XA3S50-4VQG100Q - Xilinx, Inc. - Datasheet.Directory

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Product Specification 1

countries. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium in the U.S. and other jurisdictions. All other trademarks are the property of their

respective owners.

Summary

The Xilinx® Automotive (XA) Spartan®-3 family of Field-Programmable Gate Arrays meets the needs of high-volume,

cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million

system gates, as shown in Ta bl e 1 .

Introduction

XA devices are available in both extended-temperature

Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to

+100°C TJ) and are qualified to the industry-recognized

AEC-Q100 standard.

The XA Spartan-3 family builds on the success of the earlier

XA Spartan-IIE family by increasing the amount of logic

resources, the capacity of internal RAM, the total number of

I/Os, and the overall level of performance as well as by

improving clock management functions. These Spartan-3

enhancements, combined with advanced process

technology, deliver more functionality and bandwidth per

dollar than was previously possible, setting new standards

in the programmable logic industry.

Because of their exceptionally low cost, Spartan-3 FPGAs

are ideally suited to a wide range of advanced automotive

electronics modules and systems ranging from the latest

driver assistance and infotainment systems to instrument

clusters and gateways.

The Spartan-3 family is a flexible alternative to ASICs,

ASSPs, and microcontrollers. FPGAs avoid the high initial

NREs, the lengthy development cycles, and problems with

obsolescence. Also, FPGA programmability permits design

upgrades in the field with no hardware replacement

necessary.

Features

•AEC-Q100 device qualification and full PPAP

documentation support available in both extended

temperature Q-grade and I-grade

•Guaranteed to meet full electrical specification over the

= –40°C to +125°C temperature range

•Revolutionary 90-nanometer process technology

•Low cost, high-performance logic solution for

high-volume, automotive applications

♦Three power rails: for core (1.2V), I/Os (1.2V to

3.3V), and auxiliary purposes (2.5V)

•SelectIO™ interface signaling

♦Up to 487 I/O pins

♦622 Mb/s data transfer rate per I/O

♦Eighteen single-ended signal standards

♦Eight differential signal standards including LVDS

♦Termination by Digitally Controlled Impedance

♦Signal swing ranging from 1.14V to 3.45V

♦Double Data Rate (DDR) support

•Logic resources

♦Abundant logic cells with shift register capability

♦Wide multiplexers

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XA Spartan-3 Automotive FPGA Family:

Introduction and Ordering Information

DS314 (v1.3) June 18, 2009 00 Product Specification

Tabl e 1 : Summary of Spartan-3 FPGA Attributes

Device

System

Gates

Logic

Cells

CLB Array

(One CLB = Four Slices) Distributed

RAM (bits1)

Block RAM

(bits1)

Dedicated

Multipliers DCMs

Maximum

User I/O

Maximum

Differential

I/O PairsRows Columns Total CLBs

XA3S50 50K 1,728 16 12 192 12K 72K 4 2 124 56

XA3S200 200K 4,320 24 20 480 30K 216K 12 4 173 76

XA3S400 400K 8,064 32 28 896 56K 288K 16 4 264 116

XA3S1000 1M 17,280 48 40 1,920 120K 432K 24 4 333 149

XA3S1500 1.5M 29,952 64 52 3,328 208K 576K 32 4 487 221

Notes:

1. By convention, one Kb is equivalent to 1,024 bits.

Introduction and Ordering Information

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Product Specification 2

♦Fast look-ahead carry logic

♦Dedicated 18 x 18 multipliers

♦JTAG logic compatible with IEEE 1149.1/1532

•SelectRAM™ hierarchical memory

♦Up to 576 Kbits of total block RAM

♦Up to 208 Kbits of total distributed RAM

•Digital Clock Manager (up to four DCMs)

♦Clock skew elimination

♦Frequency synthesis

♦High-resolution phase shifting

♦Maximum clock frequency 125 MHz

•Fully supported by Xilinx ISE® software development

system

♦Synthesis, mapping, placement and routing

•MicroBlaze™ processor, CAN, LIN, MOST, and other

cores

•Pb-free packaging options

•Xilinx and all of our production partners are qualified to

ISO-TS16949

Please refer to the Spartan-3 complete data sheet (DS099)

for a full product description, AC and DC specifications, and

package pinout descriptions

Architectural Overview

The Spartan-3 family architecture consists of five

fundamental programmable functional elements:

•Configurable Logic Blocks (CLBs) contain RAM-based

Look-Up Tables (LUTs) to implement logic and storage

elements that can be used as flip-flops or latches.

