INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-PLA192-R07 1
PLA192
Single Pole, Normally Open
OptoMOS® Relay
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Pb
Part # Description
PLA192E 6-Pin DIP (50/Tube)
PLA192ES 6-Pin Surface Mount (50/Tube)
PLA192ESTR 6-Pin Surface Mount (1000/Reel)
PLA192 6-Pin DIP (50/Tube)
PLA192S 6-Pin Surface Mount (50/Tube)
PLA192STR 6-Pin Surface Mount (1000/Reel)
Parameters Ratings Units
Blocking Voltage 600 VP
Load Current 150 mArms / mADC
On-Resistance (max) 22
LED Current to Operate 5 mA
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment: Patient/Equipment Isolation
• Aerospace
• Industrial Controls
Switching Characteristics of
Normally Open Devices
Form-A
IF
ILOAD
10%
90%
ton toff
• UL Recognized Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 12 11 82667 002
• DIN EN 60747-5-5 Certified ("E" Suffix Only)
VDE Certificate 40036603
1
3
2
4
5
6
+ Control
- Control
Do Not Use
+ Load
- Load
DC Only Configuration
1
3
2
4
5
6
+ Control
- Control
Do Not Use
Load
Do Not Use
Load
AC/DC Configuration
• PLA192E is 100% Tested for Partial Discharge:
DIN EN 60747-5-5
• 5000Vrms Input/Output Isolation
• Low Drive Power Requirements (TTL/CMOS
Compatible)
• No Moving Parts
• High Reliability
• Arc-Free With No Snubbing Circuits
• No EMI/RFI Generation
• Small 6-Pin Package
• Machine Insertable, Wave Solderable
IXYS Integrated Circuits Division's PLA192 is a
single-pole, normally open (1-Form-A) solid state
relay that provides 5000Vrms of input to output
isolation.
In addition to all the features and benefits of the
PLA192, the PLA192E meets the partial discharge
demands of DIN EN 60747-5-5 (previously VDE
0884).
All versions of the PLA192 can be used to replace
mechanical relays, while offering the superior
reliability associated with semiconductor devices.
Optically coupled outputs that use the patented
OptoMOS architecture are controlled by a highly
efficient GaAIAs infrared LED. Because they have
no moving parts, they offer bounce-free switching in
more compact surface mount or thru-hole packages.
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R07
PLA192
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
Parameter Rating Units
Blocking Voltage 600 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Package Dissipation 2800 mW
Isolation Voltage, Input to Output
(60 Seconds) 5000 Vrms
ESD Rating, Human Body Model 4 kV
Operational Temperature -40 to +85 ºC
Storage Temperature -40 to +125 ºC
1 Derate linearly 1.33 mW / ºC
2 Derate linearly 6.67 mW / ºC
Absolute Maximum Ratings @ 25ºC (Unless Otherwise Noted)
Electrical Characteristics @ 25ºC (Unless Otherwise Noted)
Parameters Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current
Continuous, AC/DC Configuration - IL
- - 150 mArms / mADC
Continuous, DC-Only Configuration - - - 220 mADC
Peak t=10ms ILPK - - ±400 mAP
On-Resistance
AC/DC Configuration IL=150mA RON
- 13.3 22
DC-Only Configuration IL=220mA - 4.15 8
Off-State Leakage Current VL=600VPILEAK -- 1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton -- 5 ms
Turn-Off toff -- 5
Output Capacitance VL=50V, f=1MHz COUT -10 - pF
Input Characteristics
Input Control Current to Activate IL=100mA IF- 0.22 5 mA
Input Control Current to Deactivate - IF0.1 0.21 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3 - pF
PLA192E Safety and Insulation Ratings
Parameters Conditions Symbol Min Max Units
Pollution Degree 2 according to DIN VDE 0109 - ----
Highest Allowable Over-Voltage Transient Voltage VIOTM 7071 - VP
Maximum Working Insulation Voltage Recurring Voltage VIORM 1000 - VP
Partial Discharge Test Voltage DIN EN 60747-5-5 Method B VPR - 1875 VP
Isolation Test Voltage - VISO - 5000 Vrms
Creepage Distance - - 7.6 - mm
Clearance Distance - - 7.6 - mm
INTEGRATED CIRCUITS DIVISION
PLA192
www.ixysic.com 3
R07
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
35
30
25
20
15
10
5
0
1.25 1.26 1.27 1.28 1.29
LED Forward Voltage Drop (V)
Device Count (N)
Typical Turn-On Time
(N=50, IF=5mA, IL=100mADC )
1.7 1.9 2.11.6 1.8 2.0
Turn-On Time (ms)
Device Count (N)
0
5
10
15
25
20
30
35
Typical Turn-Off Time
(N=50, IF=5mA, IL=100mADC )
0.26 0.32 0.380.350.290.23
Turn-Off Time (ms)
Device Count (N)
35
30
25
20
15
10
5
0
LED Current (mA)
0.20 0.21 0.22 0.23 0.24 0.25 0.26
Device Count (N)
0
5
10
15
20
25
30
Typical IF for Switch Operation
(N=50, IL=100mA)
On-Resistance (:)
13.1 13.2 13.3 13.4 13.5 13.6
Device Count (N)
0
5
10
15
20
25
30
35
40
Typical On-Resistance Distribution
(N=50, IF=5mA, IL=150mA)
On-Resistance (:)
4.05 4.10 4.15 4.20 4.25 4.30
Device Count (N)
0
5
10
15
20
25
30
DC-Only On-Resistance Distribution
(N=50, IF=5mA, IL=220mA)
Typical Blocking Voltage Distribution
(N=50)
30
25
20
15
10
5
0
710 730 750700 720 740
Blocking Voltage (VP)
