2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 1
MTCH102/5/8
Description
The Microchip mTouch® MTCH102/5/8 Proximity/Touch Controller with simple digital output provides an easy way to
add proximity or touch detection to any application. This device family implements capacitive sensors with active
guarding capability. The sensitivity and power mode can be configured through the MTSA and MTPM pins. The
MTCH102/5/8 devices also use an advanced optimization algorithm to actively suppress noise from the signal to
achieve reliable proximity/touch detection.
Features
• Capacitive Proximity and Touch Detection
System:
- High Signal to Noise Ratio (SNR)
- Adjustable sensitivity with compensation for
different sensor sizes
- Multi-stage active noise suppression filters
- Automatic environmental compensation
- Support wide range of sensor shapes and
sizes
• Simple I/O Interface with Existing System
• Smart Scan Scheduling
• Threshold Hysteresis
• Flexible Low-Power mode
• Brown-Out Protection
• Operating Voltage Range:
- 2.05V to 3.6V
• Operating Temperature:
- 40°C to +85°C
Typical Application
•Light Switch
• Portable Device Enabler
• White Goods and Appliance
• Office Equipment and Toys
• Display and Keypad Back-lighting Activation
TABLE 1: MTCH10X FAMILY TYPES
Device Data Sheet Index Sensor Input Active Guard Digital Output
MTCH101 (A) 1 N 1
MTCH102 (B) 2(1) Y(1) 2
MTCH105 (B) 5(1) Y(1) 5
MTCH108 (B) 8(1) Y(1) 8
Note 1: One of the sensor inputs can be configured as active guard output.
Data Sheet In dex: (Unshaded devices are described in this document.)
A: DS-40001664 MTCH101 Single-Channel Proximity Detector
B: DS-40001793 MTCH102/105/108 Dual-Channel Proximity/Touch Controller
Note: For other small form-factor package availability and marking information, please visit
http://www.microchip.com/packaging or contact your local sales office.
TABLE 2: PACKAGES
Packages MSOP TSSOP SSOP UDFN QFN UQFN
MTCH102 X — — X — —
MTCH105 — X — — X —
MTCH108 — — X — — X
2, 5 and 8-Channel Proximity/Touch Controller Data Sheet
MTCH102/5/8
DS40001793C-page 2 Preliminary 2015-2016 Microchip Technology Inc.
PIN DIAGRAMS
FIGURE 1: 8-LEAD MSOP, UDFN
FIGURE 2: 14-LEAD TSSOP
FIGURE 3: 16-LEAD QFN
FIGURE 4: 20-LEAD SSOP
FIGURE 5: 20-LEAD UQFN
1
2
3
4
8
7
6
5
VDD
MTI0
MTPM
VSS
MTO0
MTSA
Note: See Ta bl e 3 for the pin allocation table.
MTI1/Guard
MTCH102
MTO1/GC
Note: See Table 4 for the pin allocation table.
MTCH105
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VDD
MTI0
MTI1
MTPM
MTI2/ Guard
MTI3
MTI4 MTO4
MTO1
MTO2/GC
MTSA
MTO0
VSS
MTO3
Note: See Ta bl e 4 for the pin allocation table.
MTCH105
2
3
1
9
10
11
12
MTI3
4
VSS
MTO0
MTO1
MTSA
MTO2/GC
NC
NC
VDD
MTI0
MTI1
MTPM
MTI2/Guard
MTI4
MTO4
MTO3
6
7
5
8
15
14
16
13
Note: See Ta bl e 5 for the pin allocation table.
MTCH108
2
3
4
5
6
7
8
9
10
VDD
MTI0
MTI1
MTPM
MTI2/Guard
MTI3
MTI4
MTI5
MTI6
MTI7
MTO0
MTO1
MTSA
MTO2/GC
MTO3
MTO4
MTO5
MTO6
MTO7
20
19
18
17
16
15
14
13
12
11
VSS
1
Note: See Ta bl e 5 for the pin allocation table.
