ADVANTECH
DRAM Memory Module
Portfolio Introduction
PAPS Product Management
Q1 / 2016
PART I.
ADVANTECH QUALIFIED DIMM
(AQD)
Advantech Confidential
& Internal Use Only
- 3 -
Q1/2016
Built to Last ---
The toughest memory module for rigorous applications
ADVANTECH QUALIFIED DIMM
Advantech Confidential
& Internal Use Only
- 4 -
Q1/2016
QUALITY RELIABILITY COMPATIBILITY LONGEVITY LIFE-TIME
WARRANTY
SELLING PROPOSITION
Advantech Confidential
& Internal Use Only
- 5 -
Quality Assurance Rigorous Reliability
Tests Cross-Checked
Compatibility Longevity Life-Time Warranty
Advantech Confidential
& Internal Use Only
- 6 -
100% Module On
Board Testing Shock & Vibration
Test Chamber Test Functional Test
Quality Assurance Rigorous Reliability
Tests Cross-Checked
Compatibility Longevity Life-Time Warranty
Advantech Confidential
& Internal Use Only
- 7 -
Quality Assurance Rigorous Reliability
Tests Cross-Checked
Compatibility Longevity Life-Time Warranty
Motherboard Team
DOA Testing Result
Memory Compatibility
Testing Result
Check & Compare
Both Teams Cross Compare Testing Results to Ensure M/B & Memory Compatibility
Advantech Confidential
& Internal Use Only
- 8 -
Locked BOM
- IC Spec
-PCB Layout
Minimum 3 Years Longevity
Quality Assurance Rigorous Reliability
Tests Cross-Checked
Compatibility Longevity Life-Time Warranty
Advantech Confidential
& Internal Use Only
- 9 -
Q1/2016
Every ADVATECH QUALIFIED
DIMM (AQD) is back up by
Lifetime Warranty
Quality Assurance Rigorous Reliability
Tests Cross-Checked
Compatibility Longevity Life-Time Warranty
Advantech Confidential
& Internal Use Only
- 10 -
Small Things Matter
For better durability all AQD DRAM applies IPC-2221,using
30u Golden plated connector to ensure DRAM’s stability in
any given circumstances. (Est. Running Change Q1 / 2015)
Advantech Confidential
& Internal Use Only
- 11 -
Q1/2016
Unbuffered DIMM
- General IPC Applications
ECC Unbuffered DIMM
- Improve System Productivity & Efficiency
Registered DIMM
- Providing The Best Solution for
Capacity and Performance Requirement
Load Reduce DIMM
- Providing the biggest capacity
per server with the lowest energy costs
AQD Product Portfolio
DDR3: 1GB, 2GB, 4GB & 8GB
DDR4: 4GB, 8GB, 16GB(New)
DDR3: 2GB, 4GB & 8GB
DDR4: 4GB, 8GB, 16GB(New)
DDR3: 4GB, 8GB & 16GB
DDR4: 4GB, 8GB & 16GB
DDR3: 32GB
Advantech Confidential
& Internal Use Only
- 12 -
Q1/2016
Product Roadmap
Q1 2016
Advantech Confidential
& Internal Use Only
- 13 -
