E7 GAB1/IO03RSB0
E8 IO13RSB0
E9 IO14RSB0
E10 IO21RSB0
E11 IO27RSB0
E12 IO32RSB0
E13 IO38RSB0
E14 IO42RSB0
E15 GBC1/IO55RSB0
E16 GBB0/IO56RSB0
E17 IO44RSB0
E18 GBA2/IO60PDB1
E19 IO60NDB1
E20 GND
FG484
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-67
E21 NC
E22 NC
F1 NC
F2 NC
F3 NC
F4 IO154VDB3
F5 IO155VDB3
F6 IO11RSB0
F7 IO07RSB0
F8 GAC0/IO04RSB0
F9 GAC1/IO05RSB0
F10 IO20RSB0
F11 IO24RSB0
F12 IO33RSB0
F13 IO39RSB0
F14 IO45RSB0
F15 GBC0/IO54RSB0
F16 IO48RSB0
F17 VMV0
F18 IO61NPB1
F19 IO63PDB1
F20 NC
F21 NC
F22 NC
G1 NC
G2 NC
G3 NC
G4 IO151VDB3
G5 IO151UDB3
G6 GAC2/IO153UDB3
G7 IO06RSB0
G8 GNDQ
G9 IO10RSB0
G10 IO19RSB0
G11 IO26RSB0
G12 IO30RSB0
FG484
Pin Number A3P400 Function
G13 IO40RSB0
G14 IO46RSB0
G15 GNDQ
G16 IO47RSB0
G17 GBB2/IO61PPB1
G18 IO53RSB0
G19 IO63NDB1
G20 NC
G21 NC
G22 NC
H1 NC
H2 NC
H3 VCC
H4 IO150PDB3
H5 IO08RSB0
H6 IO153VDB3
H7 IO152VDB3
H8 VMV0
H9 VCCIB0
H10 VCCIB0
H11 IO25RSB0
H12 IO31RSB0
H13 VCCIB0
H14 VCCIB0
H15 VMV1
H16 GBC2/IO62PDB1
H17 IO65RSB1
H18 IO52RSB0
H19 IO66PDB1
H20 VCC
H21 NC
H22 NC
J1 NC
J2 NC
J3 NC
J4 IO150NDB3
FG484
Pin Number A3P400 Function
J5 IO149NPB3
J6 IO09RSB0
J7 IO152UDB3
J8 VCCIB3
J9 GND
J10 VCC
J11 VCC
J12 VCC
J13 VCC
J14 GND
J15 VCCIB1
J16 IO62NDB1
J17 IO49RSB0
J18 IO64PPB1
J19 IO66NDB1
J20 NC
J21 NC
J22 NC
K1 NC
K2 NC
K3 NC
K4 IO148NDB3
K5 IO148PDB3
K6 IO149PPB3
K7 GFC1/IO147PPB3
K8 VCCIB3
K9 VCC
K10 GND
K11 GND
K12 GND
K13 GND
K14 VCC
K15 VCCIB1
K16 GCC1/IO67PPB1
K17 IO64NPB1
K18 IO73PDB1
FG484
Pin Number A3P400 Function
Package Pin Assignments
4-68 Revision 13
K19 IO73NDB1
K20 NC
K21 NC
K22 NC
L1 NC
L2 NC
L3 NC
L4 GFB0/IO146NPB3
L5 GFA0/IO145NDB3
L6 GFB1/IO146PPB3
L7 VCOMPLF
L8 GFC0/IO147NPB3
L9 VCC
L10 GND
L11 GND
L12 GND
L13 GND
L14 VCC
L15 GCC0/IO67NPB1
L16 GCB1/IO68PPB1
L17 GCA0/IO69NPB1
L18 NC
L19 GCB0/IO68NPB1
L20 NC
L21 NC
L22 NC
M1 NC
M2 NC
M3 NC
M4 GFA2/IO144PPB3
M5 GFA1/IO145PDB3
M6 VCCPLF
M7 IO143NDB3
M8 GFB2/IO143PDB3
M9 VCC
M10 GND
FG484
Pin Number A3P400 Function
M11 GND
M12 GND
M13 GND
M14 VCC
M15 GCB2/IO71PPB1
M16 GCA1/IO69PPB1
M17 GCC2/IO72PPB1
M18 NC
M19 GCA2/IO70PDB1
M20 NC
M21 NC
M22 NC
N1 NC
N2 NC
N3 NC
N4 GFC2/IO142PDB3
N5 IO144NPB3
N6 IO141PPB3
N7 IO120RSB2
N8 VCCIB3
N9 VCC
N10 GND
N11 GND
N12 GND
N13 GND
N14 VCC
N15 VCCIB1
N16 IO71NPB1
N17 IO74RSB1
N18 IO72NPB1
N19 IO70NDB1
N20 NC
N21 NC
N22 NC
P1 NC
P2 NC
FG484
Pin Number A3P400 Function
P3 NC
P4 IO142NDB3
P5 IO141NPB3
P6 IO125RSB2
P7 IO139RSB3
P8 VCCIB3
P9 GND
P10 VCC
P11 VCC
P12 VCC
P13 VCC
P14 GND
P15 VCCIB1
P16 GDB0/IO78VPB1
P17 IO76VDB1
P18 IO76UDB1
P19 IO75PDB1
P20 NC
P21 NC
P22 NC
R1 NC
R2 NC
R3 VCC
R4 IO140PDB3
R5 IO130RSB2
R6 IO138NPB3
R7 GEC0/IO137NPB3
R8 VMV3
R9 VCCIB2
R10 VCCIB2
R11 IO108RSB2
R12 IO101RSB2
R13 VCCIB2
R14 VCCIB2
R15 VMV2
R16 IO83RSB2
FG484
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-69
R17 GDB1/IO78UPB1
R18 GDC1/IO77UDB1
R19 IO75NDB1
R20 VCC
R21 NC
R22 NC
T1 NC
T2 NC
T3 NC
T4 IO140NDB3
T5 IO138PPB3
T6 GEC1/IO137PPB3
T7 IO131RSB2
T8 GNDQ
T9 GEA2/IO134RSB2
T10 IO117RSB2
T11 IO111RSB2
T12 IO99RSB2
T13 IO94RSB2
T14 IO87RSB2
T15 GNDQ
T16 IO93RSB2
T17 VJTAG
T18 GDC0/IO77VDB1
T19 GDA1/IO79UDB1
T20 NC
T21 NC
T22 NC
U1 NC
U2 NC
U3 NC
U4 GEB1/IO136PDB3
U5 GEB0/IO136NDB3
U6 VMV2
U7 IO129RSB2
U8 IO128RSB2
FG484
Pin Number A3P400 Function
U9 IO122RSB2
U10 IO115RSB2
U11 IO110RSB2
U12 IO98RSB2
U13 IO95RSB2
U14 IO88RSB2
U15 IO84RSB2
U16 TCK
U17 VPUMP
U18 TRST
U19 GDA0/IO79VDB1
U20 NC
U21 NC
U22 NC
V1 NC
V2 NC
V3 GND
V4 GEA1/IO135PDB3
V5 GEA0/IO135NDB3
V6 IO127RSB2
V7 GEC2/IO132RSB2
V8 IO123RSB2
V9 IO118RSB2
V10 IO112RSB2
V11 IO106RSB2
V12 IO100RSB2
V13 IO96RSB2
V14 IO89RSB2
V15 IO85RSB2
V16 GDB2/IO81RSB2
V17 TDI
V18 NC
V19 TDO
V20 GND
V21 NC
V22 NC
FG484
Pin Number A3P400 Function
W1 NC
W2 NC
W3 NC
W4 GND
W5 IO126RSB2
W6 GEB2/IO133RSB2
W7 IO124RSB2
W8 IO116RSB2
W9 IO113RSB2
W10 IO107RSB2
W11 IO105RSB2
W12 IO102RSB2
W13 IO97RSB2
W14 IO92RSB2
W15 GDC2/IO82RSB2
W16 IO86RSB2
W17 GDA2/IO80RSB2
W18 TMS
W19 GND
W20 NC
W21 NC
W22 NC
Y1 VCCIB3
Y2 NC
Y3 NC
Y4 NC
Y5 GND
Y6 NC
Y7 NC
Y8 VCC
Y9 VCC
Y10 NC
Y11 NC
Y12 NC
Y13 NC
Y14 VCC
FG484
Pin Number A3P400 Function
Package Pin Assignments
4-70 Revision 13
Y15 VCC
Y16 NC
Y17 NC
Y18 GND
Y19 NC
Y20 NC
Y21 NC
Y22 VCCIB1
AA1 GND
AA2 VCCIB3
AA3 NC
AA4 NC
AA5 NC
AA6 NC
AA7 NC
AA8 NC
AA9 NC
AA10 NC
AA11 NC
AA12 NC
AA13 NC
AA14 NC
