CD54/74AC257, CD54/74ACT257, CD74ACT258 Data sheet acquired from Harris Semiconductor SCHS248A Quad 2-Input Multiplexer with Three-State Outputs August 1998 - Revised May 2000 Features Description * 'AC257, 'ACT257. . . . . . . . . . . . . Non-Inverting Outputs The 'AC257, 'ACT257 and CD74ACT258 are quad 2-input multiplexers with three-state outputs that utilize Advanced CMOS Logic technology. Each of these devices selects four bits of data from two sources under the control of a common Select input (S). The Output Enable (OE) is active LOW. When OE is HIGH, all of the outputs (Y or Y) are in the highimpedance state regardless of all other input conditions. * CD74ACT258 . . . . . . . . . . . . . . . . . . . Inverting Outputs * Buffered Inputs * Typical Propagation Delay - 4.4ns at VCC = 5V, TA = 25oC, CL = 50pF * Exceeds 2kV ESD Protection MIL-STD-883, Method 3015 Moving data from two groups of registers to four common output buses is a common use of the 'AC257, 'ACT257, and CD74ACT258. The state of the Select input determines the particular register from which the data comes. The 'AC257, 'ACT257 and CD74ACT258 can also be used as function generators. * SCR-Latchup-Resistant CMOS Process and Circuit Design * Speed of Bipolar FASTTM/AS/S with Significantly Reduced Power Consumption * Balanced Propagation Delays Ordering Information * AC Types Feature 1.5V to 5.5V Operation and Balanced Noise Immunity at 30% of the Supply PART NUMBER * 24mA Output Drive Current - Fanout to 15 FASTTM ICs TEMP. RANGE (oC) CD54AC257F3A 0 to 70oC, -40 to 85, 16 Ld PDIP -55 to 125 CD74AC257M 0 to 70oC, -40 to 85, 16 Ld SOIC -55 to 125 CD54ACT257F3A CD54AC257, CD54ACT257 (CERDIP) CD74AC257, CD74ACT257, CD74ACT258 (PDIP, SOIC) TOP VIEW ACT258 S AC/ACT257 S 1 1I0 CD74ACT257E -55 to 125 0 to 70oC, -40 to 85, 16 Ld CERDIP 16 Ld PDIP -55 to 125 AC/ACT257 16 VCC ACT258 VCC 1I0 2 15 OE OE 1I1 1I1 3 14 4I0 4I0 1Y 1Y 4 13 4I1 4I1 2I0 2I0 5 12 4Y 4Y 2I1 2I1 6 11 3I0 3I0 2Y 2Y 7 10 3I1 3I1 GND GND 8 9 3Y 3Y CD74ACT257M 0 to 70oC, -40 to 85, 16 Ld SOIC -55 to 125 CD74ACT258E 0 to 70oC, -40 to 85, 16 Ld PDIP -55 to 125 CD74ACT258M 0 to 70oC, -40 to 85, 16 Ld SOIC -55 to 125 NOTES: 1. When ordering, use the entire part number. Add the suffix 96 to obtain the variant in the tape and reel. 2. Wafer and die for this part number is available which meets all electrical specifications. Please contact your local TI sales office or customer service for ordering information. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. FASTTM is a Trademark of Fairchild Semiconductor. Copyright (c) 2000, Texas Instruments Incorporated 16 Ld CERDIP CD74AC257E Drives 50 Transmission Lines Pinout -55 to 125 PACKAGE 1 CD54/74AC257, CD54/74ACT257, CD74ACT258 Functional Diagram AC/ACT AC/ACT 257 258 1I0 2I0 3I0 4I0 1I1 2I1 3I1 4I1 2 4 5 1Y 1Y 2Y 2Y 3Y 3Y 4Y 4Y 11 7 14 3 9 6 10 12 13 1 15 S OE TRUTH TABLE OUTPUT ENABLE SELECT INPUT 257 OUTPUTS 258 OUTPUTS OE S I0 I1 Y Y H X X X Z Z L L L X L H L L H X H L L H X L L H L H X H H L DATA INPUTS H = High level voltage, L = Low level voltage, Z = High impedance (off) state, X = Don't Care 2 CD54/74AC257, CD54/74ACT257, CD74ACT258 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 6V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .50mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .50mA DC VCC or Ground Current, ICC or IGND (Note 3) . . . . . . . . .100mA Thermal Resistance (Typical, Note 5) JA (oC/W) PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ___ Maximum Junction Temperature (Plastic Package) . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC Operating Conditions Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC (Note 4) AC Types. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1.5V to 5.5V ACT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Slew Rate, dt/dv AC Types, 1.5V to 3V . . . . . . . . . . . . . . . . . . . . . . . . . 50ns (Max) AC Types, 3.6V to 5.5V . . . . . . . . . . . . . . . . . . . . . . . . 20ns (Max) ACT Types, 4.5V to 5.5V. . . . . . . . . . . . . . . . . . . . . . . 10ns (Max) CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 3. For up to 4 outputs per device, add 25mA for each additional output. 4. Unless otherwise specified, all voltages are referenced to ground. 5. JA is measured with the component mounted on an evaluation PC board in free air. DC Electrical Specifications TEST CONDITIONS PARAMETER -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VIH - - 1.5 1.2 - 1.2 - 1.2 - V 3 2.1 - 2.1 - 2.1 - V AC TYPES High Level Input Voltage Low Level Input Voltage High Level Output Voltage VIL VOH - VIH or VIL 5.5 3.85 - 3.85 - 3.85 - V 1.5 - 0.3 - 0.3 - 0.3 V 3 - 0.9 - 0.9 - 0.9 V 5.5 - 1.65 - 1.65 - 1.65 V -0.05 1.5 1.4 - 1.4 - 1.4 - V -0.05 3 2.9 - 2.9 - 2.9 - V -0.05 4.5 4.4 - 4.4 - 4.4 - V -4 3 2.58 - 2.48 - 2.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V - 3 CD54/74AC257, CD54/74ACT257, CD74ACT258 DC Electrical Specifications (Continued) TEST CONDITIONS PARAMETER Low Level Output Voltage -40oC TO 85oC 25oC -55oC TO 125oC SYMBOL VI (V) IO (mA) VCC (V) MIN MAX MIN MAX MIN MAX UNITS VOL VIH or VIL 0.05 1.5 - 0.1 - 0.1 - 0.1 V 0.05 3 - 0.1 - 0.1 - 0.1 V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 12 3 - 0.36 - 0.44 - 0.5 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V Input Leakage Current II VCC or GND - 5.5 - 0.1 - 1 - 1 A Three-State Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - 0.5 - 5 - 10 A Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 A High Level Input Voltage VIH - - 4.5 to 5.5 2 - 2 - 2 - V Low Level Input Voltage VIL - - 4.5 to 5.5 - 0.8 - 0.8 - 0.8 V High Level Output Voltage VOH VIH or VIL -0.05 4.5 4.4 - 4.4 - 4.4 - V -24 4.5 3.94 - 3.8 - 3.7 - V -75 (Note 6, 7) 5.5 - - 3.85 - - - V -50 (Note 6, 7) 5.5 - - - - 3.85 - V 0.05 4.5 - 0.1 - 0.1 - 0.1 V 24 4.5 - 0.36 - 0.44 - 0.5 V 75 (Note 6, 7) 5.5 - - - 1.65 - - V 50 (Note 6, 7) 5.5 - - - - - 1.65 V ACT TYPES Low Level Output Voltage VOL VIH or VIL II VCC or GND - 5.5 - 0.1 - 1 - 1 A Three-State or Leakage Current IOZ VIH or VIL VO = VCC or GND - 5.5 - 0.5 - 5 - 10 A Quiescent Supply Current MSI ICC VCC or GND 0 5.5 - 8 - 80 - 160 A ICC VCC -2.1 - 4.5 to 5.5 - 2.4 - 2.8 - 3 mA Input Leakage Current Additional Supply Current per Input Pin TTL Inputs High 1 Unit Load NOTES: 6. Test one output at a time for a 1-second maximum duration. Measurement is made by forcing current and measuring voltage to minimize power dissipation. 