2018 Microchip Technology Inc. DS20006079A-page 1
MIC2871
Features
• Up to 1.2A Flash LED Driving Current
• Highly Efficient, Synchronous Boost Driver
(up to 94%)
• ±5% LED Current Accuracy
• Control through Single-Wire Serial Interface or
External Control Pins
• Input Voltage Range: 2.7V to 5.5V
• True Load Disconnect
• Configurable Safety Time-Out Protection
• Output Overvoltage Protection (OVP)
• LED Short Detection and Protection
• 1 µA Shutdown Current
• Available in 14-Pin 3 mm x 2 mm LDFN Package
Applications
• Camera Phones/Mobile Handsets
• Cell Phones/Smartphones
• LED Light for Image Capture/Auto-Focus/
White Balance
• Handset Video Light (Torch Light)
• Digital Cameras
• Portable Applications
General Description
The MIC2871 is a high-current, high-efficiency flash LED
driver. The LED driver current is generated by an inte-
grated inductive boost converter with a 2 MHz switching
frequency, which allows the use of a very small inductor
and output capacitor. These features make the MIC2871
an ideal solution for high-resolution camera phone LED
flashlight driver applications.
The MIC2871 operates in either Flash or Torch modes
that can be controlled through the single-wire serial inter-
face and/or external control pins. Default flash and torch
brightness can be adjusted via an external resistor. A
robust single-wire serial interface allows simple control
by the host processor to support typical camera
functions. such as auto-focus, white balance, and image
capture (Flash mode).
The MIC2871 is available in a 14-pin 3 mm x 2 mm LDFN
package with a junction temperature range of –40°C to
+125°C.
1.2A High-Brightness Flash LED Driver with
Single-Wire Serial Interface
MIC2871
DS20006079A-page 2 2018 Microchip Technology Inc.
Package Type
Typical Application Schematic
MIC2871
14-Pin 3 mm x 2 mm LDFN (MK)
(Top View)
1
2
3
4
5
6
78
9
10
11
12
13
14
AGND1
DC
LED
FEN1
AGND2
V
IN
PGND1
FRSET
PGND2
NC
FEN2
SW
NC
OUT
ePAD
(EP)
SINGLE-WIRE SERIAL I/F
FLASH ENABLE #1
FLASH ENABLE #2
L1 1 μH
VBAT C1
2.2 μF/10V C4
4.7 μF
R4
20.5 k
AGND2
FEN2
VIN
AGND2
EPAD
AGND1
DC
FEN1
SW OUT
LED
PGND1
PGND2
FRSET
FLASH
WHITE
LED
LED1
GND
U1
MIC2871YMK
2018 Microchip Technology Inc. DS20006079A-page 3
MIC2871
Functional Block Diagram
SW
SYSTEM
CONTROL
LOGIC +
ANTI-CROSS
CONDUCTION
DC
FEN1
FEN2
FRSET
VIN
AGND2
LED
OUT
PGND2
OVP
PGND1
AGND1
SINGLE-
WIRE
SERIAL
INTERFACE
SAFETY
TIMER
LED SCP
UVLO
BODY
SWITCH
OTP
155°C/
140°C
LBVD
SAFETY
TIMER
SAFETY TIMER
DIE TEMP
2.75V/
2.30V
OUT
LED 1.7V
VIN
OUT
5.37V/5.31V
AGND
PGND
ZZ
2MHz
OSCILLATOR
V/I
MIC2871
DS20006079A-page 4 2018 Microchip Technology Inc.
1.0 ELECTRICAL CHARACTERISTICS
Absolute Maximum Ratings†
Input Voltage (VIN)...................................................................................................................................... -0.3V to +6.0V
General I/O Voltage (VFEN1, VFEN2)............................................................................................................... -0.3V to VIN
VOUT and VLED Voltage..............................................................................................................................-0.3V to +6.0V
Single-Wire I/O Voltage (VDC) ........................................................................................................................ -0.3V to VIN
VFRSET Voltage .............................................................................................................................................. -0.3V to VIN
VSW Voltage ...............................................................................................................................................-0.3V to +6.0V
ESD Rating(1)........................................................................................................................... 2 kV, HBM and 200V, MM
Note 1: Devices are ESD-sensitive. Handling precautions are recommended. Human body model, 1.5 k in series
with 100 pF.
Operating Ratings(1)
Input Voltage (VIN)..................................................................................................................................... +2.7V to +5.5V
Enable Input Voltage (VFEN1, VFEN2) ................................................................................................................. 0V to VIN
Single-Wire I/O Voltage (VDC) ............................................................................................................................ 0V to VIN
Power Dissipation (PD)....................................................................................................................... Internally Limited(2)
Note 1: The device is not ensured to function outside the operating range.
2: The maximum allowable power dissipation at any TA (ambient temperature) is PD(max) = (TJ(max) – TA)/JA.
†Notice: Stresses above those listed under “Maximum Ratings” may cause permanent damage to the device. This
is a stress rating only and functional operation of the device at those or any other conditions above those indi-
cated in the operational sections of this specification is not intended. Exposure to maximum rating conditions for
extended periods may affect device reliability.
TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1)
Electrical Specifications:
unless otherwise specified, V
IN
= 3.6V; L = 1 µH; C
OUT
= 4.7 µF; R
FRSET
= 20.5 k
;
I
OUT
=100 mA;
TA = +25°C. Boldface values indicate -40°C TJ+125°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions
Power Supply
Supply Voltage Range VIN 2.7 —5.5 V—
Start-up Voltage VSTART —2.652.95 V—
UVLO Threshold (falling) VUVLO_F —2.302.5 V—
Standby Current ISTB —230—µA
VDC = HIGH, boost regula-
tor and LED current driver
are both off
Shutdown Current ISD —1 2µAV
DC = 0V
Overvoltage Protection (OVP)
Threshold VOVP 5.2 5.37 5.55 V—
OVP Hysteresis VOVPHYS —60—mV—
OVP Blanking Time tBLANK_OVP —23—µs—
Maximum Duty Cycle DMAX 82 86 90 % —
Switch Current Limit ISW 3.5 4.5 5.5 AV
IN = VOUT = 2.7V
Minimum Duty Cycle DMIN 46.4 9 % —
Switch-On Resistance RDS(ON)_P —100—mISW = 100 mA
RDS(ON)_N ISW = 100 mA
Note 1: Specification for packaged product only.