Q1/2016
Color / Symbol Key
Q D S D G N V S
SD2=DDR2 SO-DIMM
SD3=DDR3 SO-DIMM
SD4= DDR4 SO-DIMM
D2=DDR2
D3=DDR3
D4=DDR4
SPEED
1G=1GB
2G=2GB
4G=4GB
8G=8GB
16 =16GB
32 =32GB
64= 64GB
TYPE 40=400Mt/s
53=533Mt/s
66=667Mt/s
80=800Mt/s
10=1066Mt/s
13=1333Mt/s
16=1600Mt/s
18=1866Mt/s
FAB
S=Samsu
ng
H=Hynix
M=Micron
/Elpida
N=Nanya
– 2 1 6
ADVNCED
FEATURE
N=
NON-ECC
and NON
REGISTER
R=
REGISTER
E= ECC
ONLY
L=Load
reduce
G
A
PRODUCT NAME
A=Advantech
Q=Qualified
D=DIMM
3 L
VERSION
X=1Gb(128Mx8)
T=1Gb(256Mx4)
C=2Gb
Q=2Gb(256Mx8)
Y=2Gb(512Mx4)
G=4Gb(512Mx8)
Z=4Gb(1Gbx4)
E=8Gb(1Gbx8)
M=8Gb(2Gbx4)
VOLTAGE
Blank=
1.5V
L=1.35V
U=1.2V
CAPACITY Height
V=
VLP
–
AQD Naming Convention
Advantech Confidential
& Internal Use Only
- 14 -
AQD DDR2 & DDR3 Memory Modules Portfolio
800 1333 1600
SHORT LONG SHORT LONG SHORT
Non-VLP Non-VLP Non-VLP VLP Non-VLP Non-VLP
U-
DIMM
1GB
(128X8) AQD-SD21GN80-SX
AQD-D31GN13-SX AQD-SD31GN13-
SX
1GB
(128X16) AQD-D31GN16-HC
AQD-D3L1GN16-HC AQD-SD31GN16-HC
AQD-SD3L1GN16-HC
2GB
(256MX8) AQD-D3L2GNV16-
SQ
(New) AQD-D3L2GN16-SQ
AQD-D3L2GN16-HQ AQD-SD3L2GN16-SQ
AQD-SD3L2GN16-HQ
4GB
(256MX8) AQD-D3L4GN16-MQ
AQD-D3L4GN16-SQ AQD-SD3L4GN16-MQ
AQD-SD3L4GN16-SQ
4GB
(512MX8)
AQD-D3L4GNV16-SG
(New)
AQD-D3L4GN16-SG
AQD-D3L4GN16-HG
AQD-D3L4GN16-MG
AQD-SD3L4GN16-SG
AQD-SD3L4GN16-HG
AQD-SD3L4GN16-MG
8GB
(512MX8) AQD-D3L8GNV16-SG
(New)
AQD-D3L8GN16-SG
AQD-D3L8GN16-HG
AQD-D3L8GN16-MG
AQD-SD3L8GN16-SG
AQD-SD3L8GN16-HG
AQD-SD3L8GN16-MG
Unbuffered DIMM
Advantech Confidential
& Internal Use Only
- 15 -
AQD DDR3 Memory Modules Portfolio
1333 1600
LONG SHORT LONG SHORT
Non-VLP Non-VLP VLP Non-VLP Non-VLP
ECC U-
DIMM
2GB
(256MX8) AQD-D3L2GE16-SQ
4GB
(512MX8) AQD-D3L4GE16-SG AQD-SD3L4GE16-SG
AQD-SD3L4GE16-MG
8GB
(512MX8) AQD-D3L8GE16-SG AQD-SD3L8GE16-SG
AQD-SD3L8GE16-MG
R-DIMM
4GB
(512MX8) AQD-D3L4GR16-SG
8GB
(512MX8) AQD-D3L8GR13-SG AQD-D38GRV16-SG
AQD-D3L8GRV16-SG AQD-D3L8GR16-SG
16GB
(2Gbx4) AQD-D316RV16-SM
AQD-D3L16RV16-SM AQD-D3L16R16-SM
LOAD
REDUCE
32GB
(2GbX4) AQD-D3L32L13-SM
ECC Unbuffered DIMM
Registered DIMM
Load Reduce DIMM
Q1/2016
DDR3 DIMM
1GB 2GB
AQD-D31GN13-SX
240PIN, 1333Mt/s, 128Mx8, 1.181” Height, Samsung, 1.5V
U-DIMM ECC U-DIMM R-DIMM Load Reduce
AQD-D3L2GN16-HQ
240PIN, 1600Mt/s, 256Mx8, 1.181” Height, Hynix Chips 1.35V
AQD-D31GN16-HC
240PIN, 1600Mt/s, 128Mx16, 1.181” Height, Hynix, 1.5V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
AQD-D3L1GN16-HC
240PIN, 1600Mt/s, 128Mx16, 1.181” Height, Hynix, 1.35V
