MBRS360T3G - ON Semiconductor L.L.C.

February, 2012 − Rev. 8

1Publication Order Number:

MBRS360T3/D

MBRS360T3G,

MBRS360BT3G,

NRVBS360T3G,

NRVBS360BT3G

Surface Mount

Schottky Power Rectifier

This device employs the Schottky Barrier principle in a large area

metal−to−silicon power diode. State−of−the−art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification, or

as free wheeling and polarity protection diodes, in surface mount

applications where compact size and weight are critical to the system.

Features

•Small Compact Surface Mountable Package with J−Bend Leads

•Rectangular Package for Automated Handling

•Highly Stable Oxide Passivated Junction

•Excellent Ability to Withstand Reverse Avalanche Energy Transients

•Guard−Ring for Stress Protection

•NRVBS Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements; AEC−Q101

Qualified and PPAP Capable

•These are Pb−Free Devices

Mechanical Characteristics

•Case: Epoxy, Molded, Epoxy Meets UL 94 V−0

•Weight: 217 mg (Approximately), SMC

95 mg (Approximately), SMB

•Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

•Lead and Mounting Surface Temperature for Soldering Purposes:

260°C Max. for 10 Seconds

•Polarity: Notch in Plastic Body Indicates Cathode Lead

•Device Meets MSL 1 Requirements

•ESD Ratings:

♦Machine Model, C

♦Human Body Model, 3B

Device Package Shipping†

ORDERING INFORMATION

SMC

CASE 403

SCHOTTKY BARRIER

RECTIFIERS

3.0 AMPERES, 60 VOLTS

http://onsemi.com

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

MBRS360T3G SMC

(Pb−Free)

2,500 /

Tape & Reel

B36 = Specific Device Code

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

(Note: Microdot may be in either location)

MARKING DIAGRAMS

AYWW

B36G

SMB

CASE 403A

AYWW

B36G

MBRS360BT3G SMB

(Pb−Free)

2,500 /

Tape & Reel

NRVBS360T3G SMC

(Pb−Free)

2,500 /

Tape & Reel

2,500 /

Tape & Reel

NRVBS360BT3G SMB

(Pb−Free)

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

60 V

Average Rectified Forward Current IF(AV) 3.0 @ TL = 137°C

4.0 @ TL = 127°C

Nonrepetitive Peak Surge Current

(Surge applied at rated load conditions halfwave, single phase, 60 Hz)

IFSM 125

Storage Temperature Range Tstg −65 to +175 °C

Operating Junction Temperature (Note 1) TJ−65 to +175 °C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. The heat generated must be less than the thermal conductivity from Junction−to−Ambient: dPD/dTJ < 1/RqJA.

THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance, Junction−to−Lead (Note 2)

SMC Package

SMB Package

RqJL 11

°C/W

Thermal Resistance, Junction−to−Ambient (Note 2)

SMC Package

SMB Package

RqJA 136

145

°C/W

Thermal Resistance, Junction−to−Ambient (Note 3)

SMC Package

SMB Package (Note 4)

RqJA 71

°C/W

ELECTRICAL CHARACTERISTICS

Maximum Instantaneous Forward Voltage (Note 5)

(iF = 3.0 A, TJ = 25°C)

VF0.740

Maximum Instantaneous Reverse Current (Note 5)

(Rated dc Voltage, TJ = 25°C)

(Rated dc Voltage, TJ = 100°C)

iR0.15

2. Mounted with minimum recommended pad size, PC Board FR4.

3. 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.

4. Typical Value; 1 inch square pad size (1 x 0.5 inch for each lead) on FR4 board.

5. Pulse Test: Pulse Width = 300 ms, Duty Cycle ≤2.0%.

, INSTANTANEOUS FORWARD VOLTAGE (V)

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

, INSTANTANEOUS FORWARD

CURRENT (A)

TJ = 25°C

TJ = 150°C

TJ = 100°C

TJ = −40°C

, INSTANTANEOUS FORWARD VOLTAGE (V)

TJ = 25°C

TJ = 150°C

TJ = 100°C

TJ = −40°C

0.01

0.1

0.0 0.2 0.4 0.6 0.8

TJ = 175°C

0.01

0.1

0.0 0.2 0.4 0.6 0.8

, INSTANTANEOUS FORWARD

CURRENT (A)