AA15 NC
AA16 NC
AA17 NC
AA18 NC
AA19 NC
AA20 NC
AA21 VCCIB1
AA22 GND
AB1 GND
AB2 GND
AB3 VCCIB2
AB4 NC
AB5 NC
AB6 IO121RSB2
FG484
Pin Number A3P400 Function
AB7 IO119RSB2
AB8 IO114RSB2
AB9 IO109RSB2
AB10 NC
AB11 NC
AB12 IO104RSB2
AB13 IO103RSB2
AB14 NC
AB15 NC
AB16 IO91RSB2
AB17 IO90RSB2
AB18 NC
AB19 NC
AB20 VCCIB2
AB21 GND
AB22 GND
FG484
Pin Number A3P400 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-71
FG484
Pin Number A3P600 Function
A1 GND
A2 GND
A3 VCCIB0
A4 NC
A5 NC
A6 IO09RSB0
A7 IO15RSB0
A8 NC
A9 NC
A10 IO22RSB0
A11 IO23RSB0
A12 IO29RSB0
A13 IO35RSB0
A14 NC
A15 NC
A16 IO46RSB0
A17 IO48RSB0
A18 NC
A19 NC
A20 VCCIB0
A21 GND
A22 GND
B1 GND
B2 VCCIB3
B3 NC
B4 NC
B5 NC
B6 IO08RSB0
B7 IO12RSB0
B8 NC
B9 NC
B10 IO17RSB0
B11 NC
B12 NC
B13 IO36RSB0
B14 NC
B15 NC
B16 IO47RSB0
B17 IO49RSB0
B18 NC
B19 NC
B20 NC
B21 VCCIB1
B22 GND
C1 VCCIB3
C2 NC
C3 NC
C4 NC
C5 GND
C6 NC
C7 NC
C8 VCC
C9 VCC
C10 NC
C11 NC
C12 NC
C13 NC
C14 VCC
C15 VCC
C16 NC
C17 NC
C18 GND
C19 NC
C20 NC
C21 NC
C22 VCCIB1
D1 NC
D2 NC
D3 NC
D4 GND
D5 GAA0/IO00RSB0
D6 GAA1/IO01RSB0
FG484
Pin Number A3P600 Function
D7 GAB0/IO02RSB0
D8 IO11RSB0
D9 IO16RSB0
D10 IO18RSB0
D11 IO28RSB0
D12 IO34RSB0
D13 IO37RSB0
D14 IO41RSB0
D15 IO43RSB0
D16 GBB1/IO57RSB0
D17 GBA0/IO58RSB0
D18 GBA1/IO59RSB0
D19 GND
D20 NC
D21 NC
D22 NC
E1 NC
E2 NC
E3 GND
E4 GAB2/IO173PDB3
E5 GAA2/IO174PDB3
E6 GNDQ
E7 GAB1/IO03RSB0
E8 IO13RSB0
E9 IO14RSB0
E10 IO21RSB0
E11 IO27RSB0
E12 IO32RSB0
E13 IO38RSB0
E14 IO42RSB0
E15 GBC1/IO55RSB0
E16 GBB0/IO56RSB0
E17 IO52RSB0
E18 GBA2/IO60PDB1
E19 IO60NDB1
E20 GND
FG484
Pin Number A3P600 Function
Package Pin Assignments
4-72 Revision 13
E21 NC
E22 NC
F1 NC
F2 NC
F3 NC
F4 IO173NDB3
F5 IO174NDB3
F6 VMV3
F7 IO07RSB0
F8 GAC0/IO04RSB0
F9 GAC1/IO05RSB0
F10 IO20RSB0
F11 IO24RSB0
F12 IO33RSB0
F13 IO39RSB0
F14 IO44RSB0
F15 GBC0/IO54RSB0
F16 IO51RSB0
F17 VMV0
F18 IO61NPB1
F19 IO63PDB1
F20 NC
F21 NC
F22 NC
G1 IO170NDB3
G2 IO170PDB3
G3 NC
G4 IO171NDB3
G5 IO171PDB3
G6 GAC2/IO172PDB3
G7 IO06RSB0
G8 GNDQ
G9 IO10RSB0
G10 IO19RSB0
G11 IO26RSB0
G12 IO30RSB0
FG484
Pin Number A3P600 Function
G13 IO40RSB0
G14 IO45RSB0
G15 GNDQ
G16 IO50RSB0
G17 GBB2/IO61PPB1
G18 IO53RSB0
G19 IO63NDB1
G20 NC
G21 NC
G22 NC
H1 NC
H2 NC
H3 VCC
H4 IO166PDB3
H5 IO167NPB3
H6 IO172NDB3
H7 IO169NDB3
H8 VMV0
H9 VCCIB0
H10 VCCIB0
H11 IO25RSB0
H12 IO31RSB0
H13 VCCIB0
H14 VCCIB0
H15 VMV1
H16 GBC2/IO62PDB1
H17 IO67PPB1
H18 IO64PPB1
H19 IO66PDB1
H20 VCC
H21 NC
H22 NC
J1 NC
J2 NC
J3 NC
J4 IO166NDB3
FG484
Pin Number A3P600 Function
J5 IO168NPB3
J6 IO167PPB3
J7 IO169PDB3
J8 VCCIB3
J9 GND
J10 VCC
J11 VCC
J12 VCC
J13 VCC
J14 GND
J15 VCCIB1
J16 IO62NDB1
J17 IO64NPB1
J18 IO65PPB1
J19 IO66NDB1
J20 NC
J21 IO68PDB1
J22 IO68NDB1
K1 IO157PDB3
K2 IO157NDB3
K3 NC
K4 IO165NDB3
K5 IO165PDB3
K6 IO168PPB3
K7 GFC1/IO164PPB3
K8 VCCIB3
K9 VCC
K10 GND
K11 GND
K12 GND
K13 GND
K14 VCC
K15 VCCIB1
K16 GCC1/IO69PPB1
K17 IO65NPB1
K18 IO75PDB1
FG484
Pin Number A3P600 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-73
K19 IO75NDB1
K20 NC
K21 IO76NDB1
K22 IO76PDB1
L1 NC
L2 IO155PDB3
L3 NC
L4 GFB0/IO163NPB3
L5 GFA0/IO162NDB3
L6 GFB1/IO163PPB3
L7 VCOMPLF
L8 GFC0/IO164NPB3
L9 VCC
L10 GND
L11 GND
L12 GND
L13 GND
L14 VCC
L15 GCC0/IO69NPB1
L16 GCB1/IO70PPB1
L17 GCA0/IO71NPB1
L18 IO67NPB1
L19 GCB0/IO70NPB1
L20 IO77PDB1
L21 IO77NDB1
L22 IO78NPB1
M1 NC
M2 IO155NDB3
M3 IO158NPB3
M4 GFA2/IO161PPB3
M5 GFA1/IO162PDB3
M6 VCCPLF
M7 IO160NDB3
M8 GFB2/IO160PDB3
M9 VCC
M10 GND
FG484
Pin Number A3P600 Function
M11 GND
M12 GND
M13 GND
M14 VCC
M15 GCB2/IO73PPB1
M16 GCA1/IO71PPB1
M17 GCC2/IO74PPB1
M18 IO80PPB1
M19 GCA2/IO72PDB1
M20 IO79PPB1
M21 IO78PPB1
M22 NC
N1 IO154NDB3
N2 IO154PDB3
N3 NC
N4 GFC2/IO159PDB3
N5 IO161NPB3
N6 IO156PPB3
N7 IO129RSB2
N8 VCCIB3
N9 VCC
N10 GND
N11 GND
N12 GND
N13 GND
N14 VCC
N15 VCCIB1
N16 IO73NPB1
N17 IO80NPB1
N18 IO74NPB1
N19 IO72NDB1
N20 NC
N21 IO79NPB1
N22 NC
P1 NC
P2 IO153PDB3
FG484
Pin Number A3P600 Function
P3 IO153NDB3
P4 IO159NDB3
P5 IO156NPB3
P6 IO151PPB3
P7 IO158PPB3
P8 VCCIB3
P9 GND
P10 VCC
P11 VCC
P12 VCC
P13 VCC
P14 GND
P15 VCCIB1
P16 GDB0/IO87NPB1
P17 IO85NDB1
P18 IO85PDB1
P19 IO84PDB1
P20 NC
P21 IO81PDB1
P22 NC
R1 NC
R2 NC
R3 VCC
R4 IO150PDB3
R5 IO151NPB3
R6 IO147NPB3
R7 GEC0/IO146NPB3
R8 VMV3
R9 VCCIB2
R10 VCCIB2
R11 IO117RSB2
R12 IO110RSB2
R13 VCCIB2
R14 VCCIB2
R15 VMV2
R16 IO94RSB2
FG484
