High Reliability Commercial Off-the-Shelf (COTS) T428 Series High Volumetric Efficiency Facedown MnO2 Overview The KEMET T428 Series was developed to provide the volumetric efficiency of a conformally coated capacitor in a pickand-place friendly molded package. The planerity of the molded package eliminates the "drops" associated with the conformally coated tantalum surface mount devices. This new package design offers the highest CV/cc of any molded leadframe product. In addition, the facedown construction offers higher power ratings per cc. The robust design features and testing protocol make this part suitable for application in the telecommunications, industrial, military and aerospace markets. Benefits Applications * * * * * * * * * * * * * Typical applications include decoupling and filtering in telecommunications, computer, industrial, defense and aerospace applications. High CV/cc Taped and reeled per EIA 481-1 SnPb termination finish Laser-marked case 100% surge current test available Halogen-free epoxy Capacitance values of 16 to 470 F Tolerances of 5%, 10% and 20% Voltage rating of 4 to 50 VDC Extended range values Pick-and-place friendly RoHS Compliant and lead-free terminations available Operating temperature range of -55C to +125C Environmental Compliance RoHS Compliant (6/6) according to Directive 2002/95/EC when ordered with 100% Sn solder. SPICE For a detailed analysis of specific part numbers, please visit www.kemet.com for a free download of KEMET's SPICE software. The KEMET SPICE program is freeware intended to aid design engineers in analyzing the performance of these capacitors over frequency, temperature, ripple, and DC bias conditions. One world. One KEMET (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 1 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Ordering Information T 428 P 227 K 006 A H 61 10 Capacitor Class Series Case Size Capacitance Code (pF) Capacitance Tolerance Voltage Failure Rate/ Design Lead Material Surge ESR P First two digits represent significant figures. Third digit specifies number of zeros. A = N/A B = 0.1%/1,000 hours H = Standard solder coated (SnPb 5% Pb) T = 100% tin (Sn) 61 = None 62 = 10 cycles, 25C 63 = 10 cycles, -55C and 85C 10 = Standard 20 = Low 30 = Ultra-low T= Tantalum High Volumetric Efficient Facedown Hi-Rel MnO2 COTS J = 5% K = 10% M = 20% 004 = 4 V 006 = 6.3 V 010 = 10 V 016 = 16 V 020 = 20 V 025 = 25 V 035 = 35 V 050 = 50 V Performance Characteristics Item Performance Characteristics Operating Temperature Rated Capacitance Range Capacitance Tolerance Rated Voltage Range -55C to 125C 16 - 470 F @ 120 Hz/25C J Tolerance (5%), K Tolerance (10%), M Tolerance (20%) 4 - 50 V DF (120 Hz) Refer to Part Number Electrical Specification Table ESR (100 kHz) Refer to Part Number Electrical Specification Table Leakage Current 0.01 CV (A) at rated voltage after 5 minutes (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 2 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Qualification Test Condition Characteristics C/C Endurance Storage Life Thermal Shock Temperature Stability 85C @ rated voltage, 2,000 hours 125C @ 2/3 rated voltage, 2,000 hours 125C @ 0 volts, 2,000 hours MIL-STD-202, Method 107, Condition B, mounted, -55C to 125C, 1,000 cycles Extreme temperature exposure at a succession of continuous steps at +25C, -55C, +25C, +85C, +125C, +25C DF Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits C/C Within 10% of initial value DF Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits C/C Within 5% of initial value DF Within initial limits DCL Within 1.25 x initial limit ESR Within initial limits +25C -55C +85C +125C C/C IL* 10% 10% 20% DF IL IL 1.5 x IL 1.5 x IL DCL IL n/a 10 x IL 12 x IL C/C Surge Voltage Mechanical Shock/Vibration Additional Qualification Tests per MIL-PRF-55365/8 Within 10% of initial value 25C and 85C, 1.32 x rated voltage 1,000 cycles (125C, 1.2 x rated