AQD-D3L2GN16-SQ
240PIN, 1600Mt/s, 256Mx8, 1.181” Height, Samsung Chips 1.35V
AQD-D3L2GNV16-SQ
240PIN, 1600Mt/s, 256Mx8, 0.74” Height, Samsung Chips 1.35V
Q1/2016
DDR3 DIMM
U-DIMM ECC U-DIMM R-DIMM Load Reduce
8GB
AQD-D3L8GN16-MG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Micron Chips 1.35V
AQD-D3L8GN16-HG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Hynix Chips 1.35V
AQD-D3L8GN16-SG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Samsung Chips 1.35V
4GB
AQD-D3L4GN16-HG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Hynix Chips 1.35V
AQD-D3L4GN16-MG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Micron Chips 1.35V
AQD-D3L4GN16-MQ
240PIN, 1600Mt/s, 256Mx8, 1.181” Height, Micron Chips 1.35V
AQD-D3L4GN16-SQ
240PIN, 1600Mt/s, 256Mx8, 1.181” Height, Samsung 1.35V
AQD-D3L4GN16-SG
240PIN, 1600Mt/s, 512Mx8, 1.181” Height, Samsung Chips 1.35V
AQD-D3L4GNV16-SQ
240PIN, 1600Mt/s, 256Mx8, 0.74” Height, Samsung Chips 1.35V
AQD-D3L8GNV16-SQ
240PIN, 1600Mt/s, 256Mx8, 0.74” Height, Samsung Chips 1.35V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
U-DIMM ECC U-DIMM R-DIMM Load Reduce
DDR3 SO-DIMM
1GB 2GB
4GB
AQD-SD31GN13-SX
204PIN, 1333Mt/s, 128Mx8, 1.181” Height, Samsung Chips 1.5V
AQD-SD3L2GN16-SQ
204PIN, 1600Mt/s, 256Mx8, 1.181” Height, Samsung Chips 1.35V
AQD-SD3L2GN16-HQ
204PIN, 1600Mt/s, 256Mx8, 1.181” Height, Hynix, Chips 1.35V
AQD-SD3L4GN16-SG
204PIN, 1600Mt/s, 512Mx8, 1.181” Height, Samsung Chips 1.35V
AQD-SD3L4GN16-HG
204PIN, 1600s, 512Mx8, 1.181” Height, Hynix Chips 1.35V
AQD-SD3L4GN16-MG
204PIN, 1600s, 512Mx8, 1.181” Height, Micron Chips 1.35V
AQD-SD3L4GN16-MQ
204PIN, 1600s, 256Mx8, 1.181” Height, Micron Chips 1.35V
8GB
AQD-SD3L8GN16-HG
204PIN, 1600Mt/s, 512Mx8, 1.181” Height, Hynix, Chips 1.35V
AQD-SD3L8GN16-SG
204PIN, 1600Mt/s, 512Mx8, 1.181” Height, Samsung, Chips 1.35V
AQD-SD3L8GN16-MG
204PIN, 1600Mt/s, 512Mx8, 1.181” Height, Micron, Chips 1.35V
AQD-SD31GN16-HC
204PIN, 1600Mt/s, 128Mx16 1.181” Height, Hynix Chips 1.5V
AQD-SD3L4GN16-SQ
204PIN, 1600s, 256Mx8, 1.181” Height, Samsung Chips 1.35V
AQD-SD3L1GN16-HC
204PIN, 1600Mt/s, 128Mx16 1.181” Height, Hynix Chips 1.35V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
U-DIMM ECC U-DIMM R-DIMM Load Reduce
4GB
8GB
DDR3 DIMM – Advanced Feature
ECC
AQD-D3L8GE16-SG
240PIN, 1600Mt/s, 512Mx8,2R 1.181” Height, Samsung, 1.35V
AQD-D3L4GE16-SG
240 PIN, 1600Mt/s, 512 Mx8,1R 1.181” Height, Samsung, 1.35V
2GB
AQD-D3L2GE16-SQ