MTCH108
2
3
4
5
1
6
7
8
9
20
19
18
17
16
10
12
13
14
15
11
MTO5
MTO6
MTO7
MTI7
MTI6
MTPM
MTI2/Guard
MTI3
MTI4
MTI5
MTI1
MTI0
VDD
VSS
MTO0
MTO1
MTSA
MTO2/GC
MTO3
MTO4
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 3
MTCH102/5/8
PIN ALLOCATION TABLES
TABLE 3: 8-PIN DESCRIPTION (MTCH102)
Name 8-Lead
MSOP and
UDFN Description
VDD 1 Power Supply Input
MTI0 2 Proximity/Touch Sensor 0 Input
MTI1/Guard 3 Proximity/Touch Sensor 1 Input/Active Guard
MTPM 4 Low-Power Mode Select
MTSA 5 Sensitivity Adjust Input
MTO1/GC 6 MTI1 Detect Output (Active-Low)/Guard Control
MTO0 7 MTI0 Detect Output (Active-Low)
VSS 8 Ground
TABLE 4: 14-/16-PIN DESCRIPTION (MTCH105)
Name 14-Lead
TSSOP 16-Lead
QFN Description
VDD 1 16 Power Supply Input
MTI0 2 1 Proximity/Touch Sensor 0 Input
MTI1 3 2 Proximity/Touch Sensor 1 Input
MTPM 4 3 Low-Power Mode Select
MTI2/Guard 5 4 Proximity/Touch Sensor 2 Input/Active Guard
MTI3 6 5 Proximity/Touch Sensor 3 Input
MTI4 7 6 Proximity/Touch Sensor 4 Input
MTO4 8 7 MTI4 Detect Output (Active-Low)
MTO3 9 8 MTI3 Detect Output (Active-Low)
MTO2/GC 10 9 MTI2 Detect Output (Active-Low) /Guard Control
MTSA 11 10 Sensitivity Adjust Input
MTO1 12 11 MTI1 Detect Output (Active-Low)
MTO0 13 12 MTI0 Detect Output (Active-Low)
VSS 14 13 Ground
MTCH102/5/8
DS40001793C-page 4 Preliminary 2015-2016 Microchip Technology Inc.
TABLE 5: 20-PIN DESCRIPTION (MTCH108)
Name 20-Lead
SSOP 20-Lead
UQFN Description
VDD 1 18 Power Supply Input
MTI0 2 19 Proximity/Touch Sensor 0 Input
MTI1 3 20 Proximity/Touch Sensor 1 Input
MTPM 4 1 Low-Power Mode Select
MTI2/Guard 5 2 Proximity/Touch Sensor 2 Input/Active Guard
MTI3 6 3 Proximity/Touch Sensor 3 Input
MTI4 7 4 Proximity/Touch Sensor 4 Input
MTI5 8 5 Proximity/Touch Sensor 5 Input
MTI6 9 6 Proximity/Touch Sensor 6 Input
MTI7 10 7 Proximity/Touch Sensor 7 Input
MTO7 11 8 MTI7 Detect Output (Active-Low)
MTO6 12 9 MTI6 Detect Output (Active-Low)
MTO5 13 10 MTI5 Detect Output (Active-Low)
MTO4 14 11 MTI4 Detect Output (Active-Low)
MTO3 15 12 MTI3 Detect Output (Active-Low)
MTO2/GC 16 13 MTI2 Detect Output (Active-Low)/Guard Control
MTSA 17 14 Sensitivity Adjust Input
MTO1 18 15 MTI1 Detect Output (Active-Low)
MTO0 19 16 MTI0 Detect Output (Active-Low)
VSS 20 17 Ground
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 5
MTCH102/5/8
Table of Contents
1.0 Device Overview .......................................................................................................................................................................... 6
2.0 Typical Circuit............................................................................................................................................................................... 8
3.0 Sensitivity Adjustment .................................................................................................................................................................. 9
4.0 Power Mode and Timeout Reset................................................................................................................................................ 10
5.0 Electrical Specifications.............................................................................................................................................................. 11
6.0 Packaging Information................................................................................................................................................................ 15
Appendix .............................................................................................................................................................................................. 33
The Microchip Website......................................................................................................................................................................... 34
Product Identification System .............................................................................................................................................................. 35
Customer Change Notification Service ................................................................................................................................................ 34
Customer Support ................................................................................................................................................................................ 34
TO OUR VALUED CUSTOMERS
It is our intention to provide our valued customers with the best documentation possible to ensure successful use of your Microchip
products. To this end, we will continue to improve our publications to better suit your needs. Our publications will be refined and
enhanced as new volumes and updates are introduced.
If you have any questions or comments regarding this publication, please contact the Marketing Communications Department via
E-mail at docerrors@microchip.com. We welcome your feedback.
Most Current Data Sheet
To obtain the most up-to-date version of this data sheet, please register at our Worldwide Website at:
http://www.microchip.com
You can determine the version of a data sheet by examining its literature number found on the bottom outside corner of any page.
The last character of the literature number is the version number, (e.g., DS30000000A is version A of document DS30000000).
Errata
An errata sheet, describing minor operational differences from the data sheet and recommended workarounds, may exist for current
devices. As device/documentation issues become known to us, we will publish an errata sheet. The errata will specify the revision
of silicon and revision of document to which it applies.
To determine if an errata sheet exists for a particular device, please check with one of the following:
• Microchip’s Worldwide Website; http://www.microchip.com
• Your local Microchip sales office (see last page)
When contacting a sales office, please specify which device, revision of silicon and data sheet (include literature number) you are
using.
Customer No tific atio n Syst em
Register on our website at www.microchip.com to receive the most current information on all of our products.
