TPS851
2008-07-10
1
TOSHIBA Photo-IC Silicon Epitaxial Planar
TPS851
Mobile Phones, PHS
Notebook PCs, PDAs
Video cameras, Digital Still Cameras
Other Equipment Requiring Luminosity Adjustment
The TPS851 is an ultra-compact surface-mount photo-IC for
illuminance sensors which incorporates a photodiode and current amp
circuit in a single chip.
The sensitivity is superior to that of a phototransistor, and exhibits
little variation.
It has spectral sensitivity closer to luminous efficiency and excellent
output linearity.
With its ultra-compact surface-mount package, this photo-IC can be
used as the power-saving control for domestic appliances or for
backlighting for displays in cellular phones, this device enables low
power consumption to be achieved.
• Ultra-compact and light surface-mount package:
2.0mm × 2.1mm × 0.7 mm
• Excellent output linearity of illuminance
• Little fluctuation in light current and high level of sensitivity:
• IL = 37 μA to 74 μA @EV = 100 lx using fluorescent light
• Light current variation width = ×1.67 (when light current
classification is specified.)
• Little temperature fluctuation
• Built-in luminous-efficiency correction function, reduced sensitivity variations due to various light sources:
I
L (using incandescent light)/IL (using fluorescent light) = 1.2 (typ.)
• Low supply voltage, making device suitable for battery-powered equipment: VCC = 2.7 V to 5.5 V
Absolute Maximum Ratings (Ta = 25°C)
Characteristics Symbol Rating Unit
Supply voltage VCC −0.5 to 7 V
Output voltage VOUT ≤ VCC V
Light current IL 5 mA
Permissible power dissipation P 35 mW
Operating temperature range Topr −30 to 85 °C
Storage temperature range Tstg −40 to 100 °C
Soldering temperature range (Note 1) Tsol 260 °C
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum
ratings and the operating ranges.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test
report and estimated failure rate, etc).
Note 1: The reflow time and the recommended temperature profile are shown in the section entitled Handling
Precautions.
TOSHIBA 0-2D1
Weight: 0.0054 g (typ.)
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Electrical and Optical Characteristics (Ta = 25°C)
Characteristics Symbol Test Condition Min Typ. Max Unit
Supply voltage VCC ⎯ 2.7 ⎯ 5.5 V
Supply current ICC VCC = 3 V, EV = 1000 lx
RL = 1 kΩ (Note 2) ⎯ 620 ⎯ μA
Light current (1) IL (1)
VCC = 3 V, EV = 100 lx
(Note 2), (Note 4) ⎯ 62 ⎯ μA
Light current (2) IL (2)
VCC = 3 V, EV = 10 lx
(Note 3), (Note 4)
3.7 ⎯ 7.4 μA
Light current (3) IL (3)
VCC = 3 V, EV = 100 lx
(Note 3), (Note 4)
37 ⎯ 74 μA
Light current ratio (3)
L
I
(1)
L
I ⎯ ⎯ 1.2 1.7
Dark current ILEAK V
CC = 3.3 V, EV = 0 lx ⎯ ⎯ 0.17 μA
Saturation output voltage VO VCC = 3 V, RL = 150 kΩ, EV = 100 lx
(Note 3) 2.2 2.35 ⎯ V
Peak sensitivity wavelength λp ⎯ ⎯ 600 ⎯ nm
Rise time tr ⎯ 0.07 1
Switching time
Fall time tf
VCC = 3 V, RL = 5 kΩ, VOUT = 1.5 V
(Note 5) ⎯ 0.4 2
ms
Note 2: CIE standard A light source is used (color temperature = 2856K, approximated incandescence light).
Note 3: Fluorescence light is used as light source. However, white LED is substituted in a mass-production process.
IL (3) classification IL A: 37 μA to 62 μA
Note 4: Light current measurement circuit
Note 5: Rise time/fall time time measurement method
A
OUT
VCC
IL
TPS851
Light
source
VOUT
VCC
White LED
Pulse drive
TPS851
RL
tf
tr
IF
1.5 V
VOUT
GND
90%
10%
EV
IF
TPS851
2008-07-10
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Package Dimensions
Weight: 0.0054 g (typ.)