2018 Microchip Technology Inc. DS20006079A-page 5
MIC2871
Switch Leakage Current ISW —0.01 1 µAV
DC = 0V, VSW = 5.5V
Oscillator Frequency FSW —2—MHz—
Oscillator Frequency Variation — -10 — 10 % —
Overtemperature Shutdown
Threshold TSD —155—°C—
Overtemperature Shutdown
Hysteresis TSDHYS —15—°C—
Safety Time-out Shutdown TTO — 1.25 — µs Default timer setting
Safety Timer Current
Threshold ITO —250—mA
Default current threshold
setting
Safety Timer Current
Resolution ——50—mA—
Safety Timer Current
Threshold Accuracy ——25—mA—
Low-Battery Voltage Detection
Threshold VLBVD —3.6—V
Default LBVD threshold set-
ting
Low-Battery Voltage Detection
Threshold Accuracy ——50—mV—
LED Short-Circuit Detection
Voltage Threshold VSHORT —1.7—VV
OUT – VLED
LED Short-Circuit Detection
Tes t C u rr e nt ITEST 123mA—
Current Sink Channels
Channel Current Accuracy — -5 — 5 % 3.5V < VIN < 4.2V, ILED = 1A
Current Sink Voltage Dropout VLED — 160 — mV Boost regulator on, ILED = 1A
TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED)
Electrical Specifications:
unless otherwise specified, V
IN
= 3.6V; L = 1 µH; C
OUT
= 4.7 µF; R
FRSET
= 20.5 k
;
I
OUT
=100 mA;
TA = +25°C. Boldface values indicate -40°C TJ+125°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions
Note 1: Specification for packaged product only.
MIC2871
DS20006079A-page 6 2018 Microchip Technology Inc.
FEN1, FEN2 Control Pins
FEN1/FEN2 High-Level
Voltage VFEN_H 1.5 ——
V
Flash on
FEN1/FEN2 Low-Level
Voltage VFEN_L ——0.4 Flash off
FEN1/FEN2 Pull-Down
Current IFEN_PD —1 5µA VFEN1 = VFEN2 = 5.5V
TABLE 1-1: ELECTRICAL CHARACTERISTICS(Note 1) (CONTINUED)
Electrical Specifications:
unless otherwise specified, V
IN
= 3.6V; L = 1 µH; C
OUT
= 4.7 µF; R
FRSET
= 20.5 k
;
I
OUT
=100 mA;
TA = +25°C. Boldface values indicate -40°C TJ+125°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions
Note 1: Specification for packaged product only.
TABLE 1-2: ELECTRICAL CHARACTERISTICS – SINGLE-WIRE INTERFACE(1)
Electrical Specifications:
unless otherwise specified, V
IN
= 3.6V; L = 1 µH; C
OUT
= 4.7 µF; I
OUT
=100 mA;
TA = 25°C.
Boldface values indicate -40°C TJ+125°C.
Parameter Symbol Min. Typ. Max. Units Test Conditions
Low-Level Input Voltage VL——0.4 V—
High-Level Input Voltage VH1.5 ——V—
DC Pull-Down Current IDC_PD —2.5 5µAV
DC = 5.5V
On Time TON 0.1 —72 µs —
Off Time TOFF 0.1 —72 µs —
Latch Time TLAT 97 —324 µs —
End Time TEND 405 ——µs—
Note 1: Design guidance only.
2018 Microchip Technology Inc. DS20006079A-page 7
MIC2871
TEMPEARTURE SPECIFICATIONS (Note 1)
Parameters Symbol Min. Typ. Max. Units Conditions
Temperature Ranges
Maximum Junction Temperature Range TJ–40 — 150 °C —
Operating Junction Temperature
Range TJ–40 — 125 °C —
Storage Temperature TS–40 — 150 °C —
Lead Temperature — — — 260 °C Soldering, 10s
Package Thermal Resistance
Thermal Resistance 3x2 LDFN-14LD JA — 65.83 — °C/W —
θJC —38.9— —
Note 1: The maximum allowable power dissipation is a function of ambient temperature, the maximum allowable
junction temperature and the thermal resistance from junction to air (i.e., TA, TJ, JA). Exceeding the
maximum allowable power dissipation will cause the device operating junction temperature to exceed the
maximum +150°C rating. Sustained junction temperatures above +150°C can impact the device reliability.
MIC2871
DS20006079A-page 8 2018 Microchip Technology Inc.
2.0 TYPICAL PERFORMANCE CURVES
FIGURE 2-1: Shutdown Current vs.
Temperature.
FIGURE 2-2: Standby Current vs.
Temperature.
FIGURE 2-3: Boost Switching Frequency
vs. Input Voltage.
FIGURE 2-4: WLED Power Efficiency vs.
Input Voltage.
FIGURE 2-5: Torch Mode LED Current vs.
Temperature.
FIGURE 2-6: Flash Mode LED Current vs.
Temperature.
Note: The graphs and tables provided following this note are a statistical summary based on a limited number of
samples and are provided for informational purposes only. The performance characteristics listed herein
are not tested or guaranteed. In some graphs or tables, the data presented may be outside the specified
operating range (e.g., outside specified power supply range) and therefore outside the warranted range.
50
60
70
80
90
100
2.6 3.0 3.4 3.8 4.2 4.6 5.0
INPUT VOLTAGE (V)
L = 1µH
COUT = 4.7µF
ILED = 100mA
ILED = 250mA
ILED = 400mA
ILED = 640mA
ILED = 1.2A
ILED = 1.0A
EFFICIENCY (%)
230
235
240
245
250
255
260
265
270
-40-20 0 20406080100120
TEMPERATURE (°C)
L = 1µH
COUT = 4.7µF
ILED = 250mA
RFRSET = 20kO
TORCH MODE LED CURRENT (mA)
RFRSET = 20k
2018 Microchip Technology Inc. DS20006079A-page 9
MIC2871
FIGURE 2-7: Flash Mode ILED(MAX) vs.
FRSET Resistor.
FIGURE 2-8: Torch Mode ILED(MAX) vs.
FRSET Resistor.
FIGURE 2-9: Flash Mode ILED(MAX)
Accuracy vs. Input Voltage.
FIGURE 2-10: Torch Mode ILED(MAX)
Accuracy vs. Input Voltage.
FIGURE 2-11: Flash Mode Turn-On
Sequence (Boost Mode).
FIGURE 2-12: Flash Mode Turn-On
Sequence (Linear Mode).