Pin Number A3P600 Function
Package Pin Assignments
4-74 Revision 13
R17 GDB1/IO87PPB1
R18 GDC1/IO86PDB1
R19 IO84NDB1
R20 VCC
R21 IO81NDB1
R22 IO82PDB1
T1 IO152PDB3
T2 IO152NDB3
T3 NC
T4 IO150NDB3
T5 IO147PPB3
T6 GEC1/IO146PPB3
T7 IO140RSB2
T8 GNDQ
T9 GEA2/IO143RSB2
T10 IO126RSB2
T11 IO120RSB2
T12 IO108RSB2
T13 IO103RSB2
T14 IO99RSB2
T15 GNDQ
T16 IO92RSB2
T17 VJTAG
T18 GDC0/IO86NDB1
T19 GDA1/IO88PDB1
T20 NC
T21 IO83PDB1
T22 IO82NDB1
U1 IO149PDB3
U2 IO149NDB3
U3 NC
U4 GEB1/IO145PDB3
U5 GEB0/IO145NDB3
U6 VMV2
U7 IO138RSB2
U8 IO136RSB2
FG484
Pin Number A3P600 Function
U9 IO131RSB2
U10 IO124RSB2
U11 IO119RSB2
U12 IO107RSB2
U13 IO104RSB2
U14 IO97RSB2
U15 VMV1
U16 TCK
U17 VPUMP
U18 TRST
U19 GDA0/IO88NDB1
U20 NC
U21 IO83NDB1
U22 NC
V1 NC
V2 NC
V3 GND
V4 GEA1/IO144PDB3
V5 GEA0/IO144NDB3
V6 IO139RSB2
V7 GEC2/IO141RSB2
V8 IO132RSB2
V9 IO127RSB2
V10 IO121RSB2
V11 IO114RSB2
V12 IO109RSB2
V13 IO105RSB2
V14 IO98RSB2
V15 IO96RSB2
V16 GDB2/IO90RSB2
V17 TDI
V18 GNDQ
V19 TDO
V20 GND
V21 NC
V22 NC
FG484
Pin Number A3P600 Function
W1 NC
W2 IO148PDB3
W3 NC
W4 GND
W5 IO137RSB2
W6 GEB2/IO142RSB2
W7 IO134RSB2
W8 IO125RSB2
W9 IO123RSB2
W10 IO118RSB2
W11 IO115RSB2
W12 IO111RSB2
W13 IO106RSB2
W14 IO102RSB2
W15 GDC2/IO91RSB2
W16 IO93RSB2
W17 GDA2/IO89RSB2
W18 TMS
W19 GND
W20 NC
W21 NC
W22 NC
Y1 VCCIB3
Y2 IO148NDB3
Y3 NC
Y4 NC
Y5 GND
Y6 NC
Y7 NC
Y8 VCC
Y9 VCC
Y10 NC
Y11 NC
Y12 NC
Y13 NC
Y14 VCC
FG484
Pin Number A3P600 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-75
Y15 VCC
Y16 NC
Y17 NC
Y18 GND
Y19 NC
Y20 NC
Y21 NC
Y22 VCCIB1
AA1 GND
AA2 VCCIB3
AA3 NC
AA4 NC
AA5 NC
AA6 IO135RSB2
AA7 IO133RSB2
AA8 NC
AA9 NC
AA10 NC
AA11 NC
AA12 NC
AA13 NC
AA14 NC
AA15 NC
AA16 IO101RSB2
AA17 NC
AA18 NC
AA19 NC
AA20 NC
AA21 VCCIB1
AA22 GND
AB1 GND
AB2 GND
AB3 VCCIB2
AB4 NC
AB5 NC
AB6 IO130RSB2
FG484
Pin Number A3P600 Function
AB7 IO128RSB2
AB8 IO122RSB2
AB9 IO116RSB2
AB10 NC
AB11 NC
AB12 IO113RSB2
AB13 IO112RSB2
AB14 NC
AB15 NC
AB16 IO100RSB2
AB17 IO95RSB2
AB18 NC
AB19 NC
AB20 VCCIB2
AB21 GND
AB22 GND
FG484
Pin Number A3P600 Function
Package Pin Assignments
4-76 Revision 13
FG484
Pin Number A3P1000 Function
A1 GND
A2 GND
A3 VCCIB0
A4 IO07RSB0
A5 IO09RSB0
A6 IO13RSB0
A7 IO18RSB0
A8 IO20RSB0
A9 IO26RSB0
A10 IO32RSB0
A11 IO40RSB0
A12 IO41RSB0
A13 IO53RSB0
A14 IO59RSB0
A15 IO64RSB0
A16 IO65RSB0
A17 IO67RSB0
A18 IO69RSB0
A19 NC
A20 VCCIB0
A21 GND
A22 GND
B1 GND
B2 VCCIB3
B3 NC
B4 IO06RSB0
B5 IO08RSB0
B6 IO12RSB0
B7 IO15RSB0
B8 IO19RSB0
B9 IO24RSB0
B10 IO31RSB0
B11 IO39RSB0
B12 IO48RSB0
B13 IO54RSB0
B14 IO58RSB0
B15 IO63RSB0
B16 IO66RSB0
B17 IO68RSB0
B18 IO70RSB0
B19 NC
B20 NC
B21 VCCIB1
B22 GND
C1 VCCIB3
C2 IO220PDB3
C3 NC
C4 NC
C5 GND
C6 IO10RSB0
C7 IO14RSB0
C8 VCC
C9 VCC
C10 IO30RSB0
C11 IO37RSB0
C12 IO43RSB0
C13 NC
C14 VCC
C15 VCC
C16 NC
C17 NC
C18 GND
C19 NC
C20 NC
C21 NC
C22 VCCIB1
D1 IO219PDB3
D2 IO220NDB3
D3 NC
D4 GND
D5 GAA0/IO00RSB0
D6 GAA1/IO01RSB0
FG484
Pin Number A3P1000 Function
D7 GAB0/IO02RSB0
D8 IO16RSB0
D9 IO22RSB0
D10 IO28RSB0
D11 IO35RSB0
D12 IO45RSB0
D13 IO50RSB0
D14 IO55RSB0
D15 IO61RSB0
D16 GBB1/IO75RSB0
D17 GBA0/IO76RSB0
D18 GBA1/IO77RSB0
D19 GND
D20 NC
D21 NC
D22 NC
E1 IO219NDB3
E2 NC
E3 GND
E4 GAB2/IO224PDB3
E5 GAA2/IO225PDB3
E6 GNDQ
E7 GAB1/IO03RSB0
E8 IO17RSB0
E9 IO21RSB0
E10 IO27RSB0
E11 IO34RSB0
E12 IO44RSB0
E13 IO51RSB0
E14 IO57RSB0
E15 GBC1/IO73RSB0
E16 GBB0/IO74RSB0
E17 IO71RSB0
E18 GBA2/IO78PDB1
E19 IO81PDB1
E20 GND
FG484
Pin Number A3P1000 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-77
E21 NC
E22 IO84PDB1
F1 NC
F2 IO215PDB3
F3 IO215NDB3
F4 IO224NDB3
F5 IO225NDB3
F6 VMV3
F7 IO11RSB0
F8 GAC0/IO04RSB0
F9 GAC1/IO05RSB0
F10 IO25RSB0
F11 IO36RSB0
F12 IO42RSB0
F13 IO49RSB0
F14 IO56RSB0
F15 GBC0/IO72RSB0
F16 IO62RSB0
F17 VMV0
F18 IO78NDB1
F19 IO81NDB1
F20 IO82PPB1
F21 NC
F22 IO84NDB1
G1 IO214NDB3
G2 IO214PDB3
G3 NC
G4 IO222NDB3
G5 IO222PDB3
G6 GAC2/IO223PDB3
G7 IO223NDB3
G8 GNDQ
G9 IO23RSB0
G10 IO29RSB0
G11 IO33RSB0
G12 IO46RSB0
FG484
Pin Number A3P1000 Function
G13 IO52RSB0
G14 IO60RSB0
G15 GNDQ
G16 IO80NDB1
G17 GBB2/IO79PDB1
G18 IO79NDB1
G19 IO82NPB1
G20 IO85PDB1
G21 IO85NDB1
G22 NC
H1 NC
H2 NC
H3 VCC
H4 IO217PDB3
H5 IO218PDB3
H6 IO221NDB3
H7 IO221PDB3
H8 VMV0
H9 VCCIB0
H10 VCCIB0
H11 IO38RSB0
H12 IO47RSB0
H13 VCCIB0
H14 VCCIB0
H15 VMV1
H16 GBC2/IO80PDB1
H17 IO83PPB1
H18 IO86PPB1
H19 IO87PDB1
H20 VCC
H21 NC
H22 NC
J1 IO212NDB3