voltage) MIL-STD-202, Method 213, Condition I, 100 G peak MIL-STD-202, Method 204, Condition D, 10 Hz to 2,000 Hz, 20 G peak Within 5% of initial value DF Within initial limits DCL Within initial limits ESR Within initial limits C/C Within 10 of initial value DF Within initial limits DCL Within initial limits Please contact KEMET for more information. *IL = Initial limit Certification MIL-PRF-55365/8 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 3 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Electrical Characteristics Impedance & ESR vs. Frequency 10 T428P390uF6V Z T428P390uF6V ESR vs. f T428P330uF10V Z T428P330uF10V ESR vs. f Impedance & ESR T428P180uF16V Z T428P180uF16V ESR vs. f 1 T428P68uF25V Z T428P68uF25V ESR vs. f T428P15uF50V Z T428P15uF50V ESR vs. f 0 0 100 1,000 10,000 100,000 f (Hz) 1,000,000 10,000,000 100,000,000 Capacitor vs. Frequency 10,000 T428P390uF6V T428P330uF10V T428P180uF16V T428P68uF25V Capacitance (F) 1,000 T428P15uF50V 100 10 1 100 1,000 10,000 f (Hz) 100,000 (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com 1,000,000 10,000,000 T2058_T428 * 9/19/2012 4 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Dimensions - Millimeters Case Size EIA L 7260-38 7.2 Max. Component W H F 0.2 S1 0.2 S2 0.2 4.95 1.6 1.6 6.0 0.3 3.5 0.3 Note: Molded case dimensions are 7.0 mm L x 6.12 mm W x 3.78 mm H Table 1 - Ratings & Part Number Reference Rated Voltage Rated Capacitance Case Code/ Case Size KEMET Part Number DC Leakage DF Standard ESR Low ESR Ultra-Low ESR VDC F KEMET/EIA (See below for part options) 4 6.3 6.3 10 16 16 20 25 35 50 470 390 470 330 180 220 150 68 22 15 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 P/7260-38 T428P477(1)004(2)(3)(4)(5) T428P397(1)006(2)(3)(4)(5) T428P477(1)006(2)(3)(4)(5) T428P337(1)010(2)(3)(4)(5) T428P187(1)016(2)(3)(4)(5) T428P227(1)016(2)(3)(4)(5) T428P157(1)020(2)(3)(4)(5) T428P686(1)025(2)(3)(4)(5) T428P226(1)035(2)(3)(4)(5) T428P156(1)050(2)(3)(4)(5) VDC F KEMET/EIA (See below for part options) A @ +20C Maximum/ 5 Minutes 18.8 24.6 29.6 33.0 28.8 35.2 30.0 17.0 7.7 7.5 A @ +20C Maximum/ 5 Minutes %@ +20C 120 Hz Maximum 10.0 8.0 10.0 8.0 8.0 8.0 8.0 6.0 6.0 6.0 %@ +20C 120 Hz Maximum m @ +20C 100 kHz Maximum 130 130 120 130 130 120 140 200 280 400 m @ +20C 100 kHz Maximum m @ +20C 100 kHz Maximum 45 45 50 45 55 55 100 95 220 350 m @ +20C 100 kHz Maximum @ +20C 100 kHz Maximum NA NA NA NA NA NA NA NA NA NA @ +20C 100 kHz Maximum Rated Voltage Rated Capacitance Case Code/ Case Size KEMET Part Number DC Leakage DF Standard ESR Low ESR Ultra-Low ESR (1) To complete KEMET part number, insert J for 5%, K for 10% and M for 20%. Designates capacitance tolerance. (2) To complete KEMET part number, insert B (0.1%/1,000 hours) or A = N/A. (3) To complete KEMET part number, insert H = solder plated or T = 100% tin (Sn). Designates termination finish. (4) To complete KEMET part number, insert 61 = none, 62 = 10 cycles +25C or 63 = 10 cycles -55C +85C. Designates surge current option. (5) To complete KEMET part number, insert 10 = standard, 20 = low or 30 = ultra-low. Designates ESR option. Please refer to Ordering Information for additional details. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com Roll Over for Order Info. T2058_T428 * 9/19/2012 5 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Recommended Voltage Derating Guidelines 1.2 -55C to 125C 50% of VR VR 100% of VR VR 1 0.8 % Working Voltage % Change in Working DC Voltage with Temperature Recommended Maximum Application Voltage % Change in Working DC Voltage with Temperature 67% 0.6 0.4 Recommended Maximum Application Voltage (As % of Rated Voltage) 33% 0.2 0 -55 25 85 125 Temperature (C) Ripple Current/Ripple Voltage KEMET Case Code EIA Case Code Maximum Power Dissipation (P max) mWatts @ 25C with +20C Rise P 7260-38 325 Temperature Compensation Multipliers for Maximum Power Dissipation 25C 1.00 85C 0.90 125C 0.40 T= Environmental