0
200
400
600
800
1000
1200
0 102030405060
FRSET RESISTOR (k? )
L = 1 µH
COUT = 4.7µF
FLASH MODE ILED(MAX) (mA)
FRSET RESISTOR (k)
0
50
100
150
200
250
300
0 102030405060
FRSET RESISTOR (k? )
L = 1 µH
COUT = 4.7µF
TORCH MODE ILED(MAX) (mA)
FRSET RESISTOR (k)
-1.5
-1.0
-0.5
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
3.5 3.7 3.9 4.1 4.3
INPUT VOLTAGE (V)
RFRSET=17kO
RFRSET=20kO
RFRSET=30kO
RFRSET=39kO
RFRSET=62kO
RFRSET=51kO
FLASH MODE ILED(MAX) ACCURACY (%)
RFRSET = 17k
RFRSET = 20k
RFRSET = 30k
RFRSET = 39k
RFRSET = 51k
RFRSET = 62k
-1.4
-1.2
-1.0
-0.8
-0.6
-0.4
-0.2
0.0
0.2
0.4
3.5 3.7 3.9 4.1 4.3
Input Voltage (V)
RFRSET=51kO
RFRSET=62kO
RFRSET=39kO
RFRSET=30kO
RFRSET=20kO
RFRSET=17kO
TORCH MODE ILED(MAX) ACCURACY (%)
RFRSET = 17k
RFRSET = 20k
RFRSET = 30k
RFRSET = 39k
RFRSET = 62k
RFRSET = 51k
VFEN1/VFEN2
(5V/div)
VOUT
(2V/div)
VLED
(1V/div)
ILED
(1A/div)
ILED = 1.0A
VIN = 3.0V
L = 1 µH
Time (100 µs/div)
VFEN1/VFEN2
(5V/div)
VOUT
(2V/div)
VLED
(1V/div)
ILED
(1A/div)
Time (100 µs/div)
ILED = 1.0A
VIN = 4.2V
L = 1 µH
MIC2871
DS20006079A-page 10 2018 Microchip Technology Inc.
FIGURE 2-13: Flash Safety Timer at
1250 ms.
FIGURE 2-14: Flash Safety Timer at
156 ms.
FIGURE 2-15: LED Short-Circuit
Protection.
VFEN1/VFEN2
(5V/div)
VOUT
(2V/div)
VLED
(1V/div)
ILED
(1A/div)
Time (200 ms/div)
ILED = 1.0A
VIN = 3.6V
L = 1 µH
VFEN1/VFEN2
(5V/div)
VFEN1/VFEN2
(5V/div)
VOUT
(2V/div)
VLED
(1V/div)
IL
(100 mA/div)
VOUT – VLED
(2V/div)
Time (40 µs/div)
VIN = 3.6V
L = 1 µH
LED IS SHORTED BY 620
2018 Microchip Technology Inc. DS20006079A-page 11
MIC2871
3.0 PIN DESCRIPTIONS
The descriptions of the pins are listed in Table 3-1.
TABLE 3-1: PIN FUNCTION TABLE
MIC2871
Pin Number Pin Name Pin Function
1 AGND1 Analog Ground: LED current return path.
2 DC Single-wire serial interface control input.
3 LED LED Current Sink Pin: Connect the LED anode to OUT and cathode to this pin.
4 FEN1 Flash Mode Enable Pin: Toggling FEN1 from LOW to HIGH enables MIC2871 into the
Flash mode. FEN1 is logic-OR with FEN2. If this pin is left floating, it is pulled down
internally by a built-in 1 µA current source when the device is enabled.
5 AGND2 Analog Ground: Reference ground of the FRSET pin.
6V
IN Supply Input Pin: Connect a low-ESR ceramic capacitor of at least 2.2 µF to AGND2.
7 PGND1 Power Ground: Inductor current return path.
8 OUT Boost Converter Output Pin: This is connected to the anode of the LED. Connect a
low-ESR ceramic capacitor of at least 4.7 µF to PGND1.
9, 12 NC No Connect: Connect this pin to AGND or leave it floating.
10 SW Inductor Connection Pin: It is connected to the internal power MOSFETs.
11 FEN2 Additional Flash Mode Enable Pin: FEN2 is logic-OR with FEN1. If this pin is left floating,
it is pulled down internally by a built-in 1 µA current source when the device is enabled.
13 PGND2 Power Ground.
14 FRSET Flash Mode Current-Level Programming Pin: Connect a resistor from this pin to AGND2
to set the maximum current in the Flash mode. This pin may be grounded if the default
Flash mode current (1A) is desired. This pin cannot be left floating and the
recommended resistance range is from 17 k to 60 k.
EP ePAD Exposed Heat Sink Pad: Connect to ground for best thermal performance.
MIC2871
DS20006079A-page 12 2018 Microchip Technology Inc.
4.0 FUNCTIONAL DESCRIPTION
4.1 VIN
The input supply provides power to the internal
MOSFETs’ gate drive and controls circuitry for the switch
mode regulator. The operating input voltage range is
from 2.7V to 5.5V. A 2.2 µF low-ESR ceramic input
capacitor should be connected from VIN to AGND2 as
close to the MIC2871 as possible to ensure a clean sup-
ply voltage for the device. The minimum voltage rating of
10V is recommended for the input capacitor.
4.2 SW
The MIC2871 has internal low-side and synchronous
MOSFET switches. The switch node (SW) between the
internal MOSFET switches connects directly to one
end of the inductor and provides the current paths
during switching cycles.
The other end of the inductor is connected to the input
supply voltage. Due to the high-speed switching on this
pin, the switch node should be routed away from
sensitive nodes wherever possible.
4.3 AGND1
This is the ground path of the LED current sink. It should
be connected to the AGND2, but not via an exposed pad
on the PCB. The current loop of the Analog Ground
should be separated from that of the Power Ground
(PGND1 and PGND2). AGND1 and AGND2 should be
connected to PGND1 and PGND2 at a single point.
4.4 AGND2
This is the ground path for the internal biasing and con-
trol circuitry. AGND2 should be connected to the PCB
pad for the package exposed pad. AGND2 should be
connected to the AGND1 directly without going through
the exposed pad. The current loop of the analog ground
should be separated from that of the Power Ground
(PGND1 and PGND2). The AGND2 and AGND1 should
be connected to PGND1 and PGND2 at a single point.
4.5 PGND1 and PGND2
The Power Ground pins are the ground path for the
high current in the boost switch and they are internally
connected together. The current loop for the Power
Ground should be as small as possible and separate
from the Analog Ground (AGND) loop as applicable.
4.6 OUT
This is the boost converter output pin which is con-
nected to the anode of the LED. A low-ESR ceramic
capacitor of 4.7 µF or larger should be connected from
OUT to PGND1, as close as possible to the MIC2871.
The minimum voltage rating of 10V is recommended
for the output capacitor.
4.7 LED
This is the current sink pin for the LED. The LED anode
is connected to the OUT pin and the LED cathode is
connected to this pin.
4.8 DC
The DC is a single multiplexed device enable, and
serial data control pin used for functional control and
communication in GPIO limited applications. When the
DC pin is used as a hardware device enable pin, a logic
high signal on the DC pin enables the device, and a
logic low signal on the DC pin disables the device.
