TB62801FG
2006-06-14
1
TOSHIBA Bi-CMOS Integrated Circuit Silicon Monolithic
TB62801FG
Linear CCD Clock Driver
The TB62801FG is a clock distribution driver for CCD linear
image sensors.
The IC can functionally drive the CCD input capacitance. It
also supports inverted outputs, eliminating the need for
crosspoint control.
The IC contains a 1 to 4 clock distribution driver for the main
clock and 4-bit buffers for control signals.
The suffix (G) appended to the part number represents a Lead
(Pb) -Free product.
Features
• High drivability: Guaranteed driving 450 [pF] load
capacitance @fclock = 20 [MHz]
• Operating temperature range: Ta = −25°C to 60°C
Pin Connection (top view)
Weight: 0.5 g (typ.)
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
2B_in
CP_in
VCC
GND
VCC
CK_in
SH_in
RS_in
2B_out
CP_out
φ
φ
GND
φ
φ
SH_out
RS_out
2B_ out
TB62801FG
2006-06-14
2
Lo g ic Diagr a m
Pin Description
Pin N o. P in Na me Func tio ns Re marks
1 2B_ out Light-load drive output (inverted) Driver output for CCD last-stage clock
2 2B_in
Light-load drive input Driver input for CCD last-stage clock
3 CP_in
Light-load drive input CCD clamp gate driver input
4 VCC Power supply ―
GND
Ground ―
5 VCC Power supply ―
6 CK_in
Heavy-load drive input Driver input for CCD transfer clock
7 SH_in Light-load drive input CCD shift gate driver input
8 RS_in Light-load drive input CCD reset gate driver input
9 RS_out Light-load drive output (not inverted) CCD reset gate driver output
10 SH_out Light-load drive output (not inverted) CCD shift gate driver output
11 φ Heavy-load drive output (not inverted) Driver output for CCD transfer clock
12 φ Heavy-load drive output (inverted) Driver output for CCD transfer clock
GND Ground ―
13 φ Heavy-load drive output (inverted) Driver output for CCD transfer clock
14 φ Heavy-load drive output (not inverted) Driver output for CCD transfer clock
15 CP_out Light-load drive output (not inverted) CCD clamp gate driver output
16 2B_out Light-load drive output (not inverted) Driver output for CCD last-stage clock
φ
φ
φ
φ
CK_in
CP_out CP_in
SH_out SH_in
RS_out RS_in
2B_in
2B_ out
2B_out
TB62801FG
2006-06-14
3
Truth Table
Input Output
L H
H
2B_ out
L
L L
2B_in
H
2B_out
H
L L
CP_in
H
CP_out
H
L L
H
φ
H
L H
CK_in
H
φ
L
L L
SH_in
H
SH_out
H
L L
RS_in
H
RS_out
H
Absolute Maximum Ratings (Ta = 25°C)
Characteristic Symbol Rating Unit
Power supply voltage VCC −0.5 to 7.0 V
Input voltage VIN −1.2 to
VCC+0.5 V
Output voltage VO −0.5 to VCC V
Input clamp diode current (Vi < 0) IIK −50 mA
Output clamp diode current (VO < 0) IOK −50 mA
High level IOH (O/ O) −16.0 mA Output current
excluding other
than φ, φ outputs Low level IOL (O/ O ) 16.0 mA
High level IOH (φ/φ)−100 mA
φ output current
Low level IOL (φ/φ) 150 mA
Operating temperature Topr −25 to 60 ℃
Storage temperature Tstg −40 to 100 ℃
Junction temperature Tj 150 ℃
Power dissipation PD 1.5 W
Note: Output current is specified as follows: VOH = 4.0 V, VOL = 0.5 V.
TB62801FG
2006-06-14
4
Recomm end ed Operating Condi tions
Characteristic Symbol Min Typ. Max Unit
Power supply voltage VCC 4.7 5.0 5.5 V
Input voltage VIN 0 ⎯ V
CC V
Output voltage VO 0 ⎯ V
CC V
High level IOH (O/ O)⎯ ⎯ −8.0 mA Output current
excluding φ, φ
outputs Low level IOL (O/ O) ⎯ ⎯ 8.0 mA
High level IOH (φ/φ) ⎯ ⎯ −20.0 mA
φ output current
(Note)
Low level IOL (φ/φ) ⎯ ⎯ 20.0 mA
Operating temperature Topr −25 25 60 °C
Input rise/fall time tri/tfi ⎯ 2.5 5.0 ns
Note: Output current is specified as follows: VCC = 4.7 V, VOH = 4.5 V, VOL = 0.2 V.