7. Test verifies a minimum 50 transmission-line-drive capability at 85oC, 75 at 125oC. 4 CD54/74AC257, CD54/74ACT257, CD74ACT258 ACT Input Load Table INPUT UNIT LOAD Data 0.83 S 1.27 OE 1.27 NOTE: Unit load is ICC limit specified in DC Electrical Specifications Table, e.g., 2.4mA max at 25oC. Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) -40oC TO 85oC PARAMETER -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS tPLH, tPHL 1.5 - - 106 - - 117 ns 3.3 (Note 9) 3.3 - 11.8 3.3 - 13 ns 5 (Note 10) 2.4 - 8.5 2.3 - 9.3 ns 1.5 - - 153 - - 168 ns 3.3 4.8 - 17.1 4.7 - 18.8 ns 5 3.5 - 12.2 3.4 - 13.4 ns 1.5 - - 167 - - 184 ns 3.3 5.3 - 18.7 5.2 - 20.6 ns 5 3.8 - 13.4 3.7 - 14.7 ns 1.5 - - 91 - - 100 ns 3.3 2.9 - 10.2 2.8 - 11.2 ns 5 2.1 - 7.3 2 - 8 ns 1.5 - - 153 - - 168 ns 3.3 4.8 - 17.1 4.7 - 18.8 ns 5 3.5 - 12.2 3.4 - 13.4 ns 1.5 - - 167 - - 184 ns 3.3 5.3 - 18.7 5.2 - 20.6 ns 5 3.8 - 13.4 3.7 - 14.7 ns AC TYPES Propagation Delay, In to Y AC/ACT257 Propagation Delay, S to Y AC/ACT257 Propagation Delay, OE to Y AC/ACT257 Propagation Delay, In to Y 'AC/CD74ACT258 Propagation Delay, S to Y 'AC/CD74ACT258 Propagation Delay, OE to Y 'AC/CD74ACT258 tPLH, tPHL tPLZ, tPHZ, tPZL, tPZH tPLH, tPHL tPLH, tPHL tPLZ, tPHZ, tPZL, tPZH Three-State Output Capacitance CO - - - 15 - - 15 pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 130 - - 130 - pF Propagation Delay, In to Y AC/ACT257 tPLH, tPHL 5 (Note 10) 2.8 - 9.7 2.7 - 10.7 ns Propagation Delay, S to Y AC/ACT257 tPLH, tPHL 5 4 - 14 3.9 - 15.4 ns Power Dissipation Capacitance ACT TYPES 5 CD54/74AC257, CD54/74ACT257, CD74ACT258 Switching Specifications Input tr, tf = 3ns, CL = 50pF (Worst Case) (Continued) -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN TYP MAX MIN TYP MAX UNITS Propagation Delay, OE to Y AC/ACT257 tPLZ, tPHZ, tPZL, tPZH 5 4.1 - 14.6 4 - 16.1 ns Propagation Delay, In to Y 'AC/CD74ACT258 tPLH, tPHL 5 2.4 - 8.5 2.3 - 9.3 ns Propagation Delay, S to Y 'AC/CD74ACT258 tPLH, tPHL 5 4 - 14 3.9 - 15.4 ns Propagation Delay, OE to Y 'AC/CD74ACT258 tPLZ, tPHZ, tPZL, tPZH 5 4.1 - 14.6 4 - 16.1 ns Three-State Output Capacitance CO - - - 15 - - 15 pF Input Capacitance CI - - - 10 - - 10 pF CPD (Note 11) - - 130 - - 130 - pF PARAMETER Power Dissipation Capacitance NOTES: 8. Limits tested 100%. 9. 3.3V Min is at 3.6V, Max is at 3V. 10. 5V Min is at 5.5V, Max is at 4.5V. 11. CPD is used to determine the dynamic power consumption per multiplexer. AC: PD = CPD VCC2 fi + (CL VCC2 fo) ACT: PD = CPD VCC2 fi + (CL VCC2 fo) + VCC ICC where fi = input frequency, fo = output frequency, CL = output load capacitance, VCC = supply voltage. tr = 3ns tf = 3ns INPUT LEVEL 90% OUTPUT DISABLE VS 10% GND tPZL tPLZ VS 0.2VCC OUTPUT: LOW TO OFF TO LOW tPHZ tPZH 0.8 VCC VS OUTPUT: HIGH TO OFF TO HIGH OUTPUTS ENABLED OTHER INPUTS (TIED HIGH OR LOW) OUTPUT DISABLE OUTPUTS DISABLED 500 RL DUT WITH THREESTATE OUTPUT CL 50pF VOL (GND) VOH (VCC) OUTPUTS ENABLED GND (tPHZ, tPZH) OPEN (tPHL, tPLH) 2 VCC (tPLZ, tPZL) (OPEN DRAIN) OUT 500 RL FOR AC SERIES ONLY: WHEN VCC = 1.5V, RL = 1k FIGURE 1. THREE-STATE PROPAGATION DELAY TIMES AND TEST CIRCUIT 6 CD54/74AC257, CD54/74ACT257, CD74ACT258 tr = 3ns tf = 3ns INPUT