1
PF909-03
Micro MINI S1C60N02
4-bit Single Chip Microcomputer
● S1C6200B Core CPU
● Low Voltage and Low Power
● Built-in LCD Driver
● Built-in A/D Converter
● Low Cost Performance
■INTRODUCTION
Each member of the S1C60N02 Series of single chip microcomputers feature a 4-bit S1C6200B core CPU,
1,024 words of ROM (12 bits per word), 80 words of RAM (4 bits per word), an LCD driver, 4 bits for input ports
(K00–K03), 4 bits for output ports (R00–R03), one 4-bit I/O port (P00–P03), clock timer and A/D converter.
Because of their low voltage operation and low power consumption, the S1C60N02 Series are ideal for a wide
range of applications.
■CONFIGURATION
The S1C60N02 Series are configured as follows, depending on the supply voltage.
Model Supply voltage Oscillation circuits
1.8 – 3.5 V
1.2 – 2.0 V
S1C60N02
S1C60L02 Crystal or CR
Crystal or CR
■FEATURES
● Core CPU........................................................S1C6200B
● Built-in oscillation circuit..................................Crystal or CR oscillation circuit, 32,768 Hz (typ.)
● Instruction set..................................................100 instructions
● ROM capacity .................................................1,024 words × 12 bits
● RAM capacity (data RAM) ..............................80 words × 4 bits
● Input port.........................................................4 bits (Supplementary pull-down resistors may be used)
● Output port ......................................................4 bits (Piezo buzzer and programmable frequency output
can be driven directry by mask option)
● Input/output port..............................................4 bits
● LCD driver.......................................................20 segments × 4 common duty (or 3 and 2 common duty)
● Timer ...............................................................Clock timer
● A/D converter ..................................................CR oscillation type A/D converter built-in
● Interrupts:
External interrupt .....................................Input port interrupt 1 system
Internal interrupt ......................................Timer interrupt 1 system
A/D converter interrupt 1 system
● Supply voltage ................................................1.5 V (1.2–2.0 V) S1C60L02 (During A/D conversion)
3.0 V (1.8–3.5 V) S1C60N02
● Current consumption (typ.) .............................1.0 µA (Crystal oscillation CLK = 32,768 Hz, when halted)
2.5 µA (Crystal oscillation CLK = 32,768 Hz, when executing)
● Supply form.....................................................QFP6-60pin (plastic) or chip
Low Voltage
Operation
Products
2
S1C60N02
■BLOCK DIAGRAM
■PIN CONFIGURATION
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
N.C.
N.C.
N.C.
Pin No. Pin name 16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
N.C.
TEST
RESET
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
COM0
COM1
COM2
COM3
Pin No. Pin name 31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
N.C.
VL3
VL2
VL1
CA
CB
VSS
VDD
OSC1
OSC2
VS1
P00
P01
P02
P03
Pin No. Pin name 46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
N.C. : No Connection
N.C.
K00
K01
K02
K03
R00
R01
R02
R03
RS
TH
CS
ADOUT
N.C.
N.C.
Pin No. Pin name
3145
16
30
INDEX
151
60
46
S1C60N02
QFP6-60pin
VDD
VL1–3
CA–CB
VS1
VSS
COM0–3
SEG0–19
K00–03
P00–03
R00–03
OSC1
OSC2
RESET
TEST
Power
Controller
RAM
80 words x 4 bits
ROM
1,024 words x 12 bits
OSC
System Reset
Control
Fout & Buzzer
Interrupt
Generator
Input Port
Test Port
LCD Driver
I/O Port
Output Port
Timer
A/D Converter
Core CPU S1C6200B
FOUT / BUZZER
BUZZER
ADOUT
RS
TH
CS
3
S1C60N02
■PIN DESCRIPTION
Pin name
VDD
VSS
VS1
VL1
VL2
VL3
CA, CB
OSC1
OSC2
K00–K03
P00–P03
R00–R03
SEG0–19
COM0–3
CS
RS
TH
ADOUT
RESET
TEST
Function
Power source (+) terminal
Power source (-) terminal
Oscillation and internal logic system regulated voltage output terminal
LCD system regulated voltage output terminal
LCD system booster output terminal
LCD system booster output terminal
Booster capacitor connecting terminal
Crystal or CR oscillation input terminal
Crystal or CR oscillation output terminal
Input terminal
I/O terminal
Output terminal
LCD segment output terminal
(convertible to DC output terminal by mask option)
LCD common output terminal
A/D converter CR oscillation input terminal
A/D converter CR oscillation output terminal
A/D converter CR oscillation output terminal
A/D converter oscillation frequency output terminal
Initial setting input terminal
Test input terminal
Pin No.