J2 IO212PDB3
J3 NC
J4 IO217NDB3
FG484
Pin Number A3P1000 Function
J5 IO218NDB3
J6 IO216PDB3
J7 IO216NDB3
J8 VCCIB3
J9 GND
J10 VCC
J11 VCC
J12 VCC
J13 VCC
J14 GND
J15 VCCIB1
J16 IO83NPB1
J17 IO86NPB1
J18 IO90PPB1
J19 IO87NDB1
J20 NC
J21 IO89PDB1
J22 IO89NDB1
K1 IO211PDB3
K2 IO211NDB3
K3 NC
K4 IO210PPB3
K5 IO213NDB3
K6 IO213PDB3
K7 GFC1/IO209PPB3
K8 VCCIB3
K9 VCC
K10 GND
K11 GND
K12 GND
K13 GND
K14 VCC
K15 VCCIB1
K16 GCC1/IO91PPB1
K17 IO90NPB1
K18 IO88PDB1
FG484
Pin Number A3P1000 Function
Package Pin Assignments
4-78 Revision 13
K19 IO88NDB1
K20 IO94NPB1
K21 IO98NDB1
K22 IO98PDB1
L1 NC
L2 IO200PDB3
L3 IO210NPB3
L4 GFB0/IO208NPB3
L5 GFA0/IO207NDB3
L6 GFB1/IO208PPB3
L7 VCOMPLF
L8 GFC0/IO209NPB3
L9 VCC
L10 GND
L11 GND
L12 GND
L13 GND
L14 VCC
L15 GCC0/IO91NPB1
L16 GCB1/IO92PPB1
L17 GCA0/IO93NPB1
L18 IO96NPB1
L19 GCB0/IO92NPB1
L20 IO97PDB1
L21 IO97NDB1
L22 IO99NPB1
M1 NC
M2 IO200NDB3
M3 IO206NDB3
M4 GFA2/IO206PDB3
M5 GFA1/IO207PDB3
M6 VCCPLF
M7 IO205NDB3
M8 GFB2/IO205PDB3
M9 VCC
M10 GND
FG484
Pin Number A3P1000 Function
M11 GND
M12 GND
M13 GND
M14 VCC
M15 GCB2/IO95PPB1
M16 GCA1/IO93PPB1
M17 GCC2/IO96PPB1
M18 IO100PPB1
M19 GCA2/IO94PPB1
M20 IO101PPB1
M21 IO99PPB1
M22 NC
N1 IO201NDB3
N2 IO201PDB3
N3 NC
N4 GFC2/IO204PDB3
N5 IO204NDB3
N6 IO203NDB3
N7 IO203PDB3
N8 VCCIB3
N9 VCC
N10 GND
N11 GND
N12 GND
N13 GND
N14 VCC
N15 VCCIB1
N16 IO95NPB1
N17 IO100NPB1
N18 IO102NDB1
N19 IO102PDB1
N20 NC
N21 IO101NPB1
N22 IO103PDB1
P1 NC
P2 IO199PDB3
FG484
Pin Number A3P1000 Function
P3 IO199NDB3
P4 IO202NDB3
P5 IO202PDB3
P6 IO196PPB3
P7 IO193PPB3
P8 VCCIB3
P9 GND
P10 VCC
P11 VCC
P12 VCC
P13 VCC
P14 GND
P15 VCCIB1
P16 GDB0/IO112NPB1
P17 IO106NDB1
P18 IO106PDB1
P19 IO107PDB1
P20 NC
P21 IO104PDB1
P22 IO103NDB1
R1 NC
R2 IO197PPB3
R3 VCC
R4 IO197NPB3
R5 IO196NPB3
R6 IO193NPB3
R7 GEC0/IO190NPB3
R8 VMV3
R9 VCCIB2
R10 VCCIB2
R11 IO147RSB2
R12 IO136RSB2
R13 VCCIB2
R14 VCCIB2
R15 VMV2
R16 IO110NDB1
FG484
Pin Number A3P1000 Function
ProASIC3 Flash Family FPGAs
Revision 13 4-79
R17 GDB1/IO112PPB1
R18 GDC1/IO111PDB1
R19 IO107NDB1
R20 VCC
R21 IO104NDB1
R22 IO105PDB1
T1 IO198PDB3
T2 IO198NDB3
T3 NC
T4 IO194PPB3
T5 IO192PPB3
T6 GEC1/IO190PPB3
T7 IO192NPB3
T8 GNDQ
T9 GEA2/IO187RSB2
T10 IO161RSB2
T11 IO155RSB2
T12 IO141RSB2
T13 IO129RSB2
T14 IO124RSB2
T15 GNDQ
T16 IO110PDB1
T17 VJTAG
T18 GDC0/IO111NDB1
T19 GDA1/IO113PDB1
T20 NC
T21 IO108PDB1
T22 IO105NDB1
U1 IO195PDB3
U2 IO195NDB3
U3 IO194NPB3
U4 GEB1/IO189PDB3
U5 GEB0/IO189NDB3
U6 VMV2
U7 IO179RSB2
U8 IO171RSB2
FG484
Pin Number A3P1000 Function
U9 IO165RSB2
U10 IO159RSB2
U11 IO151RSB2
U12 IO137RSB2
U13 IO134RSB2
U14 IO128RSB2
U15 VMV1
U16 TCK
U17 VPUMP
U18 TRST
U19 GDA0/IO113NDB1
U20 NC
U21 IO108NDB1
U22 IO109PDB1
V1 NC
V2 NC
V3 GND
V4 GEA1/IO188PDB3
V5 GEA0/IO188NDB3
V6 IO184RSB2
V7 GEC2/IO185RSB2
V8 IO168RSB2
V9 IO163RSB2
V10 IO157RSB2
V11 IO149RSB2
V12 IO143RSB2
V13 IO138RSB2
V14 IO131RSB2
V15 IO125RSB2
V16 GDB2/IO115RSB2
V17 TDI
V18 GNDQ
V19 TDO
V20 GND
V21 NC
V22 IO109NDB1
FG484
Pin Number A3P1000 Function
W1 NC
W2 IO191PDB3
W3 NC
W4 GND
W5 IO183RSB2
W6 GEB2/IO186RSB2
W7 IO172RSB2
W8 IO170RSB2
W9 IO164RSB2
W10 IO158RSB2
W11 IO153RSB2
W12 IO142RSB2
W13 IO135RSB2
W14 IO130RSB2
W15 GDC2/IO116RSB2
W16 IO120RSB2
W17 GDA2/IO114RSB2
W18 TMS
W19 GND
W20 NC
W21 NC
W22 NC
Y1 VCCIB3
Y2 IO191NDB3
Y3 NC
Y4 IO182RSB2
Y5 GND
Y6 IO177RSB2
Y7 IO174RSB2
Y8 VCC
Y9 VCC
Y10 IO154RSB2
Y11 IO148RSB2
Y12 IO140RSB2
Y13 NC
Y14 VCC
FG484
Pin Number A3P1000 Function
Package Pin Assignments
4-80 Revision 13
Y15 VCC
Y16 NC
Y17 NC
Y18 GND
Y19 NC
Y20 NC
Y21 NC
Y22 VCCIB1
AA1 GND
AA2 VCCIB3
AA3 NC
AA4 IO181RSB2
AA5 IO178RSB2
AA6 IO175RSB2
AA7 IO169RSB2
AA8 IO166RSB2
AA9 IO160RSB2
AA10 IO152RSB2
AA11 IO146RSB2
AA12 IO139RSB2
AA13 IO133RSB2
AA14 NC
AA15 NC
AA16 IO122RSB2
AA17 IO119RSB2
AA18 IO117RSB2
AA19 NC
AA20 NC
AA21 VCCIB1
AA22 GND
AB1 GND
AB2 GND
AB3 VCCIB2
AB4 IO180RSB2
AB5 IO176RSB2
AB6 IO173RSB2
FG484
Pin Number A3P1000 Function
AB7 IO167RSB2
AB8 IO162RSB2
AB9 IO156RSB2
AB10 IO150RSB2
AB11 IO145RSB2
AB12 IO144RSB2
AB13 IO132RSB2
AB14 IO127RSB2
AB15 IO126RSB2
AB16 IO123RSB2
AB17 IO121RSB2
AB18 IO118RSB2
AB19 NC
AB20 VCCIB2
AB21 GND
AB22 GND
FG484
Pin Number A3P1000 Function
Revision 13 5-1
5 – Datasheet Information
List of Changes
The following table lists critical changes that were made in each version of the ProASIC3 datasheet.
