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0.1 µF
LM3480IM3-5.0
3
2 1 5 V, 100 mA OUT6.5 V IN
CIN
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LM3480
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LM3480 100-mA, SOT-23, Quasi Low-Dropout Linear Voltage Regulator
1 Features 3 Description
The LM3480 is an integrated linear voltage regulator.
1• Input Voltage Range: up to 30 V It features operation from an input as high as 30 V
• 3.3-V, 5-V, 12-V, and 15-V Versions Available and an ensured maximum dropout of 1.2 V at the full
• Packaged in the Tiny 3-Lead SOT-23 Package 100-mA load. Standard packaging for the LM3480 is
the 3-lead SOT-23 package.
• 30-V Maximum Input for Operation
• 1.2-V Ensured Maximum Dropout Over Full Load The 5-V, 12-V, and 15-V members of the LM3480
and Temperature Ranges series are intended as tiny alternatives to industry
standard LM78Lxx series and similar devices. The
• 100-mA Ensured Minimum Load Current 1.2-V quasi-low dropout of LM3480 series devices
• ±5% Ensured Output Voltage Tolerance Over Full makes them a nice fit in many applications where the
Load and Temperature Ranges 2-V to 2.5-V dropout of LM78Lxx series devices
•−40 to 125°C Junction Temperature Range for precludes their (LM78Lxx series devices) use.
Operation The LM3480 series also features a 3.3-V member.
The SOT-23 packaging and quasi-low dropout
2 Applications features of the LM3480 series converge in this device
to provide a very nice, very tiny, 3.3-V, 100-mA bias
• Tiny Alternative to LM78Lxx Series and Similar supply that regulates directly off the system 5-V ±5%
Devices power supply.
• Tiny 5-V ±5% to 3.3-V, 100-mA Converter
• Post Regulator for Switching DC/DC Converter Device Information(1)
• Bias Supply for Analog Circuits PART NUMBER PACKAGE BODY SIZE (NOM)
LM3480 SOT-23 (3) 2.92 mm × 1.30 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet.
space
space
space
Typical Application Circuit
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
LM3480
SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
www.ti.com
Table of Contents
7.2 Functional Block Diagram....................................... 10
1 Features.................................................................. 17.3 Feature Description................................................. 10
2 Applications ........................................................... 17.4 Device Functional Modes........................................ 10
3 Description............................................................. 18 Application and Implementation ........................ 11
4 Revision History..................................................... 28.1 Application Information............................................ 11
5 Pin Configuration and Functions......................... 38.2 Typical Application ................................................. 11
6 Specifications......................................................... 49 Power Supply Recommendations...................... 13
6.1 Absolute Maximum Ratings ...................................... 410 Layout................................................................... 13
6.2 ESD Ratings.............................................................. 410.1 Layout Guidelines ................................................. 13
6.3 Recommended Operating Conditions....................... 410.2 Layout Example .................................................... 13
6.4 Thermal Information.................................................. 411 Device and Documentation Support................. 14
6.5 Electrical Characteristics: LM3480-3.3, LM3480-5... 511.1 Trademarks........................................................... 14
6.6 Electrical Characteristics: LM3480-12, LM3480-15.. 611.2 Electrostatic Discharge Caution............................ 14
6.7 Typical Characteristics.............................................. 711.3 Glossary................................................................ 14
7 Detailed Description............................................ 10 12 Mechanical, Packaging, and Orderable
7.1 Overview................................................................. 10 Information........................................................... 14
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (December 2014) to Revision G Page
• Changed pin numbers indicated in Typical Application drawing; fix typos............................................................................. 1
• Deleted soldering specs - found in POA ................................................................................................................................ 4
• Changed Handling Ratings to ESD Ratings format ............................................................................................................... 4
Changes from Revision E (March 2013) to Revision F Page
• Added Pin Configuration and Functions section, Handling Rating table, Feature Description section, Device
Functional Modes,Application and Implementation section, Power Supply Recommendations section, Layout
section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information
section; add updated Thermal Information............................................................................................................................. 1
Changes from Revision D (March 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format ............................................................................................................. 9
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5 Pin Configuration and Functions
SOT-23 (DBZ) Package
3 Pins
Top View
Pin Functions
PIN I/O DESCRIPTION
NAME NO.