CLBs can be programmed to perform a wide variety of

logical functions as well as to store data.

•Input/Output Blocks (IOBs) control the flow of data

between the I/O pins and the internal logic of the

device. Each IOB supports bidirectional data flow plus

3-state operation. Twenty-six different signal standards,

including eight high-performance differential standards,

are available as shown in Table 2 . Double Data-Rate

(DDR) registers are included. The Digitally Controlled

Impedance (DCI) feature provides automatic on-chip

terminations, simplifying board designs.

•Block RAM provides data storage in the form of 18-Kbit

dual-port blocks.

•Multiplier blocks accept two 18-bit binary numbers as

inputs and calculate the product.

•Digital Clock Manager (DCM) blocks provide

self-calibrating, fully digital solutions for distributing,

delaying, multiplying, dividing, and phase shifting clock

signals.

These elements are organized as shown in Figure 1. A ring

of IOBs surrounds a regular array of CLBs. The XA3S50

has a single column of block RAM embedded in the array.

Those devices ranging from the XA3S200 to the XA3S1500

have two columns of block RAM. Each column is made up

of several 18 Kbit RAM blocks; each block is associated

with a dedicated multiplier. The DCMs are positioned at the

ends of the block RAM columns.

The Spartan-3 family features a rich network of traces and

switches that interconnect all five functional elements,

transmitting signals among them. Each functional element

has an associated switch matrix that permits multiple

connections to the routing.

Introduction and Ordering Information

DS314 (v1.3) June 18, 2009 www.xilinx.com

Product Specification 3

Configuration

Spartan-3 FPGAs are programmed by loading configuration

data into robust static memory cells that collectively control

all functional elements and routing resources. Before

powering on the FPGA, configuration data is stored

externally in a PROM or some other nonvolatile medium

either on or off the board. After applying power, the

configuration data is written to the FPGA using any of five

different modes: Master Parallel, Slave Parallel, Master

Serial, Slave Serial and Boundary Scan (JTAG). The Master

and Slave Parallel modes use an 8-bit-wide SelectMAP

port.

I/O Capabilities

The SelectIO feature of Spartan-3 devices supports 18

single-ended standards and eight differential standards as

listed in Tabl e 2. Many standards support the DCI feature,

which uses integrated terminations to eliminate unwanted

signal reflections. Ta b l e 3 shows the number of user I/Os as

well as the number of differential I/O pairs available for each

device/package combination.

Figure 1: Spartan-3 Family Architecture

DS314-1_01_100808

Notes:

1. The XA3S50 has only the block RAM column on the far left.

Introduction and Ordering Information

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Product Specification 4

Tabl e 2 : Signal Standards Supported by the Spartan-3 Family

Standard

Category Description VCCO (V) Class Symbol DCI

Option

Single-Ended

GTL Gunning Transceiver Logic N/A Terminated GTL Ye s

Plus GTLP Ye s

HSTL High-Speed Transceiver Logic 1.5 I HSTL_I Ye s

III HSTL_III Ye s

1.8 I HSTL_I_18 Ye s

II HSTL_II_18 Ye s

III HSTL_III_18 Ye s

LVCMOS Low-Voltage CMOS 1.2 N/A LVCMOS 1 2 No

1.5 N/A LVCM O S15 Ye s

1.8 N/A LVCM O S18 Ye s

2.5 N/A LVCM O S25 Ye s

3.3 N/A LVCM O S33 Ye s

LVTTL Low-Voltage Transistor-Transistor Logic 3.3 N/A LVTTL No

PCI Peripheral Component Interconnect 3.0 33 MHz PCI33_3 No

SSTL Stub Series Terminated Logic 1.8 N/A (±6.7 mA) SSTL18_I Ye s

N/A (±13.4 mA) SSTL18_II No

2.5 I SSTL2_I Ye s

II SSTL2_II Ye s

Differential

LDT

(ULVDS)

Lightning Data Transport

(HyperTransport™)