Input rise/fall time is specified as 10 % to 90 % of waveform amplitude.
Electrical Characteristics
DC Characteristics (unless otherwise specified, VCC = 4.7 to 5.5 V, Ta = −25 to 60°C)
Characteristic Symbol
Test
Circuit Test Condition VCC Min Typ. Max Unit
High VIH ⎯ 4.7 2.0 ⎯ V
CC
Input voltage
Low VIL
1, 2
⎯ 4.7 0 ⎯ 0.8
V
Input clamp voltage VIK 3 IIK = −30 mA 4.7 ⎯ ⎯ 1.0 V
IOH = −10 mA 4.7 4.5 ⎯ V
CC
IOH = −50 mA 4.7 4.0 ⎯ V
CC
VOH (φ/φ) 4, 5
IOH = −300 mA 4.7 2.5 ⎯ V
CC
IOL = 100 µA 4.7 0 ⎯ 0.2
IOL = 50 mA 4.7 0 ⎯ 0.5
φ output voltage
VOL (φ/φ) 6, 7
IOL = 300 mA 4.7 0 ⎯ 2.5
V
IOH (O / O) = −4 mA 4.7 4.5 ⎯ V
CC
VOH (O/ O) 4, 5
IOH (O / O) = −16 mA 4.7 4.0 ⎯ V
CC
IOL (O / O) = 4 mA 4.7 0 ⎯ 0.2
Output voltage excluding
φ, φ outputs
VOL (O/ O) 6, 7
IOL (O / O) = 16 mA 4.7 0 ⎯ 0.5
V
Input voltage IIN 8 VIN = VCC or GND 5.5 ⎯ ⎯ 1.0 µA
Total ICC 9
φ outputs: High or Low
φoutputs: Low or High
Other outputs are High
5.5 ⎯ ⎯ 15.0
Static current
consumption
Each bit ∆ICC 10
One input: VIN = 0.5 V
Other inputs: VCC or GND ⎯ ⎯ ⎯ 1.5
mA
Output off mode supply
voltage VPOR ⎯ See description on next page. ⎯ ⎯ 3.0 ⎯ V
TB62801FG
2006-06-14
5
Output Low-Level Fixed Mode at Power-On
To avoid malfunction at power on, this IC incorporates the following functions:
• All outputs are fixed to low level until VCC reaches more than 3 V.
• When VCC reaches 3 V (typ.), internal logic depends on input signals.
• VCC must be more than 4.7 V for normal operation.
AC Characteristics (input transition rise or fall time: tr/tf = 2.5 ns)
Normal Temperature/
VCC = 5.0 V
All
Temperatures/
VCC = 4.7 t o
5.5 V
Characteristic Symbol Test Condition
Min Typ. Max Min Max
Unit R eference
Measurement
Diagram
CL = 450 pF 7.0 10.0 14.0 7.0 16.0
tpLH (φ/φ) CL = 350 pF 6.0 9.0 13.0 6.0 15.0
CL = 450 pF 7.0 10.0 14.0 7.0 16.0
tpHL (φ/φ) CL = 350 pF 6.0 9.0 13.0 6.0 15.0
ns Measurement
diagram 1
CL = 30 pF 3.0 5.0 7.0 2.5 8.0
tpLH (O/ O) CL = 15 pF 2.0 4.0 6.0 1.5 7.0
CL = 30 pF 3.0 5.0 7.0 2.5 8.0
Propagation delay time
tpHL (O/ O) CL = 15 pF 2.0 4.0 6.0 1.5 7.0
ns Measurement
diagram 2
Output skew excluding
φ, φ outputs to (skw) CL = 30 pF 0 ⎯ 2.0 ⎯ 2.0 ns
Measurement
diagram 3
Output crosspoints
(φ1/φ2) VT (crs) CL = 300 to
450 pF ⎯ ⎯ ⎯ 1.5 ⎯ V
Measurement
diagram 4
Power VCC
DUT
Output signal waveform
Pulse
generator
Additional circuit (P.O.R) test circuit
Output signal waveform
GND
Supply voltage
3 V
VCC
Time
Low-level state
TB62801FG
2006-06-14
6
Waveform Measuring Point
Propagation Delay Time Setting
Input signal
• 2B_in
• CK_in
• SH_in
• RS_in
• CP_in
Mea surem ent Diagram 1
Output signal
• φ
Output signal
•φ
Mea surem ent Diagram 2
Output signal
• 2B_out
• CP_out
• SH_out
• RS_out
Output signal
• 2B_out
Mea surem ent Diagram 3
Output signal
•out_B2
• 2B_out
• CP_out
• SH_out
• RS_out
Output Waveform Crosspoint/Level Setting
Mea surem ent Diagram 4
• φ
•φ
10%
90%
1.5 V
tri
10%
90%
1.5 V
tfi
GND
3.0 V
VCC − 0.5 V
tpLH (O) tpHL (O)
GND + 0.5 V
tpHL ( O) tpLH ( O)
VCC − 0.5 V
GND + 0.5 V
VCC − 0.5 V
tpLH (φ1) tpHL (φ1)
GND + 0.5 V
VCC
GND
VCC
GND
VCC
GND
VCC
GND
to (skw) to (skw)
VOL
VT (CRS)
VOH
GND
tpHL (φ2) tpLH (φ2)
VCC − 0.5 V
GND + 0.5 V
VCC
GND
TB62801FG
2006-06-14
7
Reference Da ta (typ. value)
1.6
0.0
0 25 150
0.2
0.4
0.6
0.8
1.4
100
1.0
Mounted on test board
IC only
Note: Test board:
50 mm × 50 mm
glass-epoxy board.