OUT 1 O Output voltage
IN 2 I Input voltage supply
GND 3 — Common ground
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6 Specifications
6.1 Absolute Maximum Ratings(1)(2)
MIN MAX UNIT
Input voltage (IN to GND) –0.3 35 V
Power dissipation(3) Internally
Limited
Junction temperature(3) –40 150 °C
Storage temperature, Tstg −65 150 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.
(2) If Military- or Aerospace-specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(3) The Absolute Maximum power dissipation depends on the ambient temperature and can be calculated using P = (TJ– TA) / RθJA where
TJis the junction temperature, TAis the ambient temperature, and RθJA is the junction-to-ambient thermal resistance. The 370-mW
rating results from substituting the Absolute Maximum junction temperature, 150°C for TJ, 50°C for TA, and 269.6°C/W for RθJA. More
power can be safely dissipated at lower ambient temperatures. Less power can be safely dissipated at higher ambient temperatures.
The Absolute Maximum power dissipation can be increased by 3.7 mW for each °C below 50°C ambient. It must be derated by 3.7 mW
for each °C above 50°C ambient. Heat sinking enables the safe dissipation of more power. The LM3480 actively limits its junction
temperature to about 150°C.
6.2 ESD Ratings VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
Electrostatic
V(ESD) V
discharge Charged-device model (CDM), per JEDEC specification JESD22-C101(2) ±500
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Maximum input voltage (IN to GND) 0 30 V
Junction temperature (TJ) –40 125 °C
(1) Absolute Maximum Ratings are limits beyond which damage to the device may occur. Recommended Operating Conditions are
conditions under which operation of the device is ensured. Recommended operating ratings do not imply ensured performance limits.
For ensured performance limits and associated test conditions, see the Electrical Characteristics: LM3480-3.3, LM3480-5.
6.4 Thermal Information LM3480
THERMAL METRIC(1) SOT-23 (DBZ) UNIT
3 PINS
RθJA Junction-to-ambient thermal resistance 269.6
RθJC(top) Junction-to-case (top) thermal resistance 141.1
RθJB Junction-to-board thermal resistance 63.1 °C/W
ψJT Junction-to-top characterization parameter 24.2
ψJB Junction-to-board characterization parameter 62.1
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
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6.5 Electrical Characteristics: LM3480-3.3, LM3480-5
Typical and other limits apply for TA= TJ= 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 3.3 V or 5
V.(1)(2)(3)
VNOM = 3.3 V VNOM = 5 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V 3.17 3.3 3.43 4.8 5 5.2
1 mA ≤IOUT ≤100 mA
VOUT Output voltage V
VIN = VNOM + 1.5 V
1 mA ≤IOUT ≤100 mA 3.14 3.46 4.75 5.25
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 10 12
IOUT = 1 mA
ΔVOUT Line regulation mV
VNOM + 1.5 V ≤VIN ≤30 V
IOUT = 1 mA 25 25
−40°C ≤TJ≤125°C
VIN = VNOM + 1.5 V 20 20
10 mA ≤IOUT ≤100 mA
ΔVOUT Load regulation mV
VIN = VNOM + 1.5 V
10 mA ≤IOUT ≤100 m 40 40
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 2 2
No Load
IGND Ground pin current mA
VNOM + 1.5 V ≤VIN ≤30 V
No Load, 4 4
−40°C ≤TJ≤125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9 V
IOUT = 10 mA 1 1
−40°C ≤TJ≤125°C
VIN -Dropoutvoltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1 V
IOUT = 100 mA 1.2 1.2
−40°C ≤TJ≤125°C
VIN = 10 V
enOutput noise voltage 100 150 µVrms
Bandwidth: 10 Hz to 100 kHz
(1) A typical is the center of characterization data taken with TA= TJ= 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA= TJ= 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.