38
37
41
34
33
32
35, 36
39
40
47–50
42–45
51–54
1–12
19–26
27–30
57
55
56
58
18
17
In/Out
(I)
(I)
O
O
O
O
–
I
O
I
I/O
O
O
O
I
O
O
O
I
I
■OPTION LIST
1. DEVICE TYPE AND LCD VOLTAGE
■■ 1. E0C6002 (Normal Type <S1C60N02>) LCD 3 V
■■ 2. E0C6002 (Normal Type <S1C60N02>) LCD 4.5 V
■■ 3. E0C60L02(Low Power Type <S1C60L02>) LCD 3 V
■■ 4. E0C60L02(Low Power Type <S1C60L02>) LCD 4.5 V
2. MULTIPLE KEY ENTRY RESET
• COMBINATION.................... ■■ 1. Not Use
■■ 2. Use K00, K01
■■ 3. Use K00, K01, K02
■■ 4. Use K00, K01, K02, K03
3. INTERRUPT NOISE REJECTOR
• K00–K03 .............................. ■■ 1. Use ■■ 2. Not Use
4. INPUT PORT PULL DOWN RESISTOR
• K00 ....................................... ■■ 1. With Resistor ■■ 2. Gate Direct
• K01 ....................................... ■■ 1. With Resistor ■■ 2. Gate Direct
• K02 ....................................... ■■ 1. With Resistor ■■ 2. Gate Direct
• K03 ....................................... ■■ 1. With Resistor ■■ 2. Gate Direct
5. R00 SPECIFICATION
• OUTPUT TYPE .................... ■■ 1. DC Output
■■ 2. Buzzer Inverted Output (Control bit is R00)
■■ 3. Buzzer Inverted Output (Control bit is R01)
■■ 4. F OUT Output
• FOUT OUTPUT SPACIFICATION F1 ...........■■ 1. 256[Hz] F3........... ■■ 1. 1,024[Hz]
■■ 2. 512[Hz] ■■ 2. 2,048[Hz]
■■ 3. 1,024[Hz] ■■ 3. 4,096[Hz]
■■ 4. 2,048[Hz] ■■ 4. 8,192[Hz]
■■ 5. 4,096[Hz] ■■ 5. 16,384[Hz]
F2 ...........■■ 1. 512[Hz] F4........... ■■ 1. 2,048[Hz]
■■ 2. 1,024[Hz] ■■ 2. 4,096[Hz]
■■ 3. 2,048[Hz] ■■ 3. 8,192[Hz]
■■ 4. 4,096[Hz] ■■ 4. 16,384[Hz]
■■ 5. 8,192[Hz] ■■ 5. 32,768[Hz]
• OUTPUT SPECIFICATION.. ■■ 1. Complementary ■■ 2. Pch-OpenDrain
4
S1C60N02
■ELECTRICAL CHARACTERISTICS
●Absolute Maximum Ratings
Rating
Power voltage
Input voltage (1)
Input voltage (2)
Operating temperature
Storage temperature
Soldering temperature / Time
Allowable dissipation *
1
∗1: In case of plastic package (QFP6-60pin).