1.2
50 125 75
1.4
0.0
0.0E + 0 5.0E + 6 1.0E + 7 2.0E + 7
0.2
0.4
0.6
0.8
1.2
1.5E + 7
1.0
Power dissipation
Rise in temperature
Note:
CL (φ/φ) = 450 pF,
CL = (O/ O) = 30 pF
Output amplitude = 4.5 V
Supply voltage = 5.5 V
Mounted on a
50 mm × 50 mm
glass-epoxy board 0
100
20
40
60
80
120
0
50 100 150 250 300 400 450
20
40
60
80
100
200 350
Note: Maximum operating frequency:
Under specified load conditions,
the frequency when the pulse width of the
output signal matches that of the input signal; or
the frequency at which the specified amplitude is
obtained. Note that light-load bits are fixed to a
capacitance of 30 pF.
Note: Propagation delay time is
in accordance with
attached sheet.
VCC = 5.0 V, Ta = 25°C,
tri/tfi = 2.5 ns
12
4
50 150 250 350 450 550 650
5
6
7
8
9
10
11
Low-level output current IOL (A)
PD (W)
Capacitance (pF)
tpLH (φ), tpHL (φ) – CL
(characteristics of 1-output,
other outputs: no load)
Propagation delay time (ns)
Capacitance (pF)
Load capacitance versus maximum
operating frequency (all bits in operation)
VCC = 5.0 V, Ta = 25°C, tri/tfi = 2.5 ns
Frequency (MHz)
Rise in temperature (°C)
Frequency (Hz)
Frequency versus power dissipation,
temperature
(@all outputs: maximum load capacitance)
Power dissipation (W)
Ta (°C )
PD – Ta
Low-level output voltage VOL (V)
φ/φ output
IOL – VOL
High-level output voltage VOH (V)
φ
/
φ
output
IOH – VOH
High-level output current IOH (A)
1.0
0.0
0.0 1.0 5.0
0.2
0.4
0.8
3.0
0.6
2.0 4.0
Ta = 25°C
VCC = 4.7 V
0.0
−1.0
−5.0 −4.0 0.0
−0.8
−0.6
−0.2
−2.0
−0.4
−3.0 −1.0
Ta = 25°C
VCC = 4.7 V
(*) Subtract amplitude voltage
with VCC as reference.
TB62801FG
2006-06-14
8
Test Circuit
DC Paramet ers
Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so
that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
• VIH/VIL
(1) Light-load drive bit
(2) Heavy-load drive bit
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
0 to VCC
30 pF
E.g., oscilloscope
♦
♦
♦
♦
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
0 to VCC
450 pF
E.g., oscilloscope
♦
TB62801FG
2006-06-14
9
• VIK
Note 1: When measuring input pins, connect the input pins that are not being measured to GND.
• VOH (O/φ)
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
♦
♦
♦
♦
V
−30 mA
♦
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
V
♦
♦
♦
♦
♦
♦
O output: −4/−16 mA
φ output: −10/−50/−300 mA
TB62801FG
2006-06-14
10
• VOH (O/φ)
• VOL (O/φ)
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
♦
♦
V O output: −4/−16 mA
φ output: −10/−50/−300 mA
♦
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
♦
♦
♦
♦
♦
♦
O output: 4/16 mA
φ output: 100 µA/50/300 mA
V
4.7 V
TB62801FG
2006-06-14
11
• VOL (O/φ)
• IIN
Note: When measuring input pins, connect the input pins that are not being measured to GND.