MTCH102/5/8
DS40001793C-page 6 Preliminary 2015-2016 Microchip Technology Inc.
1.0 DEVICE OVERVIEW
The MTCH102/5/8 provides an easy way to add
proximity or touch detection to any application with
human machine interface. These devices can integrate
up to two, five and eight capacitive touch/proximity
detection sensors which can work through plastic,
wood or even metal front panels with Microchip’s
proprietary Metal over Capacitive technology. It also
supports a wide range of conductive materials as
sensors, like copper pad on PCB, silver ink, PEDOT or
carbon printing on plastic film, Indium Tin Oxide (ITO)
pad, wire/cable, etc.
The MTCH102/5/8 uses a sophisticated scan
optimization algorithm to actively attenuate noise from
the signal. The sensitivity adjustment and flexible
power mode allow users to easily configure the device
at run-time. An active-low output will communicate the
state of the sensors to a host/master MCU or drive an
indication LED.
FIGURE 1-1: MTCH102/5/8 BLOCK DIAGRAM
1.1 Pin Description
MTIx
Connect the sensor to this input. An additional resistor
of at least 4.7 kΩ is recommended for best noise
immunity. Sensors work best when the base
capacitance is minimized. This will maximize the
percentage change in capacitance when a finger is
added to the circuit. The recommended sensor
capacitance is 5pF to 50pF.
MTOx
The MTOx pin is an open-drain output which reports
the touch/proximity state of the corresponding MTIx
input. A pull-up resistor is required on each output. The
MTOx will pull the line low when a touch/proximity
event happens and release the line when the touch/
proximity is released.
Guard
The Guard function is multiplexed with one of the MTIx
pins. If the GC pin is floating, the Guard pin will function
as a standard MTIx sensor. If the GC pin is grounded,
the Guard pin will output a signal in-phase with the
other sensors being scanned. This has several
advantages, such as providing a mutual capacitance
coupling to the sensors to increase sensitivity, and
providing a low-impedance trace near the sensor to
absorb noise. The active guard layout should encircle
the sensor and its traces so that it will shield the sensor.
For more information about guarding and layout
guidelines, see application notes “mTouch® Sensing
Solution Acquisition Methods Capacitive Voltage
Divider” (AN1478) and “Techniques for Robust Touch
Sensing Design” (AN1334).
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 7
MTCH102/5/8
GC
The GC (Guard Control) is multiplexed with one of the
MTOx pins. By grounding the GC pin, the active guard
signal will be enabled on the Guard pin.
MTSA
The MTSA pin is an input that determines the
sensitivity of touch/proximity sensors. Applying VDD will
give the lowest sensitivity while applying VSS will give
the highest.
MTPM
The MTPM pin is an input that determines the power
mode of MTCH10X devices. By connecting VSS to the
MTPM pin, the device will operate in Low-Power mode.
See Figure 5-1 for current consumption and response
time specifications. When applying VDD on the
MTCH10X MTPM pin, the device will scan the sensors
at the fastest possible sampling rate. Host-controlled
sampling rates are available using the Smart Scan
Scheduling feature described in Section 4.0, Power
Mode and Timeout Reset.
MTCH102/5/8
DS40001793C-page 8 Preliminary 2015-2016 Microchip Technology Inc.
2.0 TYPICAL CIRCUIT
The MTCH102 is used as an example to show two
typical circuits for MTCH10X devices in the following
figures. For more information about capacitive sensor
layout guidance, refer to “Techniques for Robust Touch
Sensing Design” (AN1334).
FIGURE 2-1: TWO SENSORS AND NO ACTIVE GUARD CIRCUIT
FIGURE 2-2: ONE SENSOR WITH ACTIVE GUARD CIRCUIT
1
V
DD
MTI0
2
MTI1/Guard
3
MTPM
4MTSA 5
MTO1/GC 6
MTO0 7
V
SS
8
U1
07&+
V
DD
GND
10K
R3
R5
R4
Sensor
Sensor
4.7K
R1
4.7K
R2
0.1uF
C1
10K
R7
10K
R6
V
DD
GND
V
DD
MTO0
MTO1
MTPM
1
VDD
MTI0
2
MTI1/Guard
3
MTPM
4MTSA 5
MTO1/GC 6
MTO0 7
VSS8
U1
07&+
VDD
GND
10K
R3
R5
R4
Sensor
4.7K
R1
0
R2
0.1uF
C1
10K
R6
VDD
GND
VDD
MTO0
MTPM
S
ens
or
Active Guard GND
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 9
MTCH102/5/8
3.0 SENSITIVITY ADJUSTMENT
The sensitivity of the sensor inputs determines how far
it can respond to proximity or how much capacitance is
required to activate a touch. The voltage on the
MTCH102/5/8 MTSA pin will determine the sensitivity.