TJ = 175°C

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

Figure 3. Typical Reverse Current

Figure 4. Maximum Reverse Current

IR, INSTANTANEOUS REVERSE

CURRENT (A)

TJ = 25°C

TJ = 150°C

TJ = 100°C

VR, INSTANTANEOUS REVERSE VOLTAGE (V)

IR, INSTANTANEOUS REVERSE

CURRENT (A)

TJ = 25°C

TJ = 150°C

TJ = 100°C

1.0E−07

1.0E−06

1.0E−05

1.0E−04

1.0E−03

1.0E−02

1.0E−01

1.0E+00

0 102030405060

TJ = 175°C

1.0E−06

1.0E−05

1.0E−04

1.0E−03

1.0E−02

1.0E−01

1.0E+00

0 102030405060

TJ = 175°C

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

TL, LEAD TEMPERATURE (°C)

Figure 5. Current Derating Figure 6. Forward Power Dissipation

IF(AV), AVERAGE FORWARD CURRENT (A)

40123

IO, AVERAGE FORWARD CURRENT (A)

2.5

4.5 5

PFO, AVERAGE POWER DISSIPATION (W)

SQUARE WAVE

0.5

1.5

RqJL = 15°C/W

3.52.51.50.5

SQUARE

WAVE

Figure 7. Typical Capacitance

1000

600102030

VR, REVERSE VOLTAGE (V)

100

40 50 70

C, CAPACITANCE (pF)

TJ = 25°C

3.5

TJ = 175°C

0 20 40 60 80 100 120 140 160 180

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

Test Type > min pad 1 oz

RqJC = min pad 1 oz C/W

P(pk)

DUTY CYCLE, D = t1/t2

t, TIME (s)

Figure 8. Thermal Response, Junction−to−Ambient, SMC Package

(

)

, TRAN

IENT THERMAL RE

100

0.1

0.2

D = 0.5

0.05

SINGLE PULSE

0.1

0.00001 0.0001 0.001 0.01 1 100 1000

0.01

0.1 10

Test Type > min pad 1 oz

RqJC = min pad 1 oz C/W

P(pk)

DUTY CYCLE, D = t1/t2

Figure 9. Typical Thermal Response, Junction−to−Ambient, SMB Package

PULSE TIME (s)

0.000001 0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000

0.01

0.1

100

R(t) (°C/W)

Single Pulse

50% Duty Cycle

20%

10%

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

PACKAGE DIMENSIONS

SMC

PLASTIC PACKAGE

CASE 403−03

ISSUE E

DIM

MIN NOM MAX MIN

MILLIMETERS

1.90 2.13 2.41 0.075

INCHES

A1 0.05 0.10 0.15 0.002

b2.92 3.00 3.07 0.115

c0.15 0.23 0.30 0.006

D5.59 5.84 6.10 0.220

E6.60 6.86 7.11 0.260

L0.76 1.02 1.27 0.030

0.084 0.095

0.004 0.006

0.118 0.121

0.009 0.012

0.230 0.240

0.270 0.280

0.040 0.050

NOM MAX

7.75 7.94 8.13 0.305 0.313 0.320

4.343

0.171

3.810

0.150

2.794

0.110 ǒmm

inchesǓ

SCALE 4:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

L1L A1

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

4. 403-01 THRU -02 OBSOLETE, NEW STANDARD 403-03.

0.020 REF

0.51 REF

MBRS360T3G, MBRS360BT3G, NRVBS360T3G, NRVBS360BT3G

http://onsemi.com

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

2.261

0.089

2.743

0.108

2.159

0.085 ǒmm

inchesǓ

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

1.90 2.20 2.28 0.075

INCHES

A1 0.05 0.10 0.19 0.002

b1.96 2.03 2.20 0.077

c0.15 0.23 0.31 0.006

D3.30 3.56 3.95 0.130

E4.06 4.32 4.60 0.160

L0.76 1.02 1.60 0.030

0.087 0.090

0.004 0.007

0.080 0.087

0.009 0.012

0.140 0.156

0.170 0.181

0.040 0.063

NOM MAX

5.21 5.44 5.60 0.205 0.214 0.220

0.51 REF 0.020 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent

rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur.

Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries,

affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury

or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an

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PUBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBRS360T3/D

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