Revision Changes Page
Revision 13
(January 2013)
The "ProASIC3 Ordering Information" section has been updated to mention "Y" as
"Blank" mentioning "Device Does Not Include License to Implement IP Based on the
Cryptography Research, Inc. (CRI) Patent Portfolio" (SAR 43104).
1-III
Added a note to Table 2-2 • Recommended Operating Conditions 1,2 (SAR 43644):
The programming temperature range supported is Tambient = 0°C to 85°C.
2-2
The note in Table 2-115 • ProASIC3 CCC/PLL Specification referring the reader to
SmartGen was revised to refer instead to the online help associated with the core
(SAR 42569).
2-89
Libero Integrated Design Environment (IDE) was changed to Libero System-on-Chip
(SoC) throughout the document (SAR 40284).
Live at Power-Up (LAPU) has been replaced with ’Instant On’.
NA
Revision 12
(September 2012)
The "Security" section was modified to clarify that Microsemi does not support
read-back of programmed data.
1-1
Added a Note stating "VMV pins must be connected to the corresponding VCCI pins.
See the "VMVx I/O Supply Voltage (quiet)" section on page 3-1 for further information." to
Table 2-1 • Absolute Maximum Ratings and Table 2-2 • Recommended Operating
Conditions 1,2 (SAR 38321).
2-1
2-2
Table 2-35 • Duration of Short Circuit Event Before Failure was revised to change
the maximum temperature from 110°C to 100°C, with an example of six months
instead of three months (SAR 37933).
2-30
In Table 2-93 • Minimum and Maximum DC Input and Output Levels, VIL and VIH
were revised so that the maximum is 3.6 V for all listed values of VCCI (SAR
28549).
2-67
Figure 2-36 • FIFO Read and Figure 2-37 • FIFO Write are new (SAR 28371). 2-98
The following sentence was removed from the "VMVx I/O Supply Voltage (quiet)"
section in the "Pin Descriptions" chapter: "Within the package, the VMV plane is
decoupled from the simultaneous switching noise originating from the output buffer
VCCI domain" and replaced with “Within the package, the VMV plane biases the
input stage of the I/Os in the I/O banks” (SAR 38321). The datasheet mentions that
"VMV pins must be connected to the corresponding VCCI pins" for an ESD
enhancement.
3-1
Datasheet Information
5-2 Revision 13
Revision 11
(March 2012)
Note indicating that A3P015 is not recommended for new designs has been added.
The "Devices Not Recommended For New Designs" section is new (SAR 36760).
I to IV
The following sentence was removed from the "Advanced Architecture" section: "In
addition, extensive on-chip programming circuitry allows for rapid, single-voltage
(3.3 V) programming of IGLOO devices via an IEEE 1532 JTAG interface" (SAR
34687).
1-3
The reference to guidelines for global spines and VersaTile rows, given in the
"Global Clock Contribution—PCLOCK" section, was corrected to the "Spine
Architecture" section of the Global Resources chapter in the ProASIC3 FPGA Fabric
User's Guide (SAR 34734).
2-12
Figure 2-3 • Input Buffer Timing Model and Delays (example) has been modified for
the DIN waveform; the Rise and Fall time label has been changed to tDIN (35430).
2-15
The AC Loading figures in the "Single-Ended I/O Characteristics" section were
updated to match tables in the "Summary of I/O Timing Characteristics – Default I/O
Software Settings" section (SAR 34883).
2-31
Added values for minimum pulse width and removed the FRMAX row from
Table 2-107 through Table 2-114 in the "Global Tree Timing Characteristics" section.
Use the software to determine the FRMAX for the device you are using (SARs
37279, 29269).
2-84
Revision 10
(September 2011)
The "In-System Programming (ISP) and Security" section and "Security" section
were revised to clarify that although no existing security measures can give an
absolute guarantee, Microsemi FPGAs implement the best security available in the
industry (SAR 32865).
I, 1-1
The value of 34 I/Os for the QN48 package in A3P030 was added to the "I/Os Per
Package 1" section (SAR 33907).
II
The Y security option and Licensed DPA Logo were added to the "ProASIC3
Ordering Information" section. The trademarked Licensed DPA Logo identifies that a
product is covered by a DPA counter-measures license from Cryptography
Research (SAR 32151).
III
The "Specifying I/O States During Programming" section is new (SAR 21281). 1-7
In Table 2-2 • Recommended Operating Conditions 1,2, VPUMP programming
voltage in programming mode was changed from "3.0 to 3.6" to "3.15 to 3.45" (SAR
30666). It was corrected in v2.0 of this datasheet in April 2007 but inadvertently
changed back to “3.0 to 3.6 V” in v1.4 in August 2009. The following changes were
made to Table 2-2 • Recommended Operating Conditions 1,2:
VCCPLL analog power supply (PLL) was changed from "1.4 to 1.6" to "1.425 to
1.575" (SAR 33850).
For VCCI and VMV, values for 3.3 V DC and 3.3 V DC Wide Range were corrected.
The correct value for 3.3 V DC is "3.0 to 3.6 V" and the correct value for 3.3 V Wide
Range is "2.7 to 3.6" (SAR 33848).
2-2
Table 2-25 • Summary of I/O Timing Characteristics—Software Default Settings was
update to restore values to the correct columns. Previously the Slew Rate column
was missing and data were aligned incorrectly (SAR 34034).
2-23
The notes regarding drive strength in the "Summary of I/O Timing Characteristics –
Default I/O Software Settings" section and "3.3 V LVCMOS Wide Range" section
tables were revised for clarification. They now state that the minimum drive strength
for the default software configuration when run in wide range is ±100 µA. The drive
strength displayed in software is supported in normal range only. For a detailed I/V
curve, refer to the IBIS models (SAR 25700).
2-21, 2-38
Revision Changes Page
ProASIC3 Flash Family FPGAs
Revision 13 5-3
Revision 10
(continued)
"TBD" for 3.3 V LVCMOS Wide Range in Table 2-28 • I/O Output Buffer Maximum
Resistances1 through Table 2-30 • I/O Output Buffer Maximum Resistances1 was
replaced by "Same as regular 3.3 V" (SAR 33852).
2-25 to
2-27
The equations in the notes for Table 2-31 • I/O Weak Pull-Up/Pull-Down
Resistances were corrected (SAR 32470).
2-27
"TBD" for 3.3 V LVCMOS Wide Range in Table 2-32 • I/O Short Currents IOSH/IOSL
through Table 2-34 • I/O Short Currents IOSH/IOSL was replaced by "Same as
regular 3.3 V LVCMOS" (SAR 33852).
2-28 to
2-30
In the "3.3 V LVCMOS Wide Range" section, values were added to Table 2-47
through Table 2-49 for IOSL and IOSH, replacing "TBD" (SAR 33852).
2-38 to
2-39
The following sentence was deleted from the "2.5 V LVCMOS" section (SAR 24916):
"It uses a 5 V–tolerant input buffer and push-pull output buffer."
2-46
The table notes were revised for Table 2-90 • LVDS Minimum and Maximum DC
Input and Output Levels (SAR 33859).
2-65
Values were added for FDDRIMAX and FDDOMAX in Table 2-102 • Input DDR
Propagation Delays and Table 2-104 • Output DDR Propagation Delays (SAR
23919).
2-77, 2-79
Table 2-115 • ProASIC3 CCC/PLL Specification was updated. A note was added to
indicate that when the CCC/PLL core is generated by Microsemi core generator
software, not all delay values of the specified delay increments are available (SAR
25705).
2-89
The following figures were deleted (SAR 29991). Reference was made to a new
application note, Simultaneous Read-Write Operations in Dual-Port SRAM for
Flash-Based cSoCs and FPGAs, which covers these cases in detail (SAR 21770).
Figure 2-34 • Write Access after Write onto Same Address
Figure 2-35 • Read Access after Write onto Same Address
Figure 2-35 • Read Access after Write onto Same Address
The port names in the SRAM "Timing Waveforms", SRAM "Timing Characteristics"
tables, Figure 2-38 • FIFO Reset, and the FIFO "Timing Characteristics" tables were
revised to ensure consistency with the software names (SARs 29991, 30510).