When the DC pin is used as the single-wire serial inter-
face digital control pin, a combination of bit edges and
the period between edges is used to communicate a
variable length data word across the single wire. Each
word is transmitted as a series of pulses, each pulse
incrementing an internal data counter. A stop sequence
consisting of an inactive period is used to latch the data
word internally. The data word received is then used to
set the value of the corresponding register for
controlling the specific function. The MIC2871 supports
five writable registers for controlling Flash mode, Torch
mode, safety timer duration, safety timer threshold
current and low-battery threshold.
An address/data frame is used to improve protection
against erroneous writes where communications are in
error. When the DC is in a low state and no data is
detected for an extended period of time, the MIC2871
will automatically go into a low-power Shutdown state,
simultaneously resetting all internal registers to their
default states.
4.9 FEN1 and FEN2
FEN1 and FEN2 are hardware enable pins for Flash
mode. FEN1 is logic-OR with FEN2. A logic low-to-high
transition on either the FEN1 pin or FEN2 pin can
initiate the MIC2871 in Flash mode. If FEN1 or FEN2 is
left floating, it is pulled down internally by a built-in 1 µA
current source when the device is enabled. Flash mode
is terminated when both FEN1 and FEN2 are pulled
low or left floating, and the Flash register is cleared.
4.10 FRSET
The Flash mode maximum LED current level is
programmed through the FRSET pin. A resistor
connected from the FRSET pin to AGND2 sets the
maximum current in the Flash mode. This pin can be
grounded if the default Flash mode current of 1A is
desired. For the best current accuracy, a 0.1% or smaller
tolerance resistor for setting the maximum Flash mode
LED current is recommended. This pin cannot be left
floating and the minimum resistance is limited to 17 k.
The maximum Flash mode current to maximum Torch
mode current ratio is internally fixed as 4 to1.
2018 Microchip Technology Inc. DS20006079A-page 13
MIC2871
5.0 APPLICATION INFORMATION
The MIC2871 can drive a high-current Flash WLED in
either Flash mode or Torch mode.
5.1 Boost Converter
The internal boost converter is turned on/off automati-
cally when the LED driver is activated/deactivated
without any exception.
The boost converter is an internally compensated
Current mode PWM boost converter running at 2 MHz.
It is for stepping up the supply voltage to a high enough
value at the OUT pin to drive the LED current. If the
supply voltage is high enough, the synchronous switch
of the converter is then fully turned on. In this case, all
the excessive voltage is dropped over the linear LED
driver.
5.2 Flash Mode
The maximum current level in the Flash mode is 1.2A.
This current level can be adjusted through an external
resistor connected to the FRSET pin according to
Equation 5-1:
EQUATION 5-1: CURRENT LEVEL
ADJUSTMENT
Alternatively, the default value of 1A is used when the
FRSET pin is grounded.
The Flash mode current can be initiated at this preset
FRSET brightness level by asserting the FEN1 or
FEN2 pin high, or by setting the Flash Control register
(Address 1) for the desired Flash duration, subjected to
the safety time-out setting. The Flash mode current is
terminated when the FEN1 and FEN2 pins are brought
low and the Flash register is cleared.
Flash mode current can be adjusted to a fraction of the
maximum Flash mode current level by selecting the
desired percentage in the Flash Control register
through the single-wire serial interface. The Flash
current is the product of the maximum Flash current
setting and the percentage selected in the Flash
register.
5.3 Torch Mode
By default, the maximum Torch mode level is
one-fourth (1/4) of the maximum Flash mode current.
The Torch mode operation is activated by setting the
Torch Control register (Address 2) for the desired dura-
tion. The Torch mode current is terminated when the
Torch register is cleared or when the configurable
safety timer expires.
Like the Flash mode current, the Torch mode current
can be tuned to a fraction of the maximum Torch mode
level by selecting the desired torch current level per-
centage in the Torch Control register (Address 2)
through the single-wire serial interface.
The torch current is the product of the maximum torch
current setting and the percentage selected in the
Torch register.
5.4 Configurable Safety Timer
The Flash safety time-out feature automatically shuts
down the LED current, after the safety timer duration is
expired, if the programmed LED current exceeds a
certain current threshold. Both the current threshold
and the timer duration are programmable via the Safety
Timer registers (Addresses 3 and 5).
5.5 Low-Battery Voltage Detection
(LBVD)
When the VIN voltage drops below the LBVD threshold
(default = 3.6V) in flash or torch mode, the LED current
driver is disabled. The LED driver can be resumed by
toggling the corresponding input control signal. The
LBVD threshold is adjustable through the LBVD Con-
trol register (Address 4).
5.6 Overvoltage Protection
When the output voltage rises above the over voltage
protection threshold (OVP), MIC2871 is latched off
automatically to avoid permanent damage to the IC. To
clear the latched off condition, either power cycle the
MIC2871 or assert the DC pin low.
5.7 Short-Circuit Detection
Each time before enabling the LED driver, the MIC2871
performs the short-circuit test by driving the Flash LED
with a small (2 mA typical) current for 200 µs. If (VOUT –
VLED) < 1.7V at the end of the short-circuit test, the
LED is considered to be shorted and MIC2871 will
ignore the Flash and/or Torch mode command. Note
that the short-circuit test is carried out every time prior
to Flash and Torch mode, but the result is not latched.
5.8 Thermal Shutdown
When the internal die temperature of MIC2871 reaches
+155°C, the LED driver is disabled until the die
temperature falls below +140°C.
ILED(MAX) = 20500
RFRSET
MIC2871
DS20006079A-page 14 2018 Microchip Technology Inc.
5.9 Single-Wire Interface
The single-wire interface allows the use of a single
multiplexed enable and data pin (DC) for control, and
communication in GPIO limited applications. The
interface is implemented using a simple mechanism,
allowing any open-drain or directly driven GPIO to
control the MIC2871.
The MIC2871 uses the single-wire interface for simple
command and control functions. The interface provides
fast access to write-only registers with protection
features to avoid potentially erroneous data writes and
improve robustness. When the DC is in a low state and
no data is detected for an extended period of time, the
MIC2871 will automatically go into a low-power shut-
down state, simultaneously resetting internal registers
to their default states.
5.10 Overview
The single-wire interface relies on a combination of bit
edges, and the period between edges, in order to
communicate across a single wire. Each word is
transmitted as a series of pulses, with each pulse
incrementing an internal data counter. A stop sequence
consisting of an inactive period is used to latch the data
word internally. An address and data framing format is
used to improve protection against erroneous writes by
enforcing address and data field lengths, as well as the
timing duration between them.
Timing is designed such that when communicating with
a device using a low-cost on-chip oscillator, the
worst-case minimum and maximum conditions can be
easily met within the wide operating range of the
oscillator. Using this method ensures that the device
can always detect the delay introduced by the
communication master.