240 PIN, 1600Mt/s, 256Mx8,1R 1.181” Height, Samsung, 1.35V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR3 SO-DIMM – Advanced Feature
ECC
U-DIMM ECC U-DIMM R-DIMM Load Reduce
4GB
AQD-SD3L4GE16-SG
204 PIN, 1600Mt/s, 512 Mx8, 1R 1.181” Height, Samsung, 1.35V
8GB 2GB
AQD-SD3L4GE16-MG
204 PIN, 1600Mt/s, 512 Mx8, 1R 1.181” Height, Micron, 1.35V
AQD-SD3L8GE16-SG
204PIN, 1600Mt/s, 512Mx8, 2R 1.181” Height, Samsung, 1.35V
AQD-SD3L8GE16-MG
204PIN, 1600Mt/s, 512Mx8, 2R 1.181” Height, Micron, 1.35V
AQD-SD3L2GE16-MG
240 PIN, 1600Mt/s, 256 Mx8, 1R 1.181” Height, Micron, 1.35V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR3 DIMM – Advanced Feature
Registered
8GB
16GB
AQD-D3L8GR13-SG
240PIN, 1333 Mt/s, 512 Mx8 2R, 1.18” Height, Samsung Chips 1.35V
4GB
AQD-D3L4GR16-SG
240PIN, 1600 Mt/s, 512 Mx8 1R, 1.18” Height, Samsung Chips 1.35V
AQD-D3L8GRV16-SG
240PIN, 1600 Mt/s, 512 Mx8 2R, VLP 0.74” Height, Samsung Chips 1.35V
AQD-D38GRV16-SG
240PIN, 1600 Mt/s, 512 Mx8 2R, 1.18” Height, Samsung Chips 1.35V
AQD-D3L8GR16-SG
240PIN, 1600 Mt/s, 512 Mx8 2R, 1.18” Height, Samsung Chips 1.35V
AQD-D3L16RV16-SM
240PIN, 1600 Mt/s, 2Gx4 2R, 0.74“ Height, Samsung, Chips 1.35V
AQD-D316RV16-SM
240PIN, 1600 Mt/s, 2Gx4 2R, 0.74“ Height, Samsung, Chips 1.35V
U-DIMM ECC U-DIMM R-DIMM Load Reduce
AQD-D3L16R16-SM
240PIN, 1600 Mt/s, 1Gx4 2R, 0.74“ Height, Samsung, Chips 1.35V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR3 SO-DIMM – Advanced Feature
Load Reduce
U-DIMM ECC U-DIMM R-DIMM Load Reduce
32GB
AQD-D3L32L13-SM
240PIN, 1333 Mt/s, 2Gbx4 ,4R, 1.810“ Height, Samsung, Chips 1.5V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR4 Roadmap
1999
2002
2006
2010
2015
SDRAM / 66-133
DDR1 / 200-400
DDR2 / 400-800
DDR3 / 800-2133
DDR4 / 2133- 4266
DDR4 R-DIMM (Q1/2015)
DDR4 ECC DIMM (Q2/2015)
DDR4 U-DIMM (Q2/2015)
Q1/2016
DDR4 Market Penetration 2015
(DDR3 v.s. DDR4)
Q1 Q2 Q3 Q4
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
0%
PC
DDR4 DDR3
TTL
DDR4 DDR3
Server
DDR4 DDR3
1% 1% 1% 2%
99% 99% 99% 98%
17% 31% 46% 58%
83% 69% 54% 42%
5% 14% 19% 28%
95% 86% 81% 72%
DDR4 market
share is growing
Advantech Confidential
& Internal Use Only
- 25 -
AQD DDR4 Memory Modules Portfolio
2133
LONG SHORT
VLP Non-VLP Non-VLP
U-DIMM
4GB
(512Mx8) AQD-D4U4GN21-SG AQD-SD4U4GN21-SG
8GB
(512Mx8) AQD-D4U8GN21-SG AQD-SD4U8GN21-SG
16GB
(1Gbx8) AQD-D4U16N21-SE
(New) AQD-SD4U16N21-SE
(New)
ECC U-
DIMM
4GB
(512Mx8) AQD-D4U4GE21-SG AQD-SD4U4GE21-SG
8GB