Temperature Using the P max of the device, the maximum allowable rms ripple current or voltage may be determined. I(max) = P max/R E(max) = P max*R I = rms ripple current (amperes) E = rms ripple voltage (volts) P max = maximum power dissipation (watts) R = ESR at specified frequency (ohms) (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 6 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Reverse Voltage Solid tantalum capacitors are polar devices and may be permanently damaged or destroyed if connected with the wrong polarity. The positive terminal is identified on the capacitor body by a stripe, plus in some cases a beveled edge. A small degree of transient reverse voltage is permissible for short periods per the below table. The capacitors should not be operated continuously in reverse mode, even within these limits. Temperature Permissible Transient Reverse Voltage 25C 85C 125C 15% of Rated Voltage 5% of Rated Voltage 1% of Rated Voltage Table 2 - Land Dimensions/Courtyard KEMET Metric Size Code Density Level A: Maximum (Most) Land Protrusion (mm) Density Level B: Median (Nominal) Land Protrusion (mm) Density Level C: Minimum (Least) Land Protrusion (mm) Case EIA X Y C V1 V2 X Y C V1 V2 X Y C V1 V2 P 7260-38 5.25 1.80 2.35 8.50 7.30 5.15 1.70 2.35 8.00 6.80 5.05 1.60 2.35 7.70 6.50 Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reflow solder processes. Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reflow solder processes. Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualification testing based on the conditions outlined in IPC Standard 7351 (IPC-7351). Height of these chips may create problems in wave soldering. Land pattern geometry is too small for silkscreen outline. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 7 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Soldering Process Note that although the X/7343-43 case size can withstand wave soldering, the tall profile (4.3 mm maximum) dictates care in wave process development. Hand soldering should be performed with care due to the difficulty in process control. If performed, care should be taken to avoid contact of the soldering iron to the molded case. The iron should be used to heat the solder pad, applying solder between the pad and the termination, until reflow occurs. Once reflow occurs, the iron should be removed immediately. "Wiping" the edges of a chip and heating the top surface is not recommended. During typical reflow operations, a slight darkening of the goldcolored epoxy may be observed. This slight darkening is normal and not harmful to the product. Marking permanency is not affected by this change. Profile Feature SnPb Assembly Pb-Free Assembly Preheat/Soak Temperature Minimum (TSmin) 100C 150C Temperature Maximum (TSmax) 150C 200C Time (ts) from Tsmin to Tsmax) 60 - 120 seconds 60 - 120 seconds 3C/seconds maximum Ramp-up Rate (TL to TP) 3C/seconds maximum Liquidous Temperature (TL) 183C 217C Time Above Liquidous (t L) 60 - 150 seconds 220C* 235C** 60 - 150 seconds 250C* 260C** Peak Temperature (TP) Time within 5C of Maximum Peak Temperature (tP) Ramp-down Rate (TP to TL) 20 seconds maximum 30 seconds maximum 6C/seconds maximum 6C/seconds maximum Time 25C to Peak Temperature 6 minutes maximum 8 minutes maximum Note: All temperatures refer to the center of the package, measured on the package body surface that is facing up during assembly reflow. *Case Size D, E, P, Y, and X **Case Size A, B, C, H, I, K, M, R, S, T, U, V, W, and Z TP TL Temperature KEMET's families of surface mount capacitors are compatible with wave (single or dual), convection, IR, or vapor phase reflow techniques. Preheating of these components is recommended to avoid extreme thermal stress. KEMET's recommended profile conditions for convection and IR reflow reflect the profile conditions of the IPC/J-STD-020D standard for moisture sensitivity testing. The devices can safely withstand