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6.6 Electrical Characteristics: LM3480-12, LM3480-15
Typical and other limits apply for TA= TJ= 25°C, unless otherwise specified. Nominal output voltage (VNOM) = 12 V or 15
V.(1)(2)(3)
VNOM = 12 V VNOM = 15 V
PARAMETER TEST CONDITIONS UNIT
MIN TYP MAX MIN TYP MAX
VIN = VNOM + 1.5 V 11.52 12 12.48 14.4 15 15.6
1 mA ≤IOUT ≤100 mA
VOUT Output voltage V
VIN = VNOM + 1.5 V
1 mA ≤IOUT ≤100 mA 11.4 12.6 14.25 15.75
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 14 16
IOUT = 1 mA
ΔVOUT Line regulation mV
VNOM + 1.5 V ≤VIN ≤30 V
IOUT = 1 mA 40 40
−40°C ≤TJ≤125°C
VIN = VNOM + 1.5 V 36 45
10 mA ≤IOUT ≤100 mA
ΔVOUT Load regulation mV
VIN = VNOM + 1.5 V
10 mA ≤IOUT ≤100 mA 60 75
−40°C ≤TJ≤125°C
VNOM + 1.5 V ≤VIN ≤30 V 2 2
No Load
IGND Ground pin current mA
VNOM + 1.5 V ≤VIN ≤30 V 4 4
No Load, −40°C ≤TJ≤125°C
IOUT = 10 mA 0.7 0.9 0.7 0.9 V
IOUT = 10 mA, 1 1
−40°C ≤TJ≤125°C
VIN -Dropout voltage
VOUT IOUT = 100 mA 0.9 1.1 0.9 1.1 V
IOUT = 100 mA , 1.2 1.2
−40°C ≤TJ≤125°C
VIN = 10 V
enOutput noise voltage 360 450 µVrms
Bandwidth: 10 Hz to 100 kHz
(1) A typical is the center of characterization data taken with TA= TJ= 25°C. Typicals are not ensured.
(2) All limits are ensured. All electrical characteristics having room-temperature limits are tested during production with TA= TJ= 25°C. All
hot and cold limits are ensured by correlating the electrical characteristics to process and temperature variations and applying statistical
process control.
(3) All voltages except dropout are with respect to the voltage at the GND pin.
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6.7 Typical Characteristics
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 1. Dropout Voltage vs Load Current Figure 2. Dropout Voltage vs Junction Temperature
Figure 3. Ground Pin Current vs Input Voltage Figure 4. Ground Pin Current vs Input Voltage
Figure 5. Ground Pin Current vs Load Current Figure 6. Ground Pin Current vs Junction Temperature
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Typical Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 7. Input Current vs Input Voltage Figure 8. Input Current vs Input Voltage
Figure 9. Output Voltage vs Input Voltage Figure 10. Output Voltage vs Input Voltage
Figure 11. Output Voltage vs Input Voltage Figure 12. Output Voltage vs Input Voltage
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Typical Characteristics (continued)
Unless indicated otherwise, VIN = VNOM + 1.5 V, CIN = 0.1 µF, COUT = 0.1 µF, and TA .= 25°C.
Figure 13. Output Short-Circuit Current Figure 14. Output Short-Circuit Current
Figure 15. Power Supply Rejection Ratio Figure 16. Power Supply Rejection Ratio
Figure 17. DC Load Regulation
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+
Thermal
Shutdown
IN OUT
GND
PNP
Bandgap
Reference
OVSD
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7 Detailed Description
7.1 Overview
The LM3480 is an integrated linear voltage regulator with inputs that can be as high as 30 V. It ensures a
maximum dropout of 1.2 V at the full load of 100 mA. The LM3480 has different output options including 3.3-V, 5-
V, 12-V, and 15-V outputs, making LM3480 the tiny alternative to industry standard LM78Lxx series and similar
devices.
7.2 Functional Block Diagram
7.3 Feature Description
7.3.1 3.3-V, 5-V, 12-V, and 15-V Versions Available
The 3.3-V, 5-V, 12-V, and 15-V versions of LM3480 series are intended as tiny alternatives to industry standard
LM78Lxx series and similar devices.
7.3.2 1.2-V Ensured Maximum Dropout
The 1.2-V quasi-low dropout of the LM3480 series devices make them a nice fit in many application where the 2-
V to 2.5-V dropout of LM78Lxx series devices precludes their use.
7.4 Device Functional Modes
7.4.1 Operation with VIN =5V
The 3.3-V member of LM3480 can operate with an input of 5 V ±5%, its tiny SOT-23 package and quasi-low
dropout makes it suitable for providing a very tiny, 3.3-V, 100-mA bias supply from 5-V power supply.