Symbol
V
SS
V
I
V
IOSC
Topr
Tstg
Tsol
P
D
Value
-5.0 to 0.5
V
SS
- 0.3 to 0.5
V
SS
- 0.3 to 0.5
-20 to 70
-65 to 150
260°C, 10sec (lead section)
250
Unit
V
V
V
°C
°C
–
mW
(V
DD
=0V)
●Recommended Operating Conditions
S1C60N02
Condition
Power voltage
Oscillation frequency
Booster capacitor
Capacitor between V
DD
and V
S1
Symbol
V
SS
f
OSC1
f
OSC2
C
1
C
2
Remark
V
DD
=0V
Crystal oscillation
CR oscillation, R=420kΩ
Unit
V
kHz
kHz
µF
µF
(Ta=-20 to 70°C)
Max.
-1.8
80
Typ.
-3.0
32.768
65
Min.
-3.5
0.1
0.1
S1C60L02
Condition
Power voltage
Oscillation frequency
Booster capacitor
Capacitor between V
DD
and V
S1
∗1:
∗2:
∗3:
When switching to the heavy load protection mode.
The voltage which can be displayed on the LCD panel will differ according to the characteristics of the LCD panel.
When there is no software correspondence during CR oscillation or crystal oscillation.
Symbol
V
SS
f
OSC1
f
OSC2
C
1
C
2
Remark
V
DD
=0V *
3
V
DD
=0V, With software correspondence *
1
Crystal oscillation
CR oscillation, R=420kΩ
Unit
V
V
kHz
kHz
µF
µF
(Ta=-20 to 70°C)
Max.
-1.2
-0.9 *
2
80
Typ.
-1.5
-1.5
32.768
65
Min.
-2.0
-2.0
0.1
0.1
6. R01 SPECIFICATION
• OUTPUT TYPE .................... ■■ 1. DC Output ■■ 2. Buzzer Output
• OUTPUT SPECIFICATION.. ■■ 1. Complementary ■■ 2. Pch-OpenDrain
7. OUTPUT SPECIFICATION (R02, R03)
• R02....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
• R03....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
8. I/O PORT SPECIFICATION
• P00 ....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
• P01 ....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
• P02 ....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
• P03 ....................................... ■■ 1. Complementary ■■ 2. Pch-OpenDrain
9. LCD COMMON DUTY AND BIAS
■■ 1. 1/4 Duty 1/3 Bias
■■ 2. 1/3 Duty 1/3 Bias
■■ 3. 1/2 Duty 1/3 Bias
■■ 4. 1/4 Duty 1/2 Bias
■■ 5. 1/3 Duty 1/2 Bias
■■ 6. 1/2 Duty 1/2 Bias
10.OSC1 SYSTEM CLOCK ■■ 1. Crystal
■■ 2. CR
5
S1C60N02
●DC Characteristics
S1C60N02
Unit
V
V
V
V
µA
µA
µA
µA
mA
mA
mA
mA
mA
mA
µA
µA
µA
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=32.768kHz, Ta=25°C, V
S1
/V
L1
–V
L3
are internal voltage
, C
1
=C
2
=0.1µF)
Max.
0
0
0.8•V
SS
0.85•V
SS
0.5
16
100
0
-1.0
-1.0
-1.0
-3
-3
-300
Typ.Min.