a maximum of three reflow passes at these conditions. tP Maximum Ramp Up Rate = 3C/seconds Maximum Ramp Down Rate = 6C/seconds tL Tsmax Tsmin 25 tS 25C to Peak Time Construction Epoxy Tantalum Washer Tantalum Wire Weld MnO2 Leadframe (+ Anode) Ta2O5 Silver Paint Carbon Leadframe (-Cathode) (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 8 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Capacitor Marking (FDM) Facedown MnO2 Polarity Indicator (+) FDM 337 Rated Voltage Picofarad Code 2R5 K KEMET ID 030 Date Code* * 030 = 30th week of 2010 Date Code * 1 digit = Last number of Year 9 = 2009 0 = 2010 1 =2011 2 = 2012 3 = 2013 4 =2014 3rd and 4th digit = Week of the Year 01 = 1st week of the Year to 52 = 52nd week of the Year st Storage Tantalum chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term storage. In addition, packaging materials will be degraded by high temperature- reels may soften or warp and tape peel force may increase. KEMET recommends that maximum storage temperature not exceed 40C and maximum storage humidity not exceed 60% relative humidity. Temperature fluctuations should be minimized to avoid condensation on the parts and atmospheres should be free of chlorine and sulphur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within three years of receipt. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 9 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Tape & Reel Packaging Information KEMET's molded tantalum and aluminum chip capacitor families are packaged in 8 and 12 mm plastic tape on 7" and 13" reels in accordance with EIA Standard 481-1: Embossed Carrier Taping of Surface Mount Components for Automatic Handling. This packaging system is compatible with all tape-fed automatic pick-and-place systems. 8 mm (0.315") or 12 mm (0.472") Top Tape Thickness 0.10 mm (0.004") Maximum Thickness 180 mm (7.0") or 330 mm (13.0") Table 3 - Packaging Quantity Case Code KEMET R I S T M U L W Z V A B C D Y X E/T428P H EIA 2012-12 3216-10 3216-12 3528-12 3528-15 6032-15 6032-19 7343-15 7343-17 7343-20 3216-18 3528-21 6032-28 7343-31 7343-40 7343-43 7260-38 7360-20 Tape Width (mm) 7" Reel* 13" Reel* 8 8 8 8 8 12 12 12 12 12 8 8 12 12 12 12 12 12 2,500 3,000 2,500 2,500 2,000 1,000 1,000 1,000 1,000 1,000 2,000 2,000 500 500 500 500 500 1,000 10,000 12,000 10,000 10,000 8,000 5,000 5,000 3,000 3,000 3,000 9,000 8,000 3,000 2,500 2,000 2,000 2,000 2,500 * No C-Spec required for 7" reel packaging. C-7280 required for 13" reel packaging. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 10 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Figure 1 - Embossed (Plastic) Carrier Tape Dimensions P2 T T2 ODo Po [10 pitches cumulative tolerance on tape 0.2 mm] E1 Ao F Ko W B1 E2 Bo S1 P1 T1 Center Lines of Cavity OD 1 Cover Tape B 1 is for tape feeder reference only, including draft concentric about B o. Embossment For cavity size, see Note 1 Table 4 User Direction of Unreeling Table 4 - Embossed (Plastic) Carrier Tape Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size D0 8 mm 12 mm 1.5 +0.10/-0.0 (0.059 +0.004/-0.0) 16 mm D1 Minimum Note 1 1.0 (0.039) 1.5 (0.059) E1 P0 P2 1.75 0.10 (0.069 0.004) 4.0 0.10 (0.157 0.004) 2.0 0.05 (0.079 0.002) R Reference Note 2 25.0 (0.984) 30 (1.181) S1 Minimum Note 3 0.600 (0.024) T Maximum T1 Maximum 0.600 (0.024) 0.100 (0.004) Variable Dimensions -- Millimeters (Inches) Tape Size Pitch 8 mm Single (4 mm) 12 mm Single (4 mm) & Double (8 mm) 16 mm Triple (12 mm) B1 Maximum Note 4 4.35 (0.171) 8.2 (0.323) 12.1 (0.476) E2 Minimum F P1 T2 Maximum W Maximum A0,B0 & K0 6.25 (0.246) 10.25 (0.404) 14.25 (0.561) 3.5 0.05 (0.138 0.002) 5.5 0.05 (0.217 0.002) 5.5 0.05 (0.217 0.002) 4.0 0.10 (0.157 0.004) 8.0 0.10 (0.315 0.004) 8.0 0.10 (0.315 0.004) 2.5 (0.098) 4.6 (0.181) 4.6 (0.181) 8.3 (0.327) 12.3 (0.484) 16.3 (0.642) Note 5 1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of embossment location and hole location shall be applied independent of each other. 