5.11 Idle States and Error Conditions
In Shutdown mode, the MIC2871 is in a Reset condi-
tion, with all functions off, while consuming minimal
power. Register settings are reset to their default state
when coming out of Shutdown state. In Idle mode, all
register settings persist and all MIC2871 functions
continue in their current state. Table 5-1 summarizes
the difference between the two IDLE modes:
TABLE 5-1: DIFFERENCES BETWEEN
IDLE MODES
Idle mode is entered automatically at the end of a com-
munication frame by holding DC high for TEND, by
enabling the device by bringing DC high when in
shutdown mode, or when an error is detected by the
single-wire interface logic.
Shutdown mode can be entered at any time by pulling
down DC for TEND, discarding any current com-
munication and resetting the internal registers. If a
communication is received before the shutdown period,
but after the TLAT period, the communication is dis-
carded. This state is also used to create an internal
error state to avoid erroneously latching data where the
communication process cannot be serviced in time.
Additionally, each register has a maximum value
associated with it. If the number of bits clocked in
exceeds the maximum value for the register, the data is
assumed to be in error and the data is discarded.
FIGURE 5-1: Abort, Shutdown and Idle
Timing Waveforms.
DC
Shutdown Idle
Low High
ISUPPLY (all functions off) 1 µA 230 µA
Register State Default Persist
Start-up Time 1 µs 100 ns
SHUTDOWN
IDLE
V
H
V
L
IDLE
<TEND – TLAT
TLAT TEND
TLAT TEND
V
H
V
L
V
H
V
L
TLAT TEND
IDLE
2018 Microchip Technology Inc. DS20006079A-page 15
MIC2871
5.12 Communication Details
The serial interface requires delimiters to indicate the
Start-of-Frame (SOF), data as a series of pulses and
End-of-Frame (EOF) indicated by a lack of activity. The
Start-of-Frame is the first high-to-low transition of the
DC when in Idle mode. The first rising edge resets the
internal data counter to 0.
FIGURE 5-2: Data Word Pulse Timing.
A pulse is delimited by the signal first going below VL
and then above VH within the Latch Time-out, TLAT.
During this transition, the minimum on (TON) and off
(TOFF) periods are observed to improve tolerance to
glitches. Each rising edge increments the internal Data
register. Data is automatically latched into the internal
Shadow Address and Data registers after an inactivity
period of >TLAT.
To send register write commands, the address and
data are entered in series as two data words using the
above pattern, with the second word starting after the
first latch period has expired. After the second word is
entered, the IDLE command should be issued by
leaving the DC pins high for TEND.
After receiving the stop sequence, the internal regis-
ters’ decode and update cycle is started, with the
Shadow register values being transferred to the
decoder. Figure 5-3 shows an example of entering a
write of Data 5 to Address 3.
FIGURE 5-3: Communication Timing
Example of Entering Write for Data 5 to
Address 3.
Only a correctly formatted address/data combination
will be treated as a valid frame and processed by the
MIC2871. Any other input, such as a single data word
followed by TEND, or three successive data words, will
be discarded by the target hardware as an erroneous
entry. Additionally, any register write to either an invalid
register or with invalid register data will also be
discarded.
5.13 MIC2871 Registers
The MIC2871 supports five writable registers for con-
trolling the Torch and Flash modes of operation, as
shown in Table 5-2. Note that register addressing starts
at 1. Writing any value above the maximum value
shown for each register will cause an invalid data error
and the frame will be discarded.
TABLE 5-2: FIVE WRITABLE REGISTERS
OF MIC2871
AUTOMATIC LATCH
AFTER T
LAT
EXPIRES
T
OFF
T
ON
V
H
V
L
T
LAT
1 COUNT
T
ON
+ T
OFF
< T
LA T
START
T
LAT
< T
END
0123
START
0 1 2 3 4 5
END
REGISTER
WRITE
STARTLATCH LATCH
T
LAT
ADDRESS/DATA FRAME
> T
END
Address Name Max.
Value Description
1 FEN/FCUR 31 Flash Enable/Current
2 TEN/TCUR 31 Touch Enable/Current
3 STDUR 7 Safety Timer Duration
4 LB_TH 9 Low-Battery Voltage
Detection Threshold
5 ST_TH 5 Safety Timer
Threshold
MIC2871
DS20006079A-page 16 2018 Microchip Technology Inc.
5.13.1 FLASH CURRENT REGISTER
(FEN/FCUR: DEFAULT 0)
The Flash Current register enables and sets the Flash
mode current level. Valid values are 0 to 31; Values 0-15
will set the Flash current without enabling the Flash (such
that it can be triggered externally), Values 16-31 will set
the Flash current and enable the Flash. The Flash
Current register maps into the internal FEN and FCUR
registers, as shown in Table 5-3. Table 5-3 describes the
relationship between the Flash current, as a percentage
of maximum current, and the FCUR register setting.
TABLE 5-3: FLASH CURRENT REGISTER
MAPPING INTO INTERNAL
FEN/FCUR REGISTERS AND
RELATIONSHIP BETWEEN
FLASH CURRENT AS % OF
MAX. CURRENT AND FCUR
REGISTER SETTING
5.13.2 TORCH CURRENT REGISTER
(TEN/TCUR: DEFAULT 0)
The Torch Current register enables and sets the Torch
mode current level. Valid values are 0 to 31; Values 0-15
will set the torch current without enabling the torch (such
that it can be triggered by setting the internal TEN register
value to 1), Values 16-31 will set the torch current and
enable the torch. A value of 0 at the internal TEN register
will disable the torch. The Torch Current register maps
into the internal TEN and TCUR registers, as shown in
Table 5-4. The table also describes the relationship
between the torch current as a percentage of maximum
current, and the TCUR register setting.