LEVEL nI0, nI1, S VS tPLH INPUT LEVEL 90% 10% tPLH tPHL GND Y Y VS S tPHL VS VS FIGURE 2. INPUTS OR SELECT TO OUTPUT PROPAGATION DELAYS (AC/ACT257) FIGURE 3. SELECT TO OUTPUT PROPAGATION DELAYS (CD74ACT258) OUTPUT RL (NOTE) 500 DUT OUTPUT LOAD CL 50pF NOTE: For AC Series Only: When VCC = 1.5V, RL = 1k. AC ACT VCC 3V Input Switching Voltage, VS 0.5 VCC 1.5V Output Switching Voltage, VS 0.5 VCC 0.5 VCC Input Level FIGURE 4. PROPAGATION DELAY TIMES 7 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Amplifiers amplifier.ti.com Audio www.ti.com/audio Data Converters dataconverter.ti.com Automotive www.ti.com/automotive DSP dsp.ti.com Broadband www.ti.com/broadband Interface interface.ti.com Digital Control www.ti.com/digitalcontrol Logic logic.ti.com Military www.ti.com/military Power Mgmt power.ti.com Optical Networking www.ti.com/opticalnetwork Microcontrollers microcontroller.ti.com Security www.ti.com/security Low Power Wireless www.ti.com/lpw Telephony www.ti.com/telephony Video & Imaging www.ti.com/video Wireless www.ti.com/wireless Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2007, Texas Instruments Incorporated PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54AC257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD54ACT257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74AC257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC257EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT257EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT258M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. 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Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT258M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC257M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT257M96 SOIC D 16 2500 346.0 346.0 33.0 CD74ACT257M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT258M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54AC257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD54ACT257F3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type CD74AC257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC257EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74AC257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74AC257MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT257EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74ACT257M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT257MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74ACT258M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR CD74ACT258MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Addendum-Page 1 PACKAGE OPTION ADDENDUM www.ti.com 11-Nov-2009 NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74AC257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT257M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74ACT258M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jul-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74AC257M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT257M96 SOIC D 16 2500 367.0 367.0 38.0 CD74ACT257M96 SOIC D 16 2500 333.2 345.9 28.6 CD74ACT258M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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