2-92,
2-94,
2-99,
2-101
The "Pin Descriptions" chapter has been added (SAR 21642). 3-1
Package names used in the "Package Pin Assignments" section were revised to
match standards given in Package Mechanical Drawings (SAR 27395).
4-1
July 2010 The versioning system for datasheets has been changed. Datasheets are assigned
a revision number that increments each time the datasheet is revised. The
"ProASIC3 Device Status" table on page III indicates the status for each device in
the device family.
N/A
Revision Changes Page
Datasheet Information
5-4 Revision 13
Revision Changes Page
Revision 9 (Oct 2009)
Product Brief v1.3
The CS121 package was added to table under "Features and Benefits" section,
the "I/Os Per Package 1" table, Table 1 • ProASIC3 FPGAs Package Sizes
Dimensions, "ProASIC3 Ordering Information", and the "Temperature Grade
Offerings" table.
I – IV
"ProASIC3 Ordering Information" was revised to include the fact that some RoHS
compliant packages are halogen-free.
III
Packaging v1.5 The "CS121" figure and pin table for A3P060 are new. 4-15
Revision 8 (Aug 2009)
Product Brief v1.2
All references to M7 devices (CoreMP7) and speed grade –F were removed from
this document.
N/A
Table 1-1 • I/O Standards Supported is new. 1-7
The "I/Os with Advanced I/O Standards" section was revised to add definitions of
hot-swap and cold-sparing.
1-7
DC and Switching
Characteristics v1.4
3.3 V LVCMOS and 1.2 V LVCMOS Wide Range support was added to the
datasheet. This affects all tables that contained 3.3 V LVCMOS and 1.2 V
LVCMOS data.
N/A
IIL and IIH input leakage current information was added to all "Minimum and
Maximum DC Input and Output Levels" tables.
N/A
–F was removed from the datasheet. The speed grade is no longer supported. N/A
The notes in Table 2-2 • Recommended Operating Conditions 1,2 were updated. 2-2
Table 2-4 • Overshoot and Undershoot Limits 1 was updated. 2-3
Table 2-6 • Temperature and Voltage Derating Factors for Timing Delays was
updated.
2-6
In Table 2-116 • RAM4K9, the following specifications were removed:
tWRO
tCCKH
2-94
In Table 2-117 • RAM512X18, the following specifications were removed:
tWRO
tCCKH
2-96
In the title of Table 2-74 • 1.8 V LVCMOS High Slew, VCCI had a typo. It was
changed from 3.0 V to 1.7 V.
2-57
Revision 7 (Feb 2009)
Product Brief v1.1
The "Advanced I/O" section was revised to add a bullet regarding wide range
power supply voltage support.
I
The table under "Features and Benefits" section, was updated to include a value
for typical equivalent macrocells for A3P250.
I
The QN48 package was added to the following tables: the table under "Features
and Benefits" section, "I/Os Per Package 1" "ProASIC3 FPGAs Package Sizes
Dimensions", and "Temperature Grade Offerings".
The number of singled-ended I/Os for QN68 was added to the "I/Os Per
Package 1" table.
N/A
The "Wide Range I/O Support" section is new. 1-7
Revision 6 (Dec 2008)
Packaging v1.4
The "QN48" section is new. 4-1
The "QN68" pin table for A3P030 is new. 4-5
ProASIC3 Flash Family FPGAs
Revision 13 5-5
Revision 5 (Aug 2008)
DC and Switching
Characteristics v1.3
TJ, Maximum Junction Temperature, was changed to 100° from 110º in the
"Thermal Characteristics" section and EQ 2. The calculated result of Maximum
Power Allowed has thus changed to 1.463 W from 1.951 W.
2-5
Values for the A3P015 device were added to Table 2-7 • Quiescent Supply
Current Characteristics.
2-6
Values for the A3P015 device were added to Table 2-14 • Different Components
Contributing to Dynamic Power Consumption in ProASIC3 Devices. PAC14 was
removed. Table 2-15 • Different Components Contributing to the Static Power
Consumption in ProASIC3 Devices is new.
2-10, 2-11
The "PLL Contribution—PPLL" section was updated to change the PPLL formula
from PAC13 + PAC14 * FCLKOUT to PDC4 + PAC13 * FCLKOUT
.
2-13
Both fall and rise values were included for tDDRISUD and tDDRIHD in Table 2-102 •
Input DDR Propagation Delays.
2-77
Table 2-107 • A3P015 Global Resource is new. 2-85
The typical value for Delay Increments in Programmable Delay Blocks was
changed from 160 to 200 in Table 2-115 • ProASIC3 CCC/PLL Specification.
2-89
Revision 4 (Jun 2008)
DC and Switching
Characteristics v1.2
Table note references were added to Table 2-2 • Recommended Operating
Conditions 1,2, and the order of the table notes was changed.
2-2
The title for Table 2-4 • Overshoot and Undershoot Limits 1 was modified to
remove "as measured on quiet I/Os." Table note 1 was revised to remove
"estimated SSO density over cycles." Table note 2 was revised to remove "refers
only to overshoot/undershoot limits for simultaneous switching I/Os."
2-3
The "Power per I/O Pin" section was updated to include 3 additional tables
pertaining to input buffer power and output buffer power.
2-6
Table 2-29 • I/O Output Buffer Maximum Resistances 1 was revised to include
values for 3.3 V PCI/PCI-X.
2-26
Table 2-90 • LVDS Minimum and Maximum DC Input and Output Levels was
updated.
2-65
Revision 3 (Jun 2008)
Packaging v1.3
Pin numbers were added to the "QN68" package diagram. Note 2 was added
below the diagram.
4-3
The "QN132" package diagram was updated to include D1 to D4. In addition,
note 1 was changed from top view to bottom view, and note 2 is new.
4-6
Revision 2 (Feb 2008)
Product Brief v1.0
This document was divided into two sections and given a version number, starting
at v1.0. The first section of the document includes features, benefits, ordering
information, and temperature and speed grade offerings. The second section is a
device family overview.
N/A
This document was updated to include A3P015 device information. QN68 is a
new package that was added because it is offered in the A3P015. The following
sections were updated:
"Features and Benefits"
"ProASIC3 Ordering Information"
"Temperature Grade Offerings"
"ProASIC3 Product Family"
"A3P015 and A3P030" note
"Introduction and Overview"
N/A
Revision Changes Page
Datasheet Information
5-6 Revision 13
Revision 2 (cont’d) The "ProASIC3 FPGAs Package Sizes Dimensions" table is new. II
In the "ProASIC3 Ordering Information", the QN package measurements were
updated to include both 0.4 mm and 0.5 mm.
III
In the "General Description" section, the number of I/Os was updated from 288 to
300.
1-1
Packaging v1.2 The "QN68" section is new. 4-3
Revision 1 (Feb 2008)
DC and Switching
Characteristics v1.1
In Table 2-2 • Recommended Operating Conditions 1,2, TJ was listed in the
symbol column and was incorrect. It was corrected and changed to TA.
2-2
In Table 2-3 • Flash Programming Limits – Retention, Storage and Operating
Temperature1, Maximum Operating Junction Temperature was changed from
110°C to 100°C for both commercial and industrial grades.
2-2
The "PLL Behavior at Brownout Condition" section is new. 2-3
In the "PLL Contribution—PPLL" section, the following was deleted:
FCLKIN is the input clock frequency.
2-13
In Table 2-21 • Summary of Maximum and Minimum DC Input Levels, the note
was incorrect. It previously said TJ and it was corrected and changed to TA.
2-20
In Table 2-115 • ProASIC3 CCC/PLL Specification, the SCLK parameter and note
1 are new.
2-89
Table 2-125 • JTAG 1532 was populated with the parameter data, which was not
in the previous version of the document.
2-108
Packaging v1.1 In the "VQ100" A3P030 pin table, the function of pin 63 was incorrect and
changed from IO39RSB0 to GDB0/IO38RSB0.
4-19
Revision 0 (Jan 2008) This document was previously in datasheet v2.2. As a result of moving to the
handbook format, Actel has restarted the version numbers.
N/A
v2.2
(July 2007)
The M7 and M1 device part numbers have been updated in Table 1 • ProASIC3
Product Family, "I/Os Per Package", "Automotive ProASIC3 Ordering
Information", "Temperature Grade Offerings", and "Speed Grade and
Temperature Grade Matrix".
i, ii, iii,
iii, iv
The words "ambient temperature" were added to the temperature range in the
"Automotive ProASIC3 Ordering Information", "Temperature Grade Offerings",
and "Speed Grade and Temperature Grade Matrix" sections.
iii, iv
The TJ parameter in Table 3-2 • Recommended Operating Conditions was
changed to TA, ambient temperature, and table notes 4–6 were added.