Device Count (N)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage Drop (V)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
LED Current (mA)
0 1020304050
Turn-On Time (Ps)
0
500
1000
1500
2000
2500
3000
3500
4000
4500
Typical Turn-On Time
vs. LED Forward Current
(IL=100mA)
Forward Current (mA)
0 1020304050
Turn-Off Time (Ps)
355
356
357
358
359
360
361
Typical Turn-Off Time
vs. LED Forward Current
(IL=100mA)
INTEGRATED CIRCUITS DIVISION
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4R07
PLA192
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA (@ 25ºC Unless Otherwise Noted)*
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
8
10
12
14
16
18
Typical AC/DC On-Resistance
vs. Temperature
(IF=5mA, IL=150mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-Resistance (:)
1
2
3
4
5
6
7
Typical DC-Only On-Resistance
vs. Temperature
(IF=5mA, IL=220mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Load Current (mA)
50
100
150
200
250
Maximum Load Current
vs. Temperature
(IF=5mA)
AC/DC Configuration
DC-Only Configuration
Typical Blocking Voltage
vs. Temperature
Temperature (ºC)
Blocking Voltage (VP)
-40
770
760
750
740
730
720
710
700 -20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured across Pins 4&6
(VL=600V)
Temperature º(C)
Leakage (PA)
-40
0.06
0.05
0.04
0.03
0.02
0.01
0
-20 0 20 40 60 80 100
Load Voltage (V)
0.1 1 10 100 1000
Output Capacitance (pF)
0
20
40
60
80
100
120
140
160
180
Output Capacitance
vs. Load Voltage
(IF=0mA, f=1MHz)
Energy Rating Curve
(IF=5mA)
Time
Load Current (A)
10Ps
1.2
1.0
0.8
0.6
0.4
0.2
0
1ms100Ps 100ms 1s
10ms 10s 100s
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-Off Time (Ps)
200
250
300
350
400
450
500
Typical Turn-Off Time
vs. Temperature
(IL=100mA)
IF=10mA
IF=5mA
IF=2mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current to Operate (mA)
0.16
0.18
0.20
0.22
0.24
0.26
0.28
0.30
Typical IF for Switch Operation
vs. Temperature
(IL=100mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Turn-On Time (Ps)
500
1000
1500
2000
2500
3000
3500
4000
4500
Typical Turn-On Time
vs. Temperature
(IL=100mA)
IF=10mA
IF=2mA
IF=5mA
Voltage (V)
0123
Current (A)
-0.15
-0.10
-0.05
0.00
0.05
0.10
0.15
Typical Load Current vs. Load Voltage
AC/DC Configuration
(IF=5mA)
-3 -2 -1
Voltage (V)
0.0 0.2 0.4 0.6 0.8 1.0 1.2
Current (A)
0.00
0.05
0.10
0.15
0.20
0.25
Typical Load Current vs. Load Voltage
DC-Only Configuration
(IF=5mA)
INTEGRATED CIRCUITS DIVISION
PLA192
www.ixysic.com 5
R07
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
All Versions MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
All Versions 250ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. IXYS Integrated Circuits Division employs the use of silicone coating as an optical
waveguide in the standard PLA192 (without the "E" suffix); the use of a short drying bake could be necessary if a
wash is used after solder reflow processes. The E-suffix product, being of double-molded construction, does not have
the same necessity for a drying bake. Chlorine- or Fluorine-based solvents or fluxes should not be used. Cleaning
methods that employ ultrasonic energy should not be used.
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Pb
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R07
PLA192
MECHANICAL DIMENSIONS
Dimensions
mm
(inches)
PCB Hole Pattern
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
5.080 ± 0.127
(0.200 ± 0.005)
6 - 0.800 DIA.
(6 - 0.031 DIA.)
0.254 ± 0.0127
(0.010 ± 0.0005)
9.144 ± 0.508
(0.360 ± 0.020)
7.239 TYP
(0.285 TYP)
7.620 ± 0.254
(0.300 ± 0.010)
3.302 ± 0.051
(0.130 ± 0.002) 4.064 TYP
(0.160 TYP)
0.457 ± 0.076
(0.018 ± 0.003)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
0.254 ± 0.0127
(0.010 ± 0.0005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
4.445 ± 0.254
(0.175 ± 0.010)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
8.382 ± 0.381
(0.330 ± 0.015) 2.54 ± 0.127
(0.100 ± 0.005)
9.524 ± 0.508
(0.375 ± 0.020) 6.350 ± 0.127
(0.250 ± 0.005)
0.457 ± 0.076
(0.018 ± 0.003)
1.651 ± 0.254
(0.065 ± 0.010)
1.651 ± 0.254
(0.065 ± 0.010)
Pin 1
PLA192 & PLA192E
PLA192S & PLA192ES
INTEGRATED CIRCUITS DIVISION
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
For additional information please visit our website at: www.ixysic.com
7
PLA192
Specification: DS-PLA192-R07
©Copyright 2013, IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
2/28/2013
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Dimensions
mm
(inches)
Embossment
Embossed
Carrier
330.2 Dia
(13.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
W=16.00
(0.63)
B0 = 10.10
(0.398)
A0 = 10.10
(0.398)
P = 12.00
(0.472)
K1 = 3.80
(0.15)
K0 = 4.90
(0.19)
User Direction of Feed
PLA192STR & PLA192ESTR Tape & Reel
Mouser Electronics
Authorized Distributor
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