VDD voltage will give the lowest sensitivity, while VSS
voltage will give the highest. The device will sample the
voltage on the MTSA pin after every 32nd scan, so it
does not only support setting a fixed sensitivity by a
resistor ladder, but it also allows adjusting the
sensitivity dynamically while the device is running. A
Digital-to-Analog Converter (DAC) controlled by the
host or a hardware potentiometer can be used to adjust
the sensitivity. Refer to the typical circuit in Figure 3-1
to Figure 3-4.
FIGURE 3-1: FIXED SENSITIVITY
USING RESISTOR
LADDER
FIGURE 3-2: HARDWARE SENSITIVITY
ADJUST USING
POTENTIOMETER
FIGURE 3-3: SENSITIVITY
CONTROLLED BY HOST
USING DAC
FIGURE 3-4: SENSITIVITY
CONTROLLED BY HOST
USING PWM
Note:
Both R1 and R2 are recommended
to be greater than 100K for lower
power consumption.
10k
R3
R1
VDD
R2
MTSA
10k
R2
R1
VDD
MTSA
10k
R2
MTSA
Host
DAC
Note: Refer to Application Note “Using PWM to
Generate Analog Output” (AN538) for
details about how to choose appropriate
R and C values.
R
MTSA
Host
PWM
C
MTCH102/5/8
DS40001793C-page 10 Preliminary 2015-2016 Microchip Technology Inc.
4.0 POWER MODE AND TIMEOUT
RESET
The MTCH102/5/8 has three power mode options to
meet the needs of various applications: Normal mode,
Low-Power mode and Smart-Scheduling mode. The
state of the MTPM pin determines the power mode.
4.1 Normal Mode
The device will run in Normal mode if the MTPM pin is
connected to VDD. In this mode, the MTCH102/5/8 will
scan continuously; so it will achieve the shortest
response time among the three power modes, but also
the power consumption is the highest.
4.2 Low-Power Mode
The device will run in Low-Power mode if the MTPM pin
is connected to VSS. The device will go to Sleep for
256 ms after each round of sensor scans; so it will
achieve the lowest power consumption, but it will have
the longest response time among the three power
modes, as shown in Figure 4-1.
FIGURE 4-1: LOW-POWER MODE
4.3 Smart-Scheduling Mode
The MTCH102/5/8 also implements a Smart-Scheduling
mode that allows a host to set the exact sampling rate by
pulsing the MTPM pin, as shown in Figure 4-2. The
minimum recognizable pulse width is 25 ns. If the MTPM
pin is toggled during a scan cycle, the device will skip the
next Sleep and immediately start a new set of scans.
FIGURE 4-2: SMART-SCHEDULING
MODE
4.4 Timeout Reset
The device keeps track of the activated state duration
for each MTIx input channel. The sensor state will be
reset once the activated state duration exceeds the
timeout duration, and the associated MTOx pin will
release the line.
For the Normal and Low-Power modes, the timeout
duration is 10 seconds. For the Smart-Scheduling
mode, the timeout duration is 400 multiplied by the
scan interval.
MTIx
Burst Scan Sleep:256ms
MTIx
Burst Scan Sleep
MTPM
Scan Interval
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 11
MTCH102/5/8
5.0 ELECTRICAL SPECIFICATIONS
Absolute Maximum Ratings(†)
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on pins with respect to VSS
on VDD pin ................................................................................................................................ -0.3V to +4.0V
on all other pins ............................................................................................................. -0.3V to (VDD + 0.3V)
Total power dissipation(1) ............................................................................................................................... 800 mW
Maximum current
out of VSS pin
-40°C T
A +85°C for industrial.......................................................................................................... 85 mA
into VDD pin
-40°C TA +85°C for industrial .......................................................................................................... 80 mA
Clamp current, IK (VPIN < 0 or VPIN > VDD)20 mA
Maximum output current
sunk by any I/O pin................................................................................................................................ 25 mA
sourced by any I/O pin........................................................................................................................... 25 mA
Note 1: Power dissipation is calculated as follows: PDIS = VDD x {IDD – IOH} + {(VDD – VOH) x IOH} + (VOl x IOL).
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
5.1 DC Characteristics: MTCH102/5/8
MTCH102/5/8 Standard Operating Conditions (unless otherwise
stated)
Operating temperature -40°C ≤ T
A ≥ +85°C for industrial
Param.
No. Sym. Characteristic Min. Typ.† Max. Units Conditions
D001 VDD Supply Voltage 2.05 — 3.6 V
D002* VDR RAM Data Retention Voltage (1) 1.5 — — V Device in Sleep mode
VPOR*Power-on Reset Release Volt-
age —1.6— V
VPORR*Power-on Reset Rearm Voltage — 0.8 — V Device in Sleep mode
D004* SVDD VDD Rise Rate to ensure internal
Power-on Reset signal
0.05 — — V/ms
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: This is the limit to which VDD can be lowered in Sleep mode without losing RAM data.