Block Diagram
0.70 ± 0.05
Center of
sensitive area
1. VCC
5. OUT
2. GND
3. NC
Current
amp
4. NC
: Light-receiving area
Size of light-receiving area:
(□0.35 mm)
Unit: mm
Tolerance unless otherwise
specified: ±0.1
( ): Reference value
Pin connection
1. VCC
2. GND
3. NC
4. NC
5. OUT
0-2D1
0.70 ± 0.05
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2008-07-10
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Handling Precautions
Insert a bypass condenser of up to 0.1μF between Vcc and GND near the device to stabilize the power supply line.
When Vcc is turned on it takes at least 100 ms for the internal circuit to stabilize. During this time the output
signal is unstable. Please do not use the unstable signal as the output signal.
Moisture-Proof Packing
(1) To avoid moisture absorption by the resin, the product is packed in an aluminum envelope with silica
gel.
(2) Since the optical characteristics of the device can be affected during soldering by vaporization
resulting from prior absorption of moisture and they should therefore be stored under the following
conditions:
Temperature: 5°C to 30°C, Relative humidity: 60% (max), Time: 168 h (max)
(3) Baking is required if the devices have been store unopened for more than six months or if the
aluminum envelope has been opened for more than 168 h.
These devices are packed on tapes; hence, please avoid baking at high temperature.
Recommended baking conditions: 60°C for 12 h or longer
Mounting Precautions
(1) Do not apply stress to the resin at high temperature.
(2) The resin part is easily scratched, so avoid friction with hard materials.
(3) When installing the assembly board in equipment, ensure that this product does not come into
contact with other components.
Mounting Methods
(4) Reflow soldering
• Package surface temperature: 260°C (max)
• Please perform reflow soldering using the following reference temperature profile.
Perform reflow soldering no more than twice.
• Please perform the first reflow soldering within 168 h after opening the package with reference to
the above temperature profile.
• Second reflow soldering
In case of second reflow soldering, it should be performed within 168 h after first reflow under the
above conditions.
Storage conditions before second reflow soldering: 30°C, 60% RH or lower
• Do not perform flow soldering.
• Make any necessary soldering correction manually.
(do not do this more than once for any given pin.)
Temperature: no more than 350°C (25 W for soldering iron)
Time: within 5 s
30 s to 50 s Heating part
Time (s) →
60 s to 120 s
Temperature (°C) →
260°C max
230°C
190°C
180°C Preheating part
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(2) Recommended soldering pattern
(3) Cleaning conditions
When cleaning is required after soldering
Chemicals: AK225 alcohol
Temperature and time: 50°C × 30 s or 30°C × 3 minutes
Ultrasonic cleaning: 300 W or less
Packing Specification
(1) Packing quantity
Reel (minimum packing quantity) 3,000 devices
Carton 5 reels (15,000 devices)
(2) Packing format
An aluminum envelope containing silica gel and reels is deaerated and sealed.
Pack shock-absorbent materials around the aluminum envelopes in the cartons to cushion them.
• Carton specification
Carton dimensions
(W) 81 mm × (L) 280 mm × (H) 280 mm
Label
0.65
1.9
0.65
0.4
0.8
Unit: mm
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Tape Packing Specifications
(1) Reel dimensions
Reel material: Plastic
φ180
φ60
11.4
9.0
Unit: mm
5.0
Enlarged view of reel center
5.0
120°
φ13 ± 0.2
2 ± 0.5
φ21 ± 0.8
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(2) Tape dimensions
Tape material: Plastic (anti-electrostatic)
Unit: mm
Tolerance: ±0.2
φ1.5 + 0.1
− 0
0.18
4.0
3.5 ± 0.1
0.85 ± 0.05
2.3 ± 0.05
2.2 ± 0.05
A’A
B’
2.0 ± 0.1 B
4.0 ± 0.1
(feed hole)
8.0
1.75
φ1.1
(pocket hole)
Cross-section between A and A’
Cross-section between B and B’
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Reel Label
The label markings may include product number, tape type and quantity.
P/N
TYPE TPS851
ADDC Q’TY 3,000 pcs.