0.2•V
SS
0.15•V
SS
V
SS
V
SS
0
5
30
-0.5
3.0
3.0
3.0
3
3
300
Characteristic
High level input voltage (1)
High level input voltage (2)
Low level input voltage (1)
Low level input voltage (2)
High level input current (1)
High level input current (2)
High level input current (3)
Low level input current
High level output current (1)
High level output current (2)
High level output current (3)
Low level output current (1)
Low level output current (2)
Low level output current (3)
Common output current
Segment output current
(during LCD output)
Segment output current
(during DC output)
Symbol
V
IH1
V
IH2
V
IL1
V
IL2
I
IH1
I
IH2
I
IH3
I
IL
I
OH1
I
OH2
I
OH3
I
OL1
I
OL2
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
I
OH6
I
OL6
V
IH1
=0V, No pull down resistor
V
IH2
=0V, With pull down resistor
V
IH3
=0V, With pull down resistor
V
IL
=V
SS
V
OH1
=0.1•V
SS
V
OH2
=0.1•V
SS
(built-in protection resistance)
V
OH3
=-1.0V
V
OL1
=0.9•V
SS
V
OL2
=0.9•V
SS
(built-in protection resistance)
V
OL3
=-2.0V
V
OH4
=-0.05V
V
OL4
=V
L3
+0.05V
V
OH5
=-0.05V
V
OL5
=V
L3
+0.05V
V
OH6
=0.1•V
SS
V
OL6
=0.9•V
SS
Condition K00–K03, P00–P03
RESET, TEST
K00–K03, P00–P03
RESET, TEST
K00–K03, P00–P03
K00–K03
P00–P03
RESET, TEST
K00–K03, P00–P03
RESET, TEST
R02, R03, P00–P03
R00, R01
ADOUT
R02, R03, P00–P03
R00, R01
ADOUT
COM0–COM3
SEG0–SEG19
SEG0–SEG19
S1C60L02
Unit
V
V
V
V
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=32.768kHz, Ta=25°C, V
S1
/V
L1
–V
L3
are internal voltage
, C
1
=C
2
=0.1µF)
Max.
0
0
0.8•V
SS
0.85•V
SS
0.5
16
100
0
-200
-200
-200
-3
-3
-100
Typ.Min.
0.2•V
SS
0.15•V
SS
V
SS
V
SS
0
2.0
9.0
-0.5
700
700
700
3
3
130
Characteristic
High level input voltage (1)
High level input voltage (2)
Low level input voltage (1)
Low level input voltage (2)
High level input current (1)
High level input current (2)
High level input current (3)
Low level input current
High level output current (1)
High level output current (2)
High level output current (3)
Low level output current (1)
Low level output current (2)
Low level output current (3)
Common output current
Segment output current
(during LCD output)
Segment output current
(during DC output)
Symbol
V
IH1
V
IH2
V
IL1
V
IL2
I
IH1
I
IH2
I
IH3
I
IL
I
OH1
I
OH2
I
OH3
I
OL1
I
OL2
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
I
OH6
I
OL6
V
IH1
=0V, No pull down resistor
V
IH2
=0V, With pull down resistor
V
IH3
=0V, With pull down resistor
V
IL
=V
SS
V
OH1
=0.1•V
SS
V
OH2
=0.1•V
SS
(built-in protection resistance)
V
OH3
=-0.5V
V
OL1
=0.9•V
SS
V
OL2
=0.9•V
SS
(built-in protection resistance)
V
OL3
=-1.0V
V
OH4
=-0.05V
V
OL4
=V
L3
+0.05V
V
OH5
=-0.05V
V
OL5
=V
L3
+0.05V
V
OH6
=0.1•V
SS
V
OL6
=0.9•V
SS
Condition K00–K03, P00–P03
RESET, TEST
K00–K03, P00–P03
RESET, TEST
K00–K03, P00–P03
K00–K03
P00–P03
RESET, TEST
K00–K03, P00–P03
RESET, TEST
R02, R03, P00–P03
R00, R01
ADOUT
R02, R03, P00–P03
R00, R01
ADOUT
COM0–COM3
SEG0–SEG19
SEG0–SEG19
6
S1C60N02
●Analog Circuit Characteristics and Current Consumption
S1C60N02 (Normal Operating Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=32.768kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
<During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
1/2•V
L2
×0.9
3/2•V
L2
×0.9
2.5
5.0
40
Typ.
V
SS
1.0
2.5
30
Min.
