CM1204-03CP - ON Semiconductor - Datasheet.Directory

January, 2011 − Rev. 4

1Publication Order Number:

CM1204/D

CM1204

4-Channel ESD Array in CSP

Product Description

The CM1204 is a quad ESD transient voltage suppression diode

array. Each diode provides a very high level of protection for sensitive

electronic components that may be subjected to electrostatic discharge

(ESD). These diodes safely dissipate ESD strikes of ±15 kV,

exceeding the maximum requirement of the IEC 61000-4-2

international standard. Using the MIL-STD-883 (Method 3015)

specification for Human Body Model (HBM) ESD, the device

provides protection for contact discharges to greater than ±30 kV.

The CM1204 is particularly well suited for portable electronics

(e.g., cellular telephones, PDAs, notebook computers) because of its

small package format and low weight.

The CM1204 features Optiguardt coating which results in

improved reliability at assembly. It is available in a space-saving,

low-profile chip scale package with RoHS-compliant lead-free

finishing.

Features

•Functionally and Pin Compatible with ON Semiconductor’s

CSPESD304

•Optiguardt Coated for Improved Reliability

•Four Channels of ESD Protection

•±15 kV ESD Protection on Each Channel

(IEC 61000-4-2 Level 4, Contact Discharge)

•±30 kV ESD Protection on Each Channel (HBM)

•Chip Scale Package Features Extremely Low

Lead Inductance for Optimum ESD Protection

•5-bump, 0.960 mm X 1.330 mm Footprint

Chip Scale Package (CSP)

•These Devices are Pb−Free and are RoHS Compliant

Applications

•ESD Protection for Sensitive Electronic Equipment

•I/O Port and Keypad and Button Circuitry

Protection for Portable Devices

•Wireless Handsets

•Handheld PCs / PDAs

•MP3 Players

•Digital Camcorders

•Notebooks

•Desktop PCs

MARKING DIAGRAM

Device Package Shipping†

ORDERING INFORMATION

CSP−5

CP SUFFIX

CASE 567AY

BLOCK DIAGRAM

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CM1204−03CP CSP

(Pb−Free)

3500/Tape & Reel

S = Specific Device Code

ESD_1 ESD_2 ESD_3 ESD_4

GND B2

A1 C1A3 C3

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specification

Brochure, BRD8011/D.

CM1204

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Table 1. PIN DESCRIPTIONS

Pin Name Description

A1 ESD_1 ESD Channel 1

A3 ESD_2 ESD Channel 2

B2 GND Device Ground

C1 ESD_3 ESD Channel 3

C3 ESD_4 ESD Channel 4

PACKAGE / PINOUT DIAGRAMS

Bottom View

(Bumps Up View)

ESD_4ESD_3

ESD_2ESD_1

GND

Top View

(Bumps Down View)

CM1204

CSP Package with OptiGuardt

Orientation

Marking

Orientation

Marking

SPECIFICATIONS

Table 2. ABSOLUTE MAXIMUM RATINGS

Parameter Rating Units

Storage Temperature Range −65 to +150 °C

DC Package Power Rating 200 mW

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

Table 3. STANDARD OPERATING CONDITIONS

Parameter Rating Units

Operating Temperature Range −40 to +85 °C

Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)

Symbol Parameter Conditions Min Typ Max Units

VDIODE Diode Reverse Breakdown Voltage IDIODE = 10 μA 6.0 V

ILEAK Diode Leakage Current VIN = 3.3 V, TA = 25°C 100 nA

VSIG Signal Voltage

Positive Clamp

Negative Clamp

IDIODE = 10 mA

5.6

−1.5

6.8

−0.8

9.0

−0.4

VESD In-system ESD Withstand Voltage

a) Human Body Model, MIL-STD-883, Method 3015

b) Contact Discharge per IEC 61000-4-2

(Note 2)

±30

±15

VCL Clamping Voltage during ESD Discharge

MIL-STD-883 (Method 3015), 8 kV

Positive Transients

Negative Transients

(Note 2)

+15

−8

CDIODE Diode Capacitance At 2.5 VDC Reverse Bias,

1 MHz, 30 mVAC

22 27 32 pF

1. TA = −40 to +85°C unless otherwise specified.

2. ESD applied to input and output pins with respect to GND, one at a time.

CM1204

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PERFORMANCE INFORMATION

Diode Characteristics (nominal conditions unless specified otherwise)

Figure 1. Typical Diode Capacitance vs. Input Voltage (Normalized to 2.5 VDC)

Figure 2. Frequency Response (Single Channel vs. GND, in 50 W System)

CM1204

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APPLICATION INFORMATION

Refer to Application Note “The Chip Scale Package”, for a detailed description of Chip Scale Packages offered by

ON Semiconductor.

Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS

Parameter Value

Pad Size on PCB 0.275 mm

Pad Shape Round

Pad Definition Non−Solder Mask defined pads

Solder Mask Opening 0.325 mm Round

Solder Stencil Thickness 0.125 mm − 0.150 mm

Solder Stencil Aperture Opening (laser cut, 5% tapered walls) 0.330 mm Round

Solder Flux Ratio 50/50 by volume

Solder Paste Type No Clean

Pad Protective Finish OSP (Entek Cu Plus 106 A)

Tolerance — Edge To Corner Ball ±50 mm

Solder Ball Side Coplanarity ±20 mm

Maximum Dwell Time Above Liquidous 60 seconds

Maximum Soldering Temperature 260°C

Figure 3. Recommended Non−Solder Mask Defined Pad Illustration

Figure 4. Lead−free (SnAgCu) Solder Ball Reflow Profile

CM1204

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PACKAGE DIMENSIONS

WLCSP5, 0.96x1.33

CASE 567AY−01

ISSUE O

SEATING

PLANE

0.05 C

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO SPHERICAL

CROWNS OF SOLDER BALLS.

DIM

MIN MAX

0.56

MILLIMETERS

D0.96 BSC

b0.29 0.35

eD 0.50 BSC

0.72

ÈÈ

PIN A1

REFERENCE

A0.05 BC

0.03 C

0.05 C

5X b

123

0.05 C

0.21 0.27

1.33 BSC

eE 0.435 BSC

0.50

0.25

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

0.25

0.87

0.44

0.05 C

2X TOP VIEW

SIDE VIEW

BOTTOM VIEW

NOTE 3

A2 0.40 REF

RECOMMENDED

PACKAGE

OUTLINE

eD/2

ÉÉÉ

OptiGuard Option

Optiguard is a trademark of Semiconductor Components Industries, LLC (SCILLC).

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,

and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.

PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5773−3850

CM1204/D

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