2. The tape, with or without components, shall pass around R without damage (see Figure 5). 3. If S1 < 1.0 mm, there may not be enough area for cover tape to be properly applied (see EIA Standard 481-D, paragraph 4.3, section b). 4. B1 dimension is a reference dimension for tape feeder clearance only. 5. The cavity defined by A0, B0 and K0 shall surround the component with sufficient clearance that: (a) the component does not protrude above the top surface of the carrier tape. (b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been removed. (c) rotation of the component is limited to 20 maximum for 8 and 12 mm tapes and 10 maximum for 16 mm tapes (see Figure 2). (d) lateral movement of the component is restricted to 0.5 mm maximum for 8 mm and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape (see Figure 3). (e) see Addendum in EIA Standard 481-D for standards relating to more precise taping requirements. (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 11 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Packaging Information Performance Notes 1. Cover Tape Break Force: 1.0 Kg minimum. 2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be: Tape Width Peel Strength 8 mm 0.1 to 1.0 Newton (10 to 100 gf) 12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf) The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165 to 180 from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 10 mm/minute. 3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA Standards 556 and 624. Figure 2 - Maximum Component Rotation T Maximum Component Rotation Top View Maximum Component Rotation Side View Typical Pocket Centerline Tape Width (mm) 8,12 16 - 200 Bo Maximum Rotation ( 20 10 T) Typical Component Centerline Ao Figure 3 - Maximum Lateral Movement 8 mm & 12 mm Tape 0.5 mm maximum 0.5 mm maximum 16 mm Tape s Tape Maximum Width (mm) Rotation ( 8,12 20 16 - 56 10 72 - 200 5 S) Figure 4 - Bending Radius Embossed Carrier Punched Carrier 1.0 mm maximum 1.0 mm maximum R Bending Radius (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com R T2058_T428 * 9/19/2012 12 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Figure 5 - Reel Dimensions Full Radius, See Note W3 (Includes Access Hole at Slot Location (O 40 mm minimum) flange distortion at outer edge) W2 (Measured at hub) D A N (See Note) C (Arbor hole diameter) B (see Note) W1 (Measured at hub) If present, tape slot in core for tape start: 2.5 mm minimum width x 10.0 mm minimum depth Note: Drive spokes optional; if used, dimensions B and D shall apply. Table 5 - Reel Dimensions Metric will govern Constant Dimensions -- Millimeters (Inches) Tape Size A B Minimum C D Minimum 8 mm 178 0.20 (7.008 0.008) or 330 0.20 (13.000 0.008) 1.5 (0.059) 13.0 +0.5/-0.2 (0.521 +0.02/-0.008) 20.2 (0.795) 12 mm 16 mm Variable Dimensions -- Millimeters (Inches) Tape Size N Minimum W1 W2 Maximum W3 50 (1.969) 8.4 +1.5/-0.0 (0.331 +0.059/-0.0) 12.4 +2.0/-0.0 (0.488 +0.078/-0.0) 16.4 +2.0/-0.0 (0.646 +0.078/-0.0) 14.4 (0.567) 18.4 (0.724) 22.4 (0.882) Shall accommodate tape width without interference 8 mm 12 mm 16 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 13 Tantalum Surface Mount Capacitors High Reliability Commercial Off-the-Shelf (COTS) - T428 Series High Volumetric Efficiency Facedown MnO2 Figure 6 - Tape Leader & Trailer Dimensions Embossed Carrier Carrier Tape Punched Carrier 8 mm & 12 mm only END Round Sprocket Holes START Top Cover Tape Elongated Sprocket Holes (32 mm tape and wider) Trailer 160 mm Minimum Components 100 mm Minimum Leader 400 mm Minimum Top Cover Tape Figure 7 - Maximum Camber Elongated sprocket holes (32 mm & wider tapes) Carrier Tape Round Sprocket Holes 1 mm Maximum, either direction Straight Edge 250 mm (c) KEMET Electronics Corporation * P.O. Box 5928 * Greenville, SC 29606 (864) 963-6300 * www.kemet.com T2058_T428 * 9/19/2012 14