1/2•V
L2
-0.1
3/2•V
L2
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60N02 (Heavy Load Protection Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=32.768kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
<During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
1/2•V
L2
×0.85
3/2•V
L2
×0.85
5.5
10.0
41.5
Typ.
V
SS
2.0
5.5
31
Min.
1/2•V
L2
-0.1
3/2•V
L2
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60L02 (Normal Operating Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=32.768kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
<During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
2•V
L1
×0.9
3•V
L1
×0.9
2.5
5.0
40
Typ.
V
SS
1.0
2.5
30
Min.
2•V
L1
-0.1
3•V
L1
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60L02 (Heavy Load Protection Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=32.768kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
<During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
2•V
L1
×0.85
3•V
L1
×0.85
5.5
10.0
41.5
Typ.
V
SS
2.0
5.5
31
Min.
2•V
L1
-0.1
3•V
L1
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
7
S1C60N02
S1C60N02 (CR, Normal Operating Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=65kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
Recommended external resistance for CR oscillation=420kΩ <During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
1/2•V
L2
×0.9
3/2•V
L2
×0.9
15.0
20.0
52.5
Typ.
V
SS
8.0
15.0
37
Min.
1/2•V
L2
-0.1
3/2•V
L2
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60N02 (CR, Heavy Load Protection Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, f
OSC
=65kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
Recommended external resistance for CR oscillation=420kΩ <During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
1/2•V
L2
×0.85
3/2•V
L2
×0.85
30.0
40.0
57.5
Typ.
V
SS
16.0
30.0
45
Min.
1/2•V
L2
-0.1
3/2•V
L2
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60L02 (CR, Normal Operating Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=65kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
Recommended external resistance for CR oscillation=420kΩ <During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
2•V
L1
×0.9
3•V
L1
×0.9
15.0
20.0
52.5
Typ.
V
SS
8.0
15.0
37
Min.
2•V
L1
-0.1
3•V
L1
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
S1C60L02 (CR, Heavy Load Protection Mode)
Unit
V
V
V
µA
µA
µA
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, f
OSC
=65kHz, Ta=25°C, C
G
=25pF, V
S1
/V
L1
–V
L3
are internal voltage, C
1
=C
2
=0.1µF
Recommended external resistance for CR oscillation=420kΩ <During A/D conversion: R
S
=49.8kΩ, TH=50kΩ, C
AD
=2,200pF>)
Max.
2•V
L1
×0.85
3•V
L1
×0.85
30.0
40.0
57.5
Typ.
V
SS
16.0
30.0
45
Min.
2•V
L1
-0.1
3•V
L1
-0.1
Characteristic
Internal voltage
Power current consumption
Symbol
V
L1
V
L2
V
L3
I
OP
Condition
Connect 1MΩ load resistor between V
DD
and V
L1
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L2
(without panel load)
Connect 1MΩ load resistor between V
DD
and V
L3
(without panel load)
During HALT
During execution
During A/D conversion (HALT) Without panel load
8
S1C60N02
●Oscillation Characteristics
Oscillation characteristics will vary according to different conditions. Use the following characteristics are as reference
values.
S1C60N02
Unit
V
V
pF
ppm
ppm
ppm
V
MΩ
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, Crystal: Q13MC146, C
G
=25pF, C
D
=built-in, Ta=25°C)
Max.
5
10
-3.6
Typ.
20
Min.
-1.8
-1.8
-10
40
200
Characteristic
Oscillation start voltage
Oscillation stop voltage
Built-in capacitance (drain)
Frequency/voltage deviation
Frequency/IC deviation
Frequency adjustment range
Harmonic oscillation start voltage
Allowable leak resistance
Symbol
Vsta
Vstp
C
D
∂f/∂V
∂f/∂IC
∂f/∂C
G
V
hho
R
leak
Condition
t
sta≤5sec (V
SS
)
t
stp≤10sec (V
SS
)
Including the parasitic capacity inside the IC
V
SS
=-1.8 to -3.5V
C
G
=5 to 25pF
C
G
=5pF (V
SS
)
Between OSC1 and V
DD
,
and between V
SS
and OSC1
S1C60L02
∗1: Items enclosed in parentheses ( ) are those used when operating at heavy load protection mode.