2.5 N/A LDT_25 No

LVDS Low-Voltage Differential Signaling Standard LVDS_25 Ye s

Bus BLVDS_25 No

Extended Mode LVDSEXT_25 Ye s

LVPECL Low-Voltage Positive Emitter-Coupled

Logic

2.5 N/A LVPECL_25 No

RSDS Reduced-Swing Differential Signaling 2.5 N/A RSDS_25 No

HSTL Differential High-Speed Transceiver Logic 1.8 II DIFF_HSTL_II_18 Ye s

SSTL Differential Stub Series Terminated Logic 2.5 II DIFF_SSTL2_II Ye s

Introduction and Ordering Information

DS314 (v1.3) June 18, 2009 www.xilinx.com

Product Specification 5

DC Specifications

Tabl e 3 : Spartan-3 XA I/O Chart

Device Grade

Available User I/Os and Differential (Diff) I/O Pairs

VQG100 TQG144 PQG208 FTG256 FGG456 FGG676

User Diff User Diff User Diff User Diff User Diff User Diff

XA3S50I,Q6329--12456---- - -

XA3S200I,Q632997461416217376 - - - -

XA3S400 I,Q - - - - 141 62 173 76 264 116 - -

XA3S1000 I,Q - - - - - - 173 76 333 149 - -

XA3S1500 I - - - - - - - - 333 149 487 221

Notes:

1. All device options listed in a given package column are pin-compatible.

Tabl e 4 : General Recommended Operating Conditions

Symbol Description Min Nom Max Units

TJJunction temperature I-Grade –40 25 100 °C

Q-Grade –40 25 125 °C

VCCINT Internal supply voltage 1.140 1.200 1.260 V

VCCO(1) Output driver supply voltage 1.140 - 3.450 V

VCCAUX Auxiliary supply voltage 2.375 2.500 2.625 V

ΔVCCAUX(2) Voltage variance on VCCAUX when using a DCM --10mV/ms

VIN Voltage applied to all User I/O

pins and Dual-Purpose pins

relative to GND

VCCO = 3.3V –0.3 - 3.75 V

VCCO < 2.5V –0.3 - VCCO+0.3 V

Voltage applied to all

Dedicated pins relative to

GND

–0.3 - VCCAUX+0.3 V

Notes:

1. The VCCO range given here spans the lowest and highest operating voltages of all supported I/O standards. The recommended VCCO range

specific to each of the single-ended I/O standards is given in Table 34 of DS099, and that specific to the differential standards is given in

Table 36 of DS099.

2. Only during DCM operation is it recommended that the rate of change of VCCAUX not exceed 10 mV/ms.

Introduction and Ordering Information

DS314 (v1.3) June 18, 2009 www.xilinx.com

Product Specification 6

Ordering Information

Spartan-3 FPGAs are available in Pb-free packaging options for all device/package combinations. The Pb-free packages

include a special “G” character in the ordering code.

Tabl e 5 : Quiescent Supply Current Characteristics

Symbol Description Device I-Grade

Maximum

Q-Grade

Maximum Units

ICCINTQ Quiescent VCCINT supply current XA3S50 50 100 mA

XA3S200 125 200 mA

XA3S400 180 250 mA

XA3S1000 315 400 mA

XA3S1500 410 - mA

ICCOQ Quiescent VCCO supply current XA3S50 12 12 mA

XA3S200 12 12 mA

XA3S400 14 14 mA

XA3S1000 14 14 mA

XA3S1500 16 - mA

ICCAUXQ Quiescent VCCAUX supply current XA3S50 22 25 mA

XA3S200 33 35 mA

XA3S400 44 50 mA

XA3S1000 55 60 mA

XA3S1500 85 - mA

Notes:

1. The numbers in this table are based on the conditions set forth in Table 31 of DS099. Quiescent supply current is measured with all

I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads disabled. Typical values are

characterized using devices with typical processing at ambient room temperature (TA of 25°C at VCCINT = 1.2V, VCCO = 3.3V, and

VCCAUX = 2.5V). Maximum values are the production test limits measured for each device at the maximum specified junction

temperature and at maximum voltage limits with VCCINT = 1.26V, VCCO = 3.45V, and VCCAUX = 2.625V. The FPGA is programmed

with a “blank” configuration data file (i.e., a design with no functional elements instantiated). For conditions other than those

described above, (e.g., a design including functional elements, the use of DCI standards, etc.), measured quiescent current levels

may be different than the values in the table. Use the XPower Power Estimator for more accurate estimates. See Note 2.