(512Mx8) AQD-D4U8GE21-SG AQD-SD4U8GE21-SG
16GB
(1Gbx8) AQD-D4U16E21-SE
(New) AQD-SD4U16E21-SE
(New)
R-DIMM
4GB
(512Mx8)
AQD-D4U4GR21-HG
AQD-D4U4GR21-SG
(Coming Soon)
8GB
(512Mx8) AQD-D4U8GRV21-SG
(New) AQD-D4U8GR21-SG
(Coming Soon)
8GB
(1Gbx4) AQD-D4U8GR21-HZ
16GB
(1Gbx4) AQD-D4U16R21-HZ
16GB
(1Gbx8) AQD-D4U16R21-SE
(New)
16GB
(2Gbx4) AQD-D4U16RV21-SM
(New)
Q1/2016
DDR4 DIMM
4GB
U-DIMM ECC U-DIMM R-DIMM Load Reduce
AQD-D4U4GN21-SG
288PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Samsung Chips 1.2V
AQD-D4U8GN21-SG
288PIN, 2133Mt/s, 512Mx8, 31.24mm/1.23” Height, Samsung Chips 1.2V
8GB
DDR4 SO-DIMM
4GB 8GB
AQD-SD4U4GN21-SG
260PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Samsung Chips 1.2V
AQD-SD4U8GN21-SG
260PIN, 2133Mt/s, 512Mx8, 31.24mm/1.23” Height, Samsung Chips 1.2V
16GB
AQD-D4U16N21-SE
288PIN, 2133Mt/s, 1Gbx8, 31.24mm/1.23” Height, Samsung Chips 1.2V
16GB
AQD-SD4U16N21-SE
260PIN, 2133Mt/s, 1Gbx8, 31.24mm/1.23” Height, Samsung Chips 1.2V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR4 DIMM
4GB
U-DIMM ECC U-DIMM R-DIMM Load Reduce
AQD-D4U4GN21-HG
288PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Hynix Chips 1.2V
AQD-D4U8GN21-HG
288PIN, 2133Mt/s, 512Mx8, 31.24mm/1.23” Height, Hynix Chips 1.2V
8GB
DDR4 SO-DIMM
4GB 8GB
AQD-SD4U4GN21-HG
260PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Hynix Chips 1.2V
AQD-SD4U8GN21-HG
260PIN, 2133Mt/s, 512Mx8, 31.24mm/1.23” Height, Hynix Chips 1.2V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR4 DIMM – Advanced Feature
ECC
U-DIMM ECC U-DIMM R-DIMM Load Reduce
4GB 8GB
DDR4 SO-DIMM – Advanced Feature
ECC
4GB 8GB
AQD-D4U4GE21-SG
288PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Samsung Chips 1.2V
AQD-D4U8GE21-SG
288PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Samsung Chips 1.2V
AQD-SD4U4GE21-SG
260PIN, 2133Mt/s, 512Mx8 31.25mm/1.23” Height, Samsung Chips 1.2V
AQD-SD4U8GE21-SG
260PIN, 2133Mt/s, 512Mx8, 2R 21.25MM/1.23”” Height, Samsung Chip 1.2V
16GB
AQD-D4U16GE21-SE
288PIN, 2133Mt/s, 1Gbx8, 31.25mm/1.23” Height, Samsung Chips 1.2V
16GB
AQD-SD4U16GE21-SE
260PIN, 2133Mt/s, 1Gbx8, 2R 21.25MM/1.23”” Height, Samsung Chip 1.2V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Q1/2016
DDR4 DIMM – Advanced Feature
Registered
U-DIMM ECC U-DIMM R-DIMM Load Reduce
8GB
16GB
AQD-D4U8GR21-HZ
288PIN, 2133 Mt/s, 1Gbx4 1R, 1.23” Height, Hynix Chips 1.2V
4GB
AQD-D4U4GR21-HG
288PIN, 2133 Mt/s, 512 Mx8 1R, 1.23” Height, Hynix Chips 1.2V
AQD-D4U8GR21-SG