3-2
v2.1
(May 2007)
In the "Clock Conditioning Circuit (CCC) and PLL" section, the Wide Input
Frequency Range (1.5 MHz to 200 MHz) was changed to (1.5 MHz to 350 MHz).
i
The "Clock Conditioning Circuit (CCC) and PLL" section was updated. i
In the "I/Os Per Package" section, the A3P030, A3P060, A3P125, ACP250, and
A3P600 device I/Os were updated.
ii
Table 3-5 • Package Thermal Resistivities was updated with A3P1000
information. The note below the table is also new.
3-5
Revision Changes Page
ProASIC3 Flash Family FPGAs
Revision 13 5-7
v2.0
(April 2007)
In the "Packaging Tables", Ambient was deleted. ii
The timing characteristics tables were updated. N/A
The "PLL Macro" section was updated to add information on the VCO and PLL
outputs during power-up.
2-15
The "PLL Macro" section was updated to include power-up information. 2-15
Table 2-11 • ProASIC3 CCC/PLL Specification was updated. 2-29
Figure 2-19 • Peak-to-Peak Jitter Definition is new. 2-18
The "SRAM and FIFO" section was updated with operation and timing
requirement information.
2-21
The "RESET" section was updated with read and write information. 2-25
The "RESET" section was updated with read and write information. 2-25
The "Introduction" in the "Advanced I/Os" section was updated to include
information on input and output buffers being disabled.
2-28
PCI-X 3.3 V was added to Table 2-11 • VCCI Voltages and Compatible
Standards.
2-29
In the Table 2-15 • Levels of Hot-Swap Support, the ProASIC3 compliance
descriptions were updated for levels 3 and 4.
2-34
Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in ProASIC3
Devices was updated.
2-64
Notes 3, 4, and 5 were added to Table 2-17 • Comparison Table for 5 V–
Compliant Receiver Scheme. 5 x 52.72 was changed to 52.7 and the Maximum
current was updated from 4 x 52.7 to 5 x 52.7.
2-40
The "VCCPLF PLL Supply Voltage" section was updated. 2-50
The "VPUMP Programming Supply Voltage" section was updated. 2-50
The "GL Globals" section was updated to include information about direct input
into quadrant clocks.
2-51
VJTAG was deleted from the "TCK Test Clock" section. 2-51
In Table 2-22 • Recommended Tie-Off Values for the TCK and TRST Pins, TSK
was changed to TCK in note 2. Note 3 was also updated.
2-51
Ambient was deleted from Table 3-2 • Recommended Operating Conditions.
VPUMP programming mode was changed from "3.0 to 3.6" to "3.15 to 3.45".
3-2
Note 3 is new in Table 3-4 • Overshoot and Undershoot Limits (as measured on
quiet I/Os)1.
3-2
In EQ 3-2, 150 was changed to 110 and the result changed from 3.9 to 1.951. 3-5
Table 3-6 • Temperature and Voltage Derating Factors for Timing Delays was
updated.
3-6
Table 3-5 • Package Thermal Resistivities was updated. 3-5
Table 3-14 • Summary of Maximum and Minimum DC Input and Output Levels
Applicable to Commercial and Industrial Conditions—Software Default Settings
(Advanced) and Table 3-17 • Summary of Maximum and Minimum DC Input
Levels Applicable to Commercial and Industrial Conditions (Standard Plus) were
updated.
3-17 to 3-
17
Revision Changes Page
Datasheet Information
5-8 Revision 13
v2.0
(continued)
Table 3-20 • Summary of I/O Timing Characteristics—Software Default Settings
(Advanced) and Table 3-21 • Summary of I/O Timing Characteristics—Software
Default Settings (Standard Plus) were updated.
3-20 to
3-20
Table 3-11 • Different Components Contributing to Dynamic Power Consumption
in ProASIC3 Devices was updated.
3-9
Table 3-24 • I/O Output Buffer Maximum Resistances1 (Advanced) and Table 3-
25 • I/O Output Buffer Maximum Resistances1 (Standard Plus) were updated.
3-22 to
3-22
Table 3-17 • Summary of Maximum and Minimum DC Input Levels Applicable to
Commercial and Industrial Conditions was updated.
3-18
Table 3-28 • I/O Short Currents IOSH/IOSL (Advanced) and Table 3-29 • I/O
Short Currents IOSH/IOSL (Standard Plus) were updated.
3-24 to
3-26
The note in Table 3-32 • I/O Input Rise Time, Fall Time, and Related I/O
Reliability was updated.
3-27
Figure 3-33 • Write Access After Write onto Same Address, Figure 3-34 • Read
Access After Write onto Same Address, and Figure 3-35 • Write Access After
Read onto Same Address are new.
3-82 to
3-84
Figure 3-43 • Timing Diagram was updated. 3-96
Ambient was deleted from the "Speed Grade and Temperature Grade Matrix". iv
Notes were added to the package diagrams identifying if they were top or bottom
view.
N/A
The A3P030 "132-Pin QFN" table is new. 4-2
The A3P060 "132-Pin QFN" table is new. 4-4
The A3P125 "132-Pin QFN" table is new. 4-6
The A3P250 "132-Pin QFN" table is new. 4-8
The A3P030 "100-Pin VQFP" table is new. 4-11
Advance v0.7
(January 2007)
In the "I/Os Per Package" table, the I/O numbers were added for A3P060,
A3P125, and A3P250. The A3P030-VQ100 I/O was changed from 79 to 77.
ii
Advance v0.6
(April 2006)
The term flow-through was changed to pass-through. N/A
Table 1 was updated to include the QN132. ii
The "I/Os Per Package" table was updated with the QN132. The footnotes were
also updated. The A3P400-FG144 I/O count was updated.
ii
"Automotive ProASIC3 Ordering Information" was updated with the QN132. iii
"Temperature Grade Offerings" was updated with the QN132. iii
B-LVDS and M-LDVS are new I/O standards added to the datasheet. N/A
The term flow-through was changed to pass-through. N/A
Figure 2-7 • Efficient Long-Line Resources was updated. 2-7
The footnotes in Figure 2-15 • Clock Input Sources Including CLKBUF,
CLKBUF_LVDS/LVPECL, and CLKINT were updated.
2-16
The Delay Increments in the Programmable Delay Blocks specification in Figure
2-24 • ProASIC3E CCC Options.
2-24
The "SRAM and FIFO" section was updated. 2-21
Revision Changes Page
ProASIC3 Flash Family FPGAs
Revision 13 5-9
Advance v0.6
(continued)
The "RESET" section was updated. 2-25
The "WCLK and RCLK" section was updated. 2-25
The "RESET" section was updated. 2-25
The "RESET" section was updated. 2-27
The "Introduction" of the "Advanced I/Os" section was updated. 2-28
The "I/O Banks" section is new. This section explains the following types of I/Os:
Advanced
Standard+
Standard
Table 2-12 • Automotive ProASIC3 Bank Types Definition and Differences is
new. This table describes the standards listed above.
2-29
PCI-X 3.3 V was added to the Compatible Standards for 3.3 V in Table 2-
11 • VCCI Voltages and Compatible Standards
2-29
Table 2-13 • ProASIC3 I/O Features was updated. 2-30
The "Double Data Rate (DDR) Support" section was updated to include
information concerning implementation of the feature.
2-32
The "Electrostatic Discharge (ESD) Protection" section was updated to include
testing information.
2-35
Level 3 and 4 descriptions were updated in Table 2-43 • I/O Hot-Swap and 5 V
Input Tolerance Capabilities in ProASIC3 Devices.
2-64
The notes in Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance Capabilities in
ProASIC3 Devices were updated.
2-64
The "Simultaneous Switching Outputs (SSOs) and Printed Circuit Board Layout"
section is new.
2-41
A footnote was added to Table 2-14 • Maximum I/O Frequency for Single-Ended
and Differential I/Os in All Banks in Automotive ProASIC3 Devices (maximum
drive strength and high slew selected).
2-30
Table 2-18 • Automotive ProASIC3 I/O Attributes vs. I/O Standard Applications 2-45
Table 2-50 • ProASIC3 Output Drive (OUT_DRIVE) for Standard I/O Bank Type
(A3P030 device)
2-83
Table 2-51 • ProASIC3 Output Drive for Standard+ I/O Bank Type was updated. 2-84
Table 2-54 • ProASIC3 Output Drive for Advanced I/O Bank Type was updated. 2-84
The "x" was updated in the "User I/O Naming Convention" section. 2-48
The "VCC Core Supply Voltage" pin description was updated. 2-50
The "VMVx I/O Supply Voltage (quiet)" pin description was updated to include
information concerning leaving the pin unconnected.