TABLE 5-4: TORCH CURRENT REGISTER
MAPPING INTO INTERNAL
TEN/TCUR REGISTERS AND
RELATIONSHIP BETWEEN
TORCH CURRENT AS % OF
MAX. CURRENT AND TCUR
REGISTER SETTING
Value FEN/FCUR<4:0>
Dec. Binary FEN<4> FCUR<3:0> % of IMAX
000000 0 100.00
100001 0 88.96
200010 0 79.04
300011 0 70.72
400100 0 63.04
500101 0 56.00
600110 0 49.92
700111 0 44.64
801000 0 39.68
901001 0 35.52
10 01010 0 31.68
11 01011 0 28.16
12 01100 0 25.12
13 01101 0 22.40
14 01110 0 20.00
15 01111 0 17.92
16 10000 1 100.00
17 10001 1 88.96
18 10010 1 79.04
19 10011 1 70.72
20 10100 1 63.04
21 10101 1 56.00
22 10110 1 49.92
23 10111 1 44.64
24 11000 1 39.68
25 11001 1 35.52
26 11010 1 31.68
27 11011 1 28.16
28 11100 1 25.12
29 11101 1 22.40
30 11110 1 20.00
31 11111 1 17.92
Value TEN/TCUR<4:0>
Dec. Binary TEN<4> TCUR<3:0> % of IMAX
000000 0 100.00
100001 0 88.96
200010 0 79.04
300011 0 70.72
400100 0 63.04
500101 0 56.00
600110 0 49.92
700111 0 44.64
801000 0 39.68
901001 0 35.52
10 01010 0 31.68
11 01011 0 28.16
12 01100 0 25.12
13 01101 0 22.40
14 01110 0 20.00
15 01111 0 17.92
16 10000 1 100.00
17 10001 1 88.96
18 10010 1 79.04
19 10011 1 70.72
20 10100 1 63.04
21 10101 1 56.00
22 10110 1 49.92
23 10111 1 44.64
24 11000 1 39.68
25 11001 1 35.52
26 11010 1 31.68
27 11011 1 28.16
28 11100 1 25.12
29 11101 1 22.40
30 11110 1 20.00
31 11111 1 17.92
2018 Microchip Technology Inc. DS20006079A-page 17
MIC2871
5.13.3 SAFETY TIMER DURATION
REGISTER (STDUR: DEFAULT 7)
The Safety Timer Duration register sets the duration of
the Flash and Torch modes when the LED current
exceeds the programmed threshold current. Valid
values are 0 for the minimum timer duration to 7 for the
maximum duration.
TABLE 5-5: SAFETY TIMER DURATION
REGISTER SETTING AND
SAFETY TIMER DURATION
5.13.4 LOW-BATTERY THRESHOLD
REGISTER (LB_TH: DEFAULT 7)
The LB_TH register sets the supply threshold voltage
below which the internal low-battery flag is asserted
and Flash functions are inhibited. Table 5-6 shows the
threshold values that correspond to the register set-
tings. Setting 0 is reserved for disabling the function,
and settings between 1 and 9 inclusively enable and
set the LB_TH value, between 3.0V and 3.8V with
100 mV resolution.
TABLE 5-6: LOW-BATTERY THRESHOLD
REGISTER SETTING AND
SUPPLY THRESHOLD VOLTAGE
5.13.5 SAFETY TIMER THRESHOLD
CURRENT REGISTER (ST_TH:
DEFAULT 4)
The Safety Timer Threshold Current register deter-
mines the amount of LED current flowing through the
external LED before the internal LED safety timer is
activated. Setting ST_TH to 0 disables the safety timer
function, and setting the register to Values 1 to 5 set the
safety time threshold current to 100 mA to 300 mA in
50 mA steps.
TABLE 5-7: SAFETY TIMER THRESHOLD
CURRENT REGISTER SETTING
AND SAFETY TIMER
THRESHOLD CURRENT
Value STDUR<2:0>
(binary) Time-out (ms)
Dec. Binary
0000 000 156.25
1001 001 312.5
2010 010 468.75
3011 011 625
4100 100 781.25
5101 101 937.5
6110 110 1093.75
7111 111 1250
Value
LB_TH<3:0> VBAT Threshold
(V)
Dec. Binary
00000 0000 Disabled
10001 0001 3.0
20010 0010 3.1
30011 0011 3.2
40100 0100 3.3
50101 0101 3.4
60110 0110 3.5
70111 0111 3.6
81000 1000 3.7
91001 1001 3.8
Value
ST_TH<2:0>
Safety Timer
Threshold
Current (mA)
Dec. Binary
0000 000 Disabled
1001 001 100 mA
2010 010 150 mA
3011 011 200 mA
4100 100 250 mA
5101 101 300 mA
MIC2871
DS20006079A-page 18 2018 Microchip Technology Inc.
6.0 COMPONENT SELECTION
6.1 Inductor
Inductor selection is a balance between efficiency,
stability, cost, size, and rated current. Because the
boost converter is compensated internally, the recom-
mended inductance of L is limited from 1 µH to 2.2 µH
to ensure system stability. It is usually a good balance
between these considerations.
A large inductance value reduces the peak-to-peak
inductor ripple current; hence, the output ripple voltage
and the LED ripple current. This also reduces both the
DC loss and the transition loss at the same inductor’s
DC Resistance (DCR). However, the DCR of an
inductor usually increases with the inductance in the
same package size. This is due to the longer windings
required for an increase in inductance. Because the
majority of the input current passes through the induc-
tor, the higher the DCR, the lower the efficiency is, and
more significantly, at higher load currents. On the other
hand, an inductor with a smaller DCR, but the same
inductance, usually has a larger size. The saturation
current rating of the selected inductor must be higher
than the maximum peak inductor current to be encoun-
tered and should be at least 20% to 30% higher than
the average inductor current at maximum output cur-
rent.
6.2 Input Capacitor
A ceramic capacitor of 2.2 µF or larger with low-ESR is
recommended to reduce the input voltage ripple to
ensure a clean supply voltage for the device. The input
capacitor should be placed as close as possible to the
MIC2871 VIN pin with a short trace for good noise
performance. X5R or X7R type ceramic capacitors are
recommended for better tolerance over temperature.
The Y5V and Z5U type temperature rating ceramic
capacitors are not recommended due to their large
reduction in capacitance over temperature and
increased resistance at high frequencies. These
reduce their ability to filter out high-frequency noise.
The rated voltage of the input capacitor should be at
least 20% higher than the maximum operating input
voltage over the operating temperature range.
6.3 Output Capacitor
Output capacitor selection is also a trade-off between
performance, size and cost. Increasing the output
capacitor will lead to an improved transient response,
however, the size and cost also increase. The output
capacitor is preferred in the range of 2.2 µF to 10 µF,
with ESR from 10 m to 50 m. X5R or X7R type
ceramic capacitors are recommended for better
tolerance over temperature.
The Y5V and Z5U type ceramic capacitors are not
recommended due to their wide variation in capaci-
tance over temperature and increased resistance at
high frequencies. The rated voltage of the output
capacitor should be at least 20% higher than the
maximum operating output voltage over the operating
temperature range.
6.4 FRSET Resistor
Because the FRSET resistor is used for setting the
maximum LED current, a resistor type with 0.1% toler-
ance is recommended for a more accurate maximum
LED current setting.
2018 Microchip Technology Inc. DS20006079A-page 19
MIC2871
7.0 POWER DISSIPATION
CONSIDERATION
As with all power devices, the ultimate current rating of
the output is limited by the thermal properties of the
device package and the PCB on which the device is
mounted. There is a simple ’s law type relationship
between thermal resistance, power dissipation and
temperature, which are analogous to an electrical
circuit:
FIGURE 7-1: Series Electrical Resistance
Circuit.
From this simple circuit, we can calculate VX if we know
the ISOURCE, VZ and resistor values, R
XY and RYZ,
using Equation 7-1:
EQUATION 7-1: CALCULATING VX
Thermal circuits can be considered using this same
rule and can be drawn similarly by replacing current
sources with power dissipation (in watts), resistance
with thermal resistance (in °C/W) and voltage sources
with temperature (in °C).
