© Semiconductor Components Industries, LLC, 2002
February, 2021 − Rev. 2
1Publication Order Number:
NC7SV08/D
TinyLogic ULP-A 2-Input
AND Gate
NC7SV08
The NC7SV08 is a single 2−Input AND Gate in tiny footprint
packages. The device is designed to operate for VCC = 0.9 V to 3.6 V.
Features
•Designed for 0.9 V to 3.6 V VCC Operation
•1.6 ns tPD at 3.3 V (Typ)
•Inputs/Outputs Over−Voltage Tolerant up to 3.6 V
•IOFF Supports Partial Power Down Protection
•Source/Sink 24 mA at 3.3 V
•Available in SC−88A and MicroPak™ Packages
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
6V
CC
A1
B2
4YGND 3
5NC
Figure 1. Pinout Diagrams (Top Views)
SC−88A MicroPak
Figure 2. Logic Symbol
VCC
B
A
Y
GND
1
2
34
5
&Y
A
B
PIN ASSIGNMENT
Pin SC−88A MicroPak
1 A A
2 B B
3 GND GND
4 Y Y
5 VCC N.C.
6−VCC
N.C. = No Connect
FUNCTION TABLE
Input
Output
Y = AB
A B Y
L L L
L H L
H L L
H H H
MARKING
DIAGRAMS
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SIP6 1.45X1.0
MicroPak
CASE 127EB
CC = Specific Device Code
KK = 2−Digit Lot Run Traceability Code
XY = 2−Digit Date Code
Z = Assembly Plant Code
UDFN6
MicroPak2
CASE 517DP
CCKK
XYZ
Pin 1
CCKK
XYZ
Pin 1
See detailed ordering, marking and shipping information on
page 6 of this data sheet.
ORDERING INFORMATION
XXXMG
G
XXX = Specific Devic Code
M = Date Code
G= Pb−Free Package
SC−88A
CASE 419A−02
NC7SV08
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2
MAXIMUM RATINGS
Symbol Characteristics Value Unit
VCC DC Supply Voltage −0.5 to +4.3 V
VIN DC Input Voltage −0.5 to +4.3 V
VOUT DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
−0.5 to VCC + 0.5
−0.5 to +4.3
−0.5 to +4.3
V
IIK DC Input Diode Current VIN < GND −50 mA
IOK DC Output Diode Current VOUT < GND −50 mA
IOUT DC Output Source/Sink Current ±50 mA
ICC or IGND DC Supply Current per Supply Pin or Ground Pin ±50 mA
TSTG Storage Temperature Range −65 to +150 °C
TLLead Temperature, 1 mm from Case for 10 Seconds 260 °C
TJJunction Temperature Under Bias +150 °C
qJA Thermal Resistance (Note 2) SC−88A
MicroPak
377
154
°C/W
PDPower Dissipation in Still Air SC−88A
MicroPak
332
812
mW
MSL Moisture Sensitivity Level 1 −
FRFlammability Rating Oxygen Index: 28 to 34 UL 94 V−0 @ 0.125 in −
VESD ESD Withstand Voltage (Note 3) Human Body Model
Charged Device Model
4000
2000
V
ILatchup Latchup Performance (Note 4) ±100 mA
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Applicable to devices with outputs that may be tri−stated.
2. Measured with minimum pad spacing on an FR4 board, using 10 mm−by−1 inch, 2 ounce copper trace no air flow per JESD51−7.
3. HBM tested to EIA / JESD22−A114−A. CDM tested to JESD22−C101−A. JEDEC recommends that ESD qualification to EIA/JESD22−A115A
(Machine Model) be discontinued.
