Ver. 201207 Multilayer Power Inductor CIG22E_MAE Series(2520/ EIA 1008) APPLICATION Mobile phones, DSC, DVC, PDA etc. for DC-DC Converter FEATURES RECOMMENDED LAND PATTERN High Current Type Low DC resistance Magnetically shielded structure Free of all RoHS-regulated substances Monolithic structure for high reliability DIMENSION TYPE 22 Dimension [mm] L W T D 2.50.2 2.00.2 0.80.1 0.550.25 DESCRIPTION Size Inductance DC Rated Current (A)1 Rated Current (A)2 (inch/mm) (uH)@1MHz Resistance() Typ. Max. CIG22ER33MAE 1008/2520 0.33 20 % 0.060 20% 4.80 2.0 CIG22ER47MAE 1008/2520 0.47 20 % 0.060 25% 4.05 2.0 CIG22ER56MAE 1008/2520 0.56 20 % 0.075 20% 4.10 1.9 CIG22E1R0MAE 1008/2520 1.0 20 % 0.090 20% 2.30 1.9 CIG22E2R2MAE 1008/2520 2.2 20 % 0.146 20% 1.05 1.3 Part no. Rated Current (A)1: DC current value when Inductance drops to 30% of nominal Inductance value (ONLY REFERENCE) Rated Current (A)2: DC current value when the self-generation of heat rises to 40 (Reference ambient temperature:25) Operating temperature range: -40 to +125C ( Including self-temperature rise) Test equipment: Agilent :E4991A+16092A CHARACTERISTIC DATA 1) Frequency characteristics (Typ.) 2) DC Bias characteristics (Typ.) Ver. 201207 PRODUCT IDENTIFICATION CI (1) (1) (3) (5) (7) (8) G (2) 22 (3) E (4) 1R0 (5) M (6) A (7) E (8) Chip Inductor (2) Power Inductor Dimension (4) Product Series (E:High Current Type) Inductance (1R0:1.0uH) (6) Tolerance (M:20%) Thickness option(N:Standard, A:Thinner than standard, B:Thicker than standard) Packaging(C:paper tape, E:embossed tape) RECOMMENDED SOLDERING CONDITION FLOW SOLDERING REFLOW SOLDERING PACKAGING Packaging Style Quantity(pcs/reel) Embossed Taping 3,000pcs NOTICE :All specifications are subject to change without previous notice. Please contact with product representatives or engineers to check specifications.