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COUT
0.1 µF
LM3480IM3-5.0
3
2 1 5 V, 100 mA OUT6.5 V IN
CIN
0.1 µF
LM3480
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SNVS011G –JUNE 1999–REVISED FEBRUARY 2015
8 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
8.1 Application Information
The LM3480 is a linear voltage regulator with 1.2-V ensured maximum dropout and 100-mA ensured minimum
load current. This device has 3.3-V, 5-V, 12-V, and 15-V versions. The implementation of LM3480 is discussed in
this section.
8.2 Typical Application
8.2.1 Design Requirements
DESIGN PARAMETER EXAMPLE VALUE
Input voltage 6.5 V
Output voltage 5 V
Output current 100 mA
8.2.2 Detailed Design Procedure
8.2.2.1 External Capacitors
The output capacitor is critical to maintaining regulator stability, and must meet the required conditions for both
equivalent series resistance (ESR) and minimum amount of capacitance.
8.2.2.1.1 Output Capacitor
The output capacitance required to maintain stability is 0.1 µF. Larger values of output capacitance will give
improved transient response.
8.2.3 Application Curves
Unless indicated otherwise, VIN = 6.5 V, VOUT =5V,COUT = 0.1 µF, and TA= 25°C
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Figure 18. Line Transient Response Figure 19. Line Transient Response
Figure 20. Load Transient Response Figure 21. Load Transient Response
Figure 22. Load Transient Response Figure 23. Load Transient Response
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VOUT
VIN
GND
IN
GND
OUT
2 1
3
LM3480
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9 Power Supply Recommendations
The LM3480 is designed to operated from up to a 30-V input voltage supply. This input supply must be well
regulated. If the input supply is noisy, additional input capacitors with low ESR can help to improve the output
noise performance.
10 Layout
10.1 Layout Guidelines
For best overall performance, place all the circuit components on the same side of the circuit board and as near
as practical to the respective LDO pin connections. Place ground return connections to the input and output
capacitors, and to the LDO ground pin as close to each other as possible, connected by a wide, component-side,
copper surface. The use of vias and long traces to create LDO circuit connections is strongly discouraged and
negatively affects system performance. This grounding and layout scheme minimizes the inductive parasitic, and
thereby reduces load-current transients, minimizes noise, and increases circuit stability.
A ground reference plane is also recommended and is either embedded in the PCB itself or located on the
bottom side of the PCB opposite the components. This reference plane serves to assure accuracy of the output
voltage, shield noise, and behaves similar to a thermal plane to spread heat from the LDO device. In most
applications, this ground plane is necessary to meet thermal requirements.
10.2 Layout Example
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11 Device and Documentation Support
11.1 Trademarks
All trademarks are the property of their respective owners.
11.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
11.3 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM3480IM3-12 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 L0C
LM3480IM3-12/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0C
LM3480IM3-15/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0D
LM3480IM3-3.3 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 L0A
LM3480IM3-3.3/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0A
LM3480IM3-5.0 NRND SOT-23 DBZ 3 1000 TBD Call TI Call TI -40 to 125 L0B
LM3480IM3-5.0/NOPB ACTIVE SOT-23 DBZ 3 1000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0B
LM3480IM3X-12 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 L0C
LM3480IM3X-12/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0C
LM3480IM3X-15/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0D
LM3480IM3X-3.3 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 L0A
LM3480IM3X-3.3/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0A
LM3480IM3X-5.0 NRND SOT-23 DBZ 3 3000 TBD Call TI Call TI -40 to 125 L0B
LM3480IM3X-5.0/NOPB ACTIVE SOT-23 DBZ 3 3000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L0B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM3480IM3-12 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0 SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-12 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-5.0 SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 178.0 8.4 3.3 2.9 1.22 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2015
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM3480IM3-12 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-12/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-15/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-3.3/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0 SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3-5.0/NOPB SOT-23 DBZ 3 1000 210.0 185.0 35.0
LM3480IM3X-12 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-12/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-15/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-3.3/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-5.0 SOT-23 DBZ 3 3000 210.0 185.0 35.0
LM3480IM3X-5.0/NOPB SOT-23 DBZ 3 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 27-Jan-2015
Pack Materials-Page 2
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LM3480IM3-12 LM3480IM3-12/NOPB LM3480IM3-15/NOPB LM3480IM3-3.3 LM3480IM3-3.3/NOPB LM3480IM3-
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LM3480IM3X-3.3/NOPB LM3480IM3X-5.0 LM3480IM3X-5.0/NOPB