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
4.7 V
♦
♦
♦
O output: 4/16 mA
φ output: 100 µA/50/300 mA
V
4.7 V
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
5.5 V
♦
♦
♦
5.5 V
A
A
♦
♦
TB62801FG
2006-06-14
12
• ICC
Note 1: The input logic of the heavy-load drive clock input pin (pin 6) is the same for High or Low.
• ∆ICC
Note 2: When measuring input pins, connect the input pins that are not being measured to GND or
power.
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
3 V
♦
5.5 V
A
♦
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
0.5 V
♦
♦
VCC
A
TB62801FG
2006-06-14
13
AC Parame t ers
Pins marked with an asterisk (*) are test pins. Ground the input pins that are not being used as test pins so
that their logic is determined. Unless otherwise specified, bits of the same type are measured in the same way.
• Propagation Delay Time
(1) Light-load drive bit
(2) Heavy-load drive bit
15/30 pF
E.g., oscilloscope
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
0 to 3 V
♦
♦
VCC
♦
♦
♦
350/450 pF
E.g., oscilloscope
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
0 to 3 V
♦
♦
VCC
♦
♦
TB62801FG
2006-06-14
14
• Ligh t - L o a d Drive Ou t put Skew
• Heavy-Load Drive Output Crosspoints
30 pF
E.g., oscilloscope
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
0 to 3 V
♦
♦
VCC
♦
♦
♦
30 pF
30 pF
30 pF
30 pF
CL
E.g., oscilloscope
1
2
3
4
16
5
6
7
8
15
14
13
12
11
10
9
0 to 3 V
♦
♦
VCC
♦
♦
CL
CL
CL
CL = 300 to 450 pF
TB62801FG
2006-06-14
15
Example of an Appl ic ati on Ci rcuit
(1) Connection to the TCD1503C
Note: Driving the CCD requires a lot of power. Toshiba recommends using a bypass capacitor
connected to the 5 V power supply to stabilize voltage.
Precautions on Use
This IC does not include built-in protection circuits for excess current or overvoltage. If the IC is subjected to
excess current or overvoltage, it may be destroyed. Therefore systems incorporating the IC should be designed with
the utmost care.
Particular care is necessary in the design of the output, VCC and GND lines since the IC may be destroyed by
short circuits between outputs, air contamination faults, or faults due to improper grounding.
VCC
GND
2B_in
16
15
14
13
12
11
10
9
1
2
3
4
22
5
6
7
8
21
20
19
15
14
13
12
SS
NC
φ2E
SS
φ1E
NC
9
10
11
OS1
18
17
16 NC
CP
φ2B
SH
RS
SS
OS2
φ10
φ20
NC
NC
CP
φ2B
RS
OD
Signal output 1 Signal output 2
12 V
1
2
3
4
GND
5
6
7
8
CP_in
VCC
CK_in
SH_in
RS_in
2B_out
CP_out
φ
φ
φ
φ
SH_out
RS_out
2B_ out
5 V
Last transfer clock signal input
Clamp gate signal input
Transfer clock signal input
Shift gate signal input
Reset gate signal input
5000
TCD1503C
1
TB62801FG
2006-06-14 16
(2) Connection to the TCD1703C
Note: Driving the CCD requires a lot of power. Toshiba recommends the use of a bypass capacitor connected to the 5 V power supply to
stabilize voltage.
Two TB62801FGS devices are used in this application: one is used to drive all the control bits and the four transfer clock bits, the
other to drive the remaining four transfer clock bits.
VCC
GND
2B_in
16
15
14
13
12
11
10
9
1
2
3
4
22
5
6
7
8
21
20
19
15
14
13
12
OD
NC
φ2E1
SS
φ1E2
SH
9
10
11
OS1
18
17
16 φ2E2
φ1E2
φ2B
RS
CP
SS
OS2
φ101
φ201
SS
φ202
φ102
φ2B
RS
CP
Signal output 1 Signal output 2
12 V
1
2
3
4
GND
5
6
7
8
CP_in
VCC
CK_in
SH_in
RS_in
2B_out
CP_out
φ
φ
φ
φ
SH_out
RS_out
2B_ out
5 V
Last transfer clock signal input
Clamp gate signal input
Transfer clock signal input
Shift gate signal input
Reset gate signal input
7500
TCD1703C
1
VCC
GND
2B_in
16
15
14
13
12
11
10
9
1
2
3
4
GND
5
6
7
8
CP_in
VCC
CK_in
SH_in
RS_in
2B_out
CP_out
φ
φ
φ
φ
SH_out
RS_out
2B_ out
5 V
TB62801FG
2006-06-14
17
Package Dimensions
HSOP16-P-300-1.00
Unit: mm
Weight: 0.5 g (typ.)