288PIN, 2133 Mt/s, 512 Mx8 2R, 1.23” Height, Samsung Chips 1.2V
AQD-D4U4GR21-SG
288PIN, 2133 Mt/s, 512 Mx8 1R, 1.23” Height, Samsung Chips 1.2V
AQD-D4U16R21-HZ
288PIN, 2133 Mt/s, 1Gbx4 2R, 1.23“ Height, Hynix Chips 1.2V
AQD-D4U16R21-SE
288PIN, 2133 Mt/s, 1Gbx4 2R, 1.23“ Height, Samsung Chips 1.2V
AQD-D4U16RV21-SM
288PIN, 2133 Mt/s, 2Gbx4 2R, 0.74” Height, Samsung Chips 1.2V
AQD-D4U8GRV21-SG
288PIN, 2133 Mt/s, 2Gbx4 2R, 0.74” Height, Samsung Chips 1.2V
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 30 -
Q1/2016
Advantech Confidential
& Internal Use Only
- 31 -
Q1/2016
9 6 D
M M 4 N N A
DR1=DDR
DR1I=INDUSTRIAL GRADE DDR1
D2=DDR2
D2I=INDUSTRIAL GRADE DDR2
D3=DDR3
SS=SDRAM SO-DIMM
SD=DDR SO-DIMM
SDI=INDUSTRIAL GRADE SO-DDR
SD2=DDR2 SO-DIMM
SD2I=INDUSRIAL GRADE SO-DDR2
SD3=DDR3 SO-DIMM
SD3I=INDUSTRIAL GRADE SO-DDR3
Speed Capacity
64M=64MB
128M=128MB
256M=256MB
512M=512MB
1G=1GB
2G=2GB
4G=4GB
8G=8GB
Memory Type
100=100Mb/s
133=133Mb/s
266=266Mb/s
333=333Mb/s
400=400Mb/s
533=533Mb/s
667=667Mb/s
800=800Mb/s
1066=1066Mb/s
1333=1333Mbs
Manufacturer
AP=APACER
ATL=ATP
DA=DATA
IK=INNODISK
KI=KINGSTON
MI=MIRCON
SB=SWISSBIT
TR=TRANSCEND
VI=VIRTIUM
–
Color / Symbol Key
–
6 1 0
Advance
Feature
NN=
NON-ECC
and NON-
REGISTER
ER=
ECC AND
REGISTER
E=
ECC ONLY
M 0 P
96 DRAM Naming Convention
Advantech Confidential
& Internal Use Only
- 32 -
Q1/2016
DDR2 DIMM
512MB
2GB 1GB
96D2-512M667NN-TRL
240PIN, 667Mb/s, 64Mx8, 0.720” Height, Samsung Chips
96D2-1G667NN-TRL
240PIN, 667Mb/s, 64Mx8, 0.720” Height, Samsung Chips EOL:Q2/2016
96D2-2G667-AP
240PIN, 667Mb/s, 128Mx8, 1.181” Height, Samsung Chips EOL:Q2/2016
96D2-2G667NN-TRL
240PIN, 667Mb/s, 128Mx8, 0.720” Height, Samsung Chips EOL:Q4/2015
96D2-1G800NN-AP3
240PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96D2-1G800NN-TRL1
240PIN, 800Mb/s, 128Mx8, 0.720” Height, Samsung Chips
96D2-2G800NN-AP
240PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96D2-2G800NN-TRL1
240PIN, 800Mb/s, 128Mx8, 0.720” Height, Samsung Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 33 -
Q1/2016
DDR2 DIMM- Advanced Feature
2GB
96D2-2G800E-TR1
240PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
Registered
1GB
96D2-1G400ER-TR
240PIN, 400Mb/s, 64Mx8, 1.181” Height, Samsung Chips
96D2-2G800E-AP1
240PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
ECC
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 34 -
Q1/2016
DDR2 SO-DIMM
512MB
2GB 1GB
96SD2-512M667NN-TR