FIGURE 7-2: Series Thermal Resistance
Circuit.
Now replacing the variables in Equation 7-1, we can
find the Junction Temperature (TJ) from the power dis-
sipation, ambient temperature, and the known thermal
resistance of the PCB (CA) and the package (JC).
EQUATION 7-2: FINDING THE JUNCTION
TEMPERATURE (TJ)
As can be seen in the diagram, the total thermal
resistance is: JA = JC + CA. Hence, this can also be
written as in Equation 7-3:
EQUATION 7-3: TOTAL THERMAL
RESISTANCE
Because effectively all of the power losses (minus the
inductor losses) in the converter are dissipated within
the MIC2871 package, PDISS can be calculated thus:
EQUATION 7-4: CALCULATING PDISS
VX
RXY VY
RYZ
VZ
ISOURCE
VZ
VX = ISOURCE (RXY + RYZ) + VZ
TJ
ĬJC TC
ĬCA
TA
PDISS
TA
TJ = PDISS (JC + CA) + TA
TJ = PDISS (JA) + TA
Where:
θJA = Thermal resistance between junction and ambient,
which is typically 65.83°C/W for 3 mm x 2 mm LDFN
package
Linear Mode: P
DISS
= [P
OUT
1
– 1
] – I
OUT2
DCR
Boost Mode: P
DISS
= [P
OUT
1
– 1
] –
I
OUT
1 – D
2
DCR
Duty Cycle in Boost Mode: D = V
OUT
– V
IN
V
OUT
Where:
= Efficiency taken from efficiency curves
DCR = Inductor DCR
MIC2871
DS20006079A-page 20 2018 Microchip Technology Inc.
Where the real board area differs from 1" square, CA
(the PCB thermal resistance) values for various PCB
copper areas can be taken from Figure 7-3. Figure 7-3
is taken from “Designing with Low Dropout Voltage
Regulators” available from the Microchip web site
(“LDO Application Hints”).
FIGURE 7-3: Graph to Determine PC
Board Area for a Given PCB Thermal
Resistance.
Figure 7-3 shows the total area of a round or square
pad, centered on the device. The solid trace represents
the area of a square, single-sided, horizontal,
solder-masked, copper PC board trace heat sink,
measured in square millimeters. No airflow is assumed.
The dashed line shows PC board’s trace heat sink
covered in black oil-based paint and with 1.3m/sec
(250 feet per minute) airflow. This approaches a “best
case” pad heat sink. Conservative design dictates
using the solid trace data, which indicates a maximum
pad size of 5000 mm2 is needed. This is a pad that is
71 mm by 71 mm (2.8 inches per side).
2018 Microchip Technology Inc. DS20006079A-page 21
MIC2871
8.0 PCB LAYOUT GUIDELINES
PCB layout is critical to achieve reliable, stable and
efficient performance. A ground plane is required to
control EMI and minimize the inductance in power and
signal return paths. The following guidelines should be
followed to ensure proper operation of the device:
8.1 IC (Integrated Circuit)
• Place the IC close to the point-of-load (in this
case, the flash LED).
• Use fat traces to route the input and output power
lines.
• Analog grounds (AGND1 and AGND2) and power
grounds (PGND1 and PGND2) should be kept
separate and connected at a single location.
• The exposed pad (ePAD) on the bottom of the IC
must be connected to the analog ground AGND2
of the IC.
• 8 to 12 thermal vias must be placed on the PCB
pad for exposed pad and connected it to the
ground plane to ensure a good PCB thermal
resistance can be achieved.
8.2 VIN Decoupling Capacitor
• The VIN decoupling capacitor must be placed
close to the VIN pin of the IC and preferably con-
nected directly to the pin and not through any via.
The capacitor must be located right at the IC.
• The VIN decoupling capacitor should be
connected to analog ground (AGND2).
• The VIN terminal is noise sensitive and the
placement of capacitor is very critical.
8.3 Inductor
• Keep both the inductor connections to the switch
node (SW) and input power line short and wide
enough to handle the switching current. Keep the
areas of the switching current loops small to
minimize the EMI problem.
• Do not route any digital lines underneath or close
to the inductor.
• Keep the switch node (SW) away from the noise
sensitive pins.
• To minimize noise, place a ground plane under-
neath the inductor.
8.4 Output Capacitor
• Use wide and short traces to connect the output
capacitor to the OUT and PGND1 pins.
• Place several vias to the ground plane close to
the output capacitor ground terminal.
• Use either X5R or X7R temperature rating
ceramic capacitors. Do not use Y5V or Z5U type
ceramic capacitors.
8.5 Flash LED
• Use wide and short trace to connect the LED
anode to the OUT pin.
• Use wide and short trace to connect the LED
cathode to the LED pin.
• Make sure that the LED’s PCB land pattern can
provide sufficient PCB pad heat sink to the flash
LED.
8.6 FRSET Resistor
The FRSET resistor should be placed close to the
FRSET pin and connected to AGND2.
MIC2871
DS20006079A-page 22 2018 Microchip Technology Inc.
9.0 PACKAGING INFORMATION
9.1 Package Marking Information
Legend: XX...X Product code or customer-specific information
Y Year code (last digit of calendar year)
YY Year code (last 2 digits of calendar year)
WW Week code (week of January 1 is week ‘01’)
NNN Alphanumeric traceability code
Pb-free JEDEC® designator for Matte Tin (Sn)
*This package is Pb-free. The Pb-free JEDEC designator ( )
can be found on the outer packaging for this package.
●, ▲, ▼ Pin one index is identified by a dot, delta up or delta down (triangle
mark).
Note: In the event the full Microchip part number cannot be marked on one line, it will
be carried over to the next line, thus limiting the number of available
characters for customer-specific information. Package may or may not include
the corporate logo.
Underbar (_) and/or Overbar (‾) symbol may not be to scale.
3
e
3
e
Example
14-Lead LDFN*
XXXX
NNN
2871
017
2018 Microchip Technology Inc. DS20006079A-page 23
MIC2871
9.2 Package Details
The following sections give the technical details of the packages.
Note: For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging.
MIC2871
DS20006079A-page 24 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006079A-page 25
MIC2871
APPENDIX A: REVISION HISTORY
Revision A (October 2018)
• Converted Micrel document MIC2871 to
Microchip data sheet DS20006079A.
• Minor text changes throughout document.
MIC2871
DS20006079A-page 26 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006079A-page 27
MIC2871
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, contact your local Microchip representative or sales office.