4. Tested to EIA/JESD78 Class II.
NC7SV08
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3
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
VCC Positive DC Supply Voltage 0.9 3.6 V
VIN DC Input Voltage 0 3.6 V
VOUT DC Output Voltage Active−Mode (High or Low State)
Tri−State Mode (Note 1)
Power−Down Mode (VCC = 0 V)
0
0
0
VCC
3.6
3.6
TAOperating Temperature Range −40 +85 °C
tr , tfInput Transition Rise and Fall Time VCC = 3.3 V ± 0.3 V 0 10 ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition VCC (V)
TA = 255C TA = −405C to +855C
Unit
Min Typ Max Min Max
VIH High−Level Input
Voltage
0.9 −0.5 − − − V
1.1 to 1.3 0.65 x VCC − − 0.65 x VCC −
1.4 to 1.6 0.65 x VCC − − 0.65 x VCC −
1.65 to 1.95 0.65 x VCC − − 0.65 x VCC −
2.3 to <2.7 1.6 − − 1.6 −
2.7 to 3.6 2.0 − − 2.0 −
VIL Low−Level Input
Voltage
0.9 −0.5 − − − V
1.1 to 1.3 − − 0.35 x VCC −0.35 x VCC
1.4 to 1.6 − − 0.35 x VCC −0.35 x VCC
1.65 to 1.95 − − 0.35 x VCC −0.35 x VCC
2.3 to <2.7 − − 0.7 −0.7
2.7 to 3.6 − − 0.8 −0.8
VOH High−Level Output
Voltage
VIN = VIH or VIL V
IOH = −100 mA0.9 −VCC –
0.1
− − −
1.1 to 1.3 VCC – 0.1 − − VCC – 0.1 −
1.4 to 1.6 VCC – 0.1 − − VCC – 0.1 −
1.65 to 1.95 VCC – 0.2 − − VCC – 0.2 −
2.3 to <2.7 VCC – 0.2 − − VCC – 0.2 −
2.7 to 3.6 VCC – 0.2 − − VCC – 0.2 −
IOH = −2 mA 1.1 o 1.3 0.75 x VCC − − 0.75 x VCC −
IOH = −4 mA 1.4 to 1.6 0.75 x VCC − − 0.75 x VCC −
IOH = −6 mA 1.65 to 1.95 1.25 − − 1.25 −
2.3 to <2.7 2.0 − − 2.0 −
IOH = −12 mA 2.3 to <2.7 1.8 − − 1.8 −
2.7 to 3.6 2.2 − − 2.2 −
IOH = −18 mA 2.3 to <2.7 1.7 − − 1.7 −
2.7 to 3.6 2.4 − − 2.4 −
IOH = −24 mA 2.7 to 3.6 2.2 − − 2.2 −
NC7SV08
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4
DC ELECTRICAL CHARACTERISTICS (continued)
TA = −405C to +855CTA = 255C
Symbol Unit
MaxMinMaxTypMin
VCC (V)ConditionParameter
VOL Low−Level
Output Voltage
VIN = VIH or VIL V
IOL = 100 mA0.9 −0.1 − − −
1.1 to 1.3 − − 0.1 −0.1
1.4 to 1.6 − − 0.1 −0.1
1.65 to 1.95 − − 0.2 −0.2
2.3 to < 2.7 − − 0.2 −0.2
2.7 to 3.6 − − 0.2 −0.2
IOL = 2 mA 1.1 o 1.3 − − 0.25 x VCC −0.25 x VCC
IOL = 4 mA 1.4 to 1.6 − − 0.25 x VCC −0.25 x VCC
IOL = 6 mA 1.65 to 1.95 − − 0.3 −0.3
IOL = 12 mA 2.3 to <2.7 − − 0.4 −0.4
2.7 to 3.6 − − 0.4 −0.4
IOL = 18 mA 2.3 to <2.7 − − 0.6 −0.6
2.7 to 3.6 − − 0.4 −0.4
IOL = 24 mA 2.7 to 3.6 − − 0.55 −0.55
IIN Input Leakage
Current
VIN = 0 V to 3.6 V 0.9 to 3.6 − − ±0.1 −±0.5 mA
IOFF Power Off Leakage
Current
VIN = 0 V to 3.6 V or
VOUT = 0 V to 3.6 V
0− − 0.5 −0.5 mA
ICC Quiescent Supply
Current
VIN = VCC or GND 0.9 to 3.6 − − 0.9 −0.9 mA
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
AC ELECTRICAL CHARACTERISTICS
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
Symbol
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Parameter
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
Condition
ÎÎÎÎÎ
ÎÎÎÎÎ
ÎÎÎÎÎ
VCC (V)
ÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎ
TA = 25°C
ÎÎÎÎÎÎ
ÎÎÎÎÎÎ
TA = −405C to +855C
ÎÎÎ
ÎÎÎ
ÎÎÎ
Unit
ÎÎÎ
ÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Typ
ÎÎÎ
ÎÎÎ
Max
ÎÎÎÎ
ÎÎÎÎ
Min
ÎÎÎ
ÎÎÎ
Max
tPLH,
tPHL
Propagation Delay,
(A or B) to Y (Figures 3
and 4)
RL = 1 MW, CL = 15 pF 0.9 −15.9 − − − ns
RL = 2 kW, CL = 15 pF 1.1 to 1.3 −6.8 11.6 −14.6
1.4 to 1.6 −3.6 6.0 −7.2
RL = 500 W, CL = 30 pF 1.65 to 1.95 −2.6 4.5 −5.3
2.3 to 2.7 −1.9 2.6 −3.7
2.7 to 3.6 −1.6 2.3 −3.0
CAPACITIVE CHARACTERISTICS
Symbol Parameter Test Condition Typical (TA = 25°C) Unit
CIN Input Capacitance VCC = 0 V 2.0 pF
CPD Power Dissipation Capacitance (Note 5) f = 10 MHz, VCC = 0.9 to 3.6 V, VIN = 0 V or VCC 8.0 pF
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation ICC(OPR) = CPD VCC fin + ICC. CPD is used to determine the no−load dynamic
power consumption: PD = CPD VCC2 fin + ICC VCC.