200PIN, 667Mb/s, 64Mx8, 1.181” Height, Samsung Chips
96SD2-1G667NN-TR
200PIN, 667Mb/s, 128Mx8, 1.181” Height, Samsung Chips EOL: Q3/2016
96SD2-2G667NN-TR1
200PIN, 667Mb/s, 128Mx8, 1.181” Height, Samsung Chips EOL: Q3/2016
96SD2-1G800NN-AP3
200PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96SD2-1G800NN-TR1
200PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96SD2-2G800NN-TR1
200PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96SD2-2G800NN-AP2
200PIN, 800Mb/s, 128Mx8, 1.181” Height, Samsung Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 35 -
Q1/2016
DDR3 DIMM
1GB 2GB
96D3-1G1333NN-TR1
240PIN, 1333Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96D3-2G1333NN-AP1
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips EOL:Q4/2016
96D3-2G1333NN-TR2
240PIN, 1333Mb/s, 128Mx8, 1.181” Height, Samsung Chips EOL:Q3/2016
96D3-2G1600NN-TR
240PIN, 1600Mb/s, 256Mx8, 1.181” Height, MICRON Chips EOL:Q4/2015
96D3-2G1600NN-APL
240PIN, 1600Mb/s, 256Mx8, 0.740” Height, Hynix Chips
96D3-2G1600NN-TRL
240PIN, 1600Mb/s, 256Mx8, 0.74” Height, Samsung Chips
96D3-2G1066NN-TR
240PIN, 1066Mb/s, 128Mx8, 1.181” Height, Samsung Chips EOL:Q3/2016
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 36 -
Q1/2016
DDR3 DIMM
4GB 8GB
96D3-4G1333NN-AP
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips EOL:Q4/2016
96D3-4G1600NN-TR
240PIN, 1600Mb/s, 256Mx8, 1.181” Height, Samsung Chips EOL:Q4/2015
96D3-4G1600NN-APL
240PIN, 1600Mb/s, 256Mx8, 0.740” Height, Hynix Chips
96D3-8G1600NN-TR
240PIN, 1600Mb/s, 512Mx8, 1.181” Height, Micron Chips EOL:Q4/2015
96D3-8G1333NN-APL
240PIN, 1333Mb/s, 512Mx8, 0.740” Height, Micron Chips EOL:Q2/2016
96D3-8G1600NN-APL
240PIN, 1600Mb/s, 512Mx8, 0.740” Height, Micron Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 37 -
Q1/2016
DDR3 DIMM- Advanced Feature
ECC
2GB 4GB
96D3-2G1333E-AP2
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96D3-2G1333E-AT
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Samsung Chips
96D3-4G1333E-AP
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96D3-4G1333E-AT
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Samsung Chips
8GB
96D3-8G1333E-AT
240PIN, 1333Mb/s, 512Mx8, 1.181” Height, Samsung Chips
96D3-8G1600E-APL
240PIN, 1600Mb/s, 512Mx8, 0.74” Height, Micron Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 38 -
Q1/2016
DDR3 DIMM- Advanced Feature
Registered
8GB 2GB 4GB
96D3-2G1333ER-AP1
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96D3-4G1333ER-AP1