Examples:
a) MIC2871YMK-T5: MIC2871,
-40°C to +125°C Temp. Range,
14-Pin LDFN, 500/Reel
b) MIC2871YMK-TR: MIC2871,
-40°C to +125°C Temp. Range,
14-Pin LDFN, 5,000/Reel
PART NO. XX
Package
Device
Device: MIC2871: 1.2A High-Brightness Flash LED Driver
with Single-Wire Serial Interface
Temperature: Y = -40°C to +125°C
Package: MK = 14-Pin 3 mm x 2 mm LDFN
Media Type: T5 = 500/Reel
TR = 5,000/Reel
X
Temperature
XX
Media
–
Type
Note 1: Tape and Reel identifier only appears in the
catalog part number description. This identifier is
used for ordering purposes and is not printed on
the device package. Check with your Microchip
Sales Office for package availability with the
Tape and Reel option.
MIC2871
DS20006079A-page 28 2018 Microchip Technology Inc.
NOTES:
2018 Microchip Technology Inc. DS20006079A-page 29
Information contained in this publication regarding device
applications and the like is provided only for your convenience
and may be superseded by updates. It is your responsibility to
ensure that your application meets with your specifications.
MICROCHIP MAKES NO REPRESENTATIONS OR
WARRANTIES OF ANY KIND WHETHER EXPRESS OR
IMPLIED, WRITTEN OR ORAL, STATUTORY OR
OTHERWISE, RELATED TO THE INFORMATION,
INCLUDING BUT NOT LIMITED TO ITS CONDITION,
QUALITY, PERFORMANCE, MERCHANTABILITY OR
FITNESS FOR PURPOSE. Microchip disclaims all liability
arising from this information and its use. Use of Microchip
devices in life support and/or safety applications is entirely at
the buyer’s risk, and the buyer agrees to defend, indemnify and
hold harmless Microchip from any and all damages, claims,
suits, or expenses resulting from such use. No licenses are
conveyed, implicitly or otherwise, under any Microchip
intellectual property rights unless otherwise stated.
Trademarks
The Microchip name and logo, the Microchip logo, AnyRate, AVR,
AVR logo, AVR Freaks, BitCloud, chipKIT, chipKIT logo,
CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, Heldo,
JukeBlox, KeeLoq, Kleer, LANCheck, LINK MD, maXStylus,
maXTouch, MediaLB, megaAVR, MOST, MOST logo, MPLAB,
OptoLyzer, PIC, picoPower, PICSTART, PIC32 logo, Prochip
Designer, QTouch, SAM-BA, SpyNIC, SST, SST Logo,
SuperFlash, tinyAVR, UNI/O, and XMEGA are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
and other countries.
ClockWorks, The Embedded Control Solutions Company,
EtherSynch, Hyper Speed Control, HyperLight Load, IntelliMOS,
mTouch, Precision Edge, and Quiet-Wire are registered
trademarks of Microchip Technology Incorporated in the U.S.A.
Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any
Capacitor, AnyIn, AnyOut, BodyCom, CodeGuard,
CryptoAuthentication, CryptoAutomotive, CryptoCompanion,
CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average
Matching, DAM, ECAN, EtherGREEN, In-Circuit Serial
Programming, ICSP, INICnet, Inter-Chip Connectivity,
JitterBlocker, KleerNet, KleerNet logo, memBrain, Mindi, MiWi,
motorBench, MPASM, MPF, MPLAB Certified logo, MPLIB,
MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation,
PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon,
QMatrix, REAL ICE, Ripple Blocker, SAM-ICE, Serial Quad I/O,
SMART-I.S., SQI, SuperSwitcher, SuperSwitcher II, Total
Endurance, TSHARC, USBCheck, VariSense, ViewSpan,
WiperLock, Wireless DNA, and ZENA are trademarks of
Microchip Technology Incorporated in the U.S.A. and other
countries.
SQTP is a service mark of Microchip Technology Incorporated in
the U.S.A.
Silicon Storage Technology is a registered trademark of Microchip
Technology Inc. in other countries.
GestIC is a registered trademark of Microchip Technology
Germany II GmbH & Co. KG, a subsidiary of Microchip
Technology Inc., in other countries.
All other trademarks mentioned herein are property of their
respective companies.
© 2018, Microchip Technology Incorporated, All Rights Reserved.
ISBN: 978-1-5224-3692-8
Note the following details of the code protection feature on Microchip devices:
• Microchip products meet the specification contained in their particular Microchip Data Sheet.
• Microchip believes that its family of products is one of the most secure families of its kind on the market today, when used in the
intended manner and under normal conditions.
• There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
• Microchip is willing to work with the customer who is concerned about the integrity of their code.
• Neither Microchip nor any other semiconductor manufacturer can guarantee the security of their code. Code protection does not
mean that we are guaranteeing the product as “unbreakable.”
Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our
products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts
allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act.
Microchip received ISO/TS-16949:2009 certification for its worldwide
headquarters, design and wafer fabrication facilities in Chandler and
Tempe, Arizona; Gresham, Oregon and design centers in California
and India. The Company’s quality system processes and procedures
are for its PIC® MCUs and dsPIC® DSCs, KEELOQ® code hopping
devices, Serial EEPROMs, microperipherals, nonvolatile memory and
analog products. In addition, Microchip’s quality system for the design
and manufacture of development systems is ISO 9001:2000 certified.
QUALITYMANAGEMENTS
YSTEM
CERTIFIEDBYDNV
== ISO/TS16949==
DS20006079A-page 30 2018 Microchip Technology Inc.
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Technical Support:
http://www.microchip.com/
support
Web Address:
www.microchip.com
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Tel: 678-957-9614
Fax: 678-957-1455
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Fax: 317-773-5453
Tel: 317-536-2380
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Tel: 951-273-7800
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Tel: 408-436-4270
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ASIA/PACIFIC
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ASIA/PACIFIC
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EUROPE
Austria - Wels
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Fax: 43-7242-2244-393
Denmark - Copenhagen
Tel: 45-4450-2828
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Tel: 49-89-627-144-0
Fax: 49-89-627-144-44
Germany - Rosenheim
Tel: 49-8031-354-560
Israel - Ra’anana
Tel: 972-9-744-7705
Italy - Milan
Tel: 39-0331-742611
Fax: 39-0331-466781
Italy - Padova
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Netherlands - Drunen
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Fax: 31-416-690340
Norway - Trondheim
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Poland - Warsaw
Tel: 48-22-3325737
Romania - Bucharest
Tel: 40-21-407-87-50
Spain - Madrid
Tel: 34-91-708-08-90
Fax: 34-91-708-08-91
Sweden - Gothenberg
Tel: 46-31-704-60-40
Sweden - Stockholm
Tel: 46-8-5090-4654
UK - Wokingham
Tel: 44-118-921-5800
Fax: 44-118-921-5820
Worldwide Sales and Service
08/15/18