MTCH102/5/8
DS40001793C-page 12 Preliminary 2015-2016 Microchip Technology Inc.
FIGURE 5-1: MTCH10X FAMILY – POWER VS RESPONSE TIME
FIGURE 5-2: NPOR AND POR REARM WITH SLOW RISING VDD
!%"
!"!"
VDD
VPOR
VPORR
VSS
VSS
NPOR(1)
TPOR(3)
POR REARM
Note 1: When NPOR is low, the device is held in Reset.
2: TPOR 1 s typical.
3: TVLOW 2.7 s typical.
TVLOW(2)
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 13
MTCH102/5/8
5.2 DC Characteristics: MTCH102/5/8-I/E
DC CHARACTERISTICS Standard Operating Conditions (unless otherwise stated)
Operating temperature: -40°C TA +85°C for industrial
Param.
No. Sym. Characteristic Min. Typ.† Max. Units Conditions
VIL Input Low Voltage
I/O PORT:
D030A with TTL buffer — — 0.15 VDD V1.8V VDD 4.5V
VIH Input High Voltage
I/O ports: — —
D040A with TTL buffer 0.25 VDD +
0.8
——V1.8V VDD 4.5V
IIL Input Leakage Current(1)
D060 I/O ports —
—
± 5
± 5
± 125
± 1000
nA
nA
VSS VPIN VDD,
Pin at high-impedance at 85°C
to 125°C
VOL Output Low Voltage(2)
D080 I/O ports ——0.6V
IOL = 6 mA, VDD = 3.3V
IOL = 1.8 mA, VDD = 1.8V
VOH Output High Voltage(2)
D090 I/O ports VDD - 0.7 — — V IOH = 3 mA, VDD = 3.3V
IOH = 1 mA, VDD = 1.8V
Capacitive Loading Specs on Output Pins
D101A* CIO All I/O pins — — 50 pF
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
Note 1: Negative current is defined as current sourced by the pin.
2: Including OSC2 in CLKOUT mode.
MTCH102/5/8
DS40001793C-page 14 Preliminary 2015-2016 Microchip Technology Inc.
FIGURE 5-3: BROWN-OUT RESET TIMING AND CHARACTERISTICS
TABLE 5-1: OSCILLATOR START-UP TIMER, POWER-UP TIMER AND BROWN-OUT RESET
PARAMETERS
Standard Operating Conditions (unless otherwise stated)
Operating Temperature -40°C TA +125°C
Param.
No. Sym. Characteristic Min. Typ.† Max. Units Conditions
33* TPWRT Power-up Timer Period 40 65 140 ms
34* TIOZ I/O High-impedance from RESET
Low or Watchdog Timer Reset
——2.0s
35 VBOR Brown-out Reset Voltage 1.80 1.9 2.05 V BORV = 1.9V
37* VHYST Brown-out Reset Hysteresis 0 25 50 mV -40°C to +85°C
38* TBORDC Brown-out Reset DC Response
Time
0140sVDD VBOR
* These parameters are characterized but not tested.
† Data in “Typ.” column is at 3.0V, 25°C unless otherwise stated. These parameters are for design guidance
only and are not tested.
VBOR
VDD
(Device in Brown-out Reset) (Device not in Brown-out Reset)
33
Reset
(due to BOR)
VBOR and VHYST
37
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 15
MTCH102/5/8
6.0 PACKAGING INFORMATION
6.1 Package Marking Information
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC® designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
8-Lead UDFN (2x3x0.5 mm) Example
102
517
17
8-Lead MSOP (3x3 mm) Example
H102
517017
14-Lead TSSOP (4.4 mm) Example
YYWW
NNN
XXXXXXXX
MTCH105
1517
017
MTCH102/5/8
DS40001793C-page 16 Preliminary 2015-2016 Microchip Technology Inc.
Package Marking Information (Continue d)
Legend: XX...X Customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC® designator ( )
can be found on the outer packaging for this package.
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information.
3
e
3
e
20-Lead UQFN (4x4x0.9 mm) Example
PIN 1 PIN 1
MTCH
108
\GZ
514017
16-Lead QFN (4x4x0.9 mm) Example
PIN 1 PIN 1
MTCH
105
517017
20-Lead SSOP (5.30 mm) Example
MTCH108
1517017
ML
3
e
\SS
3
e
3
e
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 17
MTCH102/5/8
6.2 Package Details
The following sections give the technical details of the packages.
!""#$%&
'
MTCH102/5/8
DS40001793C-page 18 Preliminary 2015-2016 Microchip Technology Inc.