NC7SV08
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5
CL includes probe and jig capacitance
RT is ZOUT of pulse generator (typically 50 W)
f = 1 MHz
R1
OUTPUT
RT
2 x VCC
DUT
GND
OPEN
CL*
RL
INPUT
Test Switch Position
tPLH / tPHL Open
tPLZ / tPZL 2 x VCC
tPHZ / tPZH GND
Figure 3. Test Circuit
tr = 3 ns
tPZH tPHZ
tPZL tPLZ
Vmo
Vmo
Vmi
90%
10%
90%
10%
INPUT
OUTPUT
OUTPUT
~0 V
INPUT
OUTPUT
OUTPUT
tf = 3 ns
VCC
GND
VOH
VOL
VOH
VOL
Vmo
Vmo
Vmi
tPHL tPLH
tPLH tPHL
Vmo
Vmo
Vmi Vmi
VCC
GND
VOL
VOH
VOH − VY
VOL + VY
~VCC
VCC, V Vmi, V Vmo, V VY
, V
0.9 VCC / 2 VCC / 2 0.1
1.1 to 1.3 VCC / 2 VCC / 2 0.1
1.4 to 1.6 VCC / 2 VCC / 2 0.1
1.65 to 1.95 VCC / 2 VCC / 2 0.15
2.3 to 2.7 VCC / 2 VCC / 2 0.15
3.0 to 3.6 1.5 1.5 0.3
Figure 4. Switching Waveforms
NC7SV08
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6
ORDERING INFORMATION
Device Package Marking
Pin 1 Orientation
(See below) Shipping†
NC7SV08P5X SC−88A V08 Q4 3000 / Tape & Reel
NC7SV08L6X MicroPak G3 Q4 5000 / Tape & Reel
NC7SV08FHX MicroPak2 G3 Q4 5000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Pin 1 Orientation in Tape and Reel
MicroPak is trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
NC7SV08
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9
PACKAGE DIMENSIONS
SC−88A (SC−70−5/SOT−353)
CASE 419A−02
ISSUE L
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A−01 OBSOLETE. NEW STANDARD
419A−02.
4. DIMENSIONS A AND B DO NOT INCLUDE
MOLD FLASH, PROTRUSIONS, OR GATE
BURRS.
DIM
A
MIN MAX MIN MAX
MILLIMETERS
1.80 2.200.071 0.087
INCHES
B1.15 1.350.045 0.053
C0.80 1.100.031 0.043
D0.10 0.300.004 0.012
G0.65 BSC0.026 BSC
H--- 0.10---0.004
J0.10 0.250.004 0.010
K0.10 0.300.004 0.012
N0.20 REF0.008 REF
S2.00 2.200.079 0.087
B0.2 (0.008) MM
12 3
45
A
G
S
D 5 PL
H
C
N
J
K
−B−
ǒmm
inchesǓ
SCALE 20:1
0.65
0.025
0.65
0.025
0.50
0.0197
0.40
0.0157
1.9
0.0748
SOLDER FOOTPRINT
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