2-50
The "VJTAG JTAG Supply Voltage" pin description was updated. 2-50
The "VPUMP Programming Supply Voltage" pin description was updated to
include information on what happens when the pin is tied to ground.
2-50
The "I/O User Input/Output" pin description was updated to include information on
what happens when the pin is unused.
2-50
The "JTAG Pins" section was updated to include information on what happens
when the pin is unused.
2-51
Revision Changes Page
Datasheet Information
5-10 Revision 13
Advance v0.6
(continued)
The "Programming" section was updated to include information concerning
serialization.
2-53
The "JTAG 1532" section was updated to include SAMPLE/PRELOAD
information.
2-54
"DC and Switching Characteristics" chapter was updated with new information. 3-1
The A3P060 "100-Pin VQFP" pin table was updated. 4-13
The A3P125 "100-Pin VQFP" pin table was updated. 4-13
The A3P060 "144-Pin TQFP" pin table was updated. 4-16
The A3P125 "144-Pin TQFP" pin table was updated. 4-18
The A3P125 "208-Pin PQFP" pin table was updated. 4-21
The A3P400 "208-Pin PQFP" pin table was updated. 4-25
The A3P060 "144-Pin FBGA" pin table was updated. 4-32
The A3P125 "144-Pin FBGA" pin table is new. 4-34
The A3P400 "144-Pin FBGA" is new. 4-38
The A3P400 "256-Pin FBGA" was updated. 4-48
The A3P1000 "256-Pin FBGA" was updated. 4-54
The A3P400 "484-Pin FBGA" was updated. 4-58
The A3P1000 "484-Pin FBGA" was updated. 4-68
The A3P250 "100-Pin VQFP*" pin table was updated. 4-14
The A3P250 "208-Pin PQFP*" pin table was updated. 4-23
The A3P1000 "208-Pin PQFP*" pin table was updated. 4-29
The A3P250 "144-Pin FBGA*" pin table was updated. 4-36
The A3P1000 "144-Pin FBGA*" pin table was updated. 4-32
The A3P250 "256-Pin FBGA*" pin table was updated. 4-45
The A3P1000 "256-Pin FBGA*" pin table was updated. 4-54
The A3P1000 "484-Pin FBGA*" pin table was updated. 4-68
Advance v0.5
(November 2005)
The "I/Os Per Package" table was updated for the following devices and
packages:
Device Package
A3P250/M7ACP250 VQ100
A3P250/M7ACP250 FG144
A3P1000 FG256
ii
Advance v0.4 M7 device information is new. N/A
The I/O counts in the "I/Os Per Package" table were updated. ii
Advance v0.3 The "I/Os Per Package" table was updated. ii
M7 device information is new. N/A
Table 2-4 • ProASIC3 Globals/Spines/Rows by Device was updated to include
the number or rows in each top or bottom spine.
2-16
EXTFB was removed from Figure 2-24 • ProASIC3E CCC Options. 2-24
Revision Changes Page
ProASIC3 Flash Family FPGAs
Revision 13 5-11
Advance v0.3 The "PLL Macro" section was updated. EXTFB information was removed from
this section.
2-15
The CCC Output Peak-to-Peak Period Jitter FCCC_OUT was updated in Table 2-
11 • ProASIC3 CCC/PLL Specification
2-29
EXTFB was removed from Figure 2-27 • CCC/PLL Macro. 2-28
Table 2-13 • ProASIC3 I/O Features was updated. 2-30
The "Hot-Swap Support" section was updated. 2-33
The "Cold-Sparing Support" section was updated. 2-34
"Electrostatic Discharge (ESD) Protection" section was updated. 2-35
The LVPECL specification in Table 2-43 • I/O Hot-Swap and 5 V Input Tolerance
Capabilities in ProASIC3 Devices was updated.
2-64
In the Bank 1 area of Figure 2-72, VMV2 was changed to VMV1 and VCCIB2 was
changed to VCCIB1.
2-97
The VJTAG and I/O pin descriptions were updated in the "Pin Descriptions"
section.
2-50
The "JTAG Pins" section was updated. 2-51
"128-Bit AES Decryption" section was updated to include M7 device information. 2-53
Table 3-6 was updated. 3-6
Table 3-7 was updated. 3-6
In Table 3-11, PAC4 was updated. 3-93-8
Table 3-20 was updated. 3-20
The note in Table 3-32 was updated. 3-27
All Timing Characteristics tables were updated from LVTTL to Register Delays 3-31 to 3-
73
The Timing Characteristics for RAM4K9, RAM512X18, and FIFO were updated. 3-85 to
3-90
FTCKMAX was updated in Table 3-110. 3-97
Advance v0.2 Figure 2-11 was updated. 2-9
The "Clock Resources (VersaNets)" section was updated. 2-9
The "VersaNet Global Networks and Spine Access" section was updated. 2-9
The "PLL Macro" section was updated. 2-15
Figure 2-27 was updated. 2-28
Figure 2-20 was updated. 2-19
Table 2-5 was updated. 2-25
Table 2-6 was updated. 2-25
The "FIFO Flag Usage Considerations" section was updated. 2-27
Table 2-13 was updated. 2-30
Figure 2-24 was updated. 2-31
The "Cold-Sparing Support" section is new. 2-34
Revision Changes Page
Datasheet Information
5-12 Revision 13
Advance v0.2,
(continued)
Table 2-43 was updated. 2-64
Table 2-18 was updated. 2-45
Pin descriptions in the "JTAG Pins" section were updated. 2-51
The "User I/O Naming Convention" section was updated. 2-48
Table 3-7 was updated. 3-6
The "Methodology" section was updated. 3-10
Table 3-40 and Table 3-39 were updated. 3-33,3-32
The A3P250 "100-Pin VQFP*" pin table was updated. 4-14
The A3P250 "208-Pin PQFP*" pin table was updated. 4-23
The A3P1000 "208-Pin PQFP*" pin table was updated. 4-29
The A3P250 "144-Pin FBGA*" pin table was updated. 4-36
The A3P1000 "144-Pin FBGA*" pin table was updated. 4-32
The A3P250 "256-Pin FBGA*" pin table was updated. 4-45
The A3P1000 "256-Pin FBGA*" pin table was updated. 4-54
The A3P1000 "484-Pin FBGA*" pin table was updated. 4-68
Revision Changes Page
ProASIC3 Flash Family FPGAs
Revision 13 5-13
Datasheet Categories
Categories
In order to provide the latest information to designers, some datasheet parameters are published before
data has been fully characterized from silicon devices. The data provided for a given device, as
highlighted in the "ProASIC3 Device Status" table on page III, is designated as either "Product Brief,"
"Advance," "Preliminary," or "Production." The definitions of these categories are as follows:
Product Brief
The product brief is a summarized version of a datasheet (advance or production) and contains general
product information. This document gives an overview of specific device and family information.
Advance
This version contains initial estimated information based on simulation, other products, devices, or speed
grades. This information can be used as estimates, but not for production. This label only applies to the
DC and Switching Characteristics chapter of the datasheet and will only be used when the data has not
been fully characterized.
Preliminary
The datasheet contains information based on simulation and/or initial characterization. The information is
believed to be correct, but changes are possible.
Unmarked (production)
This version contains information that is considered to be final.
Export Administration Regulations (EAR)
The products described in this document are subject to the Export Administration Regulations (EAR).
They could require an approved export license prior to export from the United States. An export includes
release of product or disclosure of technology to a foreign national inside or outside the United States.
Safety Critical, Life Support, and High-Reliability Applications
Policy
The products described in this advance status document may not have completed the Microsemi
qualification process. Products may be amended or enhanced during the product introduction and
qualification process, resulting in changes in device functionality or performance. It is the responsibility of
each customer to ensure the fitness of any product (but especially a new product) for a particular
purpose, including appropriateness for safety-critical, life-support, and other high-reliability applications.
Consult the Microsemi SoC Products Group Terms and Conditions for specific liability exclusions relating
to life-support applications. A reliability report covering all of the SoC Products Group’s products is
available at http://www.microsemi.com/soc/documents/ORT_Report.pdf. Microsemi also offers a variety
of enhanced qualification and lot acceptance screening procedures. Contact your local sales office for
additional reliability information.
51700097-13/01.13
© 2012 Microsemi Corporation. All rights reserved. Microsemi and the Microsemi logo are trademarks of
Microsemi Corporation. All other trademarks and service marks are the property of their respective owners.
Microsemi Corporation (NASDAQ: MSCC) offers a comprehensive portfolio of semiconductor
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and alternative energy markets. Products include high-performance, high-reliability analog and
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