!""#$%&
'
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 19
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MTCH102/5/8
DS40001793C-page 20 Preliminary 2015-2016 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 21
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MTCH102/5/8
DS40001793C-page 22 Preliminary 2015-2016 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 23
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MTCH102/5/8
DS40001793C-page 24 Preliminary 2015-2016 Microchip Technology Inc.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 25
MTCH102/5/8
B
A
0.15 C
0.15 C
0.10 C A B
(DATUM B)
(DATUM A)
C
SEATING
PLANE
NOTE 1
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
Microchip Technology Drawing C04-127D Sheet 1 of 2
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
D
E
A
(A3)
16X b
e
e
2
2X
D2
E2
K
0.40
16X
A1
MTCH102/5/8
DS40001793C-page 26 Preliminary 2015-2016 Microchip Technology Inc.
Microchip Technology Drawing C04-127D Sheet 2 of 2
Number of Pins
Overall Height
Overall Width
Contact Width
Overall Length
Exposed Pad Width
Exposed Pad Length
Contact Thickness
Pitch
Standoff
Units
Dimension Limits
e
E2
b
D2
D
A3
E
A1
A
N
MIN
0.65 BSC
0.20 REF
2.50
0.25
2.50
0.80
0.00
2.65
0.30
4.00 BSC
2.65
-
0.90
4.00 BSC
0.02
NOM
MILLIMETERS
16
2.80
0.35
2.80
-
1.00
0.05
MAX
Contact Length L 0.30 0.40 0.50
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Package is saw singulated
3. Dimensioning and tolerancing per ASME Y14.5M
Notes:
Contact-to-Exposed Pad K 0.20
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 27
MTCH102/5/8
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
16-Lead Plastic Quad Flat, No Lead Package (ML) - 4x4x0.9mm Body [QFN]
MTCH102/5/8
DS40001793C-page 28 Preliminary 2015-2016 Microchip Technology Inc.
()*+(",+((! ""#$%((,&
'
'
φ
L
L1
A2 c
e
b
A1
A
12
NOTE 1
E1
E
D
N
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 29
MTCH102/5/8
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
MTCH102/5/8
DS40001793C-page 30 Preliminary 2015-2016 Microchip Technology Inc.
B
A
0.20 C
0.20 C
0.10 C A B
(DATUM B)
(DATUM A)
C
SEATING
PLANE
1
2
N
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
NOTE 1
1
2
N
0.10 C A B
0.10 C A B
0.10 C
0.08 C
A1
Microchip Technology Drawing C04-255A Sheet 1 of 2
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
D
E
A
(A3)
20X b
e
2X
D2
E2
NOTE 1
L
K
20X
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 31
MTCH102/5/8
Microchip Technology Drawing C04-255A Sheet 2 of 2
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Number of Terminals
Overall Height
Terminal Width
Overall Width
Overall Length
Terminal Length
Exposed Pad Width
Exposed Pad Length
Terminal Thickness
Pitch
Standoff
Units
Dimension Limits
A1
A
b
D
E2
D2
A3
e
L
E
N
0.50 BSC
0.127 REF
2.60
2.60
0.30
0.20
0.45
0.00
0.25
4.00 BSC
0.40
2.70
2.70
0.50
0.02
4.00 BSC
MILLIMETERS
MIN NOM
20
2.80
2.80
0.50
0.30
0.55
0.05
MAX
K-0.20 -
REF: Reference Dimension, usually without tolerance, for information purposes only.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
1.
2.
3.
Notes:
Pin 1 visual index feature may vary, but must be located within the hatched area.
Package is saw singulated
Dimensioning and tolerancing per ASME Y14.5M
Terminal-to-Exposed-Pad
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
MTCH102/5/8
DS40001793C-page 32 Preliminary 2015-2016 Microchip Technology Inc.
RECOMMENDED LAND PATTERN
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
Note:
Dimension Limits
Units
C2
Optional Center Pad Width
Contact Pad Spacing
Optional Center Pad Length
Contact Pitch
Y2
X2
2.80
2.80
MILLIMETERS
0.50 BSC
MIN
E
MAX
4.00
Contact Pad Length (X20)
Contact Pad Width (X20)
Y1
X1
0.80
0.30
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
Notes:
1. Dimensioning and tolerancing per ASME Y14.5M
Microchip Technology Drawing C04-2255A
NOM
20-Lead Ultra Thin Plastic Quad Flat, No Lead Package (GZ) - 4x4x0.5 mm Body [UQFN]
SILK SCREEN
1
2
20
C1
C2
E
X1
Y1
G1
Y2
X2
C1Contact Pad Spacing 4.00
Contact Pad to Center Pad (X20) G1 0.20
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 33
MTCH102/5/8
APPENDIX A: DATA SHEET
REVISION HISTORY
Revision A (05/2015)
Initial release of this document.
Revision B (01/2016)
Updated Packaging Information and Product
Identification System sections. Other minor
corrections.