NOTE
Leader and Trailer Sections of Tape
Position of label
Sensor hole
Empty trailer section:
at least 10 empty device slots
Empty leader section:
at least 100 mm of carrier tape
Cover tape: 300 mm (min)
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2008-07-10
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Relative light current
Relative light current
Ambient temperature Ta (°C)
P – Ta
Power dissipation P (mW)
Ambient temperature Ta (°C)
ILEAK – Ta (typ.)
Dark current ILEAK (μA)
Luminance EV (lx)
I
L – EV (typ.)
Light current IL (μA)
Ambient temperature Ta (°C)
Relative IL – Ta (typ.)
Supply voltage VCC (V)
Relative IL – VCC (typ.)
0
0
40
20 40 60 80 100
30
20
10
5
35
25
15
Ta = 25°C
0
2
1.6
7
3 4 5 6
1.2
0.8
0.4
VCC = 3 V
EV = 100 lx
using fluorescent light
1.40
0.60
−40
1.20
1.00
0.80
−20 0 20 40 60 80 100
1
0.0001
20
VCC = 3 V
0.1
0.01
0.001
40 60 80 100
Luminance EV (lx)
V
OUT – EV (typ.)
Output voltage VOUT (V)
Ta = 25°C
VCC = 3 V
Fluorescent light RL = 1 kΩ
Fluorescent light RL = 7.5 kΩ
A light source RL = 1 kΩ
A light source RL = 7.5 kΩ
0.001
10
1
0.1
0.01
0.0001
1 10 100 1000 10000
Ta = 25°C
VCC = 3 V
A light source
Fluorescent light
1
10000
1000
100
10
0.1
1 10 100 1000 10000
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Switching time (μs)
Ambient temperature Ta (°C)
Relative ICC – Ta (typ.)
Relative consumption current
Load resistance RL (kΩ)
Switching Characteristics
(non-saturating operation) (typ.)
Load resistance RL (kΩ)
Switching Characteristics
(saturating operation) (typ.)
Switching time (μs)
Ta = 25°C
VCC = 3 V
VOUT = 1.5 V
Using white LED
tf
td
t
r
ts
1
0.1
10
1000
100
10
1
300
30
3
0.3 3
VCC = 3 V
EV = 100 lx
using fluorescent light
RL = 1 kΩ
1.40
0.60
−40
1.20
1.00
0.80
−20 0 20 40 60 80 100
Luminance EV (lx)
I
CC – EV (typ.)
Consumption current ICC (μA)
Ta = 25°C
VCC = 3 V
Using the A light source
R
L = 250 Ω
R
L = 1000 Ω
R
L = 5000 Ω
1
10000
1000
100
10
0.1
1 10 100 1000 10000
tf
Ta = 25°C
VCC = 3 V
VOUT ≥ 2 V
Using white LED
1000
0.1
0.1 10
ts
td
t
r
100
10
1
1
300
30
3
0.3
0.3 3
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Switching Time Measurement Circuit and Waveforms
VOUT
VCC
White LED
Pulse drive
TPS851
RL
tf tr
IF
1.5 V
VOUT
GND
90%
10%
ts td
Wavelength λ (nm)
Spectral Response (typ.)
Relative sensitivity
Radiation Pattern (typ.)
Luminosity
angle 30°
0°
60°
90° 90°
30°
60°
1.00.80.6 0.4 0.2 0
80°
70°
50°
40°
20°
10°
70°
80°
50°
40°
20°10°
Ta = 25°C
60
0
200 400 600 1000 1200800
20
40
80
100
Ta = 25°C
IF
TPS851
2008-07-10
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RESTRICTIONS ON PRODUCT USE
• Toshiba Corporation, and its subsidiaries and affiliates (collectively “TOSHIBA”), reserve the right to make changes to the information
in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduced without prior written permission from TOSHIBA. Even with
TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are
responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and
systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily
injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must
also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document,
the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA
Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are
solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the
appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any
information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other
referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO
LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general electronics applications (e.g., computers, personal equipment, office equipment, measuring
equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document.
Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or
reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious
public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used
in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling
equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric
power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this
document.
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• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any
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any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE
FOR PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY
WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR
LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND
LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO
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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances,
including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of
noncompliance with applicable laws and regulations.