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips EOL:Q4/2016
96D3-4G1333ER-ATL
240PIN, 1333Mb/s, 256Mx8, 0.74” Height, Samsung Chips EOL:Q1/2016
96D3-4G1600ER-TRL1
240PIN, 1600Mb/s, 256Mx8, 0.74” Height, Samsung Chips
96D3-4G1600ER-AT
240PIN, 1600Mb/s, 256Mx8, 1.181” Height, Samsung Chips
96D3-8G1066ER-AT
240PIN, 1066Mb/s, 256Mx8, 1.181” Height, Samsung Chips
96D3-8G1333ER-TR
240PIN, 1333Mb/s, 256Mx8, 1.181” Height, Samsung Chips EOL:Q3/2016
96D3-8G1600ER-TRL
240PIN, 1600Mb/s, 512Mx8, 0.740“ Height, MICRON Chips EOL:Q4/2015
16GB
96D3-16G1600ER-TRL
240PIN, 1600Mb/s, 2Gx4, 0.740“ Height, Samsung Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 39 -
Q1/2016
DDR3 SO-DIMM
1GB 2GB
96SD3-1G1333NN-TR1
204PIN, 1333Mb/s, 128Mx8, 1.181” Height, Samsung Chips
96SD3-2G1333NN-AP2
204PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-2G1600NN-AP
204PIN, 1600Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-4G1333NN-AP1
204PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-4G1066NN-AP
204PIN, 1066Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-4G1600NN-AP
204PIN, 1600Mb/s, 256Mx8, 1.181” Height, Hynix Chips
4GB
8GB
96SD3-8G1600NN-AP
204PIN, 1600Mb/s, 512Mx8, 1.181” Height, HYNIX Chips
96SD3-8G1600NN-TR
204PIN, 1600Mb/s, 512Mx8, 1.181” Height, Micron Chips EOL:Q4/2015
96SD3-8G1333NN-TR
204PIN, 1333Mb/s, 512Mx8, 1.181” Height, Micron Chips EOL:Q4/2015
96SD3-8G1600NN-AT
204PIN, 1600Mb/s, 512Mx8, 1.181” Height, Samsung Chips
Q1/2016 Q2/2016 Q3/2016 Q4/2016
96SD3-4G1333NN-TR2
204PIN, 1333Mb/s, 256Mx8, 1.181” Height, Samsung Chips
Advantech Confidential
& Internal Use Only
- 40 -
Q1/2016
DDR3 SO-DIMM- Advanced Feature
ECC
2GB 4GB
8GB
96SD3-2G1333E-AP
204PIN, 1333Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-4G1066E-AP
204PIN, 1066Mb/s, 256Mx8, 1.181” Height, Hynix Chips
96SD3-8G1333E-TR
204PIN, 1333Mb/s, 512Mx8, 1.181” Height, Samsung Chips
Low Voltage
4GB
96SD3L-4G1333NN-AP
Apacer, 204PIN, 1333Mb/s, 512Mx8, 1.35V, 1.181” Height, MICRO Chips
96SD3L-8G1333NN-AP
204PIN, 1333Mb/s, 512Mx8,1.35V, 1.181” Height, MICRO Chips
8GB
Q1/2016 Q2/2016 Q3/2016 Q4/2016
Advantech Confidential
& Internal Use Only
- 41 -
Memory EOL Procedure
For support and product management optimization, PAPS will
follow the Memory phase-out procedure as below.
EOL
Last Time
Buy Order
Official EOL
Announcement
2 Month 1 Month
Replacement and Evaluation Approval
Advantech Confidential
& Internal Use Only
- 42 -
Thank you
