OPERATING
TEMPERATURE
RANGE
VIO max
at 25°C
SLOS074 − D2785, OCT OBER 1983 — REVISED JUNE 1988
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Copyright 1991, Texas Instruments Incorporated
1
•Matched Gain and Offset Between
Amplifiers
•Unity-Gain Bandwidth ...3 MHz Min
•Slew Rate . . . 1.5 V/ns Min
•Low Equivalent Input Noise Voltage
2 µV/Hz Max (20 Hz to 20 kHz)
•No Frequency Compensation Required
•No Latch Up
•Wide Common-Mode Voltage Range
•Low Power Consumption
•Designed to be Interchangeable with
Raytheon RC4559
AVAILABLE OPTIONS
SYMBOLIZATION
DEVICE PACKAGE
SUFFIX
RC4559 D, P −0°C to 70°C6 mV
The D packages are available taped and reeled. Add the suffix R to
the device type when ordering. (i.e.,RC4559DR)
description
The RC4559 is a dual high-performance operational amplifier. The high common-mode input voltage and the
absence of latch-up make this amplifier ideal for low-noise signal applications such as audio preamplifiers and
signal conditioners. This amplifier features a guaranteed dynamic performance and output drive capability that
far exceeds that of the general-purpose type amplifiers.
The RC4559 is characterized for operation from 0°C to 70°C.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage VCC+ (see Note 1) 18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Supply voltage VCC− (see Note 1) −18 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Differential input voltage (see Note 2) ±30 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input voltage (any input, see Notes 1 and 3) ±15 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Duration of output short-circuit to ground, one amplifier at a time (see Note 4) unlimited. . . . . . . . . . . . . . . . .
Continuous total dissipation 500 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating free-air temperature range 0°C to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature range −65°C to 125°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
NOTES: 1. All voltage values, unless otherwise noted, are with respect to the zero reference level (ground) of the supply voltages where the zero
reference level is the midpoint between VCC+ and VCC−.
2. Differential voltages are at the noninverting input terminal with respect to the inverting input terminal.
3. The magnitude of the input voltage must never exceed the magnitude of the supply voltage or 15 volts, whichever is less.
4. Temperature and/or supply voltages must be limited to ensure that the dissipation rating is not exceeded.
−
+
IN+ OUT
IN−
1
2
3
4
8
7
6
5
OUT
IN−
IN+
VCC−
VCC+
OUT
IN−
IN+
D OR P PACKAGE
(TOP VIEW)
AMP # 1
AMP # 2
s
ymbol (each amplifier)
VIO Input offset voltage VO = 0
VO = 0
VO = 0
mV
nA
nA
IIO Input offset current
IIBInput bias current
VIInput voltage range V/mV
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
2
electrical characteristics at specified free-air temperature, VCC+ = 15 V, VCC− = −15 V
PARAMETER TEST CONDITIONS†TA‡MIN TYP MAX UNIT
25°C 2 6
Full Range 7.5
25°C 5 100
Full range 200
25°C 40 250
Full range 500
VIInput voltage range 25°C±12 ±13 V
RL ≥3 kΩ25°C±12 ±13
VOM Maximum peak output voltlage swing RL = 600 Ω25°C±9.5 ±10 V
RL ≥2 kΩFull range ±10
VO = ±10 V, 25°C 20 300
RL = 2 kΩFull range 15
BOM Maximum output-swing bandwidth VOPP = 20 V,
RL = 2 kΩ25°C 24 32 kHz
B1Unity-gain bandwidth 25°C 3 4 MHz
riInput resistance 25°C 0.3 1 MΩ
CMRR Common-mode rejection ratio VO = 0 25°C 80 100 dB
kSVS Supply voltage sensitivity (∆VIO/∆VCC) VO = 0 25°C 10 75 µV/V
VnEquivalent input noise voltage (closed loop) AVD = 100,
RS = 1 kΩ,
f = 20 Hz to 20 kHz 25°C 1.4 2 µV
InEquivalent input noise current f = 20 Hz to 20 kHz 25°C 25 pA
25°C 3.3 5.6
ICC Supply current (both amplifiers) No load, No signal 0°C 4 6.6 mA
70°C 3 5
Vo1/Vo2 Crosstalk attentuation AVD = 100,
RS = 1 kΩ,
f = 10 kHz 25°C 90 dB
†All characteristics are specified under open-loop operation, unless otherwise noted.
‡Full range operating free-air temperature range is 0°C to 70°C.
matching characteristics at VCC+ = 15 V, VCC− = −15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIO Input offset voltage VO = 0 ±0.2 mV
IIO Input offset current VO = 0 ±7.5 nA
IIB Input bias current VO = 0 ±15 nA
AVD Large-signal differential voltage amplification VO = ±10 V, RL = 2 kΩ ± 1 dB
operating characteristics, VCC+ = 15 V, VCC− = −15 V, TA = 25°C
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
trRise time VI = 20 mV, RL = 2 kΩ, CL = 100 pF 80 µs
Overshoot 18%
SR Slew rate at unity gain VI = 10 mV, RL = 2 kΩ, CL = 100 pF 1.5 2 V/µs
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
RC4559D ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559DE4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559DG4 ACTIVE SOIC D 8 75 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559DR ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559DRE4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559DRG4 ACTIVE SOIC D 8 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
RC4559P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
RC4559PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 23-Apr-2007
Addendum-Page 1
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
RC4559DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
RC4559DR SOIC D 8 2500 340.5 338.1 20.6
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
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