Unit
V
V
pF
ppm
ppm
ppm
V
MΩ
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, Crystal: Q13MC146, C
G
=25pF, C
D
=built-in, Ta=25°C)
Max.
5
10
-2.0
Typ.
20
Min.
-1.2
-1.2
-10
40
200
Characteristic
Oscillation start voltage
Oscillation stop voltage
Built-in capacitance (drain)
Frequency/voltage deviation
Frequency/IC deviation
Frequency adjustment range
Harmonic oscillation start voltage
Allowable leak resistance
Symbol
Vsta
Vstp
C
D
∂f/∂V
∂f/∂IC
∂f/∂C
G
V
hho
R
leak
Condition
tsta≤5sec (V
SS
)
tstp≤10sec (V
SS
)
Including the parasitic capacity inside the IC
V
SS
=-1.2 to -2.0V (-0.9) *
1
C
G
=5 to 25pF
C
G
=5pF (V
SS
)
Between OSC1 and V
DD
,
and between V
SS
and OSC1
S1C60N02 (CR)
Unit
%
V
mS
V
(Unless otherwise specified: V
DD
=0V, V
SS
=-3.0V, R
CR
=420kΩ, Ta=25°C)
Max.
20
Typ.
65kHz
3
Min.
-20
-1.8
-1.8
Characteristic
Oscillation frequency dispersion
Oscillation start voltage
Oscillation start time
Oscillation stop voltage
Symbol
f
OSC
Vsta
tsta
Vstp
Condition
V
SS
=-1.8 to -3.5V
S1C60L02 (CR)
Unit
%
V
mS
V
(Unless otherwise specified: V
DD
=0V, V
SS
=-1.5V, R
CR
=420kΩ, Ta=25°C)
Max.
20
Typ.
65kHz
3
Min.
-20
-1.2
-1.2
Characteristic
Oscillation frequency dispersion
Oscillation start voltage
Oscillation start time
Oscillation stop voltage
Symbol
f
OSC
Vsta
t
sta
Vstp
Condition
V
SS
=-1.2 to -2.0V
9
S1C60N02
■PAD LAYOUT
●Diagram of Pad Layout
Y
X
(0, 0)
2.56 mm
2.75 mm
12 11 10 9 8 7 6 5 4 3 2 1
26
25
24
23
22
21
20
19
18
17
16
15
14
13
4039383736353433323130292827
52
51
50
49
48
47
46
45
44
43
42
41
●Pad Coordinates
Pad No.
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
Pad No.
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
Pad name
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
SEG7
SEG8
SEG9
SEG10
SEG11
TEST
RESET
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
COM0
COM1
COM2
COM3
Pad name
V
L3
V
L2
V
L1
CA
CB
V
SS
V
DD
OSC1
OSC2
V
S1
P00
P01
P02
P03
K00
K01
K02
K03
R00
R01
R02
R03
RS
TH
CS
ADOUT
X
608
478
348
218
88
-42
-172
-302
-432
-562
-692
-822
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
-1,209
X
-1,162
-1,032
-902
-771
-641
16
147
281
434
587
766
896
1,026
1,156
1,209
1,209
1,209
1,209
1,209
1,209
1,209
1,209
1,209
1,209
1,209
1,209
Y
1,111
1,111
1,111
1,111
1,111
1,111
1,111
1,111
1,111
1,111
1,111
1,111
978
845
714
584
454
324
194
64
-66
-196
-361
-499
-629
-760
Y
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-1,111
-674
-544
-413
-283
-59
71
301
431
573
711
893
1,069
(Unit: µm)
10
S1C60N02
■BASIC EXTERNAL CONNECTION DIAGRAM
Piezo Buzzer Single Terminal Driving
Note: The above table is simply an example, and is not guaranteed to work.