2. There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The

XPower Power Estimator at http://www.xilinx.com/ise/power_tools provides quick, approximate, typical estimates, and does not

require a netlist of the design. b) XPower, part of the Xilinx ISE development software, uses the FPGA netlist as input to provide more

accurate maximum and typical estimates.

3. The maximum numbers in this table also indicate the minimum current each power rail requires in order for the FPGA to power-on

successfully, once all three rails are supplied. If VCCINT is applied before VCCAUX, there may be temporary additional ICCINT current

until VCCAUX is applied. See Surplus ICCINT if VCCINT Applied before VCCAUX, page 51 of DS099.

Figure 2: Spartan-3 BGA Package Marking Example for Part Number XA3S1000-4 FTG256Q

Lot Code

Date Code

XA3S1000TM

SPARTAN

Device Type

BGA Ball A1

Package

Speed Grade

Temperature Range

FTG256EGQ0525

D1234567A

Mask Revision Code

Process Code

Fabrication Code

DS314-1_02_100808

Introduction and Ordering Information

DS314 (v1.3) June 18, 2009 www.xilinx.com

Product Specification 7

Pb-Free Packaging

For additional information on Pb-free packaging, see XAPP427: Implementation and Solder Reflow Guidelines for Pb-Free

Packages.

Additional Resources

•DS099, Spartan-3 FPGA Family Data Sheet

•UG331, Spartan-3 Generation FPGA User Guide

•UG332, Spartan-3 Generation Configuration User Guide

Revision History

The following table shows the revision history for this document:

XA3S50 -4 PQ G 208 Q

Device Type

Speed Grade

Temperature Range:

Q-Grade = Automotive Extended (T

= –40°C to +125°C)

I-Grade = Automotive Industrial (T

= –40°C to +100°C)

Package Type Number of Pins

Pb-free

Example:

DS314-1_03_100808

Tabl e 6 : Package Types and Number of Pins

Device Speed Grade Package Type / Number of Pins Temperature Range ( TJ

)

XA3S50 -4 Standard

Performance VQG100 100-pin Very Thin Quad Flat Pack (VQFP) I I-Grade (– 40°C to +100°C)

XA3S200 TQG144 144-pin Thin Quad Flat Pack (TQFP) Q Q-Grade (– 40°C to +125°C)

XA3S400 PQG208 208-pin Plastic Quad Flat Pack (PQFP)

XA3S1000 FTG256 256-ball Fine-Pitch Thin Ball Grid Array

(FTBGA)

XA3S1500 FGG456 456-ball Fine-Pitch Ball Grid Array (FBGA)

FGG676 676-ball Fine-Pitch Ball Grid Array (FBGA)

Date Version Description

10/18/04 1.0 Initial Xilinx release.

12/20/04 1.1 Multiple text edits throughout.

10/27/06 1.2 Updated IO standards (Ta b l e 2 ), and link to Spartan-3 Data Sheet, added XA3S1500, TQG144, FGG676,

Table 4, and Ta bl e 5 .

11/28/06 1.2.1 Changed order of explanations in Ta ble 6 for TQG144 and PQG208.

11/12/07 1.2.2 Changed all values for the Block RAM (bits) column and two values for the XA3S1000 row in Tabl e 1 .

01/25/08 1.2.3 Changed XA3S1500 Q-Grade Maximum in Table 5 .

06/18/09 1.3 Added UG331 and UG332 to "Additional Resources" section.

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Product Specification 8

Notice of Disclaimer

THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND

CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED

WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE

SPECIFICATIONS STATED ON THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.

PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE

PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES

THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL

APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO

APPLICABLE LAWS AND REGULATIONS.

Automotive Applications Disclaimer

XILINX PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE, OR FOR USE IN ANY APPLICATION REQUIRING

FAIL-SAFE PERFORMANCE, SUCH AS APPLICATIONS RELATED TO: (I) THE DEPLOYMENT OF AIRBAGS, (II) CONTROL OF A

VEHICLE, UNLESS THERE IS A FAIL-SAFE OR REDUNDANCY FEATURE (WHICH DOES NOT INCLUDE USE OF SOFTWARE IN

THE XILINX DEVICE TO IMPLEMENT THE REDUNDANCY) AND A WARNING SIGNAL UPON FAILURE TO THE OPERATOR, OR (III)

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