Revision C (04/2016)
Updated Packaging Information section. Other minor
corrections.
MTCH102/5/8
DS40001793C-page 34 Preliminary 2015-2016 Microchip Technology Inc.
THE MICROCHIP WEBSITE
Microchip provides online support via our website at
www.microchip.com. This website is used as a means
to make files and information easily available to
customers. Accessible by using your favorite Internet
browser, the website contains the following information:
•Product Support – Data sheets and errata,
application notes and sample programs, design
resources, user’s guides and hardware support
documents, latest software releases and archived
software
•General Technical Support – Frequently Asked
Questions (FAQ), technical support requests,
online discussion groups, Microchip consultant
program member listing
•Business of Microchip – Product selector and
ordering guides, latest Microchip press releases,
listing of seminars and events, listings of
Microchip sales offices, distributors and factory
representatives
CUSTOMER CHANGE NOTIFICATION
SERVICE
Microchip’s customer notification service helps keep
customers current on Microchip products. Subscribers
will receive e-mail notification whenever there are
changes, updates, revisions or errata related to a
specified product family or development tool of interest.
To register, access the Microchip website at
www.microchip.com. Under “Support”, click on
“Customer Change Notification” and follow the
registration instructions.
CUSTOMER SUPP ORT
Users of Microchip products can receive assistance
through several channels:
• Distributor or Representative
• Local Sales Office
• Field Application Engineer (FAE)
• Technical Support
Customers should contact their distributor,
representative or Field Application Engineer (FAE) for
support. Local sales offices are also available to help
customers. A listing of sales offices and locations is
included in the back of this document.
Technical support is available through the website
at: http://www.microchip.com/support
2015-2016 Microchip Technology Inc. Preliminary DS40001793C-page 35
MTCH102/5/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office.
PART NO. X/XX XXX
PatternPackageTemperature
Range
Device
Device: MTCH102; MTCH105; MTCH108.
Tape and Reel
Option: Blank = Standard packaging (tube or tray)
T = Tape and Reel(1)
Temperature
Range: I= -40C to +85C (Industrial)
E= -40C to +125C (Extended)
Package: MS = MSOP
SS = SSOP
MU = UDFN
GZ = UQFN
ST = TSSOP
ML = QFN
Examples:
a) MTCH102 - I/MS = Industrial temperature,
MSOP package.
b) MTCH105 - I/ML = Industrial temperature, QFN
package.
c) MTCH108 - I/GZ = Industrial temperature,
UQFN package.
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This
identifier is used for ordering purposes and
is not printed on the device package. Check
with your Microchip Sales Office for package
availability with the Tape and Reel option.
[X](1)
Tape and Reel
Option
DS40001793C-page 36 Preliminary 2015-2016 Microchip Technology Inc.
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate,
dsPIC, FlashFlex, flexPWR, Heldo, JukeBlox, KeeLoq,
KeeLoq logo, Kleer, LANCheck, LINK MD, MediaLB, MOST,
MOST logo, MPLAB, OptoLyzer, PIC, PICSTART, PIC32 logo,
RightTouch, SpyNIC, SST, SST Logo, SuperFlash and UNI/O
are registered trademarks of Microchip Technology
Incorporated in the U.S.A. and other countries.
ClockWorks, The Embedded Control Solutions Company,
ETHERSYNCH, Hyper Speed Control, HyperLight Load,
IntelliMOS, mTouch, Precision Edge, and QUIET-WIRE are
registered trademarks of Microchip Technology Incorporated
in the U.S.A.
Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut,
BodyCom, chipKIT, chipKIT logo, CodeGuard, dsPICDEM,
dsPICDEM.net, Dynamic Average Matching, DAM, ECAN,
EtherGREEN, In-Circuit Serial Programming, ICSP, Inter-Chip
Connectivity, JitterBlocker, KleerNet, KleerNet logo, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code
Generation, PICDEM, PICDEM.net, PICkit, PICtail,
PureSilicon, RightTouch logo, REAL ICE, Ripple Blocker,
Serial Quad I/O, SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated
in the U.S.A.
Silicon Storage Technology is a registered trademark of
Microchip Technology Inc. in other countries.
GestIC is a registered trademarks of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2015-2016, Microchip Technology Incorporated, Printed in
the U.S.A., All Rights Reserved.