CA
CB
VL1
VL2
VL3
VDD
OSC1
OSC2
VS1
RESET
TEST
Vss
C1
CG
C2
X'tal
1.5V
or
3.0V
Piezo
Buzzer
R01
K00
K03
P00
P03
R00
R02
R03
I
I/O
O
SEG0
SEG19
COM0
COM3
LCD
PANEL
S1C60N02/60L02
Coil
Cp
RS
TH
CS
RSTH
Capacitors (C3–C5) are
connected.
Connection depending
on power supply and
LCD panel specification.
CAD
X'tal
C
G
C
1
–C
5
Cp
TH
R
S
C
AD
Crystal oscillator
Trimmer capacitor
Capacitor
Capacitor
Thermistor
Resistor
Capacitor
32,768 Hz CI(MAX) = 35 kΩ
5–25 pF
0.1 µF
3.3 µF
50 kΩ
49.8 kΩ
2,200 pF
11
S1C60N02
Piezo Buzzer Direct Driving
Piezo
Buzzer
R00
K00
K03
P00
P03
R02
R03
I
I/O
O
SEG0
SEG19
COM0
COM3
LCD
PANEL
S1C60N02/60L02
RS
TH
CS
R01
CA
CB
VL1
VL2
VL3
VDD
OSC1
OSC2
VS1
RESET
TEST
Vss
C1
CG
C2
X'tal
1.5V
or
3.0V
Cp
CAD
RSTH
Capacitors (C3–C5) are
connected.
Connection depending
on power supply and
LCD panel specification.
X'tal
C
G
C
1
–C
5
Cp
TH
R
S
C
AD
Crystal oscillator
Trimmer capacitor
Capacitor
Capacitor
Thermistor
Resistor
Capacitor
32,768 Hz CI(MAX) = 35 kΩ
5–25 pF
0.1 µF
3.3 µF
50 kΩ
49.8 kΩ
2,200 pF
Note: The above table is simply an example, and is not guaranteed to work.
S1C60N02
NOTICE:
No part of this material may be reproduced or duplicated in any form or by any means without the written permission of Seiko Epson. Seiko
Epson reserves the right to make changes to this material without notice. Seiko Epson does not assume any liability of any kind arising out of
any inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there is no representation that
this material is applicable to products requiring high level reliability, such as, medical products. Moreover, no license to any intellectual
property rights is granted by implication or otherwise, and there is no representation or warranty that anything made in accordance with this
material will be free from any patent or copyright infringement of a third party. This material or portions thereof may contain technology or the
subject relating to strategic products under the control of the Foreign Exchange and Foreign Trade Law of Japan and may require an export
license from the Ministry of International Trade and Industry or other approval from another government agency.
© Seiko Epson Corporation 2001 All right reserved.
SEIKO EPSON CORPORATION
ELECTRONIC DEVICES MARKETING DIVISION
IC Marketing & Engineering Group
ED International Marketing Department Europe & U.S.A.
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone : 042-587-5812 FAX : 042-587-5564
ED International Marketing Department Asia
421-8, Hino, Hino-shi, Tokyo 191-8501, JAPAN
Phone : 042-587-5814 FAX : 042-587-5110
http://www.epson.co.jp/device/
■ EPSON Electronic Devices Website
First issue February, 1999 M
Printed July, 2001 in Japan L
■PAKAGE
Plastic QFP6-60pin
(Unit: mm)
14±0.2
17.6±0.4
3145
14±0.2
17.6±0.4
16
30
INDEX
0.35±0.1
151
60
46
2.7±0.1
0.1
3.1
max
1.8
0.85±0.2
0°
10°
0.15±0.05
0.8