TB62801FG
2006-06-14
18
Notes on Contents
1. Block Diagrams
Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for
explanatory purposes.
2. Equivalent Circuits
The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory
purposes.
3. Timing Charts
Timing charts may be simplified for explanatory purposes.
4. Application Circuits
The application circuits shown in this document are provided for reference purposes only.
Thorough evaluation is required, especially at the mass production design stage.
Toshiba does not grant any license to any industrial property rights by providing these examples of
application circuits.
5. Test Circuits
Components in the test circuits are used only to obtain and confirm the device characteristics. These
components and circuits are not guaranteed to prevent malfunction or failure from occurring in the
application equipment.
IC Usage Considerati on s
Notes on Handling of ICs
(1) The absolute maximum ratings of a semiconductor device are a set of ratings that must not be
exceeded, even for a moment. Do not exceed any of these ratings.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
(2) Use an appropriate power supply fuse to ensure that a large current does not continuously flow in
case of over current and/or IC failure. The IC will fully break down when used under conditions that
exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal
pulse noise occurs from the wiring or load, causing a large current to continuously flow and the
breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of
breakdown, appropriate settings, such as fuse capacity, fusing time and insertion circuit location, are
required.
(3) If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the
design to prevent device malfunction or breakdown caused by the current resulting from the inrush
current at power ON or the negative current resulting from the back electromotive force at power OFF.
IC breakdown may cause injury, smoke or ignition.
Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable,
the protection function may not operate, causing IC breakdown. IC breakdown may cause injury,
smoke or ignition.
(4) Do not insert devices in the wrong orientation or incorrectly.
Make sure that the positive and negative terminals of power supplies are connected properly.
Otherwise, the current or power consumption may exceed the absolute maximum rating, and
exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result
injury by explosion or combustion.
In addition, do not use any device that is applied the current with inserting in the wrong orientation
or incorrectly even just one time.
TB62801FG
2006-06-14
19
(5) Carefully select external components (such as inputs and negative feedback capacitors) and load
components (such as speakers), for example, power amp and regulator.
If there is a large amount of leakage current such as input or negative feedback condenser, the IC
output DC voltage will increase. If this output voltage is connected to a speaker with low input
withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause
smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied
Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.
TB62801FG
2006-06-14
20
Points to Remember on Handling of ICs
(1) Heat Radiation Design
In using an IC with large current flow such as power amp, regulator or driver, please design the
device so that heat is appropriately radiated, not to exceed the specified junction temperature (Tj) at
any time and condition. These ICs generate heat even during normal use. An inadequate IC heat
radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC breakdown. In
addition, please design the device taking into considerate the effect of IC heat radiation with
peripheral components.
(2) Back-EMF
When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to
the motor’s power supply due to the effect of back-EMF. If the current sink capability of the power
supply is small, the device’s motor power supply and output pins might be exposed to conditions
beyond absolute maximum ratings. To avoid this problem, take the effect of back-EMF into
consideration in system design.
TB62801FG
2006-06-14
21
About solderability, following conditions were confirmed
• Solderability
(1) Use of Sn-37Pb solder Bath
· solder bath temperature = 230°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
(2) Use of Sn-3.0Ag-0.5Cu solder Bath
· solder bath temperature = 245°C
· dipping time
= 5 seconds
· the number of times = once
· use of R-type flux
RESTRICTIONS ON PRODUCT USE 060116EB
A
• The information contained herein is subject to change without notice. 021023_D
• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability
Handbook” etc. 021023_A
• The TOSHIBA products listed in this document are intended for usage in general electronics applications
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,
etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,
medical instruments, all types of safety devices, etc. Unintended Usage of TOSHIBA products listed in this
document shall be made at the customer’s own risk. 021023_B
• The products described in this document shall not be used or embedded to any downstream products of which
manufacture, use and/or sale are prohibited under any applicable laws and regulations. 060106_Q
• The information contained herein is presented only as a guide for the applications of our products. No
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of
TOSHIBA or others. 021023_C
• The products described in this document are subject to the foreign exchange and foreign trade laws. 021023_E