ISBN: 978-1-5224-0486-6
Note the following details of the code protection feature on Microchi p devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperip herals, nonvola tile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITY MANAGEMENT S
YSTEM
CERTIFIED BY DNV
== ISO/TS 16949 ==
2015-2016 Microchip Technology Inc. Preliminary DS40001793B-page 37
AMERICAS
Corporate Office
2355 West Chandler Blvd.
Chandler, AZ 85224-6199
Tel: 480-792-7200
Fax: 480-792-7277
Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
Atlanta
Duluth, GA
Tel: 678-957-9614
Fax: 678-957-1455
Austin, TX
Tel: 512-257-3370
Boston
Westborough, MA
Tel: 774-760-0087
Fax: 774-760-0088
Chicago
Itasca, IL
Tel: 630-285-0071
Fax: 630-285-0075
Cleveland
Independence, OH
Tel: 216-447-0464
Fax: 216-447-0643
Dallas
Addison, TX
Tel: 972-818-7423
Fax: 972-818-2924
Detroit
Novi, MI
Tel: 248-848-4000
Houston, TX
Tel: 281-894-5983
Indianapolis
Noblesville, IN
Tel: 317-773-8323
Fax: 317-773-5453
Los A n ge les
Mission Viejo, CA
Tel: 949-462-9523
Fax: 949-462-9608
New York, NY
Tel: 631-435-6000
San Jose, CA
Tel: 408-735-9110
Canada - Toronto
Tel: 905-673-0699
Fax: 905-673-6509
ASIA/PACIFIC
Asia Pacific Office
Suites 3707-14, 37th Floor
Tower 6, The Gateway
Harbour City, Kowloon
Hong Kong
Tel: 852-2943-5100
Fax: 852-2401-3431
Australia - Sydney
Tel: 61-2-9868-6733
Fax: 61-2-9868-6755
China - Beijing
Tel: 86-10-8569-7000
Fax: 86-10-8528-2104
China - Chengdu
Tel: 86-28-8665-5511
Fax: 86-28-8665-7889
China - Chongqing
Tel: 86-23-8980-9588
Fax: 86-23-8980-9500
China - Dongguan
Tel: 86-769-8702-9880
China - Hangzhou
Tel: 86-571-8792-8115
Fax: 86-571-8792-8116
China - Hong Kong SAR
Tel: 852-2943-5100
Fax: 852-2401-3431
China - Nanjing
Tel: 86-25-8473-2460
Fax: 86-25-8473-2470
China - Qingdao
Tel: 86-532-8502-7355
Fax: 86-532-8502-7205
China - Shanghai
Tel: 86-21-5407-5533
Fax: 86-21-5407-5066
China - Shenyang
Tel: 86-24-2334-2829
Fax: 86-24-2334-2393
China - Shenzhen
Tel: 86-755-8864-2200
Fax: 86-755-8203-1760
China - Wuhan
Tel: 86-27-5980-5300
Fax: 86-27-5980-5118
China - Xian
Tel: 86-29-8833-7252
Fax: 86-29-8833-7256
ASIA/PACIFIC
China - Xiamen
Tel: 86-592-2388138
Fax: 86-592-2388130
China - Zhuhai
Tel: 86-756-3210040
Fax: 86-756-3210049
India - Bangalore
Tel: 91-80-3090-4444
Fax: 91-80-3090-4123
India - New Delhi
Tel: 91-11-4160-8631
Fax: 91-11-4160-8632
India - Pune
Tel: 91-20-3019-1500
Japan - Osaka
Tel: 81-6-6152-7160
Fax: 81-6-6152-9310
Japan - Tokyo
Tel: 81-3-6880- 3770
Fax: 81-3-6880-3771
Korea - Daegu
Tel: 82-53-744-4301
Fax: 82-53-744-4302
Korea - Seoul
Tel: 82-2-554-7200
Fax: 82-2-558-5932 or
82-2-558-5934
Malaysia - Kuala Lumpur
Tel: 60-3-6201-9857
Fax: 60-3-6201-9859
Malaysia - Penang
Tel: 60-4-227-8870
Fax: 60-4-227-4068
Philippines - Manila
Tel: 63-2-634-9065
Fax: 63-2-634-9069
Singapore
Tel: 65-6334-8870
Fax: 65-6334-8850
Taiwan - Hsin Chu
Tel: 886-3-5778-366
Fax: 886-3-5770-955
Taiwan - Kaohsiung
Tel: 886-7-213-7828
Taiwan - T aipei
Tel: 886-2-2508-8600
Fax: 886-2-2508-0102
Thailand - Bangkok
Tel: 66-2-694-1351
Fax: 66-2-694-1350
EUROPE
Austria - Wels
Tel: 43-7242-2244-39
Fax: 43-7242-2244-393
Denmark - Cop e nha gen
Tel: 45-4450-2828
Fax: 45-4485-2829
France - Paris
Tel: 33-1-69-53-63-20
Fax: 33-1-69-30-90-79
Germany - Dusseldorf
Tel: 49-2129-3766400
Germany - Karlsruhe
Tel: 49-721-625370
Germany - Munich
Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Venice
Tel: 39-049-7625286
Netherlands - Drunen
Tel: 31-416-690399
Fax: 31-416-690340
Poland - Warsaw
Tel: 48-22-3325737
Spain - Ma dri d
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
07/14/15
